JP6371641B2 - Alignment apparatus and alignment method - Google Patents

Description

  The present invention relates to an alignment apparatus and an alignment method.

  2. Description of the Related Art Conventionally, there has been known an alignment apparatus that widens the interval between pieces such as a plurality of semiconductor chips (hereinafter sometimes simply referred to as chips) and makes it easy to take out the pieces (for example, see Patent Document 1).

JP 2012-204747 A

  However, in the conventional alignment apparatus as described in Patent Document 1, the distance between the chips is widened by stretching the adhesive sheet such as a dicing film to which a plurality of chips are attached. The distance between the chips cannot be increased evenly. However, since such a difference in distance is extremely small, each chip is assumed to have an evenly expanded distance, and is transported based on a position derived by calculation (hereinafter sometimes referred to as a theoretical position). It is transported by transport means such as a device or a pickup device, and is mounted on an object to be mounted such as a lead frame or a substrate. As a result, the relative positional relationship between the chip and the mounted object is slightly deviated, the wire bonding connection position is deviated, the positions of the terminals of the chip and the mounted object are deviated, and the conduction between them is reduced. This causes the inconvenience of being unable to remove. Such a problem can occur not only in the manufacture of semiconductor devices but also in, for example, dense mechanical parts and fine decorative items.

  An object of the present invention is to provide an alignment apparatus and an alignment method capable of accurately widening the interval between the pieces.

Aligning apparatus of the present invention, by inserting a holding unit capable of holding at the holding surface a plurality of strip-like body, the contact means between said plurality of flaky body held by the holding surface, said plurality of flaky Partitioning means for widening the interval between the bodies, and aligning means for relatively moving the contact means and the holding surface to align each piece-like body at a predetermined position on the holding surface in a predetermined direction. It is characterized by that.
The alignment apparatus of the present invention includes a holding unit capable of holding a plurality of pieces on a holding surface, a partition unit capable of inserting a contact means between the plurality of pieces held on the holding surface, Aligning means for aligning each piece in a predetermined position on the holding surface in a predetermined direction while relatively moving the contact means and the holding surface to widen the interval between the plurality of pieces. It is characterized by having.

In the alignment apparatus according to the aspect of the invention, it is preferable that the plurality of pieces are attached to an adhesive sheet and include transfer means capable of transferring the plurality of pieces from the adhesive sheet to the holding surface.
In the alignment apparatus according to the aspect of the invention, it is preferable that the contact means is a lattice-like member that can be arranged in a lattice shape between the plurality of pieces.

The alignment method of the present invention includes a step of holding a plurality of pieces on a holding surface, and inserting a contact means between the plurality of pieces held on the holding surface . A step of widening the interval, and a step of relatively moving the contact means and the holding surface to align each piece in a predetermined position on the holding surface in a predetermined direction. To do.
The alignment method of the present invention includes a holding step of holding a plurality of pieces on a holding surface, a partitioning step of inserting a contact means between the plurality of pieces held on the holding surface, and the contact An aligning step of aligning each piece in a predetermined position on the holding surface in a predetermined direction while relatively moving the means and the holding surface to widen the interval between the plurality of pieces. It is characterized by having.

  According to the present invention, since the abutment means can be inserted between a plurality of pieces to align the pieces, the distance between the pieces is not affected by the stress of the adhesive sheet. Can be spread accurately.

Also, if a transfer means is provided, each piece can be transferred to the holding surface from an adhesive sheet that affects the interval between each piece by stress, so that the interval between each piece can be increased accurately. Can do.
Furthermore, if the abutment means is a lattice member, the lattice members can be inserted into all the plurality of pieces at once to align the pieces, thereby improving the processing capacity per unit time. Can be made.

The side view of the alignment apparatus which concerns on 1st Embodiment of this invention. Operation | movement explanatory drawing of the alignment apparatus of FIG. The side view of the alignment apparatus which concerns on 2nd Embodiment of this invention. Operation | movement explanatory drawing of the alignment apparatus of FIG.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
Detailed description of the same configuration in each embodiment is omitted.
In each embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in each embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis and “down” being the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

[First Embodiment]
In FIG. 1, the aligning device 10 includes a holding unit 20 capable of holding a plurality of chips CP as holding pieces with a holding surface 22A, and a blade as a contact unit between the plurality of chips CP held on the holding surface 22A. Partitioning means 30 into which 32 can be inserted, blade 32 and holding surface 22A are relatively moved, alignment means 40 for aligning each chip CP at a predetermined position on holding surface 22A in a predetermined direction, and each chip CP. An optical sensor capable of recognizing the position and a detection means (not shown) such as an imaging means are provided. The chip CP is formed by cutting a semiconductor wafer (hereinafter simply referred to as a wafer) WF into a lattice shape.

  The holding means 20 is supported by a rotation motor 21 as a driving device and an output shaft 21A of the rotation motor 21, and has a holding surface 22A capable of attracting and holding the chip CP by a decompression means (not shown) such as a decompression pump or a vacuum ejector. The table 22 is provided.

  The partition means 30 includes a linear motion motor 31 as a drive device and a blade 32 supported by an output shaft 31A of the linear motion motor 31. The blade 32 is set to be longer than the length in the front-rear direction of the wafer WF, and the lower end portion of the blade 32 is tapered to be easily inserted between the chips CP.

  The aligning means 40 includes a linear motor 41 as a drive device that supports the linear motor 31 with a slider 41A.

A procedure for aligning the chips CP in the above aligning apparatus 10 will be described.
First, with respect to the alignment apparatus 10 in the state indicated by the solid line in FIG. 1 in which the respective members are arranged at the initial position, a wafer WF in which transfer means (not shown) such as an operator or a belt conveyor is separated into a plurality of chips CP is provided. Is placed at a predetermined position on the holding surface 22A. Next, the holding unit 20 drives a decompression unit (not shown), and holds and holds each chip CP by the holding surface 22A.

  Next, based on the detection result of the detection means (not shown), the holding means 20 drives the rotation motor 21 so that a plurality of chip rows CP1 composed of a plurality of chips CP arranged in the front-rear direction are arranged in the left-right direction. 22 is rotated. Thereafter, based on the detection result of the detecting means (not shown), the partitioning means 30 and the aligning means 40 drive the linear motion motor 31 and the linear motor 41, and as shown by the two-dot chain line in the center in FIG. The blade 32 is inserted between the chip row CP1 and the second chip row CP1 from the left. Next, the alignment means 40 drives the linear motor 41 to move the blade 32 to the left and move the leftmost chip row CP1 to a predetermined position as indicated by the two-dot chain line on the left side in FIG. Then, after the alignment means 40 moves the left half chip row CP1 sequentially from the left to the predetermined position by the blade 32 by the same operation as described above, the right half of the right half in FIG. The chip row CP1 is moved to a predetermined position in order from the right. As a result, as shown in FIG. 2A, the chip rows CP1 are aligned in the left-right direction with a predetermined interval.

  Next, the holding means 20 drives the rotation motor 21, and as shown in FIG. 2B, the table 22 is counterclockwise within a plane parallel to the holding surface 22A (90 degrees in this embodiment). Rotate in the direction of rotation. Then, the partitioning means 30 and the aligning means 40 move the blade 32 by the same operation as described above, and as shown by the two-dot chain line on the left side in FIG. After being moved to a predetermined position, as indicated by the two-dot chain line on the right side of the figure, the right half chip row CP2 is moved to the predetermined position on the right side in order from the right. As a result, as shown in FIG. 2C, the chips CP are aligned at a predetermined position on the holding surface 22A in a predetermined direction with a predetermined interval.

  Thereafter, the partitioning means 30 and the aligning means 40 drive the linear motion motor 31 and the linear motor 41 to return the blade 32 to the initial position, and the holding means 20 stops driving the decompression means (not shown) before the operator or the illustration. The non-conveying means mounts each chip CP on a mounted object such as a lead frame or a substrate. When all the chips CP are mounted on the mounted object, the same operation is repeated thereafter.

  According to the embodiment as described above, since the blades 32 can be inserted between the plurality of chips CP to align the chips CP, the distance between the chips CP is not affected by the stress of the adhesive sheet. Can be spread accurately.

[Second Embodiment]
In FIG. 3, the alignment apparatus 10A includes a holding unit 20, partitioning units 30A capable of inserting a grid member 33 as a contact unit between a plurality of chips CP held by the holding surface 22A, and a grid member 33. Alignment means 40A for aligning each chip CP with a predetermined position on the holding surface 22A in a predetermined direction by relatively moving the holding surface 22A, and transfer capable of transferring a plurality of chips CP from the adhesive sheet AS to the holding surface 22A Means 50 and detection means (not shown) such as an optical sensor and an imaging means capable of recognizing the position of each chip CP are provided. Each chip CP is formed as an integrated object WK in a state where it is affixed to the adhesive sheet AS.

  The partition means 30 </ b> A includes a linear motion motor 31 and a lattice-like member 33 supported by the output shaft 31 </ b> A of the linear motion motor 31. The lattice member 33 includes a base plate 33A and a lattice portion 33C formed in a lattice shape on the lower surface 33B of the base plate 33A, and is provided so that the lattice portion 33C can be inserted between all the chips CP at a time. The lower end portion of the lattice portion 33C has a tapered shape and is easy to insert between the chips CP.

  The alignment means 40A includes a linear motor 43 as a drive device and a linear motor 44 as a drive device supported by the slider 43A of the linear motor 43 and supporting the linear motion motor 31 by the slider 44A.

  The transfer means 50 is supported by a linear motor 51 as a driving device, a linear motion motor 52 supported by a slider 51A of the linear motor 51 via a bracket 51B, and an output shaft 52A of the linear motion motor 52. A suction pad 53 capable of sucking and holding the adhesive sheet AS by a decompression means (not shown) such as a vacuum ejector, a linear motor 54 as a drive device, and a linear motion motor 55 as a drive device supported by a slider 54A of the linear motor 54, And a peeling plate 56 supported by the output shaft 55A of the linear motor 55.

A procedure for aligning the chips CP in the above alignment apparatus 10A will be described.
First, with respect to the alignment apparatus 10A in the state shown in FIG. 3 in which each member is arranged at the initial position, a conveying means (not shown) such as an operator or a belt conveyor holds the integrated object WK with the adhesive sheet AS on the holding surface 22A. Placed at a predetermined position. Next, the transfer means 50 drives the linear motors 51 and 54 and the linear motion motors 52 and 55 to move the suction pad 53 and the peeling plate 56 to the positions indicated by the solid lines in FIG. Then, the transfer unit 50 drives a decompression unit (not shown), and the suction pad 53 sucks and holds the right end of the adhesive sheet AS. Next, after the transfer means 50 drives the linear motors 51 and 54 and the linear motion motor 52 to raise the suction pad 53, the suction pad 53 and the peeling plate as shown by a two-dot chain line in FIG. 56 is moved to the left. Thereby, the adhesive sheet AS is peeled from the chip CP, and the chip CP is transferred to the holding surface 22A. When the adhesive sheet AS is peeled from the chip CP, the transfer unit 50 stops driving the decompression unit (not shown), and the adhesive sheet AS is placed in a sheet collection unit (not shown) such as a box or bag located below the suction pad 53. The AS is dropped and stored. Thereafter, the transfer means 50 drives the linear motors 51 and 54 and the linear motion motors 52 and 55 to return the suction pad 53 and the peeling plate 56 to the initial positions.

  Next, the holding means 20 rotates the table 22 as in the first embodiment. Thereafter, based on the detection result of the detection means (not shown), the partition means 30A and the alignment means 40A drive the linear motion motor 31 and the linear motors 43 and 44, and as shown in FIG. The lattice portion 33C is inserted into all. At this time, as shown in FIG. 4C, the positions and orientations of some chips CP with respect to the lattice portion 33C may be scattered in front and rear, and in the left and right directions. Therefore, the alignment means 40A drives the linear motor 44 to move the lattice member 33 forward as shown in FIG. Thereby, the front-rear direction position and orientation of the chip CP are corrected by the lattice portion 33C. Thereafter, the alignment means 40A drives the linear motor 43 to move the lattice member 33 to the left as shown in FIG. As a result, the position of the chip CP in the left-right direction is corrected by the lattice portion 33C, and the chips CP are aligned at a predetermined position on the holding surface 22A in a predetermined direction with a predetermined interval.

  Next, the partitioning means 30A and the aligning means 40A drive the linear motor 31 and the linear motors 43 and 44 to return the lattice member 33 to the initial position. Then, after the holding means 20 stops driving the decompression means (not shown), the operator or the transport means (not shown) mounts the chip CP on the mounted object. When all the chips CP are mounted on the mounted object, the same operation is repeated thereafter.

According to the embodiment as described above, the same effect as that of the first embodiment can be obtained.
Further, since the transfer means 50 is provided, each chip CP can be transferred to the holding surface 22A from the adhesive sheet AS that affects the distance between the chips CP due to the stress, so that the distance between the chips CP can be increased accurately. Can do.
Furthermore, since it is possible to align the chips CP by inserting the lattice portions 33C between all the chips CP at a time, it is possible to improve the processing capacity per unit time.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the holding means 20 may be configured to hold the chip CP by chuck means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, a magnetic force, or the like, or may not be configured to hold the chip CP.
The holding means 20 is formed with a wafer WF in which a fragile layer is formed so as to be separated into a plurality of chips CP by a laser beam or the like, or a groove (a groove that does not penetrate vertically) that can be separated into a plurality of chips CP. The processed wafer WF may be held. In this case, the contact means may include a cutting blade capable of cutting the wafer WF.
The holding unit 20 may hold the chips CP separated by cutting the wafer WF in an arbitrary direction such as 1 degree, 30 degrees, 45 degrees, and 60 degrees. In this case, the holding unit 20 may arbitrarily set a predetermined angle for rotating the table 22 in accordance with the cutting direction of the wafer WF.

The blade 32 may be formed shorter than the length in the front-rear direction of the wafer WF, or may be formed shorter than the length in the front-rear direction of the chip CP. In this case, the aligning means 40 may move the chips CP of one chip row CP1, CP2 sequentially from the front or the rear.
The blade 32 and the grid portion 33C may not have a lower end formed in a tapered shape.
Instead of the blade 32, a linear member may be employed, or instead of the lattice member 33, a mesh member in which linear members are arranged in a lattice may be employed.
The lattice-like member 33 may be provided so that the lattice portion 33C can be inserted across the plurality of chip rows CP1 and CP2 in the portion between the chips CP instead of all between the plurality of chips CP. With such a configuration, the processing capability is lower than that of the second embodiment, but the processing capability can be improved as compared to that of the first embodiment.
The lattice member 33 may be a single lattice portion 33C that does not have the base plate 33A.

The alignment means 40, 40A may support the table 22 with a so-called XY table as a driving device, stop the blade 32 or the lattice member 33, and move the table 22 back and forth or left and right. You may move both the grid | lattice-like member 33 and the table 22 back and forth or right and left.
The alignment means 40, 40A may include a driving device that supports the linear motors 41, 43 so as to be rotatable in a plane parallel to the holding surface 22A, and rotates the linear motors 41, 43 without rotating the table 22. Alternatively, both the table 22 and the linear motors 41 and 43 may be rotated. When the table 22 is not rotated, the rotation motor 21 can be omitted.
The alignment means 40 may move the left half chip rows CP1 and CP2 after moving the right half chip rows CP1 and CP2, or all the chip rows except the rightmost chip rows CP1 and CP2. CP1 and CP2 may be moved to the left sequentially from the leftmost chip row CP1 and CP2, or all the chip rows CP1 and CP2 except the leftmost chip row CP1 and CP2 may be moved to the rightmost chip row. You may move to CP1 from CP1 and CP2 in order.
The alignment means 40A may move the grid member 33 to the right after moving the grid member 33 rearward, or move the grid member 33 to the left or right, The lattice member 33 may be moved forward or backward.
The alignment means 40A crosses the linear motor 44 with respect to the linear motor 43 at an arbitrary angle such as 30 degrees, 45 degrees, 60 degrees, and the like, and supports the linear motor 44 on the slider 43A. May be moved.

For example, the transfer unit 50 may grip the adhesive sheet AS with a gripping unit such as a chuck cylinder or an articulated robot, and pull the adhesive sheet AS with the gripping unit to peel the adhesive sheet AS from each chip CP. For example, the adhesive sheet for peeling may be adhered to the adhesive sheet AS, and the adhesive sheet AS may be peeled from each chip CP by pulling the adhesive sheet for peeling, and there is no limitation as long as the adhesive sheet AS can be peeled from each chip CP. It will never be done.
The transfer means 50 may employ a round bar or a roller instead of the peeling plate 56, or may not be provided with the peeling plate 56 and a driving device for moving the peeling plate 56.
The transfer unit 50 may be employed in the first embodiment, or the transfer unit 50 may not be employed in the second embodiment, and a plurality of chips CP may be placed on the holding surface 22A as in the first embodiment. Also good.

  Further, the material, type, shape and the like of the adhesive sheet AS and the piece-like body in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. In addition, as a piece, for example, food, resin containers, semiconductor chips such as silicon semiconductor chips and compound semiconductor chips, circuit boards, information recording boards such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the holding means can hold a plurality of pieces on the holding surface, the holding means is not limited in any way as long as it is within the technical scope in light of the technical common sense at the beginning of the application. The description of the means and process is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

10, 10A Alignment device 20 Holding means 22A Holding surface 30, 30A Partitioning means 32 Blade (contact means)
33 Lattice-like member (contact means)
40, 40A Alignment means 50 Transfer means AS Adhesive sheet CP Chip (Slice)

Claims (4)

Holding means capable of holding a plurality of pieces in a holding surface;
Partitioning means for inserting a contact means between the plurality of pieces held by the holding surface, and widening the interval between the pieces .
An aligning device comprising: an aligning unit that relatively moves the abutting unit and the holding surface to align each piece in a predetermined position on the holding surface.   Holding means capable of holding a plurality of pieces in a holding surface;
  Partition means capable of inserting contact means between the plurality of pieces held by the holding surface;
  Alignment in which each piece is aligned at a predetermined position on the holding surface in a predetermined direction while relatively moving the abutting means and the holding surface to widen the interval between the plurality of pieces. And an alignment device. Holding a plurality of pieces on the holding surface;
Inserting a contact means between the plurality of pieces held by the holding surface, and widening the interval between the pieces ;
And a step of relatively moving the abutting means and the holding surface to align each piece in a predetermined position on the holding surface in a predetermined direction.   Holding step of holding a plurality of pieces on the holding surface;
  A partitioning step of inserting contact means between the plurality of pieces held by the holding surface;
  Alignment in which each piece is aligned at a predetermined position on the holding surface in a predetermined direction while relatively moving the abutting means and the holding surface to widen the interval between the plurality of pieces. And an alignment method.

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