CN219715533U - Leveling device for wafer detection platform - Google Patents
Leveling device for wafer detection platform Download PDFInfo
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- CN219715533U CN219715533U CN202320815493.9U CN202320815493U CN219715533U CN 219715533 U CN219715533 U CN 219715533U CN 202320815493 U CN202320815493 U CN 202320815493U CN 219715533 U CN219715533 U CN 219715533U
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- fixedly connected
- wafer
- leveling device
- placing
- sliding
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- 238000001514 detection method Methods 0.000 title claims abstract description 24
- 238000007689 inspection Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 abstract description 50
- 238000000034 method Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer detection, in particular to a leveling device of a wafer detection platform, which comprises: the top of the detection table is provided with a placing disc; the positioning mechanism is used for enabling the wafer to be positioned on the placing disc rapidly, and the positioning mechanism is arranged on the surface of the placing disc; the positioning mechanism comprises a positioning component arranged on the surface of the placing plate, and a driving component is arranged on the surface of the positioning component; the output shaft of the servo motor drives the sliding block to move through the first bevel gear, the second bevel gear and the screw rod, the spring increases the resistance of the sliding block to move, the four clamping blocks drive the elastic blocks to slowly approach and clamp and position wafers at the same time, the wafers with different sizes can be clamped, the clamping damage to the surfaces of the wafers can be reduced by the positioning mechanism, the flatness of the wafers on the placing plate is guaranteed, the leveling work is performed at the moment, and the accuracy of the detection platform on the wafers is guaranteed.
Description
Technical Field
The utility model relates to the technical field of wafer detection, in particular to a leveling device for a wafer detection platform.
Background
The wafer needs to be subjected to electrical test after processing is completed, and in the electrical test, the wafer needs to be horizontally placed on a wafer leveling device of test equipment; most of the existing wafer detection platform leveling devices are provided with vacuum chucks at the center of a placing table, and wafers are usually directly placed on the vacuum chucks to be adsorbed and positioned, so that leveling work is performed, and when the wafers are adsorbed on the surfaces of the chucks by the vacuum chucks, the wafers can be locally deformed due to air pressure or tiny particle inhalation, so that the flatness of the wafers is affected, and the accuracy of detection of the wafer by the detection platform is further affected.
Therefore, a wafer inspection platform leveling device is proposed to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to solve the problems and provide the leveling device for the wafer detection platform, which solves the problems that the wafer is absorbed and positioned by the vacuum chuck and the flatness of the wafer is easily affected.
The utility model realizes the aim through the following technical scheme, and the wafer detection platform leveling device comprises: the top of the detection table is provided with a placing disc; the positioning mechanism is used for enabling the wafer to be positioned on the placing disc rapidly, and the positioning mechanism is arranged on the surface of the placing disc; the positioning mechanism comprises a positioning component arranged on the surface of the placing plate, and a driving assembly is arranged on the surface of the positioning component.
Preferably, the locating part is including seting up the spout that the annular distributes in the dish surface of placing, the inside sliding connection of spout has the slider, the top fixedly connected with grip block of slider, the fixed surface of grip block is connected with the elastic block that the waiting was listed as the distribution, the inside rotation of spout is connected with the lead screw, the inside threaded connection of slider is in the surface of lead screw, and the lead screw rotates and drives the grip block through the slider and remove, makes four grip blocks drive the elastic block and is close to simultaneously and carry out the centre gripping location to the wafer, and the elastic block is used for reducing the centre gripping damage to wafer surface.
Preferably, the inside of placing the dish has been seted up annular distributed spacing groove, the spacing groove is linked together with the spout, the equal fixedly connected with stopper in both sides of slider, the surface sliding connection of stopper is in the inside of spacing groove, the fixed surface of stopper is connected with the spring, the one end fixedly connected with of spring is in the inside of spacing groove, and the stopper is spacing with the slider of spacing groove to moving, guarantees the stability of slider in moving, and the spring is used for increasing the resistance of slider in moving, reduces the impact force of grip block and elastic block to wafer centre gripping location.
Preferably, the inside rotation of placing the dish is connected with first conical gear, the one end fixedly connected with second conical gear of lead screw, the surface of first conical gear meshes with the surface of second conical gear, and first conical gear rotates and drives four lead screws and rotate simultaneously through second conical gear, reduces the loaded down with trivial details nature of rotating the lead screw one by one.
Preferably, the surface fixedly connected with quantity of slider is two elasticity ripple cover, one side fixedly connected with in the spout that the slider was kept away from to elasticity ripple cover, and the slider stretches one side elasticity ripple cover and extrudes opposite side elasticity ripple cover in moving, and two elasticity ripple covers are in the slider removal to the shutoff of spout all the time, and then separate external impurity to enter into inside the spout, guarantee the inside neatly of spout.
Preferably, the drive assembly includes fixed connection in the mount of placing the dish bottom, the fixed surface of mount is connected with servo motor, servo motor's output shaft fixed connection is in first conical gear's bottom, and the mount is used for supporting spacingly to servo motor, guarantees servo motor's steadiness on placing the dish.
The beneficial effects of the utility model are as follows:
1. the output shaft of the servo motor drives the sliding block to move through the first conical gear, the second conical gear and the screw rod, and the spring increases the resistance of the sliding block to move, so that the four clamping blocks drive the elastic blocks to slowly approach to and clamp and position the wafer at the same time, the wafer with different sizes can be clamped, the clamping damage to the surface of the wafer is reduced by the positioning mechanism, the flatness of the wafer on the placing plate is ensured, the leveling work is performed at the moment, and the accuracy of the detection platform on the wafer is ensured;
2. through setting up locating part, the slider stretches one side elastic corrugated sleeve and extrudes opposite side elastic corrugated sleeve in moving, and two elastic corrugated sleeves block up the spout all the time in the slider removes, and then outside impurity of separation enters into inside the spout, guarantees the inside clean and tidy nature of spout.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of the placement tray and positioning member of the present utility model;
FIG. 3 is a cross-sectional view of a puck of the present utility model;
fig. 4 is a schematic structural view of a positioning mechanism according to the present utility model.
In the figure: 1. a detection table; 2. placing a tray; 3. a positioning mechanism; 301. a positioning member; 3011. a chute; 3012. a slide block; 3013. a clamping block; 3014. an elastic block; 3015. a screw rod; 3016. a limit groove; 3017. a limiting block; 3018. a spring; 3019. a first bevel gear; 30110. a second bevel gear; 30111. an elastic bellows; 302. a drive assembly; 3021. a fixing frame; 3022. a servo motor.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The specific implementation method comprises the following steps: as shown in fig. 1-4, a wafer inspection platform leveling device includes: the device comprises a detection table 1, wherein a placing disc 2 is arranged at the top of the detection table 1; the positioning mechanism 3 is used for enabling the positioning mechanism 3 for quickly positioning the wafer on the placing tray 2 to be arranged on the surface of the placing tray 2; wherein, positioning mechanism 3 includes setting up the locating part 301 on placing the surface of dish 2, and the surface of locating part 301 is provided with drive assembly 302.
As shown in fig. 2-4, the positioning component 301 comprises a sliding groove 3011 which is annularly distributed on the surface of the placing disc 2, a sliding block 3012 is slidingly connected in the sliding groove 3011, a clamping block 3013 is fixedly connected at the top of the sliding block 3012, an elastic block 3014 which is equally distributed on the surface of the clamping block 3013 is fixedly connected with the surface of the sliding block 3011, a screw rod 3015 is rotatably connected in the sliding groove 3011, an annular distributed limiting groove 3016 is formed in the interior of the placing disc 2, the limiting groove 3016 is communicated with the sliding groove 3011, limiting blocks 3017 are fixedly connected to two sides of the sliding block 3012, the surface of the limiting block 3017 is slidingly connected in the interior of the limiting groove 3016, a spring 3018 is fixedly connected to the surface of the limiting block 3017, one end of the spring 3018 is fixedly connected in the interior of the limiting groove 3016, a first conical gear 3019 is rotatably connected in the interior of the placing disc 2, one end of the screw rod 3015 is fixedly connected with a second conical gear 30110, the surface of the first conical gear 3019 is meshed with the surface of the second conical gear 30110, the driving component 302 comprises a motor 3022 fixedly connected to the bottom of the motor 3022, and the bottom of the motor 3022 is fixedly connected to the surface of the servo fixing frame 3022;
when the wafer needs to be positioned, the wafer is placed on the placing tray 2, the servo motor 3022 is started, the output shaft of the servo motor 3022 rotates to drive the first bevel gear 3019 to rotate, the first bevel gear 3019 rotates to drive the four second bevel gears 30110 to rotate simultaneously, the second bevel gear 30110 rotates to drive the screw rod 3015 to rotate, the screw rod 3015 rotates to drive the sliding block 3012 to move, the sliding block 3012 moves to drive the clamping block 3013 to move and drive the limiting block 3017 to move, the limiting block 3017 stretches the spring 3018 in the moving process, the spring 3018 increases the resistance of the movement of the limiting block 3017, and then the four clamping blocks 3013 drive the elastic block 3014 to slowly approach and clamp and position the wafer at the same time, wafers of different sizes can be clamped, the self-adaptability of using the positioning mechanism 3 is improved, the positioning mechanism 3 reduces clamping damage to the surface of the wafer, flatness on the placing tray 2 is guaranteed, at the moment, leveling work is performed again, and the accuracy of wafer detection by the detection platform is guaranteed.
As shown in fig. 2, the surface of the slide block 3012 is fixedly connected with two elastic corrugated sleeves 30111, one side of the elastic corrugated sleeves 30111 far away from the slide block 3012 is fixedly connected inside the slide groove 3011 (manufacturers of the elastic corrugated sleeves 30111 are manufactured by the company of Sunday products, such as Qinghui county products, rubber products limited, the shape of the elastic corrugated sleeves 30111 is selected according to actual requirements), the slide block 3012 stretches one side of the elastic corrugated sleeve 30111 in the moving process and presses the other side of the elastic corrugated sleeve 30111, and the two elastic corrugated sleeves 30111 always block the slide groove 3011 in the moving process of the slide block 3012, so that external impurities are prevented from entering the slide groove 3011, and the inside neatness of the slide groove 3011 is ensured.
When the wafer positioning device is used, when the wafer is required to be positioned, the wafer is placed on the placing disc 2, the servo motor 3022 is started, the output shaft of the servo motor 3022 rotates to drive the first bevel gear 3019 to rotate, the first bevel gear 3019 rotates to drive the four second bevel gears 30110 to rotate simultaneously, the second bevel gear 30110 rotates to drive the screw rod 3015 to rotate, the screw rod 3015 rotates to drive the slide block 3012 to move, the slide block 3012 moves to drive the clamping block 3013 to drive the limiting block 3017 to move, the limiting block 3017 stretches the spring 3018 in the moving process, the spring 3018 increases the resistance of the movement of the limiting block 3017, the four clamping blocks 3013 further drive the elastic block 3014 to simultaneously and slowly approach and clamp and position the wafer, the wafers with different sizes can be clamped, the self-adaptability of the positioning mechanism 3 is improved, the clamping damage to the surface of the wafer is reduced, the flatness of the wafer on the placing disc 2 is ensured, the leveling work is performed at the moment, and the accuracy of the wafer detection by the detection platform is ensured.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (8)
1. The utility model provides a wafer testing platform levelling device which characterized in that includes:
the device comprises a detection table (1), wherein a placing disc (2) is arranged at the top of the detection table (1);
the positioning mechanism (3) is used for enabling the wafer to be rapidly positioned on the placing disc (2), and the positioning mechanism (3) is arranged on the surface of the placing disc (2);
the positioning mechanism (3) comprises a positioning component (301) arranged on the surface of the placing disc (2), and a driving assembly (302) is arranged on the surface of the positioning component (301).
2. The wafer inspection platen leveling device of claim 1, wherein: the positioning component (301) comprises sliding grooves (3011) which are formed in the surface of the placing tray (2) in an annular mode, sliding blocks (3012) are connected in the sliding grooves (3011) in a sliding mode, clamping blocks (3013) are fixedly connected to the tops of the sliding blocks (3012), and elastic blocks (3014) which are distributed in equal rows are fixedly connected to the surfaces of the clamping blocks (3013).
3. The wafer inspection platen leveling device according to claim 2, wherein: the inside of spout (3011) rotates and is connected with lead screw (3015), the inside threaded connection of slider (3012) is in the surface of lead screw (3015).
4. The wafer inspection platen leveling device according to claim 2, wherein: annular distributed limiting grooves (3016) are formed in the placing plate (2), the limiting grooves (3016) are communicated with the sliding grooves (3011), limiting blocks (3017) are fixedly connected to two sides of the sliding block (3012), and the surfaces of the limiting blocks (3017) are slidably connected to the inside of the limiting grooves (3016).
5. The wafer inspection platen leveling device according to claim 4, wherein: the surface of the limiting block (3017) is fixedly connected with a spring (3018), and one end of the spring (3018) is fixedly connected to the inside of the limiting groove (3016).
6. A wafer inspection platform leveling device in accordance with claim 3 wherein: the inside rotation of placing dish (2) is connected with first conical gear (3019), the one end fixedly connected with second conical gear (30110) of lead screw (3015), the surface of first conical gear (3019) meshes with the surface of second conical gear (30110).
7. The wafer inspection platen leveling device according to claim 2, wherein: the surface of the sliding block (3012) is fixedly connected with two elastic corrugated sleeves (30111), and one side, far away from the sliding block (3012), of the elastic corrugated sleeves (30111) is fixedly connected to the inside of the sliding groove (3011).
8. The wafer inspection platen leveling device according to claim 6, wherein: the driving assembly (302) comprises a fixing frame (3021) fixedly connected to the bottom of the placing disc (2), a servo motor (3022) is fixedly connected to the surface of the fixing frame (3021), and an output shaft of the servo motor (3022) is fixedly connected to the bottom end of the first conical gear (3019).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320815493.9U CN219715533U (en) | 2023-04-13 | 2023-04-13 | Leveling device for wafer detection platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320815493.9U CN219715533U (en) | 2023-04-13 | 2023-04-13 | Leveling device for wafer detection platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219715533U true CN219715533U (en) | 2023-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320815493.9U Active CN219715533U (en) | 2023-04-13 | 2023-04-13 | Leveling device for wafer detection platform |
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| Country | Link |
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| CN (1) | CN219715533U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117080155A (en) * | 2023-10-13 | 2023-11-17 | 无锡星微科技有限公司 | Multi-freedom-degree moving device for wafer detection |
| CN117373942A (en) * | 2023-12-07 | 2024-01-09 | 苏州瑞霏光电科技有限公司 | Wafer defect detection device and detection method |
| CN117594510A (en) * | 2023-11-27 | 2024-02-23 | 苏州赛美达半导体科技有限公司 | Wafer conveying device with accurate positioning |
-
2023
- 2023-04-13 CN CN202320815493.9U patent/CN219715533U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117080155A (en) * | 2023-10-13 | 2023-11-17 | 无锡星微科技有限公司 | Multi-freedom-degree moving device for wafer detection |
| CN117080155B (en) * | 2023-10-13 | 2024-04-09 | 无锡星微科技有限公司 | Multi-freedom-degree moving device for wafer detection |
| CN117594510A (en) * | 2023-11-27 | 2024-02-23 | 苏州赛美达半导体科技有限公司 | Wafer conveying device with accurate positioning |
| CN117594510B (en) * | 2023-11-27 | 2024-04-16 | 苏州赛美达半导体科技有限公司 | Wafer conveying device with accurate positioning |
| CN117373942A (en) * | 2023-12-07 | 2024-01-09 | 苏州瑞霏光电科技有限公司 | Wafer defect detection device and detection method |
| CN117373942B (en) * | 2023-12-07 | 2024-02-23 | 苏州瑞霏光电科技有限公司 | Wafer defect detection device and detection method |
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