TWI601682B - Substrate stripping apparatus and stripping method, and electronic device manufacturing method - Google Patents

Description

Substrate stripping device and peeling method, and electronic component manufacturing method

The present invention relates to a peeling device and a peeling method of a substrate which peels off an interface between a substrate and a reinforcing plate, and a method of manufacturing the electronic component.

In recent years, as electronic components such as display panels, solar cells, and thin film secondary batteries have become thinner and lighter, there has been a demand for thinning of substrates for electronic components. However, when the strength of the substrate is lowered due to the thinning, the handleability of the substrate is deteriorated, so that it is difficult to form electronic components such as a thin film transistor (TFT) and a color filter (CF: color filter) on the surface of the substrate. Use the functional layer.

Therefore, there has been proposed a method in which a laminated plate (in a broad sense, a laminated body) in which a reinforcing plate is detachably attached to a back surface of a substrate, and a functional layer is formed on the front surface of the substrate of the laminated plate, and then the substrate and the reinforcing plate are peeled off. (For example, refer to Patent Document 1). Hereinafter, the surface on which the functional layer is formed is referred to as the "front surface" of the substrate, and the surface on which the reinforcing plate is attached is referred to as the "back surface" of the substrate.

The peeling method of the patent document 1 is a method of bending and deforming the board|substrate of at least one of a board|substrate and a reinforcement board so that the interface of the back surface of a board|substrate and a reinforcement board may mutually isolate from the one end side to the other end side. Strip the entire interface. The bending deformation is performed by suctioning and holding at least one of the substrate and the reinforcing plate by the flexible plate, and moving the plurality of movable bodies fixed to the flexible plate independently.

Fig. 19 (a) is a plan view schematically showing a laminated board 100 in a peeling form of a substrate in Patent Document 1. Fig. 19 (b) is a side view showing a peeling form of the substrate.

As shown in FIG. 19(b), the laminated board 100 includes a substrate 102 and a reinforcing plate 104 attached to the back surface of the substrate 102. The broken line A in FIG. 19(a) and the symbol A in FIG. 19(b) are the boundary line between the peeled region 106 in which the interface between the substrate 102 and the reinforcing plate 104 has been peeled off, and the unpeeled region 108 in which the interface is not peeled off (hereinafter also referred to as "Peeling front line", which is indicated by the symbol A below). In order to advance the peeling front line A substantially parallel to the corner portion 112 side from the corner portion 110 side of the laminated board 100 as shown by an arrow B in Fig. 19(a), the plurality of movable bodies 114 and 114 of Fig. 19(b) are caused. ... as the arrow C moves down in sequence.

The front surface of the substrate 102 is non-deformably supported by a flat-shaped stage 116 as a support mechanism, and the reinforcing plate 104 is adsorbed and held by the elastically deformable flexible plate 118. The movable bodies 114, 114, ... are fixed in a checkerboard shape on the flexible plate 118. In other words, the plurality of movable bodies 114, 114, which are arranged in a direction substantially orthogonal to the direction of the peeling of the peeling front line A, that is, the arrow B, are simultaneously lowered and moved, whereby the flexible sheet 118 is continuously bent and deformed, whereby the front line is peeled off. A travels in the direction of arrow B.

Further, in Patent Document 1, the flexible plate 118 is bent and deformed by the movable bodies 114, 114, etc. so that the radius of curvature a of the peeling region 106 is 250 mm to 2,500 mm.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/024689

However, in the peeling form of the substrate of Patent Document 1, there is a problem that when a fine crack (hereinafter referred to as a crack) 120 is generated at the end portion of the substrate 102 as shown in Fig. 19 (a), the turtle is peeled off. The crack 120 stretches to cause the substrate 102 to break (fracture).

The mechanism of the fracture of the substrate 102 due to the crack 120 is shown in Fig. 19(c).

When the peeling front line A that travels in the direction of the arrow B on the interface passes through the crack 120, it will make the turtle The direction of the crack 120 is extended. That is, the peeling traveling direction indicated by the arrow B of the peeling front line A becomes the direction from the edge portion 102A of the substrate 102 toward the inner side of the substrate 102. Thereby, the force for peeling off the interface acts on the direction in which the crack 120 is stretched, so that the crack 120 extends together with the peeling front line A as indicated by the symbol 122. It was found by experimentation that the substrate 102 was broken due to this mechanism.

The present invention has been made in view of such a situation, and an object of the present invention is to provide a peeling apparatus, a peeling method, and a method of manufacturing an electronic component, which can peel a substrate well even when a substrate is cracked.

In order to achieve the above object, in a stripping apparatus for a substrate according to an aspect of the present invention, the interface between the substrate and the reinforcing plate for reinforcing the substrate is sequentially peeled off from the one end side toward the other end side, and the peeling device is sequentially removed. A peeling mechanism is provided in which a straight line connecting a boundary line between a peeling region and an unpeeled region where the interface is peeled off and an outer circumference of the substrate is connected, and a wiring of the outer periphery of the substrate in the peeling region The angle formed is such that the angle is at least 90 degrees or less, and the interface is peeled off so that the angle between the end of the boundary line and the line of the outer periphery of the substrate in the peeling region is greater than 90 degrees.

In order to achieve the above object, in a method for peeling off a substrate according to an aspect of the present invention, the interface between the substrate and the reinforcing plate for reinforcing the substrate is sequentially peeled off from the one end side toward the other end side, and the peeling method is performed. A line formed by connecting a boundary line separating the boundary between the peeled region and the unpeeled region of the interface and the outer periphery of the substrate, and an angle formed by the wiring of the outer periphery of the substrate in the peeling region is at least In the peeling range of 90 degrees or less, the interface is peeled off by the peeling means so that the angle formed by the end of the boundary line and the line of the outer periphery of the said peeling area is more than 90 degrees.

In order to achieve the above object, a method of manufacturing an electronic component according to an aspect of the present invention is a functional layer forming step of forming a functional layer on a front surface of a substrate reinforced by a reinforcing plate, and a peeling step of peeling the substrate on which the functional layer is formed and the reinforcing plate, wherein the electronic component manufacturing method is characterized by The peeling step is a step of sequentially peeling the interface between the substrate and the reinforcing plate in a peeling traveling direction from one end side toward the other end side, and a boundary line between the peeling region and the non-stripping region where the interface is peeled off. a straight line connecting the two intersections of the outer periphery of the substrate, and an angle formed by the wiring of the outer periphery of the substrate in the peeling region is at least 90 degrees or less, and the tangent of the end portion of the boundary line is The interface is peeled off at an angle of more than 90 degrees from the outer circumference of the substrate in the peeling region.

According to one aspect of the peeling form of the present invention, the boundary line (peeling front line) which travels within the peeling range does not pass through the crack in the direction of the crack when it passes through the crack generated at the end of the substrate, but Passing from the inner side of the substrate toward the edge of the substrate. Thereby, the force of the peeling interface does not act in the direction in which the crack is stretched, and therefore the crack does not extend together with the progress of the boundary line. Therefore, according to one aspect of the peeling form of the present invention, the substrate can be favorably peeled off even when cracks occur in the substrate.

One aspect of the present invention is preferably a glass substrate having a substrate thickness of 0.2 mm or less.

According to an aspect of the present invention, it is suitable for a peeling device and a peeling method for a glass substrate corresponding to a reduction in thickness of an electronic component.

In one aspect of the substrate peeling apparatus of the present invention, preferably, the peeling mechanism includes: a support mechanism that supports a first main surface including the laminate of the substrate and the reinforcing plate; and a flexible plate having a first adsorption surface that adsorbs and holds the outer edge of the second main surface of the laminate, and a second adsorption surface that adsorbs and holds the second main surface other than the outer edge, and the second adsorption surface is opposite to the above a plane parallel to the second main surface, wherein the first adsorption surface protrudes by a specific amount of the protruding surface with respect to the second adsorption surface; and the plurality of movable bodies are fixed to the flexible plate at intervals, and are opposed to the flexible plate The above support mechanism can be moved independently And a control mechanism that sequentially moves the movable body located on the one end side of the peeling traveling direction to the other end side located in the peeling traveling direction in a direction away from the support mechanism.

In one aspect of the method for peeling off the substrate of the present invention, preferably, the peeling mechanism includes a support mechanism that supports a first main surface including the laminate of the substrate and the reinforcing plate; a flexible plate having a first adsorption surface that adsorbs and holds the outer edge of the second main surface of the laminate; and a second adsorption surface that adsorbs and holds the second main surface other than the outer edge, and the second adsorption surface (2) a surface of the adsorption surface that is parallel to the second main surface, wherein the first adsorption surface protrudes by a specific amount of the protruding surface with respect to the second adsorption surface; and the plurality of movable bodies are fixed to the space at intervals a flexible plate that is independently movable with respect to the support mechanism; and the movable body located on the one end side of the peeling traveling direction to the movable body located at the other end side of the peeling traveling direction by a control mechanism Move in the direction of leaving the above support organization.

In one aspect of the method of manufacturing an electronic component of the present invention, preferably, the stripping step is a step of supporting a first main surface including a laminate of the substrate and the reinforcing plate by a support mechanism, and controlling The movement of the movable body that is fixed to the movable plate that adsorbs and holds the second main surface of the laminated body with respect to the support mechanism is opened at intervals, thereby moving the interface from one end side toward the other end side The peeling traveling direction is sequentially peeled off, and the flexible sheet has a first adsorption surface that adsorbs and holds the outer edge of the second main surface of the laminate, and a second main surface that adsorbs and holds the outer surface other than the outer edge. In the adsorption surface, the second adsorption surface is parallel to the second main surface, and the first adsorption surface includes a protruding surface that protrudes by a specific amount with respect to the second adsorption surface.

According to one aspect of the peeling form of the present invention, the movable body located on one end side in the peeling traveling direction is sequentially moved in the direction away from the support mechanism by the movable body on the one end side in the peeling traveling direction. Then, the outer edge of the laminate can be delayed from being peeled off from the surface other than the outer edge. Thereby, according to one aspect of the peeling form of the present invention, the boundary The angle between the tangent of the end portion of the wire and the wire outside the substrate of the peeling region is greater than 90 degrees, so that the substrate can be favorably peeled off even when the substrate is cracked.

In one aspect of the substrate peeling apparatus of the present invention, preferably, the peeling mechanism includes: a support mechanism that supports a first main surface including the laminate of the substrate and the reinforcing plate; and a flexible plate that adsorbs And holding the second main surface of the laminated body; the plurality of movable bodies are located at the flexible plate at intervals, and are independently movable with respect to the support mechanism; and the control mechanism is located at the peeling The movable body on the one end side in the traveling direction is sequentially moved in a direction away from the support mechanism to the other end side in the peeling traveling direction, and the movable body located on the outer edge of the second main surface is moved. The departure movement start time is delayed by a specific time from the departure movement start time of the movable body located on the second main surface other than the outer edge.

In one aspect of the method for peeling off the substrate of the present invention, preferably, the peeling mechanism includes a support mechanism that supports a first main surface including the laminate of the substrate and the reinforcing plate; a flexible plate that adsorbs and holds the second main surface of the laminated body; and a plurality of movable bodies that are fixed to the flexible plate at intervals, and are independently movable with respect to the support mechanism; The movable body on the one end side of the peeling traveling direction to the movable body located on the other end side in the peeling traveling direction is sequentially moved in a direction away from the supporting mechanism by a control mechanism, and is controlled by the control mechanism The departure movement start time of the movable body located at the outer edge of the second main surface is delayed by a specific time from the departure movement start time of the movable body located on the second main surface other than the outer edge.

In one aspect of the method of manufacturing an electronic component of the present invention, preferably, the stripping step is a step of supporting a first main surface including a laminate of the substrate and the reinforcing plate by a support mechanism, and controlling The movement of the movable body that is fixed to the movable plate that adsorbs and holds the second main surface of the laminated body with respect to the support mechanism is opened at intervals, thereby moving the interface from one end side toward the other end side Peeling direction of travel And peeling off, the movable body located on the one end side of the peeling traveling direction to the other end side located in the peeling traveling direction is sequentially moved in a direction away from the support mechanism, and is located on the second main surface The departure movement start time of the movable body at the outer edge is delayed by a specific time from the departure movement start time of the movable body located on the second main surface other than the outer edge.

According to one aspect of the peeling form of the present invention, the movement start time of the movable body located at the outer edge of the second main surface is separated from the movable body of the second main surface located outside the excluded edge by the control mechanism When the movement start time is delayed by a certain time, the outer edge of the laminate can be delayed from being peeled off from the surface other than the exclusion edge. Therefore, according to one aspect of the peeling form of the present invention, the angle between the tangent of the end portion of the boundary line and the wiring of the outer periphery of the substrate of the peeling region is greater than 90 degrees, so that even when the substrate is cracked, The substrate can be peeled off well.

According to the peeling apparatus for a substrate, the peeling method of the substrate, and the method of manufacturing the electronic component of the present invention, the substrate can be favorably peeled off even when the substrate is cracked.

1‧‧‧ laminate

1a‧‧‧1st main face

1b‧‧‧2nd main face

2‧‧‧Substrate

3, 3A, 3B‧‧‧ reinforcing plate

4‧‧‧Support board

5‧‧‧ resin layer

6‧‧‧Layer

7‧‧‧Liquid layer

8, 9‧‧‧ corner

10‧‧‧ Stripped area

11‧‧‧Unpeeled area

12‧‧‧Extraction range

13‧‧‧ crack

20‧‧‧ peeling device

22‧‧‧Flexible board

22A‧‧‧1st adsorption surface

22B‧‧‧2nd adsorption surface

24‧‧‧ movable body

26‧‧‧The stage

28‧‧‧ drive

30‧‧‧Control device

32‧‧‧Adsorption sheet

34‧‧‧Elastic sheet

36‧‧‧ body board

38‧‧‧ slots

40‧‧‧through holes

42‧‧‧ pole

44‧‧‧ ball joint

46‧‧‧Frame

48‧‧‧ cushioning members

50‧‧‧ Drive Department

52‧‧‧Elastic sheet

52A‧‧‧1st adsorption surface

52B‧‧‧2nd adsorption surface

54, 56‧‧‧ interlayer film

58‧‧‧Adsorption pad

60‧‧‧Transporting device

62‧‧‧ panel

64‧‧‧Flexible board

66‧‧‧Layered body

D, P‧‧‧ arrows

E‧‧‧ peeling front line

F, G‧‧‧ intersection

H‧‧‧ Straight line

J, K‧‧‧ wiring

N‧‧‧ tangent

Θ‧‧‧ angle

Fig. 1 is an enlarged side elevational view of an essential part of a laminate for use in a manufacturing step of an electronic component.

Fig. 2 is an enlarged side elevational view of the main part of the laminated body produced on the way to the manufacturing steps of the electronic component.

Fig. 3 (a) is a plan view of a rectangular laminated plate, and Fig. 3 (b) is an explanatory view of a principal part of a peeling traveling direction of a peeling front line by a peeling method of the substrate of the present invention.

Fig. 4 is an explanatory view showing a peeling method in which the interface is sequentially peeled off from the short side of the substrate toward the peeling traveling direction of the opposite short side.

Fig. 5 is an explanatory view showing a peeling method in the case of a circular substrate.

Fig. 6 is a longitudinal cross-sectional view showing the essential part of the basic structure of the peeling device of the present invention.

Figure 7 is a view showing the flexibility of the arrangement position of a plurality of movable bodies with respect to the flexible board. Top view of the board.

Fig. 8(a) is a plan view of the flexible board, and Fig. 8(b) is a longitudinal sectional view taken along line S-S of (a).

Fig. 9 is a longitudinal cross-sectional view showing the essential part of the peeling device in a state in which the interface is sequentially peeled off.

Fig. 10 (a) is a longitudinal sectional view showing a state before a laminated plate is held by a peeling mechanism, and Fig. 10 (b) is a longitudinal sectional view showing a state in which a laminated plate has been held by a peeling mechanism, Fig. 10 (c) is a longitudinal cross-sectional view of an essential part showing a state in which the interface has been completely peeled off by the peeling mechanism.

Fig. 11 (a) is a plan view showing a laminate of a peeling front line during traveling, and Fig. 11 (b) is a longitudinal sectional view taken along line T-T of Fig. 11 (a).

Fig. 12 (a) is a longitudinal cross-sectional view of a main part of a peeling device having a two-stage configuration instead of the thickness of the first adsorption surface, and Fig. 12 (b) is a two-layer intermediate film disposed on the back side of the first adsorption surface. In addition, it is a longitudinal sectional view of the principal part of the peeling apparatus which consists of two stages.

Fig. 13 (a) is a plan view of the flexible plate on which the peeling front line is traveling, and Fig. 13 (b) is a longitudinal sectional view taken along line U-U of Fig. 13 (a).

Fig. 14 (a) is a side view of a peeling device in which a laminate is placed on a flexible plate by a transfer device, and Fig. 14 (b) is a vacuum suction on the stage and holding the first main surface of the laminated plate. A side view of the peeling device, and Fig. 14 (c) is a side view of the peeling device for carrying out the peeling method of the present invention by a peeling device.

Fig. 15 (a) is a side view of the peeling device in which the interface has been completely peeled off, and Fig. 15 (b) is a side view of the peeling device for transferring the substrate from the stage to the flexible plate, and Fig. 15 (c) is about to be carried out Side view of the stripping device in the state before the substrate.

Fig. 16 (a) is a side view of a peeling device in which a laminate is placed on a flexible plate by a conveying device, and Fig. 16 (b) is a vacuum suction and holding of a first main surface of the laminated body by a flexible plate. A side view of the peeling device, and Fig. 16 (c) is a side view of the peeling device for carrying out the peeling method of the present invention by a peeling device.

Figure 17 (a) is a side view of the peeling device which has completely peeled off the interface, and Figure 17 (b) is a A side view of the peeling device which vacuum-adsorbs and holds the laminated body by the upper and lower flexible plates, and Fig. 17 (c) is a side view of the peeling device which performs the peeling method of the present invention by a peeling device.

Fig. 18 (a) is a side view of the peeling device which has completely peeled off the interface, and Fig. 18 (b) is a side view of the peeling device for transferring the reinforcing plate from the upper flexible plate to the lower flexible plate. Fig. 18 (c) is a side view of the peeling device in a state immediately before the reinforcing plate is removed.

Fig. 19 (a) is a plan view schematically showing a laminate of a peeling form of a substrate in Patent Document 1, and Fig. 19 (b) is a side view showing a peeling device of a peeling form of the substrate, and Fig. 19 (c) is a view showing the cause An explanatory diagram of the mechanism of the fracture of the substrate of the crack.

Hereinafter, embodiments of the substrate peeling device, the peeling method, and the electronic component manufacturing method of the present invention will be described with reference to the accompanying drawings.

Fig. 1 is an enlarged side elevational view of an essential part of a laminate 1 for use in a manufacturing step of an electronic component.

[Manufacturing method of electronic components]

In the method of manufacturing the electronic component of the embodiment, in order to cope with the thinning of the substrate 2 for the electronic component, the laminated board 1 having the reinforcing plate 3 attached to the back surface of the substrate 2 is provided, and the front surface of the substrate 2 of the laminated board 1 is provided. A functional layer forming step of forming a functional layer, and a peeling step of peeling off the substrate 2 on which the functional layer is formed and the reinforcing plate 3. In the above-described peeling step, a peeling device for a substrate of the embodiment is used. The peeling device is described below. Further, the reinforcing plate 3 does not constitute a part of the electronic component, but is peeled off from the substrate 2 and reused as a reinforcing material for the substrate 2.

The above electronic component refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. Further, the display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL panel (OLED).

[Laminated board 1]

As shown in FIG. 1, the laminated board 1 includes the reinforcing plate 3 of the substrate 2 and the reinforcing substrate 2, and is configured by attaching the reinforcing plate 3 to the back surface of the substrate 2.

[Substrate 2]

On the front side of the substrate 2, a specific functional layer (for example, TFT, CF) is formed in the middle of the manufacturing process of the electronic component.

The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. However, the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small coefficient of linear expansion. The reason for this is that the smaller the coefficient of linear expansion, the more difficult it is to shift the pattern of the functional layer formed at a high temperature during cooling.

The glass of the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.

Further, as the glass of the glass substrate, a glass suitable for the type of the electronic component or the manufacturing step thereof is preferably used. For example, the glass substrate for a liquid crystal panel is preferably formed of glass (alkali-free glass) which does not substantially contain an alkali metal component. Thus, the glass of the glass substrate can be appropriately selected based on the type of electronic component to be applied and the manufacturing steps thereof.

The resin of the resin substrate is not particularly limited, and may be a crystalline resin or an amorphous resin.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, in order to reduce the weight and thickness of the electronic component, it is preferably 0.7 mm or less, more preferably 0.2 mm or less, and still more preferably 0.1 mm or less. When it is 0.2 mm or less, the glass substrate can be provided with good flexibility, and a preferable substrate corresponding to the thinning of the electronic component can be obtained. When the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. Further, the thickness of the glass substrate is preferably 0.03 mm or more for the reason that the production of the glass substrate is easy and the operation of the glass substrate is easy.

[Reinforcing board 3]

The reinforcing plate 3 is provided with a reinforcing substrate 2 before being subjected to a peeling operation if attached to the substrate 2 Features. After the formation of the functional layer, the reinforcing plate 3 is peeled off from the substrate 2 by the peeling device of the substrate of the embodiment in the middle of the manufacturing process of the electronic component.

In order to suppress warpage or peeling due to temperature change, the reinforcing plate 3 preferably has a smaller difference in linear expansion coefficient with respect to the substrate 2. In the case where the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of the glass plate is preferably of the same type as the glass of the glass substrate.

The reinforcing plate 3 includes a support plate 4 as a bottom layer and a resin layer 5 formed on the surface of the support plate 4. The substrate 2 is detachably attached to the support sheet 4 via the resin layer 5 by the van der Waals force acting between the resin layer 5 and the substrate 2 or the adhesion of the resin layer 5 or the like.

Further, the reinforcing plate 3 of Fig. 1 is composed of the support plate 4 and the resin layer 5, but may be constituted only by the support plate 4. In this case, the support plate 4 and the substrate 2 are detachably attached by a van der Waals force or the like acting between the support plate 4 and the substrate 2. Moreover, in this case, it is preferable to form an inorganic thin film on the attachment side surface of the support plate 4 so that the support plate 4 as a glass plate and the substrate 2 which is a glass substrate are not adhered at high temperature.

Further, the support plate 4 of Fig. 1 is one block, and the resin layer 5 is one layer. However, the support plate 4 may be constituted by a plurality of support plates 4, and the resin layer 5 may be composed of a plurality of layers.

[Support Board 4]

The support plate 4 supports the substrate 2 with the resin layer 5 interposed therebetween, whereby the substrate 2 is reinforced by the reinforcing plate 3. The support plate 4 also has a function of preventing deformation, damage, breakage, and the like of the substrate 2 in the manufacturing process of the electronic component.

As the support plate 4, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, a metal plate, or the like can be exemplified. The type of the support plate 4 can be appropriately selected depending on the type of the electronic component, the type of the substrate 2, and the like. If the support plate 4 and the substrate 2 are of the same type, warpage and peeling due to temperature change can be reduced, which is preferable.

The difference (absolute value) between the average linear expansion coefficients of the support plate 4 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, but is preferably, for example, 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R 3102: 1995).

The thickness of the support plate 4 is preferably, for example, 0.7 mm or less. Further, in order to reinforce the substrate 2, the thickness of the support plate 4 is preferably 0.4 mm or more. The thickness of the support plate 4 may be thicker than the substrate 2 or thinner than the substrate 2.

In order to enable the support plate 4 to support the entirety of the resin layer 5, the outer shape of the support plate 4 is preferably the same as the outer shape of the resin layer 5 or larger than the outer shape of the resin layer 5 as shown in FIG.

[Resin layer 5]

The resin layer 5 has a function of preventing the position of the substrate 2 from being displaced from the support plate 4 before being adhered to the substrate 2 before the peeling operation. Further, the resin layer 5 also has a function of being easily peeled off from the substrate 2 by a peeling operation. Since the substrate 2 is easily peeled off, damage of the substrate 2 at the time of peeling can be prevented. Further, the resin layer 5 is formed such that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2.

The resin of the resin layer 5 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxyn resin, and a polyimide resin. Further, a plurality of kinds of resins may be used in combination, but from the viewpoint of heat resistance and peelability, a polydecene oxide resin or a polyimide polyimide resin is preferable.

The thickness of the resin layer 5 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 5 is 1 μm or more and bubbles or foreign matter are mixed between the resin layer 5 and the substrate 2, the resin layer 5 is deformed to absorb the thickness of bubbles or foreign matter. On the other hand, when the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 or more which is necessary is not used, which is economical.

In order to enable the resin layer 5 to be in close contact with the entire substrate 2, the outer shape of the resin layer 5 is preferably the same as the outer shape of the substrate 2 as shown in FIG. Inch.

Further, the resin layer 5 may also contain two or more layers. In this case, "the thickness of the resin layer" means the total thickness of all the resin layers. Moreover, when the resin layer 5 contains two or more layers, the kind of the resin which forms each layer may differ. Further, the configuration of the laminated board 1 is not limited to those shown in FIG. For example, an inorganic layer containing at least one selected from the group consisting of metal tellurides, nitrides, and carbides (WSi ₂ , AlN, TiN, Si ₃ N ₄ , SiC, etc.) may be used instead of the resin layer 5 . Further, instead of using the resin layer 5, the surface of each of the substrate 2 and the reinforcing plate 3 may be mirror-polished to reduce the surface roughness of the bonding surfaces, and the substrate 2 and the reinforcing plate 3 may be removed. Engage.

Fig. 2 is an enlarged side elevational view of an essential part of the laminated body 6 produced in the middle of the manufacturing steps of the electronic component.

[Laminated body 6]

The laminated body 6 is formed by combining two laminated sheets 1 and 1 having a functional layer on the front surface of the substrate 2 of the laminated board 1 of Fig. 1 so that the functional layers are opposed to each other. The type of the functional layer is selected according to the type of the electronic component. A plurality of functional layers may be sequentially laminated on the front side of the substrate 2. As a method of forming the functional layer, a general method, for example, a vapor deposition method such as a CVD method or a PVD method, a sputtering method, or the like is used. The functional layer is formed into a specific pattern by photolithography and etching.

The laminated body 6 of Fig. 2 includes a reinforcing plate 3A, a substrate 2A, a liquid crystal layer (functional layer) 7, a substrate 2B, and a reinforcing plate 3B from the upper layer to the lower layer. In other words, the laminated board 1B including the substrate 2A and the reinforcing plate 3A is provided on the upper layer side, and the laminated board 1A including the substrate 2B and the reinforcing plate 3B is provided on the lower layer side.

The laminate 6 of Fig. 2 is produced by the maker of the LCD manufacturing process. A thin film transistor (TFT) is formed on the surface of the substrate 2A on the liquid crystal layer 7 side, that is, on the front surface of the substrate 2A, and a color filter (CF) is formed on the surface of the substrate 2B on the liquid crystal layer 7 side, that is, on the front surface of the substrate 2B. A liquid crystal layer 7 as a functional layer is formed by a thin film transistor and a color filter.

Further, the laminated body 6 of Fig. 2 has a configuration in which reinforcing plates 3A and 3B are disposed on both sides, but the laminated body may have a configuration in which a reinforcing plate is disposed only on one side.

The laminated body 6 is peeled off from the reinforcing plates 3A and 3B in the peeling step. An electronic component such as a backlight device is mounted on the back surfaces of the substrates 2A and 2B after the peeling reinforcing plates 3A and 3B, thereby manufacturing an LCD as a product. The peeling of the reinforcing plates 3A and 3B is performed using a peeling device described later.

[Method of peeling off substrate of the present invention]

First, the method of peeling off the substrate of the present invention will be described before explaining the peeling device for the substrate of the embodiment.

The peeling method of the substrate of the present invention is based on the following peeling method: for example, in the laminated board 1 shown in Fig. 1, the interface between the substrate 2 and the reinforcing sheet 3 is a rectangular laminated layer as shown in Fig. 3(a). As shown in the plan view of the panel 1, the peeling traveling direction is sequentially peeled off along the arrow D from the corner portion (one end) 8 side toward the corner portion (the other end) 9 side.

Next, symbols E, F, G, H, J, K, L, M, N, and 12 shown in Fig. 3(a) will be described.

The symbol E is a peeling front line (boundary line) of the peeling region 10 of the peeling interface and the unpeeled region 11.

Symbols F and G are two intersections of the peeling front line E and the outer circumference of the substrate 2.

The symbol H is a straight line in which the intersection points F and G are connected.

Symbol J, K is the wiring of the outer periphery of the substrate 2 of the peeling region 10.

Symbols M and N are tangent to the end of the front line E.

The symbol 12 is a peeling range in which the angle H between the straight line H and the wires J and K is at least 90 degrees or less. The peeling range is a range of a triangular shape in a shape surrounded by the two-point chain line L and the wires J and K.

Further, the method for peeling off the substrate of the present invention is characterized in that the interface is peeled off in the peeling range 12 such that the angles θ formed by the tangent lines M and N and the wires J and K are greater than 90 degrees.

Fig. 3 (b) is an explanatory view of a principal part of a peeling traveling direction of the peeling front line E by the peeling method of the substrate of the present invention.

When the peeling front line E traveling in the peeling range 12 passes through the crack 13 generated at the end portion of the substrate 2, it does not pass through the direction in which the crack 13 is stretched, but is directed toward the substrate from the inner side of the substrate 2 as indicated by the arrow P. The direction of the edge of 2 passes. Thereby, the force of the peeling interface does not act on the direction in which the crack 13 is stretched, and therefore the crack 13 does not extend together with the progress of the peeling front line E. Thus, according to the method for peeling off the substrate of the present invention, the substrate 2 can be favorably peeled off even when the cracks 13 are formed on the substrate 2.

Further, the reason why the peeling range 12 is specified is that, even in the range of the peeling range 12, even in the previous peeling method shown in Fig. 19 (a), the angle θ is larger than 90 degrees. In this case, even if it is the previous peeling method, the crack does not stretch. That is, the peeling method of the substrate of the present invention can prevent breakage of the substrate 2 due to the crack 13 existing in the peeling range 12.

Moreover, the peeling method of FIG. 3 (a) is a peeling method which sequentially peels the interface in the peeling advancing direction shown by the arrow D from the corner part 8 side toward the corner part 9 side. On the other hand, the other peeling method of FIG. 4 is a peeling method in which the peeling front line E is sequentially peeled off along the peeling traveling direction indicated by the arrow Q from the short side 2C of the substrate 2 toward the short side 2D. In the case of the peeling method of Fig. 4, the entire surface of the substrate 2 becomes the peeling range 12.

Further, in the case of the circular substrate 1C shown in Fig. 5, the interface was also peeled off by the same peeling method. In other words, the line H of the peeling front line E which is the boundary line between the peeling region 10 and the unpeeled region 11 at the peeling interface and the two intersections F and G of the outer periphery of the substrate 2, and the substrate 2 of the peeling region 10 The angle formed by the outer peripheral wires J and K is a peeling range of at least 90 degrees (the range of the semicircular shape defined by the two-point chain line L and the wires J and K) 12 to peel off the end of the front line E The tangent lines M, N and the wires J, K are separated by an angle θ greater than 90 degrees. In this case, the same effect can be obtained. The above is a method for peeling off the substrate of the present invention, which solves the previous problems.

Next, the peeling device of the substrate of the present invention will be described.

[The peeling device of the substrate of the present invention]

Fig. 6 is a longitudinal sectional view showing an essential part of a basic configuration of the peeling device 20. Fig. 7 is a plan view schematically showing the position of the flexible plate 22 with respect to the arrangement positions of the plurality of movable bodies 24, 24, ... of the flexible plate 22 to be described later. 6 is a cross-sectional view taken along line R-R of FIG. 7.

As shown in Fig. 6, the peeling device 20 sequentially peels the interface between the substrate 2 and the reinforcing plate 3 from the corner portion 8 side toward the corner portion 9 side. At the time of peeling, as shown in FIG. 7, the peeling front line E which is the boundary line of the peeling region 10 and the non-peeling region 11 which peeled the said interface advances in the arrow D direction.

Further, the peeling device 20 is a device that peels and deforms the reinforcing plate 3 by deformably supporting the substrate 2, but may be a device that supports the reinforcing plate 3 and deforms the substrate 2 by bending and deforms the interface. .

The peeling device 20 is a plurality of driving devices 28 that are a flat-shaped stage 26 as a supporting mechanism, a flexible plate 22, a plurality of movable bodies 24, 24, ..., and a movable body 24 that moves up and down in response to each movable body 24. And a control device (control mechanism) 30 that controls the drive device 28 for each drive device 28, and the like.

The stage 26 is a support substrate 2, and vacuum-adsorbs and holds the first main surface (front surface of the substrate 2) 1a of the laminated board 1. Further, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used. Further, since the stage 26 supports the substrate 2 in a non-deformable manner at the time of peeling, it is made of a metal having high rigidity.

The flexible plate 22 is configured to bend and deform the reinforcing plate 3 to vacuum-adsorb and hold the second main surface 1b of the laminated plate 1. Further, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used.

Fig. 8(a) is a plan view of the flexible board 22, and Fig. 8(b) is a longitudinal sectional view of the flexible board 22 taken along line S-S of Fig. 8(a).

The flexible sheet 22 is a cloth-like absorbent sheet 32 that adsorbs and holds the second main surface 1b of the laminated sheet 1, an elastic sheet 34 coated with the absorbent sheet 32, and a body sheet 36 that supports the elastic sheet 34. Composition. The surface of the elastic sheet 34 is provided with a frame-shaped groove 38 penetrating therethrough. 38 is further covered with an adsorption sheet 32 on the inner side. Further, a plurality of through holes 40, 40, ... are opened in the main body plate 36, and one end of the through holes 40, 40 is connected to the groove 38, and the other end is connected to the suction source via a suction pipe (not shown). (eg vacuum pump).

Therefore, when the air intake source is driven, the air in the suction duct, the through hole 40, and the groove 38 is sucked, whereby the second main surface 1b of the laminated plate 1 is vacuum-sucked and held on the adsorption sheet 32. . In this case, in order to allow the adsorption sheet 32 to support the second main surface 1b of the laminated board 1 as a whole, the outer dimensions of the adsorption sheet 32 are set to be larger than the outer dimensions of the second main surface 1b of the laminated board 1. Further, the material of the elastic sheet 34 is not particularly limited, but is preferably rubber. The rubber is preferably a polyoxyethylene rubber.

The body plate 36 is the same size as the elastic sheet 34. Moreover, the bending rigidity of the main body plate 36 is higher than that of the elastic sheet 34, and the bending rigidity of the main body plate 36 governs the bending rigidity of the flexible plate 22. The bending rigidity per unit width (1 mm) of the flexible plate 22 is preferably 1000 to 40,000 N. Mm ² /mm. For example, in the portion of the flexible plate 22 having a width of 100 mm, the bending rigidity is 100000 to 4000000 N. Mm ² . By setting the bending rigidity per unit width (1 mm) of the flexible board 22 to 1000 N. The mm ² /mm or more can prevent the bending of the plate (the reinforcing plate 3 in the present embodiment) which is sucked and held by the flexible plate 22. Moreover, the bending rigidity per unit width (1 mm) of the flexible board 22 is set to 40,000 N. Below mm ² /mm, the plate which is attracted and held by the flexible plate 22 is moderately bent and deformed. As the flexible plate 22, for example, a metal plate such as a polyvinyl chloride (PVC) resin, a polycarbonate resin, an acrylic resin, or a polyacetal (POM) resin can be used.

As the main body plate 36, for example, a metal plate such as a polyvinyl chloride (PVC) resin, a polycarbonate resin, an acrylic resin, or a polyacetal (POM) resin can be used.

Further, the method and structure for supporting the first main surface 1a of the laminated plate 1 by the stage 26 are also substantially the same as those of the vacuum suction holding method of the flexible board 22.

As shown in FIG. 6, the circle shown in FIG. 7 is fixed on the lower surface of the main body plate 36 in a checkerboard shape. Disc-shaped movable bodies 24, 24... The movable bodies 24, 24, ... are fixed to the main body plate 36 by fastening members such as bolts, but they may be used instead of the bolts. The movable bodies 24, 24, ... are independently moved up and down with respect to the stage 26 by the driving devices 28, 28, ... that are driven and controlled by the control device 30.

In other words, the control device 30 moves the movable bodies 24, 24, ... on the side of the corner portion 8 in Fig. 7 to the movable bodies 24, 24, ... on the side of the corner portion 9 of the peeling traveling direction indicated by the arrow D, and moves away from the stage 26. The direction moves down in sequence. By this operation, the interface between the substrate 2 and the reinforcing plate 3 is sequentially peeled off from the corner portion 8 side toward the corner portion 9 side as shown in the longitudinal cross-sectional view of FIG. 9 .

The drive unit 28 is constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotary motion of the servo motor is converted into linear motion by the ball screw mechanism and transmitted to the rod 42 of the ball screw mechanism. The movable body 24 is provided at the front end of the rod 42 via the ball joint 44. Thereby, the movable body 24 from which the stage 26 is separated can be lifted up following the bending deformation of the flexible board 22 as shown in FIG. Thereby, the flexible plate 22 can be bent and deformed without applying a force to the flexible plate 22. Further, the drive device 28 is not limited to the rotary servo motor and the ball screw mechanism, and may be a linear servo motor or a hydraulic cylinder (for example, a pneumatic cylinder).

The plurality of driving devices 28, 28, ... are preferably attached to the frame 46 that can be raised and lowered with respect to the stage 26 via the cushioning member 48. The cushioning member 48 is elastically deformed in such a manner as to follow the bending deformation of the flexible plate 22. Thereby, the rod 42 is lifted with respect to the stage 26.

When the detached reinforcing plate 3 is removed from the flexible plate 22, the frame 46 is lowered and moved by a driving portion (not shown). Thereby, a sufficient working space for taking out the reinforcing plate 3 can be obtained between the stage 26 and the flexible plate 22. Further, the stage 26 is also moved up and down by the driving units 50, 50, and moves forward and backward with respect to the flexible board 22.

The control device 30 is configured as a computer including a recording medium such as a CPU, a ROM, and a RAM. The control device 30 controls the plurality of driving devices 28 corresponding to each driving device 28 by causing the CPU to execute the program recorded on the recording medium, thereby controlling the plurality of movable bodies 24, 24... Move up and down.

Next, the configuration of the first peeling device for obtaining the peeling front line E shown in Fig. 3(a) will be described.

[Configuration of the first peeling device]

Fig. 10 (a) is a longitudinal sectional view of a main portion in a state in which the peeling mechanism including the stage 26 and the flexible plate 22 is about to hold the laminated plate 1, and Fig. 10 (b) is held by the peeling mechanism. FIG. 10(c) is a longitudinal cross-sectional view showing a principal part of the substrate 2 and the reinforcing plate 3 in which the interface has been completely peeled off by the peeling mechanism.

Further, Fig. 11(a) is a plan view showing the laminated board 1 of the peeling front line E during traveling, and Fig. 11(b) is a longitudinal sectional view taken along line T-T of Fig. 11(a).

As shown in Figs. 10(a) to 10(c), the elastic sheet 34 of the flexible sheet 22 is provided with a first adsorption surface that adsorbs and holds the frame-shaped outer edge 1c of the second main surface 1b of the laminated sheet 1. 22A, and the second adsorption surface 22B of the second main surface 1b having a rectangular shape other than the edge 1c is adsorbed and held. The second adsorption surface 22B is a surface parallel to the second main surface 1b, and the first adsorption surface 22A protrudes by a specific amount with respect to the second adsorption surface 22B.

Further, the elastic sheet 52 constituting the stage 26 also includes the same first adsorption surface 52A and second adsorption surface 52B. In other words, the elastic sheet 34 includes a first adsorption surface 52A that adsorbs and holds the frame-shaped outer edge 1d of the first main surface 1a of the laminated plate 1, and a first main surface that absorbs and holds a rectangular shape other than the exclusion edge 1d. The second adsorption surface 52B of 1a. The second adsorption surface 52B is a surface parallel to the first main surface 1a, and the first adsorption surface 52A protrudes by a specific amount with respect to the second adsorption surface 52B.

As an example, the amount of protrusion t of the first adsorption surfaces 22A and 52A is about 0.5 mm, and the width w of the first adsorption surfaces 22A and 52A is 2 to 10 mm. Further, the first adsorption surfaces 22A and 52A may be provided on at least one of the stage 26 and the flexible plate 22. In this case, the above-mentioned amount of protrusion t is about 1.0 mm.

According to the first peeling device configured as described above, the control device 30 is as shown in FIG. The movable body 24 located on the side of the corner portion 8 in the peeling traveling direction indicated by the arrow D to the movable body 24 located on the side of the corner portion 9 in the peeling traveling direction is gradually moved downward in the direction away from the stage 26 as shown in FIG. Then, as shown in Fig. 11(b), the outer edges 1c and 1d of the laminated board 1 are delayed from being peeled off from the surfaces other than the outer edges 1c and 1d.

According to the first peeling device, as shown in FIG. 3(a), the tangent lines M and N of the end portion of the front line E are peeled off, and the angles θ formed by the wires J and K on the outer circumference of the peeling region 10 are larger than 90 degrees, so that even When the crack 13 shown in FIG. 3(b) is generated on the substrate 2, the substrate 2 can be favorably peeled off.

Fig. 12 (a) shows a peeling device of another embodiment in which the thickness of the first adsorption surfaces 22A and 52A is replaced by a two-stage configuration. (b) of FIG. 12 is another embodiment in which the intermediate films 54 and 56 having two layers having different lengths are disposed on the back surface side of the first adsorption surfaces 22A and 52A, and the first adsorption surfaces 22A and 52A are formed in two stages. Peeling device. The peeling device of the other form can also achieve the same effect. Moreover, the same applies to the case where the first adsorption surfaces 22A and 52A are inclined surfaces.

The first peeling device described above is characterized in that the elastic sheets 34 and 52 are provided with the first adsorption surfaces 22A and 52A.

Next, the second peeling device will be described.

[Composition of the second peeling device]

The configuration of the second peeling device differs from the configuration of the first peeling device in that the adsorption surface of the elastic sheet 34 of the flexible sheet 22 and the adsorption surface of the elastic sheet 52 of the stage 26 are stepless. The departure movement start time of the movable body 24 located at the outer edge 1c of the second main surface 1b is delayed by a specific time from the departure movement start time of the movable body 24 located on the second main surface 1b other than the exclusion edge 1c.

13(a) and 13(b) schematically show the peeling form of the second peeling device.

Fig. 13 (a) is a plan view of the flexible sheet 22 from which the peeling front line E travels from the corner portion 8 side toward the corner portion 9 side, and Fig. 13 (b) is a longitudinal sectional view taken along line U-U of Fig. 13 (a).

Next, a method of peeling off the substrate of the second peeling device will be described with reference to Figs. 10(a), 13(a) and 13(b).

The peeling method of the substrate of the second peeling device is performed by the control device 30 so that the moving movement start time of the movable body 24 located at the outer edge 1c of the second main surface 1b is movable more than the second main surface 1b other than the outer edge 1c. The departure movement start time of the body 24 is delayed by a certain time. Thereby, as shown in FIG. 13(b), the outer edge of the reinforcing plate 3 is delayed in peeling from the surface other than the outer edge. The control of the control device 30 is performed for a plurality of movable bodies 24, 24, ... arranged in a direction substantially orthogonal to the arrow D which is the peeling traveling direction of the peeling front line E (refer to FIG. 3(a)).

Thereby, according to the peeling method of the substrate of the second peeling device, as shown in FIG. 3(a), the tangent lines M and N of the end portion of the front line E and the wirings J and K of the outer periphery of the substrate 2 of the peeling region 10 are formed. Since the angle θ is larger than 90 degrees, the substrate 2 can be favorably peeled off even when the cracks 13 are formed on the substrate 2 (see FIG. 3( b )).

[Step of carrying in the laminate with respect to the peeling device, peeling step, and carrying out step]

14(a) to 14(c) and Figs. 15(a) to 15(c) show, in time series, a step of carrying the laminated board 1 into the peeling device 20, a peeling step of the laminated board 1, and a peeling process. An explanatory view of the step of carrying out the removal of the substrate 2 and the reinforcing plate 3 from the peeling device 20. Further, the loading operation of the laminated plate 1 to the peeling device 20 and the removal of the reinforcing plate 3 and the substrate 2 by the transfer device 60 having the plurality of adsorption pads 58, 58 shown in Fig. 14 (a) And proceed.

Fig. 14 (a) is a side view of the peeling device 20 in which the laminated plate 1 is placed on the flexible plate 22 by the conveying device 60. In this case, in order to insert the conveying device 60 between the flexible plate 22 and the stage 26, the flexible plate 22 and the stage 26 are moved to a position that is relatively sufficiently retracted. Then, when the laminated board 1 is placed on the flexible board 22, the reinforcing board 3 of the laminated board 1 is vacuum-adsorbed and held by the flexible board 22. That is, the second main surface 1b of the laminated plate 1 is vacuum-adsorbed and held by the flexible plate 22.

Fig. 14 (b) is a side view of the peeling device 20 in a state in which the flexible plate 22 and the stage 26 are moved in the relatively close direction, and the first main surface 1a of the laminated plate 1 is vacuum-adsorbed and held by the stage 26.

Fig. 14 (c) is a side view of the peeling device 20 in a state in which the peeling method of the present invention is carried out by the peeling device 20. According to this figure, the interface of the laminated board 1 is peeled off along the peeling front line E while the flexible board 22 is bent and deformed.

Fig. 15 (a) is a side view of the peeling device 20 in a state in which the interface has been completely peeled off. According to the figure, the peeled substrate 2 is vacuum-adsorbed and held by the stage 26, and the peeled reinforcing plate 3 is vacuum-adsorbed and held by the flexible sheet 22. Further, in order to insert the conveying device 60 shown in Fig. 14(a) between the flexible plate 22 and the stage 26, the flexible plate 22 and the stage 26 are moved to a position relatively large enough to be retracted.

Thereafter, the vacuum adsorption of the flexible sheet 22 is first released. Next, the reinforcing plate 3 is sucked and held by the adsorption pads 58, 58 of the conveying device 60. Next, the reinforcing plate 3 is carried out from the peeling device 20 by the conveying device 60.

Fig. 15 (b) is a side view of the peeling device 20 in a state where the substrate 2 is transferred from the stage 26 to the flexible plate 22. That is, the stage 26 is moved downward toward the flexible board 22, and when the substrate 2 is placed on the flexible board 22, the holding and holding of the stage 26 is released, and then the stage 26 is retracted and moved sufficiently away from the flexible board 22. The location.

Fig. 15 (c) is a side view of the peeling device 20 in a state immediately before the substrate 2 is carried out. Thereafter, the substrate 2 is sucked and held by the transfer device 60 shown in FIG. 14( a ), and the substrate 2 is carried out from the peeling device 20 .

The above steps are the carrying-in step, the peeling step, and the unloading step of the laminate 1 with respect to the peeling device 20.

[Loading step, peeling step, and carrying out step of the laminated body with respect to the peeling device]

16(a) to 16(c), Figs. 17(a) to 17(c), and Figs. 18(a) to 18(c) show time series of the laminated body 6 shown in Fig. 2 in a peeling device. The carrying-in step of 20, the peeling step of the laminated body 6, the carrying-out step of carrying out the peeled reinforcing plates 3A and 3B from the peeling device 20, and the substrates 2A and 2B including the peeled reinforcing plates 3A and 3B and the liquid crystal layer 7 An explanatory view of the carrying-out step of the panel 62 for electronic components being carried out from the peeling device 20. Also, the laminated body 6 is oriented The loading operation of the peeling device 20 and the removal of the peeled reinforcing plates 3A and 3B and the panel 62 are performed by the conveying device 60 shown in Fig. 14 (a).

Further, the peeling device 20 shown in FIGS. 16 to 18 has a function of arranging the flexible plate 64 instead of the stage 26, and peeling the reinforcing plates 3A and 3B by the pair of upper and lower flexible plates 22 and 64. That is, the flexible board 64 has the same function as the flexible board 22. In other words, the flexible plate 64 includes a movable body (not shown) similar to the movable body 24 that bends and deforms the flexible plate 22, a driving device (not shown) similar to the driving device 28, and a control device. 30 identical control devices (not shown).

Fig. 16 (a) is a side view of the peeling device 20 in which the laminated body 6 is placed on the flexible plate 22 by the conveying device 60. In this case, in order to insert the conveying device 60 between the flexible plate 22 and the flexible plate 64, the flexible plate 22 and the flexible plate 64 are moved to a position that is relatively sufficiently retracted. Then, when the laminated body 6 is placed on the flexible plate 22, the reinforcing plate 3B of the laminated body 6 is vacuum-adsorbed and held by the flexible plate 22. That is, the second main surface 6b of the laminated body 6 is vacuum-adsorbed and held by the flexible plate 22.

16(b) is a peeling device 20 in which the first main surface 6a of the laminated body 6 is vacuum-adsorbed and held by the flexible plate 64 in a direction in which the flexible plate 22 and the flexible plate 64 are moved toward each other. Side view.

Fig. 16 (c) is a side view of the peeling device 20 in a state in which the peeling method of the present invention is carried out by the peeling device 20. According to this figure, the interface between the substrate 2B of the laminated body 6 and the reinforcing plate 3B is peeled off along the peeling front line E while the flexible plate 22 is bent and deformed.

Fig. 17 (a) is a side view of the peeling device 20 in a state in which the interface between the substrate 2B and the reinforcing plate 3B has been completely peeled off. According to the figure, the peeled reinforcing plate 3B is vacuum-adsorbed and held by the flexible plate 22, and the laminated body 66 other than the reinforcing plate 3B (including the laminated body of the reinforcing plate 3A, the substrate 2A, the liquid crystal layer 7, and the substrate 2B) It is vacuum-absorbed and held by the flexible plate 64. Moreover, in order to insert the conveying device 60 shown in FIG. 14(a) between the flexible plate 22 and the flexible plate 64, the flexible plate 22 and the flexible plate 64 are moved in advance to a relatively sufficient retreat. position.

Then, the vacuum adsorption of the flexible sheet 22 is first released. Next, the reinforcing plate 3B is adsorbed and held by the adsorption pads 58, 58 of the transfer device 60. Next, the reinforcing plate 3B is carried out from the peeling device 20 by the conveying device 60.

17(b) is a side view of the peeling device 20 which vacuum-adsorbs and holds the laminated body 66 by the flexible plate 22 and the flexible plate 64. That is, the flexible plate 22 and the flexible plate 64 are moved in the relatively close direction, and the laminated body 66 is vacuum-sucked and held by the flexible plate 22 and the flexible plate 64.

Fig. 17 (c) is a side view of the peeling device 20 in a state in which the peeling method of the present invention is carried out by the peeling device 20. According to this figure, the interface between the substrate 2A of the laminated body 66 and the reinforcing plate 3A is peeled off along the peeling front line E while the flexible plate 64 is bent and deformed.

Fig. 18 (a) is a side view of the peeling device 20 in a state in which the interface between the substrate 2A and the reinforcing plate 3A has been completely peeled off. According to the figure, the peeled reinforcing plate 3A is vacuum-adsorbed and held by the flexible plate 64, and the panel 62 is vacuum-adsorbed and held by the flexible plate 22. Moreover, in order to insert the conveying device 60 shown in FIG. 14(a) between the flexible plate 22 and the flexible plate 64, the flexible plate 22 and the flexible plate 64 are moved in advance to a relatively sufficient retreat. position.

Then, the vacuum adsorption of the flexible sheet 22 is first released. Next, the panel 62 is sucked and held by the adsorption pads 58, 58 of the transfer device 60. Next, the panel 62 is carried out from the peeling device 20 by the conveying device 60.

18(b) is a side view of the peeling device 20 in a state where the reinforcing plate 3A is transferred from the flexible plate 64 to the flexible plate 22. That is, the flexible plate 64 is moved downward toward the flexible plate 22, and when the reinforcing plate 3A is placed on the flexible plate 22, the suction and holding of the flexible plate 64 is released, and then the flexible plate 64 is retracted and moved. To the position where the flexible plate 22 is sufficiently separated.

Fig. 18 (c) is a side view of the peeling device 20 in a state immediately before the reinforcing plate 3A is carried out. Then, the reinforcing plate 3A is sucked and held by the conveying device 60 shown in Fig. 14 (a), and the reinforcing plate 3A is carried out from the peeling device 20.

The above-described carrying step of the laminated body 6 with respect to the peeling device 20, the peeling step, and the carrying out step.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. Various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the invention.

The present application is based on Japanese Patent Application No. 2012-275538, filed on Dec.

1‧‧‧ laminate

2‧‧‧Substrate

8, 9‧‧‧ corner

10‧‧‧ Stripped area

11‧‧‧Unpeeled area

12‧‧‧Extraction range

13‧‧‧ crack

D, P‧‧‧ arrows

E‧‧‧ peeling front line

F, G‧‧‧ intersection

H‧‧‧ Straight line

J, K‧‧‧ wiring

N‧‧‧ tangent

Θ‧‧‧ angle

Claims (6)

A peeling device for a substrate, wherein an interface between a substrate and a reinforcing plate for reinforcing the substrate is sequentially peeled off from a one end side toward a other end side, and the peeling device is characterized in that a peeling mechanism is provided, and the peeling mechanism is provided a straight line connecting the boundary line between the peeled region and the unpeeled region of the interface and the intersection of the outer periphery of the substrate, and an angle formed by the wire on the outer periphery of the substrate in the peeling region is at least 90 degrees or less In the peeling range, the interface is peeled off such that a tangent to an end portion of the boundary line and an angle of an outer circumference of the substrate in the peeling region is greater than 90 degrees; and the peeling mechanism includes a support mechanism that supports a first main surface including the laminate of the substrate and the reinforcing plate; and a flexible plate having a first adsorption surface that adsorbs and holds an outer edge of the second main surface of the laminate, and adsorbs and holds the above a second adsorption surface of the second main surface other than the edge, and the second adsorption surface is parallel to the second main surface, and the first adsorption surface is opposite to the upper surface a second surface of the second adsorption surface that protrudes by a specific amount; the plurality of movable bodies are fixed to the flexible plate at intervals, and are independently movable with respect to the support mechanism; and a control mechanism The movable body located on the one end side of the peeling traveling direction is moved to the movable body located on the other end side in the peeling traveling direction in a direction away from the support mechanism. A peeling device for a substrate according to claim 1, wherein the substrate has a thickness of 0.2 mm or less. A method for peeling off a substrate, which is a substrate, and a reinforcing plate for reinforcing the substrate The interface is sequentially peeled off in the peeling traveling direction from the one end side toward the other end side, and the peeling method is characterized in that the boundary line between the peeled region and the unpeeled region where the interface is peeled off and the outer periphery of the substrate are separated a line formed by the connection, and an angle formed by the outer periphery of the substrate in the peeling region is at least 90 degrees or less, and a tangent to an end portion of the boundary line and an outer circumference of the substrate in the peeling region The peeling mechanism peels off the interface by an angle of more than 90 degrees, and the peeling method by the peeling mechanism includes a support mechanism that supports the first layer of the laminate including the substrate and the reinforcing plate a main surface; a flexible plate having a first adsorption surface that adsorbs and holds the outer edge of the second main surface of the laminate; and a second adsorption surface that adsorbs and holds the second main surface other than the outer edge. Further, the second adsorption surface is a surface parallel to the second main surface, and the first adsorption surface protrudes by a specific amount of the protruding surface with respect to the second adsorption surface; and the plurality of movable surfaces are movable And the movable plate is fixed to the flexible plate at intervals, and is independently movable with respect to the support mechanism; and the movable body located on the one end side of the peeling traveling direction is located at the peeling by a control mechanism The movable body on the other end side in the traveling direction moves in the direction away from the support mechanism. The method of peeling off a substrate according to claim 3, wherein the substrate has a thickness of 0.2 mm or less. A method for producing an electronic component, comprising: a functional layer forming step of forming a functional layer on a front surface of a substrate reinforced by a reinforcing plate; and a peeling step of peeling the substrate on which the functional layer is formed and the reinforcing plate, and a feature of the manufacturing method The above peeling step is a step of supporting the substrate including the support by a support mechanism And a first main surface of the laminated body of the reinforcing plate, and a movement of the plurality of movable bodies fixed to the flexible plate that adsorbs and holds the second main surface of the laminated body with respect to the support mechanism The interface between the substrate and the reinforcing plate is sequentially peeled off from the one end side toward the other end side, and the flexible plate has the first outer edge of the second main surface that adsorbs and holds the laminated body. An adsorption surface, and a second adsorption surface that adsorbs and holds the second main surface other than the outer edge, wherein the second adsorption surface is parallel to the second main surface, and the first adsorption surface is provided with respect to the first surface (2) the adsorption surface protrudes by a specific amount of the protruding surface; a line connecting the boundary line between the peeled region and the unpeeled region of the interface and the intersection of the outer periphery of the substrate; and the outer periphery of the substrate in the peeling region The angle formed by the wiring is at least 90 degrees or less, and the angle between the end of the boundary line and the connection of the outer periphery of the substrate in the peeling area is greater than 90 degrees. Said interfacial peeling. The method of producing an electronic component according to claim 5, wherein the substrate is a glass substrate having a thickness of 0.2 mm or less.