JP6393596B2 - Alignment apparatus and alignment method - Google Patents

Alignment apparatus and alignment method Download PDF

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Publication number
JP6393596B2
JP6393596B2 JP2014234891A JP2014234891A JP6393596B2 JP 6393596 B2 JP6393596 B2 JP 6393596B2 JP 2014234891 A JP2014234891 A JP 2014234891A JP 2014234891 A JP2014234891 A JP 2014234891A JP 6393596 B2 JP6393596 B2 JP 6393596B2
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support
alignment
partition
chip
adhesive sheet
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JP2016100413A (en
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利彰 毛受
利彰 毛受
岡本 直也
直也 岡本
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リンテック株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Description

  The present invention relates to an alignment apparatus and an alignment method.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) is cut into a predetermined shape and a predetermined size and separated into a plurality of semiconductor chips (hereinafter sometimes simply referred to as chips). It has been practiced that the chips are separated from each other and the distance between the chips is increased before being mounted on a mounted object such as a lead frame or a substrate.

  As a separation method for widening the distance between chips (pieces), a frame support means (support means) for supporting a wafer (plate-like member) integrated with the frame via a film (adhesive sheet), and a film surface It is known to move the support mechanism (separation table) relative to each other (for example, see Patent Document 1). In such a method of widening the distance between chips, for example, tension in four directions of + X axis direction, -X axis direction, + Y axis direction, and -Y axis direction is applied to the adhesive sheet. When the detection means detects that the predetermined position has been reached, the operation for increasing the interval is completed.

JP 2012-204747 A

  However, in the conventional method as described in Patent Document 1, in addition to the above four directions, the adhesive sheet has a composite direction thereof, that is, a composite direction of + X axis direction and + Y axis direction, + X axis direction and −Y. Tension is also applied to the combined direction of the axial direction, the combined direction of the −X axis direction and the + Y axis direction, and the combined direction of the −X axis direction and the −Y axis direction. As a result, there is a difference between the inner chip interval and the outer chip interval. However, since such a difference in distance is extremely small, each chip is assumed to have an evenly expanded distance, and is transported based on a position derived by calculation (hereinafter sometimes referred to as a theoretical position). The product is transported by a transporting means such as a device or a pick-up device, and mounted on an object to be mounted to form a product. As a result, the relative positional relationship between the chip and the mounted object in the product may be slightly shifted, the connection position of wire bonding may be shifted, or the positions of the terminals of the chip and the mounted object may be shifted. As a result, they cannot be connected to each other, and the yield of the product is lowered. Such a problem can occur not only in the manufacture of semiconductor devices but also in, for example, dense mechanical parts and fine decorative items.

  An object of the present invention is to provide an alignment apparatus and an alignment method capable of accurately widening the interval between the pieces.

The alignment apparatus according to the present invention is a partition member having a support unit capable of supporting a plurality of pieces on a support surface, and a lattice portion formed in a lattice shape between the plurality of pieces supported on the support surface. Partitioning means that can be inserted , and at least the support surface is inclined while the lattice portion is inserted between the plurality of pieces supported by the support surface, and each piece is predetermined on the support surface. Alignment means for aligning at a predetermined orientation at the position of

In the alignment apparatus of the present invention, it is preferable that the alignment apparatus includes a movement promoting unit that promotes movement of the plurality of pieces.
In the alignment apparatus according to the aspect of the invention, it is preferable that the plurality of pieces are attached to an adhesive sheet and include transfer means capable of transferring the plurality of pieces from the adhesive sheet to the support surface.

The alignment method of the present invention includes a step of supporting a plurality of pieces on a support surface, and inserting a partition member having a lattice portion formed in a lattice shape between the plurality of pieces supported on the support surface. And tilting at least the support surface while inserting the lattice portion between the plurality of pieces supported by the support surface, and each piece is predetermined at a predetermined position on the support surface. And a step of aligning in a direction.

  According to the present invention, a partition member can be inserted between a plurality of pieces, and at least one of the support surface and the partition member can be inclined to align the pieces, so that tension is applied like an adhesive sheet. In addition to the applied direction, no tension is applied in the synthesis direction thereof, so that the interval between the pieces can be accurately widened.

Moreover, if a movement promotion means is provided, it becomes easy to guide the piece-like body to a predetermined position of the partition member.
Furthermore, if a transfer means is provided, a plurality of pieces can be transferred from the adhesive sheet to the support surface, so that the interval between the pieces can be increased accurately.

The side view of the alignment apparatus which concerns on 1st Embodiment of this invention. Operation | movement explanatory drawing of the alignment apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in each embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis and “down” being the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

  In FIG. 1, the alignment apparatus 10 can insert a partition member 35 between a support means 20 capable of supporting a plurality of chips CP as a piece on a support surface 21A and a plurality of chips CP supported on the support surface 21A. The partitioning means 30, the alignment means 40 for inclining both the support surface 21A and the partitioning member 35 to align the chips CP at predetermined positions on the support surface 21A, and the movement of the plurality of chips CP. A movement promoting means 50 for promoting, a transfer means 60 capable of transferring a plurality of chips CP from the adhesive sheet AS to the support surface 21A, and a detecting means (not shown) such as an optical sensor and an imaging means capable of recognizing the position of each chip CP; It has. Note that the chip CP is formed by cutting the wafer WF into a lattice shape, and is formed as an integrated object WK in a state of being attached to the adhesive sheet AS.

  The support means 20 has a support surface 21A capable of adsorbing and holding each chip CP by a plurality of suction holes (not shown) by a pressure reduction means (not shown) such as a pressure reduction pump or a vacuum ejector, and includes a table 21 having a quadrangular shape when viewed from above. .

  The partition means 30 includes a linear motor 32 as a driving device supported by a portal frame 31 rising from the front and rear surfaces of the table 21, a linear motor 33 as a driving device supported by a slider 32A of the linear motor 32, and a linear A linear motion motor 34 as a drive device supported by a slider 33A of the motor 33 and a partition member 35 supported by an output shaft 34A of the linear motion motor 34 are provided. The partition member 35 includes a base plate 35A and a lattice portion 35C formed in a lattice shape on the lower surface 35B of the base plate 35A, and is provided so that the lattice portion 35C can be inserted between all the chips CP at a time. The lower end portion of the lattice portion 35C has a tapered shape and is easily inserted between the chips CP.

  The aligning means 40 is supported by four linear motion motors 41 as drive devices arranged below the four corners of the table 21 and output shafts 41A of the respective linear motion motors 41. For example, the alignment means 40 includes an X axis and a Y axis. A ball joint 42 that supports the table 21 is provided so that the support surface 21A can be inclined with respect to a predetermined plane to be formed.

  The movement promoting means 50 includes an ultrasonic vibration device provided inside the table 21.

  The transfer unit 60 is supported by a linear motor 61 as a driving device, a linear motion motor 62 as a driving device supported by a slider 61A of the linear motor 61 via a bracket 61B, and an output shaft 62A of the linear motion motor 62. , A suction pad 63 capable of sucking and supporting the adhesive sheet AS by a decompression means (not shown) such as a decompression pump or a vacuum ejector, a linear motor 64 as a drive device, and a direct drive device supported by a slider 64A of the linear motor 64. The moving motor 65 and the peeling plate 66 supported by the output shaft 65A of the direct acting motor 65 are provided.

A procedure for aligning the chips CP in the above aligning apparatus 10 will be described.
First, with respect to the alignment apparatus 10 in the state shown in FIG. 1 in which the respective members are arranged at the initial positions, a conveying means (not shown) such as an operator or a belt conveyer supports the integrated object WK with the adhesive sheet AS on the support surface 21A. The support means 20 drives a decompression means (not shown) to hold the integrated object WK by suction from the chip CP side.

  Next, the transfer means 60 drives the linear motors 61 and 64 and the linear motion motors 62 and 65 to move the suction pad 63 and the peeling plate 66 to the positions indicated by the solid lines in FIG. Then, the transfer unit 60 drives a decompression unit (not shown), and the suction pad 63 sucks and holds the right end portion of the adhesive sheet AS. Next, after the transfer means 60 drives the linear motors 61 and 64 and the linear motion motor 62 to raise the suction pad 63, the suction pad 63 and the peeling plate as shown by a two-dot chain line in FIG. 66 is moved to the left. Thereby, the adhesive sheet AS is peeled from the chip CP, and the chip CP is transferred to the support surface 21A. When the adhesive sheet AS is peeled from the chip CP, the transfer unit 60 stops driving the decompression unit (not shown), and the adhesive sheet AS is placed in a sheet collection unit (not shown) such as a box or a bag located below the suction pad 63. The AS is dropped and stored. Thereafter, the transfer unit 60 drives the linear motors 61 and 64 and the linear motion motors 62 and 65 to return the suction pad 63 and the peeling plate 66 to the initial positions.

  Next, after the support unit 20 stops driving the decompression unit (not shown), the partition unit 30 drives the linear motors 32 and 33 and the linear motor 34 based on the detection result of the detection unit (not shown). As shown in B), the lattice portions 35C are inserted between the plurality of chips CP. At this time, as shown in FIG. 2C, the front and back, the position in the left-right direction, and the orientation of some chips CP with respect to the lattice portion 35C may be scattered. Therefore, the alignment means 40 drives each linear motion motor 41, and as shown in FIG. 2 (D), one corner in the square space in plan view surrounded by the lattice portion 35C is the most relative to the other three corners. The table 21 is tilted so as to be at a low position (for example, tilted so that the corner indicated by the number 21B in the table 21 is the lowest position with respect to the other three corners). Thereby, the chip CP is moved by gravity, and as shown in FIG. 2E, one corner in the chip CP (a corner located on the numbering 21B side of the table 21) is one corner in the lattice portion 35C ( The corners of the table 21 are positioned at the number 21B side), and the chips CP are aligned at predetermined positions on the support surface 21A in a predetermined direction with a predetermined interval. At this time, the movement promoting means 50 may drive the ultrasonic vibration device so that one corner of each chip CP is easily driven to one corner of the lattice portion 35C. Further, the partition means 30 drives the linear motors 32 and 33 so that the chips CP aligned by the partition member 35 are arranged at predetermined positions on the support surface 21A, and moves the partition member 35 along the support surface 21A. Then, each chip CP may be moved.

  Next, the support means 20 drives a decompression means (not shown) to hold each chip CP by suction with the support surface 21A. Next, after the alignment means 40 drives the linear motion motors 41 and returns the table 21 to the initial position, the partitioning means 30 drives the linear motors 32 and 33 and the linear motion motor 34, and the partition member 35 is moved to the initial position. Return to. Then, after the support means 20 stops driving the decompression means (not shown), the worker or the transport means (not shown) mounts each chip CP on the mounted object. When all the chips CP are mounted on the mounted object, the same operation is repeated thereafter. In addition, after returning the partition member 35 to the initial position, a sheet sticking means for sticking an adhesive sheet (not shown) is provided on each chip CP, or a stacking means for laminating a resin (not shown) is provided on each chip CP. May be.

  According to the embodiment as described above, the lattice-shaped partition member 35 can be inserted between the plurality of chips CP, and both the support surface 21A and the partition member 35 can be inclined to align the chips CP. In addition to the direction in which the tension is applied as in the adhesive sheet AS, no tension is applied in the synthesis direction thereof, so that the interval between the chips CP can be accurately widened.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the support means 20 may be configured to hold the chip CP by a chuck means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, a magnetic force, or the like, or may not be configured to hold the chip CP.
The support means 20 is formed with a wafer WF on which a fragile layer is formed so as to be separated into a plurality of chips CP by laser light or the like, or a groove (a groove that does not penetrate vertically) that can be separated into a plurality of chips CP. The processed wafer WF may be supported. In this case, the partition member may include a cutting blade capable of cutting the wafer WF.
The support unit 20 may support the chips CP separated by cutting the wafer WF in an arbitrary direction such as 1 degree, 30 degrees, 45 degrees, and 60 degrees.
In order to make the lattice portion 35C inserted between the chips CP cheaper, the support means 20 is provided with an integrated member WK in which the adhesive sheet AS is stretched (expanded) by the expanding device (not shown) and the spaces between the chips CP are expanded. You may support.
The support means 20 may have a lattice portion formed on the support surface 21A.

Instead of the partition member 35, a net-like member in which linear members are arranged in a lattice shape may be employed.
The partition member 35 may be a single grating portion 35C that does not have the base plate 35A.
The lower end portion of the lattice portion 35C may not be formed in a tapered shape.
The lattice portion 35C may not have to surround the entire chip CP, and may have a configuration having one corner corresponding to the corner of one chip CP. In such a case, the alignment unit 40 may have one corner of the chip CP. The table 21 may be inclined so as to be driven to one corner of the lattice portion 35C corresponding to the one corner.

The alignment means 40 may tilt the table 21 without tilting the partitioning means 30.
The alignment means 40 may incline the partition means 30 without inclining the table 21. In this case, the support means 20 and the partition means 30 of the alignment apparatus 10 shown in FIG. 1 are arranged upside down or the support means 20 and the partition means 30 are provided with reversing means for turning upside down. Thus, a configuration in which the chips CP are aligned on the partition member 35 may be adopted.
The aligning means 40 may incline the table 21 so that any one of the other three corners other than the corner indicated by the number 21B in the table 21 is at the lowest position. The table 21 may be tilted so as to be driven to one corner of the lattice portion 35C.
The alignment means 40 only needs to be able to tilt the table 21, and the linear motion motor 41 may be three or less, or five or more.

The movement promoting means 50 may be composed of an eccentric motor, an air cylinder, a vibrator or the like.
The movement promoting means 50 may be provided on the partition member 35 side, or at least one of the output shafts 34A, 41A of the linear motion motors 34, 41 may be taken in and out little by little, or at least one slider 32A of the linear motors 32, 33. 33A may be moved little by little to facilitate the movement of the chip CP.
The movement promoting means 50 may be configured to blow out a gas such as air or a single gas from a plurality of suction holes provided in the support surface 21A to promote the movement of the chip CP.
The movement promoting means 50 sucks air from the base plate 35A side to float the chip CP or reduce static friction between the chip CP and the support surface 21A without floating the chip CP. The structure which promotes may be sufficient.

For example, the transfer unit 60 may grip the adhesive sheet AS with a gripping unit such as a chuck cylinder or an articulated robot, and pull the adhesive sheet AS with the gripping unit to peel the adhesive sheet AS from each chip CP. For example, the adhesive sheet for peeling may be adhered to the adhesive sheet AS, and the adhesive sheet AS may be peeled from each chip CP by pulling the adhesive sheet for peeling, and there is no limitation as long as the adhesive sheet AS can be peeled from each chip CP. It will never be done.
The transfer unit 60 may employ a round bar or a roller instead of the release plate 66, or may not include the release plate 66 and a driving device for moving the release plate 66.
The transfer means 60 may be omitted.

The piece-like body may be, for example, a triangle or a pentagon or more polygon. In such a case, a partition member having a wall surface on which the corners of the piece-like body are fitted is adopted, and the aligning means 40 drives one corner of the piece-like body to one corner of the wall surface of the partition member. What is necessary is just to incline the table 21 so that it may be.
The piece-like body may be, for example, a circular or elliptical geometric shape. In such a case, a partition member having a wall surface on which a predetermined portion of the piece-like body is fitted is adopted, and the alignment means 40 is arranged so that the predetermined portion of the piece-like body is driven to the wall surface. Can be inclined.

  Further, the material, type, shape and the like of the adhesive sheet AS and the piece-like body in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. In addition, as a piece, for example, food, resin containers, semiconductor chips such as silicon semiconductor chips and compound semiconductor chips, circuit boards, information recording boards such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the support means can support a plurality of pieces on the support surface, the support means is not limited in any way as long as it is within the technical scope in light of the technical common sense at the time of filing. The description of the means and process is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Alignment apparatus 20 Support means 21A Support surface 30 Partition means 35 Partition member 40 Alignment means 50 Movement promotion means 60 Transfer means AS Adhesive sheet CP Chip (strip-shaped body)

Claims (4)

  1. A support means capable of supporting a plurality of pieces on a support surface;
    Partition means capable of inserting a partition member having a lattice portion formed in a lattice shape between the plurality of pieces supported by the support surface;
    With the lattice portion inserted between the plurality of pieces supported by the support surface, at least the support surface is inclined, and each piece is aligned at a predetermined position on the support surface in a predetermined direction. An aligning device comprising: an aligning unit that causes the aligning device to move.
  2.   The alignment apparatus according to claim 1, further comprising a movement promoting unit that promotes movement of the plurality of pieces.
  3. The plurality of pieces are affixed to an adhesive sheet,
    The alignment apparatus according to claim 1, further comprising transfer means capable of transferring the plurality of pieces from the adhesive sheet to the support surface.
  4. Supporting a plurality of pieces in a support surface;
    Inserting a partition member having a lattice portion formed in a lattice shape between the plurality of pieces supported by the support surface;
    At least the support surface is inclined while the lattice portion is inserted between the plurality of pieces supported by the support surface, and each piece is aligned at a predetermined position on the support surface in a predetermined direction. And an alignment method.
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JP2014234891A JP6393596B2 (en) 2014-11-19 2014-11-19 Alignment apparatus and alignment method
TW108122671A TW201939644A (en) 2014-11-19 2015-10-07 Aligning apparatus and aligning method
TW104133033A TWI681481B (en) 2014-11-19 2015-10-07 Array device and method
KR1020150160344A KR20160059967A (en) 2014-11-19 2015-11-16 Aligning apparatus and aligning method
CN201510790399.2A CN105609447B (en) 2014-11-19 2015-11-17 Neatly arranging device and neatly arranging method

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CN106903978B (en) * 2017-02-21 2019-01-11 深圳市华星光电技术有限公司 Transfer the transfer device of template and micro- light emitting diode
US10211363B2 (en) 2017-02-21 2019-02-19 Shenzhen China Star Optoelectronics Technology Co., Ltd Transfer printing template and transfer printing device of micro light-emitting diode

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JPS4821418B1 (en) * 1969-01-27 1973-06-28
JPS6461033A (en) * 1987-09-01 1989-03-08 Sumitomo Electric Industries Device for mounting chip
JP2007036060A (en) * 2005-07-28 2007-02-08 Sanyo Electric Co Ltd Semiconductor device and manufacturing method thereof
KR100676736B1 (en) * 2006-06-30 2007-02-01 주식회사 월드프라텍 Chip scale package tray
JP2009175581A (en) * 2008-01-28 2009-08-06 Kyocera Mita Corp Transfer belt device for image forming apparatus
JP5350980B2 (en) * 2009-11-02 2013-11-27 シチズン電子株式会社 LED element manufacturing method
JP5607965B2 (en) * 2010-03-23 2014-10-15 日東電工株式会社 Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
JP5533695B2 (en) * 2011-01-26 2014-06-25 豊田合成株式会社 Semiconductor chip manufacturing method and semiconductor chip mounting method
JP6007008B2 (en) * 2012-07-06 2016-10-12 リンテック株式会社 Sheet pasting device
JP6047439B2 (en) * 2013-03-26 2016-12-21 株式会社Screenホールディングス Peeling apparatus and peeling method

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CN105609447A (en) 2016-05-25
TWI681481B (en) 2020-01-01
JP2016100413A (en) 2016-05-30
CN105609447B (en) 2020-06-02
TW201939644A (en) 2019-10-01
TW201626488A (en) 2016-07-16

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