JP6016108B2 - Substrate peeling apparatus and peeling method, and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a substrate peeling apparatus and peeling method for peeling an interface between a substrate and a reinforcing plate, and an electronic device manufacturing method.

  In recent years, with the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin film secondary batteries, there has been a demand for thinner substrates used in electronic devices. However, if the strength of the substrate is reduced due to the thin plate, the handling property of the substrate is deteriorated. Therefore, a functional layer for an electronic device such as a thin film transistor (TFT), a color filter (CF) is provided on the surface of the substrate. It becomes difficult to form.

  Therefore, a laminated board (laminated body in a broad sense) in which the reinforcing plate is detachably attached to the back surface of the substrate is formed, a functional layer is formed on the surface of the laminated board, and then the substrate and the reinforcing plate are peeled off. A method has been proposed (see, for example, Patent Document 1). Hereinafter, the surface on which the functional layer is formed is referred to as the “front surface” of the substrate, and the surface on which the reinforcing plate is attached is referred to as the “back surface” of the substrate.

  The peeling method of Patent Document 1 is such that at least one of the substrate and the reinforcing plate is flexibly deformed so that the interface between the back surface of the substrate and the reinforcing plate is sequentially peeled from one end side to the other end side. Is a method of peeling the entire surface. The bending deformation is performed by attracting and holding at least one of the substrate and the reinforcing plate with a flexible plate and independently moving a plurality of movable bodies fixed to the flexible plate.

  FIG. 19A is a plan view of the laminated plate 100 schematically showing the substrate peeling pattern in Patent Document 1. FIG. FIG.19 (b) is a side view of the peeling form of a board | substrate.

  As shown in FIG. 19B, the laminated plate 100 includes a substrate 102 and a reinforcing plate 104 attached to the back surface of the substrate 102. A broken line A in FIG. 19A and a symbol A in FIG. 19B indicate a boundary line between the peeling region 106 where the interface between the substrate 102 and the reinforcing plate 104 is peeled and the non-peeling region 108 where the interface is not peeled ( Hereinafter, it is also referred to as a “peeling front. A plurality of movable members shown in FIG. 19B are arranged so that the peeling front A advances substantially in parallel from the corner 110 side to the corner 112 side of the laminated plate 100 as indicated by an arrow B in FIG. The bodies 114, 114... Are sequentially moved downward as indicated by an arrow C.

  The surface of the substrate 102 is supported in a non-deformable manner by a flat plate stage 116 as a support means, and the reinforcing plate 104 is adsorbed and held by a flexible plate 118 that can be elastically deformed. The movable bodies 114, 114... Are fixed to the flexible plate 118 in a grid pattern. That is, the plurality of movable bodies 114, 114... Arranged in a direction substantially orthogonal to the arrow B which is the peeling advance direction of the peeling front A are simultaneously moved downward to bend and deform the flexible plate 118. Thus, the peeling front A proceeds in the direction of arrow B.

  In Patent Document 1, the flexible plate 118 is bent and deformed by the movable bodies 114, 114... So that the radius of curvature a of the peeling region 106 is 250 mm to 2500 mm.

International Publication No. 2011/024689 Pamphlet

  However, in the peeling form of the substrate of Patent Document 1, when a fine crack (hereinafter referred to as a crack) 120 is generated at the end of the substrate 102 as shown in FIG. Has a problem that the substrate 102 breaks (breaks).

  FIG. 19C shows a mechanism of cracking of the substrate 102 caused by the crack 120.

  The peeling front A that travels in the direction of arrow B through the interface passes in the direction in which the crack 120 extends when passing through the crack 120. That is, the peeling progress direction indicated by the arrow B of the peeling front A is the direction from the edge 102 </ b> A of the substrate 102 to the inside of the substrate 102. As a result, the force that peels the interface acts in the direction in which the crack 120 extends, so that the crack 120 extends along with the peeling front A as indicated by reference numeral 122. It has been experimentally found that the substrate 102 is broken by this mechanism.

  The present invention has been made in view of such circumstances, and is a substrate peeling apparatus and peeling method that can satisfactorily peel off a substrate even when a crack has occurred in the substrate, and a method for manufacturing an electronic device The purpose is to provide.

  In order to achieve the above-described object, the substrate peeling apparatus of one embodiment of the present invention sequentially has an interface between the substrate and the reinforcing plate that reinforces the substrate along the peeling progress direction from one end side to the other end side. In the peeling apparatus for the substrate to be peeled, a straight line connecting two intersections of the boundary line between the peeling area and the non-peeling area where the interface is peeled off and the outer periphery of the substrate, and the tangent line of the outer circumference of the substrate in the peeling area In the peeling range of at least 90 degrees or less, the interface is formed such that the angle formed by the tangent of the end of the boundary line and the tangent of the outer periphery of the substrate in the peeling area is greater than 90 degrees. It is characterized by having a peeling means for peeling off.

  In order to achieve the above object, the substrate peeling method according to one aspect of the present invention sequentially performs the interface between the substrate and the reinforcing plate that reinforces the substrate from one end side to the other end side along the peeling progress direction. In the peeling method of the substrate to be peeled, a straight line connecting two intersections of the boundary line between the peeling region and the non-peeling region where the interface is peeled off and the outer periphery of the substrate, and the tangent line of the outer periphery of the substrate in the peeling region In the peeling range of at least 90 degrees or less, the interface is formed such that the angle formed by the tangent of the end of the boundary line and the tangent of the outer periphery of the substrate in the peeling area is greater than 90 degrees. Is peeled off by a peeling means.

  In order to achieve the above object, an electronic device manufacturing method according to an aspect of the present invention includes a functional layer forming step of forming a functional layer on a surface of a substrate reinforced with a reinforcing plate, and the substrate on which the functional layer is formed. And a peeling step of peeling the reinforcing plate, the peeling step is performed along a peeling progress direction in which an interface between the substrate and the reinforcing plate is directed from one end side to the other end side. A step of sequentially peeling, and a straight line connecting two intersections of a boundary line between the peeling region and the non-peeling region where the interface is peeled off and an outer periphery of the substrate, and a tangent line of the outer periphery of the substrate in the peeling region In the peeling range of at least 90 degrees or less, the interface is formed such that the angle formed by the tangent of the end of the boundary line and the tangent of the outer periphery of the substrate in the peeling area is greater than 90 degrees. Is the process of peeling And wherein the door.

  According to one aspect of the peeling mode of the present invention, the boundary line (peeling front) that progresses in the peeling range does not pass in the direction of extending the crack when passing through the crack generated at the end of the substrate. , Passing in the direction from the inside of the substrate toward the edge of the substrate. Thereby, since the force which peels an interface does not act in the direction which extends a crack, a crack does not extend with progress of a boundary line. Therefore, according to one aspect of the peeling mode of the present invention, the substrate can be peeled satisfactorily even when cracks are generated in the substrate.

  In one embodiment of the present invention, the substrate is preferably a glass substrate having a thickness of 0.2 mm or less.

  According to one embodiment of the present invention, it is suitable for a glass substrate peeling apparatus and a peeling method corresponding to a reduction in thickness of an electronic device.

  In one aspect of the substrate peeling apparatus of the present invention, the peeling means includes: a supporting means for supporting the first main surface of the laminate including the substrate and the reinforcing plate; and a second main surface of the laminate. A flexible plate having a first suction surface for sucking and holding an outer edge and a second suction surface for sucking and holding a second main surface excluding the outer edge, wherein the second suction surface is the second suction surface. The first suction surface is a projecting surface projecting a predetermined amount with respect to the second suction surface, and is spaced from the flexible plate. A plurality of movable bodies that are fixed and movable independently of the support means, and the movable body that is located on the other end side in the peeling progress direction from the movable body that is located on the one end side in the peeling progress direction. It is preferable to include a control unit that sequentially moves the movable body in a direction away from the support unit.

  In one aspect of the substrate peeling method of the present invention, the peeling method by the peeling means includes a supporting means for supporting the first main surface of the laminate including the substrate and the reinforcing plate, and a second of the laminate. A flexible plate having a first suction surface for sucking and holding the outer edge of the main surface and a second suction surface for sucking and holding the second main surface excluding the outer edge, wherein the second suction surface is A flexible plate which is a plane parallel to the second main surface, and the first suction surface is a projecting surface projecting a predetermined amount with respect to the second suction surface; and the flexibility A plurality of movable bodies fixed to the plate at an interval and movable independently with respect to the support means, from the movable body located on the one end side of the peeling progress direction to the other of the peeling progress direction. The movable body located on the end side is sequentially moved by the control means in a direction away from the support means. It is preferable.

  In one aspect of the method for producing an electronic device of the present invention, in the peeling step, the first main surface of the multilayer body including the substrate and the reinforcing plate is supported by a support means, and the second main surface of the multilayer body is supported. By controlling the movement of the plurality of movable bodies fixed to the flexible plate that holds and holds the surface at intervals with respect to the support means, the interface extends along the peeling progress direction from one end side to the other end side. The flexible plate is held by suction and holds the first suction surface that sucks and holds the outer edge of the second main surface of the laminate, and the second main surface excluding the outer edge. A flexible plate having a second suction surface, wherein the second suction surface is parallel to the second main surface, and the first suction surface is the second suction surface. It is preferable to provide a protruding surface protruding a predetermined amount with respect to the adsorption surface.

  According to one aspect of the peeling mode of the present invention, the control means moves the movable body positioned on the other end side in the peeling progress direction from the movable body positioned on the one end side in the peeling progress direction in the direction separating the support body from the movable means. When sequentially moved, the outer edge of the laminate is peeled off later than the surface excluding the outer edge. As a result, according to one aspect of the peeling mode of the present invention, the angle formed between the tangent line at the end of the boundary line and the tangent line at the outer periphery of the substrate in the peeling region is larger than 90 degrees, so that a crack is generated in the substrate. Even if it is a case, the board | substrate can be peeled favorable.

  In one aspect of the substrate peeling apparatus of the present invention, the peeling means includes a supporting means for supporting a first main surface of a laminate including the substrate and the reinforcing plate, and a second main surface of the laminate. A flexible plate to be sucked and held, a plurality of movable bodies fixed to the flexible plate at an interval and movable independently with respect to the support means, and positioned on the one end side in the peeling progress direction The movable body positioned on the other end side in the peeling progress direction from the movable body is sequentially moved in a direction away from the support means, and the movable body positioned on the outer edge of the second main surface It is preferable to include a control unit that delays the separation movement start time by a predetermined time from the separation movement start time of the movable body located on the second main surface excluding the outer edge.

  In one aspect of the substrate peeling method of the present invention, the peeling method by the peeling means includes a supporting means for supporting the first main surface of the laminate including the substrate and the reinforcing plate, and a second of the laminate. A flexible plate that adsorbs and holds a main surface; and a plurality of movable bodies that are fixed to the flexible plate at an interval and are movable independently of the support means. The movable body located on the other end side in the peeling progress direction from the movable body located on the one end side is sequentially moved by the control means in a direction away from the support means, and the second main surface It is preferable that the control means delays the separation movement start time of the movable body located on the outer edge of the movable body by a predetermined time from the separation movement start time of the movable body located on the second main surface excluding the outer edge.

  In one aspect of the method for producing an electronic device of the present invention, in the peeling step, the first main surface of the multilayer body including the substrate and the reinforcing plate is supported by a support means, and the second main surface of the multilayer body is supported. By controlling the movement of the plurality of movable bodies fixed to the flexible plate that holds and holds the surface at intervals with respect to the support means, the interface extends along the peeling progress direction from one end side to the other end side. In the direction in which the movable body positioned on the other end side in the peeling progress direction is separated from the support means from the movable body positioned on the one end side in the peeling progress direction. The movement start time of the movable body located on the outer edge of the second main surface is set to be predetermined more than the start time of the separation movement of the movable body located on the second main surface excluding the outer edge. It is preferable to delay the time.

  According to one aspect of the peeling mode of the present invention, the separation movement start time of the movable body located on the outer edge of the second main surface is set to be greater than the separation movement start time of the movable body located on the second principal surface excluding the outer edge. Also, if the control means delays for a predetermined time, the outer edge of the laminate is peeled off later than the surface excluding the outer edge. As a result, according to one aspect of the peeling mode of the present invention, the angle formed between the tangent line at the end of the boundary line and the tangent line at the outer periphery of the substrate in the peeling region is larger than 90 degrees, so that a crack is generated in the substrate. Even if it is a case, the board | substrate can be peeled favorable.

  According to the substrate peeling apparatus, the substrate peeling method, and the electronic device manufacturing method of the present invention, the substrate can be satisfactorily peeled even when cracks are generated in the substrate.

Enlarged side view of the main part of the laminate used in the manufacturing process of electronic devices Enlarged side view of the main part of a laminate produced during the manufacturing process of an electronic device (A) is a plan view of a rectangular laminated board, (b) is an explanatory diagram showing the main part of the peeling direction of the peeling front by the board peeling method of the present invention. Explanatory drawing which showed the peeling method which peels an interface sequentially along the peeling advancing direction toward the short side which opposes from the short side of a substrate Explanatory drawing showing the peeling method in the case of a circular substrate The principal part longitudinal cross-sectional view which showed the basic composition of the peeling apparatus of this invention The top view of the flexible board which showed the arrangement position of a plurality of movable bodies to a flexible board (A) is a top view of a flexible board, (b) is a longitudinal cross-sectional view which follows the SS line | wire of (a). Principal section of the main part of the peeling device showing the state where the interface is peeled off sequentially (A) is a main part longitudinal sectional view showing a state before the laminated plate is held by the peeling means, (b) is a main part vertical sectional view showing a state where the laminated board is held by the peeling means, and (c) is peeled off. Longitudinal longitudinal sectional view showing a state where the interface is completely peeled off by means (A) is a plan view of a laminate showing an ongoing peeling front, (b) is a longitudinal sectional view taken along line TT in (a). (A) is a vertical cross-sectional view of the main part of a peeling device having a two-stage configuration in which the thickness of the first suction surface is changed, and (b) is a two-layer intermediate film disposed on the back side of the first suction surface. A longitudinal section of the main part of a peeling device with a two-stage configuration (A) is a top view of the flexible board which the peeling front has advanced, (b) is a longitudinal cross-sectional view which follows the U-U line of (a). (A) is a side view of a peeling device in which a laminated plate is placed on a flexible plate by a transport device, and (b) is a side view of the peeling device in which a first main surface of the laminated plate is held by vacuum suction by a stage. (C) is a side view of a peeling apparatus in which the peeling method of the present invention is carried out by the peeling apparatus. (A) is a side view of the peeling device with the interface completely peeled off, (b) is a side view of the peeling device that delivers the substrate from the stage to the flexible plate, and (c) is a state immediately before carrying out the substrate. Side view of peeling device (A) is a side view of the peeling device in which the laminate is placed on the flexible plate by the transport device, and (b) is a drawing of the peeling device in which the first main surface of the laminate is held by vacuum suction using the flexible plate. Side view, (c) is a side view of a peeling apparatus in which the peeling method of the present invention is carried out by the peeling apparatus. (A) is a side view of a peeling apparatus in which the interface is completely peeled, (b) is a side view of the peeling apparatus in which the laminated body is vacuum-adsorbed and held by upper and lower flexible plates, and (c) is a main view of the peeling apparatus. Side view of a peeling apparatus in which the peeling method of the invention is implemented (A) is a side view of the peeling device with the interface completely peeled off, (b) is a side view of the peeling device in which the reinforcing plate is transferred from the upper flexible plate to the lower flexible plate, (c). Is a side view of the peeling device just before unloading the reinforcing plate (A) is the top view of the laminated board which showed typically the peeling form of the board | substrate in patent document 1, (b) is the side view of the peeling apparatus which showed the peeling form of the board | substrate, (c) originates in a crack. Explanatory drawing showing the mechanism of substrate cracking

  Embodiments of a substrate peeling apparatus, a peeling method, and an electronic device manufacturing method according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is an enlarged side view of a main part of a laminated plate 1 used in a manufacturing process of an electronic device.

[Method of manufacturing electronic device]
The method for manufacturing an electronic device according to the embodiment includes a laminated plate 1 in which a reinforcing plate 3 is attached to the back surface of the substrate 2 in order to cope with the thinning of the substrate 2 used in the electronic device. 2 has a functional layer forming step for forming a functional layer on the surface, and a peeling step for peeling the substrate 2 and the reinforcing plate 3 on which the functional layer is formed. In the peeling step, the substrate peeling apparatus of the embodiment is used. The peeling apparatus will be described later. The reinforcing plate 3 does not become a part of the electronic device and is reused for reinforcing the substrate 2 after being peeled from the substrate 2.

  The said electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. The display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL panel (OLED).

[Laminate 1]
As shown in FIG. 1, the laminated plate 1 includes a substrate 2 and a reinforcing plate 3 that reinforces the substrate 2, and is configured by attaching the reinforcing plate 3 to the back surface of the substrate 2.

[Substrate 2]
A predetermined functional layer (for example, TFT, CF) is formed on the surface of the substrate 2 during the manufacturing process of the electronic device.

  The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate, and the glass substrate is preferable because it has excellent chemical resistance and moisture permeability resistance and a small linear expansion coefficient. This is because as the linear expansion coefficient decreases, the pattern of the functional layer formed at a high temperature becomes difficult to shift during cooling.

  The glass of the glass substrate is not particularly limited, and examples thereof include non-alkali glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  Moreover, as glass of a glass substrate, it is preferable that the glass suitable for the kind of electronic device and its manufacturing process is employ | adopted. For example, it is preferable that the glass substrate for liquid crystal panels consists of glass (an alkali free glass) which does not contain an alkali metal component substantially. As described above, the glass of the glass substrate is appropriately selected based on the type of electronic device to be applied and the manufacturing process thereof.

  The resin of the resin substrate may be a crystalline resin or an amorphous resin, and is not particularly limited.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, it is preferably 0.7 mm or less, more preferably 0.2 mm or less, and still more preferably 0.1 mm or less for reducing the weight and thickness of the electronic device. In the case of 0.2 mm or less, it is possible to give good flexibility to the glass substrate, and it becomes a suitable substrate corresponding to thinning of the electronic device. In the case of 0.1 mm or less, the glass substrate can be wound into a roll. Further, the thickness of the glass substrate is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate and easy handling of the glass substrate.

[Reinforcement plate 3]
When the reinforcing plate 3 is attached to the substrate 2, the reinforcing plate 3 has a function of reinforcing the substrate 2 until a peeling operation is performed. After the functional layer is formed, the reinforcing plate 3 is peeled from the substrate 2 by the substrate peeling apparatus of the embodiment in the course of the manufacturing process of the electronic device.

  The reinforcing plate 3 preferably has a small difference with respect to the linear expansion coefficient of the substrate 2 in order to suppress warping and peeling due to temperature changes. When the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of this glass plate is preferably the same type as the glass of the glass substrate.

  The reinforcing plate 3 includes a support plate 4 serving as a base and a resin layer 5 formed on the surface of the support plate 4. The substrate 2 is detachably attached to the support plate 4 via the resin layer 5 by van der Waals force acting between the resin layer 5 and the substrate 2 or the adhesive force of the resin layer 5.

  In addition, although the reinforcement board 3 of FIG. 1 is comprised by the support plate 4 and the resin layer 5, you may be comprised only by the support plate 4. FIG. In this case, the support plate 4 and the substrate 2 are detachably attached by van der Waals force or the like acting between the support plate 4 and the substrate 2. Moreover, in this case, it is preferable to form an inorganic thin film on the side surface to which the support plate 4 is attached so that the support plate 4 that is a glass plate and the substrate 2 that is a glass substrate are not bonded at high temperatures.

  In addition, although the support plate 4 in FIG. 1 is one and the resin layer 5 is one layer, the support plate 4 may be composed of a plurality of support plates 4 and the resin layer 5 may be composed of a plurality of layers. Good.

[Support plate 4]
The support plate 4 supports the substrate 2 via the resin layer 5, whereby the substrate 2 is reinforced by the reinforcing plate 3. The support plate 4 also has a function of preventing deformation, scratching, breakage, and the like of the substrate 2 in the electronic device manufacturing process.

  Examples of the support plate 4 include a glass plate, a ceramic plate, a resin plate, a semiconductor plate, and a metal plate. The type of the support plate 4 is appropriately selected according to the type of the electronic device, the type of the substrate 2, and the like. It is preferable that the support plate 4 and the substrate 2 are of the same type because warpage due to a temperature change and peeling are reduced.

The difference (absolute value) in the average linear expansion coefficient between the support plate 4 and the substrate 2 is appropriately set according to the dimension shape and the like of the substrate 2, but is preferably 35 × 10 ⁻⁷ / ° C. or less, for example. Here, the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R 3102) in a temperature range of 50 to 300 ° C.

  The thickness of the support plate 4 is preferably 0.7 mm or less, for example. Further, the thickness of the support plate 4 is preferably 0.4 mm or more in order to reinforce the substrate 2. The support plate 4 may be thicker or thinner than the substrate 2.

  The outer shape of the support plate 4 is preferably the same as or larger than the outer shape of the resin layer 5 as shown in FIG. 1 so that the support plate 4 can support the entire resin layer 5. .

[Resin layer 5]
The resin layer 5 has a function of preventing displacement of the substrate 2 with respect to the support plate 4 until a peeling operation is performed after the substrate 2 is brought into close contact. The resin layer 5 also has a function of easily peeling from the substrate 2 by a peeling operation. Since the substrate 2 is easily peeled off, the substrate 2 can be prevented from being damaged at the time of peeling. Further, the resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2.

  Although resin of the resin layer 5 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, etc. can be illustrated. In addition, a plurality of types of resins can be mixed and used, but silicone resins and polyimide silicone resins are preferable from the viewpoints of heat resistance and releasability.

  Although the thickness of the resin layer 5 is not specifically limited, Preferably it is 1-50 micrometers, More preferably, it is 4-20 micrometers. By setting the thickness of the resin layer 5 to 1 μm or more, when bubbles or foreign matter are mixed between the resin layer 5 and the substrate 2, the resin layer 5 is deformed so as to absorb the thickness of the bubbles or foreign matter. Because. On the other hand, when the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 is not used more than necessary, which is economical.

  The outer shape of the resin layer 5 is preferably the same as or larger than the outer shape of the substrate 2 as shown in FIG. 1 so that the resin layer 5 can adhere the entire substrate 2.

In addition, the resin layer 5 may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the resin layers. Moreover, when the resin layer 5 consists of two or more layers, the kind of resin which forms each layer may differ. Furthermore, the structure of the laminated board 1 is not restricted to what is shown by FIG. For example, instead of the resin layer 5, an inorganic layer containing at least one selected from the group consisting of metal silicide, nitride and carbide (WSi ₂ , AlN, TiN, Si ₃ N ₄ and SiC, etc.) is used. Also good. Further, the surface roughness of these joint surfaces is reduced by polishing the respective joint surfaces of the substrate 2 and the reinforcing plate 3 without using the resin layer 5, and the substrate 2 and the reinforcing plate 3 are joined. Also good.

  FIG. 2 is an enlarged side view of a main part of the laminate 6 produced in the course of the electronic device manufacturing process.

[Laminate 6]
The laminated body 6 is configured by joining two laminated plates 1 and 1 in which functional layers are formed on the surface of the substrate 2 of the laminated plate 1 in FIG. 1 so that the respective functional layers are opposed to each other. The type of functional layer is selected according to the type of electronic device. A plurality of functional layers may be sequentially stacked on the surface of the substrate 2. As a method for forming the functional layer, a general method is used. For example, a vapor deposition method such as a CVD method or a PVD method, a sputtering method, or the like is used. The functional layer is formed in a predetermined pattern by a photolithography method and an etching method.

  2 includes a reinforcing plate 3A, a substrate 2A, a liquid crystal layer (functional layer) 7, a substrate 2B, and a reinforcing plate 3B from the upper layer to the lower layer. That is, a laminated plate 1A composed of the substrate 2A and the reinforcing plate 3A is provided on the upper layer side with the central liquid crystal layer 7 interposed therebetween, and a laminated plate 1A composed of the substrate 2B and the reinforcing plate 3B is provided on the lower layer side.

  The laminated body 6 of FIG. 2 is produced in the middle of the LCD manufacturing process. A thin film transistor (TFT) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, that is, the surface of the substrate 2A, and a color filter (CF) is formed on the surface of the substrate 2B on the liquid crystal layer 7 side, that is, the surface of the substrate 2B. A liquid crystal layer 7 as a functional layer is formed by the thin film transistor and the color filter.

  In addition, although the laminated body 6 of FIG. 2 is the structure by which reinforcement board 3A, 3B is arrange | positioned at both sides, as a laminated body, the structure by which the reinforcement board was arrange | positioned only at one side may be sufficient.

  In the laminate 6, the reinforcing plates 3A and 3B are peeled off in the peeling step. Electronic components such as a backlight are attached to the back surfaces of the substrates 2A and 2B from which the reinforcing plates 3A and 3B have been peeled off, whereby an LCD as a product is manufactured. A peeling device described later is used for peeling the reinforcing plates 3A and 3B.

[Substrate peeling method of the present invention]
First, before explaining the substrate peeling apparatus of the embodiment, the substrate peeling method of the present invention will be explained.

  For example, in the laminate 1 shown in FIG. 1, the substrate peeling method of the present invention shows the interface between the substrate 2 and the reinforcing plate 3 in the plan view of the rectangular laminate 1 shown in FIG. As shown in FIG. 4, the peeling method is basically based on a peeling method in which peeling is performed sequentially along the peeling progress direction indicated by the arrow D from the corner (one end) 8 side to the corner (other end) 9 side.

  Next, reference numerals E, F, G, H, J, K, L, M, N, and 12 shown in FIG.

  Reference symbol E denotes a peeling front (boundary line) between the peeling region 10 where the interface is peeled off and the non-peeling region 11.

  Reference numerals F and G are two intersections of the peeling front E and the outer periphery of the substrate 2.

  A symbol H is a straight line connecting the intersections F and G.

  Reference numerals J and K are tangents on the outer periphery of the substrate 2 in the peeling region 10.

  Reference numerals M and N are tangents at the end of the peeling front E.

  Reference numeral 12 denotes a peeling range in which an angle formed by the straight line H and the tangent lines J and K is at least 90 degrees or less. This peeling range is a range of a triangle in plan view surrounded by a two-dot chain line L and tangent lines J and K.

  The substrate peeling method of the present invention is characterized in that, in the peeling range 12, the interface is peeled so that the angle θ formed between the tangent lines M and N and the tangent lines J and K is larger than 90 degrees.

  FIG. 3B is an explanatory view of a main part showing the peeling progress direction of the peeling front E by the substrate peeling method of the present invention.

  The peeling front E that progresses in the peeling range 12 does not pass in the direction in which the crack 13 extends when passing through the crack 13 generated at the end of the substrate 2, and from the inside of the substrate 2 as indicated by the arrow P, from the substrate 2. Pass in the direction facing the edge of the. Thereby, since the force which peels an interface does not act in the direction which extends the crack 13, the crack 13 does not extend with progress of the peeling front E. Therefore, according to the substrate peeling method of the present invention, it is possible to peel the substrate 2 satisfactorily even when the crack 13 is generated on the substrate 2.

  The reason for defining the peeling range 12 is that the angle θ may be larger than 90 degrees in the range exceeding the peeling range 12 even in the conventional peeling method shown in FIG. It is. In this case, cracks do not extend even with the conventional peeling method. That is, the substrate peeling method of the present invention prevents the substrate 2 from cracking due to the cracks 13 existing in the peeling range 12.

  Moreover, the peeling method of Fig.3 (a) is a peeling method which peels an interface sequentially along the peeling advancing direction shown by the arrow D toward the corner part 9 side from the corner part 8 side. On the other hand, another peeling method in FIG. 4 is a peeling in which the interface is sequentially peeled by advancing the peeling front E along the peeling progress direction indicated by the arrow Q from the short side 2C to the short side 2D of the substrate 2. Is the method. In the case of the peeling method of FIG. 4, the entire surface of the substrate 2 is the peeling range 12.

  Further, in the case of the circular substrate 1C shown in FIG. 5, the interface is peeled by the same peeling method. That is, a straight line H connecting two intersections F and G between the peeling front E which is a boundary line between the peeling area 10 where the interface is peeled and the non-peeling area 11 and the outer periphery of the substrate 2, and the substrate 2 in the peeling area 10 In the peeling range (a semi-circular range in plan view surrounded by the two-dot chain line L and the tangents J and K) 12 where the angle formed by the outer tangents J and K is at least 90 degrees or less, the end of the peeling front E The interface is peeled off so that the angle θ between the tangent lines M and N and the tangent lines J and K is greater than 90 degrees. In this case, the same effect can be obtained. The above is the substrate peeling method of the present invention, which can solve the conventional problems.

  Next, the substrate peeling apparatus of the present invention will be described.

[Substrate peeling apparatus of the present invention]
FIG. 6 is a longitudinal sectional view of a main part showing the basic configuration of the peeling apparatus 20. FIG. 7 is a plan view of the flexible plate 22 schematically showing the arrangement positions of the plurality of movable bodies 24, 24... Relative to the flexible plate 22 described later. 6 corresponds to a cross-sectional view taken along line RR in FIG.

  As shown in FIG. 6, the peeling device 20 peels the interface between the substrate 2 and the reinforcing plate 3 sequentially from the corner 8 side toward the corner 9 side. At the time of peeling, a peeling front E that is a boundary line between the peeling area 10 and the non-peeling area 11 where the interface is peeled as shown in FIG.

  The peeling device 20 is a device that peels the interface by supporting the substrate 2 so that it cannot be deformed and flexing and deforming the reinforcing plate 3. However, the peeling device 20 flexes the substrate 2 while supporting the reinforcing plate 3 so that it cannot be deformed. It may be an apparatus that deforms and peels off the interface.

  The peeling apparatus 20 includes a flat plate stage 26 as a support means, a flexible plate 22, a plurality of movable bodies 24, 24..., A plurality of drive devices 28 that move the movable body 24 up and down for each movable body 24, and a drive. Each device 28 includes a control device (control means) 30 that controls the drive device 28.

  The stage 26 holds the first main surface (surface of the substrate 2) 1a of the laminated plate 1 by vacuum suction in order to support the substrate 2. Instead of vacuum suction, electrostatic suction or magnetic suction may be used. The stage 26 is made of a highly rigid metal in order to support the substrate 2 so as not to be deformed at the time of peeling.

  The flexible plate 22 holds the second main surface 1b of the laminated plate 1 by vacuum suction so as to bend and deform the reinforcing plate 3. Instead of vacuum suction, electrostatic suction or magnetic suction may be used.

  FIG. 8A is a plan view of the flexible plate 22, and FIG. 8B is a longitudinal sectional view of the flexible plate 22 taken along the line S-S in FIG. 8A.

  The flexible plate 22 includes a cloth-like suction sheet 32 that sucks and holds the second main surface 1b of the laminated plate 1, an elastic sheet 34 that is covered with the suction sheet 32, and a main body plate 36 that supports the elastic sheet 34. Composed. A frame-like groove 38 is provided on the surface of the elastic sheet 34, and the suction sheet 32 is covered inside the groove 38. Further, a plurality of through holes 40, 40... Are opened in the main body plate 36. One end of these through holes 40, 40... Is communicated with the groove 38, and the other end is connected to a suction pipe (not shown). To an intake source (for example, a vacuum pump).

  Accordingly, when the intake source is driven, the air in the suction pipe, the through hole 40, and the groove 38 is sucked, whereby the second main surface 1b of the laminated plate 1 is vacuum-sucked and held on the suction sheet 32. Is done. In this case, the outer shape of the suction sheet 32 is set larger than the outer shape of the second main surface 1b of the laminated plate 1 so that the adsorption sheet 32 can support the second main surface 1b of the laminated plate 1 as a whole. Yes. The material of the elastic sheet 34 is not particularly limited, but rubber is preferable. As the rubber, silicone rubber is preferable.

The main body plate 36 is the same size as the elastic sheet 34. The main body plate 36 has higher bending rigidity than the elastic sheet 34, and the bending rigidity of the main body plate 36 dominates the bending rigidity of the flexible plate 22. The flexural rigidity per unit width (1 mm) of the flexible plate 22 is preferably 1000 to 40000 N · mm ² / mm. For example, in a portion where the width of the flexible plate 22 is 100 mm, the bending rigidity is 100000 to 4000000 N · mm ² . By setting the bending rigidity of the flexible plate 22 to 1000 N · mm ² or more, it is possible to prevent the plate (the reinforcing plate 3 in this embodiment) that the flexible plate 22 absorbs and holds. In addition, by setting the bending rigidity of the flexible plate 22 to 4000 N · mm ² or less, the plate that the flexible plate 22 holds by suction can be appropriately bent and deformed.

  As the main body plate 36, for example, a resin plate such as polyvinyl chloride (PVC) resin, polycarbonate resin, acrylic resin, polyacetal (POM) resin, or a metal plate is used.

  The method and structure for supporting the first main surface 1a of the laminated plate 1 by the stage 26 are also substantially the same as the vacuum suction holding method and the structure by the flexible plate 22.

  As shown in FIG. 6, the disk-like movable bodies 24, 24... Shown in FIG. These movable bodies 24, 24... Are fixed to the main body plate 36 by fastening members such as bolts, but may be bonded and fixed instead of the bolts. These movable bodies 24, 24... Are moved up and down independently with respect to the stage 26 by drive devices 28, 28.

  That is, the control device 30 moves the movable bodies 24, 24... Located on the corner 9 side in the peeling progress direction indicated by the arrow D from the movable bodies 24, 24. On the other hand, it is sequentially moved downward in the direction of separation. With this operation, the interface between the substrate 2 and the reinforcing plate 3 is sequentially peeled from the corner 8 side toward the corner 9 as shown in the longitudinal sectional view of FIG.

  The drive device 28 is composed of, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 42 of the ball screw mechanism. A movable body 24 is provided at the tip of the rod 42 via a ball joint 44. Thereby, the movable body 24 separated from the stage 26 can be tilted following the bending deformation of the flexible plate 22 as shown in FIG. Therefore, the flexible plate 22 can be bent and deformed without applying an excessive force to the flexible plate 22. The drive device 28 is not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

  The plurality of driving devices 28 are preferably attached to a frame 46 that can be moved up and down with respect to the stage 26 via a cushion member 48. The cushion member 48 is elastically deformed so as to follow the bending deformation of the flexible plate 22. As a result, the rod 42 tilts with respect to the stage 26.

  The frame 46 is moved downward by a drive unit (not shown) when the peeled reinforcing plate 3 is removed from the flexible plate 22. Thereby, a sufficient working space for taking out the reinforcing plate 3 is obtained between the stage 26 and the flexible plate 22. Similarly, the stage 26 is also moved up and down by the drive units 50, 50... And moved forward and backward with respect to the flexible plate 22.

  The control device 30 is configured as a computer including a CPU, a recording medium such as a ROM and a RAM, and the like. The control device 30 controls the plurality of drive devices 28 for each drive device 28 by causing the CPU to execute the program recorded on the recording medium, thereby controlling the vertical movement of the plurality of movable bodies 24, 24.

  Next, the structure of the 1st peeling apparatus for obtaining the peeling front E shown in Fig.3 (a) is demonstrated.

[Configuration of first peeling apparatus]
FIG. 10A is a longitudinal sectional view of the main part showing a state before the laminated plate 1 is held by the peeling means composed of the stage 26 and the flexible plate 22, and FIG. FIG. 10C is a main part longitudinal sectional view showing the substrate 2 and the reinforcing plate 3 whose interface is completely peeled off by the peeling means.

  Moreover, Fig.11 (a) is a top view of the laminated board 1 in which the peeling front E in progress was shown, FIG.11 (b) is a longitudinal cross-sectional view which follows the TT line | wire of Fig.11 (a). It is.

  As shown in FIGS. 10A to 10C, the elastic sheet 34 of the flexible plate 22 has a first suction that holds the frame-shaped outer edge 1c of the second main surface 1b of the laminated plate 1 by suction. A second suction surface 22B that sucks and holds the second main surface 1b having a rectangular shape excluding the surface 22A and the outer edge 1c is provided. The second suction surface 22B is a surface parallel to the second main surface 1b, and the first suction surface 22A is a protruding surface that protrudes a predetermined amount from the second suction surface 22B.

  The elastic sheet 52 constituting the stage 26 is also provided with the same first suction surface 52A and second suction surface 52B. That is, the elastic sheet 34 includes a first suction surface 52A that sucks and holds the frame-shaped outer edge 1d of the first main surface 1a of the laminated plate 1, and a rectangular first main surface 1a excluding the outer edge 1d. A second suction surface 52B is provided for sucking and holding. The second suction surface 52B is a surface parallel to the first main surface 1a, and the first suction surface 52A is a protruding surface that protrudes from the second suction surface 52B by a predetermined amount.

  As an example, the protrusion amount t of the first suction surfaces 22A and 52A is about 0.5 mm, and the width w of the first suction surfaces 22A and 52A is 2 to 10 mm. The first suction surfaces 22 </ b> A and 52 </ b> A may be provided on at least one of the stage 26 and the flexible plate 22. In this case, the protrusion amount t is about 1.0 mm.

  According to the first peeling apparatus configured as described above, as shown in FIG. 7, the movable body 24 positioned on the corner 8 side in the peeling progress direction indicated by the arrow D is positioned on the corner 9 side in the peeling progress direction. When the movable body 24 to be moved is sequentially moved downward by the control device 30 in a direction away from the stage 26 as shown in FIG. 9, the outer edges 1c and 1d of the laminated plate 1 become the outer edge 1c, as shown in FIG. It peels later than the surface except 1d.

  Thus, according to the first peeling apparatus, as shown in FIG. 3A, the angle θ formed by the tangent lines M and N at the end of the peeling front E and the tangent lines J and K at the outer periphery of the peeling region 10 is 90. Therefore, even when the crack 13 shown in FIG. 3B has occurred in the substrate 2, the substrate 2 can be peeled off satisfactorily.

  FIG. 12A shows another type of peeling apparatus in which the thickness of the first suction surfaces 22A and 52A is changed to have a two-stage configuration. FIG. 12B shows a two-stage configuration of the first suction surfaces 22A and 52A, in which two layers of intermediate films 54 and 56 having different lengths are stacked on the back side of the first suction surfaces 22A and 52A. Another type of peeling apparatus is shown. Similar effects can be obtained even with these different types of peeling devices. The same applies when the first suction surfaces 22A and 52A are inclined surfaces.

  The first peeling apparatus described above is characterized in that the elastic sheets 34 and 52 are provided with the first suction surfaces 22A and 52A.

  Next, the second peeling apparatus will be described.

[Configuration of second peeling apparatus]
The difference between the configuration of the second peeling device and the configuration of the first peeling device is that the suction surface of the elastic sheet 34 of the flexible plate 22 and the suction surface of the elastic sheet 52 of the stage 26 are flat without a step. The separation movement start time of the movable body 24 located on the point and the outer edge 1c of the second main surface 1b is set to a predetermined time than the separation movement start time of the movable body 24 located on the second main surface 1b excluding the outer edge 1c. It is a point to delay.

  FIGS. 13A and 13B schematically show the form of peeling by the second peeling apparatus.

  FIG. 13A is a plan view of the flexible plate 22 in which the peeling front E advances from the corner 8 side toward the corner 9 side, and FIG. 13B shows the U of FIG. 13A. It is a longitudinal cross-sectional view which follows the -U line.

  Next, a substrate peeling method using the second peeling apparatus will be described with reference to FIGS. 10 (a), 13 (a), and 13 (b).

  The substrate peeling method by the second peeling apparatus is such that the movable body 24 located on the second main surface 1b excluding the outer edge 1c is set to the separation start time of the movable body 24 located on the outer edge 1c of the second main surface 1b. The controller 30 delays the separated movement start time by a predetermined time. Thereby, as shown in FIG. 13B, the outer edge of the reinforcing plate 3 is peeled off later than the surface excluding the outer edge. Such control by the control device 30 is performed for a plurality of movable bodies 24, 24,... Arranged in a direction substantially perpendicular to the arrow D that is the peeling progress direction of the peeling front E (see FIG. 3A). To do.

  Thereby, according to the substrate peeling method by the second peeling apparatus, as shown in FIG. 3A, the tangent lines M and N at the end of the peeling front E and the tangent line J at the outer periphery of the substrate 2 in the peeling region 10 Since the angle θ formed with K is greater than 90 degrees, the substrate 2 can be satisfactorily peeled even when the crack 13 (see FIG. 3B) has occurred in the substrate 2.

[Lamination board loading process, peeling process, unloading process]
14 (a) to 14 (c) to 15 (a) to 15 (c) show a carrying-in process for carrying the laminated board 1 into the peeling device 20, a peeling process for the laminated board 1, and the peeled board 2 and the reinforcing board 3; It is explanatory drawing which showed the carrying-out process which carries out from the peeling apparatus 20 in time series. Moreover, the carrying-in operation | work of carrying in the laminated board 1 to the peeling apparatus 20 and carrying out the peeled reinforcement board 3 and the board | substrate 2 are carried out by the conveying apparatus 60 provided with several suction pad 58, 58 ... shown to Fig.14 (a). Done.

  FIG. 14A is a side view of the peeling device 20 in which the laminated plate 1 is placed on the flexible plate 22 by the transport device 60. In this case, the flexible plate 22 and the stage 26 are moved in advance to a relatively sufficiently retracted position so that the transport device 60 is inserted between the flexible plate 22 and the stage 26. When the laminated plate 1 is placed on the flexible plate 22, the reinforcing plate 3 of the laminated plate 1 is held by vacuum suction by the flexible plate 22. That is, the second main surface 1 b of the laminated plate 1 is vacuum-sucked and held on the flexible plate 22.

  FIG. 14B shows a peeling device in a state where the flexible plate 22 and the stage 26 are moved in a direction in which the flexible plate 22 and the stage 26 are relatively approached and the first main surface 1a of the laminated plate 1 is vacuum-sucked and held by the stage 26. FIG.

  FIG. 14C is a side view of the peeling device 20 in a state where the peeling method of the present invention is being carried out by the peeling device 20. According to the figure, the interface of the laminated plate 1 is peeled along the peeling front E while the flexible plate 22 is bent and deformed.

  FIG. 15A is a side view of the peeling apparatus 20 with the interface completely peeled off. According to the figure, the peeled substrate 2 is held by vacuum suction on the stage 26, and the peeled reinforcing plate 3 is held by vacuum suction on the flexible plate 22. Further, the flexible plate 22 and the stage 26 are relatively sufficiently retracted so that the transfer device 60 shown in FIG. 14A is inserted between the flexible plate 22 and the stage 26. It has been moved to the position in advance.

  Thereafter, the vacuum suction of the flexible plate 22 is first released. Next, the reinforcing plate 3 is sucked and held by the suction pads 58 of the transfer device 60. Next, the reinforcing plate 3 is unloaded from the peeling device 20 by the transport device 60.

  FIG. 15B is a side view of the peeling apparatus 20 in a state where the substrate 2 is transferred from the stage 26 to the flexible plate 22. That is, the stage 26 is moved downward toward the flexible plate 22, and the suction holding of the stage 26 is released by the timing when the substrate 2 is placed on the flexible plate 22, and then the stage 26 is moved to the flexible plate 22. It is retracted to a position sufficiently separated from 22.

  FIG. 15C is a side view of the peeling apparatus 20 in a state immediately before the substrate 2 is unloaded. Thereafter, the substrate 2 is sucked and held by the transfer device 60 shown in FIG. 14A, and the substrate 2 is unloaded from the peeling device 20.

  The above are the carrying-in process of the laminated board 1 with respect to the peeling apparatus 20, a peeling process, and a carrying-out process.

[Loading process, peeling process, and unloading process of the laminate with respect to the peeling device]
16 (a) to (c) to FIG. 17 (a) to (c) to FIG. 18 (a) to (c) are a carrying-in process for carrying the laminated body 6 shown in FIG. A panel 62 for an electronic device composed of the liquid crystal layer 7 and the substrate 2A, 2B from which the reinforcing plates 3A, 3B are peeled off, and the unloading step for carrying out the peeling process of the body 6, the peeled reinforcing plates 3A, 3B from the peeling device 20. It is explanatory drawing which showed the carrying-out process carried out from the peeling apparatus 20 in time series. Moreover, the carrying-in operation | work of the laminated body 6 to the peeling apparatus 20 and the carrying-out operation | work of the peeled reinforcement plates 3A and 3B and the panel 62 are performed by the conveying apparatus 60 shown to Fig.14 (a).

  Also, the peeling device 20 shown in FIGS. 16 to 18 has a flexible plate 64 disposed in place of the stage 26, and peels the reinforcing plates 3A and 3B by a pair of flexible plates 22 and 64 positioned above and below. It has a function to let you. That is, the flexible plate 64 has the same function as the flexible plate 22. That is, the flexible plate 64 includes a movable body (not shown) that is the same as the movable body 24 that bends and deforms the flexible plate 22, a drive device (not shown) that is the same as the drive device 28, and the control device 30. The same control device (not shown) is provided.

  FIG. 16A is a side view of the peeling device 20 in which the laminate 6 is placed on the flexible plate 22 by the transport device 60. In this case, the flexible plate 22 and the flexible plate 64 are relatively retracted so that the transport device 60 is inserted between the flexible plate 22 and the flexible plate 64. It has been moved in advance. When the laminated body 6 is placed on the flexible plate 22, the reinforcing plate 3 </ b> B of the laminated body 6 is held by vacuum suction by the flexible plate 22. That is, the second main surface 6 b of the stacked body 6 is held by vacuum suction on the flexible plate 22.

  In FIG. 16B, the flexible plate 22 and the flexible plate 64 are moved in a relatively approaching direction, and the first main surface 6 a of the laminate 6 is vacuum-sucked and held by the flexible plate 64. It is a side view of the peeling apparatus 20 of the state made.

  FIG. 16C is a side view of the peeling device 20 in a state where the peeling method of the present invention is being carried out by the peeling device 20. According to the figure, the interface between the substrate 2B and the reinforcing plate 3B of the laminate 6 is peeled along the peeling front E while the flexible plate 22 is bent and deformed.

  FIG. 17A is a side view of the peeling apparatus 20 in a state where the interface between the substrate 2B and the reinforcing plate 3B is completely peeled. According to the figure, the peeled reinforcing plate 3B is vacuum-sucked and held on the flexible plate 22, and a laminated body 66 (a laminated body comprising the reinforcing plate 3A, the substrate 2A, the liquid crystal layer 7, and the substrate 2B) excluding the reinforcing plate 3B. ) Is held by vacuum suction on the flexible plate 64. In addition, the flexible plate 22 and the flexible plate 64 are relative to each other so that the conveyance device 60 shown in FIG. 14A is inserted between the flexible plate 22 and the flexible plate 64. Therefore, it has been moved in advance to a fully retracted position.

  Thereafter, the vacuum suction of the flexible plate 22 is first released. Next, the reinforcing plate 3B is sucked and held by the suction pads 58, 58. Next, the reinforcing plate 3 </ b> B is unloaded from the peeling device 20 by the transport device 60.

  FIG. 17B is a side view of the peeling device 20 in which the laminate 66 is held by vacuum suction by the flexible plate 22 and the flexible plate 64. That is, the flexible plate 22 and the flexible plate 64 are moved in a direction in which the flexible plate 22 and the flexible plate 64 are relatively approached, and the laminate 66 is held by vacuum suction between the flexible plate 22 and the flexible plate 64.

  FIG. 17C is a side view of the peeling device 20 in a state where the peeling method of the present invention is being carried out by the peeling device 20. According to the figure, while the flexible plate 64 is bent and deformed, the interface between the substrate 2A and the reinforcing plate 3A of the laminate 66 is peeled along the peeling front E.

  FIG. 18A is a side view of the peeling device 20 in a state where the interface between the substrate 2A and the reinforcing plate 3A is completely peeled. According to the figure, the peeled reinforcing plate 3A is held by vacuum suction on the flexible plate 64, and the panel 62 is held by vacuum suction on the flexible plate 22. In addition, the flexible plate 22 and the flexible plate 64 are relative to each other so that the conveyance device 60 shown in FIG. 14A is inserted between the flexible plate 22 and the flexible plate 64. Therefore, it has been moved in advance to a fully retracted position.

  Thereafter, the vacuum suction of the flexible plate 22 is first released. Next, the panel 62 is sucked and held by the suction pads 58 of the transfer device 60. Next, the panel 62 is carried out of the peeling device 20 by the transport device 60.

  FIG. 18B is a side view of the peeling device 20 in a state where the reinforcing plate 3 </ b> A is transferred from the flexible plate 64 to the flexible plate 22. That is, the flexible plate 64 is moved downward toward the flexible plate 22, and the adsorption and holding of the flexible plate 64 is released by the timing when the reinforcing plate 3 </ b> A is placed on the flexible plate 22. The flexible plate 64 is retracted to a position sufficiently separated from the flexible plate 22.

  FIG. 18C is a side view of the peeling device 20 in a state immediately before the reinforcing plate 3A is carried out. Thereafter, the reinforcing plate 3 </ b> A is sucked and held by the transport device 60 shown in FIG. 14A, and the reinforcing plate 3 </ b> A is carried out from the peeling device 20.

  The above are the carrying-in process of the laminated body 6 with respect to the peeling apparatus 20, a peeling process, and a carrying-out process.

  As mentioned above, although the preferable form of this invention was demonstrated, this invention is not restrict | limited to the said form. Various modifications and substitutions can be made to the above forms without departing from the scope of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Laminated board, 1a ... 2nd main surface, 1b ... 1st main surface, 2 ... Board | substrate, 3, 3A, 3B ... Reinforcement plate, 4 ... Support plate, 5 ... Resin layer, 6 ... Laminated body, 7 ... Liquid crystal layer, 8, 9 ... Corner, 10 ... Peeling area, 11 ... Unpeeling area, 12 ... Peeling area, 13 ... Crack, 20 ... Peeling device, 22 ... Flexible plate, 22A ... First adsorption surface 22B ... second suction surface, 24 ... movable body, 26 ... stage, 28 ... drive device, 30 ... control device, 32 ... adsorption sheet, 34 ... elastic sheet, 36 ... main plate, 38 ... groove, 40 ... penetration Hole, 42 ... Rod, 44 ... Ball joint, 46 ... Frame, 48 ... Cushion member, 50 ... Drive part, 52 ... Elastic sheet, 52A ... First suction surface, 52B ... Second suction surface, 54, 56 ... Intermediate film 58 ... Adsorption pad 60 ... Conveying device 62 ... Panel 64 ... Flexible plate 66 ... Product Body

Claims (6)

In the substrate peeling apparatus that sequentially peels the interface between the substrate and the reinforcing plate that reinforces the substrate from the one end side toward the other end side along the peeling progress direction,
An angle formed by a straight line connecting two intersections between the boundary line between the peeling area and the non-peeling area where the interface is peeled off and the outer periphery of the substrate, and the tangent line of the outer periphery of the substrate in the peeling area is at least 90 degrees In the following peeling range:
A peeling means for peeling the interface so that an angle formed between a tangent at an end of the boundary line and a tangent to the outer periphery of the substrate in the peeling region is larger than 90 degrees ;
The peeling means includes
Support means for supporting the first main surface of the laminate including the substrate and the reinforcing plate;
A flexible plate having a first suction surface for sucking and holding the outer edge of the second main surface of the laminate, and a second suction surface for sucking and holding the second main surface excluding the outer edge; The second suction surface is a surface parallel to the second main surface, and the first suction surface is a projecting surface projecting a predetermined amount with respect to the second suction surface. The board,
A plurality of movable bodies fixed to the flexible plate at intervals and movable independently of the support means;
Control means for sequentially moving the movable body located on the other end side in the peeling progress direction from the movable body located on the one end side in the peeling progress direction in a direction away from the support means. A substrate peeling apparatus.   The substrate peeling apparatus according to claim 1, wherein the substrate is a glass substrate having a thickness of 0.2 mm or less. In the peeling method of the substrate, the interface between the substrate and the reinforcing plate that reinforces the substrate is sequentially peeled along the peeling progress direction from one end side to the other end side.
An angle formed by a straight line connecting two intersections between the boundary line between the peeling area and the non-peeling area where the interface is peeled off and the outer periphery of the substrate, and the tangent line of the outer periphery of the substrate in the peeling area is at least 90 degrees In the following peeling range:
The interface is peeled off by a peeling means so that an angle formed between a tangent line at an end of the boundary line and a tangent line of the outer periphery of the substrate in the peeling region is larger than 90 degrees ,
The peeling method by the peeling means is:
Support means for supporting the first main surface of the laminate including the substrate and the reinforcing plate;
A flexible plate having a first suction surface for sucking and holding the outer edge of the second main surface of the laminate, and a second suction surface for sucking and holding the second main surface excluding the outer edge; The second suction surface is a surface parallel to the second main surface, and the first suction surface is a projecting surface projecting a predetermined amount with respect to the second suction surface. The board,
A plurality of movable bodies fixed to the flexible plate at intervals and movable independently with respect to the support means,
The movable body positioned on the other end side in the peeling progress direction is sequentially moved by the control means in a direction to be separated from the support means from the movable body positioned on the one end side in the peeling progress direction. A method for peeling the substrate. The substrate peeling method according to claim 3 , wherein the substrate is a glass substrate having a thickness of 0.2 mm or less. In a method for manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on a surface of a substrate reinforced with a reinforcing plate; and a peeling step of peeling the substrate on which the functional layer is formed and the reinforcing plate.
The peeling step includes
A plurality of substrates fixed at intervals to a flexible plate that supports the first main surface of the laminate including the substrate and the reinforcing plate by a supporting means and sucks and holds the second main surface of the laminate. Controlling the movement of the movable body with respect to the support means to sequentially peel the interface between the substrate and the reinforcing plate along the peeling progress direction from one end side to the other end side,
The flexible plate may have a first suction surface for sucking and holding the outer edge of the second main surface of the laminate, and a second suction surface for sucking and holding the second main surface excluding the outer edge. A flexible plate, wherein the second suction surface is parallel to the second main surface, and the first suction surface protrudes a predetermined amount with respect to the second suction surface. With a protruding surface,
An angle formed by a straight line connecting two intersections between the boundary line between the peeling area and the non-peeling area where the interface is peeled off and the outer periphery of the substrate, and the tangent line of the outer periphery of the substrate in the peeling area is at least 90 degrees In the following peeling range:
The step of peeling the interface so that the angle formed by the tangent at the end of the boundary line and the tangent to the outer periphery of the substrate in the peeling region is larger than 90 degrees. Production method. The method of manufacturing an electronic device according to claim 5, wherein the substrate is a glass substrate having a thickness of 0.2 mm or less.

Images