CN108364900B - Cylinder calibration table - Google Patents
Cylinder calibration table Download PDFInfo
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- CN108364900B CN108364900B CN201810284180.9A CN201810284180A CN108364900B CN 108364900 B CN108364900 B CN 108364900B CN 201810284180 A CN201810284180 A CN 201810284180A CN 108364900 B CN108364900 B CN 108364900B
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- 238000009434 installation Methods 0.000 claims description 9
- 230000006378 damage Effects 0.000 claims 2
- 210000003437 trachea Anatomy 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 45
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 11
- 230000006872 improvement Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an air cylinder calibration table, which comprises a fixed support, wherein a Z-direction linear motion unit is arranged at the bottom of the fixed support, the upper part of the Z-direction linear motion unit is connected with an R rotary motion unit, the upper part of the R rotary motion unit is connected with a bearing table, the upper part of the bearing table penetrates through a round opening at the upper part of a supporting fixing frame, and the bottom of the fixed support is symmetrically arranged at the front side and the rear side of a guide table type air cylinder; the cylinder calibration table is reasonable in structural design, can realize rapid positioning of wafers, can greatly improve the working efficiency of equipment, can realize rapid switching when positioning the wafers in large and small sizes, and has a wider application range, and the cylinder calibration table is low in manufacturing cost, simple in operation, simple in structure and convenient to install and debug; the cost is low, and a transmission mechanism such as a servo motor, a screw rod and the like is not needed, so that the control part is relatively simple; the pre-alignment process has simple steps and high efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, and particularly provides an air cylinder calibration table.
Background
Semiconductor (semiconductor) refers to a material having conductivity between that of a conductor and an insulator at normal temperature. Semiconductors have wide applications in radios, televisions, and thermometry. Such as diodes, are devices fabricated using semiconductors. A semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and an economic point of view. Most electronic products today, such as computers, mobile phones or digital recorders, have very close association with semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is one of the most influential in commercial applications among various semiconductor materials.
Along with the diversification of semiconductor devices, the wafer processing technologies are more and more, the requirements of many technologies on the position accuracy of the wafer are not high, the corresponding detection speed is fast, and new requirements are put on the prealignment device: the detection method and the detection steps are aimed at being simple, the detection efficiency is improved, the precision can be properly reduced, and the cost is reduced to ensure the suitability due to the reduction of the precision, so that a low-cost, high-efficiency and simple-operation pre-alignment device is required to be redesigned.
Accordingly, a cylinder calibration block is provided by those skilled in the art to solve the problems set forth in the background art.
Disclosure of Invention
The present invention is directed to a cylinder calibration stand, which solves the above-mentioned problems of the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the cylinder calibration table comprises a fixed support, wherein a Z-direction linear motion unit is arranged at the bottom of the fixed support, an R rotary motion unit is connected to the upper part of the Z-direction linear motion unit, the upper part of the R rotary motion unit is connected with a bearing table, the upper part of the bearing table penetrates through a round opening on the upper part of a supporting fixing frame, the bottom of the fixed support is symmetrically arranged on the front side and the rear side of a guide table type cylinder, a left platform cylinder and a right platform cylinder are symmetrically arranged on the left side and the right side of the round opening at the upper end of the fixed support, a left tool and a right tool are correspondingly arranged on the left platform cylinder and the right platform cylinder, a left platform cylinder limit part and a right platform cylinder limit part are respectively arranged at the upper end of the fixed support at the opposite positions of the left platform cylinder and the right platform cylinder, and a side searching unit is arranged at the rear side of the upper end of the fixed support; the edge searching unit main body is a photoelectric sensor and is fixed on a linear guide rail which is arranged along the radial direction of the wafer, the guide rail is fixed on a fixed bracket and can move along the radial direction of the wafer, and the edge searching unit moves to a corresponding position when the wafers with the size and the dimension are switched; the left tool and the right tool are driven by the platform cylinder respectively and can move along the radial direction perpendicular to the axis of the wafer carrying platform so as to calibrate the circle center of the wafer. The calibration of the circle centers of the wafers with the large and small sizes can be respectively carried at different heights; the wafer carrying table unit with the vacuum adsorption function is coaxially and fixedly connected to the R-axis rotary motion unit, and drives the adsorbed wafer to rotate together with the wafer.
As an improvement: the Z-direction linear motion unit comprises a guide table type air cylinder and guide table type air cylinder limiting parts, the guide table type air cylinder is arranged at the lower part of the fixed support, a connecting part is arranged at the upper part of the guide table type air cylinder, the upper part of the connecting part is connected with the R rotary motion unit, the guide table type air cylinder limiting parts are symmetrically arranged at the front side and the rear side of the guide table type air cylinder at the lower part of the fixed support, and the upper part of the guide table type air cylinder limiting parts are arranged in limiting grooves at the side surfaces of the connecting part; in the linear motion unit, the Z-direction motion subunit is driven by a guide table type air cylinder to fix the air cylinder in a fixed displacement mode, and the Z-direction motion subunit is provided with a start position and a stop position and is used for switching wafers of large and small sizes. The R-axis rotary motion unit is a DD motor directly driven by a torque motor, is provided with feedback of a grating ruler, improves precision, and can move up and down along with the Z-direction motion subunit.
As a further improvement: the edge finding unit comprises a linear guide rail, a base and an installation arm, wherein the upper part of the linear guide rail is connected with the base in a sliding manner, the upper end of the base is connected with the installation arm through a fixing piece, and the front side of the upper part of the installation arm is fixedly connected with a photoelectric sensor.
As a further improvement: the right side of the bottom of the fixed support is connected with the wiring terminal and the wiring board through DIN guide rails.
As a further improvement: the air conditioner is characterized in that an electromagnetic valve mounting plate is arranged on the right side of the bottom of the fixed support, a platform air cylinder electromagnetic valve, a guide table type air cylinder electromagnetic valve and a vacuum breaking electromagnetic valve are respectively arranged on the upper portion of the electromagnetic valve mounting plate, and the platform air cylinder electromagnetic valve, the guide table type air cylinder electromagnetic valve and the vacuum breaking electromagnetic valve are respectively connected with a left platform air cylinder, a right platform air cylinder, a guide table type air cylinder and a bearing table through air pipe connectors and air pipes.
As a further improvement: the air outlet of the digital display barometer is respectively connected with a platform air cylinder electromagnetic valve, a guide table type air cylinder electromagnetic valve and a vacuum breaking electromagnetic valve through an air pipe joint and an air pipe.
As a further improvement: the rear side of the bottom of the fixed support is provided with a controller, and the controller is electrically connected with the R rotary motion unit, the photoelectric sensor, the wiring terminal, the wiring board, the platform cylinder electromagnetic valve, the guide table type cylinder electromagnetic valve, the vacuum breaking electromagnetic valve and the digital display barometer.
Compared with the prior art, the invention has the advantages that: the cylinder calibration table is reasonable in structural design, can realize rapid positioning of wafers, can greatly improve the working efficiency of equipment, can realize rapid switching when positioning the wafers in large and small sizes, and has a wider application range, and the cylinder calibration table is low in manufacturing cost, simple in operation, simple in structure and convenient to install and debug; the cost is low, and a transmission mechanism such as a servo motor, a screw rod and the like is not needed, so that the control part is relatively simple; the pre-alignment process has simple steps and high efficiency.
Drawings
The invention will be described in further detail with reference to the accompanying drawings and embodiments:
FIG. 1 is a side view of a cylinder calibration block;
fig. 2 is another perspective side view of the cylinder calibration block.
In the figure: the device comprises a fixed support 1, a piece bearing table 2, a photoelectric sensor 3, a linear guide rail 4, a left tool 5, a right tool 6, a left platform cylinder 7, a right platform cylinder 8, a platform cylinder left limiting part 9, a platform cylinder right limiting part 10, a guide table type cylinder limiting part 11, a guide table type cylinder 12, an R rotary motion unit 13, a connecting part 14, a controller 15, an electromagnetic valve mounting plate 16, a digital display barometer 17, a platform cylinder electromagnetic valve 18, a guide table type cylinder electromagnetic valve 19, a vacuum breaking electromagnetic valve 20, an air pipe joint 21 wiring board 22, a wiring terminal 23, a DIN guide rail 24 and a fixing part 25.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 and 2, in the embodiment of the invention, a cylinder calibration stand comprises a fixed support 1, wherein a Z-direction linear motion unit is arranged at the bottom of the fixed support 1, the upper part of the Z-direction linear motion unit is connected with an R-rotation motion unit 13, the upper part of the R-rotation motion unit 13 is connected with a bearing table 2, the bearing table 2 rotates along with an R-rotation subunit, the upper part of the bearing table 2 passes through a round opening at the upper part of a supporting fixed support 1, the bottom of the fixed support 1 is symmetrically arranged at the front side and the rear side of a guide table type cylinder 12, the upper end of the fixed support 1 is symmetrically provided with a left platform cylinder 7 and a right platform cylinder 8 at the left side and the right side of the round opening, a left tool 5 and a right tool 6 are correspondingly arranged on the left platform cylinder and the right platform cylinder, the upper end of the fixed support 1 is respectively provided with a platform cylinder left limit 9 and a platform cylinder right limit 10 at the opposite positions of the left platform cylinder 7 and the right platform cylinder 8, and the rear side of the upper end of the fixed support 1 is provided with a side searching unit; the left platform cylinder 7 and the right platform cylinder 8 can shrink and expand along the radial direction of the wafer after the circle center is determined by the left tool 5 and the right tool 6, the expansion state is used for the process that the wafer manipulator places the wafer on the bearing table 2, the shrinkage process is used for the calibration of the circle center of the wafer, the precision of the calibration of the wafer center is determined by the state after shrinkage, and therefore, the left platform cylinder 7 and the right platform cylinder 8 need to be precisely limited by the platform cylinder left limiting part 9 and the platform cylinder right limiting part 10 in the shrinkage state.
The Z-direction linear motion unit comprises a guide table type air cylinder 12 and guide table type air cylinder limiting parts 11, wherein the guide table type air cylinder 12 is arranged at the lower part of the fixed support 1, a connecting part 14 is arranged at the upper part of the guide table type air cylinder 12, the upper part of the connecting part 14 is connected with an R rotary motion unit 13, the guide table type air cylinder limiting parts 11 are symmetrically arranged at the front side and the rear side of the guide table type air cylinder 12 at the lower part of the fixed support, and the upper part of the guide table type air cylinder limiting parts 11 is arranged in limiting grooves at the side surfaces of the connecting part 14; the guide table type cylinder 12 is provided with an initial position and a final position along the Z direction by using the guide table type cylinder limiting piece 11, the position accuracy is ensured by the guide table type cylinder limiting piece 11, wherein the initial position is used for receiving and calibrating a small-size wafer, and the final position is used for receiving and calibrating a large-size wafer.
The edge finding unit comprises a linear guide rail 4, a base and an installation arm, wherein the upper part of the linear guide rail 4 is connected with the base in a sliding manner, the upper end of the base is connected with the installation arm through a fixing piece 25, and the front side of the upper part of the installation arm is fixedly connected with the photoelectric sensor 3; the linear guide rail 4 is arranged with the limit of the start and end positions along the radial direction of the wafer after the circle center position is determined, the linear guide rail 4 drives the photoelectric sensor 3 to be used for searching the edges of the small-size and large-size wafers when being positioned at the start position and the end position, and the photoelectric sensor 3 has larger distance along the direction of light (namely along the Z direction), so that the photoelectric sensor does not need Z-direction displacement when changing the small-size and large-size wafers.
The right side of the bottom of the fixed bracket 1 is connected with a wiring terminal 23 and a wiring board 22 through DIN guide rails.
The right side of the bottom of the fixed support 1 is provided with an electromagnetic valve mounting plate 16, a platform cylinder electromagnetic valve 18, a guide table type cylinder electromagnetic valve 19 and a vacuum breaking electromagnetic valve 20 are respectively mounted on the upper portion of the electromagnetic valve mounting plate 16, and the platform cylinder electromagnetic valve 18, the guide table type cylinder electromagnetic valve 19 and the vacuum breaking electromagnetic valve 20 are respectively connected with a left platform cylinder 7, a right platform cylinder 8, the guide table type cylinder 12 and the bearing table 2 through air pipe joints 21 and air pipes.
The rear part of the fixed support 1 is provided with a digital display barometer 17, and an air outlet of the digital display barometer 17 is respectively connected with a platform air cylinder electromagnetic valve 18, a guide table type air cylinder electromagnetic valve 19 and a vacuum breaking electromagnetic valve 20 through an air pipe joint 21 and an air pipe.
The rear side of the bottom of the fixed support 1 is provided with a controller 15, and the controller 15 is electrically connected with the R rotary motion unit 13, the photoelectric sensor 3, the wiring terminal 23, the wiring board 22, the platform cylinder electromagnetic valve 18, the guide table type cylinder electromagnetic valve 19, the vacuum breaking electromagnetic valve 20 and the digital barometer 17.
The working principle of the invention is as follows: the wafer is placed on the wafer carrying platform 2 by the wafer manipulator in an expanding state when the working process starts, the wafer is positioned between the two pieces of tools, the platform cylinder electromagnetic valve 18 is started to simultaneously control the left platform cylinder 7 and the right platform cylinder 8 to drive the left tool 5 and the right tool 6 which are symmetrical in two pieces to move to the position of the platform cylinder left limiting piece 9 and the platform cylinder right limiting piece 10 in a contracting mode towards the circle center direction, the circle center of the wafer is pushed to reach a designated position by means of the circular arc edge of the tools, calibration of the circle center of the wafer is completed, then the wafer carrying platform 2 adsorbs the wafer, the wafer carrying platform 2 rotates together under the driving of the left platform cylinder 7 and the right platform cylinder 8, the wafer carrying platform 2 after adsorbing the wafer is driven by the R rotary motion unit 13, the position of the edge defect is determined by utilizing the photoelectric sensor 3, the wafer carrying platform 2 is released under the action of the vacuum breaking electromagnetic valve 20 until the edge of the wafer is rotated to the designated position, and the wafer is taken down again; when the small-size wafer is switched into the large-size wafer, the guide table type air cylinder 12 is controlled to drive the R rotary motion unit 13 and the wafer carrying table 2 to ascend under the action of the guide table type air cylinder electromagnetic valve 19, and the guide table type air cylinder limiting piece 11 is utilized to reach the designated position and be maintained; when the large-size wafer is switched into the small-size wafer, the guide table type air cylinder 12 is controlled to drive the R rotary motion unit 13 and the wafer carrying table 2 to descend to the lowest position under the action of the guide table type air cylinder electromagnetic valve 19.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. Cylinder calibration stand, including fixed bolster (1), its characterized in that: the device comprises a fixed support (1), wherein a Z-direction linear motion unit is arranged at the bottom of the fixed support (1), an R-direction rotary motion unit (13) is connected to the upper part of the Z-direction linear motion unit, a bearing table (2) is connected to the upper part of the R-direction rotary motion unit (13), the upper part of the bearing table (2) penetrates through a round opening at the upper part of the fixed support (1), left platform cylinders (7) and right platform cylinders (8) are symmetrically arranged at the left side and the right side of the round opening at the bottom of the fixed support (1), left tools (5) and right tools (6) are correspondingly arranged on the left platform cylinders and the right platform cylinders, a platform cylinder left limiting part (9) and a platform cylinder right limiting part (10) are respectively arranged at the opposite parts of the left platform cylinders (7) and the right platform cylinders (8), and an edge finding unit is arranged at the rear side of the upper end of the fixed support (1); the Z-direction linear motion unit comprises a guide table type air cylinder (12) and guide table type air cylinder limiting parts (11), wherein the guide table type air cylinder (12) is arranged at the lower part of the fixed support (1), a connecting part (14) is arranged at the upper part of the guide table type air cylinder (12), the upper part of the connecting part (14) is connected with an R rotary motion unit (13), the guide table type air cylinder limiting parts (11) are symmetrically arranged at the front side and the rear side of the guide table type air cylinder (12) at the lower part of the fixed support, and the upper part of the guide table type air cylinder limiting parts (11) is arranged in limiting grooves at the side surfaces of the connecting part (14); the edge finding unit comprises a linear guide rail (4), a base and an installation arm, wherein the upper part of the linear guide rail (4) is connected with the base in a sliding manner, the upper end of the base is connected with the installation arm through a fixing piece (25), and the front side of the upper part of the installation arm is fixedly connected with a photoelectric sensor (3).
2. The cylinder calibration station of claim 1, wherein: the right side of the bottom of the fixed support (1) is connected with a wiring terminal (23) and a wiring board (22) through DIN guide rails.
3. The cylinder calibration station of claim 1, wherein: the utility model discloses a platform cylinder, including fixed bolster (1), fixed bolster (1) bottom right side is provided with solenoid valve mounting panel (16), and platform cylinder solenoid valve (18), guide desk type cylinder solenoid valve (19) and vacuum destruction solenoid valve (20) are installed respectively on solenoid valve mounting panel (16), platform cylinder solenoid valve (18), guide desk type cylinder solenoid valve (19) and vacuum destruction solenoid valve (20) are connected left platform cylinder (7), right platform cylinder (8), guide desk type cylinder (12) and plummer (2) respectively through air pipe joint (21) and trachea.
4. A cylinder calibration block according to claim 3, wherein: the rear part of the fixed support (1) is provided with a digital display barometer (17), and an air outlet of the digital display barometer (17) is respectively connected with a platform cylinder electromagnetic valve (18), a guide table type cylinder electromagnetic valve (19) and a vacuum breaking electromagnetic valve (20) through an air pipe connector (21) and an air pipe.
5. The cylinder calibration station of claim 4, wherein: the automatic air guide device is characterized in that a controller (15) is arranged at the rear side of the bottom of the fixed support (1), and the controller (15) is electrically connected with the R rotary motion unit (13), the photoelectric sensor (3), the wiring terminal (23), the wiring board (22), the platform air cylinder electromagnetic valve (18), the guide table type air cylinder electromagnetic valve (19), the vacuum breaking electromagnetic valve (20) and the digital display barometer (17).
Priority Applications (1)
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CN201810284180.9A CN108364900B (en) | 2018-04-02 | 2018-04-02 | Cylinder calibration table |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810284180.9A CN108364900B (en) | 2018-04-02 | 2018-04-02 | Cylinder calibration table |
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CN108364900A CN108364900A (en) | 2018-08-03 |
CN108364900B true CN108364900B (en) | 2024-03-08 |
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CN201810284180.9A Active CN108364900B (en) | 2018-04-02 | 2018-04-02 | Cylinder calibration table |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
JP2016054169A (en) * | 2014-09-02 | 2016-04-14 | リンテック株式会社 | Alignment device and alignment method |
CN208157385U (en) * | 2018-04-02 | 2018-11-27 | 无锡星微科技有限公司 | A kind of cylinder calibration console |
-
2018
- 2018-04-02 CN CN201810284180.9A patent/CN108364900B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
JP2016054169A (en) * | 2014-09-02 | 2016-04-14 | リンテック株式会社 | Alignment device and alignment method |
CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
CN208157385U (en) * | 2018-04-02 | 2018-11-27 | 无锡星微科技有限公司 | A kind of cylinder calibration console |
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