CN105895558B - Peeling start part manufacturing device, manufacturing method thereof, and manufacturing method of electronic device - Google Patents

Abstract

The invention provides a peeling start part manufacturing device and a peeling start part manufacturing method capable of inserting a knife with good precision, and a manufacturing method of an electronic device. A peeling start portion forming apparatus for forming a peeling start portion in a laminate formed by bonding a substrate and a reinforcing plate to each other so as to be peelable with each other with a resin layer interposed therebetween, detects a positional relationship between a blade and the resin layer, moves the blade in a vertical direction based on a result of the detection, moves the blade a predetermined distance from a position of the resin layer toward the reinforcing plate in the vertical direction, advances the blade in a horizontal direction with respect to the laminate, detects which of the reinforcing plate and the resin layer the blade has come into contact with, retracts the blade in the horizontal direction with respect to the laminate when it is determined that the blade is not a resin layer in the detection step, moves the blade in the vertical direction toward the substrate side, repeats the steps until the resin layer is detected, and continues to advance the blade in the horizontal direction with respect to the laminate when it is determined that the blade is a resin layer in the detection step, thereby forming a peeling start portion.

Description

Peeling start part manufacturing device, manufacturing method thereof, and manufacturing method of electronic device

Technical Field

The invention relates to a peeling start part manufacturing apparatus, a peeling start part manufacturing method, and an electronic device manufacturing method.

Background

With the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin film secondary batteries, it is desired to reduce the thickness of substrates made of glass, resin, metal, and the like, which are used for these electronic devices.

However, when the thickness of the substrate is reduced, the handling property of the substrate is deteriorated, and it is difficult to form a functional layer (for example, a Thin Film Transistor (TFT), a Color Filter (CF), or the like) for an electronic device on the substrate.

Therefore, the following methods have been proposed: a substrate is reinforced by bonding a reinforcing plate to the substrate via a resin layer, and a functional layer is formed on the reinforced substrate (see, for example, patent document 1). In this method, a laminate is formed by bonding a reinforcing plate to a substrate, and a functional layer is formed on the substrate after the laminate is formed. After the functional layer is formed, the reinforcing plate is peeled off from the substrate.

The reinforcement plate is peeled off by, for example, flexibly deforming the reinforcement plate, the substrate, or both of them from one end of two corners located on a diagonal line toward the other end. At this time, a peeling start portion (a gap which becomes a starting point of peeling) is artificially created in order to facilitate peeling. The peeling start portion is produced by inserting a knife into the resin layer.

Patent document 1: international publication No. 2010/090147

Disclosure of Invention

Problems to be solved by the invention

In the production of the peeling starting portion, it is necessary to insert the cutting edge of the knife into the resin layer with high accuracy. In order to insert the knife with good precision, the following operations need to be performed: the positional relationship between the resin layer and the cutting edge of the blade is detected, and the position between the laminate and the blade is adjusted so that the cutting edge of the blade faces the resin layer based on the detection result, and the blade is inserted into the resin layer.

However, due to the relationship between the accuracy of detecting the position between the edge of the blade and the resin layer and the accuracy of adjusting the position between the laminate and the blade, the position of the blade may not be adjusted to the resin layer but may be adjusted to a position in contact with the substrate to be a product. In this state, when the blade is moved toward the resin layer, the blade may come into contact with the substrate, and the blade may damage the substrate as a product. In particular, if the resin layer is thin, this possibility is remarkable.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a peeling start portion forming apparatus and a peeling start portion forming method, which can insert a blade into a resin layer with high accuracy, and a method for manufacturing an electronic device.

Means for solving the problems

The invention according to claim 1 provides a peeling start portion creation device for creating a peeling start portion in a laminate in which a 1 st substrate having a 1 st main surface and a 2 nd substrate having a 1 st main surface and a 2 nd main surface are bonded to each other so as to be peelable with each other with an adsorption layer interposed therebetween, by inserting a knife into the adsorption layer, the peeling start portion creation device including: a moving section for relatively advancing or retreating the blade and the stacked body in a direction parallel to the 2 nd main surface of the 2 nd substrate; a detection unit that detects which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has made contact with; a position detecting unit for detecting a positional relationship between the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate; a position adjusting unit for adjusting a position between the laminate and the blade by relatively moving the laminate and/or the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate; and a control unit for controlling the moving unit, the detecting unit, the position detecting unit, and the position adjusting unit, wherein the control unit executes: a position detection process of detecting a position between the stacked body and the knife by the position detection unit; a 1 st position adjustment process of adjusting a position of the blade by a predetermined distance from a position facing the adsorption layer of the laminate toward the 2 nd substrate side by the position adjustment unit based on a detection result of the position detection unit; an advancing process of relatively advancing the blade and the laminated body by the moving section; and a detection process of detecting, by the detection unit, which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has made contact with, the control unit further executing a process of, that is, when the contact between the cutting edge of the blade and the 2 nd substrate is detected, a retreating process of relatively retreating the laminated body and the blade by the moving unit and a 2 nd position adjusting process of adjusting the position of the blade by a distance equal to or less than the thickness of the adsorption layer toward the adsorption layer side by the position adjusting unit are performed, repeatedly performing the forward processing, the detection processing, the backward processing, and the 2 nd position adjustment processing in this order until the contact of the blade with the adsorption layer is detected, when the contact between the cutting edge of the blade and the adsorption layer is detected, a relative movement between the blade and the laminated body is continued by the moving unit.

The invention according to claim 2 provides a method of manufacturing a peeling start portion in a laminate in which a 1 st substrate having a 1 st main surface and a 2 nd substrate having a 1 st main surface and a 2 nd main surface are bonded to each other so as to be peelable with each other with an adsorption layer interposed therebetween, the method including the steps of: a position detecting step of detecting a positional relationship between the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate; a 1 st position adjustment step of relatively moving the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate based on a detection result of the position detection step, and adjusting a position of the blade by a predetermined distance from a position facing the adsorption layer of the laminate to the 2 nd substrate side; an advancing step of relatively advancing the blade and the laminated body in a direction parallel to the 2 nd main surface of the 2 nd substrate; and a detection step of detecting which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has come into contact with, the peeling starting part production method further includes a step of, when it is detected that the cutting edge of the blade has come into contact with the 2 nd substrate, executing a retreating step of retreating the laminate and the blade relative to each other in a direction parallel to the 2 nd main surface of the 2 nd substrate, and a 2 nd position adjusting step of relatively moving the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate to adjust the position of the blade by a distance equal to or less than the thickness of the adsorption layer toward the adsorption layer side, and repeating the steps in the order of the advancing step, the detection step, the retreating step, and the 2 nd position adjusting step until it is detected that the blade has come into contact with the adsorption layer, and a continuous advancing step of continuously advancing the blade and the laminated body relative to each other when the contact between the blade edge of the blade and the adsorption layer is detected.

The 3 rd technical means provides a method for manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on the 1 st main surface of the 1 st substrate in a laminate in which the 1 st substrate having the 1 st main surface and the 2 nd substrate having the 1 st main surface and the 2 nd main surface are bonded to each other so as to be peelable with each other with an adsorption layer interposed therebetween; and a separation step of separating the 1 st substrate and the 2 nd substrate on which the functional layer is formed, wherein the separation step includes: a peeling start portion production step of inserting a knife into the adsorption layer to produce a peeling start portion; and a peeling step of sequentially peeling the 1 st substrate and the 2 nd substrate from each other with the peeling start portion as a starting point, the peeling start portion producing step including the steps of: a position detecting step of detecting a positional relationship between the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate; a 1 st position adjustment step of relatively moving the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate based on a detection result of the position detection step, and adjusting a position of the blade by a predetermined distance from a position facing the adsorption layer of the laminate to the 2 nd substrate side; an advancing step of relatively advancing the blade and the laminated body in a direction parallel to the 2 nd main surface of the 2 nd substrate; and a detection step of detecting which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has come into contact with, wherein the peeling start part producing step further executes a retreating step of retreating the laminate and the blade relatively in a direction parallel to the 2 nd main surface of the 2 nd substrate and a 2 nd position adjusting step of adjusting the position of the blade to a distance equal to or less than the thickness of the adsorption layer by relatively moving the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate, when it is detected that the cutting edge of the blade has come into contact with the 2 nd substrate, and repeatedly executes the steps in the order of the advancing step, the detection step, the retreating step, and the 2 nd position adjusting step until it is detected that the blade has come into contact with the adsorption layer, and a continuous advancing step of continuously advancing the blade and the laminated body relative to each other when the contact between the blade edge of the blade and the adsorption layer is detected.

ADVANTAGEOUS EFFECTS OF INVENTION

With the peeling start part forming apparatus, the peeling start part forming method, and the electronic device manufacturing method according to the present invention, the blade can be inserted into the resin layer with high accuracy.

Drawings

Fig. 1 is an enlarged side view of a main part showing an example of a laminate to be supplied to a manufacturing process of an electronic device.

Fig. 2 is an enlarged side view of a main part showing an example of a laminate produced in the middle of the LCD production process.

Fig. 3 is an explanatory diagram showing a structure of the peeling start portion creating device.

Fig. 4 is an explanatory diagram showing a configuration of a position detecting section for detecting a positional relationship between the knife and the laminate.

Fig. 5 is a flowchart showing steps of a method for forming a peeling start portion.

Fig. 6 (a) to 6 (D) are side views showing a part of the steps of the method for forming the peeling start portion.

Fig. 7 (a) to 7 (D) are side views showing a part of the steps of the method for forming the peeling start portion.

Fig. 8 (a) to 8 (C) are side views showing a part of the steps of the method for forming the peeling start portion.

Fig. 9 (a) to 9 (C) are plan views showing a part of the steps of the method for forming the peeling start portion.

FIG. 10 is a longitudinal sectional view showing the structure of the peeling apparatus.

Fig. 11 is a plan view of the flexible board schematically showing the arrangement positions of the plurality of movable bodies with respect to the peeling unit.

Fig. 12 (a) to 12 (C) are explanatory views showing the structure of the peeling means.

FIG. 13 is a longitudinal sectional view of a peeling apparatus for peeling the reinforcing plate from the laminate.

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The present invention is explained by the following preferred embodiments. Many modifications may be made by the method without departing from the scope of the present invention, and embodiments other than the present embodiment may be used. Accordingly, all changes that come within the scope of this invention are intended to be embraced therein.

In the drawings, the same reference numerals denote the same elements having the same functions. In the present specification, when a numerical range is expressed by "to", the numerical values of the upper limit and the lower limit expressed by "to" are also included in the numerical range.

The following describes a peeling start section forming apparatus, a peeling start section forming method, and an electronic device manufacturing method according to the present invention with reference to the drawings.

The electronic device refers to electronic components such as a display panel, a solar cell, or a thin film secondary battery. Examples of the Display Panel include a Liquid Crystal Display (LCD) Panel, a Plasma Display Panel (PDP), and an Organic EL Display (OELD) Panel.

Outline of manufacturing method of electronic device

An electronic device is manufactured by forming a functional layer (a Thin Film Transistor (TFT) or a Color Filter (CF) in the case of an LCD) for an electronic device on the 1 st main surface of a substrate made of glass, resin, metal, or the like.

Before forming the functional layer, a reinforcing plate is attached to the 2 nd main surface of the substrate via a resin layer to form a laminate. Thereafter, in the state of the laminate, a functional layer was formed on the 1 st main surface of the substrate. Then, after the functional layer is formed, the reinforcing plate is peeled off from the substrate.

That is, the method for manufacturing an electronic device includes: the method includes a functional layer forming step of forming a functional layer on the 1 st main surface of the substrate in a state of a laminate, and a separating step of separating the substrate on which the functional layer is formed from the reinforcing plate. The separation step includes: a peeling start portion production step of producing a peeling start portion by inserting a knife into the resin layer; and a peeling step of sequentially peeling the substrate and the reinforcing plate from each other with the peeling start portion as a starting point. In the separation step, the separation-starting-portion creating step employs the separation-starting-portion creating method and the separation-starting-portion creating apparatus of the present invention.

Laminated body

Fig. 1 is an enlarged side view of a main part showing an example of the laminate 1.

The laminate 1 includes a substrate 2 as a 1 st substrate, and a reinforcing plate 3 as a 2 nd substrate for reinforcing the substrate 2. A functional layer is formed on a substrate 2 as a 1 st substrate. The reinforcing plate 3 has a resin layer 4 as an adsorption layer on the 1 st main surface 3a (the surface facing the substrate 2), and the 2 nd main surface 2b of the substrate 2 (the surface opposite to the 1 st main surface 2a on which the functional layer is formed) is bonded to the resin layer 4. The substrate 2 is bonded to the reinforcing plate 3 in a peelable manner by van der waals force acting between the substrate and the resin layer 4 or adhesive force of the resin layer 4. The 2 nd main surface 3b (the surface opposite to the 1 st main surface 3a facing the substrate 2) of the reinforcing plate 3 is supported by a table (not shown) or the like.

Substrate

The substrate 2 constituting the 1 st substrate includes a 1 st main surface 2a and a 2 nd main surface 2 b. A functional layer is formed on the 1 st main surface 2a of the substrate 2. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these exemplified substrates, a glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small linear expansion coefficient, and therefore, is suitable as the substrate 2 for electronic devices. In addition, since the linear expansion coefficient is small, the glass substrate has an advantage that the pattern of the functional layer formed at a high temperature is less likely to shift during cooling. Here, the substrate 2 becomes a product substrate constituting a final product.

Examples of the glass substrate include alkali-free glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glass containing silicon oxide as a main component. The oxide glass is preferably a glass having a silicon oxide content of 40 to 90 mass% in terms of oxide.

As the glass of the glass substrate, a glass suitable for the type of the electronic device to be manufactured, or a glass suitable for the manufacturing process thereof is preferably selected and used. For example, the glass substrate for a liquid crystal panel is preferably glass (alkali-free glass) which does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is used as the substrate 2, the thickness of the substrate 2 is preferably set to 0.7mm or less, more preferably 0.3mm or less, and still more preferably 0.1mm or less for weight reduction and thinning of electronic devices. When the thickness of the substrate 2 is 0.3mm or less, good flexibility can be imparted to the glass substrate. When the thickness of the substrate 2 is 0.1mm or less, the glass substrate can be rolled up in a roll shape. From the viewpoint of manufacturing a glass substrate and the viewpoint of processing a glass substrate, the thickness of the substrate 2 is preferably 0.03mm or more.

In fig. 1, the substrate 2 is constituted by one substrate, but the substrate 2 may be constituted by a plurality of substrates. That is, the substrate 2 may be a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 becomes the thickness of the substrate 2.

Reinforcing plate

The reinforcing plate 3 constituting the 2 nd substrate includes a 1 st main surface 3a and a 2 nd main surface 3b, the substrate 2 is bonded to the 1 st main surface 3a side, and the 2 nd main surface 3b side is supported by a stage or the like. Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

The type of the reinforcing plate 3 is selected according to the type of the electronic device to be manufactured, the type of the substrate 2 to be used for the electronic device, and the like. If the reinforcing plate 3 and the substrate 2 are made of the same material, warpage and peeling due to a temperature change other than expected in the functional layer forming step can be reduced.

The difference (absolute value) in the average linear expansion coefficient between the reinforcing plate 3 and the substrate 2 is adjusted according to the size and shape of the substrate 2When set, the difference in the average linear expansion coefficients is preferably 35 × 10^-7Below/° c. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ℃ (JIS R3102: 1995).

The thickness of the reinforcing plate 3 is set to 0.7mm or less, and is set according to the type of the reinforcing plate 3, the type and thickness of the substrate 2 to be reinforced, and the like. The thickness of the reinforcing plate 3 may be larger than the thickness of the substrate 2 or smaller than the thickness of the substrate 2, but the thickness of the reinforcing plate 3 is preferably 0.4mm or more for reinforcing the substrate 2.

In the present embodiment, the reinforcing plate 3 is formed of one substrate, but the reinforcing plate 3 may be formed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 becomes the thickness of the reinforcing plate 3.

Resin layer

The resin layer 4 constituting the adsorption layer is provided on the 1 st main surface 3a of the reinforcing plate 3, and the reinforcing plate 3 and the substrate 2 are bonded together via the resin layer 4 so as to be peelable. In order to prevent the occurrence of unexpected peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling step, peeling is performed between the resin layer 4 of the laminate 1 and the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include acrylic resins, polyolefin resins, polyurethane resins, polyimide resins, silicone resins, and polyimide silicone resins. It is also possible to use several resins in combination. Among them, silicone resins and polyimide silicone resins are preferable from the viewpoint of heat resistance and releasability.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 μm to 50 μm, and more preferably set to 2 μm to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when air bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the air bubbles or the foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, setting the thickness of the resin layer 4 to 50 μm or less can shorten the time for forming the resin layer 4, and it is not necessary to excessively use the resin of the resin layer 4, which is economical.

In order to allow the reinforcing plate 3 to support the entire resin layer 4, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3. In order to bring the resin layer 4 into close contact with the entire substrate 2, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2.

In fig. 1, the resin layer 4 is formed of one layer, but the resin layer 4 may be formed of two or more layers. In this case, the total thickness of all layers constituting the resin layer 4 is the thickness of the resin layer 4. In this case, the types of resins constituting the respective layers may be different.

In this embodiment, the resin layer 4, which is an organic film, is used as the adsorption layer, and an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride, for example.

The metal silicide contains at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba, for example, and is preferably tungsten silicide.

The nitride contains at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba, for example, and is preferably aluminum nitride, titanium nitride, or silicon nitride.

The carbide contains at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, for example, and is preferably silicon carbide.

The carbonitride contains at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, for example, and is preferably silicon carbonitride.

The metal silicide, nitride, carbide, and carbonitride has a small difference in electronegativity between Si, N, or C contained in the material thereof and other elements contained in the material thereof, and polarization is small. Therefore, the reactivity between the inorganic film and water is low, and hydroxyl groups are difficult to be generated on the surface of the inorganic film. Therefore, when the substrate 2 is a glass substrate, the peelability between the inorganic film and the substrate 2 can be maintained well.

Laminate having functional layer formed thereon

A functional layer is formed on the 1 st main surface 2a of the substrate 2 of the laminate 1 through a functional layer forming step. As a method for forming the functional layer, a Vapor Deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method, or a sputtering method can be used. The functional layer is formed into a predetermined pattern by photolithography and etching.

Fig. 2 is an enlarged side view of a main part showing an example of the laminate 6 produced in the middle of the LCD production process.

The laminate 6 includes a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B, and is formed by laminating them in this order. The reinforcing plate 3A is bonded to the substrate 2A via the resin layer 4A in a releasable manner, and the reinforcing plate 3B is bonded to the substrate 2B via the resin layer 4B in a releasable manner. That is, the laminate 6 of fig. 2 corresponds to the laminate 1 shown in fig. 1, which is symmetrically arranged with the functional layer 7 interposed therebetween. Hereinafter, a laminate including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a 1 st laminate 1A, and a laminate including the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a 2 nd laminate 1B.

A Thin Film Transistor (TFT) is formed as the functional layer 7 on the 1 st main surface 2Aa of the substrate 2A of the 1 st stacked body 1A. A Color Filter (CF) is formed as the functional layer 7 on the 1 st main surface 2Ba of the substrate 2B of the 2 nd laminate 1B.

The 1 st laminate 1A and the 2 nd laminate 1B are integrated by overlapping the 1 st main surface 2Aa of the substrate 2A and the 1 st main surface 2Ba of the substrate 2B with each other. In this way, a laminate 6 having a structure in which the 1 st laminate 1A and the 2 nd laminate 1B are symmetrically arranged with the functional layer 7 interposed therebetween is produced.

The 2 nd main surface 2Ab of the substrate 2A and the 1 st main surface 3Aa of the reinforcing plate 3A are disposed at opposing positions, and the substrate 2A and the reinforcing plate 3A are bonded to each other via the resin layer 4A so as to be peelable. The 2 nd main surface 2Bb of the substrate 2B and the 1 st main surface 3Ba of the reinforcing plate 3B are disposed at opposing positions, and the substrate 2B and the reinforcing plate 3B are bonded to each other via the resin layer 4B so as to be peelable. The laminate 6 is produced by peeling the reinforcing plates 3A and 3B in a peeling step, and then attaching a polarizing plate, a backlight, and the like thereto, thereby producing an LCD as a product. In the peeling step, the 2 nd main surface 3Ab of the reinforcing plate 3A and/or the 2 nd main surface 3Bb of the reinforcing plate 3B are attracted by the flexible plate, and the reinforcing plate 3A and/or the reinforcing plate 3B are peeled from the laminate 6 by flexing the flexible plate.

Further, the laminated body 6 of fig. 2 has a structure including the reinforcing plate 3A and the reinforcing plate 3B, but the laminated body may have a structure including only one of the reinforcing plate 3A and the reinforcing plate 3B.

Peeling start part manufacturing device

Fig. 3 is an explanatory diagram for explaining the configuration of the peeling start part creation apparatus 10. Here, for convenience, a case where the peeling start portion is formed in the laminate 1 shown in fig. 1 will be described as an example.

The peeling start part creation device 10 includes: a table 12 for supporting the laminate 1; a holder 14 for holding the knife N; a table driving unit 16 for moving the table 12 in a horizontal direction (X-axis direction in fig. 3); a blade driving unit 18 for moving the blade N in the horizontal direction; a position adjustment unit 20 for adjusting the position of the knife N by moving the knife N in the vertical direction (Z-axis direction in fig. 3); a load sensor 22 as a detection unit for detecting which position (the resin layer 4 or the reinforcing plate 3) of the laminate 1 the cutting edge Na of the blade N is in contact with; a support member 24 for mounting the holder 14 and the load sensor 22; a laser displacement meter 26 for detecting the position of the cutting edge Na of the blade N in the height direction; a plate thickness detector 28 for detecting the plate thickness of the reinforcing plate 3 of the laminated body 1 supported by the table 12; and a control unit 30 that functions as a control unit for collectively controlling the overall operation.

The table 12 is horizontally disposed above the table support stand 32. The table 12 has an outer shape corresponding to the outer shape of the laminate 1 and can support substantially the entire surface of the laminate 1. The upper surface of the table 12 is a placement surface of the laminate 1 and is configured as a horizontal surface. The laminate 1 is placed on the upper surface (placement surface) of the table 12.

Further, a suction mechanism, not shown, is provided on the table 12. The laminate 1 placed on the table 12 is vacuum-sucked by the suction mechanism to the 2 nd main surface 3b of the reinforcing plate 3. Thereby, the laminate 1 placed on the stage 12 is sucked and held on the stage 12.

The blade N has a flat plate shape rectangular in plan view, and has a blade edge Na having an acute angle at a long side portion on one side. The thickness of the blade N is, for example, 50 to 600 μm.

The holder 14 detachably holds the blade N. The holder 14 holds, for example, both end portions of the knife N. The holder 14 is fixed to a linear motion device 34 provided on the upper surface of the support member 24. The linear motion device 34 includes a guide rail 36 fixed to the upper surface of the support member 24 and a guide block 38 engaged with the guide rail 36, and the guide block 38 is supported by the guide rail 36 so as to be slidable along the guide rail 36. The retainer 14 is fixed to the guide block 38. By sliding the guide block 38 along the guide rail 36, the holder 14 and the knife N held by the holder 14 can be slid along the guide rail 36.

A frame 40 is provided on the upper surface of the support member 24 at a position away from the holder 14 and opposite to the position of the stacked body 1. The frame 40 is provided with the load sensor 22 and the 1 st stopper 42. A compression spring 44 is installed between the holder 14 and the load sensor 22. The urging force of the compression spring 44 can be measured by the load cell 22. Further, the holder 14 is biased in the direction of the stack 1 by the compression spring 44.

Further, by measuring the pressing force of compression spring 44 by load sensor 22, it is possible to detect which of reinforcing plate 3 and resin layer 4 the cutting edge Na has come into contact with. This method will be described later.

A 2 nd stopper 46 is provided on the upper surface of the support member 24 on the side opposite to the compression spring 44 with respect to the holder 14. The 2 nd stopper 46 limits the movement of the holder 14 against the urging force of the compression spring 44 on the upper surface of the support member 24.

When the cutting edge Na receives a force (referred to herein as a reaction force) in a direction opposite to the biasing force of the compression spring 44, the holder 14 is moved in the direction opposite to the biasing force in accordance with the magnitude of the reaction force. In this case, the compression spring 44 is compressed. The 1 st stopper 42 limits the movement of the retainer 14 against the reaction force before the compression spring 44 is fully compressed. The operations of the 1 st stopper 42 and the compression spring 44 will be described later.

The table driving unit 16 constitutes a laminate moving section for horizontally moving the table support base 32 provided with the table 12 and horizontally moving the laminate 1 supported by the table 12. The table driving unit 16 includes: a main body frame 50; a rail 52 provided to the main body frame 50; a slide 54 slidable over the rail 52; a ball screw 56 disposed along the rail 52; and a motor 58 for rotating the ball screw 56. The main body frame 50 is horizontally disposed on a base (not shown). Here, the base refers to a place where the peeling start part creation device 10 is installed, and is typically, for example, a floor surface.

The rotational motion of the motor 58 is converted into a linear motion by the ball screw 56 to linearly move the slider 54 along the rail 52. As a result, the table support base 32 provided on the slider 54 and the table 12 provided on the table support base 32 are movable in the horizontal direction.

The knife driving unit 18 constitutes a knife moving section for moving the support member 24 on which the holder 14 holding the knife N is mounted in the horizontal direction, and as a result, the knife N is moved in the horizontal direction. The blade driving unit 18 is provided on a mount 80 provided on a base (not shown).

The blade drive unit 18 includes: a main body frame 60; a rail 62 provided to the main body frame 60; a slide 64 slidable over the rail 62; a ball screw 66 disposed along the rail 62; and a motor 68 for rotating the ball screw 66. The main body frame 60 is provided on a base (not shown) in a horizontal direction. The main body frame 60 is disposed horizontally to a mount 80 disposed horizontally on a base (not shown). The rotational motion of the motor 68 is converted into a linear motion by the ball screw 66 to linearly move the slider 64.

The support member 24 is disposed above the slider 64 by the position adjustment unit 20. Therefore, by moving the slider 64 in the horizontal direction, the position adjusting unit 20, the support member 24, the holder 14, and the knife N can be moved in the horizontal direction.

Here, since the rail 62 of the blade driving unit 18 is provided in parallel with the rail 52 of the table driving unit 16, the table 12 and the blade N can be linearly moved in the same direction (X-axis direction in fig. 3) on the horizontal plane. Therefore, the laminate 1 and the blade N can be relatively moved forward or backward in the horizontal direction.

Here, the forward movement means that the blade N and the laminate 1 are moved to be close to each other, and the backward movement means that the blade N and the laminate 1 are moved to be away from each other.

In the embodiment, the moving section is composed of a laminate moving section (table driving unit 16) and a blade moving section (blade driving unit 18). The blade N and the stacked body 1 are relatively moved forward or backward in the horizontal direction by the moving section. The structure is not particularly limited as long as the blade N and the stacked body 1 can be relatively moved forward or backward in the horizontal direction. Here, the horizontal direction is the X-axis direction in fig. 3, and means a direction parallel to the 2 nd main surface 3b of the reinforcing plate 3 as the 2 nd substrate.

The position adjustment unit 20 constitutes a position adjustment portion for moving the holder 14 holding the blade N in the vertical direction and moving the blade N in the vertical direction. The position adjusting unit 20 is disposed above the slider 64 of the blade driving unit 18.

The position adjustment unit 20 includes: a main body frame 70; a rail 72 provided to the main body frame 70; a slide 74 slidable over the rail 72; a ball screw 76 disposed along the rail 72; and a motor 78 for rotating the ball screw 76. The main body frame 70 is provided in a vertically standing manner above the slider 64 of the blade driving unit 18. The rotational motion of the motor 78 is converted into a linear motion by the ball screw 76 to linearly move the slider 74.

The support member 24 is provided to the slider 74 of the position adjustment unit 20. Therefore, by moving the slider 74 in the vertical direction, the support member 24, the holder 14, and the knife N can be moved in the vertical direction.

In the embodiment, the position adjusting unit 20 constitutes a position adjusting unit. The position between the blade N and the laminate 1 is adjusted by moving the blade N in the vertical direction with respect to the laminate 1 by the position adjusting portion. The vertical direction is the Z-axis direction in fig. 3, and is a direction perpendicular to the 2 nd main surface 3b of the reinforcing plate 3 as the 2 nd substrate.

In the embodiment, a known laser displacement meter 26 is provided on a base (not shown) via a bracket (not shown). The laser displacement meter 26 emits laser light as detection light in the vertical direction, and detects the distance to the surface of the object irradiated with the laser light. The displacement amount of the object displaced from the reference plane set as the horizontal plane is detected, and the distance from the reference plane to the surface of the object is detected.

The known thickness detector 28 is provided on a base (not shown) via a bracket (not shown), and emits the inspection light upward in the vertical direction. The thickness detector 28 detects the thickness of the reinforcing plate 3 by, for example, spectroscopic interference. When the plate thickness detector 28 by the spectroscopic interference method is used, inspection light is irradiated from a light source toward the laminate 1, the interference light reflected by the laminate 1 is dispersed by a spectroscope, the dispersed light is received by a light receiver, and the received light waveform is analyzed to calculate the plate thickness of the reinforcing plate 3. The inspection light has a wavelength of a predetermined width, and when the waveform of the reception light is analyzed, a change in intensity of the inspection light with respect to the wavelength is analyzed. When the plate thickness meter 28 by the spectroscopic interference method is used, the reinforcing plate 3 constituting the laminate 1 is preferably a member having light transmittance.

Next, a position detection method for detecting the positional relationship between the laminate 1 and the blade N by using the laser displacement meter 26 and the sheet thickness detector 28 will be described with reference to fig. 4. Fig. 4 is an explanatory diagram showing a configuration of a position detecting unit for detecting a positional relationship between the knife and the laminate. In the embodiment, the laser displacement meter 26 and the sheet thickness detector 28 constitute a position detection unit. However, the position detecting section is not particularly limited as long as the positional relationship between the blade and the laminate can be detected.

By moving the blade N to the installation position of the laser displacement gauge 26, the position in the height direction of the blade edge Na, that is, the distance L1 in the vertical direction from the reference plane of the blade edge Na can be detected by irradiating the blade edge Na with laser light.

By moving the laminate 1 supported by the stage 12 to the installation position (detection position) of the laser displacement meter 26, the 2 nd main surface 3b of the reinforcing plate 3 is irradiated with laser light, and the position in the height direction of the 2 nd main surface 3b of the reinforcing plate 3, that is, the distance L2 from the 2 nd main surface 3b to the reference plane in the vertical direction is detected.

By moving the laminated body 1 supported by the table 12 to the installation position of the plate thickness detector 28 (plate thickness detection position), the inspection light is emitted toward the 2 nd main surface 3b of the reinforcing plate 3, and the plate thickness of the reinforcing plate 3 is detected.

Further, since the reinforcing plate 3 has the resin layer 4 on the first main surface 3a of fig. 1, the plate thickness T1 of the reinforcing plate 3 and the plate thickness T2 of the reinforcing plate 3 including the resin layer 4 (the plate thickness of the reinforcing plate 3 + the thickness of the resin layer 4) are detected as the plate thickness of the reinforcing plate 3.

The positional relationship between the laminate 1 and the blade N, that is, the distance H (also referred to as an offset amount) between the cutting edge Na of the blade N and the predetermined blade insertion position is detected from the acquired distance L1, distance L2, and plate thicknesses T1, T2 of the reinforcing plate 3.

Since the resin layer 4 is provided on the reinforcing plate 3 as described above, the average value [ (T1+ T2)/2] of the plate thickness T1 of the reinforcing plate 3 and the plate thickness T2 including the resin layer 4 and the reinforcing plate 3 is defined as the plate thickness of the reinforcing plate 3. Therefore, the distance H can be obtained by H ═ L2+ [ (T1+ T2)/2] } -L1. Since the distance H is determined by the average value [ (T1+ T2)/2] of the thickness T1 of the reinforcing plate 3 and the thickness T2 including the resin layer 4 and the reinforcing plate 3, the predetermined position for inserting the knife is set at the center in the thickness direction of the resin layer 4.

The control unit 30 performs various arithmetic processes while controlling the overall operation of the peeling start section creation device 10. The control Unit 30 is constituted by a computer including a recording medium such as a ROM (Read Only Memory) or a RAM (Random access Memory), a CPU (Central Processing Unit), and the like. The control section 30 executes a predetermined control program to execute various processes. For example, the movement of the table 12 is controlled by controlling the driving of the table driving unit 16, and the movement of the knife N is controlled by controlling the driving of the knife driving unit 18. Further, the positional relationship between the predetermined blade insertion position and the cutting edge Na of the blade N is detected based on the detection results of the laser displacement meter 26 and the plate thickness detector 28, and the position of the blade N with respect to the laminated body 1 is adjusted by controlling the driving of the position adjusting means 20 based on the detection results.

Method for manufacturing peeling-off start part

A method of forming a peeling start portion by the peeling start portion forming apparatus 10 will be described with reference to fig. 3 to 8. Fig. 5 is a flowchart showing steps of a method for forming a peeling start portion, and fig. 6 to 8 are explanatory views showing a part of the steps of the method for forming a peeling start portion.

In the embodiment, the control unit 30 performs the peeling start portion creation method (fig. 3) by the peeling start portion creation device 10 by collectively controlling the operations of the table drive unit 16, the blade drive unit 18, the laser displacement meter 26, the sheet thickness detector 28, and the position adjustment unit 20.

First, as shown in the flowchart of fig. 5, the control unit 30 executes a position detection step as position detection processing (step S110). In the position detection step, the control unit 30 drives the table drive unit 16, the blade drive unit 18, the laser displacement meter 26, and the plate thickness detector 28, and the control unit 30 detects the positional relationship between the multilayer body 1 and the blade N based on the acquired information. That is, the distance H (offset amount) between the predetermined tool insertion position and the tool edge Na is detected (fig. 4 and fig. 6 a).

Next, as shown in the flowchart of fig. 5, the control unit 30 executes a 1 st position adjustment step as a 1 st position adjustment process (step S120). In the 1 st position adjustment step, first, the control unit 30 drives the position adjustment means 20 based on the detection result of the detected distance H (offset amount) to adjust the position of the blade N to a position facing the resin layer 4 of the laminate 1 ((B) of fig. 6). That is, the blade N is moved in the vertical direction so that the cutting edge Na of the blade N is positioned at the same height as the intended position for insertion of the blade. The fact that the cutting edge Na of the blade N is located at the same height as the intended position for insertion of the blade means that the distance H is 0.

Next, in the 1 st position adjustment step, the control unit 30 drives the position adjustment means 20 to adjust the position of the blade N by a predetermined distance toward the reinforcing plate 3 (fig. 6 (C)). That is, the blade N is moved in the vertical direction so that the cutting edge Na of the blade N is positioned closer to the reinforcing plate 3 than the position where the blade is to be inserted. In fig. 6, although the position adjustment is performed in fig. 6 (B) for convenience of explanation, the position adjustment may be performed directly from fig. 6 (a) to fig. 6 (C) without fig. 6 (B).

That is, the operation of adjusting the position of the blade N from the position facing the resin layer 4 to the reinforcing plate 3 side by a predetermined distance in the 1 st position adjustment step includes the following two cases: (1) adjusting the position of the blade N to a position facing the resin layer 4, and then adjusting the position of the blade N to a predetermined distance toward the reinforcing plate 3 (in the case of performing position adjustment in the order of fig. 6 (a), 6 (B), and 6 (C)); and (2) determining a position facing the resin layer 4 based on the detection result, and determining a distance moved by a predetermined distance from the position, thereby adjusting the position of the blade N so that the blade N is directly positioned on the reinforcing plate 3 side, without adjusting the position of the blade N to a position facing the resin layer 4 (in the case of performing the position adjustment in the order of fig. 6a and 6C).

As shown in fig. 6 (a), in the position detection step, the distance H is detected by the laser displacement meter 26 and the sheet thickness detector 28. However, even if the accuracy of position detection is improved, a detection error within a certain range is included in the position detection. As shown in fig. 6 (B), the blade N is moved in the vertical direction to a position where the distance H becomes 0. However, even if the accuracy of the position adjustment unit 20 is improved, a positioning error within a certain range is included in the position adjustment. Therefore, these errors may cause the position of the cutting edge Na of the blade N not to reach the same height as the position of the center in the thickness direction of the resin layer 4, which is the intended position for blade insertion. For example, the following also occurs: at the time (B) of fig. 6, the position of the cutting edge Na of the blade N is the same height as the position of the substrate 2.

In the 1 st position adjustment step of the embodiment, the position of the blade N is adjusted to a position facing the resin layer 4 of the laminate 1, and thereafter, the position of the blade N is adjusted to a predetermined distance toward the reinforcing plate 3. By performing the 1 st position adjustment step, in the subsequent advancing step, the blade N can be prevented from coming into contact with the substrate 2 when advancing the blade N toward the stacked body 1.

In particular, in consideration of both the detection error of the position detecting unit and the positioning error of the position adjusting unit, it is preferable to set the predetermined distance to be equal to or more than the maximum error amount. By moving the blade N to the reinforcing plate 3 side by a distance larger than the maximum error amount, the contact of the blade edge Na of the blade N with the substrate 2 in the advancing step can be more reliably avoided.

Next, a description will be given by taking specific numerical values. For example, the thickness of the resin layer 4 is set to 2 μm, and the maximum error between the detection error of the position detecting unit and the positioning error of the position adjusting unit is set to ± 2 μm. First, the knife insertion predetermined position was a position of 1 μm which was a position of the center in the thickness direction of the resin layer 4.

Here, the maximum error between the position detecting unit and the position adjusting unit is +2 μm (the vertical upward direction is defined as +). Even if the position of the cutting edge Na is adjusted to the position where the cutting edge is to be inserted, the cutting edge Na is adjusted to a position facing the substrate 2 across the thickness of the resin layer 4 due to the influence of the error.

Therefore, by moving the cutting edge Na in the vertical direction to the reinforcing plate 3 side by 2 μm or more of the maximum error amount, it is possible to avoid the contact between the substrate 2 and the cutting edge Na in the forward step.

Next, as shown in the flowchart of fig. 5, the control unit 30 executes a forward step as forward processing (step S130). In the advancing step, the control unit 30 drives the table driving unit 16 and/or the blade driving unit 18 constituting the moving unit to relatively advance the blade N and the stacked body 1 in the horizontal direction ((D) of fig. 6). The blade N and the laminate 1 are relatively moved by the table driving means 16 and/or the blade driving means 18 until the blade edge Na comes into contact with one of the reinforcing plate 3 and the resin layer 4 of the laminate 1.

In the advancing step, after the cutting edge Na comes into contact with the reinforcing plate 3 or the resin layer 4 of the laminate 1, the table driving means 16 and/or the blade driving means 18 are also driven to advance the blade N and/or the laminate 1 by a predetermined distance (for example, 1mm) (fig. 7 (a)). At this time, the retainer 14 is not in contact with the 1 st stopper 42.

Next, as shown in the flowchart of fig. 5, the control section 30 executes a detection step as a detection process (step S140). In the detection step, the control unit 30 detects the pressing force from the load sensor 22, and detects which of the reinforcing plate 3 and the resin layer 4 the cutting edge Na has come into contact with, based on a change in the pressing force.

First, the case where the cutting edge Na is in contact with the reinforcing plate 3 will be described. As shown in fig. 6 (D), the pressing force of the load sensor 22 increases from the time when the cutting edge Na contacts the reinforcing plate 3. This is because the cutting edge Na receives a reaction force from the reinforcing plate 3 to further compress the compression spring 44.

As shown in fig. 7 (a), when the blade N and/or the laminate 1 is further advanced by a predetermined distance, the pressing force of the load sensor 22 further increases. This is because the position of the laminate 1 is fixed and the reinforcing plate 3 is harder than the resin layer 4, and therefore, when the blade N is moved forward, the reaction force applied to the blade edge Na increases, and the compression spring 44 is compressed.

That is, when the cutting edge Na is in contact with the reinforcing plate 3, the pressing force detected by the load sensor 22 is always increased, and therefore, it can be detected that the cutting edge Na is in contact with the reinforcing plate 3.

Next, as shown in the flowchart of fig. 5, when it is determined in the detection step (step S140) that the resin layer 4 is not in contact with the cutting edge Na (no in this case), the control unit 30 executes a retreating step as a retreating process (step S150). In the retreating step, the control unit 30 drives the table driving unit 16 and/or the blade driving unit 18 constituting the moving unit to relatively retreat the blade N and the stacked body 1 in the horizontal direction ((B) of fig. 7). The blade N and the laminate 1 are relatively moved by the table driving unit 16 and/or the blade driving unit 18 until the blade edge Na is separated from the reinforcing plate 3 of the laminate 1.

As shown in the flowchart of fig. 5, when the reverse step is executed (step S150), the control unit 30 next executes the 2 nd position adjustment step as the 2 nd position adjustment process (step S160). In the 2 nd position adjustment step, the control unit 30 drives the position adjustment unit 20 to adjust the position of the blade N to a distance equal to or less than the thickness of the resin layer 4 toward the substrate 2 side ((C) of fig. 7). That is, the blade N is moved in the vertical direction so that the cutting edge Na of the blade N moves toward the substrate 2 by a distance equal to or less than the thickness of the resin layer 4. By moving the cutting edge Na of the blade N by a distance equal to or less than the thickness of the resin layer 4, the position of the blade N can be prevented from being adjusted to the position of the substrate 2 beyond the resin layer 4.

Next, as shown in the flowchart of fig. 5, the control unit 30 repeatedly executes the forward step (step S130), the detection step (step S140), the backward step (step S150), and the 2 nd position adjustment step (step S160) in this order until the contact between the edge Na of the detected blade N and the resin layer 4 is detected.

Next, a case where the cutting edge Na is brought into contact with the resin layer 4 will be described. As described above, as shown in the flowchart of fig. 5, control unit 30 executes the forward step as the forward processing (step S130), and control unit 30 executes the detection step as the detection processing (step S140).

The control unit 30 drives the table drive unit 16 and/or the blade drive unit 18 constituting the moving unit to relatively advance the blade N and the stacked body 1 in the horizontal direction. In this case, the cutting edge Na contacts the resin layer 4 ((D) of fig. 7).

As shown in fig. 7 (D), the pressing force of the load sensor 22 increases at the time when the cutting edge Na contacts the resin layer 4, as described with reference to fig. 6 (D). This is because the cutting edge Na receives a reaction force from the resin layer 4 to compress the compression spring 44.

As shown in fig. 8 (a), when the blade N and/or the laminate 1 is further advanced by a predetermined distance, the pressing force of the load sensor 22 temporarily increases and then decreases. This is because the resin layer 4 is flexible although the position of the laminate 1 is fixed, and therefore the cutting edge Na travels through the resin layer 4 while peeling off the resin layer 4. Therefore, the reaction force to press the cutting edge Na is weakened, and the compressed compression spring 44 is expanded toward the stacked body 1. Therefore, the length of the compression spring 44 of fig. 8 (a) is longer than that of the compression spring 44 of fig. 7 (a). That is, as for the pressing force detected by the load sensor 22, it can be understood that the pressing force when the cutting edge Na is in contact with the resin layer 4 (fig. 8 a) is smaller than the pressing force when the cutting edge Na is in contact with the reinforcing plate 3 (fig. 7 a). Due to this difference in pressing force, it is possible to detect which of reinforcing plate 3 and resin layer 4 the cutting edge Na has made contact with.

In the embodiment, the method of detecting whether the cutting edge Na is in contact with the reinforcing plate 3 or the resin layer 4 using the load sensor 22 has been described, but the present invention is not limited thereto, and a displacement meter or the like may be used. In the case of using a displacement meter, for example, the distance between the holder 14 and the 1 st stopper 42 is measured. It is possible to determine which of the reinforcing plate 3 and the resin layer 4 the blade N has made contact with, based on a change in the distance.

Next, as shown in the flowchart of fig. 5, if it is determined in the detection step (step S140) that the cutting edge Na is in contact with the resin layer 4 (yes in this case), the control unit 30 executes a forward step as a forward process (step S170). In the further advancing step, the control unit 30 drives the table driving unit 16 and/or the blade driving unit 18 constituting the moving unit to relatively advance the blade N and the laminate 1 in the horizontal direction, thereby moving the blade edge Na in the resin layer 4 to a predetermined distance ((B) of fig. 8 and (C) of fig. 8).

As shown in fig. 8 (B), when the cutting edge Na is advanced in the resin layer 4, the reaction force applied to the cutting edge Na increases. As a result, the compression spring 44 is compressed, and the retainer 14 moves until it reaches the 1 st stopper 42. After the retainer 14 comes into contact with the 1 st stopper 42, the movement of the retainer 14 is restricted by the 1 st stopper 42.

Then, as shown in fig. 8 (C), the blade N and the stacked body 1 are relatively advanced further in the horizontal direction in a state where the holder 14 and the 1 st stopper 42 are in contact with each other. Since the movement of the holder 14 holding the blade N is restricted by the 1 st stopper 42, the blade edge Na can be made to travel in the resin layer 4 against the reaction force.

As shown in fig. 9 a to 9C, the not-shown moving portions (table driving means and blade driving means) are driven to relatively advance the blade N and the laminate 1 in the direction parallel to the 2 nd main surface of the reinforcing plate (fig. 9 a). Next, the cutting edge Na is advanced in the resin layer 4 by a predetermined distance (fig. 9B). Finally, the peeling start portion SP is formed by relatively retreating the blade N and the laminate 1 in the direction parallel to the 2 nd main surface of the reinforcing plate ((C) of fig. 9).

Further, it is preferable to execute a storing step of storing the contact position where the edge Na of the blade N and the laminate 1 (the reinforcing plate 3 or the resin layer 4) are in contact in the first detecting step (step S140). Here, the contact position refers to a position in the horizontal direction.

When it is determined in the detection step (step S140) that the blade N is in contact with the reinforcing plate 3, the retreating step (step S150) and the 2 nd position adjustment step (step S160) are executed, and the advancing step (step S130), the detection step (step S140), the retreating step (step S150), and the 2 nd position adjustment step (step S160) are repeatedly executed as described above.

In the 2 nd advance step (step S130), the advance speed of the knife N is preferably adjusted based on the stored information of the contact position. Based on the information of the contact position, the blade N is moved at a high speed until the blade N comes into contact with the laminate 1, and then the blade N is brought into contact with the laminate 1 at a low speed.

This can prevent the blade N from being damaged.

By adjusting the advancing speed of the blade N in this manner, the advancing step (step S130) can be performed relatively quickly. If the information on the contact position is not obtained, the movement of the blade N needs to be performed at a low speed from the start of the movement until the blade N comes into contact with the laminate 1.

On the other hand, when the information of the contact position is obtained, the blade N can be moved in two stages of high speed and low speed as described above, and therefore, the advancing step can be performed faster than when the blade N is moved only at a low speed.

Next, a peeling apparatus and a peeling method for peeling the reinforcing plate from the laminate having the peeling start portion formed therein will be described. In the following description, a case of using the laminate 6 shown in fig. 2 will be described as an example.

Stripping device

Fig. 10 is a vertical sectional view showing the structure of the peeling apparatus 100, and fig. 11 is a plan view of the peeling unit 102 schematically showing the arrangement positions of the plurality of movable bodies 104 with respect to the peeling unit 102 of the peeling apparatus 100. Fig. 10 corresponds to a cross-sectional view taken along line B-B of fig. 11, and the laminate 6 is shown by a solid line in fig. 11.

The peeling apparatus 100 shown in fig. 10 includes a pair of movable devices 106 and 106 disposed above and below the laminate 6 so as to sandwich the laminate 6. The movable devices 106, 106 are identical in structure. Here, the movable device 106 disposed on the lower side in fig. 10 is explained, and the movable device 106 disposed on the upper side is given the same reference numeral and the explanation thereof is omitted.

The movable device 106 includes a plurality of movable bodies 104, a plurality of driving devices 108 for moving the movable bodies 104 up and down according to each of the movable bodies 104, and a controller 110 for controlling the driving devices 108 according to each of the driving devices 108.

In order to flexibly deform the reinforcing plate 3B, the peeling unit 102 vacuum-adsorbs and holds the reinforcing plate 3B. In addition, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may also be used.

Stripping unit

Fig. 12 (a) is a plan view of the peeling unit 102, and fig. 12 (B) is an enlarged longitudinal sectional view of the peeling unit 102 taken along the line C-C of fig. 12 (a). Fig. 12 (C) is an enlarged vertical cross-sectional view of the peeling unit 102, showing that the suction portion 114 constituting the peeling unit 102 is detachably provided to the 1 st flexible plate 112 in a rectangular plate shape constituting the peeling unit 102 via the double-sided adhesive tape 116. As described above, the peeling unit 102 is configured such that the suction unit 114 is detachably attached to the 1 st flexible board 112 via the double-sided adhesive tape 116.

The suction portion 114 has a 2 nd flexible plate 118 having a thickness thinner than the 1 st flexible plate 112. The lower surface (one surface) of the 2 nd flexible board 118 is detachably attached to the upper surface of the 1 st flexible board 112 via a double-sided adhesive tape 116.

In addition, a rectangular air-permeable sheet 120 is provided in the suction portion 114, and the air-permeable sheet 120 sucks and holds the inner surface of the reinforcing plate 3B of the stacked body 6. In order to reduce the tensile stress generated in the reinforcing plate 3B at the time of peeling, the thickness of the air-permeable sheet 120 is 2mm or less, preferably 1mm or less, and in the embodiment, the air-permeable sheet 120 having a thickness of 0.5mm is used.

Further, the suction portion 114 is provided with a seal frame member 122 surrounding the air-permeable sheet 120 and abutting against the outer peripheral surface of the reinforcing plate 3B. The seal frame member 122 and the air-permeable sheet 120 are bonded to the upper surface (the other surface) of the 2 nd flexible plate 118 by a double-sided adhesive tape 124. The sealing frame member 122 is a closed-cell sponge having a shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness of the sealing frame member 122 is 0.3mm to 0.5mm greater than the thickness of the air-permeable sheet 120.

A frame-shaped groove 126 is provided between the breathable sheet 120 and the seal frame member 122. Further, the 1 st flexible plate 112 has a plurality of through holes 128 opened therein, and one end of each of the through holes 128 communicates with the groove 126, and the other end thereof is connected to an intake source (for example, a vacuum pump) via an unillustrated suction line.

Therefore, when the suction source is driven, the air in the suction duct, the through hole 128, and the groove 126 is sucked, the inner surface of the reinforcing plate 3B of the laminated body 6 is vacuum-sucked and held on the air-permeable sheet 120, and the outer peripheral surface of the reinforcing plate 3B is pressed and brought into contact with the sealing frame member 122, so that the sealing property of the suction space surrounded by the sealing frame member 122 is improved.

The 2 nd flexible plate 118, the air-permeable sheet 120, and the sealing frameThe member 122 has a higher bending rigidity of the 1 st flexible board 112 than that of the member 112, and therefore the bending rigidity of the 1 st flexible board 112 determines the bending rigidity of the peeling unit 102. The bending rigidity of the peeling means 102 per unit width (1mm) is preferably 1000 N.mm²/mm～40000N·mm²And/mm. For example, the bending rigidity is 100000N · mm at a portion of the peeling unit 102 having a width of 100mm²～4000000N·mm². By setting the flexural rigidity of the peeling unit 102 to 1000N · mm²And/mm or more, the reinforcing plate 3B sucked and held by the peeling unit 102 can be prevented from being bent. The bending rigidity of the peeling unit 102 was 40000N · mm²The reinforcing plate 3B sucked and held by the peeling unit 102 can be flexibly deformed appropriately to be not more than mm.

The 1 st flexible plate 112 and the 2 nd flexible plate 118 are resin members having a young's modulus of 10MPa or less, and are resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, Polyacetal (POM) resin, and the like.

Movable device

A plurality of disc-shaped movable bodies 104 shown in fig. 10 are fixed to the lower surface of the 1 st flexible plate 112 in a checkered pattern as shown in fig. 11. These movable bodies 104 are fixed to the 1 st flexible plate 112 by fastening members such as bolts, but may be adhesively fixed to the 1 st flexible plate 112 instead of bolts. These movable bodies 104 are independently moved up and down by a driving device 108 driven by a controller 110.

That is, the controller 110 controls the driving device 108 to sequentially move down the movable body 104 from the movable body 104 located on the corner 6A side of the stacked body 6 in fig. 11 to the movable body 104 located on the corner 6B side in the peeling advancing direction indicated by the arrow a. According to this operation, as shown in the vertical cross section of fig. 13, peeling is performed starting from the peeling start portion SP of the resin layer 4B formed between the substrate 2B and the reinforcing plate 3B of the laminate 6. The peeling start portion SP is formed by the peeling start portion forming apparatus 10 before the peeling.

The driving device 108 includes, for example, a rotary servomotor, a ball screw mechanism, and the like. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism, and is transmitted to the rod 130 of the ball screw mechanism. The movable body 104 is provided on the tip end portion of the rod 130 via a ball joint 132. This enables the movable body 104 to tilt following the flexible deformation of the peeling unit 102 as shown in fig. 13. Therefore, the peeling unit 102 can be flexibly deformed from the corner portion 6A toward the corner portion 6B without applying an excessive force to the peeling unit 102 (see fig. 11). The driving device 108 is not limited to a rotary servomotor and a ball screw mechanism, and may be a linear servomotor or a fluid pressure cylinder (e.g., a pneumatic cylinder).

The plurality of driving devices 108 are preferably attached to a liftable frame 134 via a buffer member 136. The buffer member 136 elastically deforms to follow the flexible deformation of the peeling unit 102. Thereby, the lever 130 tilts with respect to the frame 134.

When the reinforcing sheet 3B to be peeled is removed from the peeling unit 102, the frame 134 is moved down by a driving unit not shown.

The controller 110 is configured as a computer including a recording medium such as a ROM and a RAM, a CPU, and the like. The controller 110 causes the CPU to execute a program recorded on the recording medium, thereby controlling the plurality of driving devices 108 according to each driving device 108, thereby controlling the lifting movement of the plurality of movable bodies 104.

This application is based on Japanese patent application 2015-029377 filed on 18/2/2015, the contents of which are incorporated by reference into this specification.

Description of the reference numerals

1. 1A, 1B, a laminate; 2. 2A, 2B, a substrate; 3. 3A, 3B, a reinforcing plate; 4. 4A, 4B, a resin layer; 6. a laminate; 7. a functional layer; 10. peeling off the starting part manufacturing device; 12. a work table; 14. a holder; 16. a table driving unit; 18. a knife driving unit; 20. a position adjustment unit; 22. a load sensor; 24. a support member; 26. a laser displacement meter; 28. a plate thickness detector; 30. a control unit; 32. a table support stand; 34. a linear motion device; 36. a guide rail; 38. a guide block; 40. a frame; 42. a 1 st stopper; 44. a compression spring; 46. a 2 nd stopper; 50. a main body frame; 52. a track; 54. a slider; 56. a ball screw; 58. a motor; 60. a main body frame; 62. a track; 64. a slider; 66. a ball screw; 68. a motor; 70. a main body frame; 72. a track; 74. a slider; 76. a ball screw; 78. a motor; 80. a stand; 100. a peeling device; 102. a peeling unit; 104. a movable body; 106. a movable device; 108. a drive device; 110. a controller; 112. 1 st flexible board; 114. an adsorption part; 116. a double-sided adhesive tape; 118. a 2 nd flexible board; 120. a breathable sheet; 122. a sealing frame member; 124. a double-sided adhesive tape; 126. a groove; 128. a through hole; 130. a rod; 132. a ball joint; 134. a frame; 136. a cushioning member.

Claims (9)

1. A peeling start part forming device for forming a peeling start part in a laminated body formed by bonding a 1 st substrate as a product substrate having a 1 st main surface and a 2 nd substrate as a reinforcing plate having a 1 st main surface and a 2 nd main surface in a peelable manner with an adsorption layer interposed therebetween by inserting a knife into the adsorption layer,

the peeling start part manufacturing device includes:

a moving section for relatively advancing or retreating the blade and the stacked body in a direction parallel to the 2 nd main surface of the 2 nd substrate;

a detection unit that detects which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has made contact with;

a position detecting unit for detecting a positional relationship between the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate;

a position adjusting unit for adjusting a position between the laminate and the blade by relatively moving the laminate and/or the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate; and

a control unit for controlling the moving unit, the detecting unit, the position detecting unit, and the position adjusting unit,

the control section executes the following processing:

a position detection process of detecting a position between the stacked body and the knife by the position detection unit;

a 1 st position adjustment process of adjusting, by the position adjustment unit, a position of the knife from a position facing the adsorption layer of the laminate to the 2 nd substrate side by a predetermined distance, the predetermined distance being equal to or greater than a maximum error amount in the position detection unit and the position adjustment unit, based on a detection result of the position detection unit;

an advancing process of relatively advancing the blade and the laminated body by the moving section; and

a detection process of detecting, by the detection unit, which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has made contact with,

the control section further performs a process of,

performing, when it is detected that the cutting edge of the blade is in contact with the 2 nd substrate, a retreating process of relatively retreating the laminated body and the blade by the moving unit, and a 2 nd position adjusting process of adjusting the position of the blade to a distance equal to or less than the thickness of the adsorption layer toward the adsorption layer side by the position adjusting unit, and repeating these processes in the order of the advancing process, the detecting process, the retreating process, and the 2 nd position adjusting process until it is detected that the blade is in contact with the adsorption layer,

when the contact between the cutting edge of the blade and the adsorption layer is detected, a relative movement between the blade and the laminated body is continued by the moving unit.

2. The peeling starting portion producing apparatus according to claim 1,

the detection unit is a displacement meter or a load sensor.

3. The peeling starting portion producing device according to claim 1 or 2,

the thickness of the adsorption layer is 1-50 μm.

4. The peeling starting portion producing device according to claim 1 or 2,

the control unit stores position information of which one of the adsorption layer and the No. 2 substrate the cutting edge of the blade is in contact with, and adjusts the advancing speed of the blade based on the position information when the advancing process is performed for the No. 2 or later.

5. A method for manufacturing a peeling start portion in a laminate in which a 1 st substrate as a product substrate having a 1 st main surface and a 2 nd substrate as a reinforcing plate having a 1 st main surface and a 2 nd main surface are bonded to each other so as to be peelable with each other with an adsorption layer interposed therebetween, wherein a peeling start portion is manufactured in the laminate by inserting a knife into the adsorption layer,

the method for manufacturing the peeling starting part comprises the following steps:

a position detecting step of detecting a positional relationship between the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate;

a 1 st position adjustment step of relatively moving the laminate and the blade in a direction perpendicular to a 2 nd main surface of the 2 nd substrate based on a detection result of the position detection step, and adjusting a position of the blade from a position facing the adsorption layer of the laminate to the 2 nd substrate side by a predetermined distance which is equal to or more than a maximum error amount in the position detection step and the 1 st position adjustment step;

an advancing step of relatively advancing the blade and the laminated body in a direction parallel to the 2 nd main surface of the 2 nd substrate; and

a detection step of detecting which of the adsorption layer and the 2 nd substrate the edge of the blade has made contact with,

the method for manufacturing a peeling start part further comprises the step of,

performing a retreating step of relatively retreating the laminate and the blade in a direction parallel to the 2 nd main surface of the 2 nd substrate and a 2 nd position adjusting step of relatively moving the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate to adjust the position of the blade by a distance equal to or less than the thickness of the adsorption layer toward the adsorption layer side, when it is detected that the blade edge of the blade is in contact with the 2 nd substrate, and repeating these steps in the order of the advancing step, the detecting step, the retreating step, and the 2 nd position adjusting step until it is detected that the blade is in contact with the adsorption layer,

and a continuous advancing step of continuously advancing the blade and the laminated body relative to each other when the contact between the blade edge of the blade and the adsorption layer is detected.

6. The method for manufacturing a peeling starting portion according to claim 5,

the detecting step includes an operation of detecting with a displacement meter or a load sensor.

7. The method for manufacturing a peeling starting portion according to claim 5 or 6,

the thickness of the adsorption layer is 1-50 μm.

8. The method for manufacturing a peeling starting portion according to claim 5 or 6,

the method for manufacturing a peeling start part includes a storage step of storing position information on which of the adsorption layer and the 2 nd substrate the cutting edge of the blade has come into contact with, and the advancing step after the 2 nd time includes an operation of adjusting an advancing speed of the blade based on the position information.

9. A method of manufacturing an electronic device, the method comprising: a functional layer forming step of forming a functional layer on a 1 st main surface of a 1 st substrate as a product substrate and a 1 st main surface of a 2 nd substrate as a reinforcing plate, in a laminate in which the 1 st substrate having the 1 st main surface and the 2 nd substrate having the 1 st main surface and the 2 nd main surface are bonded to each other so as to be peelable with each other via an adsorption layer; and a separation step of separating the 1 st substrate and the 2 nd substrate on which the functional layer is formed,

the separation step includes: a peeling start portion production step of inserting a knife into the adsorption layer to produce a peeling start portion; and a peeling step of sequentially peeling the 1 st substrate and the 2 nd substrate from each other with the peeling start portion as a starting point,

the step of manufacturing the peeling start part includes the steps of:

a position detecting step of detecting a positional relationship between the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate;

a 1 st position adjustment step of relatively moving the laminate and the blade in a direction perpendicular to a 2 nd main surface of the 2 nd substrate based on a detection result of the position detection step, and adjusting a position of the blade from a position facing the adsorption layer of the laminate to the 2 nd substrate side by a predetermined distance which is equal to or more than a maximum error amount in the position detection step and the 1 st position adjustment step;

an advancing step of relatively advancing the blade and the laminated body in a direction parallel to the 2 nd main surface of the 2 nd substrate; and

a detection step of detecting which of the adsorption layer and the 2 nd substrate the edge of the blade has made contact with,

the peeling start part producing step further includes a step of,

performing a retreating step of relatively retreating the laminate and the blade in a direction parallel to the 2 nd main surface of the 2 nd substrate and a 2 nd position adjusting step of relatively moving the laminate and the blade in a direction perpendicular to the 2 nd main surface of the 2 nd substrate to adjust the position of the blade by a distance equal to or less than the thickness of the adsorption layer toward the adsorption layer side, when it is detected that the blade edge of the blade is in contact with the 2 nd substrate, and repeating these steps in the order of the advancing step, the detecting step, the retreating step, and the 2 nd position adjusting step until it is detected that the blade is in contact with the adsorption layer,

and a continuous advancing step of continuously advancing the blade and the laminated body relative to each other when the contact between the blade edge of the blade and the adsorption layer is detected.

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