CN113510610A - Crystal disc automatic feeding and expand membrane equipment - Google Patents
Crystal disc automatic feeding and expand membrane equipment Download PDFInfo
- Publication number
- CN113510610A CN113510610A CN202110871961.XA CN202110871961A CN113510610A CN 113510610 A CN113510610 A CN 113510610A CN 202110871961 A CN202110871961 A CN 202110871961A CN 113510610 A CN113510610 A CN 113510610A
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- wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
Abstract
The invention discloses automatic crystal disc feeding and film expanding equipment. The automatic production equipment can enable the fast batch production of the wafer blue film discs in the production process of semiconductor devices to replace a manual operation mode, has high efficiency, high quality and stable performance, reduces intermediate film expanding machine equipment, reduces the manual operation and production management cost, is convenient and fast production operation, is convenient for storing and storing wafer products, is favorable for environmental protection of the wafer products, effectively solves the quality problems of wafer contamination and the like, and has high production efficiency and stable product quality.
Description
Technical Field
The invention relates to the field of semiconductor processing and industrial automation, in particular to automatic crystal disc feeding and film expanding equipment.
Background
In the production process of semiconductor wafer products after wafer cutting and scribing, various blue film carriers are often needed because the blue film carriers have high cleanness, extremely low ionic impurities and moderate hardness, can effectively absorb vibration and stress, reduce the occurrence of fragments and have excellent thickness uniformity. The colloid developed particularly is not easy to generate residual colloid and hydrophilic colloid, if higher cleanliness is required after the colloid is torn, the colloid only needs to be cleaned by ultrapure water, and has the advantages of excellent time stability, excellent adhesion, good extensibility, easy chip pickup and the like. The wafer cutting blue film has the following purposes: the blue protective tape is used as a surface protective tape in the silicon wafer back grinding process in the IC/semiconductor manufacturing process; a loop surface protective film when polishing the back surface of a semiconductor silicon wafer/wafer (IC/semiconductor process). Because the blue protective film uses the special hydrophilic colloid which hardly pollutes the surface of the wafer, the process of cleaning the wafer can be omitted, the production cost and the impact on the environment can be reduced, the yield of the product is improved, and the requirement of reducing the cost is met.
In the manufacturing process of semiconductor devices, chips need to be quickly taken out from a blue film carrier disc for production and manufacturing in a quick and mass mode. The conventional method is that a wafer is placed in a blue film disc, then a semi-automatic film expanding machine is used for expanding a film of the blue film of the wafer, the wafer after the film expansion and stretching is transferred to a circular ring, and then the circular ring after the film expansion is manually transferred to be used by equipment such as a die bonder/a chip arranging machine and the like. The disadvantages and shortcomings of this technique are mainly shown in the following: firstly, film expanding is needed through a film expanding machine, and manual treatment is needed after the film expanding; secondly, the quality of the product changes along with human factors, and the quality is unstable; thirdly, the production transfer is easy to cause the contamination of the wafer, which affects the product quality. Fourthly, the production efficiency is extremely low, and the method cannot meet the requirement of batch production.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects in the prior art, the invention provides automatic crystal disc feeding and film expanding equipment. The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:
a wafer disc automatic feeding and film expanding device comprises a wafer disc lifting basket device, a lifting basket lifting platform mechanism, a clamping jaw linear motion mechanism, a clamping jaw, a wafer film expanding worktable and an XY axis linear module; wherein;
the wafer expansion worktable is arranged on the XY-axis linear module, and can move in an XY two-dimensional plane through the driving of the XY-axis linear module; the wafer film expanding worktable is used for expanding a film of a wafer blue film disc attached with a chip product;
the wafer tray lifting basket device is used for storing a wafer blue film tray with a chip product;
the lifting basket lifting platform mechanism is used for driving the wafer disc lifting basket device to move in the vertical direction;
the clamping jaw linear motion mechanism is arranged along the X-axis direction and used for driving the clamping jaw to clamp or release the wafer blue film disc so as to realize the transmission of the wafer blue film disc between the wafer expanding worktable and the wafer disc basket lifting device.
Furthermore, the wafer disc basket lifting device comprises a lifting support plate device, a basket anti-position stop block and a basket anti-loose clamping device, the wafer blue film disc is placed on the lifting support plate device, and the position fixation is realized through the basket anti-loose clamping device and the basket anti-position stop block which are arranged on the edge of the lifting support plate device; and the lifting support plate device is also provided with a basket checking sensor for detecting whether the wafer blue film disc exists on the lifting support plate device.
Furthermore, the lifting basket lifting platform mechanism comprises a supporting vertical plate, a mechanism mounting bottom plate, a wafer disc detection sensor, a linear guide rail, a drag chain device, a transmission motor, a synchronous belt wheel device and a transmission screw rod; wherein the content of the first and second substances,
the mechanism supporting vertical plate is arranged on the mechanism mounting bottom plate, the linear guide rail is arranged at the top of the mechanism supporting vertical plate, the transmission screw rod is arranged in the linear guide rail, and a sliding nut on the transmission screw rod is connected with the lifting carrier plate device through the drag chain device; the transmission motor and the synchronous belt pulley device are arranged on the mechanism supporting vertical plate and are used as a driving structure of the transmission screw rod, the output end of the transmission motor is connected with the driving input end of the transmission screw rod through the synchronous belt pulley device to drive the transmission screw rod to rotate, so that the sliding nut of the transmission screw rod slides along the screw rod to realize the traction of the drag chain device, and finally the drag chain device drives the lifting support plate device to do lifting motion; and one side of the mechanism supporting vertical plate is provided with the wafer disc detection sensor which is used for detecting whether the wafer blue film disc reaches a specified position.
Further, the clamping jaw linear motion mechanism comprises a support, a linear guide rail and a sliding block, wherein the linear guide rail is installed on the support, and the sliding block is installed in the linear guide rail.
Further, the wafer die expanding worktable comprises a wafer working bottom plate, a rotary thin-wall bearing, a bearing outer ring pressing block, a wafer die expanding air cylinder, a transmission gear ring, a transmission belt, a belt tension guide wheel, an origin sensor, a motor transmission gear, a tension wheel fixing shaft, a motor mounting base, an angle correction motor, a wafer die expanding inner ring, a linear bearing guide device, an air cylinder transmission pressing plate, a wafer disc, an air cylinder transmission connecting shaft, a wafer disc lower limit stop block and a wafer disc upper limit stop block; the rotary thin-wall bearing is fixedly installed on the wafer working bottom plate through the bearing outer ring pressing block, the transmission gear ring is fixedly installed on the wafer working bottom plate, the wafer expansion inner ring is installed on the inner ring of the transmission gear ring, the origin sensor is installed on the transmission gear ring, a small hole is formed in the wafer expansion inner ring, the wafer expansion air cylinder penetrates through the small hole to be connected with the linear bearing guide device, the air cylinder transmission connecting shaft is arranged on the linear bearing guide device, the air cylinder transmission pressing plate is clamped on the bearing guide device, the wafer lower limit stop block and the wafer upper limit stop block are used for fixing the wafer blue film disc on the wafer expansion inner ring, the motor installation base is installed on the wafer working bottom plate, and the motor transmission gear is installed on the motor installation base, the belt tensioning guide wheel is provided with a hexagonal through hole along the axis, the lower bottom plate of the angle correction motor is connected with a raised hexagonal prism, the hexagonal through hole in the belt tensioning guide wheel is connected with the hexagonal prism in the motor transmission gear in an inserting mode, the transmission belt is sleeved on the transmission gear ring and the motor transmission gear, and the tensioning wheel fixing shaft is connected with the belt tensioning guide wheel in an inserting mode.
Furthermore, a clamping jaw detection sensor is further arranged on the clamping jaw.
Furthermore, a basket checking sensor is arranged on the wafer disc basket lifting device.
Furthermore, a wafer disc detection sensor is also arranged on the lifting support plate device.
Furthermore, an in-place detection sensor is further arranged on the wafer expansion worktable.
Compared with the prior art, the invention has the following beneficial effects:
1. the method can realize rapid batch production of the wafer blue film disc in the production process of the semiconductor device, replaces a manual operation mode, and has high efficiency, high quality and stable performance.
2. The film expanding machine equipment in the middle is reduced, the manual operation and the production management cost are reduced, the quality of products cannot be unstable due to the fact that the quality of the products changes along with human factors, and meanwhile, the wafer products are convenient to store and use in convenient and fast production operation.
3. The method is beneficial to environmental protection of the wafer product, effectively solves the quality problems of wafer contamination and the like, and has high production efficiency and stable product quality.
Drawings
FIG. 1 is a perspective view of an automatic wafer loading and film expanding apparatus according to an embodiment;
FIG. 2 is a top view of an automatic wafer loading and film expanding apparatus according to an embodiment;
FIG. 3 is a perspective view of a wafer carrier device and a carrier lift mechanism according to an embodiment;
FIG. 4 is a perspective view of a wafer film expanding apparatus according to an embodiment;
FIG. 5 is a schematic view of a structure above a wafer work substrate according to an embodiment;
FIG. 6 is an exploded view of the structure shown in FIG. 5;
fig. 7 is a flowchart illustrating the operation of the automatic wafer loading and film expanding apparatus according to this embodiment.
In the figure: 1. a wafer disc lifting device, 2, a lifting and lowering platform mechanism, 201, a mechanism supporting vertical plate, 202, a mechanism supporting vertical plate, 203, a lifting and lowering carrier plate device, 204, a lifting and lowering position preventing stop, 205, a lifting and lowering anti-loose clamping device, 206, a wafer disc detection sensor, 207, a linear guide rail, 208, a drag chain device, 209, a transmission motor, 210, a synchronous pulley device, 211, a transmission screw rod, 3, a clamping jaw linear motion mechanism, 301, a bracket, 302, a linear guide rail, 303, a sliding block, 4, a clamping jaw, 5, a wafer blue film disc, 6, a wafer film expanding worktable, 601, a wafer working bottom plate, 602, a rotating thin-wall bearing, 603, a bearing outer ring pressing block, 604, a wafer film expanding cylinder, 605, a transmission gear ring, 606, a transmission belt, a tension guide wheel, 607, a belt tension wheel, 608, an origin sensor, 609, a motor transmission gear, 610, a fixed shaft, 611 and a motor mounting base, 612. an angle correction motor 613, a wafer expansion inner ring 614, a linear bearing guide device 615, a cylinder transmission pressure plate 616, a wafer disc 617, a cylinder transmission connecting shaft 618, a wafer disc lower limit stop 619, a wafer disc upper limit stop 620 and an in-place detection sensor; 7. XY axis line module, 701, X axis line module, 702, Y axis line module.
Detailed Description
The present invention is further illustrated by the following description in conjunction with the accompanying drawings and the specific embodiments, it is to be understood that these examples are given solely for the purpose of illustration and are not intended as a definition of the limits of the invention, since various equivalent modifications will occur to those skilled in the art upon reading the present invention and fall within the limits of the appended claims.
Fig. 1 to 2 show a three-dimensional structure diagram of an automatic wafer disc feeding and film expanding apparatus, which includes a wafer disc basket device 1, a basket lifting table mechanism 2, a clamping jaw linear motion mechanism 3, a clamping jaw 4, a wafer film expanding worktable 6, and an XY axis linear module 7. Wherein: the wafer disc lifting basket device 1 and the lifting basket lifting platform mechanism 2 form a wafer disc feeding/discharging mechanism; the clamping jaw linear motion mechanism 4 and the clamping jaw 3 form a wafer disc carrying mechanism; the wafer film expanding worktable 6 and the XY axis linear module 7 form a wafer film expanding device. The following describes each constituent mechanism in the present apparatus in detail.
The wafer basket device 1 is used for storing a wafer blue film disk 5 with a chip product, and the structure of the wafer blue film disk device is shown in fig. 3, and mainly comprises a lifting support plate device 203, a basket anti-position stopper 204 and a basket anti-loose clamping device 205, wherein the wafer blue film disk 5 is placed on the lifting support plate device 203, and the position fixation is realized through the basket anti-loose clamping device 205 and the basket anti-position stopper 204 arranged at the edge of the lifting support plate device 203. A basket checking sensor (which may be a pressure sensor or other detection device) is further disposed on the lifting carrier plate device 203 for detecting whether the wafer blue film tray 5 is on the lifting carrier plate device 203.
The basket lifting mechanism 2 is used for driving the wafer tray basket device 1 to move in the vertical direction, and the structure of the basket lifting mechanism is shown in fig. 3, and comprises: the mechanism comprises a mechanism supporting vertical plate 201, a mechanism mounting base plate 202, a wafer tray detection sensor 206, a linear guide rail 207, a drag chain device 208, a transmission motor 209, a synchronous pulley device 210 and a transmission screw rod 211.
The mechanism supporting vertical plate 201 is installed on the mechanism installing bottom plate 202, the linear guide rail 207 is installed on the top of the mechanism supporting vertical plate 201, the transmission screw rod 211 is installed in the linear guide rail 207, and a sliding nut on the transmission screw rod 211 is connected with the lifting support plate device 203 through the drag chain device 208. The transmission motor 209 and the synchronous pulley device 210 are arranged on the mechanism supporting vertical plate 201 and used as a driving structure of the transmission screw 211, the output end of the transmission motor 209 is connected with the driving input end of the transmission screw 211 through the synchronous pulley device 210 to drive the transmission screw 211 to rotate, so that the sliding nut of the transmission screw 211 slides along the screw, the drag chain device 208 is dragged, and finally the drag chain device 208 drives the lifting support plate device 203 to do lifting motion. A wafer disc detection sensor 206 is further disposed on one side of the vertical mechanism supporting plate 201, and is used for detecting whether the wafer blue film disc 5 reaches a designated position.
A wafer film expanding device composed of a wafer film expanding worktable 6 and an XY-axis linear module 7 is shown in fig. 4, wherein the XY-axis linear module 7 comprises an X-axis linear module 701 and a Y-axis linear module 702, a slide rail of the Y-axis linear module 702 is fixed on a slide block of the X-axis linear module 701, and the slide block of the Y-axis linear module 702 is fixedly connected with the wafer film expanding worktable 6, so that the wafer film expanding worktable 6 can move in a two-dimensional plane XY.
The specific structure of the wafer film expanding worktable 6 is shown in fig. 5 to 6, and comprises: the wafer working base plate 601, the rotating thin-wall bearing 602, the bearing outer ring pressing block 603, the wafer mold expanding cylinder 604, the transmission gear ring 605, the transmission belt 606, the belt tension guide wheel 607, the origin sensor 608, the motor transmission gear 609, the tension wheel fixing shaft 610, the motor mounting base 611, the angle correction motor 612, the wafer mold expanding inner ring 613, the linear bearing guide 614, the cylinder transmission pressing plate 615, the wafer disk 616, the cylinder transmission connecting shaft 617, the wafer disk lower limit block 618, the wafer disk upper limit block 619 and the in-place detection sensor 620, wherein the rotating thin-wall bearing 602 is fixedly mounted on the wafer working base plate 601 through the bearing outer ring pressing block 603, the transmission gear ring 605 and the wafer working base plate 601 are fixedly mounted, the wafer mold expanding inner ring 613 is mounted on the inner ring of the transmission gear ring 605, the origin sensor 608 is mounted on the transmission gear ring 605, and the wafer mold expanding inner ring 613 is provided with a small hole, a wafer die expanding cylinder 604 penetrates through a small hole on a wafer die expanding inner ring 613 to be connected with a wafer disc of a linear bearing guide device wafer disc 614 in a sliding manner, a cylinder transmission connecting shaft wafer disc 617 is arranged on the linear bearing guide device 614, a cylinder transmission pressing plate 615 is clamped on the bearing guide device 614, a wafer disc lower limit stop 618 is arranged on the wafer die expanding inner ring 613, the wafer disc 616 is arranged on the wafer disc lower limit stop 618, a wafer disc upper limit stop 619 is arranged on the wafer disc 616, a motor mounting base 611 is arranged on a wafer working bottom plate 601, a small round hole is arranged on the motor mounting base 611, a motor transmission gear 609 is arranged in the small round hole on the motor mounting base 611, a hexagonal through hole is arranged along the axial line of the belt tension guide wheel 607, a raised hexagonal prism is connected to a lower bottom plate of an angle correction motor 612, and the hexagonal through hole on the belt tension guide wheel 607 is spliced with the hexagonal prism on the motor transmission gear 609, the driving belt 606 is sleeved on the driving gear ring 505 and the motor driving gear 609, and the tensioning wheel fixing shaft 610 is inserted with the belt tensioning guide wheel 607. When the die is used, the wafer blue film disc 5 with the chip product is placed above the wafer die expanding inner ring 613, and the outer ring of the wafer blue film disc 5 moves downwards to enable the blue film to contact the upper surface of the wafer die expanding inner ring 613; when the wafer blue film disk continues to move downwards, the in-place detection sensor 620 detects the position of the wafer blue film disk under the blocking of the upper surface of the inner ring of the wafer blue film expanding, the chip position of the wafer blue film expanding is stretched, the chip spacing of the wafer blue film expanding is pulled, the blue film adhesion is reduced, and the production process requirements are met.
As shown in fig. 1 to 2, a jaw moving mechanism 3 is provided for driving a jaw 4 to move in the X-axis direction. The clamping jaw movement mechanism 3 comprises a support 301, a linear guide rail 302 and a sliding block 303, wherein the linear guide rail 302 is installed on the support 301, the sliding block 303 is installed in the linear guide rail 302, and the clamping jaw 4 is fixed on the sliding block 303. Clamping jaw 4 is used for pressing from both sides to get wafer blue membrane dish 5, is provided with clamping jaw detection sensor on clamping jaw 4 for whether there is wafer blue membrane dish 5 below the detection clamping jaw.
The whole equipment is also provided with a controller (not shown in the figure for simplifying the drawing), the controller is connected with the wafer tray detection sensor 26, the basket checking sensor, the in-place detection sensor 620 and the clamping jaw detection sensor, and driving signals of the basket lifting platform mechanism 2, the wafer film expanding worktable 6 and the clamping jaw linear motion mechanism 3 are generated according to signals collected by the wafer tray detection sensor 26 and the basket checking sensor. The specific workflow of the whole device is shown in fig. 7, and includes the following steps:
when the basket inspection sensor detects that the wafer blue film disk 5 is placed on the lifting support plate device 203, the controller starts the transmission motor 209, and at this time, the transmission screw rod 211 is driven to start working, and the lifting support plate device 203 is driven to rise to a specified height (for example, the lifting support plate device is flush with the top of the wafer film expanding workbench or the uniform horizontal height of the clamping jaw linear motion mechanism 3) through the drag chain device 208. At this time, after the wafer blue film disk detection sensor 26 detects the wafer blue film disk 5 on the wafer disc basket device 1, the controller drives the clamping jaw linear motion mechanism 3 to work (for simplifying the drawing, a driving motor of the clamping jaw linear motion mechanism 3 is not shown), at this time, the clamping jaw 4 slides in the X-axis direction, when the clamping jaw moves to the upper side of the wafer blue film disk 5, the clamping jaw detection sensor on the clamping jaw 4 detects that the wafer blue film disk 5 is arranged below, at this time, the driver drives the clamping jaw 4 to perform a grabbing action, and drives the clamping jaw 4 to move to the upper side of the wafer mold expanding worktable 6 after the grabbing is completed, the positioning of the clamping jaw 4 is realized through the in-place detection sensor 620 on the wafer mold expanding worktable, and then the wafer blue film disk 5 is placed on the wafer mold expanding worktable 6. The wafer film expanding worktable 6 expands and stretches the wafer blue film disc 5, so that the chip spacing of the wafer blue film disc is expanded, the blue film adhesion is reduced, and the chips are easy to pick up; when the chips in the wafer blue film disk 5 are taken out, the wafer mold expanding cylinder 604 of the wafer mold expanding worktable 6 releases the pressure and returns to the original waiting position, the driver drives the clamping jaw 4 again to take the wafer blue film disk 5, and the wafer blue film disk 5 is put back to the wafer disk basket lifting device. And then, the gripping process is repeated by the gripping jaws 4, and the next wafer blue film disk 5 disk to be subjected to film expansion is gripped.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (9)
1. The utility model provides a crystal disc automatic feeding and expand membrane equipment which characterized in that: comprises a wafer disc lifting basket device, a lifting basket lifting platform mechanism, a clamping jaw linear motion mechanism, a clamping jaw, a wafer mold expanding worktable and an XY axis linear module; wherein;
the wafer expansion worktable is arranged on the XY-axis linear module, and can move in an XY two-dimensional plane through the driving of the XY-axis linear module; the wafer film expanding worktable is used for expanding a film of a wafer blue film disc attached with a chip product;
the wafer tray lifting basket device is used for storing a wafer blue film tray with a chip product;
the lifting basket lifting platform mechanism is used for driving the wafer disc lifting basket device to move in the vertical direction;
the clamping jaw linear motion mechanism is arranged along the X-axis direction and used for driving the clamping jaw to clamp or release the wafer blue film disc so as to realize the transmission of the wafer blue film disc between the wafer expanding worktable and the wafer disc basket lifting device.
2. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: the wafer disc basket lifting device comprises a lifting support plate device, a basket anti-position stop block and a basket anti-loosening clamping device, wherein the wafer blue film disc is placed on the lifting support plate device, and the position fixation is realized through the basket anti-loosening clamping device and the basket anti-position stop block which are arranged on the edge of the lifting support plate device; and the lifting support plate device is also provided with a basket checking sensor for detecting whether the wafer blue film disc exists on the lifting support plate device.
3. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 2, wherein: the lifting basket lifting platform mechanism comprises a supporting vertical plate, a mechanism mounting bottom plate, a wafer tray detection sensor, a linear guide rail, a drag chain device, a transmission motor, a synchronous belt wheel device and a transmission screw rod; wherein the content of the first and second substances,
the mechanism supporting vertical plate is arranged on the mechanism mounting bottom plate, the linear guide rail is arranged at the top of the mechanism supporting vertical plate, the transmission screw rod is arranged in the linear guide rail, and a sliding nut on the transmission screw rod is connected with the lifting carrier plate device through the drag chain device; the transmission motor and the synchronous belt pulley device are arranged on the mechanism supporting vertical plate and are used as a driving structure of the transmission screw rod, the output end of the transmission motor is connected with the driving input end of the transmission screw rod through the synchronous belt pulley device to drive the transmission screw rod to rotate, so that the sliding nut of the transmission screw rod slides along the screw rod to realize the traction of the drag chain device, and finally the drag chain device drives the lifting support plate device to do lifting motion; and one side of the mechanism supporting vertical plate is provided with the wafer disc detection sensor which is used for detecting whether the wafer blue film disc reaches a specified position.
4. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: the clamping jaw linear motion mechanism comprises a support, a linear guide rail and a sliding block, wherein the linear guide rail is installed on the support, and the sliding block is installed in the linear guide rail.
5. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: the wafer die expanding worktable comprises a wafer working bottom plate, a rotary thin-wall bearing, a bearing outer ring pressing block, a wafer die expanding air cylinder, a transmission gear ring, a transmission belt, a belt tension guide wheel, an origin sensor, a motor transmission gear, a tensioning wheel fixing shaft, a motor mounting base, an angle correction motor, a wafer die expanding inner ring, a linear bearing guide device, an air cylinder transmission pressing plate, a wafer disc, an air cylinder transmission connecting shaft, a wafer disc lower limit stop block and a wafer disc upper limit stop block; the rotary thin-wall bearing is fixedly installed on the wafer working bottom plate through the bearing outer ring pressing block, the transmission gear ring is fixedly installed on the wafer working bottom plate, the wafer expansion inner ring is installed on the inner ring of the transmission gear ring, the origin sensor is installed on the transmission gear ring, a small hole is formed in the wafer expansion inner ring, the wafer expansion air cylinder penetrates through the small hole to be connected with the linear bearing guide device, the air cylinder transmission connecting shaft is arranged on the linear bearing guide device, the air cylinder transmission pressing plate is clamped on the bearing guide device, the wafer lower limit stop block and the wafer upper limit stop block are used for fixing the wafer blue film disc on the wafer expansion inner ring, the motor installation base is installed on the wafer working bottom plate, and the motor transmission gear is installed on the motor installation base, the belt tensioning guide wheel is provided with a hexagonal through hole along the axis, the lower bottom plate of the angle correction motor is connected with a raised hexagonal prism, the hexagonal through hole in the belt tensioning guide wheel is connected with the hexagonal prism in the motor transmission gear in an inserting mode, the transmission belt is sleeved on the transmission gear ring and the motor transmission gear, and the tensioning wheel fixing shaft is connected with the belt tensioning guide wheel in an inserting mode.
6. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: and a clamping jaw detection sensor is also arranged on the clamping jaw.
7. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: and a basket checking sensor is arranged on the wafer disc basket device.
8. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: and a wafer disc detection sensor is also arranged on the lifting support plate device.
9. The automatic loading and film expanding equipment for the wafer disc as claimed in claim 1, wherein: and an in-place detection sensor is also arranged on the wafer expansion worktable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110871961.XA CN113510610A (en) | 2021-07-30 | 2021-07-30 | Crystal disc automatic feeding and expand membrane equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110871961.XA CN113510610A (en) | 2021-07-30 | 2021-07-30 | Crystal disc automatic feeding and expand membrane equipment |
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| CN113510610A true CN113510610A (en) | 2021-10-19 |
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| CN202110871961.XA Pending CN113510610A (en) | 2021-07-30 | 2021-07-30 | Crystal disc automatic feeding and expand membrane equipment |
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| CN114566450A (en) * | 2022-03-02 | 2022-05-31 | 珠海市硅酷科技有限公司 | Wafer loading device |
| CN114918157A (en) * | 2022-05-25 | 2022-08-19 | 佑光智能半导体科技(深圳)有限公司 | Blue film sorting machine and sorting method |
| CN115172206A (en) * | 2022-06-02 | 2022-10-11 | 深圳华工量测工程技术有限公司 | Wafer production equipment and method |
| CN115588639A (en) * | 2022-12-12 | 2023-01-10 | 常州铭赛机器人科技股份有限公司 | Chip supply device and chip supply method |
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