JP5807554B2 - Peeling apparatus and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a peeling apparatus for peeling a substrate and a reinforcing plate, and an electronic device manufacturing method.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries are made thinner and lighter, there is a demand for thinner substrates used in electronic devices. As the substrate becomes thinner, the handling of the substrate becomes worse, and it becomes difficult to form a functional layer (for example, a thin film transistor or a color filter) for an electronic device on the substrate.

  Thus, a method has been proposed in which a functional layer is formed on a substrate reinforced with a reinforcing plate, and then the substrate and the reinforcing plate are peeled off (see, for example, Patent Document 1). The substrate and the reinforcing plate are peeled by inserting the knife into one end of the interface between the main surface of the substrate and the main surface of the reinforcing plate, and then peeling the substrate and the reinforcing plate sequentially from one end side to the other end side. This is performed by bending and deforming at least one of the reinforcing plates.

  Conventionally, a camera is used to adjust the insertion position of the knife. The camera simultaneously captures the position of the knife edge and the position of the interface, and supplies the captured image data to the image processing unit. The image processing unit performs image processing on the image data supplied from the camera and detects a relative position between the blade edge of the knife and the interface.

International Publication No. 2010/090147

  However, it may be difficult to directly detect the position of the interface. For example, when the end face of the substrate and the end face of the reinforcing plate are coated at the time of forming the functional layer, or when the position of the interface is hidden, such as when the resin layer included in the reinforcing plate protrudes from the end face of the substrate. It is done. Moreover, when a crack exists in the end surface of a board | substrate or the end surface of a reinforcement board, there exists a possibility of detecting the position of an interface accidentally. Therefore, the accuracy of the knife insertion position may be deteriorated.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a peeling apparatus capable of accurately inserting a knife into an interface and a method for manufacturing an electronic device.

In order to solve the above problems, a peeling apparatus according to one aspect of the present invention provides:
In the peeling device for peeling the substrate and the reinforcing plate attached to the substrate,
A knife inserted into an interface between the substrate and the first main surface of the reinforcing plate;
An adjustment unit that adjusts the distance between the blade edge of the knife and the interface in a direction perpendicular to the interface before insertion of the knife;
A position detection unit for detecting a relative position between a blade edge of the knife and a second main surface opposite to the first main surface of the reinforcing plate in a direction perpendicular to the interface;
A plate thickness detector for detecting the plate thickness of the reinforcing plate;
An adjustment processing unit for operating the adjustment unit based on the detection result of the position detection unit and the detection result of the plate thickness detection unit ;
The position detection unit includes an imaging unit that captures the position of the blade edge of the knife and the position of the second main surface of the reinforcing plate, an image processing unit that performs image processing on an image captured by the imaging unit, A calculation unit that calculates the relative position based on an image processing result of the image processing unit,
The reinforcing plate has translucency,
The plate thickness detection unit detects the plate thickness of the reinforcing plate by spectral interferometry.

In addition, a method for manufacturing an electronic device according to another aspect of the present invention includes:
In a method for manufacturing an electronic device, comprising a step of forming a functional layer on a substrate reinforced with a reinforcing plate, and a step of separating the reinforcing plate and the substrate on which the functional layer is formed.
An adjustment step of adjusting a distance between the blade edge of the knife and the interface in a direction perpendicular to the interface before inserting the knife into the interface between the substrate and the first main surface of the reinforcing plate; ,
The adjustment process includes:
A position detection step of detecting a relative position between the blade edge of the knife and the second main surface opposite to the first main surface of the reinforcing plate in a direction perpendicular to the interface;
A plate thickness detecting step for detecting the plate thickness of the reinforcing plate;
E Bei an adjustment process of adjusting the interval based on the thickness of said detected relative position by the position detection step, and detected by the thickness detection step the reinforcing plate,
In the position detection step, image processing is performed on an image captured by an imaging unit that captures the position of the blade edge of the knife and the position of the second main surface of the reinforcing plate, and the relative position is calculated.
The reinforcing plate has translucency,
In the plate thickness detection step, the plate thickness is detected by spectral interferometry.

  ADVANTAGE OF THE INVENTION According to this invention, the peeling apparatus which can insert a knife into an interface with sufficient precision, and the manufacturing method of an electronic device are provided.

Sectional drawing which shows the laminated board provided to the manufacturing process of the electronic device by one Embodiment of this invention Sectional drawing which shows the laminated body produced in the middle of the manufacturing process of the electronic device by one Embodiment of this invention FIG. 5 is a cross-sectional view showing a main part of a peeling apparatus according to an embodiment of the present invention, taken along the line III-III in FIG. The top view which shows the principal part of the peeling apparatus by one Embodiment of this invention. Sectional drawing which shows peeling operation of peeling apparatus (1) Sectional drawing which shows peeling operation of peeling apparatus (2) The figure which shows the state of the peeling apparatus at the time of the imaging by an imaging part (1) The figure which shows the image imaged by an imaging part (1) The figure which shows the state of the peeling apparatus at the time of the imaging by an imaging part (2) The figure which shows the image imaged by an imaging part (2) The figure which shows the state of the peeling apparatus at the time of the imaging by an imaging part (3) The figure which shows the state of the peeling apparatus at the time of the imaging by an imaging part (4) Sectional drawing which shows peeling operation | movement of the peeling apparatus performed from the state of FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted.

  The manufacturing method of the electronic device according to the present embodiment corresponds to the thinning of the substrate used in the electronic device, and therefore the step of forming the functional layer on the substrate reinforced with the reinforcing plate, the substrate on which the functional layer is formed, and the reinforcement And a step of peeling the plate. The reinforcing plate does not become part of the electronic device.

  Here, the electronic device refers to an electronic component such as a display panel, a solar battery, or a thin film secondary battery. The display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL panel (OLED).

(Laminated board)
FIG. 1 is a cross-sectional view showing a laminated plate used in an electronic device manufacturing process according to an embodiment of the present invention. The laminated plate 1 includes a substrate 2 and a reinforcing plate 3 that reinforces the substrate 2.

(substrate)
A predetermined functional layer (for example, a conductive layer) is formed on the substrate 2 during the manufacturing process of the electronic device.

  The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, a glass substrate is preferable because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. As the linear expansion coefficient decreases, the pattern of the functional layer formed at high temperatures is less likely to shift during cooling.

  The glass of the glass substrate is not particularly limited, and examples thereof include non-alkali glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly containing silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, glass suitable for the type of electronic device and its manufacturing process is preferably employed. For example, it is preferable that the glass substrate for liquid crystal panels consists of glass (an alkali free glass) which does not contain an alkali metal component substantially. As described above, the glass of the glass substrate is appropriately selected based on the type of electronic device to be applied and the manufacturing process thereof.

  The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.

  Examples of the crystalline resin include thermoplastic resins such as polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or syndiotactic polystyrene. Thermosetting resins include polyphenylene sulfide and polyether ether ketone. , Liquid crystal polymer, fluororesin, or polyether nitrile.

  Examples of non-crystalline resins include polycarbonate, modified polyphenylene ether, polycyclohexene, or polynorbornene-based resins that are thermoplastic resins. Examples of thermosetting resins include polysulfone, polyethersulfone, polyarylate, polyamideimide, Examples thereof include polyetherimide and thermoplastic polyimide.

  The resin for the resin substrate is particularly preferably an amorphous thermoplastic resin.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, it is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less for reducing the weight and thickness of the electronic device. In the case of 0.3 mm or less, it is possible to give good flexibility to the glass substrate. In the case of 0.1 mm or less, the glass substrate can be wound into a roll. Further, the thickness of the glass substrate is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate and easy handling of the glass substrate.

(Reinforcement plate)
When the reinforcing plate 3 is in close contact with the substrate 2, the reinforcing plate 3 reinforces the substrate 2 until a peeling operation is performed. The reinforcing plate 3 is peeled off from the substrate 2 during the manufacturing process of the electronic device after the functional layer is formed, and does not become a part of the electronic device.

  The reinforcing plate 3 preferably has a small absolute value of the difference in linear expansion coefficient from the substrate 2 in order to suppress warping and peeling due to temperature changes. When the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of this glass plate is preferably the same type as the glass of the glass substrate.

  The reinforcing plate 3 includes a support plate 4 and a resin layer 5 formed on the support plate 4. The resin layer 5 and the substrate 2 are detachably coupled to each other by van der Waals force acting between the resin layer 5 and the substrate 2.

  In addition, although the reinforcement board 3 of this embodiment is comprised with the support board 4 and the resin layer 5, you may be comprised only with the support board 4. FIG. The support plate 4 and the substrate 2 are detachably coupled to each other by van der Waals force acting between the support plate 4 and the substrate 2. An inorganic thin film may be formed on the surface of the support plate 4 so that the glass plate which is the support plate 4 and the glass substrate which is the substrate 2 are not bonded at a high temperature. In addition, a region having a different bonding force may be provided at the interface between the support plate 4 and the substrate 2 by providing a region having a different surface roughness on the surface of the support plate 4.

  Moreover, although the reinforcement board 3 of this embodiment is comprised with the support plate 4 and the resin layer 5, the support plate 4 may be plural. Similarly, a plurality of resin layers 5 may be provided.

(Support plate)
The support plate 4 supports and reinforces the substrate 2 through the resin layer 5. The support plate 4 prevents the substrate 2 from being deformed, scratched, damaged or the like in the manufacturing process of the electronic device.

  The support plate 4 is, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, or a metal plate. The type of the support plate 4 is selected according to the type of the electronic device, the type of the substrate 2 and the like. When the support plate 4 and the substrate 2 are of the same type, warpage and peeling due to temperature changes are reduced.

The difference (absolute value) in the average linear expansion coefficient between the support plate 4 and the substrate 2 is appropriately set according to the dimension shape and the like of the substrate 2, but is preferably, for example, 35 × 10 ⁻⁷ / ° C. or less. Here, the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R 3102) in a temperature range of 50 to 300 ° C.

  The thickness of the support plate 4 is 0.7 mm or less, for example. Further, the thickness of the support plate 4 is preferably 0.4 mm or more in order to reinforce the substrate 2. The support plate 4 may be thicker than the substrate 2 or thinner.

  The outer shape of the support plate 4 is preferably the same as or larger than the outer shape of the resin layer 5 as shown in FIG. 1 so that the support plate 4 can support the entire resin layer 5. .

(Resin layer)
When the resin layer 5 is in close contact with the substrate 2, it prevents the substrate 2 from being displaced until a peeling operation is performed. The resin layer 5 is easily peeled from the substrate 2 by a peeling operation. By easily peeling the substrate 2, it is possible to prevent the substrate 2 from being damaged and to prevent peeling at an unintended position (between the resin layer 5 and the support plate 4).

  The resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2. Thereby, when the peeling operation is performed, it is possible to prevent the laminated plate 1 from being peeled at an unintended position (between the resin layer 5 and the support plate 4).

  The resin of the resin layer 5 is not particularly limited. For example, the resin of the resin layer 5 includes acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, and the like. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 5 is not specifically limited, Preferably it is 1-50 micrometers, More preferably, it is 4-20 micrometers. By setting the thickness of the resin layer 5 to 1 μm or more, the resin layer 5 can be deformed so as to absorb the thickness of the bubbles and foreign matter when the bubbles and foreign matter are mixed between the resin layer 5 and the substrate 2. . On the other hand, when the thickness of the resin layer 5 is 50 μm or less, it is economical because the formation time of the resin layer 5 can be shortened and the resin of the resin layer 5 is not used more than necessary.

  The outer shape of the resin layer 5 is preferably the same as or larger than the outer shape of the substrate 2 as shown in FIG. 1 so that the resin layer 5 can adhere the entire substrate 2.

  In addition, the resin layer 5 may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the resin layers.

  Moreover, when the resin layer 5 consists of two or more layers, the kind of resin which forms each layer may differ.

(Laminate)
FIG. 2 is a cross-sectional view showing a laminated body produced during the manufacturing process of the electronic device according to the embodiment of the present invention.

  The laminate 6 is formed by forming a functional layer such as a conductive layer on the substrate 2 of the laminate 1. The type of functional layer is selected according to the type of electronic device. A plurality of functional layers may be sequentially stacked on the substrate 2. As a method for forming the functional layer, a general method is used. For example, a vapor deposition method such as a CVD method or a PVD method, a sputtering method, or the like is used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

  For example, the laminate 6 includes a reinforcing plate 3A, a substrate 2A, a liquid crystal layer 7, a substrate 2B, and a reinforcing plate 3B in this order. This laminate 6 is produced during the manufacturing process of the LCD. A thin film transistor (TFT) (not shown) is formed on the surface on the liquid crystal layer 7 side on one substrate 2A, and a color filter (CF) (not shown) is formed on the surface on the liquid crystal layer 7 side on the other substrate 2B. ing.

  After the reinforcing plates 3A and 3B are peeled off, a polarizing plate, a backlight and the like are attached to obtain a product LCD. A peeling device described later is used for peeling the reinforcing plates 3A and 3B.

  In this embodiment, the reinforcing plates 3A and 3B are peeled off after the liquid crystal layer 7 is formed, but may be formed after the TFT and CF are formed and before the liquid crystal layer 7 is formed.

(Peeling device)
3 is a cross-sectional view showing a main part of the peeling apparatus according to the embodiment of the present invention, and is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is a plan view showing a main part of the peeling apparatus according to one embodiment of the present invention. 5 and 6 are cross-sectional views showing the peeling operation of the peeling device. 5A shows a state in which a knife is inserted into the interface 8A between the substrate 2A and the reinforcing plate 3A, and FIG. 5B shows a state in which the substrate 2A and the reinforcing plate 3A are bent and deformed in directions opposite to each other. 6A shows a state in which a knife is inserted into the interface 8B between the substrate 2B and the reinforcing plate 3B, and FIG. 6B shows a state in which the substrate 2B and the reinforcing plate 3B are bent and deformed in directions opposite to each other.

  As shown in FIG. 5A, the peeling device 10 inserts a knife 20 into one end of an interface 8A between the substrate 2A and the lower surface (first main surface) 3Ab of the reinforcing plate 3A. Thereafter, as shown in FIG. 5B, the peeling apparatus 10 removes at least one of the substrate 2A and the reinforcing plate 3A (both in the drawing) so that the interface 8A is sequentially peeled from one end side to the other end side. Bend and deform.

  Further, as shown in FIG. 6A, the peeling device 10 inserts a knife 20 at one end of an interface 8B between the substrate 2B and the upper surface (first main surface) 3Ba of the reinforcing plate 3B. Thereafter, as shown in FIG. 6B, the peeling device 10 removes at least one of the substrate 2B and the reinforcing plate 3B (both in the drawing) so that the interface 8B is sequentially peeled from one end side to the other end side. Bend and deform.

  The peeling apparatus 10 may include a nozzle that ejects fluid (for example, compressed air) toward the insertion position of the knife 20 when the knife 20 is inserted into the interfaces 8A and 8B. The insertion position of the knife 20 may be a corner of the laminate 6 as shown in FIG.

  In this way, the peeling device 10 peels the reinforcing plates 3A and 3B from the laminate 6. In the present embodiment, the upper reinforcing plate 3A is peeled off from the laminate 6 and then the lower reinforcing plate 3B is peeled. However, after the lower reinforcing plate 3B is peeled off, the upper reinforcing plate 3A is peeled off. Also good. Hereinafter, each structure of the peeling apparatus 10 is demonstrated.

  As shown in FIG. 3, the peeling apparatus 10 can support a flexible plate 11B that supports the lower surface (first main surface) 6b of the multilayer body 6 and an upper surface (second main surface) 6a of the multilayer body 6. A flexible plate 11A, a plurality of movable bodies 12A and 12B fixed on the flexible plates 11A and 11B, and a knife 20 are provided.

  The flexible plates 11A and 11B vacuum-suck the stacked body 6. Instead of vacuum suction, electrostatic suction or magnetic suction may be used. A plurality of movable bodies 12A and 12B are fixed on the flexible plates 11A and 11B.

  The plurality of movable bodies 12A and 12B are two-dimensionally arranged at intervals as shown in FIG. 4 and configured to be movable with respect to the frame Fr. The plurality of movable bodies 12A and 12B are driven by a motor or the like. By moving the plurality of movable bodies 12A and 12B in a predetermined order, the flexible plates 11A and 11B are bent and deformed.

  The knife 20 has a thickness of, for example, 50 to 600 μm so as to be elastically deformed when inserted into the interfaces 8A and 8B between the substrates 2A and 2B and the reinforcing plates 3A and 3B. The cutting edge 20a of the knife 20 is arranged in parallel to the interfaces 8A and 8B, for example, horizontally.

  Since the peeling apparatus 10 moves the knife 20 relative to the laminated body 6 supported by the flexible plates 11A and 11B, as shown in FIG. 3, the knife moving unit 30 and the laminated body moving unit 40 are used. And further comprising.

  The knife moving unit 30 includes a horizontal drive motor 31 that moves the knife 20 in the horizontal direction with respect to the frame Fr, and a vertical drive motor 32 that moves the knife 20 in the vertical direction with respect to the frame Fr.

  The horizontal drive motor 31 may be a servo motor, and includes a motor body 31a that can rotate forward and backward, an encoder 31b that detects a rotation amount and a rotation direction of the motor body 31a, and the like. The motor main body 31a is connected to the horizontal movable body 34 via a ball screw 33 that converts the rotational motion of the motor main body 31a into a linear motion. When the motor main body 31a rotates, the horizontal movable body 34 moves in the horizontal direction. The motor main body 31a is feedback-controlled based on the detection result of the encoder 31b so that the position of the horizontal movable body 34 becomes the target position.

  The vertical drive motor 32 is supported by a motor support member 35 fixed to the horizontal movable body 34. The vertical drive motor 32 may be a servo motor, and includes a motor main body portion 32a that can rotate forward and backward, an encoder portion 32b that detects a rotation amount and a rotation direction of the motor main body portion 32a, and the like. The motor body 32a is connected to the vertical movable body 37 via a ball screw 36 that converts the rotational motion of the motor body 32a into a linear motion. When the motor main body 32a rotates, the vertical movable body 37 moves in the vertical direction. The motor main body 32a is feedback-controlled based on the detection result of the encoder 32b so that the position of the vertical movable body 37 becomes the target position.

  The vertical movable body 37 supports a knife support member 38. The knife support member 38 is a member that supports the knife 20 and is fastened to the vertical movable body 37 with a bolt or the like.

  The laminated body moving unit 40 includes a laminated body motor 41 that moves the laminated body 6 supported by the flexible plates 11A and 11B in the vertical direction with respect to the frame Fr. The laminated body motor 41 may be a servo motor, and includes a motor main body portion 41a that can rotate forward and reverse, an encoder portion 41b that detects the amount and direction of rotation of the motor main body portion 41a, and the like. The motor main body 41a is connected to the flexible plate 11B via a ball screw 42 that converts the rotational motion of the motor main body 41a into a linear motion and the movable body 12B. When the motor body 41a rotates, the laminate 6 supported by the flexible plates 11A and 11B moves in the vertical direction. The motor body 41a is feedback-controlled based on the detection result of the encoder 41b so that the position of the stacked body 6 becomes the target position.

  The knife moving unit 30 and the laminate moving unit 40 constitute an adjusting unit that adjusts the insertion position of the knife 20. Before the insertion of the knife 20, the adjustment unit is configured to provide the intervals WA and WB (FIGS. 3 and 9) between the blade edge 20a of the knife 20 and the interfaces 8A and 8B in a direction perpendicular to the interfaces 8A and 8B (for example, the vertical direction). (Refer to (b)). The interface 8A is a boundary surface between the substrate 2A and the lower surface (first main surface) 3Ab of the reinforcing plate 3A. The interface 8B is a boundary surface between the substrate 2B and the upper surface (first main surface) 3Ba of the reinforcing plate 3B.

  As shown in FIG. 3, the distance WA between the blade edge 20a of the knife 20 and the interface 8A is a relative position (distance LA and vertical relationship) of the upper surface (second main surface) 3Aa of the reinforcing plate 3A with respect to the blade edge 20a of the knife 20. And the thickness DA of the reinforcing plate 3A. Similarly, as shown in FIG. 9B, the interval WB between the blade edge 20a of the knife 20 and the interface 8B is a relative position (distance) of the lower surface (second main surface) 3Bb of the reinforcing plate 3B with respect to the blade edge 20a of the knife 20. LB and vertical relationship) and the thickness DB of the reinforcing plate 3B.

  The peeling device 10 detects the relative positions (distance LA, distance LB, etc.) of the second main surfaces 3Aa and 3Bb of the reinforcing plates 3A and 3B with respect to the cutting edge 20a of the knife 20, so that the imaging unit 51, the image processing unit 52, The light source 53 for knives and the light source 54 for flexible plates are further provided.

  The imaging unit 51 includes a camera such as a CCD camera or a CMOS camera. The imaging unit 51 is fixed with respect to the frame Fr. The imaging unit 51 images the position of the cutting edge 20a of the knife 20 and the positions of the second main surfaces 3Aa and 3Bb of the reinforcing plates 3A and 3B, and supplies the captured image data to the image processing unit 52. The imaging unit 51 may separately capture the position of the cutting edge 20a of the knife 20 and the positions of the second main surfaces 3Aa and 3Bb of the reinforcing plates 3A and 3B. The accuracy of position detection by image processing is improved.

  The image processing unit 52 is configured by a computer including a CPU, a storage medium such as a ROM and a RAM, and the like. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, the relative position of the cutting edge 20 a of the knife 20 with respect to the imaging unit 51, and the second main surfaces 3 </ b> Aa and 3 </ b> Bb of the reinforcing plates 3 </ b> A and 3 </ b> B with respect to the imaging unit 51. The relative position of is detected. Examples of the image processing method include a method using a differential filter. In the method using the differential filter, a position where the luminance (brightness) of the pixel changes abruptly is detected, the position of the blade 20a of the knife 20 in the image, and the second main surface 3Aa of the reinforcing plates 3A and 3B in the image. 3Bb position is detected. The image processing unit 52 supplies the image processing result to the control unit 80.

  The knife light source 53 irradiates light toward the cutting edge 20 a of the knife 20 when the imaging unit 51 images the position of the cutting edge 20 a of the knife 20. At this time, as shown in FIG. 4, the cutting edge 20 a of the knife 20 may be disposed between the imaging unit 51 and the knife light source 53.

  The flexible plate light source 54 emits light toward the flexible plates 11A and 11B when the imaging unit 51 images the positions of the second main surfaces 3Aa and 3Bb of the reinforcing plates 3A and 3B. Light from the light source 54 for the flexible plate is reflected by a half mirror 55 provided in the middle of the optical axis of the camera that is the imaging unit 51, and illuminates the flexible plates 11A and 11B coaxially with the optical axis of the camera. .

  Note that the illumination method of the flexible plate light source 54 of the present embodiment is coaxial illumination, but light from the flexible plate light source 54 is reflected by the flexible plates 11A and 11B and enters the imaging unit 51. It can be as diverse as you can. For example, ring illumination arranged so as to surround the optical axis of the camera, external illumination provided separately from the camera, or the like may be used.

  The peeling apparatus 10 further includes plate thickness detection units 60A and 60B (see FIG. 3) that detect the plate thickness DA and DB (see FIGS. 3 and 9B) of the reinforcing plates 3A and 3B. The plate thickness detectors 60A and 60B detect the plate thickness DA and DB of the reinforcing plates 3A and 3B having translucency by, for example, spectral interference.

  The plate thickness detector 60A irradiates the inspection light from the light source toward the upper surface 6a of the laminated body 6 (that is, the upper surface 3Aa of the upper reinforcing plate 3A) and separates the interference light reflected by the laminated body 6 with a spectrometer. The dispersed light is received by a light receiver, and the received light waveform is analyzed to calculate the thickness DA of the upper reinforcing plate 3A. The inspection light has a wavelength with a predetermined width, and in the analysis of the received light waveform, the change in intensity with respect to the wavelength is analyzed. The upper flexible plate 11A is formed with a through hole 14A that allows inspection light and interference light to pass therethrough.

  Similarly, the plate thickness detector 60B irradiates the inspection light from the light source toward the lower surface 6b of the laminated body 6 (that is, the lower surface 3Bb of the lower reinforcing plate 3B), and spectrally separates the interference light reflected by the laminated body 6. Spectroscopically, the dispersed light is received by a light receiver, and the received light waveform is analyzed to calculate the thickness DB of the lower reinforcing plate 3B. The inspection light has a wavelength with a predetermined width, and in the analysis of the received light waveform, the change in intensity with respect to the wavelength is analyzed. The lower flexible plate 11B is formed with a through hole 14B through which inspection light and interference light pass.

  The spectral interference method is used when the refractive indexes of the resin layers 5A and 5B included in the reinforcing plates 3A and 3B are different from the refractive indexes of the substrates 2A and 2B. When the reinforcing plates 3A and 3B are configured only by the support plates 4A and 4B (see FIG. 2), when the difference between the refractive indexes of the support plates 4A and 4B and the refractive indexes of the substrates 2A and 2B is different, Spectral interferometry is used. In the spectroscopic interferometry, it is sufficient that the refractive index changes at the interfaces 8A and 8B between the substrates 2A and 2B and the reinforcing plates 3A and 3B.

  Note that a triangulation method may be used instead of the spectral interferometry. In the triangulation method, the plate thicknesses DA and DB of the reinforcing plates 3A and 3B are detected using inspection light having a predetermined wavelength. Triangulation is inexpensive because it does not require a spectrometer. On the other hand, spectral interferometry has good plate thickness detection accuracy.

  The peeling apparatus 10 includes a control unit 80 that controls various operations of the peeling apparatus 10. The control unit 80 is configured by a computer including a CPU, a storage medium such as a ROM and a RAM, and the like. Various operations of the peeling apparatus 10 are controlled by causing the CPU to execute a program recorded on the recording medium. The control unit 80 includes a calculation unit 81, an imaging processing unit 82, a monitoring unit 83, and an adjustment processing unit 84.

  The calculation unit 81, the imaging processing unit 82, the monitoring unit 83, the imaging unit 51, the image processing unit 52, and the like constitute a position detection unit. As will be described in detail later, the position detection unit is a relative position of the second main surfaces 3Aa and 3Bb of the reinforcing plates 3A and 3B with respect to the cutting edge 20a of the knife 20 in a direction perpendicular to the interfaces 8A and 8B (for example, a vertical direction). (Distance LA, LB, etc.) is detected.

  Next, operation | movement of the peeling apparatus 10 of the said structure is demonstrated. Various operations of the peeling device 10 are performed under the control of the control device 70.

  The laminate 6 is placed horizontally on the flexible plate 11B. When the flexible plate 11B vacuum-sucks the lower surface 6b of the stacked body 6, the flexible plate 11A is pressed against the upper surface 6a of the stacked body 6 and vacuum-sucks the upper surface 6a of the stacked body 6. At this time, the flexible plates 11A and 11B have a flat plate shape, and the plate thickness detectors 60A and 60B detect the plate thickness DA and DB of the reinforcing plates 3A and 3B. The plate thickness detection units 60A and 60B supply detection results to the adjustment processing unit 84.

  Next, the imaging processing unit 82 moves the stacked body 6 and the knife 20 relative to the imaging unit 51 by the knife moving unit 30 and the stacked body moving unit 40, and the imaging unit 51 moves the position of the blade edge 20 a of the knife 20. And the position of the upper surface 3Aa of the upper reinforcing plate 3A are imaged separately.

  FIG. 7 is a diagram illustrating a state of the peeling device during imaging by the imaging unit. FIG. 7A shows the state of the peeling device at the time of imaging the cutting edge position of the knife 20, and FIG. 7B shows the state of the peeling device at the time of imaging the upper surface position of the upper reinforcing plate 3A. FIG. 8 is a diagram illustrating an image captured by the imaging unit. FIG. 8A schematically shows an image obtained by imaging the blade tip position of the knife 20, and FIG. 8B schematically shows an image obtained by imaging the upper surface position of the upper reinforcing plate 3A. In FIG. 8, the low luminance portion of the pixel is indicated by hatching.

  For example, the imaging processing unit 82 images the position of the blade edge 20a of the knife 20 by the imaging unit 51, as shown in FIG. The blade edge 20a of the knife 20 is disposed between the knife light source 53 that irradiates light toward the blade edge 20a and the imaging unit 51. Therefore, as shown in FIG. 8A, the image around the knife 20 becomes brighter than the image 20P of the knife 20, so that the image 20aP showing the position of the blade edge 20a of the knife 20 becomes clear. The image captured by the image capturing unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the cutting edge 20 a of the knife 20 with respect to the imaging unit 51. The image processing unit 52 supplies the image processing result to the calculation unit 81.

  Next, as illustrated in FIG. 7B, the imaging processing unit 82 lowers the knife 20 with respect to the imaging unit 51 to the standby position by the knife moving unit 30. During this time, the monitoring unit 83 monitors a change in the relative position of the knife 20 with respect to the imaging unit 51. The change in the relative position includes the moving direction of the knife 20 in addition to the moving distance MA of the knife 20 (see FIG. 7B). The monitoring unit 83 performs monitoring using the encoder unit 32b of the vertical drive motor 32, for example. The monitoring unit 83 supplies the monitoring result to the calculation unit 81. Further, the imaging processing unit 82 raises the stacked body 6 to the predetermined position with respect to the imaging unit 51 by the stacked body moving unit 40.

  Thereafter, the imaging processing unit 82 images the position of the upper surface 3Aa of the upper reinforcing plate 3A by the imaging unit 51. At this time, the end of the upper flexible plate 11 </ b> A is a portion 15 </ b> A imaged by the imaging unit 51, and reflects light from the flexible plate light source 54 toward the imaging unit 51. Therefore, as shown in FIG. 8B, the image 11AP of the flexible plate 11A becomes brighter than the image 3AP of the reinforcing plate 3A, so that an image 3AaP indicating the position of the upper surface 3Aa of the reinforcing plate 3A becomes clear. The portion 15A may be formed of a reflective film (for example, a white paint film) in order to increase the light reflectance. The image 15AP of the portion 15A becomes brighter. The image captured by the image capturing unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51 and detects the relative position of the upper surface 3Aa of the reinforcing plate 3A with respect to the imaging unit 51. The image processing unit 52 supplies the image processing result to the calculation unit 81.

  Based on the result of the image processing by the image processing unit 52, the calculation unit 81 in the vertical direction between the cutting edge 20a of the knife 20 shown in FIG. 7A and the upper surface 3Aa of the reinforcing plate 3A shown in FIG. 7B. The relative position is calculated. The relative position includes a vertical relationship in addition to the distance GA (see FIG. 7B). The distance GA is calculated from the product of the distance GAP (see FIG. 8B) in the image and the proportionality constant. The proportionality constant is determined in advance by a test or the like and is stored in the storage medium of the control unit 80.

  Based on the calculation result based on the result of the image processing by the image processing unit 52 and the monitoring result of the monitoring unit 83, the calculating unit 81 is perpendicular to the cutting edge 20a of the knife 20 and the upper surface 3Aa of the upper reinforcing plate 3A. The relative position at is calculated. The relative position includes a vertical relationship in addition to the distance LA (see FIG. 7B). For example, in FIG. 7B, the cutting edge 20a of the knife 20 is positioned below the upper surface 3Aa of the reinforcing plate 3A. The distance between the upper surface 3Aa and the lower surface 3Ab of the reinforcing plate 3A is equal to the plate thickness DA of the reinforcing plate 3A.

  Based on the calculation result of the calculation unit 81 and the detection result of the plate thickness detection unit 60A, the adjustment processing unit 84 determines the vertical interval WA between the blade edge 20a of the knife 20 and the interface 8A (FIG. 7B). )) Is calculated. Next, the adjustment processing unit 84 operates an adjustment unit (for example, the knife moving unit 30) that adjusts the interval WA, and adjusts the interval WA to substantially 0 (zero).

  Thereafter, the control unit 80 moves the knife 20 horizontally by the knife moving unit 30 and inserts it into one end of the interface 8A between the substrate 2A and the reinforcing plate 3A as shown in FIG. As a result, a separation starting point is formed at the interface 8A.

  Thus, in this embodiment, the vertical interval WA between the cutting edge 20a of the knife 20 and the interface 8A is such that the relative position of the upper surface 3Aa of the reinforcing plate 3A with respect to the cutting edge 20a of the knife 20 (distance LA and upper and lower Relationship) and the thickness DA of the reinforcing plate 3A. Therefore, when it is difficult to directly detect the position of the interface 8A, the position of the interface 8A can be detected with high accuracy, and the knife 20 can be inserted into the interface 8A with high accuracy.

  Thereafter, as shown in FIG. 5B, the control unit 80 removes the plurality of movable bodies 12A and 12B so that the interface 8A between the substrate 2A and the reinforcing plate 3A is sequentially peeled from one end side to the other end side. The flexible plates 11A and 11B are bent and deformed in a predetermined order with respect to the frame Fr.

  After the separation of the substrate 2A and the reinforcing plate 3A is completed, the control unit 80 releases the vacuum suction by the flexible plate 11A. Thereafter, the reinforcing plate 3A is removed from the flexible plate 11A. Subsequently, the flexible plate 11A is pressed against the substrate 2A and sucks the upper surface of the substrate 2A. At this time, the flexible plates 11A and 11B are flat.

  Next, the imaging processing unit 82 moves the reinforcing plate 3B and the knife 20 relative to the imaging unit 51 by the knife moving unit 30 and the stacked body moving unit 40, and the imaging unit 51 moves the blade tip 20 a of the knife 20. The position and the position of the lower surface 3Bb of the lower reinforcing plate 3B are imaged separately.

  FIG. 9 is a diagram illustrating a state of the peeling device during imaging by the imaging unit. FIG. 9A shows the state of the peeling device at the time of imaging the cutting edge position of the knife 20, and FIG. 9B shows the state of the peeling device at the time of imaging the lower surface position of the lower reinforcing plate 3B. FIG. 10 is a diagram illustrating an image captured by the imaging unit. FIG. 10A schematically shows an image obtained by imaging the blade edge position of the knife 20, and FIG. 10B schematically shows an image obtained by imaging the lower surface position of the lower reinforcing plate 3B. In FIG. 10, the low luminance portion of the pixel is indicated by hatching.

  For example, as illustrated in FIG. 9A, the imaging processing unit 82 images the position of the cutting edge 20 a of the knife 20 using the imaging unit 51. The blade edge 20a of the knife 20 is disposed between the knife light source 53 that irradiates light toward the blade edge 20a and the imaging unit 51. Therefore, as shown in FIG. 9A, the image around the knife 20 becomes brighter than the image 20P of the knife 20, so that an image 20aP showing the position of the blade edge 20a of the knife 20 becomes clear. The portion 15B may be formed of a reflective film (for example, a white paint film) in order to increase the light reflectance. The image 15BP of the part 15B becomes brighter. The image captured by the image capturing unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the cutting edge 20 a of the knife 20 with respect to the imaging unit 51. The image processing unit 52 supplies the image processing result to the calculation unit 81.

  Next, as illustrated in FIG. 9B, the imaging processing unit 82 lowers the knife 20 with respect to the imaging unit 51 to the standby position by the knife moving unit 30. During this time, the monitoring unit 83 monitors a change in the relative position of the knife 20 with respect to the imaging unit 51. The change in the relative position includes the movement direction of the knife 20 in addition to the movement distance MB of the knife 20 (see FIG. 9B). The monitoring unit 83 performs monitoring using the encoder unit 32b of the vertical drive motor 32, for example. The monitoring unit 83 supplies the monitoring result to the calculation unit 81. Further, the imaging processing unit 82 raises the reinforcing plate 3 </ b> B to the predetermined position with respect to the imaging unit 51 by the stacked body moving unit 40.

  Thereafter, the imaging processing unit 82 images the position of the lower surface 3Bb of the lower reinforcing plate 3B by the imaging unit 51. At this time, the end of the lower flexible plate 11 </ b> B is a portion 15 </ b> B imaged by the imaging unit 51, and reflects light from the flexible plate light source 54 toward the imaging unit 51. Therefore, as shown in FIG. 10B, the image 11BP of the flexible plate 11B becomes brighter than the image 3BP of the reinforcing plate 3B, so that the image 3BbP indicating the position of the lower surface 3Bb of the reinforcing plate 3B becomes clear. The image captured by the image capturing unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51 and detects the relative position of the lower surface 3Bb of the reinforcing plate 3B with respect to the imaging unit 51. The image processing unit 52 supplies the image processing result to the calculation unit 81.

  Based on the result of the image processing by the image processing unit 52, the calculation unit 81 in the vertical direction between the cutting edge 20a of the knife 20 shown in FIG. 9A and the lower surface 3Bb of the reinforcing plate 3B shown in FIG. 9B. The relative position is calculated. The relative position includes a vertical relation in addition to the distance GB (see FIG. 9B). The distance GB is calculated from the product of the distance GBP in the image (see FIG. 10B) and the proportionality constant. The proportionality constant is determined in advance by a test or the like and is stored in the storage medium of the control unit 80.

  Based on the calculation result based on the result of the image processing by the image processing unit 52 and the monitoring result of the monitoring unit 83, the calculating unit 81 makes a vertical contact between the cutting edge 20a of the knife 20 and the lower surface 3Bb of the lower reinforcing plate 3B. Calculate the relative position in the direction. The relative position includes a vertical relationship in addition to the distance LB (see FIG. 9B). For example, in FIG.9 (b), the blade edge | tip 20a of the knife 20 is located below the lower surface 3Bb of the reinforcement board 3B. The distance between the lower surface 3Bb and the upper surface 3Ba of the reinforcing plate 3B is equal to the plate thickness DB of the reinforcing plate 3B.

  Based on the calculation result of the calculation unit 81 and the detection result of the plate thickness detection unit 60B, the adjustment processing unit 84 determines the vertical interval WB between the cutting edge 20a of the knife 20 and the interface 8B (FIG. 9B). )) Is calculated. Next, the adjustment processing unit 84 operates an adjustment unit (for example, the knife moving unit 30) that adjusts the interval WB, and adjusts the interval WB to approximately 0 (zero).

  Thereafter, the control unit 80 moves the knife 20 horizontally by the knife moving unit 30 and inserts the knife 20 into one end of the interface 8B between the substrate 2B and the reinforcing plate 3B as shown in FIG. As a result, a separation starting point is formed at the interface 8B.

  Thus, in the present embodiment, the vertical interval WB between the cutting edge 20a of the knife 20 and the interface 8B is the relative position (distance LB and upper limit) of the lower surface 3Bb of the reinforcing plate 3B with respect to the cutting edge 20a of the knife 20. Relationship) and the thickness DB of the reinforcing plate 3B. Therefore, when it is difficult to directly detect the position of the interface 8B, the position of the interface 8B can be detected with high accuracy, and the knife 20 can be inserted into the interface 8B with high accuracy.

  Thereafter, as shown in FIG. 6B, the control unit 80 removes the movable bodies 12A and 12B so that the interface 8B between the substrate 2B and the reinforcing plate 3B is sequentially peeled from one end side to the other end side. The flexible plates 11A and 11B are bent and deformed in a predetermined order with respect to the frame Fr.

  After the separation of the substrate 2B and the reinforcing plate 3B is completed, the control unit 80 releases the vacuum suction by the flexible plates 11A and 11B. Thereafter, the reinforcing plate 3B is removed from the flexible plate 11B, and the substrate 2A is removed from the flexible plate 11A.

  In this way, after the reinforcing plates 3A and 3B are peeled from the laminate 6, a backlight or the like is incorporated, and an LCD as a product is obtained.

  In addition, although the peeling apparatus 10 of this embodiment is used in the manufacturing process of LCD, this invention is not limited to this, It can be used in the manufacturing process of another electronic device.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. Various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

  For example, in the peeling apparatus 10 of the above embodiment, the interfaces 8A and 8B are arranged horizontally before the knife 20 is inserted, but the interfaces 8A and 8B may be arranged vertically, or the interfaces 8A and 8B You may incline with respect to a horizontal surface.

  Moreover, in the said embodiment, in order to detect accurately the position of 2nd main surface 3Aa, 3Bb of reinforcement board 3A, 3B, the part imaged by the imaging part 51 among the edge parts of flexible board 12A, 12B. Although a light reflection film (for example, a white paint film) is formed on 15A, a light absorption film (for example, a black paint film) may be formed. The light reflecting film and the light absorbing film are properly used according to the state of the side surfaces of the reinforcing plates 3A and 3B. For example, as shown in FIG. 11, when the corner of the side surface of the reinforcing plate 3B is chamfered, the light incident on the side surface of the reinforcing plate 3B is not reflected toward the imaging unit 51 and is imaged by the imaging unit 51. Since the image of the reinforcing plate 3B becomes dark, the light reflecting film is used so that the image of the flexible plate 11B becomes bright. Examples of the case where the image of the reinforcing plate 3B becomes dark include the case where the corners of the side surface of the reinforcing plate 3B are chamfered and the case where the side surface of the reinforcing plate 3B has scratches and light is scattered. On the other hand, when the side surface of the reinforcing plate 3B is a flat surface and is not chamfered, the light incident on the side surface of the reinforcing plate 3B is reflected toward the imaging unit 51 and is captured by the imaging unit 51. Since the image becomes bright, the light absorbing film is used so that the image on the flexible plate 11B becomes dark.

  In the above embodiment, when the position of the second main surface 3Aa of the reinforcing plate 3A is detected, the flexible plate 11A is placed on the second main surface 3Aa of the reinforcing plate 3A. It does not have to be placed as shown. In this case, a part of the second main surface 3Aa of the reinforcing plate 3A is arranged between the light source 53 for the knife that irradiates light toward the reinforcing plate 3A and the imaging unit 51. Therefore, since the image around the reinforcing plate 3A becomes brighter than the image of the reinforcing plate 3A, the position of the second main surface 3Aa of the reinforcing plate 3A becomes clear. In this case, as shown in FIG. 13, before placing the flexible plate 11A on the second main surface 3Aa of the reinforcing plate 3A, the knife 20 is placed between the reinforcing plate 3A and the interface 8A between the substrate 2A. May be inserted. Thereafter, with the knife 20 still inserted, the flexible plate 11A is lowered, and the second main surface 3Aa of the reinforcing plate 3A is adsorbed by the flexible plate 11A as shown in FIG. Next, as shown in FIG. 5B, at least one of the substrate 2A and the reinforcing plate 3A (both in the drawing) is bent and deformed so that the interface 8A is sequentially peeled from one end side toward the other end side.

  Moreover, although the peeling apparatus 10 of the said embodiment used the imaging part 51 in order to detect the position of 2nd main surface 3Aa, 3Bb of reinforcement board 3A, 3B, for example, non-contact-type positions, such as a laser displacement meter A contact-type position sensor such as a sensor or a dial gauge, or the encoder 41b of the laminated body motor 41 may be used.

  In the peeling device 10 of the above embodiment, the monitoring unit 83 monitors the change in the relative position of the knife 20 with respect to the imaging unit 51 between the imaging of the knife and the imaging of the reinforcing plate, but the change in the relative position is a stopper. For example, the monitoring unit 83 does not have to perform monitoring.

  Further, the imaging processing unit 82 of the above embodiment images the position of the upper surface 3Aa of the reinforcing plate 3A after imaging the position of the cutting edge 20a of the knife 20 by the imaging unit 51, but the imaging order is not limited. For example, the imaging processing unit 82 may image the position of the cutting edge 20a of the knife 20 after imaging the position of the upper surface 3Aa of the reinforcing plate 3A. In this case, the monitoring unit 83 uses the reinforcing plate 3A for the imaging unit 51. Monitor relative position changes. The monitoring unit 83 performs monitoring using, for example, the encoder unit 41b of the laminated body motor 41. Further, the imaging processing unit 82 may capture both positions at the same time. In this case, the position detection unit includes a calculation unit 81, an imaging unit 51, and an image processing unit 52.

  In the peeling device 10 of the above embodiment, the plate thickness detectors 60A and 60B detect the plate thickness of the reinforcing plates 3A and 3B, and then the position detector detects the second plate of the reinforcing plates 3A and 3B with respect to the blade edge 20a of the knife 20. The relative positions of the main surfaces 3Aa and 3Bb are detected, but the order may be reversed or simultaneous.

  Moreover, although the peeling apparatus 10 of the said embodiment is provided with the computer as the image processing part 52 separately from the computer as the control part 80, the control part 80 may fulfill | perform the function of the image processing part 52.

  In the peeling device 10 of the above embodiment, when peeling the interfaces 8A and 8B from one end side to the other end side, both the flexible plates 11A and 11B are bent and deformed, but only one of them is bent. It may be deformed. In this case, a rigid plate that is difficult to bend and deform may be used instead of the other flexible plate.

  Moreover, although the peeling apparatus 10 of the said embodiment is an apparatus which peels both interface 8A, 8B, the apparatus which peels only any one (for example, only interface 8A) may be sufficient.

2A, 2B Substrate 3A, 3B Reinforcing plate 3Ab, 3Ba First main surface 3Aa, 3Bb Second main surface 7 Liquid crystal layer (functional layer)
8A, 8B Interface 10 Peeling device 11A, 11B Flexible plate (support)
12A, 12A Movable body 20 Knife 20a Cutting edge 30 Knife moving part 40 Laminate moving part 51 Imaging part 52 Image processing part 53 Light source for knife 54 Light source for flexible plate (light source for support)
60A, 60B Plate thickness detection unit 80 Control unit 81 Calculation unit 82 Imaging processing unit 83 Monitoring unit 84 Adjustment processing unit

Claims (8)

In the peeling device for peeling the substrate and the reinforcing plate attached to the substrate,
A knife inserted into an interface between the substrate and the first main surface of the reinforcing plate;
An adjustment unit that adjusts the distance between the blade edge of the knife and the interface in a direction perpendicular to the interface before insertion of the knife;
A position detection unit for detecting a relative position between a blade edge of the knife and a second main surface opposite to the first main surface of the reinforcing plate in a direction perpendicular to the interface;
A plate thickness detector for detecting the plate thickness of the reinforcing plate;
An adjustment processing unit for operating the adjustment unit based on the detection result of the position detection unit and the detection result of the plate thickness detection unit ;
The position detection unit includes an imaging unit that captures the position of the blade edge of the knife and the position of the second main surface of the reinforcing plate, an image processing unit that performs image processing on an image captured by the imaging unit, A calculation unit that calculates the relative position based on an image processing result of the image processing unit,
The reinforcing plate has translucency,
The said plate | board thickness detection part is a peeling apparatus which detects the plate | board thickness of the said reinforcement board by spectral interference method . The position detection unit moves the knife and the reinforcing plate relative to the imaging unit by the adjusting unit, and the imaging unit positions the blade edge of the knife and the second main surface of the reinforcing plate. The peeling apparatus according to claim 1 , further comprising an imaging processing unit that separately images the position of the image. The position detection unit is configured to change a relative position of the knife with respect to the imaging unit between imaging of the position of the blade edge of the knife and imaging of the position of the second main surface of the reinforcing plate, and / or A monitoring unit that monitors a change in the relative position of the reinforcing plate with respect to the imaging unit;
The said calculation part calculates the said relative position of the blade edge | tip of the said knife and the said 2nd main surface of the said reinforcement board based on the monitoring result of the said monitoring part, and the image processing result of the said image processing part. 2. The peeling apparatus according to 2 . A light source for a knife that emits light toward the blade edge of the knife when imaging the position of the blade edge of the knife;
When the imaging position of the cutting edge of the knife, the cutting edge of the knife, peeling apparatus according to claim 2 or 3 is disposed between the imaging unit and the light source for the knife. In a method for manufacturing an electronic device, comprising a step of forming a functional layer on a substrate reinforced with a reinforcing plate, and a step of separating the reinforcing plate and the substrate on which the functional layer is formed.
An adjustment step of adjusting a distance between the blade edge of the knife and the interface in a direction perpendicular to the interface before inserting the knife into the interface between the substrate and the first main surface of the reinforcing plate; ,
The adjustment process includes:
A position detection step of detecting a relative position between the blade edge of the knife and the second main surface opposite to the first main surface of the reinforcing plate in a direction perpendicular to the interface;
A plate thickness detecting step for detecting the plate thickness of the reinforcing plate;
E Bei an adjustment process of adjusting the interval based on the thickness of said detected relative position by the position detection step, and detected by the thickness detection step the reinforcing plate,
In the position detection step, image processing is performed on an image captured by an imaging unit that captures the position of the blade edge of the knife and the position of the second main surface of the reinforcing plate, and the relative position is calculated.
The reinforcing plate has translucency,
In the plate thickness detection step, the plate thickness is detected by spectral interference method. In the position detecting step, the knife and the reinforcing plate are moved relative to the imaging unit, and the position of the blade edge of the knife and the position of the second main surface of the reinforcing plate are determined by the imaging unit. The method for manufacturing an electronic device according to claim 5 , wherein images are separately taken. In the position detection step, a change in the relative position of the knife with respect to the imaging unit between the time of imaging of the position of the blade edge of the knife and the time of imaging of the position of the second main surface of the reinforcing plate, and / or and changes in the relative positions of the reinforcing plate relative to the imaging unit, based on the result of image processing, according to claim 6 for calculating the relative position between the cutting edge and the second major surface of the reinforcing plate of the knife Electronic device manufacturing method. The electron of Claim 6 or 7 arrange | positioned between the light source for knives which irradiates light toward the blade edge | tip of the said knife, and the said imaging part at the time of imaging of the position of the blade edge | tip of the said knife. Device manufacturing method.

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