JP6047439B2 - Peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a peeling apparatus and a peeling method for peeling and separating two plate-like bodies that are in close contact with each other.

  As a technique for forming a predetermined pattern or thin film on a plate-like body such as a glass substrate or a semiconductor substrate, a technique for transferring a pattern or thin film (hereinafter referred to as “pattern etc.”) carried on another plate-like body onto the substrate. is there. In this technique, after two plates are brought into close contact with each other and a pattern or the like is transferred from one to the other, it is necessary to peel the two plates without damaging the pattern or the like.

  As a technique that can be used for this purpose, for example, Patent Document 1 records an image receiving sheet having an image forming layer in a technique for forming a pattern such as a color filter or an electric circuit wiring of a liquid crystal display device on a recording medium. After drawing on the medium, a predetermined pattern is formed on the recording medium by peeling the support layer of the image receiving sheet from the recording medium. In this technique, a peeling claw is provided in a gap between an image receiving sheet and a recording medium generated by sucking and holding one end of the image receiving sheet by a suction cup while a peeling roller that also functions as a squeeze roller is in contact with the image receiving sheet. The image receiving sheet and the recording medium are separated by being inserted and moved relative to the recording medium.

JP 2003-072123 (for example, FIGS. 14 to 16)

  In the above prior art, a constant peeling force (a force for separating both members) can be obtained by moving relative to the recording medium while maintaining the positional relationship between the peeling roller and the peeling claw. Since the peeling claw is brought into contact with one of the members, the member is damaged. On the other hand, if the peeling claw is not brought into contact in order to prevent damage to the member, it may not be possible to perform the peeling well. This is because the bending of the members increases with the progress of peeling, and the progress of peeling with respect to the separating operation of both members gradually slows down. Such fluctuations in the progressing speed of the peeling cause damage to patterns and the like due to stress concentration.

  In addition, the amount of movement for separating the two members increases, resulting in an increase in work space, bending of the member due to bending, cracking, and dropping of the member due to insufficient holding force. These problems have become particularly prominent as the member to be peeled becomes larger.

  The present invention has been made in view of the above problems, and in a peeling apparatus and a peeling method that peels and separates two plate-like bodies that are in close contact with each other, it can be favorably peeled off. It aims at providing the technology which can respond also to conversion.

  One aspect of the present invention is to provide a peeling apparatus for peeling a first plate-like body and a second plate-like body which are in close contact with each other through a thin film or a pattern. The holding surface has a holding surface larger than the plane size of the effective area on which the thin film or the pattern is formed, and the surface on the opposite side of the surface of the first plate-like body that is in close contact with the second plate-like body on the holding surface The holding means for holding the first plate-like body by contact and the one end portion of the second plate-like body moving in a direction away from the holding means while holding the one end portion of the second plate-like body, First peeling means for peeling from the plate-like body, and extending along the second plate-like body in a direction perpendicular to the peeling progress direction from one end of the second plate-like body to the other end opposite to the one end. At the contact start position adjacent to the downstream side of the one end in the peeling progress direction, Abuts against one surface of the second plate-like body on the opposite side to the surface in close contact with the shaped body, and moves in the peeling progress direction from the contact start position toward the other end while contacting the second plate-like body The contact means is provided on one side of the second plate-like body downstream of the contact start position in the peeling direction and partially on one surface of the second plate-like body after the contact means has passed. And a second peeling means that moves in a direction away from the holding means while abutting and holding the second plate-like body.

  In the invention configured in this manner, the second plate from the first plate-like body is moved by moving the first peeling means away from the holding means while the abutment means is in contact with the second plate-like body. The peeling of the state progresses. At this time, as the abutment means moves away from the first peeling means, the movement of the first peeling means is less likely to be reflected in the progress of peeling, but in the present invention, the second peeling means provided further downstream in the peeling progress direction. The peeling can be continuously progressed. Further, although the bending of the second plate-like body cannot be suppressed only by holding the one end portion by the first peeling means, the second peeling means holds the second plate-like body between the one end portion and the other end portion. Thus, the posture of the second plate-like body can be controlled. As described above, according to the present invention, the first plate-like body and the second plate-like body which are in close contact with each other can be peeled off satisfactorily, and good peeling performance can be flexibly accommodated to increase in size. Can be demonstrated.

  Of the surfaces of the first plate and the second plate that are in close contact with each other through a thin film or a pattern (hereinafter referred to as “pattern”), an effective region where the pattern or the like is effectively formed, or a region corresponding to the back surface thereof. When the member for holding is brought into contact with the surface, stress may be concentrated on the pattern or the like at the location to damage the pattern, etc. In this invention, after the contact means passes, that is, the first plate Since one surface (the surface opposite to the surface on which the pattern or the like is formed) of the second plate-like body after being peeled from the shape body is held, such a problem of damage to the pattern or the like does not occur.

  In the present invention, for example, a plurality of second peeling means may be arranged along the peeling progress direction, and the plurality of second peeling means may be configured to move toward and away from the holding means independently of each other. Good. In such a configuration, the second peeling means that acts to separate the second plate-like body from the first plate-like body can be sequentially switched as the abutting means moves along the peeling progress direction, and is stable. The peeling can be advanced while applying the peeling force between the first plate-like body and the second plate-like body. In particular, when the first and second plate-like bodies are large, it is effective to provide a plurality of second peeling means according to the size.

  Further, for example, the first peeling means may be configured to hold the second plate-like body outside the effective region where the thin film or pattern is formed in the second plate-like body. In such a configuration, since the second plate-like body is held outside the effective area, the holding by the first peeling means is prevented from damaging the pattern or the like.

  Further, for example, the first peeling means and the second peeling means may be configured to abut against one surface of the second plate-like body and suck and hold the second plate-like body. In such a configuration, the second plate-like body can be held without touching the pattern or the like, and damage to the pattern or the like can be prevented. Further, for example, the second plate-like body is not gripped with a mechanical nail or inserted between the first plate-like body, and therefore damage to the first and second plate-like bodies can be prevented.

  In this case, the contact portion that contacts the second plate-like body of the second peeling means may be formed by an elastic member that can expand and contract in a direction approaching and separating from the second plate-like body, for example. In this invention, after peeling from a 1st plate-shaped body, it is necessary for a 2nd peeling means to hold | maintain a 2nd plate-shaped body. At this time, since the back surface of the second plate-like body is not backed up, the distance from the second peeling means varies, and the second plate-like body may be pushed to the opposite side by the contact of the second peeling means. By configuring the contact portion of the second peeling means with an elastic member that can be expanded and contracted, it is possible to reliably hold the second plate-like body even in such a case.

  For example, each of the first peeling means and the second peeling means may have a plurality of suction pads that are arranged in a direction orthogonal to the peeling progress direction and come into contact with the second plate-like body. In such a configuration, the second plate-like body is sucked and held at a plurality of locations in a direction orthogonal to the peeling progress direction. Thereby, it becomes possible to hold the second plate-like body more strongly, and it is possible to effectively prevent the second plate-like body from being bent in the direction orthogonal to the peeling progress direction.

  Further, for example, the holding surface of the holding unit may be configured to be provided with suction holes or suction grooves that apply a negative pressure to suck the first plate-like body. In such a configuration, the effective area of the first plate-like body can be reliably held while being maintained in a planar state.

  According to another aspect of the present invention, there is provided a peeling method for peeling a first plate-like body and a second plate-like body that are in close contact with each other through a thin film or a pattern. The surface of the first plate-like body opposite to the surface in close contact with the second plate-like body is brought into contact with the holding surface larger than the plane size of the effective area on which the thin film or pattern is formed. At the contact start position adjacent to the downstream side of the one end in the peeling progress direction from the one end of the second plate to the other end opposite to the one end. A step of abutting a roller-like abutting means extending in a direction orthogonal to the peeling progress direction on one surface of the second plate-like body on the opposite side to the surface in close contact with the one plate-like body; One end of the plate-like body is moved in a direction away from the first plate-like body, and one end of the second plate-like body is moved to the first plate-like body. And a step of moving the contact means from the contact start position toward the other end portion in the peeling progress direction while abutting the abutting means on the second plate-shaped body, and moving the abutting means in the peeling direction. In a direction away from the first plate-like body while partially holding one surface of the second plate-like body after the contact means passes and peels from the first plate-like body on the downstream side of the contact start position. And a step of moving.

  In the invention configured as described above, similarly to the above-described peeling device, the holding position of the second plate-like body related to the peeling from the first plate-like body is switched to the downstream side with the movement of the contact means. The peeling can proceed well, and it is possible to cope with the increase in size of the first and second plate-like bodies.

  In the present invention, for example, peeling is a boundary line between an unpeeled area where the first plate-like body and the second plate-like body are in close contact with a peeled area where the first plate-like body and the second plate-like body are peeled off. A configuration may be adopted in which movement of the contact means is started when the boundary line reaches the contact start position, and the contact means is moved at a constant speed. In such a configuration, the peeling boundary line can be moved in the peeling progress direction at a constant speed, that is, the peeling progress speed can be made constant. For this reason, it is possible to effectively prevent damage to patterns and the like due to stress concentration.

  Further, for example, a configuration may be adopted in which the holding portion that holds one surface of the second plate-like body is sequentially added in the peeling progress direction as the contact means moves in the peeling progress direction. In such a configuration, the holding position of the second plate-like body related to the peeling from the first plate-like body is set as the abutting means, similarly to the invention of the peeling device in which a plurality of second peeling means are arranged in the peeling progress direction. By sequentially switching to the downstream side along with the movement, even if the first and second plate-like bodies are large, peeling can proceed with a stable peeling force.

  Further, for example, while maintaining the curvature of the second plate-like body at the contact portion with the contact means within a predetermined range, the movement of the contact means in the peeling progress direction and the first plate-like body of the second plate-like body. The structure which performs the movement to the direction which leaves | separates from may be sufficient. In such a configuration, the second plate-shaped body that is bent at the contact position with the contact means by the contact with the contact means and the separation movement from the first plate-shaped body is peeled in a stable state. Progresses. Therefore, during the period from the initial stage to the completion of the peeling, the peeling can be advanced while giving a stable peeling force between the first plate-like body and the second plate-like body.

  Further, for example, a configuration in which the posture of the second plate-like body is held substantially flat on the upstream side of the contact portion with the contact means in the peeling progress direction. With such a configuration, it is possible to prevent unnecessary bending stress from being applied to the second plate-like body after peeling.

  For example, after the 2nd plate-shaped body whole peels from the 1st plate-shaped body, the structure hold | maintained in parallel with respect to a 1st plate-shaped body may be sufficient. In such a configuration, the first and second plate bodies can be easily carried out by holding the second plate body separated from the first plate body in parallel with the first plate body. .

  According to this invention, by switching the holding position of the second plate-like body related to the peeling from the first plate-like body to the downstream side with the movement of the contact means, the peeling can be favorably progressed, Even if the object to be peeled is large, it can be peeled off satisfactorily.

It is a perspective view which shows one Embodiment of the peeling apparatus concerning this invention. It is a perspective view which shows the main structures of this peeling apparatus. It is a side view which shows the structure of an initial stage peeling unit, and the positional relationship of each part. It is a figure which shows the positional relationship of a stage and the workpiece | work mounted on this. It is a block diagram which shows the electric constitution of this peeling apparatus. It is a flowchart which shows a peeling process. It is a 1st figure which shows the positional relationship of each part in each step in process. It is a 2nd figure which shows the positional relationship of each part in each step in process. It is a figure for demonstrating the advantage of the peeling process in this embodiment.

  FIG. 1 is a perspective view showing an embodiment of a peeling apparatus according to the present invention. In order to uniformly indicate the direction in each figure, XYZ orthogonal coordinate axes are set as shown in the lower right of FIG. Here, the XY plane represents a horizontal plane and the Z axis represents a vertical axis. More specifically, the (+ Z) direction represents a vertically upward direction.

  This peeling apparatus 1 is an apparatus for peeling two plate-like bodies carried in with the main surfaces in close contact with each other. For example, it is used in a part of a pattern forming process for forming a predetermined pattern on the surface of a substrate such as a glass substrate or a semiconductor substrate. More specifically, in this pattern formation process, a pattern forming material is uniformly applied to a blanket surface as a carrier that temporarily carries a pattern to be transferred to a substrate, which is a transfer target (application process), and a pattern is formed. The coating layer is patterned by pressing a plate whose surface is processed according to the shape against the coating layer on the blanket (patterning step), and the blanket thus formed is brought into close contact with the substrate (transfer step), thereby forming a pattern. Is finally transferred from the blanket to the substrate.

  At this time, the apparatus can be suitably applied for the purpose of separating the plate and the blanket that are in close contact in the patterning step, or the substrate and the blanket that is in close contact in the transfer step. Of course, it may be used for both of these, and may be used for other purposes. For example, the present invention can also be applied to a peeling process when transferring a thin film carried on a carrier to a substrate.

  This peeling apparatus 1 has a structure in which a stage block 3 and an upper suction block 5 are respectively fixed on a main frame 11 attached to a housing. In FIG. 1, the housing is not shown to show the internal structure of the apparatus. In addition to these blocks, the peeling apparatus 1 includes a control unit 70 (FIG. 5) described later.

  The stage block 3 has a stage 30 for placing a close contact body (hereinafter referred to as “work”) in which a plate or a substrate and a blanket are in close contact, and the stage 30 is a flat surface whose upper surface is substantially horizontal. The horizontal stage part 31 which became and the taper stage part 32 where the upper surface became a plane which has the inclination of several degrees (for example, about 2 degree | times) with respect to a horizontal surface are provided. An initial peeling unit 33 is provided on the taper stage portion 32 side of the stage 30, that is, in the vicinity of the end portion on the (−Y) side. A roller unit 34 is provided so as to straddle the horizontal stage portion 31.

  On the other hand, the upper suction block 5 is erected from the main frame 11 and has a support frame 50 provided so as to cover the upper part of the stage block 3, a first suction unit 51 attached to the support frame 50, and a second An adsorption unit 52, a third adsorption unit 53, and a fourth adsorption unit 54 are provided. These adsorption units 51 to 54 are arranged in order in the (+ Y) direction.

  FIG. 2 is a perspective view showing the main configuration of the peeling apparatus. More specifically, FIG. 2 shows the structure of the stage 30, the roller unit 34, and the second suction unit 52 among the components of the peeling apparatus 1. The stage 30 includes a horizontal stage portion 31 whose upper surface 310 is a substantially horizontal surface and a tapered stage portion 32 whose upper surface 320 is a tapered surface. The upper surface 310 of the horizontal stage unit 31 has a plane size that is slightly larger than the plane size of the workpiece to be placed.

  The taper stage unit 32 is provided in close contact with the (−Y) side end of the horizontal stage unit 31, and the upper surface 320 thereof is the same height as the upper surface 310 of the horizontal stage unit 31 at the portion in contact with the horizontal stage unit 31. While located at (Z-direction position), it is retracted downward, that is, in the (−Z) direction, as it moves away from the horizontal stage portion 31 in the (−Y) direction. Therefore, in the entire stage 30, the horizontal surface of the upper surface 310 of the horizontal stage portion 31 and the tapered surface of the upper surface 320 of the tapered stage portion 32 are continuous, and the ridge line portion E to which they are connected has a linear shape extending in the X direction. ing.

  In addition, lattice-shaped grooves are formed on the upper surface 310 of the horizontal stage portion 31. More specifically, a grid-like groove 311 is provided at the center of the upper surface 310 of the horizontal stage portion 31 and one of the rectangles on the tapered stage portion 32 side is surrounded so as to surround the region where the groove 311 is formed. A groove 312 is provided on the peripheral edge of the upper surface 310 of the horizontal stage portion 31 so as to have a substantially U shape excluding the side. These grooves 311 and 312 are connected to a negative pressure supply unit 704 (FIG. 5), which will be described later, via a control valve. By supplying negative pressure, the workpiece placed on the stage 30 is sucked and held. It functions as an adsorption groove. The two types of grooves 311 and 312 are not connected on the stage, and are connected to the negative pressure supply unit 704 via independent control valves. Therefore, in addition to adsorption using both grooves, Adsorption using only grooves is also possible.

  A roller unit 34 is provided so as to straddle the stage 30 configured in this manner. Specifically, a pair of guide rails 351 and 352 extend in the Y direction along both ends in the X direction of the horizontal stage portion 31, and these guide rails 351 and 352 are fixed to the main frame 11. ing. A roller unit 34 is slidably attached to the guide rails 351 and 352.

  The roller unit 34 includes sliders 341 and 342 slidably engaged with the guide rails 351 and 352, respectively, and extends in the X direction across the upper part of the stage 30 so as to connect the sliders 341 and 342. The lower angle 343 is provided. An upper angle 345 is attached to the lower angle 343 via an appropriate lifting mechanism 344 so as to be movable up and down. A columnar peeling roller 340 extending in the X direction is attached to the upper angle 345 in a freely rotatable manner.

  When the upper angle 345 is lowered downward, that is, in the (−Z) direction by the lifting mechanism 344, the lower surface of the peeling roller 340 comes into contact with the upper surface of the work placed on the stage 30. On the other hand, in a state where the upper angle 345 is positioned upward, that is, in a position in the (+ Z) direction by the lifting mechanism 344, the peeling roller 340 is separated from the upper surface of the workpiece. A backup roller 346 for suppressing the bending of the peeling roller 340 is rotatably attached to the upper angle 345, and a rib for preventing the upper angle 345 itself from being bent is appropriately provided. The peeling roller 340 and the backup roller 346 do not have a drive source, and these rotate freely.

  The roller unit 34 is movable in the Y direction by a motor 353 attached to the main frame 11. More specifically, the lower angle 343 is connected to, for example, a ball screw mechanism 354 as a conversion mechanism that converts the rotational motion of the motor 353 into linear motion. When the motor 353 rotates, the lower angle 343 is guided to the guide rails 351, 351. The roller unit 34 moves in the Y direction by moving along the 352 in the Y direction. The movable range of the peeling roller 340 according to the movement of the roller unit 34 is as follows: (−Y) direction to the vicinity of the (−Y) side end portion of the horizontal stage portion 31, (+ Y) direction of the horizontal stage portion 31 ( The position is set to the outside of the (+ Y) side end, that is, the position further advanced to the (+ Y) side.

  Next, the configuration of the second adsorption unit 52 will be described. The first to fourth adsorption units 51 to 54 all have the same structure, and here, the structure of the second adsorption unit 52 will be described as a representative. The second suction unit 52 includes a beam member 521 that extends in the X direction and is fixed to the support frame 50. The beam member 521 has a pair of vertical downwards, that is, a (−Z) direction. The column members 522 and 523 are attached at different positions in the X direction. A plate member 524 is attached to the column members 522 and 523 via a guide rail that is hidden in the drawing so as to be lifted and lowered. The plate member 524 is lifted and lowered by a lifting mechanism 525 including a motor and a conversion mechanism (for example, a ball screw mechanism). Driven.

  A bar-shaped pad support member 526 extending in the X direction is attached to the lower portion of the plate member 524, and a plurality of suction pads 527 are arranged at equal intervals in the X direction on the lower surface of the pad support member 526. FIG. 2 shows a state where the second suction unit 52 is moved upward from the actual position. However, when the plate member 524 is moved downward by the lifting mechanism 525, the suction pad 527 is moved to the horizontal stage portion 31. It can be lowered to a position very close to the upper surface 310, and comes into contact with the upper surface of the workpiece when the workpiece is placed on the stage 30. A negative pressure from a negative pressure supply unit 704 described later is applied to each suction pad 527, and the upper surface of the workpiece is sucked and held.

  FIG. 3 is a side view showing the structure of the initial peeling unit and the positional relationship of each part. First, the structure of the initial peeling unit 33 will be described with reference to FIGS. 1 and 3. The initial peeling unit 33 has a bar-shaped pressing member 331 extending in the X direction above the taper stage portion 32, and the pressing member 331 is supported by a support arm 332. The support arm 332 is attached to the column member 334 via a guide rail 333 extending in the vertical direction, and the support arm 332 moves up and down with respect to the column member 334 by the operation of the lifting mechanism 335. The column member 334 is supported by a base portion 336 attached to the main frame 11, but the position adjustment mechanism 337 can adjust the position in the Y direction of the column member 334 on the base portion 336 within a predetermined range. .

  A workpiece WK as an object to be peeled is placed on a stage 30 constituted by the horizontal stage portion 31 and the taper stage portion 32. The workpiece in the patterning step described above is a close contact body in which a plate and a blanket are in close contact via a thin film of pattern forming material. On the other hand, the workpiece in the transfer process is a close contact body in which the substrate and the blanket are in close contact with each other through a patterned pattern. In the following, the peeling operation of the peeling apparatus 1 in the case where the contact body between the substrate SB and the blanket BL in the transfer process is the workpiece WK will be described. Can be done.

  In the work WK, it is assumed that the blanket BL has a larger planar size than the substrate SB. The substrate SB is in close contact with the substantially central portion of the blanket BL. The work WK is placed on the stage 30 with the blanket BL down and the substrate SB up. At this time, as shown in FIG. 3, the (−Y) side end portion of the substrate SB of the workpiece WK is substantially above the ridge line portion E at the boundary between the horizontal stage portion 31 and the taper stage portion 32, more specifically, the ridge line portion. The workpiece WK is placed on the stage 30 so that the position is slightly shifted to the (−Y) side from E. Accordingly, the blanket BL outside the substrate SB in the (−Y) direction is disposed so as to protrude onto the taper stage portion 32, and a gap is generated between the lower surface of the blanket BL and the upper surface 320 of the taper stage portion 32. . An angle θ formed by the lower surface of the blanket BL and the upper surface 320 of the taper stage portion 32 is about the same number of degrees (2 degrees in this embodiment) as the taper angle of the taper stage portion 32.

  The horizontal stage portion 31 is provided with suction grooves 311 and 312 to hold the lower surface of the blanket BL by suction. Among them, the suction groove 311 sucks the lower surface of the blanket BL that hits the lower part of the substrate SB, while the suction groove 312 sucks the lower surface of the blanket BL outside the substrate SB. The suction grooves 311 and 312 can independently turn on and off the suction, and the two types of suction grooves 311 and 312 can be used together to strongly suck the blanket BL. On the other hand, by performing suction using only the outer suction groove 312 and not performing suction on the central portion of the blanket BL where the pattern is effectively formed, a pattern resulting from the deflection of the blanket BL due to suction. Can prevent damage. As described above, by independently controlling the negative pressure supply to the suction groove 311 at the center and the suction groove 312 at the peripheral edge, it is possible to switch the suction holding mode of the blanket BL according to the purpose. Yes.

  Thus, the first to fourth suction units 51 to 54 and the peeling roller 340 of the roller unit 34 are arranged above the work WK sucked and held on the stage 30. As described above, the plurality of suction pads 527 are arranged below the second suction unit 52 in the X direction. More specifically, the suction pad 527 is integrally formed of a material having flexibility and elasticity, such as rubber or silicon resin, and the lower surface thereof contacts the upper surface of the work WK (more specifically, the upper surface of the substrate SB). It has an adsorbing portion 527a that contacts and adsorbs it, and a bellows portion 527b that has elasticity in the vertical direction (Z direction). The suction pads provided in the other suction units 51, 53 and 54 have the same structure, but in the following, the suction pads provided in these suction units 51, 53 and 54 will be denoted by reference numerals 517, 537 and 547, respectively. To distinguish each other.

  The first suction unit 51 is provided above the (−Y) side end of the horizontal stage portion 31 and sucks the upper surface of the (−Y) side end of the substrate SB when it is lowered. On the other hand, the fourth suction unit 54 is provided above the (+ Y) side end of the substrate SB placed on the stage 30 and sucks the upper surface of the (+ Y) side end of the substrate SB when lowered. The second suction unit 52 and the third suction unit 53 are appropriately distributed between them, and for example, the suction pads 517 to 547 can be arranged at substantially equal intervals in the Y direction. Between these adsorption units 51 to 54, movement in the vertical direction and on / off of adsorption can be performed independently of each other.

  The peeling roller 340 moves in the vertical direction to move toward and away from the substrate SB, and moves in the Y direction to move horizontally along the substrate SB. In the state where the peeling roller 340 is lowered, it moves horizontally while abutting on the upper surface of the substrate SB and rolling. The position of the peeling roller 340 when moved to the most (−Y) side is a position closest to the (+ Y) side of the suction pad 517 of the first suction unit 51. In order to enable the arrangement in such a proximity position, the first suction unit 51 has the same structure as the second suction unit 52 shown in FIG. The fourth suction units 52 to 54 are attached to the support frame 50 in the opposite direction.

  The initial peeling unit 33 has its Y-direction position adjusted so that the pressing member 331 is positioned above the blanket BL protruding above the taper stage portion 32. Then, when the support arm 332 is lowered, the lower end of the pressing member 331 is lowered and presses the upper surface of the blanket BL. At this time, the tip of the pressing member 331 is formed of an elastic member so that the pressing member 331 does not damage the blanket BL.

  FIG. 4 is a diagram showing the positional relationship between the stage and the workpiece placed on the stage. In the work WK in which the substrate SB and the blanket BL are in close contact, the blanket BL has a larger planar size than the substrate SB. Therefore, the entire surface of the substrate SB faces the blanket BL, while the blanket BL has a central portion facing the substrate SB, but the peripheral portion is a blank portion that does not face the substrate SB. Yes. An effective area AR that functions as a device by effectively transferring the pattern is set in the central portion of the surface area of the substrate SB except the peripheral edge. Therefore, the purpose of the peeling apparatus 1 is to peel the substrate SB and the blanket BL without damaging the pattern transferred from the blanket BL to the effective area AR of the substrate SB.

  The workpiece WK is placed on the stage 30 so that the entire effective area AR of the substrate SB is positioned on the upper surface 310 of the horizontal stage unit 31. On the other hand, on the outer side of the effective area AR, the (−Y) side end of the substrate SB protrudes slightly to the (−Y) side from the ridgeline E at the boundary between the horizontal stage portion 31 and the taper stage portion 32. Is positioned.

  In the figure, a region R1 with dots indicates a region where the blanket BL is adsorbed by the adsorption groove 311. The region R1 sucked by the suction groove 311 covers the entire effective region AR. A region R2 indicates a region where the blanket BL is sucked by the suction groove 312. The suction groove 312 sucks the blanket BL outside the effective area AR. Therefore, for example, in the aspect in which the blanket BL is sucked only by the suction groove 312, it is avoided that the pattern in the effective area AR is affected by the suction. The other regions R3, R4 and R5 shown in FIG. 4 will be described later when the operation is described.

  FIG. 5 is a block diagram showing the electrical configuration of the peeling apparatus. Each part of the apparatus is controlled by a control unit 70. The control unit 70 supplies the CPU 701 that controls the operation of the entire apparatus, a motor control unit 702 that controls motors provided in each unit, a valve control unit 703 that controls valves provided in each unit, and each unit. A negative pressure supply unit 704 that generates a negative pressure and a user interface (UI) unit 705 for accepting an operation input from the user and notifying the user of the state of the apparatus are provided. In addition, when the negative pressure supplied from the outside, such as factory power, can be used, the control unit 70 may not include the negative pressure supply unit.

  The motor control unit 702 drives and controls a motor group such as a motor 353 and elevating mechanisms 335 and 344 provided in the stage block 3 and an elevating mechanism 525 provided in each adsorption unit 51 to 54 of the upper adsorption block 5. The valve control unit 703 is provided on a piping path connected to the suction grooves 311 and 312 provided in the horizontal stage unit 31 from the negative pressure supply unit 704, and individually supplies a predetermined negative pressure to these suction grooves. The valve group V3 and the valve group V5 for supplying a predetermined negative pressure to the suction pads 517 to 547, which are provided on the piping path connected from the negative pressure supply unit 704 to the suction pads 517 to 547, are controlled.

  Next, the peeling operation by the peeling apparatus 1 configured as described above will be described with reference to FIGS. FIG. 6 is a flowchart showing the peeling process. FIG. 7 and FIG. 8 are diagrams showing the positional relationship of each part at each stage during processing, and schematically show the progress of processing. This peeling process is performed by the CPU 701 executing a processing program stored in advance to control each unit.

  First, when the workpiece WK is loaded at the above position on the stage 30 by an operator or an external transfer robot (step S101), the apparatus is initialized and each part of the apparatus is set to a predetermined initial state (step S102). . In the initial state, the work WK is sucked and held by one or both of the suction grooves 311 and 312, and the suction member 331 of the initial peeling unit 33, the peeling roller 340 of the roller unit 34, and the first to fourth suction units 51 to 54 are sucked. All of the pads 517 to 547 are separated from the work WK. Further, the peeling roller 340 is at a position closest to the (−Y) side in the movable range.

  From this state, the first suction unit 51 and the peeling roller 340 are lowered and brought into contact with the upper surface of the workpiece WK (step S103). At this time, as shown in FIG. 7A, the suction pad 517 of the first suction unit 51 sucks the upper surface of the (−Y) side end of the substrate SB, and the peeling roller 340 is positioned adjacent to the (+ Y) side. In contact with the upper surface of the substrate SB. In FIG. 7A, the downward arrow attached in the vicinity of the pressing member 331 means that the pressing member 331 moves in the direction of the arrow in the subsequent process from the state shown in the drawing. The same applies to the following drawings.

  A region R3 shown in FIG. 4 indicates a region where the substrate SB is sucked by the first suction unit 51 at this time, and a region R4 indicates a region where the peeling roller 340 contacts the substrate SB. As shown in FIG. 4, the first suction unit 51 sucks and holds the (−Y) side end of the substrate SB, while the peeling roller 340 is adjacent to the (+ Y) side of the suction region R <b> 3 by the first suction unit 51. It contacts the substrate SB in the region R4. The contact area R4 with which the peeling roller 340 comes into contact is outside the effective area AR, that is, at a position closer to the (−Y) side from the effective area AR. Therefore, the inside of the effective area AR is not subjected to either the suction by the first suction unit 51 or the pressing by the peeling roller 340.

  Returning to FIG. 6, next, the initial peeling unit 33 is operated, the pressing member 331 is lowered, and the end of the blanket BL is pressed (step S104). The end of the blanket BL protrudes above the taper stage 32, and there is a gap between its lower surface and the upper surface 320 of the taper stage 32. Therefore, as shown in FIG. 7B, the pressing member 331 presses the end of the blanket BL downward, so that the end of the blanket BL bends downward along the tapered surface of the taper stage portion 32. As a result, the end of the substrate SB sucked and held by the first suction unit 51 and the blanket BL are separated from each other and peeling is started. The pressing member 331 is formed in a rod shape extending in the X direction, and the length in the X direction is set longer than that of the blanket BL. Therefore, as shown in FIG. 4, the contact region R5 where the pressing member 331 contacts the blanket BL extends linearly from the (−X) side end of the blanket BL to the (+ X) side end. By doing so, the blanket BL can be bent into a columnar shape, and the boundary line between the peeling region where the substrate SB and the blanket BL have already peeled and the unpeeled region that has not yet peeled (hereinafter referred to as “peeling boundary” Line)) can be made straight.

  From this state, the first suction unit 51 starts to rise, and in synchronization with this, the peeling roller 340 is moved in the (+ Y) direction (step S105). Specifically, the movement of the peeling roller 340 is started at the timing when the peeling boundary line that moves in the (+ Y) direction reaches the position immediately below the peeling roller 340 due to the rising of the first suction unit 51. As a result, the contact region R4 shown in FIG. 4 moves in the (+ Y) direction. Thereafter, the first suction unit 51 moves upward, that is, in the (+ Z) direction, and the peeling roller 340 moves at a constant speed in the (+ Y) direction.

  As shown in FIG. 7C, when the first suction unit 51 that holds the end of the substrate SB is raised, the substrate SB is pulled up, and the separation from the blanket BL proceeds in the (+ Y) direction. Since the peeling roller 340 is in contact, the peeling does not proceed beyond the contact region R4 (FIG. 4) by the peeling roller 340. By moving the peeling roller 340 in the (+ Y) direction at a constant speed while being in contact with the substrate SB, the progressing speed of the peeling can be kept constant. That is, the separation boundary line is a straight line along the roller extending direction, that is, the X direction, and further proceeds in the (+ Y) direction at a constant speed. Thereby, the damage of the pattern resulting from the stress concentration by the fluctuation | variation of the advancing speed of peeling can be prevented reliably.

  Subsequently, the value of the internal control parameter N for the following processing is set to 2 (step S106). Then, the process waits for the peeling roller 340 to pass through the Nth suction position (step S107). The Nth suction position is a position directly below the Nth suction unit (N = 1 to 4) on the upper surface of the substrate SB, and is a position where the Nth suction unit receives the suction.

  Since N = 2 here, the process waits until the peeling roller 340 passes through the second suction position, that is, the position immediately below the second suction unit 52. When peeling roller 340 passes through the second suction position (YES in step S107), lowering of second suction unit 52 is started, and substrate SB is captured by suction pad 527 of second suction unit 52 (step S108).

  As shown in FIG. 7D, since the peeling roller 340 has already passed, the substrate SB is peeled from the blanket BL and lifted upward at a position directly below the second suction unit 52. By approaching the substrate SB while applying a negative pressure to the suction pad 527 made of an elastic member having elasticity, the substrate SB is captured when the lower surface of the suction pad 527 comes into contact with the upper surface of the substrate SB. Can be adsorbed. After the suction pad 527 is lowered to a predetermined position, the substrate SB pulled up may be waited. In any case, it is possible to prevent suction failure by providing the suction pad with flexibility.

  After the suction of the substrate SB is started, the movement of the second suction unit 52 is turned up (step S109). As a result, as shown in FIG. 8A, the peeling progress speed is still controlled by the peeling roller 340, and the main body for lifting the substrate SB for peeling is changed from the first suction unit 51 to the second suction unit 52. Taken over. Further, the substrate SB after separation is switched from holding by only the first suction unit 51 to holding by the first suction unit 51 and the second suction unit 52, and the number of holding points increases. In addition, when each adsorption | suction unit 51-54 raises, the relative position in the Z direction between each adsorption | suction unit 51-54 is maintained so that the attitude | position of the board | substrate SB after peeling becomes a substantially plane.

  Subsequently, 1 is added to the value of the control parameter N (step S111), and the process is a loop process that returns to step S107 until the parameter N becomes 4. Therefore, in the next loop, when the peeling roller 340 passes the third suction position immediately below the third suction unit 53, the lowering of the third suction unit 53 starts, and as shown in FIG. The main body for lifting the substrate SB moves from the second suction unit 52 to the third suction unit 53. Further, in the next loop, after the peeling roller 340 passes through the fourth suction position, the fourth suction unit 54 descends and pulls up the substrate SB. By changing the upper limit value of N in step S110, it is possible to cope with a case where the number of suction units is different from the above.

  Thus, by pulling up the substrate SB by the fourth suction unit 54, the entire substrate SB is pulled away from the blanket BL as shown in FIG. 8C. Therefore, after raising the fourth suction unit 54 (YES in step S110), the peeling roller 340 is moved to the (+ Y) side from the stage 30 to stop the movement (step S112). And as shown in FIG.8 (d), after raising all the adsorption | suction units 51-54 to the same height, it stops (step S113). Further, the pressing member 331 of the initial peeling unit 33 is separated from the blanket BL and moved to a retracted position above the upper surface of the blanket BL and at the (−Y) side end of the (−Y) side end of the blanket BL (step S114). ). Thereafter, the suction holding of the blanket BL by the suction groove is released, and the separated substrate SB and the blanket BL are carried out of the apparatus (step S115), thereby completing the peeling process.

  The suction units 51 to 54 have the same height by holding the substrate SB after separation and the blanket BL in parallel so that the hand for dispensing hand inserted by an external robot or operator can be accessed. This is to facilitate the delivery of the blanket BL and the substrate SB.

  As described above, in this embodiment, the peeling roller 340 extending in the X direction perpendicular to the peeling progress direction (Y direction here) is brought into contact with the substrate SB, and the peeling roller 340 is moved in the peeling progress direction. By pulling up the substrate SB while being moved at a constant speed, the separation speed can be kept constant and the substrate SB and the blanket BL can be favorably separated. At this time, the following advantages are obtained in the peeling process of the present embodiment.

  FIG. 9 is a diagram for explaining the advantage of the peeling process in the present embodiment. In the present embodiment, the main body that pulls up the substrate SB is sequentially transferred to the suction unit on the downstream side in the peeling progress direction. For this reason, from the initial stage to the final stage of peeling, the curvature of the substrate SB just below the peeling roller 340 changes within a certain range. Therefore, as shown in FIG. 9A, the angle α formed by the already peeled portion of the substrate SB and the blanket BL is within a certain range. For this reason, the force (peeling force) that separates the substrate SB and the blanket BL at the boundary between the peeled portion and the unpeeled portion, that is, the peeling boundary line immediately below the peeling roller 340, is generally constant. Therefore, peeling can be favorably progressed without damaging the pattern.

  On the other hand, considering a comparative example in which only one end portion of the substrate SB is held and pulled up, as shown in FIG. 9, depending on the rigidity and mass of the substrate SB, the substrate SB bends due to its own weight as the peeling progresses. The amount increases, and the pulling up of the substrate SB is absorbed by the bending, and the progress of the peeling is slowed down. That is, the angle β formed between the substrate SB and the blanket BL in the vicinity of the peeling boundary line is gradually reduced, and the peeling force generated between the two is reduced, so that the peeling progress is delayed.

  In a more severe case, there arises a problem that the adsorption force by the adsorption unit cannot support the mass of the substrate SB and the substrate SB falls, or the substrate SB cannot withstand bending and is broken or bent. In addition, the amount of pulling up the substrate SB required to separate the entire substrate SB from the blanket BL increases, and this leads to an increase in the size of the apparatus configuration for enabling this. In particular, as the size of the substrate SB increases, the mass of the substrate SB increases, and these problems become more prominent.

  On the other hand, in this embodiment, the holding position of the substrate SB is sequentially increased as the peeling progresses, whereby the holding of the substrate SB is ensured and the posture of the substrate SB after peeling can be easily maintained. Become. And since peeling can be advanced, giving the stable peeling force as mentioned above, damage to a pattern is also prevented. Further, by arranging the suction unit according to the size of the substrate SB, it is possible to flexibly cope with the increase in the size of the substrate SB.

  Further, in this embodiment, as shown in FIG. 4, the region R3 on which the substrate SB is adsorbed by the first adsorption unit 51 responsible for pulling up the substrate SB in the initial stage of peeling is an effective region on which an effective pattern is formed. Outside the AR. When the substrate SB is locally adsorbed, the substrate SB is partially peeled off from the blanket BL at that portion, which may cause an effect such as deformation or damage of the pattern. By adsorbing, such a problem is avoided. Further, the peeling speed becomes unstable until the peeling boundary line reaches the position immediately below the peeling roller 340. Similarly, the peeling speed can be reduced by setting the contact area R4 of the peeling roller 340 in the initial stage outside the effective area. Damage to the pattern due to fluctuations in the pattern is also prevented.

  On the other hand, the second to fourth adsorption units 52 to 54 that newly adsorb the substrate SB during the peeling are in contact with the substrate SB in the area already peeled off from the blanket BL. Will not damage the printed pattern.

  As described above, in this embodiment, the blanket BL corresponds to the “first plate-like body” of the present invention and the substrate SB of the present invention is the “second plate-shaped body” of the workpiece WK as the separation target. Is equivalent to. The (−Y) side end of the substrate SB corresponds to “one end” of the present invention, and the (+ Y) side end opposite to this corresponds to the “other end” of the present invention. The (+ Y) direction corresponds to the “peeling progress direction” of the present invention.

  In this embodiment, the stage 30 functions as the “holding means” of the present invention, and the upper surface 310 of the horizontal stage portion 31 functions as the “holding surface” of the present invention. In this embodiment, the first suction unit 51 functions as the “first peeling unit” of the present invention, while the second to fourth suction units 52 to 54 function as the “second peeling unit” of the present invention. doing. The suction pads 527 and the like correspond to the “contact portion” of the present invention. Further, the peeling roller 340 functions as the “contact means” in the present invention, and the position of the contact region R4 in FIG. 4 corresponds to the “contact start position” in the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above embodiment, the lattice-shaped suction grooves 311 and 312 are provided on the stage 30 to suck and hold the blanket BL. However, the shape of the suction groove is not limited to this. For example, an annular suction groove may be provided, or a blanket may be sucked by appropriately arranging suction holes to which negative pressure is supplied.

  Moreover, in the said embodiment, although the raise of each adsorption | suction unit 51-54 is controlled so that the attitude | position of the board | substrate SB after peeling is maintained in the state close | similar to a plane, the stress added to the board | substrate SB is reduced. The manner of pulling up is not limited to this. For example, each suction unit may be stopped at a certain height so that the substrate after peeling is substantially horizontal, or may be held in such a posture that the substrate is curved with a predetermined curvature. These can be freely set by controlling the rising mode of each adsorption unit.

  In the embodiment described above, four suction units are arranged on the substrate SB and sequentially suck the substrates SB. However, the number of suction units is not limited to this and is arbitrary. If the substrate is large, the number of suction units may be increased, and if the substrate is small, it may be decreased. The configuration having the first peeling means for holding the substrate at the initial stage of peeling and at least one second peeling means for holding the substrate after peeling on the downstream side in the peeling progress direction is a technique of the present invention. Included in the category of thought.

  Moreover, although the board | substrate and the blanket are hold | maintained by vacuum suction in the said embodiment, the aspect of holding | maintenance is not limited to this. For example, it may be attracted and held by electrostatic or magnetic attracting force. In particular, the first peeling means for holding the outside of the effective area of the substrate may be held by mechanically gripping the peripheral edge of the substrate without being attracted.

  Further, in the above embodiment, the blanket BL is protruded and held on the taper stage portion 32, and the blanket BL is bent by the pressing member 331 to create a trigger for peeling. However, this is not an essential requirement. For example, the peeling may be started only by pulling up the first suction unit. In this case, it is not necessary to provide a taper on the stage.

  The present invention can be applied to a peeling process in a pattern forming process in which two plates are brought into close contact with each other to transfer a pattern or the like. This can be suitably applied to various purposes for satisfactorily peeling the plate-like body.

1 Peeling device 30 Stage (holding means)
31 Horizontal stage (holding means)
32 Tapered stage (holding means)
51 1st adsorption | suction unit (1st peeling means)
52-54 2nd thru | or 4th adsorption | suction unit (2nd peeling means)
310 Upper surface (holding surface) of the horizontal stage unit 31
340 Peeling roller (contact means)
517 Suction pad 527, 537, 547 Suction pad (contact part)
BL blanket (first plate)
R4 Contact start position SB substrate (second plate)

Claims (13)

In the peeling apparatus for peeling the first plate and the second plate that are in close contact with each other through a thin film or pattern,
The first plate-like body has a holding surface larger than the plane size of the effective area where the thin film or pattern is formed, and the second plate-like body among the surfaces of the first plate-like body is provided on the holding surface. Holding means for holding the first plate-like body by contacting a surface opposite to the surface in close contact with,
A first peeling means that moves in a direction away from the holding means while holding one end portion of the second plate-like body, and peels the one end portion of the second plate-like body from the first plate-like body; ,
It is formed in a roller shape extending along the second plate-like body in a direction perpendicular to the peeling progress direction from the one end portion of the second plate-like body to the other end portion on the opposite side to the one end portion, At the contact start position adjacent to the downstream side of the one end portion in the peeling progress direction, the first plate-like body is in contact with one surface of the second plate-like body on the opposite side of the surface, and A contact means that moves in the peeling progress direction from the contact start position toward the other end while contacting the second plate-like body;
Provided facing the one surface of the second plate-like body on the downstream side of the contact start position in the peeling direction, and partially on the one surface of the second plate-like body after the contact means has passed And a second peeling means that moves in a direction away from the holding means while holding the second plate-like body in contact with each other.   The peeling apparatus according to claim 1, wherein the plurality of second peeling means are arranged along the peeling progress direction, and the plurality of second peeling means move toward and away from the holding means independently of each other.   3. The peeling apparatus according to claim 1, wherein the first peeling unit holds the second plate-like body outside an effective region where the thin film or pattern is formed in the second plate-like body.   The peeling apparatus according to any one of claims 1 to 3, wherein the first peeling means and the second peeling means are in contact with the one surface of the second plate-like body to suck and hold the second plate-like body. .   The contact part which contact | abuts to the said 2nd plate-shaped body among the said 2nd peeling means is formed of the elastic member which can be expanded-contracted in the direction which approaches / separates with respect to a said 2nd plate-shaped body. Peeling device.   Each of the said 1st peeling means and the said 2nd peeling means has a some suction pad arranged in the direction orthogonal to the said peeling advancing direction, and contact | abuts to the said 2nd plate-shaped body. Peeling device.   The peeling apparatus according to any one of claims 4 to 6, wherein an adsorption hole or an adsorption groove for adsorbing the first plate-like body by applying a negative pressure is provided on the holding surface of the holding means. In the peeling method of peeling the first plate and the second plate that are in close contact with each other through a thin film or pattern,
The surface of the first plate is opposite to the surface of the first plate that is in close contact with the second plate on the holding surface that is larger than the plane size of the effective area on which the thin film or pattern is formed. Holding the first plate-like body by contacting the side surface;
At the contact start position adjacent to the downstream side of the one end in the peeling progress direction from one end of the second plate to the other end opposite to the one end, the second plate contacts the first plate Contacting one surface of the second plate-like body opposite to the surface with roller-shaped contact means extending in a direction perpendicular to the peeling progress direction;
The one end of the second plate is moved away from the first plate to separate the one end of the second plate from the first plate, and the contact Moving the means in the peeling progress direction from the contact start position toward the other end while contacting the second plate-like body;
While moving the contact means, on the downstream side of the contact start position in the peeling direction, the one of the second plate-like bodies after the contact means passes and peels from the first plate-like body. And a step of moving in a direction away from the first plate-like body while partially holding the direction.   A separation boundary line that is a boundary line between an unpeeled region where the first plate-like body and the second plate-like body are in close contact with each other and a separation region where the first plate-like body and the second plate-like body are separated. The peeling method according to claim 8, wherein when the first contact point reaches the contact start position, movement of the contact unit is started and the contact unit is moved at a constant speed.   The peeling method according to claim 8 or 9, wherein a holding portion for holding the one surface of the second plate-like body is sequentially added in the peeling progress direction as the contact means moves in the peeling progress direction. .   While maintaining the curvature of the second plate-like body at the contact point with the contact means within a predetermined range, the movement of the contact means in the peeling progress direction and the first plate of the second plate-like body. The peeling method according to claim 8, wherein the peeling is performed in a direction away from the shaped body.   The peeling method according to any one of claims 8 to 11, wherein the posture of the second plate-like body is held substantially flat on the upstream side of the contact portion with the contact means in the peeling progress direction.   The second plate-like body is held in parallel to the first plate-like body after the entire second plate-like body has been peeled off from the first plate-like body. Peeling method.

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