TW201544327A - Peeling device and peeling method of laminate body, and method of manufacturing electronic devices - Google Patents

Peeling device and peeling method of laminate body, and method of manufacturing electronic devices Download PDF

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TW201544327A
TW201544327A TW104113778A TW104113778A TW201544327A TW 201544327 A TW201544327 A TW 201544327A TW 104113778 A TW104113778 A TW 104113778A TW 104113778 A TW104113778 A TW 104113778A TW 201544327 A TW201544327 A TW 201544327A
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substrate
peeling
laminated body
corner portion
corner
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TW104113778A
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TWI692407B (en
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Yasunori Ito
Hiroshi Utsugi
Kei Takiuchi
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Asahi Glass Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006Delaminating
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G41/00Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/50Auxiliary process performed during handling process
    • B65H2301/51Modifying a characteristic of handled material
    • B65H2301/511Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

This invention relates to a peeling device of a laminate body, characterized in having: a making device of peeling start part that makes at least two peeling start parts by inserting a knife into interfaces between two adjacent substrates, with at least two interface specific amounts, from a terminal part of the laminate body which is laminated by at least three substrates that can be peeled apart; a peeler that bends and deforms at least one of the at least three substrates and peeling in sequence from the at least two peeling start parts of the interfaces; and a controller that controls the peeler to peel in sequence from the at least two peeling start parts of the interfaces after controlling the making device of peeling start part to insert the knife into the at least two interfaces to make the at least two peeling start parts.

Description

積層體之剝離裝置及剝離方法、以及電子裝置之製造方法 Stripping device and peeling method of laminated body, and manufacturing method of electronic device

本發明係關於一種積層體之剝離裝置及剝離方法、以及電子裝置之製造方法。 The present invention relates to a peeling device and a peeling method for a laminate, and a method for manufacturing the electronic device.

隨著顯示面板、太陽電池、薄膜二次電池等電子裝置之薄型化、輕量化,期待該等電子裝置所使用之玻璃板、樹脂板、金屬板等基板之薄板化。 As electronic devices such as display panels, solar cells, and thin film secondary batteries are thinner and lighter, substrates such as glass plates, resin plates, and metal plates used in such electronic devices are expected to be thinned.

然而,若基板之厚度變得過薄,則基板之操作性會變差,故而難以於基板之正面形成電子裝置用之功能層(薄膜電晶體(TFT:Thin Film Transistor)、彩色濾光片(CF:Color Filter))。 However, if the thickness of the substrate is too thin, the handleability of the substrate is deteriorated, so that it is difficult to form a functional layer for a metal device (TFT: Thin Film Transistor, color filter) on the front surface of the substrate ( CF: Color Filter)).

因此,提出有將補強板(基板)貼合於基板之背面而構成藉由補強板對基板進行了補強之積層體,並於積層體之狀態下於基板之正面形成功能層之方法(參照專利文獻1)。於該方法中,由於基板之操作性提高,故而可於基板之正面良好地形成功能層。而且,於形成功能層後將補強板自基板剝離。 Therefore, there has been proposed a method in which a reinforcing plate (substrate) is bonded to the back surface of a substrate to form a laminated body which is reinforced by a reinforcing plate, and a functional layer is formed on the front surface of the substrate in the state of the laminated body (see Patent Document 1). In this method, since the handleability of the substrate is improved, the functional layer can be favorably formed on the front surface of the substrate. Moreover, the reinforcing plate is peeled off from the substrate after the functional layer is formed.

作為一例,補強板之剝離方法係藉由如下而進行,即:自位於矩形狀之積層體之對角線上之2個角部之一者朝向另一者,使補強板或基板、或者其兩者向相互隔開之方向撓曲變形。此時,為了順利地進行剝離,而於積層體之一角部製作剝離起始部。剝離起始部係如專利文獻1般,藉由自積層體之端面將刀(剝離刀)插入基板與補強板之界面特定量,而於一角部之特定之區域形成剝離起始部而製作。 As an example, the method of peeling the reinforcing plate is performed by moving one of the two corners on the diagonal line of the rectangular laminated body toward the other, so that the reinforcing plate or the substrate, or both thereof The person is flexed and deformed in a direction separating from each other. At this time, in order to smoothly perform the peeling, a peeling start portion was formed at one corner portion of the laminated body. In the peeling start portion, a knife (peeling blade) is inserted into the end surface of the substrate and the reinforcing plate by a specific amount from the end surface of the laminated body, and a peeling start portion is formed in a specific region of a corner portion.

又,於專利文獻2中,亦揭示有積層體之剝離裝置,於該剝離裝置中亦藉由將刀(楔)自積層體之端面插入基板與基板之界面而形成剝離起始部。 Further, Patent Document 2 discloses a peeling device for a laminated body in which a peeling start portion is formed by inserting a blade (wedge) from an end surface of the laminated body into an interface between the substrate and the substrate.

因此,專利文獻1之剝離裝置係於利用吸附墊等固定積層體之正反面之狀態下、即於在厚度方向上夾持積層體之狀態下將刀插入上述界面,故而於插入時會自刀對基板施加不需要之力,而存在基板破損之顧慮。 Therefore, in the peeling apparatus of the patent document 1, the knife is inserted into the interface in a state in which the front and back surfaces of the laminated body are fixed by the suction pad or the like, that is, in the state in which the laminated body is sandwiched in the thickness direction, the knife is inserted into the interface. An unnecessary force is applied to the substrate, and there is a concern that the substrate is broken.

又,專利文獻2之剝離裝置係於將刀插入界面之狀態下利用吸附墊等於厚度方向上夾持積層體,故而於利用吸附墊夾持積層體時刀所插入之部分會受到擠壓力,而有基板破損之虞。 Further, in the peeling device of Patent Document 2, when the blade is inserted into the interface, the laminated body is sandwiched by the adsorption pad in the thickness direction, so that the portion into which the blade is inserted when the laminated body is held by the adsorption pad is subjected to the pressing force. There is a flaw in the substrate damage.

根據此種情況,近年來,將利用刀而進行之剝離起始部製作步驟與利用剝離裝置而進行之剝離步驟分開實施,以防止專利文獻1、2之不良情況。 In this case, in recent years, the peeling start portion producing step by the knife and the peeling step by the peeling device are separately performed to prevent the problems of Patent Documents 1 and 2.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2011/024689號公報 [Patent Document 1] International Publication No. 2011/024689

[專利文獻2]日本專利特開平10-244545號公報 [Patent Document 2] Japanese Patent Laid-Open No. Hei 10-244545

於欲進行剝離之界面僅為1面之積層體之情形時,於利用剝離起始部製作裝置之刀於該界面製作剝離起始部後,將該積層體自剝離起始部製作裝置搬送至剝離裝置,並利用剝離裝置使基板剝離即可,該一系列之作業不耗費工夫。 When the interface to be peeled off is only one layer of the laminate, the laminate is produced from the peeling start portion preparation device after the peeling start portion is formed on the interface by the blade of the peeling starting portion forming device. The peeling device can be used to peel off the substrate by the peeling device, and the series of operations does not require labor.

然而,於具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體之情形時,必須於剝離起始部製作裝置與剝離裝置之間使界面之面數之積層體往返搬送,因此存在無法高效率地剝離基板之問 題。 However, in the case of a laminate including two or more substrates to be peeled off, it is necessary to transfer the laminate of the interface between the peeling start portion forming device and the peeling device. Therefore, there is a problem that the substrate cannot be peeled off efficiently. question.

本發明係鑒於此種問題而完成者,其目的在於提供一種於具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體中,可高效率地剝離基板之積層體之剝離裝置及剝離方法、以及電子裝置之製造方法。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a laminate in which a laminate comprising three or more substrates having two or more interfaces to be peeled off can be highly efficiently peeled off from a substrate. A device and a peeling method, and a method of manufacturing the electronic device.

為了達成上述目的,本發明之積層體之剝離裝置之特徵在於具備:剝離起始部製作器件,其針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而製作2個以上之剝離起始部;剝離器件,其使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離;及控制器件,其於控制上述剝離起始部製作器件在上述2個以上之界面使上述刀依序插入而製作上述2個以上之剝離起始部後,控制上述剝離器件以上述2個以上之界面之上述剝離起始部為起點依序剝離。 In order to achieve the above object, a peeling apparatus for a laminated body according to the present invention includes a peeling starting portion forming device for laminating a laminate of three or more substrates, from the end of the laminated body. Inserting a knife into two or more interface specific amounts of the interface between the adjacent substrate and the substrate to form two or more peeling start portions; and peeling the device to deflect at least one of the three or more substrates Deformation, sequentially peeling off from the peeling start portion of the two or more interfaces as a starting point; and a control device for sequentially inserting the cutters at the two or more interfaces by controlling the peeling start portion forming device After the two or more peeling start portions are produced, the peeling device is controlled to be peeled off in order from the peeling start portion of the two or more interfaces.

為了達成上述目的,本發明之積層體之剝離方法之特徵在於具備:剝離起始部製作步驟,其係針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而分別製作2個以上之剝離起始部;及剝離步驟,其係使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離。 In order to achieve the above object, the method for peeling a laminated body according to the present invention includes a step of producing a peeling starting portion, which is a laminated body obtained by peelably bonding three or more substrates, from the laminated body The end portion is formed by inserting a knife into two or more interfaces at an interface between the adjacent substrate and the substrate to form two or more peeling start portions, and a peeling step of causing at least three of the three or more substrates One of the substrates is flexibly deformed, and the peeling starting portions at the two or more interfaces are sequentially peeled off as a starting point.

為了達成上述目的,本發明之電子裝置之製造方法係具有:功能層形成步驟,其係於由3片以上之基板可剝離地貼合而成之積層體所含之上述基板中之至少1片基板之正面形成功能層;及分離步驟,其係將形成有上述功能層之上述基板自另一基板分離;該電子裝置之製造方法之特徵在於上述分離步驟具備:剝離起始部製作步驟,其係 自上述積層體之端部將刀插入上述積層體之相鄰之基板與基板之界面中之2個以上之界面特定量而分別製作2個以上之剝離起始部;及剝離步驟,其係使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離。 In order to achieve the above object, a method of manufacturing an electronic device according to the present invention includes a functional layer forming step of at least one of the substrates included in a laminate in which three or more substrates are peelably bonded together. a front surface of the substrate is formed with a functional layer; and a separating step of separating the substrate on which the functional layer is formed from another substrate; the method of manufacturing the electronic device is characterized in that the separating step includes a step of fabricating a peeling start portion, system Inserting a knife into the end portion of the laminate to insert two or more interface openings of the interface between the adjacent substrate and the substrate to form two or more peeling start portions; and a peeling step, At least one of the three or more substrates is flexibly deformed, and is sequentially peeled off from the peeling start portion of the two or more interfaces.

根據本發明,於剝離起始部製作器件或步驟中,於2個以上之界面使用刀製作剝離起始部,並於剝離步驟中將基板依序剝離。藉此,將積層體自剝離起始部製作器件向剝離器件搬送1次便可,因此即便為具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體,亦可高效率地剝離基板。 According to the invention, in the apparatus or step of fabricating the peeling starting portion, the peeling start portion is formed by using a knife at two or more interfaces, and the substrate is sequentially peeled off in the peeling step. In this way, since the laminated body can be transported once to the peeling device from the peeling starting portion forming device, even if it is a laminated body including two or more substrates to be peeled off, it is possible to have high efficiency. The substrate is peeled off.

於本發明之一態樣中,較佳為上述剝離起始部製作器件或步驟之上述刀之插入位置係設定為上述積層體之第1角部且於上述積層體之厚度方向上重疊之位置,且上述刀之插入量係以針對上述每一界面而不同之方式設定,且因上述剝離器件或步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定。 In one aspect of the invention, it is preferable that the insertion position of the blade in the peeling start portion forming device or the step is set to a position at which the first corner portion of the laminated body overlaps in the thickness direction of the laminated body. And the insertion amount of the knives is set differently for each of the interfaces, and the deflection direction of the substrate due to the peeling device or the step is from the first corner portion toward the first corner portion Set to the corner of the opposite direction.

於本發明中提及之上述基板之撓曲方向可為連結上述第1角部及與上述第1角部對向之角部之直線方向,亦可為相對於積層體之一邊呈45度之方向。即,上述基板之撓曲方向只要自上述第1角部朝向與上述第1角部對向之角部設定即可。 The deflection direction of the substrate mentioned in the present invention may be a linear direction connecting the first corner portion and a corner portion opposed to the first corner portion, or may be 45 degrees with respect to one side of the laminate. direction. In other words, the deflection direction of the substrate may be set from a corner portion facing the first corner portion toward a corner portion facing the first corner portion.

根據上述本發明之一態樣,若藉由剝離器件或步驟使基板自第1角部朝向與第1角部對向之角部撓曲,則於2個以上之界面中之刀之插入量最大之界面,基板最先剝離。繼而,若使基板向該方向撓曲,則於刀之插入量第2大之界面基板剝離。根據上述本發明之一態樣,藉由使刀之插入量針對每一界面不同,可控制欲進行剝離之界面之順序。 According to one aspect of the invention described above, when the substrate is deflected from the first corner portion toward the corner portion facing the first corner portion by the peeling device or the step, the insertion amount of the knife in the two or more interfaces is At the largest interface, the substrate is peeled off first. Then, when the substrate is deflected in this direction, the interface substrate having the second largest insertion amount of the blade is peeled off. According to one aspect of the present invention described above, the order of the interface to be peeled can be controlled by making the insertion amount of the knife different for each interface.

於本發明之另一態樣中,較佳為上述剝離起始部製作器件或步驟之上述刀之插入位置至少設定為上述積層體之第1角部與除上述第1 角部以外之另一角部,且因上述剝離器件或步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定,且係自上述另一角部朝向與上述另一角部對向之角部而設定。 In another aspect of the present invention, preferably, the insertion position of the blade of the peeling start portion forming device or the step is set to at least a first corner portion of the laminated body and the first The other corner portion other than the corner portion, wherein the deflection direction of the substrate due to the peeling device or the step is set from a corner portion of the first corner portion facing the first corner portion, and is derived from the above The other corner portion is set toward a corner portion opposed to the other corner portion.

根據上述本發明之另一態樣,若藉由剝離器件或步驟使基板自第1角部朝向與第1角部對向之角部撓曲,則以第1角部所具備之剝離起始部為起點而該基板剝離。又,若藉由剝離器件或步驟使基板自另一角部朝向與另一角部對向之角部撓曲,則以另一角部所具備之剝離起始部為起點而該基板剝離。根據上述本發明之另一態樣,藉由使基板撓曲之方向,可控制欲進行剝離之界面之順序。 According to another aspect of the present invention, when the substrate is deflected from the first corner portion toward the corner portion facing the first corner portion by the peeling device or the step, the peeling start of the first corner portion is provided. The portion is the starting point and the substrate is peeled off. Further, when the substrate is deflected from the other corner portion toward the corner portion facing the other corner portion by the peeling means or the step, the substrate is peeled off from the peeling start portion provided in the other corner portion. According to another aspect of the invention described above, the order of the interface to be peeled can be controlled by deflecting the substrate.

於本發明中,上述積層體較佳為至少第1基板、第2基板、第3基板、及第4基板依序可剝離地貼合而成之積層體,上述剝離起始部製作器件或步驟之上述刀之插入位置較佳設定為上述第1基板與上述第2基板之界面、及上述第3基板與上述第4基板之界面。 In the above aspect of the invention, the laminated body is preferably a laminated body in which at least a first substrate, a second substrate, a third substrate, and a fourth substrate are sequentially peelably bonded, and the peeling start portion is formed as a device or a step. The insertion position of the knife is preferably set to an interface between the first substrate and the second substrate, and an interface between the third substrate and the fourth substrate.

本發明例如係將包含第1至第4基板之積層體作為對象。於剝離起始部製作器件或步驟中,於第1基板與第2基板之界面、及第3基板與第4基板之界面分別製作剝離起始部。於剝離器件或步驟中,於該2個界面將基板依序剝離,並取出貼合有第2基板與第3基板之製品基板。於製品基板為電子裝置之情形時,於功能層形成步驟中,於第2基板與第3基板之各者之對向面形成功能層。 In the present invention, for example, a laminate including the first to fourth substrates is targeted. In the apparatus or step of fabricating the peeling starting portion, a peeling start portion is formed at the interface between the first substrate and the second substrate and the interface between the third substrate and the fourth substrate. In the peeling device or the step, the substrate is sequentially peeled off at the two interfaces, and the product substrate to which the second substrate and the third substrate are bonded is taken out. In the case where the product substrate is an electronic device, in the functional layer forming step, a functional layer is formed on the opposing surface of each of the second substrate and the third substrate.

根據本發明之積層體之剝離裝置及剝離方法、以及電子裝置之製造方法,於具備2個以上之欲進行剝離之界面之包含3片以上之基板之積層體中,可高效率地剝離基板。 According to the peeling apparatus and the peeling method of the laminated body of the present invention, and the manufacturing method of the electronic device, the substrate can be efficiently peeled off in the laminate including three or more substrates at the interface to be peeled off.

1‧‧‧積層體 1‧‧ ‧ laminated body

1A‧‧‧第1積層體 1A‧‧‧1st laminate

1B‧‧‧第2積層體 1B‧‧‧2nd layer body

2‧‧‧基板 2‧‧‧Substrate

2a‧‧‧基板之正面 2a‧‧‧front of the substrate

2b‧‧‧基板之背面 2b‧‧‧Back of the substrate

2A‧‧‧基板 2A‧‧‧Substrate

2Aa‧‧‧基板之正面 2Aa‧‧‧front of the substrate

2B‧‧‧基板 2B‧‧‧Substrate

2Ba‧‧‧基板之正面 2Ba‧‧‧front of the substrate

3‧‧‧補強板 3‧‧‧ reinforcing plate

3a‧‧‧補強板之正面 3a‧‧‧ Strengthening the front of the board

3A‧‧‧補強板 3A‧‧‧ reinforcing plate

3B‧‧‧補強板 3B‧‧‧ reinforcing plate

3Bb‧‧‧補強板之背面 3Bb‧‧‧ Back of the reinforcing board

4‧‧‧樹脂層 4‧‧‧ resin layer

4A‧‧‧樹脂層 4A‧‧‧ resin layer

4B‧‧‧樹脂層 4B‧‧‧ resin layer

6‧‧‧積層體 6‧‧‧Layer

6A、6B‧‧‧角部 6A, 6B‧‧‧ corner

7‧‧‧功能層 7‧‧‧ functional layer

10‧‧‧剝離起始部製作裝置 10‧‧‧ peeling start making device

12‧‧‧工作台 12‧‧‧Workbench

14‧‧‧支持器 14‧‧‧Support

16‧‧‧高度調整裝置 16‧‧‧ Height adjustment device

18‧‧‧運輸裝置 18‧‧‧Transportation device

20‧‧‧液體 20‧‧‧Liquid

22‧‧‧液體供給裝置 22‧‧‧Liquid supply device

24‧‧‧界面 24‧‧‧ interface

26‧‧‧剝離起始部 26‧‧‧ peeling start

28‧‧‧界面 28‧‧‧ interface

30‧‧‧剝離起始部 30‧‧‧ peeling start

32、34‧‧‧剝離起始部 32, 34‧‧‧ peeling start

40‧‧‧剝離裝置 40‧‧‧ peeling device

42‧‧‧可撓性板 42‧‧‧Flexible board

44‧‧‧可動體 44‧‧‧ movable body

46‧‧‧可動裝置 46‧‧‧ movable device

48‧‧‧驅動裝置 48‧‧‧ drive

50‧‧‧控制器 50‧‧‧ Controller

52‧‧‧吸附片 52‧‧‧Adsorption tablets

54‧‧‧彈性片 54‧‧‧Elastic film

56‧‧‧本體板 56‧‧‧ body board

58‧‧‧槽 58‧‧‧ slots

60‧‧‧貫通孔 60‧‧‧through holes

62‧‧‧桿 62‧‧‧ pole

64‧‧‧球形接頭 64‧‧‧Ball joints

66‧‧‧框架 66‧‧‧Frame

68‧‧‧緩衝構件 68‧‧‧ cushioning members

70‧‧‧面板 70‧‧‧ panel

72‧‧‧吸附墊 72‧‧‧Adsorption pad

74‧‧‧搬送裝置 74‧‧‧Transporting device

76‧‧‧控制裝置 76‧‧‧Control device

A~H‧‧‧箭頭 A~H‧‧‧ arrow

N‧‧‧刀 N‧‧‧ knife

圖1係表示供於電子裝置之製造步驟之積層體之一例之要部放大側視圖。 Fig. 1 is an enlarged side elevational view showing an essential part of an example of a laminate for a manufacturing step of an electronic device.

圖2係表示於LCD(Liquid Crystal Display,液晶顯示裝置)之製造步驟之中途製作之積層體之一例之要部放大側視圖。 FIG. 2 is an enlarged side elevational view of an essential part of an example of a laminate produced in the middle of a manufacturing process of an LCD (Liquid Crystal Display).

圖3(A)~(E)係表示利用剝離起始部製作裝置之第1剝離起始部製作方法之說明圖。 3(A) to 3(E) are explanatory views showing a method of producing the first peeling start portion by the peeling start portion producing apparatus.

圖4係藉由第1剝離起始部製作方法製作有剝離起始部之積層體之俯視圖。 Fig. 4 is a plan view showing a laminate in which a peeling start portion is produced by a first peeling starting portion producing method.

圖5(A)~(E)係表示利用剝離起始部製作裝置之第2剝離起始部製作方法之說明圖。 5(A) to 5(E) are explanatory views showing a method of producing a second peeling start portion by the peeling start portion producing apparatus.

圖6係藉由第2剝離起始部製作方法製作有剝離起始部之積層體之俯視圖。 Fig. 6 is a plan view showing a laminate in which a peeling start portion is produced by a second peeling starting portion producing method.

圖7係表示實施形態之剝離裝置之構成之縱剖視圖。 Fig. 7 is a longitudinal sectional view showing the configuration of a peeling device of the embodiment.

圖8係模式性表示相對於可撓性板之複數個可動體之配置位置之可撓性板之俯視圖。 Fig. 8 is a plan view schematically showing a flexible plate with respect to an arrangement position of a plurality of movable bodies of a flexible plate.

圖9(a)及(b)係表示可撓性板之構成之俯視圖及剖視圖。 9(a) and 9(b) are a plan view and a cross-sectional view showing a configuration of a flexible plate.

圖10係於積層體之界面將基板剝離之剝離裝置之縱剖視圖。 Fig. 10 is a vertical cross-sectional view showing a peeling device for peeling a substrate at the interface of a laminate.

圖11(A)~(C)係時間序列性地表示將藉由第1剝離起始部製作方法製作有剝離起始部之積層體之補強板剝離之剝離方法之說明圖。 (A) to (C) are explanatory diagrams showing, in a time-series manner, a peeling method of peeling a reinforcing plate in which a laminated body having a peeling start portion is produced by a first peeling starting portion producing method.

圖12(A)~(C)係繼圖11時間序列性地表示將積層體之補強板剝離之剝離方法之說明圖。 12(A) to 12(C) are explanatory diagrams showing, in a time series, a peeling method for peeling a reinforcing plate of a laminated body in a time series.

圖13係將藉由第2剝離起始部製作方法製作有剝離起始部之積層體之補強板剝離之剝離方法之說明圖。 Fig. 13 is an explanatory view showing a peeling method of peeling a reinforcing plate in which a laminated body having a peeling starting portion is produced by a second peeling starting portion producing method.

以下,根據隨附圖式對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

以下,對在電子裝置之製造步驟中使用本發明之積層體之剝離裝置及剝離方法之情形進行說明。 Hereinafter, a case where the peeling device and the peeling method of the laminated body of the present invention are used in the manufacturing steps of the electronic device will be described.

電子裝置係指顯示面板、太陽電池、薄膜二次電池等電子零 件。作為顯示面板,可例示液晶顯示器(LCD:Liquid Crystal Display)面板、電漿顯示面板(PDP:Plasma Display Panel)、及有機EL顯示器(OELD:Organic Electro Luminescence Display)面板。 Electronic device refers to electronic zeros such as display panels, solar cells, and thin film secondary batteries. Pieces. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.

[電子裝置之製造步驟] [Manufacturing steps of electronic device]

電子裝置係藉由於玻璃製、樹脂製、金屬製等基板之正面形成電子裝置用之功能層(若為LCD,則為薄膜電晶體(TFT)、彩色濾光片(CF))而製造。 The electronic device is manufactured by forming a functional layer for an electronic device (in the case of an LCD, a thin film transistor (TFT) or a color filter (CF)) on the front surface of a substrate made of glass, resin, or metal.

上述基板於形成功能層前,其背面被貼合於補強板(基板)而構成積層體。其後,於積層體之狀態下於基板之正面形成功能層。接下來,於形成功能層後,將補強板自基板剝離。 Before the formation of the functional layer, the substrate is bonded to the reinforcing plate (substrate) to form a laminate. Thereafter, a functional layer is formed on the front surface of the substrate in the state of the laminate. Next, after the functional layer is formed, the reinforcing plate is peeled off from the substrate.

即,電子裝置之製造步驟具備:功能層形成步驟,其係於積層體之狀態下於基板之正面形成功能層;及分離步驟,其係將補強板自形成有功能層之基板分離。於該分離步驟中應用本發明之積層體之剝離裝置及剝離方法。 That is, the manufacturing step of the electronic device includes a functional layer forming step of forming a functional layer on the front surface of the substrate in a state of the laminated body, and a separating step of separating the reinforcing plate from the substrate on which the functional layer is formed. A peeling device and a peeling method of the laminated body of the present invention are applied in the separating step.

[積層體1] [Layer 1]

圖1係表示積層體1之一例之要部放大側視圖。 Fig. 1 is an enlarged side elevational view showing an essential part of an example of the laminated body 1.

積層體1具備:基板2,其欲形成功能層;及補強板3,其補強該基板2。又,補強板3於正面3a具備作為吸附層之樹脂層4,且基板2之背面2b貼合於樹脂層4。即,基板2係藉由作用於與樹脂層4之間之凡得瓦耳力或樹脂層4之黏著力而隔著樹脂層4可剝離地貼合於補強板3。 The laminated body 1 includes a substrate 2 on which a functional layer is to be formed, and a reinforcing plate 3 that reinforces the substrate 2. Further, the reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the front surface 3a, and the back surface 2b of the substrate 2 is bonded to the resin layer 4. In other words, the substrate 2 is bonded to the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting on the resin layer 4 or the adhesive force of the resin layer 4.

再者,圖1之積層體1係2片基板(基板2及補強板3)可剝離地貼合而成之積層體。因此,雖並非設為本發明之對象之由3片以上之基板可剝離地貼合而成之積層體,但為了說明積層體之基本構造而作為參考圖進行表示。 Further, the laminated body 1 of Fig. 1 is a laminated body in which two substrates (the substrate 2 and the reinforcing plate 3) are peelably bonded together. Therefore, the laminated body in which three or more substrates are peelably bonded together is not the object of the present invention, but the basic structure of the laminated body is shown as a reference drawing.

[基板2] [Substrate 2]

基板2係於其正面2a欲形成功能層。作為基板2,可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、半導體基板。該等基板之中,玻璃基板之耐化學品性、耐透濕性優異,且線膨脹係數較小,因此較佳為作為電子裝置用之基板2。又,亦具有隨著線膨脹係數減小,於高溫下形成之功能層之圖案於冷卻時不易偏移之優點。 The substrate 2 is formed on its front surface 2a to form a functional layer. The substrate 2 can be exemplified by a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. Therefore, it is preferably used as the substrate 2 for an electronic device. Further, as the coefficient of linear expansion decreases, the pattern of the functional layer formed at a high temperature is less likely to shift during cooling.

作為玻璃基板之玻璃,可例示無鹼玻璃、硼矽酸玻璃、鹼石灰玻璃、高二氧化矽玻璃、以其他氧化矽作為主要之成分之氧化物系玻璃。作為氧化物系玻璃,較佳為藉由氧化物換算而得之氧化矽之含量為40~90質量%之玻璃。 Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and oxide-based glass containing other cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.

玻璃基板之玻璃較佳為選擇並採用適合欲製造之電子裝置之種類之玻璃、適合其製造步驟之玻璃。例如,對於液晶面板用之玻璃基板,較佳為採用實質上不含鹼金屬成分之玻璃(無鹼玻璃)。 The glass of the glass substrate is preferably selected and used as a glass suitable for the type of electronic device to be manufactured, and a glass suitable for the manufacturing steps thereof. For example, for the glass substrate for a liquid crystal panel, it is preferable to use a glass (alkali-free glass) which does not substantially contain an alkali metal component.

基板2之厚度係根據基板2之種類而設定。例如,於對基板2採用玻璃基板之情形時,為了實現電子裝置之輕量化、薄板化,其厚度較佳設定為0.7mm以下,更佳設定為0.3mm以下,進而較佳設定為0.1mm以下。於厚度為0.3mm以下之情形時,可對玻璃基板賦予良好之可撓性。進而,於厚度為0.1mm以下之情形時,可將玻璃基板捲曲成捲狀,但就玻璃基板之製造之觀點及玻璃基板之操作之觀點而言,其厚度較佳為0.03mm以上。 The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is used for the substrate 2, the thickness thereof is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably set to 0.1 mm or less in order to reduce the weight and thickness of the electronic device. . When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Further, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. However, from the viewpoint of the production of the glass substrate and the operation of the glass substrate, the thickness thereof is preferably 0.03 mm or more.

再者,於圖1中基板2係由1片基板構成,但基板2亦可由複數片基板構成。即,基板2亦可由將複數片基板積層而成之積層體構成。於此情形時,構成基板2之所有基板之合計之厚度成為基板2之厚度。 Further, in FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of a plurality of substrates. In other words, the substrate 2 may be formed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2.

[補強板3] [Reinforcing board 3]

作為補強板3,可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、半導體基板。 Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

補強板3之種類係根據欲製造之電子裝置之種類、該電子裝置所 使用之基板2之種類等而選定。若補強板3與基板2為相同之材質,則可降低因溫度變化而引起之翹曲、剝離。 The type of the reinforcing plate 3 is based on the type of electronic device to be manufactured, and the electronic device The type of the substrate 2 to be used is selected. When the reinforcing plate 3 and the substrate 2 are made of the same material, warpage and peeling due to temperature change can be reduced.

補強板3與基板2之平均線膨脹係數之差(絕對值)係根據基板2之尺寸形狀等適當設定,較佳為35×10-7/℃以下。此處,「平均線膨脹係數」係指50~300℃之溫度範圍內之平均線膨脹係數(JIS R3102:1995年)。 The difference (absolute value) between the average linear expansion coefficients of the reinforcing plate 3 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, and is preferably 35 × 10 -7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R3102: 1995).

補強板3之厚度設定為0.7mm以下,且係根據補強板3之種類、欲補強之基板2之種類、厚度等而適當設定。再者,補強板3之厚度可厚於基板2,亦可薄於基板2,但為了補強基板2,較佳為0.4mm以上。 The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is appropriately set depending on the type of the reinforcing plate 3, the type and thickness of the substrate 2 to be reinforced, and the like. Further, the reinforcing plate 3 may have a thickness thicker than the substrate 2 or may be thinner than the substrate 2. However, in order to reinforce the substrate 2, it is preferably 0.4 mm or more.

再者,於本例中補強板3係由1片基板構成,但補強板3亦可由將複數片基板積層而成之積層體構成。於此情形時,構成補強板3之所有基板之合計之厚度成為補強板3之厚度。 Further, in the present embodiment, the reinforcing plate 3 is composed of one substrate, but the reinforcing plate 3 may be composed of a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 is the thickness of the reinforcing plate 3.

[樹脂層4] [Resin layer 4]

為了防止於樹脂層4與補強板3之間剝離,樹脂層4與補強板3之間之結合力設定為高於與基板2之間之結合力。藉此,於剝離步驟中,於樹脂層4與基板2之界面,基板2被剝離。 In order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set to be higher than the bonding force with the substrate 2. Thereby, in the peeling step, the substrate 2 is peeled off at the interface between the resin layer 4 and the substrate 2.

構成樹脂層4之樹脂並未特別限定,可例示丙烯酸系樹脂、聚烯烴樹脂、聚胺基甲酸酯樹脂、聚醯亞胺樹脂、聚矽氧樹脂、聚醯亞胺聚矽氧樹脂。亦可將若干種樹脂混合使用。其中,就耐熱性或剝離性之觀點而言,較佳為聚矽氧樹脂、聚醯亞胺聚矽氧樹脂。於實施形態中,例示聚矽氧樹脂層作為樹脂層4。 The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, and a polyimide resin. Several kinds of resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polydecene oxide resin or a polyamidene polyimide resin is preferable. In the embodiment, a polyoxynitride resin layer is exemplified as the resin layer 4.

樹脂層4之厚度並未特別限定,較佳設定為1~50μm,更佳設定為4~20μm。藉由將樹脂層4之厚度設為1μm以上,於氣泡或異物混入樹脂層4與基板2之間時,可藉由樹脂層4之變形而吸收氣泡或異物之厚度。另一方面,藉由將樹脂層4之厚度設為50μm以下,可縮短樹 脂層4之形成時間,進而無需過度使用樹脂層4之樹脂,故而於經濟方面良好。 The thickness of the resin layer 4 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 4 is 1 μm or more, when bubbles or foreign matter are mixed between the resin layer 4 and the substrate 2, the thickness of the bubble or the foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the tree can be shortened. The formation time of the lipid layer 4 does not require excessive use of the resin of the resin layer 4, so it is economically good.

再者,樹脂層4之外形較佳為與補強板3之外形相同或小於補強板3之外形以使補強板3可支持樹脂層4之整體。又,樹脂層4之外形較佳為與基板2之外形相同或大於基板2之外形以使樹脂層4可將基板2之整體密接。 Further, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entirety of the resin layer 4. Further, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entirety of the substrate 2.

又,於圖1中樹脂層4係由1層構成,但樹脂層4亦可由2層以上構成。於此情形時,構成樹脂層4之所有層之合計之厚度成為樹脂層之厚度。又,於此情形時,構成各層之樹脂之種類可不相同。 Further, in FIG. 1, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. Moreover, in this case, the kind of the resin which comprises each layer may differ.

進而,於實施形態中,使用作為有機膜之樹脂層4作為吸附層,但亦可使用無機層代替樹脂層4。構成無機層之無機膜例如包含選自由金屬矽化物、氮化物、碳化物、及碳氮化物所組成之群中之至少1種。 Further, in the embodiment, the resin layer 4 as an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

進而,又,圖1之積層體1具備樹脂層4作為吸附層,但亦可設為去掉樹脂層4而包含基板2與補強板3之構成。於此情形時,藉由作用於基板2與補強板3之間之凡得瓦耳力等而將基板2與補強板3可剝離地貼合。又,於此情形時,較佳為以作為玻璃基板之基板2與作為玻璃板之補強板3於高溫下不會接著之方式於補強板3之正面3a形成無機薄膜。 Further, the laminated body 1 of Fig. 1 includes the resin layer 4 as an adsorption layer. However, the resin layer 4 may be removed to include the substrate 2 and the reinforcing plate 3. In this case, the substrate 2 and the reinforcing plate 3 are detachably bonded by a van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. Moreover, in this case, it is preferable to form an inorganic thin film on the front surface 3a of the reinforcing plate 3 so that the board|substrate 2 which is a glass substrate, and the reinforcement board 3 which is a glass plate are not the high temperature.

[形成有功能層之實施形態之積層體6] [Laminate 6 in which an embodiment having a functional layer is formed]

藉由經過功能層形成步驟而於積層體1之基板2之正面2a形成功能層。作為功能層之形成方法,使用CVD(Chemical Vapor Deposition,化學氣相沈積)法、PVD(Physical Vapor Deposition,物理氣相沈積)法等蒸鍍法、濺鍍法。功能層係藉由光微影法、蝕刻法而被形成為特定之圖案。 The functional layer is formed on the front surface 2a of the substrate 2 of the laminated body 1 by the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method or a sputtering method is used. The functional layer is formed into a specific pattern by photolithography and etching.

圖2係表示於LCD之製造步驟之中途製作之矩形狀之積層體6之一 例之要部放大側視圖,且係設為本發明之對象之積層體之一例。 2 is a view showing one of the rectangular laminated bodies 6 which are formed in the middle of the manufacturing process of the LCD. The main part of the example is an enlarged side view, and is an example of a laminated body to which the present invention is applied.

積層體6係補強板(第1基板)3A、樹脂層4A、基板(第2基板)2A、功能層7、基板(第3基板)2B、樹脂層4B、及補強板(第4基板)3B依序積層而構成。即,圖2之積層體6相當於圖1所示之積層體1隔著功能層7呈對稱配置而成之積層體。以下,將包含基板2A、樹脂層4A、及補強板3A之積層體稱為第1積層體1A,將包含基板2B、樹脂層4B、及補強板3B之積層體稱為第2積層體1B。 Laminate 6 reinforced plate (first substrate) 3A, resin layer 4A, substrate (second substrate) 2A, functional layer 7, substrate (third substrate) 2B, resin layer 4B, and reinforcing plate (fourth substrate) 3B It is composed of layers. In other words, the laminated body 6 of Fig. 2 corresponds to a laminated body in which the laminated body 1 shown in Fig. 1 is symmetrically arranged via the functional layer 7. Hereinafter, the laminated body including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminated body 1A, and the laminated body including the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminated body 1B.

於第1積層體1A之基板2A之正面2Aa形成有作為功能層7之薄膜電晶體(TFT),於第2積層體1B之基板2B之正面2Ba形成有作為功能層7之彩色濾光片(CF)。 A thin film transistor (TFT) as the functional layer 7 is formed on the front surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the front surface 2Ba of the substrate 2B of the second laminated body 1B. CF).

第1積層體1A與第2積層體1B係基板2A、2B之正面2Aa、2Ba相互重合而被一體化。藉此,製造隔著功能層7而第1積層體1A與第2積層體1B呈對稱配置之構造之積層體6。 The front faces 2Aa and 2Ba of the first laminated body 1A and the second laminated body 1B based substrates 2A and 2B are superposed on each other and integrated. Thereby, the laminated body 6 of the structure in which the 1st laminated body 1A and the 2nd laminated body 1B are arrange|positioned mutually by the functional layer 7 is manufactured.

關於積層體6,於在分離步驟之剝離起始部步驟中藉由刀形成剝離起始部後,於分離步驟之剝離步驟中依序剝離補強板3A、3B,其後,貼合偏光板、背光裝置等而製造作為製品之LCD。 In the layered body 6, after the peeling start portion is formed by a knife in the peeling start portion of the separating step, the reinforcing sheets 3A, 3B are sequentially peeled off in the peeling step of the separating step, and thereafter, the polarizing plate is attached, An LCD as a product is manufactured by a backlight or the like.

[剝離起始部製作裝置10] [Peeling start unit making device 10]

圖3(A)~(E)係表示利用剝離起始部製作裝置(剝離起始部製作器件)10之第1剝離起始部製作方法之說明圖,圖3(A)係表示積層體6與刀N之位置關係之說明圖,圖3(B)係藉由刀N於界面24製作剝離起始部26之說明圖,圖3(C)係表示將要於界面28製作剝離起始部30之前之狀態之說明圖,圖3(D)自藉由刀N於界面28製作剝離起始部30之說明圖,圖3(E)係製作有剝離起始部26、30之積層體6之說明圖。又,圖4係製作有剝離起始部26、30之積層體6之俯視圖。 3(A) to 3(E) are explanatory views showing a method of producing a first peeling start portion by a peeling start portion forming device (peeling start portion forming device) 10, and Fig. 3(A) shows a laminated body 6 FIG. 3(B) is an explanatory view of the peeling start portion 26 formed by the knife N at the interface 24, and FIG. 3(C) shows that the peeling start portion 30 is to be formed at the interface 28. FIG. 3(D) is an explanatory view of the peeling start portion 30 formed by the knife N at the interface 28, and FIG. 3(E) is a laminated body 6 having the peeling start portions 26 and 30. Illustrating. 4 is a plan view of the laminated body 6 in which the peeling start portions 26 and 30 are formed.

於製作剝離起始部26、30時,如圖3(A)所示般,積層體6之補強板3B之背面3Bb被吸附保持於工作台12而被水平地支持(圖中X軸方 向)。 When the peeling start portions 26 and 30 are produced, as shown in Fig. 3(A), the back surface 3Bb of the reinforcing plate 3B of the laminated body 6 is adsorbed and held on the table 12 to be horizontally supported (X-axis side in the figure) to).

刀N係以刀尖與積層體6之角部(第1角部)6A之端面對向之方式藉由支持器14而被水平地支持。又,刀N係藉由高度調整裝置16而調整高度方向(圖中Z軸方向)之位置。進而,刀N與積層體6係藉由滾珠螺桿裝置等運輸裝置18而於水平方向上相對移動。運輸裝置18只要使刀N與工作台12中之至少一者於水平方向上移動即可,於實施形態中係使刀N移動。進而,又,對插入前或插入中之刀N之上表面供給液體20之液體供給裝置22係配置於刀N之上方。 The knife N is horizontally supported by the holder 14 such that the blade edge faces the end surface of the corner portion (first corner portion) 6A of the laminated body 6. Further, the knife N is adjusted in the height direction (the Z-axis direction in the drawing) by the height adjusting device 16. Further, the blade N and the laminated body 6 are relatively moved in the horizontal direction by the transport device 18 such as a ball screw device. The transport device 18 only needs to move at least one of the blade N and the table 12 in the horizontal direction. In the embodiment, the knife N is moved. Further, the liquid supply device 22 that supplies the liquid 20 to the upper surface of the blade N before or during the insertion is disposed above the blade N.

[第1剝離起始部製作方法] [Method for producing first peeling start portion]

於利用剝離起始部製作裝置10之第1剝離起始部製作方法中,將刀N之插入位置設定為積層體6之角部6A且於積層體6之厚度方向上重疊之位置,且以針對各界面24、28而不同之方式設定刀N之插入量。 In the method of producing the first peeling start portion by the peeling start portion forming apparatus 10, the insertion position of the knife N is set to the corner portion 6A of the laminated body 6 and overlapped in the thickness direction of the laminated body 6, and The insertion amount of the knife N is set differently for each of the interfaces 24 and 28.

對其製作順序進行說明。 The order in which they are made will be explained.

於初始狀態下,刀N之刀尖存在於相對於作為第1插入位置之基板2B與樹脂層4B之界面24而沿高度方向(Z軸方向)偏移之位置。因此,首先,如圖3(A)所示,使刀N沿高度方向移動,並將刀N之刀尖之高度設定至界面24之高度。 In the initial state, the blade edge of the blade N exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B as the first insertion position. Therefore, first, as shown in FIG. 3(A), the blade N is moved in the height direction, and the height of the blade edge of the blade N is set to the height of the interface 24.

此後,如圖3(B)所示般,使刀N朝向積層體6之角部6A水平地移動,並將刀N插入界面24特定量。此時,由於積層體6未於厚度方向上被夾持,故而無於刀N之插入時損傷基板2B之顧慮。又,於刀N之插入時或插入前,自液體供給裝置22向刀N之上表面供給液體20。藉此,角部6A之基板2B自樹脂層4B剝離,因此於界面24製作如圖4般於俯視下為三角形狀之剝離起始部26。再者,液體20之供給並非為必須,但若使用液體20,則於拔出刀N後液體20亦殘留於剝離起始部26,因此可製作無法再附著之剝離起始部26。 Thereafter, as shown in FIG. 3(B), the blade N is horizontally moved toward the corner portion 6A of the laminated body 6, and the blade N is inserted into the interface 24 by a specific amount. At this time, since the laminated body 6 is not sandwiched in the thickness direction, there is no concern that the substrate 2B is damaged when the blade N is inserted. Further, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N at the time of insertion of the blade N or before insertion. Thereby, the substrate 2B of the corner portion 6A is peeled off from the resin layer 4B. Therefore, the peeling start portion 26 having a triangular shape in plan view as shown in FIG. 4 is formed at the interface 24. Further, the supply of the liquid 20 is not essential. However, when the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 after the blade N is pulled out, so that the peeling start portion 26 which can no longer adhere can be produced.

繼而,自角部6A將刀N沿水平方向拔出,如圖3(C)所示般,將刀 N之刀尖設定至作為第2插入位置之基板2A與樹脂層4A之界面28之高度。 Then, the blade N is pulled out from the corner 6A in the horizontal direction, as shown in Fig. 3(C), The blade edge of N is set to the height of the interface 28 between the substrate 2A and the resin layer 4A as the second insertion position.

此後,如圖3(D)所示般,使刀N朝向積層體6水平地移動,並將刀N插入界面28特定量。同樣地自液體供給裝置22向刀N之上表面供給液體20。藉此,如圖3(D)所示般,於界面28製作剝離起始部30。此處,刀N對界面28之插入量設為較刀N對界面24之插入量少量。以上為第1剝離起始部製作方法。再者,亦可將刀N對界面24之插入量設為較刀N對界面28之插入量少量。 Thereafter, as shown in Fig. 3(D), the knife N is horizontally moved toward the laminated body 6, and the knife N is inserted into the interface 28 by a certain amount. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N. Thereby, as shown in FIG. 3(D), the peeling start portion 30 is formed at the interface 28. Here, the insertion amount of the knife N to the interface 28 is set to be smaller than the insertion amount of the knife N to the interface 24. The above is the method for producing the first peeling starting portion. Further, the insertion amount of the knife N to the interface 24 may be set to be smaller than the insertion amount of the knife N to the interface 28.

將製作有剝離起始部26、30之積層體6自剝離起始部製作裝置10取出,並搬送至下述剝離裝置(剝離器件),藉由剝離裝置於界面24、28將補強板3B、3A依序剝離。 The layered body 6 on which the peeling start portions 26 and 30 are formed is taken out from the peeling start portion forming apparatus 10, and conveyed to a peeling device (peeling device) described below, and the reinforcing plate 3B is placed on the interfaces 24 and 28 by the peeling device. 3A was peeled off in sequence.

剝離方法之詳細內容於下文中進行敍述,如圖4之箭頭A所示般,藉由使積層體6自角部6A朝向與角部6A對向之角部6B撓曲,於剝離起始部26之面積較大之界面24,以剝離起始部26為起點而補強板3B最先被剝離。藉此,剝離補強板3B。其後,藉由使積層體6自角部6A朝向角部6B再次撓曲,於剝離起始部30之面積較小之界面28,以剝離起始部30為起點而補強板3A被剝離。藉此,剝離補強板3A。 The details of the peeling method will be described later, and as shown by the arrow A in Fig. 4, the laminated body 6 is deflected from the corner portion 6A toward the corner portion 6B opposed to the corner portion 6A at the peeling start portion. The interface 24 having a large area of 26 has the peeling start portion 26 as a starting point and the reinforcing plate 3B is first peeled off. Thereby, the reinforcing plate 3B is peeled off. Thereafter, the laminated body 6 is deflected again from the corner portion 6A toward the corner portion 6B, and the reinforcing plate 3A is peeled off from the peeling start portion 30 as the starting point 28 at the interface 28 where the area of the peeling start portion 30 is small. Thereby, the reinforcing plate 3A is peeled off.

即,第1剝離起始部製作方法係於剝離起始部製作步驟中,使用刀N於界面24、28依序製作剝離起始部26、30,此後,於剝離步驟中於界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。 That is, the first peeling starting portion is formed in the peeling start portion forming step, and the peeling start portions 26, 30 are sequentially formed on the interfaces 24, 28 using the knife N, and thereafter, in the peeling step at the interfaces 24, 28 The reinforcing plates 3B and 3A are peeled off in order. With this configuration, the laminated body 6 can be transported once from the peeling start portion forming apparatus 10 to the peeling device. Therefore, even if the laminated body 6 having the two interfaces 24 and 28 to be peeled off is provided, the laminated body 6 can be efficiently peeled and reinforced. Plates 3A, 3B.

再者,圖4之箭頭A所示之積層體6之撓曲方向可為連結角部6A與角部6B之直線方向,亦可為相對於積層體6之一邊呈45度之方向。即,積層體6之撓曲方向只要自角部6A朝向角部6B設定即可。 Further, the direction of the deflection of the laminated body 6 shown by the arrow A in FIG. 4 may be a linear direction connecting the corner portion 6A and the corner portion 6B, or may be a direction of 45 degrees with respect to one side of the laminated body 6. In other words, the deflection direction of the laminated body 6 may be set from the corner portion 6A toward the corner portion 6B.

[第2剝離起始部製作方法] [Second peeling initiation unit production method]

於利用剝離起始部製作裝置10之第2剝離起始部製作方法中,將刀N之插入位置設定為積層體6之角部6A與除角部6A以外之另一角部(此處係設為角部6B,但亦可為其他角部),於角部6A之基板2B與樹脂層4B之界面24製作剝離起始部,於角部6B之基板2A與樹脂層4A之界面28製作剝離起始部。 In the second peeling start portion manufacturing method using the peeling start portion forming apparatus 10, the insertion position of the knife N is set to the corner portion 6A of the laminated body 6 and the other corner portion other than the corner portion 6A (here The corner portion 6B, but may be other corner portions, the peeling start portion is formed at the interface 24 between the substrate 2B of the corner portion 6A and the resin layer 4B, and the peeling start portion is formed at the interface 28 between the substrate 2A of the corner portion 6B and the resin layer 4A. Starting point.

對其製作順序進行說明。 The order in which they are made will be explained.

首先,如圖5(A)所示,將刀N之刀尖之高度設定至界面24之高度。 First, as shown in FIG. 5(A), the height of the blade edge of the blade N is set to the height of the interface 24.

此後,如圖5(B)所示般,使刀N朝向角部6A水平地移動,將刀N插入位於角部6A之界面24特定量,並且自液體供給裝置22向刀N之上表面供給液體20。藉此,於角部6A之界面24製作剝離起始部32(參照圖5(E)、圖6)。 Thereafter, as shown in Fig. 5(B), the knife N is horizontally moved toward the corner portion 6A, the knife N is inserted into the interface 24 at the corner portion 6A by a certain amount, and supplied from the liquid supply device 22 to the upper surface of the knife N. Liquid 20. Thereby, the peeling start portion 32 is formed at the interface 24 of the corner portion 6A (see FIGS. 5(E) and 6).

繼而,自角部6A將刀N沿水平方向拔出,並如圖5(C)所示般使刀N之刀尖與積層體6之角部6B對向,並且設定至界面28之高度。 Then, the blade N is pulled out from the corner portion 6A in the horizontal direction, and as shown in FIG. 5(C), the blade edge of the blade N faces the corner portion 6B of the laminated body 6, and is set to the height of the interface 28.

此後,如圖5(D)所示般,使刀N朝向角部6B水平地移動,將刀N插入位於角部6B之界面28特定量,並且自液體供給裝置22向刀N之上表面供給液體20。藉此,如圖5(E)所示般,於角部6B之界面28製作剝離起始部34。以上為第2剝離起始部製作方法。再者,刀N對界面24、28之插入量可相同亦可不同。 Thereafter, as shown in Fig. 5(D), the knife N is horizontally moved toward the corner portion 6B, the knife N is inserted into the interface 28 at the corner portion 6B by a specific amount, and supplied from the liquid supply device 22 to the upper surface of the knife N. Liquid 20. Thereby, as shown in FIG. 5(E), the peeling start portion 34 is formed at the interface 28 of the corner portion 6B. The above is the second peeling initiation unit production method. Furthermore, the insertion amount of the knife N to the interfaces 24, 28 may be the same or different.

將製作有剝離起始部32、34之積層體6自剝離起始部製作裝置10取出,並搬送至剝離裝置,藉由剝離裝置於界面24、28將補強板3B、3A依序剝離。剝離方法之詳細內容於下文中進行敍述,如圖6之箭頭A所示,藉由使積層體6自角部6A朝向角部6B撓曲,於界面24,以剝離起始部32為起點而補強板3B被剝離。藉此,剝離補強板3B。其後,如圖6之箭頭B所示,藉由使積層體6自角部6B朝向角部6A撓曲,於界面28,以剝離起始部34為起點而補強板3A被剝離。藉此, 剝離補強板3A。再者,亦可首先實施補強板3A之剝離。 The laminated body 6 on which the peeling start portions 32 and 34 are formed is taken out from the peeling starting portion forming apparatus 10, transported to the peeling device, and the reinforcing sheets 3B and 3A are sequentially peeled off at the interfaces 24 and 28 by the peeling device. The details of the peeling method will be described later. As shown by the arrow A in Fig. 6, the laminate body 6 is deflected from the corner portion 6A toward the corner portion 6B, and the peeling start portion 32 is used as the starting point at the interface 24. The reinforcing plate 3B is peeled off. Thereby, the reinforcing plate 3B is peeled off. Thereafter, as shown by an arrow B in Fig. 6, by bending the laminated body 6 from the corner portion 6B toward the corner portion 6A, the reinforcing plate 3A is peeled off from the peeling start portion 34 as the starting point at the interface 28. With this, Strip the reinforcing plate 3A. Further, the peeling of the reinforcing plate 3A may be performed first.

如上所述,第2剝離起始部製作方法係於剝離起始部製作步驟中,使用刀N於界面24、28依序製作剝離起始部32、34,並於剝離步驟中於界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。 As described above, the second peeling starting portion is formed in the peeling start portion forming step, and the peeling start portions 32 and 34 are sequentially formed on the interfaces 24 and 28 using the knife N, and in the peeling step at the interface 24, The reinforcing plates 3B and 3A were peeled off in sequence. With this configuration, the laminated body 6 can be transported once from the peeling start portion forming apparatus 10 to the peeling device. Therefore, even if the laminated body 6 having the two interfaces 24 and 28 to be peeled off is provided, the laminated body 6 can be efficiently peeled and reinforced. Plates 3A, 3B.

再者,刀N之插入量根據積層體6之尺寸,較佳設定為7mm以上,更佳設定為15~20mm左右。 Further, the insertion amount of the knife N is preferably set to 7 mm or more, and more preferably set to about 15 to 20 mm, depending on the size of the laminated body 6.

又,圖6之箭頭B所示之積層體6之撓曲方向可為連結角部6B與角部6A之直線方向,亦可為相對於積層體6之一邊呈45度之方向。即,積層體6之撓曲方向只要自角部6B朝向角部6A設定即可。 Further, the direction of the deflection of the laminated body 6 shown by the arrow B in Fig. 6 may be a linear direction connecting the corner portion 6B and the corner portion 6A, or may be a direction of 45 degrees with respect to one side of the laminated body 6. In other words, the deflection direction of the laminated body 6 may be set from the corner portion 6B toward the corner portion 6A.

[剝離裝置40] [Peeling device 40]

圖7係表示實施形態之剝離裝置40之構成之縱剖視圖,圖8係模式性表示剝離裝置40之複數個可動體44相對於可撓性板42之配置位置之可撓性板42之俯視圖。再者,圖7相當於沿圖8之C-C線之剖視圖,又,於圖8中以實線表示積層體6。 7 is a longitudinal cross-sectional view showing the configuration of the peeling device 40 of the embodiment, and FIG. 8 is a plan view schematically showing the flexible plate 42 of the plurality of movable bodies 44 of the peeling device 40 with respect to the position of the flexible plate 42. Further, Fig. 7 corresponds to a cross-sectional view taken along line C-C of Fig. 8, and further, the laminated body 6 is indicated by a solid line in Fig. 8.

如圖7所示,剝離裝置40具備隔著積層體6而沿上下配置之一對可動裝置46、46。由於可動裝置46、46為相同構成,故而此處對圖7之配置於下側之可動裝置46進行說明,並藉由對配置於上側之可動裝置46標註相同之符號而省略說明。 As shown in Fig. 7, the peeling device 40 is provided with a pair of movable devices 46 and 46 arranged one above the other with the laminated body 6 interposed therebetween. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of FIG. 7 will be described here, and the same reference numerals will be given to the movable device 46 disposed on the upper side, and the description thereof will be omitted.

可動裝置46係由可撓性板42、複數個可動體44、針對各可動體44而使可動體44升降移動之複數個驅動裝置48、及針對各驅動裝置48而控制驅動裝置48之控制器50等構成。 The movable device 46 is composed of a flexible plate 42 , a plurality of movable bodies 44 , a plurality of driving devices 48 that move the movable body 44 up and down for each movable body 44 , and a controller that controls the driving device 48 for each driving device 48 . 50 and so on.

由於可撓性板42係使補強板3B撓曲變形,故而真空吸附保持補強板3B。再者,亦可為靜電吸附或磁性吸附以代替真空吸附。 Since the flexible plate 42 flexes and deforms the reinforcing plate 3B, the reinforcing plate 3B is vacuum-sucked and held. Furthermore, it may be electrostatic adsorption or magnetic adsorption instead of vacuum adsorption.

圖9(a)係可撓性板42之俯視圖,圖9(b)係沿圖9(a)之D-D線之可撓 性板42之縱剖視圖。 Figure 9 (a) is a plan view of the flexible plate 42, and Figure 9 (b) is flexible along the D-D line of Figure 9 (a) A longitudinal section view of the sex plate 42.

可撓性板42係由吸附保持積層體6之補強板3B之布狀之吸附片52、被覆有吸附片52之彈性片54、及支持彈性片54之本體板56構成。於彈性片54之正面具備貫通之框狀之槽58,於較該槽58靠內側被覆有吸附片52。又,於本體板56開設有複數個貫通孔60,該等貫通孔60之一端連通於槽58,另一端經由未圖示之抽吸管路連接於抽氣源(例如真空泵)。 The flexible plate 42 is composed of a cloth-like adsorption sheet 52 that adsorbs and holds the reinforcing plate 3B of the laminated body 6, an elastic sheet 54 coated with the adsorption sheet 52, and a main body plate 56 that supports the elastic sheet 54. A groove 58 penetrating through the frame is provided on the front surface of the elastic piece 54, and the suction piece 52 is covered on the inner side of the groove 58. Further, a plurality of through holes 60 are formed in the main body plate 56. One end of the through holes 60 communicates with the groove 58 and the other end is connected to an air suction source (for example, a vacuum pump) via a suction pipe (not shown).

因此,若驅動上述抽氣源,則上述抽吸管路、貫通孔60、及槽58之空氣被抽吸,藉此積層體6之補強板3B被真空吸附保持於吸附片52。於此情形時,吸附片52之外形設定為大於補強板3B之外形以使吸附片52可整體支持補強板3B。又,作為彈性片54之材料並未特別限定,較佳為橡膠。作為橡膠,較佳為聚矽氧橡膠。 Therefore, when the suction source is driven, the air in the suction line, the through hole 60, and the groove 58 is sucked, whereby the reinforcing plate 3B of the laminated body 6 is vacuum-sucked and held by the adsorption sheet 52. In this case, the outer shape of the adsorption sheet 52 is set to be larger than the shape of the reinforcing plate 3B so that the adsorption sheet 52 can integrally support the reinforcing plate 3B. Further, the material of the elastic sheet 54 is not particularly limited, and rubber is preferable. As the rubber, a polyoxyethylene rubber is preferred.

本體板56與彈性片54為相同大小。又,本體板56較彈性片54彎曲剛度更高,本體板56之彎曲剛度支配可撓性板42之彎曲剛度。可撓性板42之每單位寬度(1mm)之彎曲剛度較佳為1000~40000N.mm2/mm。例如,於可撓性板42之寬度為100mm之部分,彎曲剛度成為100000~4000000N.mm2。藉由將可撓性板42之彎曲剛度設為1000N.mm2/mm以上,可防止吸附保持於可撓性板42之補強板3B之折彎。又,藉由將可撓性板42之彎曲剛度設為40000N.mm2/mm以下,可使吸附保持於可撓性板42之補強板3B適當地撓曲變形。 The body plate 56 and the elastic piece 54 are the same size. Moreover, the body plate 56 has a higher bending rigidity than the elastic piece 54, and the bending rigidity of the body plate 56 governs the bending rigidity of the flexible plate 42. The bending rigidity per unit width (1 mm) of the flexible plate 42 is preferably 1000 to 40,000 N. Mm 2 /mm. For example, in the portion of the flexible plate 42 having a width of 100 mm, the bending rigidity becomes 100,000 to 4,000,000 N. Mm 2 . By setting the bending stiffness of the flexible plate 42 to 1000N. The mm 2 /mm or more prevents the bending of the reinforcing plate 3B held by the flexible plate 42 from being adsorbed. Also, by setting the bending stiffness of the flexible plate 42 to 40000 N. Below mm 2 /mm, the reinforcing plate 3B which is adsorbed and held by the flexible plate 42 can be appropriately flexed and deformed.

作為本體板56,例如除聚氯乙烯(PVC)樹脂、聚碳酸酯樹脂、丙烯酸系樹脂、聚縮醛(POM)樹脂等樹脂板以外,使用金屬板。 As the main body plate 56, for example, a metal plate is used in addition to a resin plate such as a polyvinyl chloride (PVC) resin, a polycarbonate resin, an acrylic resin, or a polyacetal (POM) resin.

如圖7所示之圓盤狀之複數個可動體44係如圖8所示般以柵格狀固定於本體板56之下表面。該等可動體44係藉由螺栓等緊固構件固定於本體板56,亦可進行接著固定以代替螺栓。該等可動體44係藉由利用控制器50控制驅動之驅動裝置48而獨立地升降移動。 A plurality of movable bodies 44 having a disk shape as shown in FIG. 7 are fixed to the lower surface of the main body plate 56 in a lattice shape as shown in FIG. The movable bodies 44 are fixed to the main body plate 56 by fastening members such as bolts, and may be fixed next to the bolts. The movable bodies 44 are independently moved up and down by the drive unit 48 that is controlled by the controller 50.

即,控制器50控制驅動裝置48,並使圖8中之位於積層體6之角部6A側之可動體44至位於箭頭A所示之剝離進行方向之角部6B側之可動體44依序下降移動。藉由該動作,如圖10之縱剖視圖所示般以界面24之剝離起始部26(參照圖4)為起點將積層體6剝離。再者,圖7、圖10所示之積層體6係於圖3中說明之藉由第1剝離起始部製作方法製作剝離起始部26、30之積層體6。 That is, the controller 50 controls the driving device 48, and the movable body 44 on the side of the corner portion 6A of the laminated body 6 in Fig. 8 is sequentially moved to the movable body 44 on the side of the corner portion 6B of the peeling progress direction indicated by the arrow A. Falling moves. By this operation, the laminated body 6 is peeled off from the peeling start portion 26 (see FIG. 4) of the interface 24 as shown in the longitudinal cross-sectional view of FIG. Further, the laminated body 6 shown in Figs. 7 and 10 is a laminated body 6 in which the peeling start portions 26 and 30 are produced by the first peeling starting portion forming method described with reference to Fig. 3 .

驅動裝置48例如係由旋轉式之伺服馬達及滾珠螺桿機構等構成。伺服馬達之旋轉運動於滾珠螺桿機構中被轉換為直線運動,並被傳遞至滾珠螺桿機構之桿62。於桿62之前端部經由球形接頭64設置有可動體44。藉此,如圖10所示般可使可動體44追隨可撓性板42之撓曲變形而傾動。因此,不對可撓性板42施加過多之力便可使可撓性板42自角部6A朝向角部6B撓曲變形。再者,作為驅動裝置48,並不限定於旋轉式之伺服馬達及滾珠螺桿機構,亦可為線性式之伺服馬達、或流體壓汽缸(例如空氣壓汽缸)。 The drive unit 48 is constituted by, for example, a rotary servo motor, a ball screw mechanism, or the like. The rotary motion of the servo motor is converted into a linear motion in the ball screw mechanism and transmitted to the rod 62 of the ball screw mechanism. A movable body 44 is provided at a front end of the rod 62 via a ball joint 64. Thereby, as shown in FIG. 10, the movable body 44 can be tilted following the flexural deformation of the flexible plate 42. Therefore, the flexible plate 42 can be flexibly deformed from the corner portion 6A toward the corner portion 6B without applying excessive force to the flexible plate 42. Further, the drive device 48 is not limited to the rotary servo motor and the ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, an air pressure cylinder).

複數個驅動裝置48較佳為隔著緩衝構件68安裝於可升降之框架66。緩衝構件68係以追隨可撓性板42之撓曲變形之方式彈性變形。藉此,桿62相對於框架66傾動。 A plurality of drive units 48 are preferably mounted to the elevating frame 66 via a cushioning member 68. The cushioning member 68 is elastically deformed in such a manner as to follow the flexural deformation of the flexible plate 42. Thereby, the rod 62 is tilted relative to the frame 66.

於將剝離後之補強板3B自可撓性板42卸下時,框架66係藉由未圖示之驅動部而下降移動。 When the reinforcing plate 3B after peeling is detached from the flexible plate 42, the frame 66 is moved downward by a driving unit (not shown).

控制器50構成為包含CPU(Central Processing Unit,中央處理單元)、ROM(Read Only Memory,唯讀記憶體)、及RAM(Random Access Memory,隨機存取記憶體)等記錄媒體等之電腦。控制器50藉由使CPU執行記錄於記錄媒體之程式,而針對各驅動裝置48控制複數個驅動裝置48,從而控制複數個可動體44之升降移動。 The controller 50 is configured to include a computer such as a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The controller 50 controls a plurality of driving devices 48 for each driving device 48 by causing the CPU to execute a program recorded on the recording medium, thereby controlling the lifting movement of the plurality of movable bodies 44.

[利用剝離裝置40之補強板3A、3B之剝離方法] [Separation method of reinforcing plates 3A, 3B by peeling device 40]

[基於第1剝離起始部製作方法之剝離方法] [Separation method based on the method for producing the first peeling initiation portion]

於圖11(A)~(C)~圖12(A)~(C)中表示有於圖3中說明之藉由第1剝離起始部製作方法於角部6A製作有剝離起始部26、30之積層體6之剝離方法。即,於該圖中時間序列性地表示有將積層體6之補強板3A、3B剝離之剝離方法。又,向剝離裝置40之積層體6之搬入作業、及剝離後之補強板3A、3B及面板70之搬出作業係藉由圖11(A)所示之具備吸附墊72之搬送裝置74而進行。再者,於圖11、圖12中,為了避免圖式之繁雜,而省略可動裝置46之圖示。又,面板70係除補強板3A、3B以外之基板2A與基板2B隔著功能層7貼合而成之製品面板。 11(A) to (C) to (A) to (C), the peeling start portion 26 is formed in the corner portion 6A by the first peeling start portion manufacturing method described with reference to Fig. 3 . The peeling method of the laminated body 6 of 30. That is, in the figure, a peeling method in which the reinforcing sheets 3A and 3B of the laminated body 6 are peeled off is shown in time series. Moreover, the loading operation of the laminated body 6 of the peeling device 40 and the unloading operation of the reinforcing plates 3A and 3B and the panel 70 after peeling are performed by the conveying device 74 including the adsorption pad 72 shown in Fig. 11(A). . In addition, in FIGS. 11 and 12, in order to avoid the complication of the drawings, the illustration of the movable device 46 is omitted. Further, the panel 70 is a product panel in which the substrate 2A and the substrate 2B other than the reinforcing plates 3A and 3B are bonded together via the functional layer 7.

圖11(A)係根據搬送裝置74之箭頭E、F所示之動作將積層體6載置於下側之可撓性板42之剝離裝置40之側視圖。於此情形時,以搬送裝置74插入至下側之可撓性板42與上側之可撓性板42之間之方式使下側之可撓性板42與上側之可撓性板42預先移動至相對地充分退避後之位置。接下來,若將積層體6載置於下側之可撓性板42,則藉由下側之可撓性板42真空吸附保持積層體6之補強板3B。 Fig. 11(A) is a side view of the peeling device 40 in which the laminated body 6 is placed on the lower flexible plate 42 in accordance with the operation indicated by the arrows E and F of the conveying device 74. In this case, the lower flexible plate 42 and the upper flexible plate 42 are moved in advance so that the transfer device 74 is inserted between the lower flexible plate 42 and the upper flexible plate 42. To a position that is relatively fully retracted. Next, when the laminated body 6 is placed on the lower flexible plate 42, the reinforcing plate 3B of the laminated body 6 is vacuum-sucked by the lower flexible plate 42.

圖11(B)係下側之可撓性板42與上側之可撓性板42向相對接近之方向移動,而積層體6之補強板3A藉由上側之可撓性板42而被真空吸附保持之狀態之剝離裝置40之側視圖。 11(B), the lower flexible plate 42 and the upper flexible plate 42 move in a relatively close direction, and the reinforcing plate 3A of the laminated body 6 is vacuum-adsorbed by the upper flexible plate 42. A side view of the stripping device 40 in a state of being held.

圖11(C)係表示一面使下側之可撓性板42自積層體6之角部6A朝向角部6B向下方撓曲變形,一面於積層體6之界面24以剝離起始部26(參照圖4)為起點將補強板3B剝離之狀態之側視圖。即,於圖10所示之下側之可撓性板42之複數個可動體44中,使位於積層體6之角部6A側之可動體44至位於角部6B側之可動體44依序下降移動,而於界面24將補強板3B剝離。 Fig. 11(C) shows that the lower flexible plate 42 is deflected downward from the corner portion 6A of the laminated body 6 toward the corner portion 6B, and the peeling start portion 26 is formed at the interface 24 of the laminated body 6 ( Referring to Fig. 4), a side view of a state in which the reinforcing plate 3B is peeled off as a starting point. In other words, in the plurality of movable bodies 44 of the flexible plate 42 on the lower side shown in Fig. 10, the movable body 44 on the side of the corner portion 6A of the laminated body 6 is moved to the movable body 44 on the side of the corner portion 6B. The movement is lowered, and the reinforcing plate 3B is peeled off at the interface 24.

圖12(A)係於界面24補強板3B完全被剝離後之狀態之剝離裝置40之側視圖。根據該圖,經剝離後之補強板3B被真空吸附保持於下側之可撓性板42,除補強板3B以外之積層體6(包含補強板3A及面板70 之積層體)被真空吸附保持於上側之可撓性板42。 Fig. 12(A) is a side view of the peeling device 40 in a state in which the interface plate 24 is completely peeled off from the reinforcing plate 3B. According to the figure, the reinforced plate 3B after peeling is vacuum-sucked and held by the flexible plate 42 on the lower side, and the laminated body 6 other than the reinforcing plate 3B (including the reinforcing plate 3A and the panel 70) The laminated body) is vacuum-adsorbed and held on the upper flexible plate 42.

又,以圖11(A)所示之搬送裝置74插入至上下之可撓性板42之間之方式使下側之可撓性板42與上側之可撓性板42移動至相對充分地退避後之位置。 Further, the lower flexible plate 42 and the upper flexible plate 42 are moved to relatively sufficiently evacuated so that the transfer device 74 shown in Fig. 11(A) is inserted between the upper and lower flexible plates 42. After the location.

此後,首先,解除下側之可撓性板42之真空吸附。繼而,藉由搬送裝置74之吸附墊72吸附保持補強板3B。接下來,根據圖12(A)之箭頭G、H所示之搬送裝置74之動作將補強板3B自剝離裝置40搬出。 Thereafter, first, vacuum suction of the lower flexible plate 42 is released. Then, the reinforcing plate 3B is suction-held by the adsorption pad 72 of the conveying device 74. Next, the reinforcing plate 3B is carried out from the peeling device 40 in accordance with the operation of the conveying device 74 indicated by arrows G and H in Fig. 12(A).

圖12(B)係除補強板3B以外之積層體6藉由下側之可撓性板42與上側之可撓性板42而被真空吸附保持之側視圖。即,下側之可撓性板42與上側之可撓性板42向相對接近之方向移動,而基板2B被真空吸附保持於下側之可撓性板42。 Fig. 12(B) is a side view in which the laminated body 6 other than the reinforcing plate 3B is vacuum-sucked and held by the lower flexible plate 42 and the upper flexible plate 42. That is, the lower flexible plate 42 and the upper flexible plate 42 move in the relatively close direction, and the substrate 2B is vacuum-sucked and held by the lower flexible plate 42.

圖12(C)係表示一面使上側之可撓性板42自積層體6之角部6A朝向角部6B向上方撓曲變形,一面於積層體6之界面28以剝離起始部30(參照圖4)為起點將補強板3A剝離之狀態之側視圖。即,於圖7所示之上側之可撓性板42之複數個可動體44中,使位於積層體6之角部6A側之可動體44至位於角部6B側之可動體44依序上升移動,而於界面28將補強板3A剝離。 12(C) shows that the upper flexible plate 42 is bent upward from the corner portion 6A of the laminated body 6 toward the corner portion 6B, and the peeling start portion 30 is formed at the interface 28 of the laminated body 6 (refer to Fig. 4) is a side view showing a state in which the reinforcing plate 3A is peeled off from the starting point. In other words, in the plurality of movable bodies 44 of the flexible plate 42 on the upper side shown in Fig. 7, the movable body 44 on the side of the corner portion 6A of the laminated body 6 is moved up to the movable body 44 on the side of the corner portion 6B. Moving, the reinforcing plate 3A is peeled off at the interface 28.

此後,將自面板70完全剝離之補強板3A自上側之可撓性板42取出,並將面板70自下側之可撓性板42取出。以上為於角部6A製作有剝離起始部26、30之積層體6之剝離方法。 Thereafter, the reinforcing plate 3A completely peeled from the panel 70 is taken out from the upper flexible plate 42, and the panel 70 is taken out from the lower flexible plate 42. The above is a peeling method in which the laminated body 6 having the peeling start portions 26 and 30 is formed in the corner portion 6A.

因此,根據上述實施形態之剝離方法,利用剝離起始部製作裝置10於界面24、28製作剝離起始部26、30,並利用剝離裝置40於該界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置40搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。 Therefore, according to the peeling method of the above embodiment, the peeling start portion manufacturing device 10 is used to form the peeling start portions 26 and 30 at the interfaces 24 and 28, and the reinforcing plate 3B is sequentially peeled off at the interfaces 24 and 28 by the peeling device 40, 3A. With this configuration, the laminated body 6 can be transported once from the peeling start portion forming apparatus 10 to the peeling device 40. Therefore, even if the laminated body 6 having the two interfaces 24 and 28 to be peeled off is provided, the laminated body 6 can be efficiently peeled off. Reinforcing plates 3A, 3B.

[基於第2剝離起始部製作方法之剝離方法] [Separation method based on the second peeling initiation portion preparation method]

於圖13中表示有藉由於圖5中說明之第2剝離起始部製作方法於角部6A、6B製作有剝離起始部32、34(參照圖6)之積層體6之剝離方法之要部。 FIG. 13 shows the peeling method of the laminated body 6 in which the peeling start portions 32 and 34 (see FIG. 6) are formed in the corner portions 6A and 6B by the second peeling start portion manufacturing method described in FIG. unit.

該剝離方法首先係以剝離起始部32為起點於界面24將補強板3B剝離,該步驟與圖11(A)~(C)~圖12(A)、(B)所示之步驟相同,因此省略說明。 This peeling method first peels the reinforcing plate 3B from the interface 24 with the peeling start portion 32 as a starting point, and this step is the same as the steps shown in Figs. 11(A) to (C) to Figs. 12(A) and (B). Therefore, the description is omitted.

基於第2剝離起始部製作方法之剝離方法係自圖12(B)之狀態如圖13所示般一面使上側之可撓性板42自積層體6之角部6B朝向角部6A向上方撓曲變形,一面於積層體6之界面28以剝離起始部34(參照圖6)為起點將補強板3A剝離。 The peeling method based on the second peeling starting portion manufacturing method is such that the upper flexible plate 42 is lifted upward from the corner portion 6B of the laminated body 6 toward the corner portion 6A as shown in Fig. 13 In the flexural deformation, the reinforcing plate 3A is peeled off from the interface 28 of the laminated body 6 with the peeling start portion 34 (see FIG. 6) as a starting point.

此後,將自面板70完全剝離之補強板3A自上側之可撓性板42取出,並將面板70自下側之可撓性板42取出。以上為於角部6A製作有剝離起始部32、及於角部6B製作有剝離起始部34之積層體6之剝離方法。 Thereafter, the reinforcing plate 3A completely peeled from the panel 70 is taken out from the upper flexible plate 42, and the panel 70 is taken out from the lower flexible plate 42. The above is a peeling method in which the peeling start portion 32 and the laminated body 6 having the peeling start portion 34 formed in the corner portion 6B are formed in the corner portion 6A.

因此,根據上述實施形態之剝離方法,利用剝離起始部製作裝置10於界面24、28製作剝離起始部32、34,並利用剝離裝置40於該界面24、28依序剝離補強板3B、3A。藉此,將積層體6自剝離起始部製作裝置10向剝離裝置40搬送1次便可,因此即便為具備2個欲進行剝離之界面24、28之積層體6,亦可高效率地剝離補強板3A、3B。 Therefore, according to the peeling method of the above-described embodiment, the peeling start portion forming device 10 is used to form the peeling start portions 32 and 34 at the interfaces 24 and 28, and the reinforcing plate 3B is sequentially peeled off at the interfaces 24 and 28 by the peeling device 40, 3A. With this configuration, the laminated body 6 can be transported once from the peeling start portion forming apparatus 10 to the peeling device 40. Therefore, even if the laminated body 6 having the two interfaces 24 and 28 to be peeled off is provided, the laminated body 6 can be efficiently peeled off. Reinforcing plates 3A, 3B.

又,較佳為藉由統一控制剝離起始部製作裝置10及剝離裝置40之圖7之控制裝置(控制器件)76控制剝離起始部製作裝置10之界面24、28之剝離起始部製作動作及剝離裝置40之界面24、28之剝離動作。 Further, it is preferable that the control device (control device) 76 of Fig. 7 which integrally controls the peeling start portion forming device 10 and the peeling device 40 controls the peeling start portion of the interfaces 24, 28 of the peeling start portion producing device 10 The peeling action of the interfaces 24 and 28 of the action and peeling device 40.

再者,於實施形態中,例示了具備2個界面24、28之積層體6,但本發明設為對象之積層體並不限定於積層體6,只要為由3片以上之基板可剝離地貼合而成之積層體即可。 In addition, in the embodiment, the laminated body 6 having the two interfaces 24 and 28 is exemplified, but the laminated body to be used in the present invention is not limited to the laminated body 6, and may be peeled off from three or more substrates. It can be laminated together.

參照特定之實施態樣對本發明詳細地進行了說明,但業者應明瞭可於不脫離本發明之精神與範圍之情況下添加各種變更或修正。 The present invention has been described in detail with reference to the specific embodiments thereof. It is understood that various changes and modifications may be added without departing from the spirit and scope of the invention.

本申請案係基於在2014年4月30日提出申請之日本專利申請2014-093440者,其內容係作為參照而被引用至本文中。 The present application is based on Japanese Patent Application No. 2014-093440, filed on Apr. 30, 2014, the content of which is hereby incorporated by reference.

6‧‧‧積層體 6‧‧‧Layer

6A‧‧‧角部 6A‧‧‧ corner

6B‧‧‧角部 6B‧‧‧ corner

26‧‧‧剝離起始部 26‧‧‧ peeling start

30‧‧‧剝離起始部 30‧‧‧ peeling start

A‧‧‧箭頭 A‧‧‧ arrow

Claims (12)

一種積層體之剝離裝置,其特徵在於具備:剝離起始部製作器件,其針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而製作2個以上之剝離起始部;剝離器件,其使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離;及控制器件,其於控制上述剝離起始部製作器件在上述2個以上之界面使上述刀依序切入而製作上述2個以上之剝離起始部後,控制上述剝離器件以上述2個以上之界面之上述剝離起始部為起點依序剝離。 A peeling device for a laminated body, comprising: a peeling start portion forming device for inserting a knife from an end portion of the laminated body from an end portion of the laminated body Two or more peeling start portions are formed by a specific amount of two or more interfaces on the interface between the substrate and the substrate; and the peeling device is configured to bend and deform at least one of the three or more substrates, and the above two The peeling start portions of the plurality of interfaces are sequentially peeled off from the starting point; and the control device is configured to control the peeling start portion forming device to sequentially cut the cutters at the two or more interfaces to produce the two or more After peeling off the starting portion, the peeling device is controlled to be sequentially peeled off from the peeling start portion of the two or more interfaces. 如請求項1之積層體之剝離裝置,其中上述剝離起始部製作器件之上述刀之插入位置設定為上述積層體之第1角部且於上述積層體之厚度方向上重疊之位置,且上述刀之插入量以針對上述每一界面而不同之方式設定,且因上述剝離器件所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定。 The peeling device of the laminated body according to claim 1, wherein the insertion position of the blade of the peeling starting portion forming device is set to a position at which the first corner portion of the laminated body overlaps in the thickness direction of the laminated body, and The insertion amount of the blade is set differently for each of the interfaces, and the deflection direction of the substrate due to the peeling device is from a corner of the first corner toward a corner opposite to the first corner. set up. 如請求項1之積層體之剝離裝置,其中上述剝離起始部製作器件之上述刀之插入位置至少設定為上述積層體之第1角部與除上述第1角部以外之另一角部,且因上述剝離器件所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定,且係自上述另一角部朝向與上述另一角部對向之角部而設定。 The peeling device of the laminated body according to claim 1, wherein the insertion position of the blade of the peeling starting portion forming device is set at least at a first corner portion of the laminated body and another corner portion other than the first corner portion, and The deflection direction of the substrate due to the peeling device is set from a corner portion of the first corner portion facing the first corner portion, and is oriented from the other corner portion toward the other corner portion Set at the corner. 如請求項1、2或3之積層體之剝離裝置,其中上述積層體係至少第1基板、第2基板、第3基板、及第4基板依序可剝離地貼合而成之積層體,且上述剝離起始部製作器件之上述刀之插入位置係設定為上述第1基板與上述第2基板之界面、及上述第3基板與上述第4基板之界面。 The stripping device of the laminate according to claim 1, wherein the at least the first substrate, the second substrate, the third substrate, and the fourth substrate are bonded to each other in a stepwise manner, and The insertion position of the blade of the peeling start portion forming device is set to be an interface between the first substrate and the second substrate, and an interface between the third substrate and the fourth substrate. 一種積層體之剝離方法,其特徵在於具備:剝離起始部製作步驟,其係針對由3片以上之基板可剝離地貼合而成之積層體,自上述積層體之端部將刀插入相鄰之基板與基板之界面中之2個以上之界面特定量而分別製作2個以上之剝離起始部;及剝離步驟,其係使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離。 A method for peeling a laminated body, comprising: a step of forming a peeling start portion, wherein the laminated body is formed by peelingly bonding three or more substrates, and inserting a blade from an end portion of the laminated body Two or more peeling start portions are respectively formed in a specific amount of two or more interfaces between the adjacent substrate and the substrate; and a peeling step of bending and deforming at least one of the three or more substrates The peeling start portion of the two or more interfaces is sequentially peeled off as a starting point. 如請求項5之積層體之剝離方法,其中上述剝離起始部製作步驟之上述刀之插入位置設定為上述積層體之第1角部且於上述積層體之厚度方向上重疊之位置,且上述刀之插入量係以針對上述每一界面而不同之方式設定,且因上述剝離步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定。 The peeling method of the laminated body according to claim 5, wherein the insertion position of the blade in the peeling start portion forming step is set to a position at which the first corner portion of the laminated body overlaps in the thickness direction of the laminated body, and The insertion amount of the knife is set differently for each of the interfaces, and the deflection direction of the substrate due to the peeling step is from a corner of the first corner toward a corner opposite to the first corner And set. 如請求項5之積層體之剝離方法,其中上述剝離起始部製作步驟之上述刀之插入位置至少設定為上述積層體之第1角部與除上述第1角部以外之另一角部,且因上述剝離步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定,且係自上述另一角部朝向與上述另一角部對向之角部而設定。 The method of peeling a laminated body according to claim 5, wherein the insertion position of the blade in the peeling start portion forming step is at least set to a first corner portion of the laminated body and another corner portion other than the first corner portion, and The deflection direction of the substrate due to the peeling step is set from a corner portion of the first corner portion facing the first corner portion, and the other corner portion faces the other corner portion Set at the corner. 如請求項5、6或7之積層體之剝離方法,其中上述積層體係至少第1基板、第2基板、第3基板、及第4基板可剝離地貼合而成之積層體,且上述剝離起始部製作步驟之上述刀之插入位置係設定為上述第1基板與上述第2基板之界面、及上述第3基板與上述第4基板之界面。 The method for peeling a laminated body according to claim 5, 6 or 7, wherein the laminated system is formed by laminating at least a first substrate, a second substrate, a third substrate, and a fourth substrate, and the peeling is performed The insertion position of the blade in the initial portion forming step is set as an interface between the first substrate and the second substrate, and an interface between the third substrate and the fourth substrate. 一種電子裝置之製造方法,其具有:功能層形成步驟,其係於由3片以上之基板可剝離地貼合而成之積層體所含之上述基板中之至少1片基板之正面形成功能層;及分離步驟,其係將形成有上述功能層之上述基板自另一基板分離;該電子裝置之製造方法之特徵在於,上述分離步驟具備:剝離起始部製作步驟,其係自上述積層體之端部將刀插入上述積層體之相鄰之基板與基板之界面中之2個以上之界面特定量而分別製作2個以上之剝離起始部;及剝離步驟,其係使上述3片以上之基板中之至少一片基板撓曲變形,並以上述2個以上之界面之上述剝離起始部為起點依序剝離。 A method for producing an electronic device, comprising: a functional layer forming step of forming a functional layer on a front surface of at least one of the substrates included in a laminate which is formed by laminating three or more substrates And a separating step of separating the substrate on which the functional layer is formed from another substrate; the method of manufacturing the electronic device characterized in that the separating step includes a step of fabricating a peeling starting portion from the laminated body The end portion is formed by inserting a knife into two or more interface specific amounts of the interface between the adjacent substrate and the substrate of the laminated body to form two or more peeling start portions, and a peeling step for making the three or more pieces At least one of the substrates is flexibly deformed, and is sequentially peeled off from the peeling start portion of the two or more interfaces. 如請求項9之電子裝置之製造方法,其中上述剝離起始部製作步驟之上述刀之插入位置係設定為上述積層體之第1角部且於上述積層體之厚度方向上重疊之位置,且上述刀之插入量係以針對上述每一界面而不同之方式設定,且因上述剝離步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定。 The method of manufacturing an electronic device according to claim 9, wherein the insertion position of the blade in the peeling start portion forming step is set to a position at which the first corner portion of the laminated body overlaps in a thickness direction of the laminated body, and The insertion amount of the knives is set differently for each of the interfaces, and the deflection direction of the substrate due to the peeling step is from the angle of the first corner toward the angle opposite to the first corner Set by the Ministry. 如請求項9之電子裝置之製造方法,其中上述剝離起始部製作步驟之上述刀之插入位置至少設定為上述積層體之第1角部與除上 述第1角部以外之另一角部,且因上述剝離步驟所致之上述基板之撓曲方向係自上述第1角部朝向與上述第1角部對向之角部而設定,且係自上述另一角部朝向與上述另一角部對向之角部而設定。 The method of manufacturing an electronic device according to claim 9, wherein the insertion position of the knife in the peeling start portion forming step is at least set to a first corner portion and a division of the laminated body The other corner portion other than the first corner portion, wherein the deflection direction of the substrate due to the peeling step is set from a corner portion of the first corner portion facing the first corner portion, and is set from The other corner portion is set toward a corner opposite to the other corner portion. 如請求項9、10或11之電子裝置之製造方法,其中上述積層體係至少第1基板、第2基板、第3基板、及第4基板可剝離地貼合而成之積層體,且於上述第2基板與上述第3基板之各者之對向面形成有上述功能層,且上述剝離起始部製作步驟之上述刀之插入位置係設定為上述第1基板與上述第2基板之界面、及上述第3基板與上述第4基板之界面。 The method of manufacturing an electronic device according to claim 9, wherein the laminated system is formed by laminating at least a first substrate, a second substrate, a third substrate, and a fourth substrate. The functional layer is formed on a facing surface of each of the second substrate and the third substrate, and the insertion position of the blade in the peeling start portion forming step is set to be an interface between the first substrate and the second substrate. And an interface between the third substrate and the fourth substrate.
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