JP6436389B2 - Peel start part creating apparatus, peel start part creating method, and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a peeling start part creating apparatus, a peeling start part creating method, and an electronic device manufacturing method.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries are made thinner and lighter, glass, resin, and metal substrates used for these electronic devices are required to be thinned. .

  However, when the thickness of the substrate is reduced, the handling of the substrate is deteriorated, and a functional layer for an electronic device (for example, a thin film transistor (TFT) or a color filter (CF)) is formed on the substrate. It becomes difficult to form.

  Thus, a method has been proposed in which a reinforcing plate is bonded to a substrate via a resin layer to reinforce the substrate, and a functional layer is formed on the reinforced substrate (see, for example, Patent Document 1). In this method, a reinforcing plate is bonded to a substrate to form a laminate, and a functional layer is formed on the substrate that is the laminate. And after formation of a functional layer, a reinforcement board is peeled from a board | substrate.

  The reinforcing plate is peeled off by, for example, bending and deforming the reinforcing plate and / or the substrate from one end to the other end of the two corner portions located on the diagonal line. At this time, in order to facilitate the peeling, a peeling start portion (a gap serving as a trigger for peeling) is artificially created. This peeling start portion is created by inserting a knife into the resin layer.

International Publication No. 2010/090147

  In creating the peeling start portion, it is necessary to insert the knife edge into the resin layer with high accuracy. In order to insert the knife accurately, the positional relationship between the resin layer and the blade edge of the knife is detected, and on the basis of the detection result, the laminate and the knife are arranged so that the knife edge and the resin layer face each other. It is necessary to adjust the position and insert a knife into the resin layer.

  However, there is a case where the knife is positioned not on the resin layer but on the substrate serving as a product due to the relationship between the accuracy of detecting the position of the knife edge and the resin layer and the accuracy of adjusting the position of the laminated body and the knife. . In this state, if the knife is moved toward the resin layer, the knife and the substrate come into contact with each other, and there is a concern that the knife may damage the product substrate. In particular. As the resin layer becomes thinner, the concern becomes significant.

  The present invention has been made in view of such a problem, and provides a peeling start portion creation apparatus, a peeling start portion creation method, and an electronic device manufacturing method capable of accurately inserting a knife into a resin layer. The purpose is to do.

The peeling start part creation apparatus according to the first embodiment includes a first substrate having a first main surface and a second main surface that are product substrates, a first main surface that is a reinforcing plate, and a second substrate. And a second substrate having a main surface of the laminate, the peelable start portion is formed on the laminate by inserting a knife into the adsorbent layer with respect to the laminate that is detachably bonded via the adsorbent layer. In the device for creating a peeling start part of a laminate to be created, a moving unit that relatively advances or retracts the knife and the laminate in a direction parallel to the second main surface of the second substrate, and the knife A detection unit that detects which of the suction layer and the second substrate is in contact with the blade edge, the laminate and the knife in a direction perpendicular to the second main surface of the second substrate, Relative to the position detection unit for detecting the positional relationship between the second substrate and the second main surface of the second substrate. A position adjustment unit that adjusts the position of the laminate and the knife, and a control unit that controls the movement unit, the detection unit, the position detection unit, and the position adjustment unit, The control unit detects the position of the stacked body and the knife by the position detection unit, and based on the detection result of the position detection unit, the position adjustment unit sets the position of the knife by the position detection unit. A first position adjustment process for adjusting the position of the knife on the second substrate side by a predetermined distance from a position of the body facing the adsorption layer; and the knife and the laminate by the moving unit. A detecting process for detecting which of the suction layer and the second substrate is contacted by the detection unit; and a detecting process for detecting whether the knife edge is in contact with the second blade. Touched the substrate If detected, the moving unit moves backward relative to the stacked body and the knife, and the position adjusting unit moves the knife toward the adsorption layer by a distance equal to or less than the thickness of the adsorption layer. A second position adjustment process that adjusts the forward movement process, the detection process, the backward movement process, and the second position adjustment process until it is detected that the knife has contacted the adsorption layer. When it is detected that the blade edge of the knife is in contact with the adsorption layer, a continuous advance process is performed in which the knife and the laminate are continuously moved forward by the moving unit.

The peeling start part creation method according to the second embodiment includes a first substrate having a first main surface and a second main surface that are product substrates, a first main surface that is a reinforcing plate, and a second substrate. And a second substrate having a main surface of the laminate, the peelable start portion is formed on the laminate by inserting a knife into the adsorbent layer with respect to the laminate that is detachably bonded via the adsorbent layer. In the peeling start part creation method to be created, a position detection step for detecting a positional relationship between the laminate and the knife in a direction perpendicular to the second main surface of the second substrate, and detection of the position detection step Based on the result, the laminated body and the knife are moved relative to each other in a direction perpendicular to the second main surface of the second substrate, and the position of the knife is opposed to the adsorption layer of the laminated body. The position of the knife on the second substrate side by a predetermined distance from the position to be A first position adjusting step for adjusting the position of the second substrate, an advancing step for relatively advancing the knife and the laminated body in a direction parallel to the second main surface of the second substrate, and a blade edge of the knife Detecting step of detecting which of the adsorbing layer and the second substrate is in contact, and detecting that the blade edge of the knife is in contact with the second substrate, the first of the second substrate A retreating step for retreating the laminate and the knife relative to each other in a direction parallel to the principal surface of the second substrate, and a direction perpendicular to the second principal surface of the second substrate. And a second position adjusting step of adjusting the position of the knife by a distance equal to or less than the thickness of the adsorption layer to the side of the adsorption layer, and the knife contacts the adsorption layer The forward step and the A step of repeating the ejecting step, the retreating step, and the second position adjusting step in this order; and when detecting that the blade edge of the knife is in contact with the adsorption layer, the knife and the laminate are relatively And a continuous forward step for continuously moving forward.

The electronic device manufacturing method according to the third embodiment includes a first substrate having a first main surface and a second main surface that are product substrates, a first main surface that is a reinforcing plate, and a second substrate. The second substrate having the main surface of the first substrate is detachably bonded to the second main surface of the first substrate and the first main surface of the second substrate through the adsorption layer. A functional layer forming step of forming a functional layer on the first main surface of the first substrate, and the first substrate and the second substrate on which the functional layer is formed are separated from the stacked body. In the method for manufacturing an electronic device having a separation step, the separation step includes a separation start portion creation step for creating a separation start portion by inserting a knife into the adsorption layer, and the separation start portion as a starting point. A peeling step of sequentially peeling the substrate of the second substrate and the second substrate, and the peeling start portion creating step of the second substrate A position detecting step for detecting a positional relationship between the stacked body and the knife in a direction perpendicular to the second main surface; and based on a detection result of the position detecting step, the stacked body and the knife are The position of the knife is moved by a predetermined distance from a position facing the adsorption layer of the stacked body by relatively moving in a direction perpendicular to the second main surface of the second substrate. A first position adjusting step for adjusting the position of the knife to the side, and a forward step for relatively advancing the knife and the laminate in a direction parallel to the second main surface of the second substrate. Detecting step of detecting whether the blade edge of the knife has contacted the adsorption layer or the second substrate, and detecting that the blade edge of the knife has contacted the second substrate, 2nd main surface of 2 substrates A retreating step for retreating the laminate and the knife relative to each other in a parallel direction; and moving the laminate and the knife relatively to a direction perpendicular to the second main surface of the second substrate. And a second position adjusting step for adjusting the position of the knife on the side of the adsorption layer by a distance equal to or less than the thickness of the adsorption layer, until it is detected that the knife has contacted the adsorption layer. The forward step, the detection step, the backward step, and the second position adjustment step are repeated in this order, and when it is detected that the blade edge of the knife is in contact with the adsorption layer, the knife and the And a continuous advance step for relatively continuously advancing the laminated body.

  According to the peeling start part creating apparatus, the peeling start part creating method, and the electronic device manufacturing method according to the present invention, it is possible to insert the knife into the resin layer with high accuracy.

The principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device The principal part enlarged side view which shows an example of the laminated body produced in the middle of the manufacturing process of LCD Explanatory drawing showing the configuration of the peeling start part creation device Explanatory drawing which showed the structure of the position detection part which detects the positional relationship of a knife and a laminated body. Flow chart showing the procedure of the peeling start part creation method Side view showing part of the procedure for creating the peeling start part Side view showing part of the procedure for creating the peeling start part Side view showing part of the procedure for creating the peeling start part The top view which showed a part of procedure of the peeling start part creation method Longitudinal sectional view showing the configuration of the peeling device The top view of the flexible board which showed typically the arrangement position of a plurality of movable bodies to a peeling unit Explanatory drawing showing the configuration of the peeling unit Longitudinal sectional view of the peeling device that peels the reinforcing plate from the laminate

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The present invention is illustrated by the following preferred embodiments. Changes can be made by many techniques without departing from the scope of the present invention, and other embodiments than the present embodiment can be utilized. Accordingly, all modifications within the scope of the present invention are included in the claims.

  Here, in the drawing, portions indicated by the same symbols are similar elements having similar functions. In addition, in the present specification, when a numerical range is expressed using “˜”, upper and lower numerical values indicated by “˜” are also included in the numerical range.

  Hereinafter, a peeling start part creating apparatus, a peeling start part creating method, and an electronic device manufacturing method according to the present invention will be described with reference to the accompanying drawings.

  The electronic device refers to an electronic component such as a display panel, a solar battery, or a thin film secondary battery. As a display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be illustrated.

[Outline of electronic device manufacturing method]
An electronic device is formed by forming a functional layer for an electronic device (in the case of LCD, a thin film transistor (TFT) or a color filter (CF)) on the first main surface of a substrate made of glass, resin, metal, or the like. Manufactured.

  Before the functional layer is formed, the substrate is configured as a laminated body in which a reinforcing plate is bonded to the second main surface via a resin layer. Thereafter, a functional layer is formed on the first main surface of the substrate in the state of the laminate, and after the functional layer is formed, the reinforcing plate is peeled from the substrate.

  That is, the method for manufacturing an electronic device includes a functional layer forming step of forming a functional layer on the first main surface of the substrate in the state of a laminate, and a separation step of separating the substrate on which the functional layer is formed and the reinforcing plate. Provided. This separation step includes a peeling start portion creation step for creating a peeling start portion by inserting a knife into the resin layer, and a peeling step for sequentially peeling the substrate and the reinforcing plate starting from the peeling start portion. The peeling start part creating method and the peeling start part creating apparatus according to the present invention are applied to the peeling start part creating process of the separation process.

[Laminate]
FIG. 1 is an enlarged side view of an essential part showing an example of a laminated body 1.

  The laminated body 1 includes a substrate 2 that is a first substrate and a reinforcing plate 3 that is a second substrate that reinforces the substrate 2. A functional layer is formed on the substrate 2 which is the first substrate. Further, the reinforcing plate 3 includes a resin layer 4 as an adsorption layer on the first main surface 3a (surface facing the substrate 2), and the second main surface 2b (functional layer of the substrate 2) is provided on the resin layer 4. The surface opposite to the first main surface 2a to be formed) is bonded. The substrate 2 is detachably bonded to the reinforcing plate 3 by van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4. The reinforcing plate 3 has a second main surface 3b (a surface opposite to the first main surface 3a facing the substrate 2) supported by a table (not shown) or the like.

[substrate]
The substrate 2 constituting the first substrate includes a first main surface 2a and a second main surface 2b. A functional layer is formed on the first main surface 2 a of the substrate 2. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these exemplified substrates, the glass substrate is suitable as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. Further, as the linear expansion coefficient decreases, the glass substrate also has an advantage that the pattern of the functional layer formed at a high temperature is difficult to shift during cooling. Here, the board | substrate 2 becomes a product board | substrate which comprises a final product.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses containing silicon oxide as a main component. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, it is preferable to select and use a glass suitable for the type of electronic device to be produced and a glass suitable for the production process. For example, it is preferable to employ glass (non-alkali glass) that does not substantially contain an alkali metal component for the glass substrate for a liquid crystal panel.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, and further preferably 0.1 mm or less, in order to reduce the weight and thickness of the electronic device. Set to When the plate thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the plate thickness is 0.1 mm or less, the glass substrate can be wound into a roll. In addition, it is preferable that the plate | board thickness is 0.03 mm or more from a viewpoint of manufacture of a glass substrate, and a viewpoint of the handling of a glass substrate.

  In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the board | substrate 2 can also be comprised with the laminated body which laminated | stacked the several board | substrate.

[Reinforcement plate]
The reinforcing plate 3 constituting the second substrate includes a first main surface 3a and a second main surface 3b, the substrate 2 is bonded to the first main surface 3a, and the second main surface. The side 3b is supported by a stage or the like. Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

  The type of the reinforcing plate 3 is selected according to the type of electronic device to be manufactured, the type of the substrate 2 used for the electronic device, and the like. If the reinforcing plate 3 and the substrate 2 are made of the same material, it is possible to reduce unintentional warpage due to temperature change and peeling in the functional layer forming step.

The difference (absolute value) in the average linear expansion coefficient between the reinforcing plate 3 and the substrate 2 is appropriately set according to the dimensional shape and the like of the substrate 2. The difference in average linear expansion coefficient is preferably 35 × 10 ⁻⁷ / ° C. or less. Here, the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R3102) in a temperature range of 50 to 300 ° C.

  The plate thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type of the reinforcing plate 3, the type of the substrate 2 to be reinforced, the plate thickness, and the like. The reinforcing plate 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

  In this example, the reinforcing plate 3 is constituted by a single substrate, but the reinforcing plate 3 can also be constituted by a laminated body in which a plurality of substrates are laminated.

[Resin layer]
The resin layer 4 constituting the adsorption layer is provided on the first main surface 3 a of the reinforcing plate 3, and the reinforcing plate 3 and the substrate 2 are detachably bonded via the resin layer 4. In order to prevent unintended peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Is done. Thereby, in a peeling process, peeling is performed between the resin layer 4 and the board | substrate 2 of the laminated body 1. FIG.

  Although resin which comprises the resin layer 4 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, and polyimide silicone resin can be illustrated. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 2-20 micrometers. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, when the thickness of the resin layer 4 is 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is economical.

  The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2.

  Moreover, although the resin layer 4 is comprised by 1 layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer 4. In this case, the type of resin constituting each layer may be different.

  Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  The metal silicide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba. Is tungsten silicide.

  The nitride is, for example, at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba. It contains seeds, preferably aluminum nitride, titanium nitride, or silicon nitride.

  The carbide includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbide.

  The carbonitride includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbonitride.

  Metal silicide, nitride, carbide, and carbonitride have a small difference in electronegativity between Si, N, or C contained in the material and other elements contained in the material, and have a small polarization. Therefore, the reactivity between the inorganic film and water is low, and hydroxyl groups are unlikely to be generated on the surface of the inorganic film. Therefore, the releasability between the inorganic film and the substrate 2 which is a glass substrate is kept good.

[Laminated body in which functional layer is formed]
A functional layer is formed on the first main surface 2a of the substrate 2 of the laminate 1 through the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed in a predetermined pattern by photolithography or etching.

  FIG. 2 is an enlarged side view of an essential part showing an example of a laminate 6 produced in the middle of the LCD manufacturing process.

  The laminate 6 is configured by laminating a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B in this order. The reinforcing plate 3A is detachably bonded to the substrate 2A via the resin layer 4A, and the reinforcing plate 3B is detachably bonded to the substrate 2B via the resin layer 4B. That is, the laminate 6 in FIG. 2 corresponds to a laminate in which the laminate 1 shown in FIG. 1 is arranged symmetrically with the functional layer 7 in between. Hereinafter, a laminate composed of the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminate 1A, and a laminate composed of the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminate 1B.

  A thin film transistor (TFT) as the functional layer 7 is formed on the first main surface 2Aa of the substrate 2A of the first stacked body 1A. A color filter (CF) as the functional layer 7 is formed on the first main surface 2Ba of the substrate 2B of the second stacked body 1B.

  The first stacked body 1A and the second stacked body 1B are integrated by superimposing the first main surface 2Aa of the substrate 2A and the first main surface 2Ba of the substrate 2B on each other. Thereby, the laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically with the functional layer 7 interposed therebetween is manufactured.

  The second main surface 2Ab of the substrate 2A and the first main surface 3Aa of the reinforcing plate 3A are arranged at positions facing each other, and the substrate 2A and the reinforcing plate 3A are detachably bonded via the resin layer 4A. . Further, the second main surface 2Bb of the substrate 2B and the first main surface 3Ba of the reinforcing plate 3B are disposed at positions facing each other, and the substrate 2B and the reinforcing plate 3B are bonded to each other through the resin layer 4B. Is done. In the laminate 6, the reinforcing plates 3 </ b> A and 3 </ b> B are peeled off in a peeling step, and thereafter, a polarizing plate, a backlight, and the like are attached to manufacture a product LCD. In the peeling process, the second main surface 3Ab of the reinforcing plate 3A and / or the second main surface 3Bb of the reinforcing plate 3B are adsorbed by the flexible plate, and the reinforcing plate 3A and the reinforcing plate 3A are bent by bending the flexible plate. / Or the reinforcing plate 3B is peeled off from the laminated body 6.

  In addition, although the laminated body 6 of FIG. 2 is a structure provided with the reinforcement board 3A and the reinforcement board 3B, as a laminated body, the structure provided with only one of the reinforcement board 3A and the reinforcement board 3B may be sufficient.

[Peeling start part creation device]
FIG. 3 is an explanatory diagram for explaining a configuration of the peeling start part creation device 10. Here, for the sake of convenience, a case where a peeling start portion is formed in the laminate 1 shown in FIG. 1 will be described as an example.

  The peeling start part creating apparatus 10 includes a table 12 that supports the laminated body 1, a holder 14 that holds the knife N, a table drive unit 16 that moves the table 12 in the horizontal direction (X-axis direction in FIG. 3), The knife drive unit 18 that moves the knife N in the horizontal direction, the position adjustment unit 20 that moves the knife N in the vertical direction (Z-axis direction in FIG. 3) and adjusts the position, and the blade edge Na of the knife N are laminated bodies. 1, a load cell 22 as a detection unit for detecting which position (resin layer 4 or reinforcing plate 3) is in contact with, a support member 24 for mounting the holder 14 and the load cell 22, and a cutting edge Na of the knife N A laser displacement meter 26 that detects the position in the height direction, a plate thickness detector 28 that detects the plate thickness of the reinforcing plate 3 of the laminate 1 supported by the table 12, and a control that controls the overall operation in an integrated manner. Part A control unit 30 that functions to, and provided with a.

  The table 12 is horizontally installed on the table support frame 32. The table 12 has an outer shape corresponding to the outer shape of the multilayer body 1 so as to support almost the entire surface of the multilayer body 1. The upper surface of the table 12 is a mounting surface of the stacked body 1 and is configured as a horizontal plane. The laminate 1 is placed on the upper surface (mounting surface) of the table 12.

  The table 12 is provided with a suction mechanism (not shown). In the laminated body 1 placed on the table 12, the second main surface 3b of the reinforcing plate 3 is vacuum-sucked by this suction mechanism. As a result, the laminate 1 placed on the table 12 is sucked and held on the table 12.

  The knife N has a rectangular flat plate shape in plan view, and has an acute blade edge Na on one long side portion. The plate | board thickness of the knife N is 50-600 micrometers, for example.

  The holder 14 detachably holds the knife N. The holder 14 grips both ends of the knife N, for example. The holder 14 is fixed to a linear motion device 34 provided on the upper surface of the support member 24. The linear motion device 34 includes a guide rail 36 fixed to the upper surface of the support member 24 and a guide block 38 engaged with the guide rail 36, and the guide block 38 is slidably supported along the guide rail 36. Has been. The holder 14 is fixed to the guide block 38. By sliding the guide block 38 along the guide rail 36, the holder 14 and the knife N held by the holder 14 can be slid along the guide rail 36.

  On the upper surface of the support member 24, a frame 40 is provided at a position opposite to the position of the stacked body 1 away from the holder 14. The frame 40 is provided with a load cell 22 and a first stopper 42. A compression spring 44 is attached between the holder 14 and the load cell 22. The pressing force by the compression spring 44 can be measured by the load cell 22. Further, the holder 14 is urged in the direction of the laminated body 1 by the compression spring 44.

  In addition, by measuring the pressing force by the compression spring 44 with the load cell 22, it is possible to detect whether the blade edge Na is in contact with the reinforcing plate 3 or the resin layer 4. This method will be described later.

  A second stopper 46 is provided on the upper surface of the support member 24 on the opposite side of the holder 14 from the compression spring 44. The second stopper 46 restricts the movement of the holder 14 against the urging force of the compression spring 44 on the upper surface of the support member 24.

  When the cutting edge Na receives a force in a direction opposite to the urging force of the compression spring 44 (herein referred to as a reaction force), the holder 14 moves in a direction opposite to the urging force according to the magnitude of the reaction force. In this case, the compression spring 44 is compressed. Before the compression spring 44 is completely compressed, the first stopper 42 restricts the movement of the holder 14 against the reaction force. The operations of the first stopper 42 and the compression spring 44 will be further described later.

  The table driving unit 16 constitutes a stacked body moving unit, and moves the table support frame 32 on which the table 12 is installed in the horizontal direction to horizontally move the stacked body 1 supported by the table 12. The table driving unit 16 rotates the main body frame 50, a rail 52 provided in the main body frame 50, a slider 54 that can slide on the rail 52, a ball screw 56 disposed along the rail 52, and the ball screw 56. A motor 58 to be operated. The main body frame 50 is horizontally installed on a base (not shown). Here, the base is a place where the peeling start part creating apparatus 10 is installed, and is typically a floor surface, for example.

  The rotational motion of the motor 58 is converted into linear motion by the ball screw 56, and the slider 54 moves linearly along the rail 52. As a result, the table support frame 32 installed on the slider 54 and the table 12 installed on the table support frame 32 are movable in the horizontal direction.

  The knife drive unit 18 constitutes a knife moving unit, moves the support member 24 carrying the holder 14 holding the knife N in the horizontal direction, and consequently moves the knife N in the horizontal direction. The knife driving unit 18 is installed on a gantry 80 installed on a base (not shown).

  The knife drive unit 18 rotates the main body frame 60, a rail 62 provided in the main body frame 60, a slider 64 slidable on the rail 62, a ball screw 66 disposed along the rail 62, and the ball screw 66. And a motor 68 to be operated. The main body frame 60 is horizontally installed on a base (not shown). The main body frame 60 is installed horizontally with respect to a gantry 80 installed horizontally on a base (not shown). The rotary motion of the motor 68 is converted into a linear motion by the ball screw 66, and the slider 64 moves linearly.

  The support member 24 is installed on the slider 64 via the position adjustment unit 20. Therefore, by moving the slider 64 in the horizontal direction, the position adjustment unit 20, the support member 24, the holder 14, and the knife N can be moved in the horizontal direction.

  Here, since the rail 62 of the knife drive unit 18 is installed so as to be parallel to the rail 52 of the table drive unit 16, the table 12 and the knife N are on the horizontal plane in the same direction (X-axis direction in FIG. 3). ) Can be moved in a straight line. Therefore, the laminated body 1 and the knife N can be moved forward or backward relatively in the horizontal direction.

  Here, the forward means that the knife N and the laminated body 1 move so as to approach each other, and the backward means that the knife N and the laminated body 1 move so as to be separated from each other.

  In the embodiment, the moving unit is configured by the stacked body moving unit (table driving unit 16) and the knife moving unit (knife driving unit 18). By this moving part, the knife N and the laminated body 1 are moved forward or backward relatively in the horizontal direction. As long as the knife N and the laminate 1 are relatively advanced or retracted in the horizontal direction, the configuration is not particularly limited. Here, the horizontal direction is the X-axis direction in FIG. 3 and means a direction parallel to the second main surface 3b of the reinforcing plate 3 that is the second substrate.

  The position adjustment unit 20 constitutes a position adjustment unit, and moves the knife N in the vertical direction by moving the holder 14 holding the knife N in the vertical direction. The position adjustment unit 20 is installed on the slider 64 of the knife drive unit 18.

  The position adjustment unit 20 rotates the main body frame 70, a rail 72 provided on the main body frame 70, a slider 74 that can slide on the rail 72, a ball screw 76 disposed along the rail 72, and the ball screw 76. And a motor 78 to be operated. The main body frame 70 is vertically installed on the slider 64 of the knife drive unit 18. The rotary motion of the motor 78 is converted into a linear motion by the ball screw 76, and the slider 74 moves linearly.

  The support member 24 is provided on the slider 74 of the position adjustment unit 20. Therefore, by moving the slider 74 in the vertical direction, the support member 24, the holder 14, and the knife N can be moved in the vertical direction.

  In the embodiment, the position adjustment unit 20 includes a position adjustment unit. The position of the knife N and the laminated body 1 is adjusted by moving the knife N and the laminated body 1 in the vertical direction by the position adjusting unit. The vertical direction is the Z-axis direction in FIG. 3 and means a direction perpendicular to the second main surface 3b of the reinforcing plate 3 that is the second substrate.

  In the embodiment, a known laser displacement meter 26 is installed on a base (not shown) via a bracket (not shown). The laser displacement meter 26 emits laser light as detection light in the vertical direction, and detects the distance to the surface of the object irradiated with the laser light. A displacement amount from a reference plane set as a horizontal plane is detected, and a distance from the reference plane to the surface of the object is detected.

  A known plate thickness detector 28 is installed on a base (not shown) via a bracket (not shown), and emits inspection light vertically upward. The plate thickness detector 28 detects the plate thickness of the reinforcing plate 3 by, for example, spectral interferometry. In the plate thickness detector 28 by the spectral interference method, the inspection light is irradiated from the light source toward the laminated body 1, the interference light reflected by the laminated body 1 is dispersed by the spectroscope, and the dispersed light is received by the light receiver. The thickness of the reinforcing plate 3 is calculated by analyzing the received light waveform. The inspection light has a wavelength of a predetermined width, and the intensity change with respect to the wavelength is analyzed in the analysis of the received light waveform. When the plate thickness detector 28 by the spectral interference method is used, it is preferable that the reinforcing plate 3 constituting the laminated body 1 has translucency.

  Next, a position detection method for detecting the positional relationship between the laminated body 1 and the knife N using the laser displacement meter 26 and the plate thickness detector 28 will be described with reference to FIG. FIG. 4 is an explanatory diagram showing the configuration of the position detection unit that detects the positional relationship between the knife and the laminated body. In the embodiment, the laser displacement meter 26 and the plate thickness detector 28 constitute a position detector. However, the position detection unit is not particularly limited as long as the positional relationship can be detected.

  By moving the knife N to the installation position of the laser displacement meter 26, the cutting edge Na is irradiated with laser light, and the height direction position of the cutting edge Na, that is, the distance L1 in the vertical direction from the reference plane is detected. .

  By moving the laminated body 1 supported by the table 12 to the installation position (detection position) of the laser displacement meter 26, the second main surface 3b of the reinforcing plate 3 is irradiated with laser light, and the second of the reinforcing plate 3 is irradiated. The position of the main surface 3b in the height direction, that is, the vertical distance L2 from the reference surface is detected.

  By moving the laminated body 1 supported by the table 12 to the installation position (plate thickness detection position) of the plate thickness detector 28, the inspection light is emitted toward the second main surface 3b of the reinforcement plate 3, and the reinforcement is performed. The plate thickness of the plate 3 is detected.

  Since the reinforcing plate 3 includes the resin layer 4 on the first main surface 3a, the plate thickness T1 of the reinforcing plate 3 and the plate thickness T2 of the reinforcing plate 3 including the resin layer 4 (the plate of the reinforcing plate 3). (Thickness + thickness of the resin layer 4) is detected as the plate thickness of the reinforcing plate 3.

  From the acquired distance L1, distance L2, and plate thicknesses T1, T2 of the reinforcing plate 3, the positional relationship between the laminate 1 and the knife N, that is, the distance H (displacement) between the blade edge Na of the knife N and the knife insertion planned position. ) Is also detected.

  Since the resin layer 4 is provided on the reinforcing plate 3 as described above, the average value ((T1 + T2) / the thickness T1 of the reinforcing plate 3 and the thickness T2 including the resin layer 4 and the reinforcing plate 3). 2) is the thickness of the reinforcing plate 3. The distance H can therefore be determined by H = [L2 + ((T1 + T2) / 2)]-L1. Since the distance H is obtained by using the average value ((T1 + T2) / 2) of the plate thickness T1 of the reinforcing plate 3 and the plate thickness T2 including the resin layer 4 and the reinforcing plate 3, a knife is used. The planned insertion position is set at the center of the resin layer 4 in the thickness direction.

  The control unit 30 performs overall control of the entire operation of the peeling start unit creating apparatus 10 and executes various arithmetic processes. The control unit 30 includes, for example, a computer including a storage medium such as a CPU (Central Processing Unit), ROM (Read Only Memory), and RAM (Random Access Memory). The control unit 30 executes a predetermined control program and executes various processes. For example, the drive of the table drive unit 16 is controlled to control the movement of the table 12, and the drive of the knife drive unit 18 is controlled to control the movement of the knife N. Further, based on the detection results of the laser displacement meter 26 and the plate thickness detector 28, the positional relationship between the knife insertion scheduled position and the blade edge Na of the knife N is detected, and based on the detection result, the position adjustment unit 20 is detected. The position adjustment of the knife N with respect to the laminated body 1 is carried out by controlling the driving of.

[Peeling start part creation method]
A method for creating a peeling start portion by the peeling start portion creating apparatus 10 will be described with reference to FIGS. FIG. 5 is a flowchart showing the procedure of the peeling start portion creation method, and FIGS. 6 to 8 are explanatory views showing a part of the procedure of the peeling start portion creation method.

  In the embodiment, the control unit 30 controls the operations of the table drive unit 16, the knife drive unit 18, the laser displacement meter 26, the plate thickness detector 28, and the position adjustment unit 20, so that the peeling start unit creating device is performed. 10 is performed (FIG. 3).

  First, as shown in the flowchart of FIG. 5, the control unit 30 executes a position detection step that is a position detection process (step S110). In the position detection step, the control unit 30 drives the table drive unit 16, the knife drive unit 18, the laser displacement meter 26, and the plate thickness detector 28, and the control unit 30 controls the stacked body 1 and the knife N based on the acquired information. And detect the positional relationship. That is, the distance H (deviation amount) between the knife insertion scheduled position and the blade edge Na is detected (FIGS. 4 and 6A).

  Next, as shown in the flowchart of FIG. 5, the control unit 30 executes a first position adjustment step which is a first position adjustment process (step S120). In the first position adjustment step, first, the control unit 30 drives the position adjustment unit 20 based on the detection result of the detected distance H (deviation amount), and the knife is placed at a position facing the resin layer 4 of the laminate 1. The position of N is adjusted (FIG. 6B). That is, the knife N is moved in the vertical direction so that the blade edge Na of the knife N is positioned at the same height as the planned knife insertion position. Positioning at the same height means positioning the distance H to be zero.

  Next, in the first position adjustment step, the control unit 30 drives the position adjustment unit 20 to adjust the position of the knife N toward the reinforcing plate 3 by a predetermined distance (FIG. 6C). That is, the knife N is moved in the vertical direction so that the blade edge Na of the knife N is positioned on the reinforcing plate 3 side with respect to the knife insertion scheduled position. In FIG. 6, the position adjustment of FIG. 6B is performed for the sake of explanation, but FIG. 6B may be omitted and the position adjustment may be performed directly from FIG. 6A to FIG.

  That is, in the first position adjustment step, the position of the knife N is adjusted to the reinforcing plate 3 side by a predetermined distance from the position facing the resin layer 4. (1) The position where the resin layer 4 faces Adjusting the position of the knife N, and then adjusting the position of the knife N on the side of the reinforcing plate 3 by a predetermined distance, and (2) obtaining the position facing the resin layer 4 based on the detection result, The distance of movement by a predetermined distance from the position is obtained, and the knife N is positioned directly on the reinforcing plate 3 side without adjusting the position of the knife N at the position facing the resin layer 4. And the case of adjusting the position.

  As shown in FIG. 6A, the distance H is detected by using the laser displacement meter 26 and the plate thickness detector 28 in the position detection step. However, even if the accuracy of position detection is increased, the position detection includes a certain range of detection errors. Further, as shown in FIG. 6B, the knife N is moved in the vertical direction to a position where the distance H becomes zero. However, even if the accuracy of the position adjustment unit 20 is increased, the position adjustment includes a certain range of positioning errors. Therefore, due to these error factors, the position of the blade edge Na of the knife N may not be the same height as the center position in the thickness direction of the resin layer 4 which is the knife insertion scheduled position. For example, the position of the blade edge Na of the knife N may be the same height as the position of the substrate 2 at the time of FIG.

  In the first position adjustment step of the embodiment, the position of the knife N and the resin layer 4 of the laminate 1 are adjusted so as to face each other, and then the position of the knife N is set on the reinforcing plate 3 side by a predetermined distance. The position is adjusted. By performing the first position adjustment step described above, it is possible to avoid the knife N from contacting the substrate 2 when the knife N is advanced toward the stacked body 1 in the subsequent advancement step.

  In particular, it is preferable to set the predetermined distance to be equal to or greater than the maximum error in consideration of both the detection error of the position detection unit and the positioning error of the position adjustment unit. By moving to the side of the reinforcing plate 3 larger than the maximum error, it is possible to more reliably avoid contact between the blade edge Na of the knife N and the substrate 2 in the forward step.

  Next, specific numerical values will be described. For example, the thickness of the resin layer 4 is 2 μm, and the maximum error between the detection error of the position detection unit and the positioning error of the position adjustment unit is ± 2 μm. First, the planned knife insertion position is a position of 1 μm, which is the center position of the thickness of the resin layer 4.

  Here, the maximum error between the position detection unit and the position adjustment unit is +2 μm (upward in the vertical direction is +). Even if the position of the blade edge Na is adjusted to the planned knife insertion position, the position is adjusted to a position that exceeds the thickness of the resin layer 4 and faces the substrate 2 due to an error.

  Therefore, by moving the blade edge Na in the vertical direction by 2 μm or more corresponding to the maximum error, the contact between the substrate 2 and the blade edge Na can be avoided in the forward step.

  Next, as shown in the flowchart of FIG. 5, the control unit 30 executes a forward step that is forward processing (step S <b> 130). In the advance step, the control unit 30 drives the table drive unit 16 and / or the knife drive unit 18 constituting the moving unit to relatively advance the knife N and the stacked body 1 in the horizontal direction (FIG. 6D )). The knife N and the laminated body 1 are relatively moved by the table driving unit 16 and / or the knife driving unit 18 until the blade edge Na comes into contact with either the reinforcing plate 3 or the resin layer 4 of the laminated body 1.

  Further, in the forward step, the table driving unit 16 and / or the knife driving unit 18 are driven after the blade edge Na comes into contact with either the reinforcing plate 3 or the resin layer 4 of the laminate 1, and a predetermined distance (for example, 1 mm). Only the knife N and / or the laminated body 1 are advanced (FIG. 7E). At this time, the holder 14 is not in contact with the first stopper 42.

  Next, as shown in the flowchart of FIG. 5, the control unit 30 executes a detection step which is a detection process (step S140). In the detection step, the control unit 30 detects the pressing force from the load cell 22 and detects whether the blade edge Na is in contact with the reinforcing plate 3 or the resin layer 4 from the change in the pressing force.

  First, the case where the blade edge Na contacts the reinforcing plate 3 will be described. As shown in FIG. 6D, the pressing force of the load cell 22 increases from the point when the blade edge Na comes into contact with the reinforcing plate 3. This is because the cutting edge Na receives the reaction force from the reinforcing plate 3 and the compression spring 44 is further compressed.

  Further, as shown in FIG. 7E, when the knife N and / or the laminate 1 continues to advance by a predetermined distance, the pressing force of the load cell 22 further increases. The reason is that the position of the laminated body 1 is fixed and the reinforcing plate 3 is harder than the resin layer 4, so that when the knife N is advanced, the reaction force received by the blade edge Na increases and the compression spring 44 is compressed. Because it is done.

  That is, when the blade edge Na comes into contact with the reinforcing plate 3, the pressing force detected from the load cell 22 always increases, so that it is possible to detect that the blade edge Na has come into contact with the reinforcing plate 3.

  Next, as shown in the flowchart of FIG. 5, when it is determined in the detection step (step S140) that the layer is not the resin layer 4 (No in this case), the control unit 30 executes a reverse step that is a reverse process (step S150). ). In the retreating step, the control unit 30 drives the table driving unit 16 and / or the knife driving unit 18 constituting the moving unit to relatively retract the knife N and the stacked body 1 in the horizontal direction (FIG. 7F). )). The knife N and the laminated body 1 are relatively moved by the table driving unit 16 and / or the knife driving unit 18 until the blade edge Na is separated from the reinforcing plate 3 of the laminated body 1.

  As shown in the flowchart of FIG. 5, when the backward step (step S150) is executed, the control unit 30 then executes a second position adjustment step that is a second position adjustment process (step S160). In the second position adjustment step, the control unit 30 drives the position adjustment unit 20 to adjust the position of the knife N toward the substrate 2 by a distance equal to or less than the thickness of the resin layer 4 (FIG. 7G). That is, the knife N is moved in the vertical direction so that the blade edge Na of the knife N is positioned on the substrate 2 side by a distance equal to or less than the thickness of the resin layer 4. By moving the resin layer 4 by a distance equal to or less than the thickness, the knife N can be prevented from being adjusted to the position of the substrate 2 beyond the resin layer 4.

  Next, as shown in the flowchart of FIG. 5, the control unit 30 moves forward (step S <b> 130), detection step (step S <b> 140), and reverse until it detects that the cutting edge Na of the knife N has contacted the resin layer 4. The step (step S150) and the second position adjustment step (step S160) are repeatedly executed in this order.

  Next, the case where the blade edge Na contacts the resin layer 4 will be described. As described above, as shown in the flowchart of FIG. 5, the control unit 30 executes a forward step that is a forward process (step S130), and the control unit 30 executes a detection step that is a detection process (step S140).

  The control unit 30 drives the table driving unit 16 and / or the knife driving unit 18 constituting the moving unit to relatively advance the knife N and the stacked body 1 in the horizontal direction. In this case, the blade edge Na contacts the resin layer 4 (FIG. 7H).

  As shown in FIG. 7H, the pressing force of the load cell 22 increases from the time when the blade edge Na comes into contact with the resin layer 4 as described in FIG. 6D. This is because the blade tip Na receives the reaction force from the reinforcing plate 3 and the compression spring 44 is compressed.

  Further, as shown in FIG. 8I, when the knife N and / or the laminated body 1 continues to advance by a predetermined distance, the pressing force of the load cell 22 once increases and then decreases. The reason is that although the position of the laminated body 1 is fixed, the resin layer 4 is soft, so that the cutting edge Na advances through the resin layer 4 while peeling the resin layer 4. Therefore, the reaction force that pushes the blade edge Na is weakened, and the compressed compression spring 44 extends toward the laminate 1. Therefore, the length of the compression spring 44 in FIG. 8I is longer than the length of the compression spring 44 in FIG. That is, regarding the pressing force detected by the load cell 22, the pressing force when the blade edge Na contacts the resin layer 4 (FIG. 8 (I)) is the pressing force when the blade edge Na contacts the reinforcing plate 3 (FIG. 7). (E)) can be understood to be smaller. From this difference in the pressing force, it can be detected whether the blade edge Na is in contact with the reinforcing plate 3 or the resin layer 4.

  In the embodiment, the method of detecting the reinforcing plate 3 or the resin layer 4 using the load cell 22 has been described. However, the present invention is not limited to this, and a displacement meter or the like can be used. When using a displacement meter, for example, the distance between the holder 14 and the first stopper 42 is measured. It can be determined whether the knife N has contacted the reinforcing plate 3 or the resin layer 4 from the change in distance.

  Next, as shown in the flowchart of FIG. 5, when it is determined that the resin layer 4 is detected in the detection step (step S <b> 140) (here, Yes), the control unit 30 executes a continuous advance step that is a continuous advance process. (Step S170). In the continuous advance step, the control unit 30 drives the table driving unit 16 and / or the knife driving unit 18 constituting the moving unit, and until the blade edge Na reaches the predetermined distance in the resin layer 4, The knife N and the laminated body 1 are relatively advanced in the horizontal direction (FIGS. 8J and 8K).

  As shown in FIG. 8J, when the blade edge Na is advanced in the resin layer 4, the reaction force received by the blade edge Na increases. As a result, the compression spring 44 is compressed and moves until the holder 14 reaches the first stopper 42. After the holder 14 comes into contact with the first stopper 42, the movement of the holder 14 is restricted by the first stopper 42.

  Further, as shown in FIG. 8K, the knife N and the laminated body 1 are further moved forward in the horizontal direction while the holder 14 and the first stopper 42 are in contact with each other. Since the movement of the holder 14 holding the knife N is regulated by the first stopper 42, the blade edge Na can be advanced in the resin layer 4 against the reaction force.

  As shown in FIG. 9, a moving part (table drive unit and knife drive unit) (not shown) is driven, and the knife N and the laminated body 1 are relatively advanced in a direction parallel to the second main surface of the reinforcing plate. (FIG. 9A). Next, the blade edge Na is advanced through the resin layer 4 by a predetermined distance (FIG. 9B). Finally, the peeling start part SP is formed by retreating the knife N and the laminate 1 relatively in a direction parallel to the second main surface of the reinforcing plate.

  In addition, it is preferable to perform the memory | storage step which memorize | stores the contact position where the blade edge | tip Na of the knife N and the laminated body 1 (the reinforcement board 3 or the resin layer 4) contacted at the first detection step (step S140). The contacted position here means a position in the horizontal direction.

  If it is determined in the detection step (step S140) that the knife N and the reinforcing plate 3 are in contact with each other, a backward step (step S150) and a second position adjustment step (step S160) are executed, and as described above, the forward movement is performed. The step (step S130), the detection step (step S140), the reverse step (step S150), and the second position adjustment step (step S160) are repeatedly executed.

  In the second forward step (step S130), it is preferable to adjust the forward speed of the knife N based on the stored information on the contact position. Based on the information on the contact position, the knife N can be moved at a high speed until the knife N comes into contact with the stacked body 1, and then the knife N and the stacked body 1 can be contacted at a low speed. Thereby, the breakage of the knife N can be prevented.

  In addition, the forward step (step S130) can be performed quickly. If the information on the contact position is not obtained, it is necessary to move the knife N at a low speed from the start of movement to the contact with the laminate 1.

  On the other hand, when the information on the contact position is obtained, as described above, the knife N can be moved in two stages of high speed and low speed, so the forward step is executed faster than the movement of only the low speed. It becomes possible to do.

  Next, a peeling apparatus and a peeling method for peeling the reinforcing plate from the laminate in which the peeling start portion is formed will be described. In the following description, the case where the laminate 6 shown in FIG. 2 is used will be described as an example.

[Peeling device]
10 is a longitudinal sectional view showing the configuration of the peeling apparatus 100, and FIG. 11 is a plan view of the peeling unit 102 schematically showing the arrangement positions of the plurality of movable bodies 104 with respect to the peeling unit 102 of the peeling apparatus 100. It is. 10 corresponds to a cross-sectional view taken along line BB in FIG. 11, and in FIG. 11, the stacked body 6 is indicated by a solid line.

  As shown in FIG. 10, the peeling apparatus 100 includes a pair of movable devices 106 and 106 that are disposed above and below the laminated body 6. The movable devices 106 and 106 have the same configuration. Here, the movable device 106 arranged on the lower side of FIG. 10 will be described, and the movable device 106 arranged on the upper side will be denoted by the same reference numerals and description thereof will be omitted.

  The movable device 106 includes a plurality of movable bodies 104, a plurality of drive devices 108 that move the movable body 104 up and down for each movable body 104, a controller 110 that controls the drive device 108 for each drive device 108, and the like.

  The peeling unit 102 holds the reinforcing plate 3B by vacuum suction in order to bend and deform the reinforcing plate 3B. Instead of vacuum suction, electrostatic suction or magnetic suction may be used.

[Peeling unit]
12A is a plan view of the peeling unit 102, and FIG. 12B is an enlarged longitudinal sectional view of the peeling unit 102 taken along the line CC in FIG. 12A. In FIG. 12C, the suction portion 114 constituting the peeling unit 102 is attached to and detached from the first flexible plate 112 having a rectangular plate shape constituting the peeling unit 102 via the double-sided adhesive tape 116. It is an expanded vertical sectional view of the peeling unit 102 which shows having been provided freely. As described above, the peeling unit 102 is configured such that the suction portion 114 is detachably attached to the first flexible plate 112 via the double-sided adhesive tape 116.

  The adsorption unit 114 includes a second flexible plate 118 that is thinner than the first flexible plate 112. The lower surface (one surface) of the second flexible plate 118 is detachably attached to the upper surface of the first flexible plate 112 via a double-sided adhesive tape 116.

  Further, the suction part 114 is provided with a rectangular breathable sheet 120 that sucks and holds the inner surface of the reinforcing plate 3B of the laminate 6. The thickness of the air-permeable sheet 120 is 2 mm or less, preferably 1 mm or less for the purpose of reducing the tensile stress generated in the reinforcing plate 3B at the time of peeling, and in the embodiment, a thickness of 0.5 mm is used.

  Furthermore, the adsorbing part 114 is provided with a seal frame member 122 that surrounds the breathable sheet 120 and is in contact with the outer peripheral surface of the reinforcing plate 3B. The seal frame member 122 and the air permeable sheet 120 are bonded to the upper surface (the other surface) of the second flexible plate 118 via the double-sided adhesive tape 124. Further, the seal frame member 122 is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is configured to be 0.3 mm to 0.5 mm thicker than the thickness of the breathable sheet 120. Has been.

  A frame-shaped groove 126 is provided between the breathable sheet 120 and the seal frame member 122. Further, the first flexible plate 112 has a plurality of through holes 128 opened. One end of each of the through holes 128 communicates with the groove 126, and the other end of the first flexible plate 112 via a suction pipe (not shown). Connected to an intake source (for example, a vacuum pump).

  Therefore, when the intake source is driven, the air in the suction pipe, the through hole 128, and the groove 126 is sucked, whereby the inner surface of the reinforcing plate 3B of the laminate 6 is vacuum-adsorbed and held on the breathable sheet 120, In addition, since the outer peripheral surface of the reinforcing plate 3B is pressed against the seal frame member 122, the sealing performance of the suction space surrounded by the seal frame member 122 is improved.

The first flexible plate 112 has higher bending rigidity than the second flexible plate 118, the air permeable sheet 120, and the seal frame member 122, and the bending rigidity of the first flexible plate 112 is higher than the peeling unit. 102 dominates the bending stiffness. The bending rigidity per unit width (1 mm) of the peeling unit 102 is preferably 1000 to 40000 N · mm ² / mm. For example, in a portion where the width of the peeling unit 102 is 100 mm, the bending rigidity is 100000 to 4000000 N · mm ² . By setting the bending rigidity of the peeling unit 102 to 1000 N · mm ² / mm or more, it is possible to prevent the reinforcing plate 3B from being bent and held by the peeling unit 102 from being bent. Further, by setting the bending rigidity of the peeling unit 102 to 40000 N · mm ² / mm or less, the reinforcing plate 3B sucked and held by the peeling unit 102 can be appropriately bent and deformed.

  The first flexible plate 112 and the second flexible plate 118 are resin members having a Young's modulus of 10 MPa or less. For example, polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, polyacetal (POM) ) A resin member such as resin.

[Movable device]
A plurality of disc-shaped movable bodies 104 shown in FIG. 10 are fixed to the lower surface of the first flexible plate 112 in a grid pattern as shown in FIG. These movable bodies 104 are fixed to the first flexible plate 112 by fastening members such as bolts, but may be bonded and fixed instead of the bolts. These movable bodies 104 are moved up and down independently by a driving device 108 that is driven and controlled by the controller 110.

  That is, the controller 110 controls the driving device 108 to move the movable body 104 located on the corner 6B side in the peeling progress direction indicated by the arrow A from the movable body 104 located on the corner 6A side of the stacked body 6 in FIG. Are sequentially moved downward. By this operation, as shown in the longitudinal cross-sectional view of FIG. 13, the peeling starts from the peeling start portion SP formed in the resin layer 4 </ b> B between the substrate 2 </ b> B and the reinforcing plate 3 </ b> B of the laminate 6. In addition, peeling start part SP is formed before peeling by the above-mentioned peeling start part preparation apparatus 10. FIG.

  The driving device 108 is constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 130 of the ball screw mechanism. A movable body 104 is provided at the tip of the rod 130 via a ball joint 132. Thereby, the movable body 104 can be tilted following the bending deformation of the peeling unit 102 as shown in FIG. Therefore, the peeling unit 102 can be bent and deformed from the corner 6A toward the corner 6B without applying an excessive force to the peeling unit 102 (see FIG. 11). The driving device 108 is not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

  The plurality of driving devices 108 are preferably attached to a vertically movable frame 134 via cushion members 136. The cushion member 136 is elastically deformed so as to follow the bending deformation of the peeling unit 102. As a result, the rod 130 tilts with respect to the frame 134.

  The frame 134 is moved downward by a drive unit (not shown) when the peeled reinforcing plate 3B is removed from the peeling unit 102.

  The controller 110 is configured as a computer including a storage medium such as a CPU, a ROM, and a RAM. The controller 110 controls the plurality of driving devices 108 for each driving device 108 by causing the CPU to execute a program recorded on the recording medium, thereby controlling the vertical movement of the plurality of movable bodies 104.

  DESCRIPTION OF SYMBOLS 1 ... Laminated body, 2, 2A, 2B ... Board | substrate, 3, 3A, 3B ... Reinforcement board, 4 ... Resin layer, 6 ... Laminated body, 7 ... Functional layer, 10 ... Stripping start part production apparatus, 12 ... Table, 14 DESCRIPTION OF SYMBOLS ... Holder, 16 ... Table drive unit, 18 ... Knife drive unit, 20 ... Position adjustment unit, 22 ... Load cell, 24 ... Support member, 26 ... Laser displacement meter, 28 ... Plate thickness detector, 30 ... Control part, 32 ... Table support frame, 34 ... linear motion device, 36 ... guide rail, 38 ... guide block, 40 ... frame, 42 ... first stopper, 44 ... compression spring, 46 ... second stopper, 50 ... main body frame, 52 ... Rail, 54 ... Slider, 56 ... Ball screw, 58 ... Motor, 60 ... Body frame, 62 ... Rail, 64 ... Slider, 66 ... Ball screw, 68 ... Motor, 70 ... Body frame, 72 ... Ray , 74 ... slider, 76 ... ball screw, 78 ... motor, 80 ... mount, 100 ... peeling device, 102 ... peeling unit, 104 ... movable body, 106 ... movable device, 108 ... drive device, 110 ... controller, 112 ... first 114 ... Adsorption part, 116 ... Double-sided adhesive tape, 118 ... Second flexible plate, 120 ... Breathable sheet, 122 ... Seal frame member, 124 ... Double-sided adhesive sheet, 126 ... Groove, 128 ... through hole, 130 ... rod, 132 ... ball joint, 134 ... frame, 136 ... cushion member

Claims (11)

A first substrate having a first main surface and a second main surface, which are product substrates, and a second substrate having a first main surface and a second main surface, which are reinforcing plates, are adsorbed layers. In the peel start part creating device for creating a peel start part in the laminate, by inserting a knife into the adsorption layer, for the laminate bonded in a peelable manner via
A moving part that relatively advances or retracts the knife and the laminate in a direction parallel to the second main surface of the second substrate;
A detection unit that detects which of the suction layer and the second substrate the blade edge of the knife has contacted;
A position detector that detects a positional relationship between the stacked body and the knife in a direction perpendicular to the second main surface of the second substrate;
A position adjusting unit that moves relative to a direction perpendicular to the second main surface of the second substrate and adjusts the position of the stacked body and the knife;
A controller that controls the moving unit, the detecting unit, the position detecting unit, and the position adjusting unit;
The control unit detects a position of the laminate and the knife by the position detection unit, and
Based on the detection result of the position detection unit, the position adjustment unit moves the knife to the second substrate side by a predetermined distance from a position facing the adsorption layer of the stacked body. A first position adjustment process for adjusting the position of
Advance processing for relatively advancing the knife and the laminate by the moving unit;
A detection process in which the detection unit detects which of the suction layer and the second substrate the blade edge of the knife has contacted;
When it is detected that the cutting edge of the knife is in contact with the second substrate,
A retreat process for retreating the stacked body and the knife relative to each other by the moving part; Performing the position adjustment process, and repeating the forward process, the detection process, the backward process, and the second position adjustment process in this order until it is detected that the knife has contacted the adsorption layer,
When it is detected that the blade edge of the knife is in contact with the adsorption layer, a continuous advance process is performed in which the knife and the laminated body are continuously advanced relatively by the moving unit.
Peel start part creation device.   The peeling start part creation apparatus according to claim 1, wherein the detection part is a displacement meter or a load cell.   The peeling start part creation apparatus according to claim 1 or 2, wherein the predetermined distance is equal to or greater than a maximum error in the position detection unit and the position adjustment unit. The peeling start part creation apparatus according to any one of claims 1 to 3 , wherein the adsorption layer has a thickness of 1 µm to 50 µm. The control unit stores position information in which the blade edge of the knife is in contact with either the adsorption layer or the second substrate. Based on the position information, the control unit stores the position information in the second and subsequent forward processing. The peeling start part preparation apparatus as described in any one of Claim 1 to 4 which adjusts the advance speed of a knife. A first substrate having a first main surface and a second main surface, which are product substrates, and a second substrate having a first main surface and a second main surface, which are reinforcing plates, are adsorbed layers. In the peel start part creating method for creating a peel start part in the laminate, by inserting a knife into the adsorption layer, for the laminate bonded in a peelable manner via
A position detecting step of detecting a positional relationship between the stacked body and the knife in a direction perpendicular to the second main surface of the second substrate;
Based on the detection result of the position detecting step, the laminated body and the knife are moved relative to each other in a direction perpendicular to the second main surface of the second substrate, and the position of the knife is changed to the laminated body. A first position adjusting step for adjusting the position of the knife on the second substrate side by a predetermined distance from a position facing the adsorption layer;
An advancing step of relatively advancing the knife and the laminate in a direction parallel to the second main surface of the second substrate;
A detection step of detecting which of the suction layer and the second substrate the blade edge of the knife has contacted;
When it is detected that the blade edge of the knife is in contact with the second substrate, the retreat is performed so that the stacked body and the knife are relatively retreated in a direction parallel to the second main surface of the second substrate. Moving the step and the laminate and the knife relative to each other in a direction perpendicular to the second main surface of the second substrate, and moving the adsorption layer toward the adsorption layer by a distance equal to or less than the thickness of the adsorption layer. A second position adjusting step for adjusting the position of the knife, and the forward step, the detecting step, the reverse step, and the second position until it is detected that the knife has contacted the adsorption layer. Repeating the adjustment steps in this order;
If it is detected that the blade edge of the knife is in contact with the adsorption layer, a continuous advance step for relatively continuously advancing the knife and the laminate;
The peeling start part production method which has this. The peeling start part preparation method according to claim 6 , wherein the detecting step includes detecting with a displacement meter or a load cell. The peeling start part creation method according to claim 6 or 7 , wherein the predetermined distance is equal to or greater than a maximum error in the position detection step and the first position adjustment step. The method for creating a peeling start portion according to any one of claims 6 to 8 , wherein the adsorption layer has a thickness of 1 µm to 50 µm. A storage step for storing position information in which the blade edge of the knife is in contact with either the adsorption layer or the second substrate; The peeling start part production | generation method as described in any one of Claim 6 to 9 including adjusting advancing speed. A first substrate having a first main surface and a second main surface, which are product substrates, and a second substrate having a first main surface and a second main surface, which are reinforcing plates, are adsorbed layers. With respect to the laminate in which the second main surface of the first substrate and the first main surface of the second substrate are detachably bonded to each other, the first substrate of the first substrate In a method for manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on a main surface; and a separation step of separating the first substrate and the second substrate on which the functional layer is formed.
The separation step sequentially separates the first substrate and the second substrate from the separation start portion creation step of creating a separation start portion by inserting a knife into the adsorption layer, and starting from the separation start portion. A peeling step,
The peeling start part creation process
A position detecting step of detecting a positional relationship between the stacked body and the knife in a direction perpendicular to the second main surface of the second substrate;
Based on the detection result of the position detecting step, the laminated body and the knife are moved relative to each other in a direction perpendicular to the second main surface of the second substrate, and the position of the knife is changed to the laminated body. A first position adjusting step for adjusting the position of the knife on the second substrate side by a predetermined distance from a position facing the adsorption layer;
An advancing step of relatively advancing the knife and the laminate in a direction parallel to the second main surface of the second substrate;
A detection step of detecting which of the suction layer and the second substrate the blade edge of the knife has contacted;
When it is detected that the blade edge of the knife is in contact with the second substrate, the retreat is performed so that the stacked body and the knife are relatively retreated in a direction parallel to the second main surface of the second substrate. Moving the step and the laminate and the knife relative to each other in a direction perpendicular to the second main surface of the second substrate, and moving the adsorption layer toward the adsorption layer by a distance equal to or less than the thickness of the adsorption layer. A second position adjusting step for adjusting the position of the knife, and the forward step, the detecting step, the reverse step, and the second position until it is detected that the knife has contacted the adsorption layer. Repeating the adjustment steps in this order;
If it is detected that the blade edge of the knife is in contact with the adsorption layer, a continuous advance step for relatively continuously advancing the knife and the laminate;
A method of manufacturing an electronic device comprising:

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