TWI566306B - A peeling device and a method for manufacturing the electronic component - Google Patents

Description

Stripping device and method of manufacturing electronic component

The present invention relates to a peeling device for peeling a substrate from a reinforcing plate and a method of manufacturing the electronic component.

In order to reduce the thickness and weight of electronic components such as display panels, solar cells, and thin film secondary batteries, it is desirable to use a thin plate for electronic substrates. When the substrate is thinned, the handleability of the substrate is deteriorated, so that it is difficult to form a functional layer (for example, a thin film transistor or a color filter) for an electronic component on the substrate.

Therefore, there has been proposed a method of separating a substrate from a reinforcing plate after forming a functional layer on a substrate reinforced with a reinforcing plate (see, for example, Patent Document 1). The peeling of the substrate and the reinforcing plate is performed by inserting the blade into one end of the interface between the main surface of the substrate and the main surface of the reinforcing plate, and sequentially peeling the interface from the one end side to the other end side to at least one of the substrate and the reinforcing plate. One is bent and deformed.

Since the beginning, the camera has been used to adjust the insertion position of the blade. The camera simultaneously captures the position of the blade tip and the position of the interface, and supplies the captured image data to the image processing section. The image processing unit performs image processing on the image data supplied from the camera, and detects the relative position of the blade edge and the interface.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2010/090147

However, there are cases where it is difficult to directly detect the position of the interface. For example, the position of the interface such as the end surface of the substrate and the end surface of the reinforcing plate when the functional layer is formed, or the case where the resin layer included in the reinforcing plate is exposed on the end surface of the substrate may be unclear. Further, when there is a crack in the end surface of the substrate or the end surface of the reinforcing plate, the position of the interface is mistaken and detected. Therefore, there is a case where the accuracy of the insertion position of the blade is deteriorated.

The present invention has been made in view of the above problems, and an object thereof is to provide a peeling device and a method of manufacturing an electronic component which can insert a blade into an interface with high precision.

In order to solve the above problems, a peeling apparatus according to an aspect of the present invention is characterized in that a substrate is peeled off from a reinforcing plate attached to the substrate, and includes a blade inserted into an interface between the substrate and a first main surface of the reinforcing plate. And an adjustment portion that adjusts a distance between a blade edge of the blade and a direction perpendicular to the interface before the insertion of the blade; and a position detecting unit that detects the direction perpendicular to the interface a position of a blade edge of the blade and a second main surface of the reinforcing plate opposite to the first main surface; a plate thickness detecting portion detecting a thickness of the reinforcing plate; and an adjustment processing portion based on the position The detection result of the detection unit and the detection result of the plate thickness detecting unit operate the adjustment unit.

In the peeling device of the present invention, preferably, the position detecting unit includes: an image capturing unit that captures a position of a blade edge of the blade and a position of the second main surface of the reinforcing plate; and an image processing unit The image captured by the imaging unit performs image processing, and the calculation unit calculates the relative position based on the image processing result of the image processing unit.

Preferably, the position detecting unit further includes an imaging processing unit that is an imaging processing unit The blade and the reinforcing plate are relatively moved relative to the imaging unit by the adjustment unit, and the position of the blade edge of the blade and the position of the second main surface of the reinforcing plate are respectively captured by the imaging unit.

Preferably, the position detecting unit further includes a monitoring unit that monitors the blade between the time when the position of the blade edge of the blade is captured and the position of the second main surface of the reinforcing plate relative to The calculation unit calculates the change in the relative position of the imaging unit and/or the change in the relative position of the reinforcing plate with respect to the imaging unit, and the calculation unit calculates the result based on the monitoring result of the monitoring unit and the image processing result of the image processing unit. relative position.

Preferably, the peeling device further includes a light source for the blade, wherein when the light source for the blade is attached to the edge of the blade, the tip of the blade is irradiated with light at a position of the blade edge of the blade. The blade tip of the blade is disposed between the blade light source and the imaging unit.

In the peeling device of the present invention, preferably, the reinforcing plate has light transmissivity, and the plate thickness detecting portion detects a thickness of the reinforcing plate by a spectroscopic interference method.

Moreover, a method of manufacturing an electronic component according to another aspect of the present invention includes the steps of forming a functional layer on a substrate reinforced by a reinforcing plate, and separating the substrate on which the functional layer is formed from the reinforcing plate, and including And a step of adjusting an interval between the blade edge of the blade and the interface in a direction perpendicular to the interface before inserting the blade into the interface between the substrate and the first main surface of the reinforcing plate, the adjusting step comprising: detecting the position a step of detecting a relative position of a blade edge of the blade perpendicular to the interface and a second principal surface of the reinforcing plate opposite to the first main surface; and a plate thickness detecting step for reinforcing the blade The thickness of the board is tested; and The adjustment processing step adjusts the interval based on the relative position detected in the position detecting step and the thickness of the reinforcing plate detected in the thickness detecting step.

In the method of manufacturing an electronic component of the present invention, in the position detecting step, an image captured by an imaging unit that captures a position of a blade edge of the blade and a position of the second main surface of the reinforcing plate is preferable. The image processing is performed to calculate the relative position.

Preferably, in the position detecting step, the blade and the reinforcing plate are relatively moved with respect to the imaging unit, and the position of the blade edge of the blade and the second main surface of the reinforcing plate are respectively captured by the imaging unit. The location.

In the position detecting step, it is preferable that the relative position of the blade with respect to the imaging portion is between the imaging position of the blade tip and the position of the second main surface of the reinforcing plate. The change and/or the change in the relative position of the reinforcing plate with respect to the imaging unit and the result of the image processing are used to calculate the relative position.

Preferably, the blade tip of the blade is disposed between the blade light source that emits light toward the blade tip of the blade and the imaging portion at the position of the blade tip.

In the method of manufacturing an electronic component of the present invention, it is preferable that the reinforcing plate has translucency, and in the step of detecting the thickness, the plate thickness of the reinforcing plate is detected by a spectroscopic interference method.

According to the present invention, there is provided a peeling device and a method of manufacturing an electronic component which can insert a blade into an interface with high precision.

1‧‧‧ laminate

2‧‧‧Substrate

2A‧‧‧Substrate

2B‧‧‧Substrate

3‧‧‧ reinforcing plate

3A‧‧‧ reinforcing plate

3B‧‧‧ reinforcing plate

3Aa‧‧‧2nd main face

3Ab‧‧‧1st main face

3Ba‧‧‧1st main face

3Bb‧‧‧2nd main face

3AP‧‧‧ image

3AaP‧‧‧ image

3BP‧‧‧ image

3BbP‧‧‧ image

4‧‧‧Support board

4A‧‧‧Support board

4B‧‧‧ support plate

5‧‧‧ resin layer

5A‧‧‧ resin layer

5B‧‧‧ resin layer

6‧‧‧Layer

6a‧‧‧Upper surface

6b‧‧‧lower surface

7‧‧‧Liquid layer (functional layer)

8A‧‧‧ interface

8B‧‧‧ interface

10‧‧‧ peeling device

11A‧‧‧Flexible board (support)

11B‧‧‧Flexible board (support)

11AP‧‧‧ Images

11BP‧‧‧ image

12A‧‧‧ movable body

12B‧‧‧ movable body

14A‧‧‧through hole

14B‧‧‧through hole

15A‧‧‧Photographed by the camera department

15B‧‧‧Photographed by the camera department

15AP‧‧‧ image

15BP‧‧‧ image

20‧‧‧blade

20a‧‧‧Edge

20aP‧‧‧ image

20P‧‧‧ image

30‧‧‧ Blade Moving Department

31‧‧‧Horizontal drive motor

31a‧‧‧Motor body

31b‧‧‧Encoder Division

32‧‧‧Digital drive motor

32a‧‧‧Motor body

32b‧‧‧Encoder Division

33‧‧‧Rolling screw

34‧‧‧ horizontal movable body

35‧‧‧Motor support members

36‧‧‧Rolling screw

37‧‧‧Vertical movable body

38‧‧‧ Blade support members

40‧‧‧Layered body movement

41‧‧‧Layered motor

41a‧‧‧Motor body

41b‧‧‧Encoder Department

42‧‧‧Ball screw

51‧‧‧Photography Department

52‧‧‧Image Processing Department

53‧‧‧Light source for blades

54‧‧‧Light source for flexible board (light source for support)

55‧‧‧Half mirror

60A‧‧‧Sheet thickness detection department

60B‧‧‧Sheet thickness detection department

80‧‧‧Control Department

81‧‧‧ Calculation Department

82‧‧‧Video Processing Department

83‧‧‧Monitor

84‧‧‧Adjustment Processing Department

DA‧‧‧ plate thickness

DB‧‧‧ plate thickness

Fr‧‧ frame

GA‧‧‧Distance

GAP‧‧‧ distance

GB‧‧‧ distance

GBP‧‧‧Distance

LA‧‧‧Distance

LB‧‧‧ distance

MA‧‧‧Moving distance

MB‧‧‧Moving distance

WA‧‧ ‧ interval

WB‧‧ ‧ interval

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated board used in a manufacturing step of an electronic component according to an embodiment of the present invention.

Figure 2 is a view showing the middle of the manufacturing steps of the electronic component according to an embodiment of the present invention; A cross-sectional view of the fabricated laminate.

Fig. 3 is a cross-sectional view showing a principal part of a peeling apparatus according to an embodiment of the present invention, and is a sectional view taken along line III-III of Fig. 4;

Fig. 4 is a plan view showing essential parts of a peeling device according to an embodiment of the present invention.

5(a) and 5(b) are cross-sectional views (1) showing the peeling operation of the peeling device.

6(a) and 6(b) are cross-sectional views (2) showing the peeling operation of the peeling device.

7(a) and 7(b) are diagrams (1) showing the state of the peeling device at the time of shooting by the imaging unit.

8(a) and 8(b) are diagrams (1) showing images taken by the imaging unit.

9(a) and 9(b) are diagrams (2) showing the state of the peeling device at the time of shooting by the imaging unit.

10(a) and 10(b) are diagrams (2) showing an image taken by the imaging unit.

Fig. 11 is a view (3) showing a state of the peeling device at the time of shooting by the image pickup unit.

Fig. 12 is a view (4) showing a state of a peeling device at the time of imaging by an imaging unit.

Fig. 13 is a cross-sectional view showing the peeling operation of the peeling device from the state of Fig. 12.

Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or corresponding reference numerals are given to the same or corresponding components, and the description is omitted.

The method for manufacturing an electronic component according to the present embodiment is a step of forming a functional layer on a substrate reinforced by a reinforcing plate and a step of peeling off the substrate on which the functional layer is formed and the reinforcing plate in response to thinning of the substrate for the electronic component. . The reinforcing plate does not become part of the electronic component.

Here, the electronic component refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. The display panel includes a liquid crystal display (LCD), a plasma display panel (PDP), and a plasma display panel. Organic EL (electroluminescence) panel (OLED) (Organic Light Emitting Diode).

(Laminated board)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated board used in a manufacturing step of an electronic component according to an embodiment of the present invention. The laminated board 1 includes a substrate 2 and a reinforcing plate 3 of the reinforcing substrate 2.

(substrate)

A specific functional layer (for example, a conductive layer) is formed on the substrate 2 in the middle of the manufacturing process of the electronic component.

The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. The smaller the coefficient of linear expansion, the less the pattern of the functional layer formed at a high temperature is less likely to shift upon cooling.

The glass of the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda lime glass, sorghum glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.

As the glass of the glass substrate, it is preferable to use a glass suitable for the kind of the electronic component or the manufacturing step thereof. For example, the glass substrate for a liquid crystal panel preferably contains glass (alkali-free glass) which does not substantially contain an alkali metal component. As such, the glass of the glass substrate is appropriately selected based on the type of electronic component to be used and the manufacturing steps thereof.

The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.

The crystalline resin may, for example, be a polyamide resin, a polyacetal, a polybutylene terephthalate, a polyethylene terephthalate, a polyethylene naphthalate or a syndiotactic polyphenylene as a thermoplastic resin. Examples of the thermosetting resin such as ethylene include polyphenylene sulfide, polyether ether ketone, liquid crystal polymer, fluororesin or polyether nitrile.

Examples of the amorphous resin include polycarbonate, modified polyphenylene ether, polycyclohexene or polycondensation as a thermoplastic resin. Examples of the thermosetting resin include an olefin resin, a polyether oxime, a polyarylate, a polyamidoximine, a polyether quinone, or a thermoplastic polyimide.

As the resin of the resin substrate, a resin which is amorphous and thermoplastic is particularly preferable.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, in order to reduce the weight and thickness of the electronic component, it is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less. When it is 0.3 mm or less, good flexibility can be imparted to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. Moreover, the thickness of the glass substrate is preferably 0.03 mm or more for the reason that the production of the glass substrate is easy and the operation of the glass substrate is easy.

(reinforcing board)

When the reinforcing plate 3 is in close contact with the substrate 2, the substrate 2 is reinforced before the peeling operation. After the formation of the functional layer, the reinforcing plate 3 is peeled off from the substrate 2 in the middle of the manufacturing process of the electronic component, and does not become a part of the electronic component.

The reinforcing plate 3 is for suppressing warpage or peeling due to temperature change, and is preferably one in which the absolute value of the difference in linear expansion coefficient from the substrate 2 is small. In the case where the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of the glass plate is preferably of the same type as the glass of the glass substrate.

The reinforcing plate 3 includes a support plate 4 and a resin layer 5 formed on the support plate 4. The resin layer 5 and the substrate 2 are detachably bonded by acting on the van der Waals force or the like between the resin layer 5 and the substrate 2.

Further, the reinforcing plate 3 of the present embodiment may include the support plate 4 and the resin layer 5, or may be constituted only by the support plate 4. The support plate 4 and the substrate 2 are releasably joined by acting on the van der Waals force or the like between the support plate 4 and the substrate 2. In order to prevent the glass plate as the support plate 4 from being adhered to the glass substrate as the substrate 2 at a high temperature, an inorganic thin film may be formed on the surface of the support plate 4. membrane. Further, by providing a region having a different surface roughness or the like on the surface of the support plate 4, a region having a different bonding force may be provided at the interface between the support plate 4 and the substrate 2.

Further, the reinforcing plate 3 of the present embodiment includes the support plate 4 and the resin layer 5, and the support plate 4 may be plural. Similarly, the resin layer 5 may also be a plurality of layers.

(support plate)

The support plate 4 supports and reinforces the substrate 2 via the resin layer 5 . The support plate 4 prevents deformation, scratches, breakage, and the like of the substrate 2 in the manufacturing steps of the electronic component.

The support plate 4 may be, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, a metal plate, or the like. The type of the support plate 4 is selected depending on the type of the electronic component, the type of the substrate 2, and the like. If the support plate 4 and the substrate 2 are of the same kind, warping or peeling due to temperature change is reduced.

The difference (absolute value) between the average linear expansion coefficients of the support plate 4 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, and is preferably, for example, 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R 3102: 1995).

The thickness of the support plate 4 is, for example, 0.7 mm or less. Further, in order to reinforce the substrate 2, the thickness of the support plate 4 is preferably 0.4 mm or more. The thickness of the support plate 4 may be thicker than the substrate 2 or thinner than the substrate 2.

The outer shape of the support plate 4 is preferably such that the support plate 4 can support the entirety of the resin layer 5, as shown in FIG. 1, with the outer shape of the resin layer 5 being the same size or larger than the outer shape of the resin layer 5.

(resin layer)

When the resin layer 5 is in close contact with the substrate 2, the positional deviation of the substrate 2 can be prevented before the peeling operation. The resin layer 5 is easily peeled off from the substrate 2 by a peeling operation. By easily peeling off the substrate 2, damage of the substrate 2 can be prevented, and peeling of the unexpected position (between the resin layer 5 and the support plate 4) can be prevented.

The resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2. Thereby, it is possible to prevent the laminated board 1 from being peeled off at an unexpected position (between the resin layer 5 and the support plate 4) at the time of performing the peeling operation.

The resin of the resin layer 5 is not particularly limited. For example, examples of the resin of the resin layer 5 include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxyn resin, and a polyimide resin. It can also be used by mixing several resins. Among them, from the viewpoint of heat resistance or peelability, a polydecene oxide resin or a polyamidene polyimide resin is preferable.

The thickness of the resin layer 5 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 5 is 1 μm or more, when a bubble or a foreign matter is mixed between the resin layer 5 and the substrate 2, the resin layer 5 can be deformed so as to absorb the thickness of bubbles or foreign matter. On the other hand, when the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 is not excessively used, which is economical.

The outer shape of the resin layer 5 is preferably such that the resin layer 5 can be closely adhered to the entirety of the substrate 2, and the outer shape of the substrate 2 is the same as or larger than the outer shape of the substrate 2 as shown in FIG.

Further, the resin layer 5 may also contain two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all the resin layers.

Moreover, when the resin layer 5 contains two or more layers, the kind of the resin which forms each layer may differ.

(layered body)

Fig. 2 is a cross-sectional view showing a laminate produced in the middle of the manufacturing process of the electronic component according to the embodiment of the present invention.

The laminated body 6 is formed by forming a functional layer such as a conductive layer on the substrate 2 of the laminated board 1. The type of functional layer is selected according to the type of electronic component. The plurality of functional layers may also be sequentially laminated on the substrate 2. As a method of forming the functional layer, a general method can be used, for example, A vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method, a sputtering method, or the like is used. The functional layer is formed into a specific pattern by photolithography or etching.

For example, the laminated body 6 includes the reinforcing plate 3A, the substrate 2A, the liquid crystal layer 7, the substrate 2B, and the reinforcing plate 3B in this order. This laminated body 6 is produced by a maker in the middle of the manufacturing process of an LCD. A thin film transistor (TFT) (not shown) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, and a color filter (not shown) is formed on the surface of the other substrate 2B on the liquid crystal layer 7 side. Light film (CF, Color Filter).

After the reinforcing plates 3A and 3B are peeled off, a polarizing plate, a backlight, and the like are mounted to obtain an LCD as a product. The following peeling device was used for the peeling of the reinforcing plates 3A and 3B.

Further, in the present embodiment, the peeling of the reinforcing plates 3A and 3B is performed after the formation of the liquid crystal layer 7, and may be performed after the formation of the TFT or CF and before the formation of the liquid crystal layer 7.

(peeling device)

Fig. 3 is a cross-sectional view showing a principal part of a peeling apparatus according to an embodiment of the present invention, and is a sectional view taken along line III-III of Fig. 4; Fig. 4 is a plan view showing essential parts of a peeling device according to an embodiment of the present invention. 5 and 6 are cross-sectional views showing the peeling operation of the peeling device. Fig. 5(a) shows a state in which the blade is inserted into the interface 8A between the substrate 2A and the reinforcing plate 3A, and Fig. 5(b) shows a state in which the substrate 2A and the reinforcing plate 3A are bent and deformed in opposite directions. Fig. 6(a) shows a state in which the blade is inserted into the interface 8B between the substrate 2B and the reinforcing plate 3B, and Fig. 6(b) shows a state in which the substrate 2B and the reinforcing plate 3B are bent and deformed in opposite directions.

As shown in Fig. 5 (a), the peeling device 10 inserts the blade 20 at one end of the interface 8A between the substrate 2A and the lower surface (first main surface) 3Ab of the reinforcing plate 3A. Then, as shown in FIG. 5( b ), the peeling device 10 causes at least one of the substrate 2A and the reinforcing plate 3A so as to sequentially peel the interface 8A from the one end side toward the other end side (both in the figure) ) Bending deformation.

Further, as shown in FIG. 6(a), the peeling device 10 inserts the blade 20 at one end of the interface 8B of the upper surface (first main surface) 3Ba of the substrate 2B and the reinforcing plate 3B. Thereafter, the stripping device 10 is as shown As shown in FIG. 6(b), at least one of the substrate 2B and the reinforcing plate 3B (both in the drawing) is bent and deformed so that the interface 8B is sequentially peeled from the one end side toward the other end side.

The stripping device 10 can also include a nozzle that ejects fluid (e.g., compressed air) toward the insertion position of the blade 20 when the blade 20 is inserted into the interfaces 8A, 8B. The insertion position of the blade 20 can be the corner portion of the laminated body 6 as shown in FIG.

In this manner, the peeling device 10 peels the reinforcing plates 3A and 3B from the laminated body 6. In the present embodiment, after the reinforcing plate 3A on the upper side is peeled off from the laminated body 6, the reinforcing plate 3B on the lower side is peeled off, and the reinforcing plate 3A on the lower side may be peeled off after the reinforcing plate 3B on the lower side is peeled off. Hereinafter, each configuration of the peeling device 10 will be described.

As shown in FIG. 3, the peeling device 10 includes a flexible plate 11B that supports the lower surface (first main surface) 6b of the laminated body 6, and a flexible plate 11A that supports the upper surface of the laminated body 6 (second The main surface 6a; the plurality of movable bodies 12A, 12B, which are fixed to the flexible plates 11A, 11B; and the blade 20.

The flexible sheets 11A and 11B vacuum-adsorb the laminated body 6. Further, it may be electrostatic adsorption or magnetic adsorption instead of vacuum adsorption. A plurality of movable bodies 12A and 12B are fixed to the flexible boards 11A and 11B.

The plurality of movable bodies 12A and 12B are two-dimensionally arranged at intervals as shown in FIG. 4, and are configured to be movable with respect to the frame Fr. The plurality of movable bodies 12A, 12B are driven by a motor or the like. The flexible plate 11A11B is bent and deformed by moving the plurality of movable bodies 12A and 12B in a specific order.

The blade 20 has a thickness of, for example, 50 to 600 μm so as to be elastically deformed when inserted into the interfaces 8A and 8B of the substrates 2A and 2B and the reinforcing plates 3A and 3B. The blade tip 20a of the blade 20 is disposed in parallel with respect to the interfaces 8A, 8B, for example, horizontally.

The peeling device 10 relatively moves the blade 20 with respect to the laminated body 6 supported by the flexible plates 11A and 11B, and further includes a blade moving portion 30 and a laminated body moving portion 40 as shown in Fig. 3 .

The blade moving portion 30 includes a horizontal drive motor 31 that moves the blade 20 in the horizontal direction with respect to the frame Fr, and a vertical drive motor 32 that moves the blade 20 in the vertical direction with respect to the frame Fr.

The horizontal drive motor 31 may be a servo motor, and includes a motor main body portion 31a that can rotate forward and backward, an encoder portion 31b that detects a rotation amount and a rotation direction of the motor main portion 31a, and the like. The motor main body portion 31a is coupled to the horizontal movable body 34 via a ball screw 33 that converts the rotational motion of the motor main portion 31a into a linear motion. When the motor main body portion 31a rotates, the horizontal movable body 34 moves in the horizontal direction. The motor main body portion 31a performs feedback control based on the detection result of the encoder portion 31b so that the position of the horizontal movable body 34 becomes the target position.

The vertical drive motor 32 is supported by a motor support member 35 that is fixed to the horizontal movable body 34. The vertical drive motor 32 may be a servo motor, and includes a motor main body portion 32a that can rotate forward and backward, and an encoder portion 32b that detects the amount of rotation and the direction of rotation of the motor main portion 32a. The motor main body portion 32a is coupled to the vertical movable body 37 via a ball screw 36 that converts the rotational motion of the motor main portion 32a into a linear motion. When the motor main body portion 32a rotates, the vertical movable body 37 moves in the vertical direction. The motor main body portion 32a performs feedback control based on the detection result of the encoder portion 32b so that the position of the vertical movable body 37 becomes the target position.

The vertical movable body 37 supports the blade support member 38. The blade supporting member 38 supports the member of the blade 20 and is fastened to the vertical movable body 37 with a bolt or the like.

The laminated body moving unit 40 includes a laminated body motor 41 that moves the laminated body 6 supported by the flexible plates 11A and 11B in the vertical direction with respect to the frame Fr. The laminated body motor 41 can be a servo motor, and includes a motor main body portion 41a that can rotate forward and backward, and an encoder portion 41b that detects the amount of rotation and the direction of rotation of the motor main portion 41a. The motor main body portion 41a is coupled to the flexible plate 11B via the ball screw 42 and the movable body 12B that convert the rotational motion of the motor main body portion 41a into a linear motion. If the motor body portion 41a is rotated, the flexible plates 11A, 11B are used. The laminated body 6 of the support moves in the vertical direction. The motor main body portion 41a performs feedback control based on the detection result of the encoder portion 41b so that the position of the laminated body 6 becomes the target position.

The blade moving portion 30 and the laminated body moving portion 40 constitute an adjusting portion for adjusting the insertion position of the blade 20. The adjustment portion adjusts the intervals WA, WB between the blade edge 20a of the blade 20 and the interfaces 8A, 8B in the direction perpendicular to the interfaces 8A, 8B (for example, the vertical direction) before the insertion of the blade 20 (refer to FIG. 3, FIG. 9(b)). The interface between the interface 8A-based substrate 2A and the lower surface (first main surface) 3Ab of the reinforcing plate 3A. The interface between the interface 8B-based substrate 2B and the upper surface (first main surface) 3Ba of the reinforcing plate 3B.

As shown in FIG. 3, the distance WA between the blade edge 20a of the blade 20 and the interface 8A is based on the relative position (distance LA and the upper and lower relationship) of the upper surface (second main surface) 3Aa of the reinforcing plate 3A with respect to the blade tip 20a of the blade 20. ) and the plate thickness DA of the reinforcing plate 3A is calculated. Similarly, as shown in Fig. 9(b), the interval WB between the blade edge 20a of the blade 20 and the interface 8B is based on the relative position of the lower surface (second main surface) 3Bb of the reinforcing plate 3B with respect to the blade tip 20a of the blade 20. (The distance LB and the vertical relationship) and the plate thickness DB of the reinforcing plate 3B are calculated.

The peeling device 10 detects the relative positions (distance LA, distance LB, and the like) of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B with respect to the blade tip 20a of the blade 20, and further includes an imaging unit 51 and an image processing unit 52. The blade light source 53 and the flexible plate light source 54.

The imaging unit 51 includes a camera such as a CCD (Charge Coupled Device) camera or a CMOS (Complementary Metal Oxide Semiconductor) camera. The imaging unit 51 is fixed to the frame Fr. The imaging unit 51 captures the position of the blade edge 20a of the blade 20 and the positions of the second principal faces 3Aa and 3Bb of the reinforcing plates 3A and 3B, and supplies the captured image data to the image processing unit 52. The imaging unit 51 can image the position of the blade edge 20a of the blade 20 and the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B, respectively. Thereby, the accuracy of position detection by image processing is improved.

The image processing unit 52 includes a CPU (Central Processing Unit). A computer such as a unit), a ROM (Read OnLy Memory), and a RAM (Random Access Memory). The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the blade edge 20a of the blade 20 with respect to the imaging unit 51 and the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B. The relative position of the imaging unit 51. As a method of image processing, for example, there is a method of using a differential filter or the like. In the method of using the differential filter, the position where the brightness (brightness) of the pixel is sharply changed, the position of the blade tip 20a of the blade 20 in the detection image, and the second of the reinforcing plates 3A, 3B in the image are detected. The position of the main faces 3Aa, 3Bb. The image processing unit 52 supplies the result of the image processing to the control unit 80.

When the blade light source 53 is positioned at the position of the blade edge 20a of the blade 20 by the imaging unit 51, the blade tip 20a is irradiated with light. At this time, as shown in FIG. 4, the blade edge 20a of the blade 20 can be disposed between the imaging unit 51 and the blade light source 53.

When the light source 54 for the flexible board is used to image the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B by the imaging unit 51, the flexible plates 11A and 11B are irradiated with light. The light from the flexible plate light source 54 is reflected by the half mirror surface 55 provided in the middle of the optical axis of the camera as the imaging unit 51, and illuminates the flexible plates 11A and 11B coaxially with the optical axis of the camera.

In addition, the illumination method of the flexible plate light source 54 of the present embodiment is coaxial illumination, but if the light from the flexible plate light source 54 is reflected by the flexible plates 11A and 11B and is incident on the imaging unit 51, Can be varied. For example, it may be an annular illumination arranged to surround the optical axis of the camera, an external illumination separately provided from the camera, or the like.

The peeling device 10 further includes plate thickness detecting portions 60A and 60B (see FIG. 3) that detect the plate thicknesses DA and DB (see FIGS. 3 and 9(b)) of the reinforcing plates 3A and 3B. The plate thickness detecting units 60A and 60B detect the plate thicknesses DA and DB of the light-transmitting reinforcing plates 3A and 3B by, for example, a spectroscopic interference method.

The plate thickness detecting portion 60A irradiates the inspection light from the light source to the upper surface 6a of the laminated body 6 (i.e., the upper surface 3Aa of the reinforcing plate 3A on the upper side), and splits the interference light reflected by the laminated body 6 by the spectroscope, and uses the light receiver. Receiving the split light, analyzing the received light waveform and calculating the upper reinforcing plate 3A board thickness DA. The test light has a wavelength of a specific width, and in the analysis of the received light waveform, the change in intensity with respect to the wavelength is analyzed. The upper flexible plate 11A is formed with a through hole 14A through which the inspection light and the interference light pass.

Similarly, the plate thickness detecting portion 60B irradiates the inspection light from the light source toward the lower surface 6b of the laminated body 6 (i.e., the lower surface 3Bb of the reinforcing plate 3B on the lower side), and splits the interference light reflected by the laminated body 6 by the spectroscope. The light receiving beam is received by the light receiver, and the light receiving waveform is analyzed to calculate the thickness DB of the reinforcing plate 3B on the lower side. The test light has a wavelength of a specific width, and in the analysis of the received light waveform, the change in intensity with respect to the wavelength is analyzed. The flexible plate 11B on the lower side is formed with a through hole 14B through which the inspection light and the interference light pass.

The spectroscopic interference method is used in the case where the refractive indices of the resin layers 5A and 5B included in the reinforcing plates 3A and 3B are different from those of the substrates 2A and 2B. Further, when the reinforcing plates 3A and 3B are composed only of the supporting plates 4A and 4B (see FIG. 2), and the difference between the refractive indices of the supporting plates 4A and 4B and the refractive indices of the substrates 2A and 2B is different, Use spectroscopic interference. In the spectroscopic interference method, the interfaces 8A and 8B of the substrates 2A and 2B and the reinforcing plates 3A and 3B may be changed in refractive index.

Furthermore, triangulation can also be used instead of spectroscopic interference. In the triangulation method, the plate thicknesses DA and DB of the reinforcing plates 3A and 3B are detected using the inspection light having a specific wavelength. There is no need for a beam splitter in triangulation, so the cost is lower. On the other hand, the detection accuracy of the plate thickness of the spectroscopic interference method is good.

The peeling device 10 includes a control unit 80 that controls various operations of the peeling device 10. The control unit 80 includes a computer including a memory medium such as a CPU, a ROM, and a RAM. The various actions of the stripping device 10 are controlled by causing the CPU to execute a program recorded in the recording medium. The control unit 80 includes a calculation unit 81, an imaging processing unit 82, a monitoring unit 83, and an adjustment processing unit 84.

Further, the calculation unit 81, the imaging processing unit 82, the monitoring unit 83, the imaging unit 51, and the image processing unit 52 constitute a position detecting unit. The position detecting unit detects the reinforcing plates 3A and 3B in the vertical direction (for example, the vertical direction) with respect to the interfaces 8A and 8B in detail as follows. The relative position (distance LA, LB, etc.) of the second main faces 3Aa, 3Bb with respect to the blade tip 20a of the blade 20.

Next, the operation of the peeling device 10 having the above configuration will be described. The various actions of the stripping device 10 are performed under the control of the control device 70.

The laminated body 6 is horizontally placed on the flexible board 11B. When the flexible plate 11B vacuum-adsorbs the lower surface 6b of the laminated body 6, the flexible plate 11A is pressed against the upper surface 6a of the laminated body 6, and the upper surface 6a of the laminated body 6 is vacuum-adsorbed. At this time, the flexible plates 11A and 11B are formed into a flat plate shape, and the plate thickness detecting portions 60A and 60B detect the plate thicknesses DA and DB of the reinforcing plates 3A and 3B. The plate thickness detecting units 60A and 60B supply the detection result to the adjustment processing unit 84.

Then, the imaging processing unit 82 relatively moves the laminated body 6 and the blade 20 with respect to the imaging unit 51 by the blade moving unit 30 and the laminated body moving unit 40, and the imaging unit 51 respectively captures the position of the blade tip 20a of the blade 20. The position of the upper surface 3Aa with the reinforcing plate 3A on the upper side.

Fig. 7 is a view showing a state of a peeling device at the time of image pickup by an image pickup unit. Fig. 7(a) shows the state of the peeling device at the time of photographing the blade edge position of the blade 20, and Fig. 7(b) shows the state of the peeling device at the time of photographing the upper surface position of the upper reinforcing plate 3A. Fig. 8 is a view showing an image taken by an imaging unit. Fig. 8(a) schematically shows an image of the blade edge position of the imaging blade 20, and Fig. 8(b) schematically shows an image of the upper surface position of the reinforcing plate 3A on the upper side. In Fig. 8, the portion where the luminance of the pixel is low is indicated by the hatching of the oblique line.

For example, the imaging processing unit 82 captures the position of the blade edge 20a of the blade 20 by the imaging unit 51 as shown in Fig. 7(a). The blade edge 20a of the blade 20 is disposed between the blade light source 53 that irradiates the blade tip 20a with the imaging unit 51. Therefore, as shown in Fig. 8(a), the image of the periphery of the blade 20 is brighter than the image 20P of the blade 20, so that the image 20aP indicating the position of the blade tip 20a of the blade 20 becomes clear. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the blade edge 20a of the blade 20 with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to The calculation unit 81.

Then, as shown in FIG. 7(b), the imaging processing unit 82 lowers the blade 20 to the standby position with respect to the imaging unit 51 by the blade moving unit 30. In the meantime, the monitoring unit 83 monitors the change in the relative position of the blade 20 with respect to the imaging unit 51. The change in the relative position includes the moving direction of the blade 20 except for the moving distance MA of the blade 20 (refer to FIG. 7(b)). The monitoring unit 83 performs monitoring using, for example, the encoder unit 32b of the vertical drive motor 32. The monitoring unit 83 supplies the monitoring result to the calculation unit 81. Further, the imaging processing unit 82 lowers the laminated body 6 to the specific position with respect to the imaging unit 51 by the laminated body moving unit 40.

Thereafter, the imaging processing unit 82 captures the position of the upper surface 3Aa of the upper reinforcing plate 3A by the imaging unit 51. At this time, the end portion of the upper flexible plate 11A reflects the light from the flexible plate light source 54 toward the imaging unit 51 at the portion 15A imaged by the imaging unit 51. Therefore, as shown in Fig. 8(b), the image 11AP of the flexible plate 11A is brighter than the image 3AP of the reinforcing plate 3A, so that the image 3AaP indicating the position of the upper surface 3Aa of the reinforcing plate 3A becomes clear. In order to increase the light reflectance, the above portion 15A may include a reflective film (for example, a film of white paint). The image 15AP of the above portion 15A becomes brighter. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the upper surface 3Aa of the reinforcing plate 3A with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to the calculation unit 81.

The calculation unit 81 calculates the vertical direction of the blade tip 20a of the blade 20 shown in Fig. 7(a) and the upper surface 3Aa of the reinforcing plate 3A shown in Fig. 7(b) based on the result of the image processing by the image processing unit 52. The relative position in the direction. The relative position includes a vertical relationship in addition to the distance GA (see FIG. 7(b)). The distance GA is calculated from the product of the distance GAP (see FIG. 8(b)) in the image and the proportional constant. The proportionality constant is determined in advance by a test or the like, and is stored in the memory medium of the control unit 80.

The calculation unit 81 calculates the blade edge 20a of the blade 20 and the reinforcing plate 3A on the upper side based on the calculation result of the image processing by the image processing unit 52 and the monitoring result of the monitoring unit 83. The relative position of the upper surface 3Aa in the vertical direction. The relative position includes a vertical relationship in addition to the distance LA (see FIG. 7(b)). For example, in Fig. 7(b), the blade tip 20a of the blade 20 is located below the upper surface 3Aa of the reinforcing plate 3A. The distance between the upper surface 3Aa and the lower surface 3Ab of the reinforcing plate 3A is equal to the plate thickness DA of the reinforcing plate 3A.

The adjustment processing unit 84 calculates the interval WA in the vertical direction between the blade edge 20a of the blade 20 and the interface 8A based on the calculation result of the calculation unit 81 and the detection result of the plate thickness detecting unit 60A (see FIG. 7(b)). Then, the adjustment processing unit 84 operates the adjustment unit (for example, the blade moving unit 30) of the adjustment interval WA to adjust the interval WA to about 0 (zero).

Thereafter, the control unit 80 horizontally moves the blade 20 by the blade moving unit 30, and is inserted into one end of the interface 8A between the substrate 2A and the reinforcing plate 3A as shown in Fig. 5(a). As a result, the starting point of the peeling is formed at the interface 8A.

As described above, in the present embodiment, the distance WA between the blade edge 20a of the blade 20 and the interface 8A in the vertical direction is based on the relative position of the upper surface 3Aa of the reinforcing plate 3A with respect to the blade tip 20a of the blade 20 (distance LA and up and down) The relationship is calculated with the plate thickness DA of the reinforcing plate 3A. Therefore, when it is difficult to directly detect the position of the interface 8A, the position of the interface 8A can be accurately detected, so that the blade 20 can be inserted into the interface 8A with high precision.

Then, as shown in FIG. 5(b), the control unit 80 sequentially peels the plurality of movable bodies 12A and 12B in a specific order so as to peel the interface 8A between the substrate 2A and the reinforcing plate 3A from the one end side toward the other end side. The frame Fr is moved to bend and deform the flexible plates 11A and 11B.

After the peeling of the substrate 2A and the reinforcing plate 3A is completed, the control unit 80 releases the vacuum suction by the flexible plate 11A. Thereafter, the reinforcing plate 3A is removed from the flexible board 11A. Then, the flexible board 11A is pressed against the substrate 2A and adsorbs the upper surface of the substrate 2A. At this time, the flexible plates 11A and 11B have a flat shape.

Then, the imaging processing unit 82 relatively moves the reinforcing plate 3B and the blade 20 with respect to the imaging unit 51 by the blade moving unit 30 and the laminated body moving unit 40, and the imaging unit 51 respectively captures the position of the blade tip 20a of the blade 20. With the lower surface of the reinforcing plate 3B below the surface 3Bb Set.

FIG. 9 is a view showing a state of a peeling device at the time of imaging by an imaging unit. Fig. 9(a) shows the state of the peeling device at the time of photographing the blade edge position of the blade 20, and Fig. 9(b) shows the state of the peeling device at the time of photographing the lower surface position of the lower reinforcing plate 3B. Fig. 10 is a view showing an image taken by an imaging unit. Fig. 10(a) schematically shows an image of the blade edge position of the imaging blade 20, and Fig. 10(b) schematically shows an image of the lower surface position of the reinforcing plate 3B on the lower side. In Fig. 10, the portion where the luminance of the pixel is low is indicated by the hatching of the oblique line.

For example, the imaging processing unit 82 captures the position of the blade edge 20a of the blade 20 by the imaging unit 51 as shown in FIG. 9(a). The blade edge 20a of the blade 20 is disposed between the blade light source 53 that irradiates the blade tip 20a with the imaging unit 51. Therefore, as shown in Fig. 9(a), the image of the periphery of the blade 20 is brighter than the image 20P of the blade 20, so that the image 20aP indicating the position of the blade tip 20a of the blade 20 becomes clear. In order to increase the light reflectance, the above portion 15B may include a reflective film (for example, a film of white paint). The image 15BP of the above portion 15B becomes brighter. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the blade edge 20a of the blade 20 with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to the calculation unit 81.

Then, as shown in FIG. 9(b), the imaging processing unit 82 lowers the blade 20 to the standby position with respect to the imaging unit 51 by the blade moving unit 30. In the meantime, the monitoring unit 83 monitors the change in the relative position of the blade 20 with respect to the imaging unit 51. The change in the relative position includes the moving direction of the blade 20 in addition to the moving distance MB of the blade 20 (refer to FIG. 9(b)). The monitoring unit 83 performs monitoring using, for example, the encoder unit 32b of the vertical drive motor 32. The monitoring unit 83 supplies the monitoring result to the calculation unit 81. Further, the imaging processing unit 82 raises the reinforcing plate 3B to the specific position with respect to the imaging unit 51 by the laminated body moving unit 40.

Thereafter, the imaging processing unit 82 captures the position of the lower surface 3Bb of the lower reinforcing plate 3B by the imaging unit 51. At this time, the end of the lower flexible plate 11B is taken by the imaging unit 51. The portion 15B that has taken the light reflects the light from the flexible plate light source 54 toward the imaging unit 51. Therefore, as shown in Fig. 10 (b), the image 11BP of the flexible plate 11B is brighter than the image 3BP of the reinforcing plate 3B, so that the image 3BbP indicating the position of the lower surface 3Bb of the reinforcing plate 3B becomes clear. The image captured by the imaging unit 51 is supplied to the image processing unit 52. The image processing unit 52 performs image processing on the image supplied from the imaging unit 51, and detects the relative position of the lower surface 3Bb of the reinforcing plate 3B with respect to the imaging unit 51. The image processing unit 52 supplies the result of the image processing to the calculation unit 81.

The calculation unit 81 calculates the vertical direction of the blade tip 20a of the blade 20 shown in Fig. 9(a) and the lower surface 3Bb of the reinforcing plate 3B shown in Fig. 9(b) based on the result of the image processing by the image processing unit 52. The relative position in the direction. The relative position includes a vertical relationship in addition to the distance GB (see FIG. 9(b)). The distance GB is calculated from the product of the distance GBP (see FIG. 10(b)) in the image and the proportionality constant. The proportionality constant is determined in advance by a test or the like, and is stored in the memory medium of the control unit 80.

The calculation unit 81 calculates the vertical direction of the blade tip 20a and the lower surface 3Bb of the lower reinforcing plate 3B based on the calculation result of the image processing by the image processing unit 52 and the monitoring result of the monitoring unit 83. Relative position. The relative position includes a vertical relationship in addition to the distance LB (see FIG. 9(b)). For example, in Fig. 9(b), the blade tip 20a of the blade 20 is located below the lower surface 3Bb of the reinforcing plate 3B. The distance between the lower surface 3Bb of the reinforcing plate 3B and the upper surface 3Ba is equal to the plate thickness DB of the reinforcing plate 3B.

The adjustment processing unit 84 calculates the interval WB in the vertical direction between the blade edge 20a of the blade 20 and the interface 8B based on the calculation result of the calculation unit 81 and the detection result of the plate thickness detecting unit 60B (see FIG. 9(b)). Then, the adjustment processing unit 84 operates the adjustment unit (for example, the blade moving unit 30) of the adjustment interval WB, and adjusts the interval WB to about 0 (zero).

Thereafter, the control unit 80 horizontally moves the blade 20 by the blade moving unit 30, and is inserted into one end of the interface 8B between the substrate 2B and the reinforcing plate 3B as shown in Fig. 6(a). As a result, the starting point of the peeling is formed at the interface 8B.

Thus, in the present embodiment, the vertical direction between the blade edge 20a of the blade 20 and the interface 8B. The interval WB of the direction is calculated based on the relative position (distance LB and the upper limit relationship) of the lower surface 3Bb of the reinforcing plate 3B with respect to the blade edge 20a of the blade 20 and the plate thickness DB of the reinforcing plate 3B. Therefore, when it is difficult to directly detect the position of the interface 8B, the position of the interface 8B can be accurately detected, so that the blade 20 can be inserted into the interface 8B with high precision.

Then, as shown in FIG. 6(b), the control unit 80 sequentially peels the plurality of movable bodies 12A and 12B in a specific order so that the interface 8B between the substrate 2B and the reinforcing plate 3B is sequentially peeled from one end side to the other end side. The flexible plates 11A and 11B are bent and deformed with respect to the movement of the frame Fr.

After the peeling of the substrate 2B and the reinforcing plate 3B is completed, the control unit 80 releases the vacuum suction by the flexible plates 11A and 11B. Thereafter, the reinforcing plate 3B is removed from the flexible plate 11B, and the substrate 2A is removed from the flexible plate 11A.

In this manner, the reinforcing sheets 3A and 3B are peeled off from the laminated body 6, and then incorporated into a backlight or the like to obtain an LCD as a product.

Further, the peeling device 10 of the present embodiment is used in the manufacturing process of the LCD, but the present invention is not limited thereto, and can be used in the manufacturing steps of other electronic components.

Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. Various changes and modifications can be made without departing from the spirit and scope of the invention.

For example, in the peeling device 10 of the above embodiment, the interfaces 8A and 8B are horizontally arranged before the insertion of the blade 20, but the interfaces 8A and 8B may be arranged vertically, and the interfaces 8A and 8B may be inclined with respect to the horizontal plane.

Further, in the above-described embodiment, the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B are accurately detected, and the portions 15A of the flexible plates 12A and 12B which are imaged by the imaging unit 51 are formed at the end portions of the flexible plates 12A and 12B. There is a light reflecting film (for example, a film of a white paint), and a light absorbing film (for example, a film of a black paint) can also be formed. The light reflecting film and the light absorbing film can be used depending on the state of the side faces of the reinforcing plates 3A and 3B, respectively. For example, as shown in FIG. 11, when the corner portion of the side surface of the reinforcing plate 3B is chamfered, the light incident on the side surface of the reinforcing plate 3B is not reflected by the imaging portion 51. Since the image of the reinforcing plate 3B imaged by the imaging unit 51 is dark, the light reflecting film is used to brighten the image of the flexible plate 11B. In the case where the image of the reinforcing plate 3B is darkened, in addition to the case where the corner portion of the side surface of the reinforcing plate 3B is chamfered, the side surface of the reinforcing plate 3B is damaged to cause light scattering. On the other hand, when the side surface of the reinforcing plate 3B is a flat surface and is not chamfered, the light incident on the side surface of the reinforcing plate 3B is reflected by the imaging unit 51, and the image of the reinforcing plate 3B imaged by the imaging unit 51 is obtained. Since it is brightened, a light absorbing film is used in order to darken the image of the flexible board 11B.

Further, in the above embodiment, when the position of the second main surface 3Aa of the reinforcing plate 3A is detected, the flexible plate 11A is placed on the second main surface 3Aa of the reinforcing plate 3A, and as shown in FIG. Set. In this case, one of the second main faces 3Aa of the reinforcing plate 3A is disposed between the blade light source 53 that irradiates light to the reinforcing plate 3A and the imaging unit 51. Therefore, since the image of the periphery of the reinforcing plate 3A is brighter than the image of the reinforcing plate 3A, the position of the second main surface 3Aa of the reinforcing plate 3A becomes clear. In this case, as shown in FIG. 13, the blade 20 can be inserted between the reinforcing plate 3A and the interface 8A of the substrate 2A before the flexible plate 11A is placed on the second main surface 3Aa of the reinforcing plate 3A. Then, the flexible board 11A is lowered in a state in which the blade 20 is inserted, and the second main surface 3Aa of the reinforcing plate 3A is sucked by the flexible board 11A as shown in Fig. 5(a). Then, as shown in FIG. 5(b), at least one of the substrate 2A and the reinforcing plate 3A (both in the drawing) is bent and deformed so that the interface 8A is sequentially peeled from one end side to the other end side.

Further, in the peeling device 10 of the above-described embodiment, the imaging unit 51 is used to detect the positions of the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B, and non-contact position sensing such as a laser displacement meter can be used. A contact position sensor such as a needle or a measuring wheel or an encoder portion 41b of the laminated body motor 41.

Further, in the peeling device 10 of the above-described embodiment, the monitoring unit 83 monitors the change in the relative position of the blade 20 with respect to the imaging unit 51 between the time of capturing the blade and the time of capturing the reinforcing plate, and the change in the relative position is determined in advance by the shutter or the like. In this case, it is not necessary to monitor by the monitoring unit 83.

Further, the imaging processing unit 82 of the above-described embodiment captures the position of the upper surface 3Aa of the reinforcing plate 3A by the position of the blade edge 20a of the blade 20 by the imaging unit 51, but the order of imaging is not limited. For example, the imaging processing unit 82 may photograph the position of the blade edge 20a of the blade 20 after capturing the position of the upper surface 3Aa of the reinforcing plate 3A. In this case, the monitoring unit 83 monitors the relative position of the reinforcing plate 3A with respect to the imaging portion 51. Change. The monitoring unit 83 monitors using, for example, the encoder unit 41b of the laminated body motor 41. Further, the imaging processing unit 82 can simultaneously capture the position of both, and in this case, the position detecting unit includes the calculation unit 81, the imaging unit 51, and the image processing unit 52.

Further, in the peeling apparatus 10 of the above-described embodiment, the thicknesses of the reinforcing plates 3A and 3B are detected by the plate thickness detecting units 60A and 60B, and the second main faces 3Aa and 3Bb of the reinforcing plates 3A and 3B are detected by the position detecting unit. Relative to the position of the blade tip 20a of the blade 20, but the order may be reversed or simultaneously.

Further, the peeling device 10 of the above embodiment includes a computer as the image processing unit 52 and a computer as the control unit 80. However, the control unit 80 can also function as the image processing unit 52.

Further, in the peeling device 10 of the above-described embodiment, when the interfaces 8A and 8B are peeled from the one end side to the other end side, both of the flexible plates 11A and 11B are bent and deformed, and only one of them may be bent and deformed. In this case, it is also possible to use a rigid plate which is difficult to bend and deform to replace another flexible plate.

Further, the peeling device 10 of the above embodiment is a device that peels off both interfaces 8A and 8B, and may be a device that peels only one of them (for example, only the interface 8A).

The present application is based on Japanese Patent Application No. 2012-009347, filed Jan.

2A‧‧‧Substrate

2B‧‧‧Substrate

3A‧‧‧ reinforcing plate

3B‧‧‧ reinforcing plate

3Ab‧‧‧1st main face

6‧‧‧Layer

6a‧‧‧Upper surface

6b‧‧‧lower surface

7‧‧‧Liquid layer (functional layer)

8A‧‧‧ interface

11A‧‧‧Flexible board (support)

11B‧‧‧Flexible board (support)

12A‧‧‧ movable body

12B‧‧‧ movable body

14A‧‧‧through hole

14B‧‧‧through hole

15A‧‧‧Photographed by the camera department

15B‧‧‧Photographed by the camera department

20‧‧‧blade

30‧‧‧ Blade Moving Department

31‧‧‧Horizontal drive motor

31a‧‧‧Motor body

31b‧‧‧Encoder Division

32‧‧‧Digital drive motor

32a‧‧‧Motor body

32b‧‧‧Encoder Division

33‧‧‧Rolling screw

34‧‧‧ horizontal movable body

35‧‧‧Motor support members

36‧‧‧Rolling screw

37‧‧‧Vertical movable body

38‧‧‧ Blade support members

40‧‧‧Layered body movement

41‧‧‧Layered motor

41a‧‧‧Motor body

41b‧‧‧Encoder Department

42‧‧‧Ball screw

51‧‧‧Photography Department

52‧‧‧Image Processing Department

54‧‧‧Light source for flexible board (light source for support)

55‧‧‧Half mirror

60A‧‧‧Sheet thickness detection department

60B‧‧‧Sheet thickness detection department

80‧‧‧Control Department

81‧‧‧ Calculation Department

82‧‧‧Video Processing Department

83‧‧‧Monitor

84‧‧‧Adjustment Processing Department

DA‧‧‧ plate thickness

Fr‧‧ frame

LA‧‧‧Distance

WA‧‧ ‧ interval

Claims (14)

A peeling device for peeling a substrate from a reinforcing plate attached to the substrate, and comprising: a blade inserted into an interface between the substrate and a first main surface of the reinforcing plate; and an adjusting portion attached to the blade Before the insertion, adjusting the distance between the blade edge of the blade and the interface in the direction perpendicular to the interface; the position detecting portion detecting the blade edge of the blade and the reinforcing plate in a direction perpendicular to the interface a relative position of the second main surface opposite to the first main surface; a plate thickness detecting portion that detects a thickness of the reinforcing plate; and an adjustment processing portion that is based on a detection result of the position detecting portion and the plate thickness The adjustment unit is operated by the detection result of the detection unit. The peeling device of claim 1, wherein the position detecting unit includes: an image capturing unit that captures a position of a blade edge of the blade and a position of the second main surface of the reinforcing plate; and an image processing unit The image captured by the imaging unit performs image processing, and the calculation unit calculates the relative position based on the image processing result of the image processing unit. The peeling device according to claim 2, wherein the position detecting unit further includes an imaging processing unit that relatively moves the blade and the reinforcing plate with respect to the imaging unit by the adjustment unit, and the image capturing unit The portion captures the position of the blade tip of the blade and the position of the second main surface of the reinforcing plate. The peeling device of claim 3, wherein the position detecting unit further includes a monitoring unit that monitors a position between a position of the blade edge of the blade and a position of the second main surface of the reinforcing plate a change in the relative position of the blade relative to the imaging unit and/or a phase of the reinforcing plate relative to the imaging unit The calculation unit calculates the relative position based on the monitoring result of the monitoring unit and the image processing result of the image processing unit. The stripping device of claim 3 or 4, further comprising a light source for the blade, wherein the light source is attached to the blade tip of the blade to illuminate the blade tip of the blade at the edge of the blade At the time of shooting, the blade tip of the blade is disposed between the blade light source and the imaging unit. The peeling device according to any one of claims 1 to 4, wherein the reinforcing plate has light transmissivity, and the plate thickness detecting portion detects a thickness of the reinforcing plate by a spectroscopic interference method. The peeling device of claim 5, wherein the reinforcing plate has light transmissivity, and the plate thickness detecting portion detects a thickness of the reinforcing plate by a spectroscopic interference method. A method of manufacturing an electronic component, comprising the steps of: forming a functional layer on a substrate reinforced by a reinforcing plate; and separating the substrate on which the functional layer is formed from the reinforcing plate, and including inserting the blade into the substrate And an adjustment step of adjusting an interval between the blade edge of the blade and the interface in a direction perpendicular to the interface before the interface with the first main surface of the reinforcing plate, the adjusting step comprising: a position detecting step, relative to the above The edge of the blade in the direction perpendicular to the interface and the second principal surface of the reinforcing plate opposite to the first main surface are detected; and the thickness detecting step detects the thickness of the reinforcing plate And an adjustment processing step of adjusting the relative position detected in the position detecting step and the thickness of the reinforcing plate detected in the thickness detecting step The above interval. The method of manufacturing an electronic component according to claim 8, wherein in the position detecting step, an image captured by an imaging unit that captures a position of a blade edge of the blade and a position of the second main surface of the reinforcing plate is performed. The image processing is performed to calculate the relative position. The method of manufacturing an electronic component according to claim 9, wherein in the position detecting step, the blade and the reinforcing plate are relatively moved with respect to the imaging unit, and the imaging unit respectively captures a position of a blade edge of the blade and the above The position of the second main surface of the reinforcing plate. The method of manufacturing an electronic component according to claim 10, wherein in the position detecting step, the blade is opposed to the position of the second principal surface of the reinforcing plate based on the position of the blade edge of the blade The relative position is calculated by a change in the relative position of the imaging unit and/or a change in the relative position of the reinforcing plate with respect to the imaging unit and a result of image processing. The method of manufacturing an electronic component according to claim 10, wherein the blade tip of the blade is disposed on a blade light source that emits light toward a blade edge of the blade and the image pickup portion at the position of a blade edge of the blade between. The method of manufacturing an electronic component according to any one of claims 8 to 11, wherein the reinforcing plate has a light transmissive property, and in the step of detecting the thickness, the plate thickness of the reinforcing plate is detected by a spectroscopic interference method. The method of manufacturing an electronic component according to claim 12, wherein the reinforcing plate has light transmissivity, and in the step of detecting the thickness, the plate thickness of the reinforcing plate is detected by a spectroscopic interference method.