KR102535488B1 - Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

The present invention provides a laminate including a first substrate and a second substrate, in which the first substrate and the second substrate are peelably bonded, from one end side to the other end at the interface between the first substrate and the second substrate. A peeling device for a laminate that sequentially peels toward the side, comprising: a support portion for supporting the first substrate of the laminate, a flexible plate for adsorbing the second substrate of the laminate on its suction surface, and the flexible plate While being installed on the surface opposite to the adsorption surface of, by moving independently with respect to the support portion, the flexible plate is flexibly deformed from one end side toward the other end side, and the laminate is sequentially separated from the interface. A plurality of It is related with the peeling apparatus of a laminated body which is equipped with a movable body, and the said some movable body is attached to the said flexible board through a plurality of connecting members, singly and every plurality.

Description

Peeling device and peeling method of a layered product, and manufacturing method of an electronic device

The present invention relates to a peeling apparatus and method of a layered product, and a manufacturing method of an electronic device.

With the thinning and weight reduction of electronic devices such as display panels, solar cells, and thin-film secondary batteries, thinning of substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices is desired.

However, when the thickness of the substrate becomes thin, the handleability of the substrate deteriorates, so it is preferable to form a functional layer for electronic devices (thin film transistor (TFT), color filter (CF)) on the surface of the substrate. It gets difficult.

Therefore, an electronic device in which a reinforcing plate (second substrate) made of glass is attached to the back side of the substrate to form a laminate in which the substrate is reinforced by the reinforcing plate, and a functional layer is formed on the exposed surface of the substrate in the form of a laminate. A manufacturing method has been proposed. In this manufacturing method, since the handleability of the substrate is improved, the functional layer can be satisfactorily formed on the exposed surface of the substrate. Then, the reinforcing plate is separated from the substrate after formation of the functional layer.

In the method for peeling a reinforcing plate disclosed in Patent Literature 1, from one side of two corner portions located on the diagonal of a rectangular laminate to the other side, the reinforcing plate or substrate or both are sequentially bent in a direction that separates them from each other. It is done by transforming. At this time, in order to perform peeling smoothly, a peeling start part is produced in one corner part of a laminated body. The separation starting portion is produced by inserting a predetermined amount of a peeling blade into the interface between the substrate and the reinforcing plate from the end face of the laminate.

The peeling device of Patent Document 1 includes a stage, a flexible board, a plurality of pads, a plurality of drive devices (movable bodies), a control device, and the like. According to the peeling apparatus of patent document 1, a board|substrate is adsorbed and held by a stage, and a reinforcing board is adsorbed and held by a flexible board. To the flexible board, rods of a plurality of driving devices are connected via a plurality of pads. Then, the control device controls the position of the rods of the plurality of driving devices relative to the stage for each rod. Specifically, the positions of the rods of the plurality of driving devices are controlled so that the reinforcement plate is sequentially bent and deformed from the peeling start portion in a state where the substrate is flatly supported on the stage. In this way, the reinforcing board can be separated from the substrate.

Japanese Patent No. 5155454

In the peeling device of Patent Literature 1, a plurality of drive devices are installed in a grid pattern with respect to a flexible board at regular intervals. That is, since the peeling device of Patent Literature 1 has a structure in which the power of each rod of a plurality of drive devices is directly transmitted to the flexible board through a pad, the number of drive devices increases and the configuration of the device becomes complicated.

The present invention has been made in view of these problems, and aims to provide a peeling device and method for peeling a laminate capable of peeling a first substrate and a second substrate by reducing the number of movable bodies, and a method for manufacturing an electronic device. to be

In order to achieve the above object, the laminate peeling device of the present invention includes a first substrate and a second substrate, and a laminate in which the first substrate and the second substrate are bonded to be peelable, the first substrate and the second substrate at the interface between one end side and the other end side, wherein the peeling device of the laminate is sequentially separated, comprising: a support part for supporting the first substrate of the laminate; and the second substrate of the laminate. A flexible plate adsorbed on the adsorbing surface, and being installed on a surface of the flexible plate opposite to the adsorbing face, and being moved independently with respect to the support portion, the flexible plate is bent and deformed from one end side toward the other end side , a plurality of movable bodies for sequentially peeling the laminated body from the interface, and the plurality of movable bodies are attached to the flexible board through a plurality of connecting members, singularly and every plurality.

In order to achieve the above object, the laminate peeling method of the present invention includes a first substrate and a second substrate, and a laminate in which the first substrate and the second substrate are peelably bonded, the first substrate and the second substrate, a step of supporting the first substrate of the layered product by a support part, wherein the first substrate of the layered product is supported by a support part; An adsorption step of adsorbing a second substrate on an adsorption surface of a flexible plate, and a plurality of plurality of flexible plates through a plurality of connecting members so that the second substrate of the laminate is sequentially flexibly deformed from one end side to the other end side. It is characterized by comprising a peeling step of sequentially peeling the layered product at the interface by bending and deforming it with a movable body.

In order to achieve the above object, the manufacturing method of an electronic device of the present invention has a function of forming a functional layer on an exposed surface of a first substrate in a laminate formed by attaching a first substrate and a second substrate in a peelable manner. An electronic device manufacturing method comprising a layer forming step and a separating step of separating the second substrate from the first substrate on which the functional layer is formed, wherein the separating step comprises: placing the first substrate of the laminate on a support portion. a supporting step of supporting the laminated body, and an adsorbing step of adsorbing the second substrate of the laminated body on the adsorbing surface of the flexible plate, so that the second substrate of the laminated body is bent sequentially from one end side toward the other end side, and a peeling step of sequentially peeling the second substrate from the first substrate by bending and deforming the flexible board by means of a plurality of movable bodies via a plurality of connecting members.

According to the present invention, in the peeling step, the power of the movable body is transmitted to the flexible board through the connecting member, so that the flexible board is bent and deformed. That is, the conventional movable body bends and deforms the flexible plate by transmitting power to the flexible plate at one point, but in the present invention, since a connecting member is interposed between the movable body and the flexible plate, the power of the movable body , can be transmitted in lines or planes for flexible boards. In this way, the first substrate and the second substrate can be separated by a peeling device in which the number of movable bodies is reduced.

In one aspect of the present invention, the connecting member is configured in an elongated shape, and its longitudinal axis is disposed along a peeling wire that is a boundary line between an already peeled portion and an unpeeled portion of the interface, and the connecting member is disposed along the interface. It is preferable to arrange a plurality at intervals along the peeling progress direction.

According to one aspect of the present invention, since the longitudinal axis of the connecting member coincides with the peeling wire, the first substrate and the second substrate can be smoothly separated.

In another aspect of the present invention, it is preferable that the connecting members are each configured to have a length corresponding to the length of the peeling wire, and the movable body is disposed at a position that divides the connecting member equally in the longitudinal direction. .

According to another aspect of the present invention, since the power of the movable body can be transmitted uniformly in the longitudinal direction of the connecting member, the first substrate and the second substrate can be separated more smoothly.

In another aspect of this invention, it is preferable that the said connection member is attached to the said flexible board via a buffer member.

According to still another aspect of the present invention, even if a fluctuation occurs in the distance between the support section and the flexible board due to fluctuations in the flatness of the support section and the flexible board, the buffer member absorbs the fluctuation, so that the connecting member is replaced with the flexible board. can be installed for sure. Further, since the shock absorbing member absorbs fluctuations in the straightness of the connecting member, the connecting member can be reliably attached to the flexible board.

According to the peeling apparatus and peeling method of a layered product and the manufacturing method of an electronic device according to the present invention, the first substrate and the second substrate can be peeled by reducing the number of movable bodies.

1 is an enlarged side view of a main part showing an example of a laminate provided in a manufacturing process of an electronic device.
Fig. 2 is an enlarged side view of a main part showing an example of a laminate produced during the LCD manufacturing process.
3(A) to (E) are explanatory diagrams showing a method for manufacturing a peeling start portion using a peeling start portion fabrication device.
Fig. 4 is a plan view of a laminate in which a peel start portion is produced by a method for producing a peel start portion.
5 is a longitudinal sectional view showing the configuration of the peeling device of the embodiment.
Fig. 6 is a plan view of the flexible board showing arrangement positions of a plurality of connecting members relative to the peeling unit.
7(A) to (C) are explanatory diagrams showing the configuration of the peeling unit.
Fig. 8 is a longitudinal sectional view of a peeling device that peels a layered product at an interface.
Fig. 9 is a longitudinal sectional view showing an installation structure of a shock absorbing member to a connecting member.
10(A) and (B) are longitudinal cross-sectional views of the buffer member 82 showing the operation of the buffer member 82. As shown in FIG.
11(A) to (C) are explanatory diagrams illustrating a peeling method of peeling a reinforcing plate of a layered product in which a peeling start portion was produced in a time-sequential manner by the peel start portion preparation method.
Figs. 12(A) to (C) are explanatory diagrams illustrating a peeling method of peeling the reinforcing board of the layered product sequentially following Figs. 11(A) to (C).
13 (A) and (B) are enlarged perspective views of main parts of FIG. 11 (B) and (C).

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described according to accompanying drawings.

Below, the case where the peeling apparatus and peeling method of the laminate concerning this invention are used in the manufacturing process (manufacturing method) of an electronic device is demonstrated.

Electronic devices refer to electronic components such as display panels, solar cells, and thin film secondary batteries. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP), and an organic electro luminescence display (OELD) panel can be exemplified.

[Manufacturing process of electronic device]

BACKGROUND OF THE INVENTION Electronic devices are manufactured by forming functional layers for electronic devices (thin film transistors (TFTs) and color filters (CFs) in the case of LCDs) on the surface of a substrate made of glass, resin, metal, or the like.

The back surface of the substrate is attached to a reinforcing plate before formation of the functional layer to form a laminate. After that, a functional layer is formed on the surface of the substrate in a laminated state. Then, after formation of the functional layer, the reinforcing plate is peeled off from the substrate.

That is, the manufacturing process of an electronic device includes a functional layer forming process of forming a functional layer on the surface of a substrate in a laminate state, and a separation process of separating a reinforcing plate from a substrate on which the functional layer is formed. To this separation step, the layered product peeling device and peeling method according to the present invention are applied.

[Laminate (1)]

1 is an enlarged side view of a main part showing an example of the laminate 1 .

The laminate 1 includes a substrate (first substrate) 2 on which a functional layer is formed, and a reinforcing plate (second substrate) 3 reinforcing the substrate 2 . In addition, the front surface 3a of the reinforcing board 3 is equipped with the resin layer 4 as an adsorption layer, and the back surface 2b of the board|substrate 2 is bonded to the resin layer 4. That is, the substrate 2 is attached to the reinforcing board 3 through the resin layer 4 so as to be peelable by the Van der Waals force acting between it and the resin layer 4 or the adhesive force of the resin layer 4. do.

[Substrate (2)]

The substrate 2 has a functional layer formed on its surface (exposed surface) 2a. As the substrate 2, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these substrates, since the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small coefficient of linear expansion, it is preferable as the substrate 2 for electronic devices. In addition, as the coefficient of linear expansion decreases, there is also an advantage that the pattern of the functional layer formed at a high temperature becomes difficult to shift during cooling.

As the glass of the glass substrate, alkali-free glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses containing silicon oxide as a main component can be exemplified. As oxide type glass, the glass whose content of silicon oxide by oxide conversion is 40-90 mass % is preferable.

It is preferable to select and employ|adopt the glass of a glass substrate suitable for the kind of electronic device to manufacture, and the glass suitable for the manufacturing process. For example, it is preferable to employ|adopt the glass (alkali free glass) which does not contain an alkali metal component substantially for the glass substrate for liquid crystal panels.

The thickness of the substrate 2 is set according to the type of the substrate 2 . For example, when a glass substrate is used for the substrate 2, its thickness is preferably 0.7 mm or less, more preferably 0.3 mm or less, still more preferably 0.1 mm, for the purpose of reducing the weight and thinning of the electronic device. set below When thickness is 0.3 mm or less, favorable flexibility can be provided to a glass substrate. Moreover, when thickness is 0.1 mm or less, although a glass substrate can be wound up in roll shape, it is preferable that the thickness is 0.03 mm or more from the manufacturing viewpoint of a glass substrate, and a handling viewpoint of a glass substrate.

In addition, although the board|substrate 2 is comprised by one board|substrate in FIG. 1, the board|substrate 2 may be comprised by several board|substrates. That is, the substrate 2 may be formed of a laminated body in which a plurality of substrates are stacked. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2 .

[Reinforcing plate (3)]

As the reinforcement board 3, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be illustrated.

The thickness of the reinforcement plate 3 is set to 0.7 mm or less, and is set according to the type, thickness, etc. of the substrate 2 to be reinforced. In addition, the thickness of the reinforcing board 3 may be thicker or thinner than the board|substrate 2, but it is preferable that it is 0.4 mm or more in order to reinforce the board|substrate 2.

Further, in this example, the reinforcing board 3 is constituted by a single board, but the reinforcing board 3 may be constituted by a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all substrates constituting the reinforcing board 3 is the thickness of the reinforcing board 3 .

[Resin layer (4)]

In order to prevent the laminated body from peeling between the resin layer 4 and the reinforcing board 3, the bonding force between the resin layer 4 and the reinforcing board 3 is greater than the bonding strength between the substrate 2. set high Thereby, in a peeling process, it peels at the interface of the resin layer 4 and the board|substrate 2.

Resin constituting the resin layer 4 is not particularly limited, but examples thereof include acrylic resins, polyolefin resins, polyurethane resins, polyimide resins, silicone resins, and polyimide silicone resins. A mixture of several types of resin may also be used. Especially, a silicone resin and a polyimide silicone resin are preferable from a viewpoint of heat resistance or peelability.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 μm, more preferably 4 to 20 μm. By setting the thickness of the resin layer 4 to 1 μm or more, when air bubbles or foreign substances are mixed between the resin layer 4 and the substrate 2, the thickness of the air bubbles or foreign substances is absorbed by the deformation of the resin layer 4. can do. On the other hand, by making the thickness of the resin layer 4 into 50 micrometers or less, since the formation time of the resin layer 4 can be shortened and resin of the resin layer 4 is not used more than necessary, it is economical.

In addition, the outer shape of the resin layer 4 is the same as or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. it is desirable In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere to the entire substrate 2. .

In addition, although the resin layer 4 is comprised by one layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer 4 . In addition, in this case, the kind of resin which comprises each layer may be different.

In addition, in embodiment, although the resin layer 4 which is an organic film was used as an adsorption layer, you may use an inorganic layer instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one material selected from the group consisting of metal silicides, nitrides, carbides, and carbonitrides.

In addition, although the laminated body 1 of FIG. 1 is equipped with the resin layer 4 as an adsorption layer, it is good also as a structure which eliminates the resin layer 4 and contains the board|substrate 2 and the reinforcement board 3. In this case, the substrate 2 and the reinforcing plate 3 are attached so that they can be separated by van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3 . Further, when the substrate 2 and the reinforcing plate 3 are glass plates, an inorganic thin film is formed on the surface 3a of the reinforcing plate 3 so that the substrate 2 and the reinforcing plate 3 do not adhere at high temperatures. It is desirable to do

[Laminate 6 of Embodiment with Functional Layer Formed]

A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 by passing through the functional layer forming step. As a method of forming the functional layer, vapor deposition methods such as CVD (Chemical Vapor Deposition) method and PVD (Physical Vapor Deposition) method, and sputtering method are used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

Fig. 2 is an enlarged side view of a main part showing an example of a rectangular laminate 6 produced during the LCD manufacturing process.

The laminate 6 includes a reinforcing board 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing board 3B in this order. It is composed of layered. That is, the layered body 6 of FIG. 2 corresponds to the layered body in which the layered body 1 shown in FIG. 1 is symmetrically arranged with the functional layer 7 interposed therebetween. Hereinafter, a laminate including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminate 1A, and the substrate 2B, the resin layer 4B, and the reinforcing plate ( A laminate including 3B) is referred to as a second laminate 1B.

A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminate 1A, and the surface 2Ba of the substrate 2B of the second laminate 1B. ), a color filter CF as the functional layer 7 is formed.

The first layered body 1A and the second layered body 1B are integrated with the surfaces 2Aa and 2Ba of the substrates 2A and 2B overlapping each other. Thereby, the laminate 6 of the structure in which the 1st laminated body 1A and the 2nd laminated body 1B are symmetrically arrange|positioned with the functional layer 7 interposed is manufactured.

In the laminate 6, after the peeling start portion is formed with a knife in the peeling start portion preparation step of the separation step, the reinforcing plates 3A and 3B are sequentially peeled in the peeling step of the separation step, and thereafter, a polarizing plate, a backlight, etc. It is installed, and the product, LCD, is manufactured.

[Peel start portion manufacturing device 10]

3(A) to (E) are explanatory diagrams showing the configuration of the peeling start portion manufacturing device 10 used in the peeling start portion manufacturing process, and FIG. 3 (A) shows the laminate 6 and the knife. An explanatory diagram showing the positional relationship of N. FIG. 3(B) is an explanatory diagram for producing the peeling start portion 26 at the interface 24 with the knife N. FIG. An explanatory diagram showing a state immediately before manufacturing the peeling start portion 30, FIG. 3(D) is an explanatory diagram for fabricating the peeling start portion 30 at the interface 28 by knife N, ) is an explanatory view of the layered product 6 in which the peeling start portions 26 and 30 were produced. 4 is a plan view of the layered product 6 in which the peeling start portions 26 and 30 were produced.

At the time of production of the peeling start parts 26 and 30, the laminated body 6 is horizontally ( It is supported in the X-axis direction in the drawing).

The knife N is supported horizontally by the holder 14 so that the blade edge faces the end surface of the corner portion (one end side) 6A of the laminated body 6 . In addition, the position of the knife N in the height direction (Z-axis direction in the drawing) is adjusted by the height adjusting device 16 . In addition, the knife N and the laminated body 6 are relatively moved in the horizontal direction by a conveying device 18 such as a ball screw device. The transfer device 18 should just move at least one of the knife N and the table 12 in the horizontal direction, and the knife N moves in embodiment. In addition, a liquid supply device 22 for supplying liquid 20 to the upper surface of the knife N before or during cutting is disposed above the knife N.

[Method of manufacturing peeling initiation part]

In the peeling start part manufacturing method by the peeling start part manufacturing device 10, the cutting position of the knife N is the corner part 6A of the laminated body 6, and is overlapped in the thickness direction of the laminated body 6. It is set, and the amount of cutting of the knife N is set differently for each interface 24, 28.

The manufacturing procedure is explained.

In the initial state, the blade tip of the knife N exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B, which is the first cutting position. Therefore, first, as shown in FIG. 3(A), the knife N is moved in the height direction, and the height of the edge of the knife N is set to the height of the interface 24.

After that, as shown in FIG. 3(B), the knife N is moved horizontally toward the corner portion 6A of the laminate 6, and the knife N is inserted into the interface 24 by a predetermined amount. In addition, at the time of insertion of the knife N or before the insertion of the knife, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. Thereby, since the board|substrate 2B of corner part 6A peels from the resin layer 4B, the peeling start part 26 of triangular shape in planar view is produced in the interface 24 as shown in FIG. In addition, although the supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 even after removing the knife N, so that the peeling start portion ( 26) can be produced.

Next, the knife N is removed from the corner portion 6A in the horizontal direction, and as shown in FIG. 28) to a height.

After that, as shown in FIG. 3(D), the knife N is moved horizontally toward the layered body 6, and the knife N is inserted into the interface 28 by a predetermined amount. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. Thereby, like FIG. 3(D), the peeling start part 30 is produced in the interface 28. Here, the cutting amount of the knife N to the interface 28 is made smaller than the cutting amount to the interface 24. The above is the peeling start part manufacturing method. In addition, it is good also considering the cutting amount of the knife N with respect to the interface 24 smaller than the cutting amount with respect to the interface 28.

The layered product 6 in which the peeling start portions 26 and 30 have been fabricated is taken out of the peeling start portion manufacturing device 10, conveyed to a peeling device described later, and sequentially peeled at the interfaces 24 and 28 by the peeling device. do.

Although the detail of the peeling method is mentioned later, like the arrow A of FIG. 4, by bending the laminated body 6 from the corner part 6A toward the corner part (other end side) 6B which opposes the corner part 6A. At the interface 24 where the area of the peeling start part 26 is large, it peels first starting from the peeling start part 26. Thereby, the reinforcing board 3B peels. After that, by bending the layered product 6 again from the corner portion 6A toward the corner portion 6B, the area of the peeling start portion 30 is small at the interface 28 starting from the peeling start portion 30. and is peeled off Thereby, 3 A of reinforcing plates are peeled.

In addition, the cutting amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm depending on the size of the layered product 6.

[peeling device 40]

5 is a longitudinal sectional view showing the configuration of the peeling device 40 of the embodiment. FIG. 6 shows a plurality of (19 in FIG. 6 ) connection members 44A, 44B, 44C, 44D, 44E, 44F, 44G, 44H, 44I, 44J, 44K for the peeling unit 42 of the peeling device 40. , 44L, 44M, 44N, 44O, 44P, 44Q, 44R, 44S), and a plurality of drive units (movable bodies) (48A, 48B, 48C, 48D, 48E, 48F, 48G, 48H, 48I, 48J, 48K, 48L, 48M, 48N, 48O, 48P, 48Q, 48R, 48S) is a plan view of the peeling unit 42 schematically showing the arrangement position. 5 corresponds to a cross-sectional view taken along line B-B in FIG. 6, and in FIG. 6, the laminate 6 is indicated by a solid line.

As shown in FIG. 5 , the peeling device 40 includes a pair of movable devices 46 and 46 arranged vertically with the layered product 6 interposed therebetween. Since the movable devices 46 and 46 have the same structure, the movable device 46 disposed on the lower side in FIG. 5 will be described here, and the movable device 46 disposed on the upper side will be described by giving the same reference numerals. omit

The movable device 46 includes the above-described plurality of linking members 44A to 44S, the above-described plurality of driving devices 48A to 48S for lifting and moving the linking members 44A to 44S for each linking member 44A to 44S, and Each of the drive devices 48A to 48S is configured with a controller 50 or the like that controls the drive devices 48A to 48S. In addition, the connecting members 44A to 44S and the driving devices 48A to 48S are described later. Further, the coupling members 44A, 44B, 44C, 44D, 44P, 44Q, 44R, and 44S are driven by one (single) drive device 48A, 48B, 48C, 48D, 48P, 48Q, 48R, and 48S. It is moved up and down. Two (plural) drive units 48E, 48F, 48G, 48H, 48I, 48J, 48K , 48L, 48M, 48N, 48O).

The peeling unit 42 holds the reinforcing plate 3B by vacuum suction in order to bend and deform the reinforcing plate 3B. In addition, instead of vacuum adsorption, electrostatic adsorption or magnetic adsorption may be used.

[peeling unit 42]

Fig. 7(A) is a plan view of the exfoliating unit 42, and Fig. 7(B) is an enlarged longitudinal sectional view of the exfoliating unit 42 along line C-C of Fig. 7(A). 7(C) shows that the suction unit 54 constituting the peeling unit 42 is attached to the rectangular plate-shaped flexible plate 52 constituting the peeling unit 42 via the double-sided adhesive tape 56. It is an enlarged longitudinal cross-sectional view of the peeling unit 42 showing what was provided so that it could be attached or detached.

As described above, the peeling unit 42 is configured by attaching the adsorbing portion 54 to the flexible board 52 via the double-sided adhesive tape 56 so as to be detachably attached.

The suction portion 54 includes a flexible plate 58 that is thinner than the flexible plate 52 . The lower surface of this flexible board 58 is detachably attached to the upper surface of the flexible board 52 via the double-sided tape 56.

In addition, the adsorption portion 54 is provided with a rectangular air permeable sheet (adsorption surface) 60 that adsorbs and holds the inner surface of the reinforcing plate 3B of the laminate 6 . The thickness of the air permeable sheet 60 is 2 mm or less, preferably 1 mm or less, for the purpose of reducing the tensile stress generated in the reinforcing plate 3B during peeling, and a 0.5 mm thickness is used in the embodiment.

Further, the adsorbing portion 54 is provided with a seal frame member 62 that surrounds the air permeable sheet 60 and contacts the outer circumferential surface of the reinforcing plate 3B. The seal frame member 62 and the air permeable sheet 60 are adhered to the upper surface of the flexible board 58 via a double-sided adhesive tape 64. In addition, the seal frame member 62 is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and its thickness is configured to be 0.3 mm to 0.5 mm thicker than the thickness of the air permeable sheet 60.

Between the breathable sheet 60 and the seal frame member 62, a frame-shaped groove 66 is provided. In addition, a plurality of through holes 68 are opened in the flexible plate 52, and one end of the through hole 68 communicates with the groove 66, and the other end of the through hole 68 communicates with the groove 66. It is connected to a power source (e.g. vacuum pump).

Therefore, when the suction source is driven, air is sucked through the suction tube, the through hole 68, and the groove 66, so that the inner surface of the reinforcing plate 3B of the laminate 6 is attached to the air permeable sheet 60. Vacuum adsorption is maintained, and the outer circumferential surface of the reinforcing plate 3B is brought into press contact with the seal frame member 62 . Thereby, the airtightness of the adsorption space enclosed by the seal frame member 62 is improved.

Since the flexible plate 52 has a higher bending rigidity than the flexible plate 58, the air permeable sheet 60, and the seal frame member 62, the bending rigidity of the flexible plate 52 is greater than the bending rigidity of the peeling unit 42. dominate It is preferable that the bending rigidity per unit width (1 mm) of the peeling unit 42 is 1000-40000 N*mm<2>/mm. For example, in the part where the width of the peeling unit 42 is 100 mm, the bending rigidity is set to 100000 to 4000000 N mm 2 . By setting the bending rigidity of the peeling unit 42 to 1000 N mm 2 /mm or more, bending of the reinforcing board 3B adsorbed and held by the peeling unit 42 can be prevented. Moreover, the reinforcement board 3B adsorption-held by the peeling unit 42 can be flexibly deformed appropriately by making the bending rigidity of the peeling unit 42 into 40000 N*mm<2>/mm or less.

The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, for example, resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM) resin. .

[movable device 46]

A plurality of connecting members 44A to 44S constituting the movable device 46 of FIG. 5 are fixed to the lower surface of the flexible plate 52 (a surface opposite to the suction surface) via a buffer member 82 .

<Connecting members 44A to 44S>

As shown in FIG. 6 , the connecting members 44A to 44S are made of, for example, aluminum with high rigidity, and their longitudinal axis is the same as that of the pre-peeled portion of the interfaces 24 and 28 (see FIG. 5 ) of the laminate 6. It is arrange|positioned along the peeling wire L (refer FIG. 6, FIG. 8) which is the boundary line of a peeling part.

On the other hand, 52 A of corner parts of the flexible board 52 corresponding to 6 A of corner parts of the layered product 6 extend in a direction opposite to the peeling advancing direction A of the peeling wire L. In this corner part 52A, two connecting members 44A, 44B and two driving devices 48A, 48B are arranged along the peeling advancing direction A. That is, 6 A of corner parts are peeled by lowering two driving devices 48A, 48B arrange|positioned at 52 A of corner parts.

Further, the connecting members 44A to 44S are disposed at intervals along the peeling advancing direction (arrow A in FIG. 6 ) of the interfaces 24 and 28 (see FIG. 5 ). Thereby, since the longitudinal axis of connecting members 44A-44S and the peeling wire L which advance coincide, the reinforcing board 3B can be peeled smoothly from the board|substrate 2B.

Moreover, connecting members 44C to 44Q are each configured with a length corresponding to the length of the peeling wire L.

Further, the driving devices 48A to 48S connected to the connecting members 44A to 44S are disposed at positions that equally divide the connecting members 44A to 44S in the longitudinal direction. That is, since the peeling wire does not pass below the connecting members 44A, 44B, 44R, 44S disposed outside the peeling start end and the peeling end end, the drive devices 48A, 48B, 48R, 48S are the connecting members One each is disposed in the central portion in the longitudinal direction of 44A, 44B, 44R, and 44S. In connection members 44C, 44D, 44P, 44Q disposed at the peeling start end and the peeling end end, since the length of the peeling wire L passing therebelow is shorter than that of other parts, the driving devices 48C, 48D, 48P, 48Q is disposed at a central portion in the longitudinal direction of each of the coupling members 44C, 44D, 44P, and 44Q. In other connecting members 44E to 44O, since the length of the peeling wire L passing therebelow is longer than that of the other parts, the driving devices 48E to 48O divide the connecting members 44E to 44O into thirds in the longitudinal direction. 2 of each are placed. Thereby, since the power from drive devices 48A to 48S can be transmitted uniformly in the longitudinal direction of connecting members 44A to 44S, the reinforcing plate 3B can be more smoothly peeled off from the substrate 2B. can The number of divisions in the longitudinal direction is not limited to 2 divisions or 3 divisions, and may be 4 divisions or more, but it is assumed that the number of divisions does not deviate from the object of the present invention of reducing the number of driving devices.

These driving devices 48A to 48S are moved up and down independently by the controller 50 .

That is, the controller 50 controls the driving devices 48A to 48S to progress the peeling indicated by the arrow A from the connecting member 44A located on the side of the corner portion 6A of the layered product 6 in FIG. 6 . The connecting member 44S located on the side of the corner portion 6B in the direction is sequentially moved down. By this operation, as shown in the longitudinal cross-sectional view of FIG. 8 , the layered product 6 is peeled from the interface 24 starting from the peeling start portion 26 (see FIG. 4 ). In addition, the laminate 6 shown in FIGS. 5 and 8 is a laminate 6 in which the peel start portions 26 and 30 are manufactured by the peel start portion manufacturing method described in FIGS. 3 (A) to (E). )am.

The driving devices 48A to 48S are constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism. Connecting members 44A to 44S are connected to the distal end of the rod 70 via a ball joint and a lateral sliding mechanism (not shown). Thereby, following the bending deformation of the peeling unit 42, it is possible to tilt the connecting members 44A to 44S. Therefore, the peeling unit 42 can be bent and deformed sequentially from the corner part 6A toward the corner part 6B, without applying excessive force to the peeling unit 42. In addition, the driving devices 48A to 48S are not limited to rotary servomotors and ball screw mechanisms, and may be linear servomotors or fluid pressure cylinders (eg pneumatic cylinders).

When removing the peeled reinforcing board 3B from the peeling unit 42, the frame|frame 74 moves down by the drive part not shown.

The controller 50 is configured as a computer including a CPU, ROM, and recording media such as RAM. The controller 50 controls the plurality of drive devices 48A to 48S for each drive device 48A to 48S by executing the program recorded on the recording medium on the CPU, so as to move the plurality of linking members 44A to 44S up and down. to control

<buffering member 82>

Fig. 9 is a longitudinal sectional view showing an installation structure of the buffer member 82 to the connecting member 44D. 10(A) is a longitudinal sectional view of the buffer member 82 at non-compression, and (B) is a longitudinal sectional view of the buffer member 82 at the time of compression. 9 and 10 (A) and (B) illustrate the buffer member 82 attached to the linking member 44D, but the shock absorber attached to the other linking members 44A to 44C and 44E to 44S. The member 82 also has the same structure. The buffer member 82 is composed of a bolt 84, a spring 86, a stopper 88, and a nut 90.

The base portion 84A of the bolt 84 is fixed to the flexible plate 52 of the peeling unit 42 with a screw 92, and the screw portion 84B is screwed into the through hole 45 of the connecting member 44D. ) protrudes outward from The threaded portion 84B is inserted into the spring 86, and the spring 86 is interposed between the base portion 84A and the connecting member 44D. In addition, the connecting member 44D is configured to have a U-shaped cross section.

A stopper 88 having a larger diameter than the through hole 45 is fixed by a nut 90 to the screw portion 84B protruding from the through hole 45 . In the form in which this stopper 88 is brought into contact with the surface of the connecting member 44D as shown in Fig. 10 (A), the spring 86 is held at the pre-compression length. As a result, the buffer member 82 is in a non-compressed form. 9, when connecting member 44D is raised by drive device 48D, surface of connecting member 44D comes into contact with stopper 88, via stopper 88 and bolt 84. The peeling unit 42 can be raised.

In addition, when fluctuations occur in the interval between the pair of exfoliation units 42 and 42 disposed vertically (interval between the support portion and the flexible board) due to fluctuations in the flatness of the flexible board 52 of the exfoliation unit 42 , the spring 86 contracts as shown in FIG. 10(B) to absorb the fluctuation. In addition, even when a fluctuation occurs in the straightness of the connecting member 44D, the spring 86 contracts to absorb the fluctuation. As a result, even if fluctuations occur in the distance and the straightness, the connecting member 44D can be attached to the flexible board 52 reliably.

[Peel method of reinforcing board 3A, 3B by peeling device 40]

11(A) to (C) to 12(A) to (C) show a peeling start portion in the corner portion 6A by the peeling start portion manufacturing method described in FIGS. 3A to (E). The peeling method of the laminate 6 from which 26 and 30 were made is shown. That is, in this figure, the peeling method of peeling reinforcement board 3A, 3B of the laminated body 6 is shown time-sequentially.

In the carrying-in operation of the layered product 6 to the peeling device 40, the carrying-out operation of the peeled reinforcing plates 3A and 3B, and panel P, the suction pad 78 shown in FIG. 11(A) is used. It is performed by the conveying device 80 provided. In Fig. 11 (A) to (C) and Fig. 12 (A) to (C), illustration of the movable device 46 is omitted in order to avoid complexity in the drawings. In addition, panel P is a product panel to which board|substrate 2A and board|substrate 2B from which reinforcing board 3A, 3B were removed were affixed via the functional layer 7.

11(A) is a side view of the peeling device 40 in which the layered product 6 is mounted on the lower peeling unit 42 by the operation indicated by the arrows E and F of the conveying device 80. In this case, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the conveying device 80 is inserted between the lower peeling unit 42 and the upper peeling unit 42. moved to the location in advance. And when the layered product 6 is placed on the lower side peeling unit 42, the reinforcing board 3B of the layered product 6 is vacuum-adsorbed and held by the lower side peeling unit 42. That is, Fig. 11(A) shows an adsorption step in which the reinforcing plate 3B as the second substrate is adsorbed and held by the peeling unit 42 on the lower side.

In (B) of FIG. 11 , the lower peeling unit 42 and the upper peeling unit 42 are moved in a direction in which they become relatively closer, so that the reinforcing plate 3A of the layered product 6 moves toward the upper peeling unit 42 ) It is a side view of the peeling device 40 in a state of being held by vacuum adsorption. That is, FIG. 11(B) shows a supporting step in which the reinforcing board 3A as the first substrate is supported by the peeling unit (support part) 42 on the upper side. 13(A) is a perspective view corresponding to FIG. 11(B), and is an enlarged perspective view of the corner portion 6A of the laminate 6. As shown in FIG.

In addition, when peeling the board|substrate 2 of the laminated body 1 shown in FIG. 1 from the reinforcing board 3 by the peeling apparatus 40, the board|substrate 2 which is a 1st board|substrate is separated from the upper peeling unit. It is supported by the (support part) 42 (support process), and the reinforcing board 3 which is a 2nd board|substrate is suction-held by the peeling unit 42 on the lower side (adsorption process). In this case, the support part which supports the board|substrate 2 is not limited to the peeling unit 42, What is necessary is just to be able to support the board|substrate 2 detachably. However, since the board|substrate 2 and the reinforcing board 3 can be simultaneously curved and peeled by using the peeling unit 42 as a support part, compared with the form which curves only the board|substrate 2 or the reinforcing plate 3, peeling It has the advantage of reducing power.

Returning to FIGS. 11(A) to (C), FIG. 11(C) bends the lower peeling unit 42 downward from the corner portion 6A of the laminate 6 toward the corner portion 6B. It is a side view showing a state in which the layered product 6 is peeled from the interface 24 starting from the peeling start portion 26 (see Fig. 4) while being deformed. That is, in the plurality of connecting members 44A to 44S of the lower peeling unit 42 shown in FIG. 8, from the connecting member 44A located on the side of the corner portion 6A of the layered body 6, the corner portion (6B) The connecting member 44S located on the side is sequentially moved downward to peel at the interface 24 (peeling step). 13(B) is a perspective view corresponding to FIG. 11(C), and is an enlarged perspective view of the corner portion 6A of the laminate 6. As shown in FIG. According to this figure, it turns out that the peeling unit 42 is bent and deformed by the downward movement of coupling members 44A-44E, and the reinforcing board 3B peels from the board|substrate 2B.

Furthermore, in conjunction with the above operation, in the plurality of connecting members 44A to 44S of the upper peeling unit 42, from the connecting member 44A located on the side of the corner portion 6A of the laminated body 6, the corner The coupling member 44S located on the side of the portion 6B may be sequentially moved upward and separated from the interface 24 . Thereby, compared with the form which curves only the reinforcement board 3B, peeling force can be made small.

12(A) is a side view of the peeling device 40 in a state in which the reinforcing plate 3B is completely peeled at the interface 24. As shown in FIG. According to this figure, the peeled reinforcing board 3B is held in vacuum by the peeling unit 42 on the lower side, and the laminate 6 (including the reinforcing plate 3A and panel P) except for the reinforcing plate 3B laminated body) is vacuum suction-held by the peeling unit 42 on the upper side.

Moreover, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the conveying device 80 shown in FIG. 11(A) is inserted between the upper and lower peeling units 42. moved to a location

After this, first, the vacuum suction of the peeling unit 42 on the lower side is released. Next, the reinforcement board 3B is adsorbed and held via the resin layer 4B by the suction pad 78 of the conveyance device 80 . Then, the reinforcing board 3B is carried out from the peeling device 40 by the operation|movement of the conveying apparatus 80 shown by the arrows G and H of FIG. 12(A).

12(B) is a side view in which the layered body 6 except for the reinforcing plate 3B is vacuum suction-held by the peeling unit 42 on the lower side and the peeling unit 42 on the upper side. That is, the peeling unit 42 on the lower side and the peeling unit 42 on the upper side are moved in a relatively close direction, and the substrate 2B is vacuum-sucked and held by the peeling unit 42 on the lower side (support step).

12(C) shows that the laminate 6 is bent at the interface 28 while bending and deforming the upper peeling unit 42 upward from the corner 6A of the laminate 6 toward the corner 6B. , it is a side view showing a state in which peeling starts from the peeling start portion 30 (see Fig. 4). That is, in the plurality of connecting members 44A to 44S of the upper peeling unit 42 shown in FIG. 8, from the connecting member 44A located on the side of the corner portion 6A of the laminate 6 to the corner portion. (6B) The connecting member 44S located on the side is sequentially moved upward to be peeled at the interface 28 (peeling step). Furthermore, in conjunction with this operation, in the plurality of connecting members 44A to 44S of the peeling unit 42 on the lower side, from the connecting member 44A located on the side of the corner portion 6A of the layered product 6, the corner The coupling member 44S located on the side of the portion 6B may be sequentially moved downward to be separated from the interface 28. Thereby, compared with the form which curves only 3 A of reinforcing plates, peeling force can be made small.

Then, the reinforcing board 3A peeled completely from panel P is taken out from the upper peeling unit 42, and panel P is taken out from the lower peeling unit 42. The above is the peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were produced in 6 A of corner parts.

[Features of Peeling Device 40]

[First feature]

In the peeling process, the peeling device 40 transmits the power of the driving devices 48A to 48S to the flexible board 52 via the elongated connecting members 44A to 44S to bend the flexible board 52. It is characterized by transformation.

That is, the conventional driving device bends and deforms the flexible board by transmitting power to the flexible board at one point, but in the embodiment, the long-shaped connection between the driving devices 48A to 48S and the flexible board 52 Since the members 44A to 44S are interposed, the power of the driving devices 48A to 48S can be transmitted to the flexible board 52 in a line or plane. Thereby, the board|substrate 2 (2A, 2B) and the reinforcement board 3 (3A, 3B) can be peeled with the peeling apparatus 40 which reduced the number of drive apparatuses 48A-48S.

[Second Feature]

In the peeling device 40, the connecting members 44A to 44S are arranged so that their longitudinal axes follow the peeling wire L as shown in FIG. has a characteristic in

Thereby, since the longitudinal axes of the connecting members 44A to 44S coincide with the peeling wire L, the substrate 2 (2A, 2B) and the reinforcing plate 3 (3A, 3B) can be peeled smoothly.

[Third Feature]

The peeling device 40 has a length corresponding to the length of the peeling wire L, and constitutes connecting members 44A to 44S, respectively, and is located at a position where the connecting members 44A to 44S are equally divided in the longitudinal direction, and a driving device 48A. to 48S) are respectively arranged.

Because of this, in the longitudinal direction of the connecting members 44A to 44S, the power of the driving devices 48A to 48S can be transmitted uniformly, so that the substrate 2 (2A, 2B) and the reinforcing plate 3 (3A, 3B) can be peeled off more smoothly.

[Fourth feature]

The peeling device 40 is characterized in that connecting members 44A to 44S are attached to the flexible board 52 via a buffer member 82 .

As a result, even if a fluctuation occurs in the interval between the pair of peeling units 42 and 42, the spring 86 of the buffer member 82 contracts so as to absorb the fluctuation. Also, fluctuations in the straightness of the connecting member 44B are absorbed by the contraction of the spring 86. As a result, even if fluctuations occur in the interval and the straightness, the connecting member 44B can be attached to the flexible board 52 reliably.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added, without deviating from the mind and range of this invention.

This application is based on Japanese Patent Application No. 2015-032742 filed on February 23, 2015 and Japanese Patent Application No. 2015-099740 filed on May 15, 2015, the contents of which are incorporated herein by reference.

N: knife
P: panel
1: Laminate
1A: 1st laminated body
1B: 2nd laminated body
2: substrate
2a: the surface of the substrate
2b: back side of substrate
2A: Substrate
2Aa: surface of substrate
2B: substrate
2Ba: surface of substrate
3: reinforcement plate
3a: surface of reinforcing plate
3A: reinforcement plate
3B: reinforcement plate
3Bb: back side of stiffening plate
4: resin layer
4A: resin layer
4B: resin layer
6: laminate
6A, 6B: corner part
7: functional layer
10: Peeling start portion production device
12: table
14: holder
16: height adjustment device
18: transfer device
20: liquid
22: liquid supply device
24: interface
26: peeling start portion
28: interface
30: peeling start portion
40: peeling device
42: peeling unit
44A to 44S: connecting member
46: mobile device
48A to 48S: driving device
50: controller
52: flexible board
54: adsorption unit
56: double-sided adhesive tape
58: flexible board
60: breathable sheet
62: seal frame member
64: double-sided adhesive tape
66: home
68: through hole
70: load
74: frame
78: suction pad
80: transport device
82: buffer member
84: bolt
86: spring
88: stopper
90: nut
92: screw

Claims (6)

A laminate including a first substrate and a second substrate, in which the first substrate and the second substrate are bonded in a peelable manner, is disposed from one end side to the other end side at an interface between the first substrate and the second substrate. In the peeling device of a layered product that is sequentially peeled,
a support portion for supporting the first substrate of the laminate;
a flexible plate for adsorbing the second substrate of the laminate on its adsorbing surface;
While being installed on the surface of the flexible board opposite to the adsorption surface, and being moved independently with respect to the support part, the flexible plate is bent and deformed from one end side toward the other end side, and the laminate is sequentially peeled at the interface A plurality of movable bodies are provided,
The plurality of movable bodies are attached to the flexible board through a plurality of connecting members in each singular and plural,
The connecting member is configured in a long shape, and its longitudinal axis is disposed along a peeling front line, which is a boundary line between an already peeled portion and an unpeeled portion of the interface, and the connecting member has a gap along the peeling progress direction of the interface. A peeling device for a layered product, characterized in that a plurality of pieces are placed and arranged. The method of claim 1, wherein the connecting members are each configured to have a length corresponding to the length of the peeling wire,
The movable body is disposed at a position that equally divides the connecting member in the longitudinal direction. The peeling device for a laminate according to claim 1 or 2, wherein the coupling member is attached to the flexible board via a buffer member. A laminate including a first substrate and a second substrate, in which the first substrate and the second substrate are bonded in a peelable manner, is disposed from one end side to the other end side at an interface between the first substrate and the second substrate. In the peeling method of a layered product that is sequentially peeled,
a supporting step of supporting the first substrate of the laminate by means of a supporting part;
an adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible board;
The flexible plate is bent and deformed by a plurality of movable bodies through a plurality of connecting members so that the second substrate of the laminate is sequentially bent and deformed from one end side toward the other end side, so that the laminate is sequentially bent at the interface. Peeling process to peel
to provide,
The connecting member is configured in a long shape, and its longitudinal axis is disposed along a peeling front line, which is a boundary line between an already peeled portion and an unpeeled portion of the interface, and the connecting member has a gap along the peeling progress direction of the interface. A peeling method of a layered product, characterized in that a plurality of pieces are placed and arranged. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate in a laminate formed by attaching a first substrate and a second substrate in a peelable manner; In the manufacturing method of an electronic device having a separation step of separating two substrates,
The separation process is
a supporting step of supporting the first substrate of the laminate by means of a supporting part;
an adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible board;
The flexible plate is bent and deformed by a plurality of movable bodies via a plurality of connecting members so that the second substrate of the laminate is sequentially bent and deformed from one end side toward the other end side, so that the second substrate is bent and deformed in the first direction. Peeling process to sequentially peel from the substrate
to provide,
The connecting member is configured in a long shape, and its longitudinal axis is disposed along a peeling wire that is a boundary line between a previously peeled portion and an unpeeled portion of the interface between the first substrate and the second substrate. A method of manufacturing an electronic device, characterized in that a plurality of pieces are arranged at intervals along the peeling progress direction of the interface. delete

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