CN115588639B

CN115588639B - Chip supply device and chip supply method

Info

Publication number: CN115588639B
Application number: CN202211588458.4A
Authority: CN
Inventors: 郜福亮; 曲东升; 李长峰; 史晔鑫; 彭方方; 胡君君; 苗虎
Original assignee: Shanghai Mingwei Terui Semiconductor Technology Co ltd; Changzhou Mingseal Robotic Technology Co Ltd
Current assignee: Shanghai Mingwei Terui Semiconductor Technology Co ltd; Changzhou Mingseal Robotic Technology Co Ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-03-10
Anticipated expiration: 2042-12-12
Also published as: CN115588639A

Abstract

The invention discloses a chip supply device and a chip supply method, comprising the following steps: a platform; the wafer position adjusting mechanism is arranged on the platform and is used for driving the wafer to carry out position adjustment along the y direction, the x direction and the circumferential direction; the wafer expanding mechanism is arranged on the wafer position adjusting mechanism and used for stretching a wafer film on the wafer to expand the distance between adjacent chips; the chip ejection device is arranged on the platform and is positioned below the wafer expanding mechanism, and the chip ejection device is used for ejecting a chip from the wafer film; and the wafer loading and unloading mechanism is arranged on the platform and is used for grabbing the wafer with the chips to the wafer expanding mechanism from the wafer box or grabbing the wafer without the chips to the wafer box from the wafer expanding mechanism. The invention can automatically supply chips on the wafer, improves the automation degree and improves the production and processing efficiency.

Description

Chip supply device and chip supply method

Technical Field

The invention belongs to the technical field of semiconductor supply, and particularly relates to a chip supply device and a chip supply method.

Background

The die bonder sucks the chip on the wafer from the die supply position through the suction nozzle, then moves the chip to the die bonding position on the lead frame, and accurately installs the chip on the lead frame to realize die bonding. The wafer is arranged in the wafer ring, the chip is ejected out through the wafer taking mechanism, and the chip is sucked and moved by the suction nozzle. The lead frame is conveyed to a mounting position through a conveying mechanism. And pushing the lead frame after die bonding into a material box for blanking.

The wafer generally includes a wafer ring (generally made of stainless steel) for providing a supporting function, the wafer ring is covered with a wafer film (also called a blue film), and a plurality of chips which are arranged in order and have completed a dicing process are placed on the wafer film. The wafers correspond to different sizes, such as 6 inches, 8 inches, 12 inches, etc. The mounting of chips on lead frames is an important process in the semiconductor product processing industry. With the improvement of semiconductor process, the chips become smaller and smaller, which brings more challenges to the automatic feeding. The following disadvantages are common to current chip feeding equipment: 1. the wafer automatic identification device can only feed chips on wafers with single sizes, cannot be adapted to wafers with other sizes, and can only be used for replacing another wafer fixing machine for operation or replacing the whole wafer expansion mechanism, but the existing structure is complicated to replace, and after replacement, each electric component needs to be wired again, and the whole electric control system needs to be subjected to re-identification, resetting and calibration operations, so that the operation is very complicated; 2. the wafer film and the wafer ring which have taken out the chip cannot be recovered into the wafer box, the wafer box and the wafer ring are separately conveyed, extra facility conveying equipment is needed, and waste and cost increase in equipment space are caused.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art.

Therefore, the invention provides a chip supply device which has the advantage of automatically supplying chips.

The chip supply apparatus according to an embodiment of the present invention includes: a platform; the wafer position adjusting mechanism is arranged on the platform and is used for driving the wafer to carry out position adjustment along the y direction, the x direction and the circumferential direction; the wafer expanding mechanism is arranged on the wafer position adjusting mechanism and used for stretching a wafer film on a wafer to expand the distance between adjacent chips; the chip ejection device is arranged on the platform, is positioned below the crystal expansion mechanism and is used for ejecting a chip from a wafer film; the wafer loading and unloading mechanism is arranged on the platform and is used for grabbing wafers with chips from a wafer box to the wafer expanding mechanism; the wafer expanding mechanism comprises: the jacking ring is detachably arranged on the wafer position adjusting mechanism; the wafer mounting mechanism is arranged on the jacking ring and used for placing wafers, and the size of the wafer mounting mechanism is matched with the size of wafers with different sizes; the active unit is positioned on the side surface of the wafer mounting mechanism and can be close to or far away from the wafer mounting mechanism; after the driving unit approaches the wafer mounting mechanism, the driving unit establishes a transmission relationship with the wafer mounting mechanism and can drive the wafer mounting mechanism to approach or leave the jacking ring so as to finish the wafer expanding operation; and after the active unit is far away from the wafer mounting mechanism, the active unit is disconnected from the transmission relation with the wafer mounting mechanism.

The wafer film expanding device has the beneficial effects that the structure is simple, the wafer film expanding device can be integrated in a die bonder, timely adaptation is carried out when wafers of 6 inches, 8 inches or 12 inches are operated, the wafers are taken out from a wafer box and placed in the wafer expanding mechanism, then a wafer film is stretched through the wafer expanding mechanism, so that the distance between adjacent chips is expanded, then the position and the angle of the whole wafer are adjusted through the wafer position adjusting mechanism, so that the position and the angle of the chips during feeding are obtained, and then the chips on the wafers are jacked up through the chip jacking device, so that the chips are picked up by the mounting mechanism of the die bonder. The efficiency and the precision of feed have been improved.

According to an embodiment of the present invention, the wafer loading and unloading mechanism includes: the lifting mechanism is arranged on the platform and positioned on one side of the wafer expanding mechanism, the wafer box is arranged on the lifting mechanism, a plurality of wafers are stacked in the wafer box, and the lifting mechanism drives the wafer box to move up and down; the picking and placing mechanism is arranged on the platform and is positioned on one side of the wafer expanding mechanism, and the picking and placing mechanism is used for grabbing the wafer to move between the wafer box and the wafer expanding mechanism.

According to one embodiment of the present invention, the elevating mechanism includes: a seat plate vertically mounted on the platform; a guide rail slider assembly disposed on the seat pan; the lead screw nut assembly is arranged on the seat plate and is parallel to the guide rail sliding block assembly; a mounting seat, a slide block on the guide rail slide block component and a nut on the screw rod nut component are connected with the mounting seat, the wafer box is placed on the mounting seat.

According to one embodiment of the invention, the pick and place mechanism comprises: the support is arranged on the platform, and a cross beam is arranged on the support; the synchronous belt assembly is arranged on the cross beam; the first linear guide rail is arranged on the cross beam and is parallel to the synchronous belt assembly; clamping jaw support, clamping jaw support's one end with hold-in range subassembly links to each other, clamping jaw support's one end with first linear guide slides and links to each other, clamping jaw assembly is installed to clamping jaw support's the other end.

According to one embodiment of the invention, the jaw assembly comprises: the lifting cylinder is arranged at the other end of the clamping jaw bracket; the first mounting block is connected with the output end of the lifting cylinder; the lower clamping jaw is mounted on the first mounting block; the upper clamping jaw is arranged on the first mounting block and located above the lower clamping jaw, and the upper clamping jaw can be close to or far away from the lower clamping jaw.

According to an embodiment of the present invention, the wafer position adjustment mechanism includes: the y-direction moving mechanism is arranged on the platform; the x-direction moving mechanism is arranged on the y-direction moving mechanism, and the y-direction moving mechanism drives the x-direction moving mechanism to move along the y direction; the circumferential rotating mechanism is installed on the x-direction moving mechanism, the x-direction moving mechanism drives the circumferential rotating mechanism to move along the x direction, the circumferential rotating mechanism is provided with a crystal expanding mechanism, and the circumferential rotating mechanism drives the crystal expanding mechanism to rotate in the circumferential direction.

According to one embodiment of the present invention, the y-direction moving mechanism includes: the y-direction linear guide rail is arranged on the platform; the y-direction moving plate is positioned above the platform, and the y-direction moving plate is connected with the platform in a sliding manner through the y-direction linear guide rail; the y-direction linear motor is installed on the platform, and the output end of the y-direction linear motor is connected with the y-direction moving plate.

According to one embodiment of the invention, the x-direction moving mechanism comprises: the x-direction linear guide rail is arranged on the y-direction moving plate; the x-direction moving plate is positioned above the y-direction moving plate, and the x-direction moving plate is connected with the y-direction moving plate in a sliding manner through the x-direction linear guide rail; the x-direction linear motor is installed on the y-direction moving plate, and the output end of the x-direction linear motor is connected with the x-direction moving plate.

According to an embodiment of the present invention, the circumferential rotation mechanism includes: the rollers are uniformly arranged on the x-direction moving plate along the circumferential direction; the driving ring is arranged on the outer side of the rollers and is in rolling connection with the rollers; the first synchronous belt is in transmission connection with the driving ring; the motor is arranged on the x-direction moving plate, and the output end of the motor is in transmission connection with the first synchronous belt; the encoder is installed on the x-direction moving plate and connected with the first synchronous belt in a transmission mode.

According to one embodiment of the invention, the wafer expanding mechanism is arranged on the driving ring of the wafer position adjusting mechanism, when wafers with different sizes are processed, the wafer expanding mechanism with corresponding sizes is replaced, the jacking ring is detachably connected with the driving ring, the upper surface of the jacking ring is provided with an annular bulge, the wafer mounting mechanism is positioned on the outer side of the annular bulge, and when the wafer mounting mechanism is close to the jacking ring, a wafer film on the wafer is jacked up by the annular bulge.

According to one embodiment of the present invention, the wafer mounting mechanism includes: the pressure plate base is positioned above the jacking ring; the two pressing plates are oppositely arranged and are arranged on the pressing plate base, the clamping jaw assembly moves between the two pressing plates, and the wafer is clamped between the pressing plate base and the pressing plates; the height adjusting units are uniformly arranged along the circumferential direction and are all positioned between the pressing plate base and the jacking rings so as to adjust the distance between the pressing plate base and the jacking rings.

According to one embodiment of the invention, a driven unit and a tensioning unit are arranged on the pressure plate base, the tensioning unit and the plurality of height adjusting units are in transmission connection with the driven unit, the driven unit is arranged opposite to the driving unit, and after the driving unit approaches, the driven unit is in transmission connection with the driving unit.

According to one embodiment of the present invention, the chip ejection apparatus includes: the lifting mounting base is mounted on the platform, a wafer film is arranged above the platform, and a plurality of chips are placed on the wafer film; the lifting assembly is arranged on the lifting mounting seat; the ejection assembly is arranged on the lifting assembly, the lifting assembly drives the ejection assembly to move up and down to be close to or far away from the wafer film, the ejection assembly is provided with a housing assembly and an ejector pin arranged in the housing assembly, negative pressure is arranged in the housing assembly to downwards adsorb the wafer film, and the ejector pin can move upwards and protrude out of the housing assembly to upwards eject the chip.

According to an embodiment of the present invention, a chip supplying method for supplying chips by using the above chip supplying apparatus includes the steps of: the method comprises the following steps: determining the size of a wafer to be supplied, and placing a corresponding wafer box on a wafer loading and unloading mechanism according to the size of the wafer; step two: installing a corresponding wafer installation mechanism on the wafer position adjusting mechanism according to the size of the wafer; step three: the wafer loading and unloading mechanism grabs and places the wafer in the wafer box on the wafer expanding mechanism; step four: the wafer expanding mechanism stretches the wafer film to increase the distance between chips on the wafer film; step five: the wafer position adjusting mechanism moves the chips to be right above the chip ejection device, the angle of the chips is adjusted at the same time, the chip ejection device ejects the chips upwards while adsorbing the wafer film downwards so as to be convenient for taking the chips away, and the step is repeated until all the chips on the wafer are taken away; step six: the wafer position adjusting mechanism resets, and the wafer loading and unloading mechanism grabs the wafer back into the wafer box.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments with reference to the accompanying drawings, in which:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the elevating mechanism;

FIG. 3 is a schematic view of the structure of FIG. 2 from another angle;

FIG. 4 is a schematic structural diagram of the pick and place mechanism;

FIG. 5 is a schematic view of the timing belt assembly at the driven wheel;

FIG. 6 is a schematic view of the timing belt assembly at the drive pulley;

FIG. 7 is a schematic view of the jaw assembly;

FIG. 8 is a schematic structural diagram of a wafer position adjustment mechanism according to the present invention;

FIG. 9 is a schematic structural view of a y-direction moving mechanism;

FIG. 10 is a schematic view of the structure of the x-direction moving mechanism;

FIG. 11 is a schematic structural view of a circumferential rotation mechanism;

FIG. 12 is a schematic view of the structure of the roller;

FIG. 13 is a cross-sectional structural view of the drive ring;

FIG. 14 is a partial structural schematic view of the drive ring;

FIG. 15 is a schematic structural view of the wafer expanding mechanism of the present invention;

FIG. 16 is a schematic view of another embodiment of the present invention;

FIG. 17 is a schematic view of a portion of the structure of FIG. 16;

fig. 18 is a cross-sectional structural schematic view of the height adjusting unit;

FIG. 19 is a cross-sectional structural schematic of the tension unit;

FIG. 20 is a schematic diagram of the structure of an active cell;

fig. 21 is a cross-sectional structural view of an active cell;

FIG. 22 is a schematic view of the active unit after installation;

fig. 23 is a schematic view of the mounting position of the chip ejector of the present invention;

FIG. 24 is a schematic structural view of a chip ejector according to the present invention;

FIG. 25 is a schematic view of the structure of FIG. 24 from another angle;

FIG. 26 is a schematic view of a portion of the structure of FIG. 25;

FIG. 27 is a cross-sectional structural schematic view of a leveling bolt assembly;

FIG. 28 is a schematic structural view of the ejector assembly;

FIG. 29 is a schematic view of the internal cross-section of the housing assembly;

FIG. 30 is a top schematic view of the housing assembly;

FIG. 31 is a schematic view showing a state where a wafer film is being pulled and pushed;

reference numerals:

the device comprises a platform 40, a wafer box 401, a lifting mechanism 41, a picking and placing mechanism 42, a seat plate 411, a guide rail sliding block assembly 412, a screw nut assembly 413, a first limiting block 414, a mounting seat 415, a motor 416, a coupling 417, a second limiting block 418, an optoelectronic switch 419, a support 421, a cross beam 422, a synchronous belt assembly 423, a driven wheel mounting block 4231, a limiting optoelectronic switch 4233, a first linear guide rail 424, a clamping jaw support 425, a lifting air cylinder 426, a first mounting block 427, a lower clamping jaw 428, a pressing air cylinder 429, a second mounting block 4271, a second linear guide rail 4272, an upper clamping jaw 4281, a y-direction moving mechanism 44, an x-direction moving mechanism 45, a circumferential rotating mechanism 46, a y-direction linear guide rail 441, a base a y-direction linear motor 442, a y-direction moving plate 443, a y-direction photoelectric switch 444, a y-direction limit block 445, an x-direction linear guide rail 451, an x-direction linear motor 452, an x-direction moving plate 453, an x-direction photoelectric switch 454, an x-direction limit block 455, a roller 461, a driving ring 462, a first synchronous belt 463, a motor 464, an encoder 465, a tensioning bearing 466, a tensioning adjusting block 467, a circumferential photoelectric switch 468, a feeding rod 4531, a feeding guide block 4532, a feeding photoelectric switch 4533, a chip ejection device 47, an elevation mounting seat 471, an elevation assembly 472, an ejection assembly 473, an elevation screw rod 4721, an elevation slide block 4722, an elevation motor 4723, an elevation linear guide rail 4724, an elevation seat 4725 and an elevation limit block 4726, lifting detection photoelectricity 4727, ejection mounting block 4731, leveling bolt component 4732, gasket 47321, leveling bolt 47322, leveling nut 47323, locking bolt component 47324, ejection servo motor 4733, eccentric wheel 4734, bearing 4735, rotary baffle plate 4736, zero photoelectricity 4737, ejection block 4738, intermediate shaft 4739, shaft sleeve 47310, spring 47311, clamp 47312, ejection pin 47313, casing component 47314, pneumatic joint 47315, negative pressure hole 47316, intermediate hole 47317, and, the device comprises a fixing pin 4621, a crystal expansion mechanism 48, a magnetic switch assembly 481, a jacking ring 482, an annular protrusion 4821, a lower limit hook 4822, a locking wrench 483, a pressure plate base 484, an upper limit hook 4841, a pressure plate 485, a height adjusting unit 486, an adjusting screw 4861, a first synchronous belt pulley 4862, a tensioning unit 487, an eccentric shaft 4871, a second synchronous belt pulley 4872, a driven unit 488, a transmission shaft 4881, a driven gear 4882, a second synchronous belt 4883, a driving unit 489, a driving support 4891, a sliding rail assembly 4892, a close cylinder 4893, a driving motor 4894 and a transmission wheel set 4895.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The chip supply apparatus according to the embodiment of the present invention is described in detail below with reference to the drawings.

As shown in fig. 1 to 31, a chip supply apparatus according to an embodiment of the present invention includes: the wafer position adjusting mechanism is arranged on the platform 40 and used for driving the wafer to carry out position adjustment along the y direction, the x direction and the circumferential direction; the wafer expanding mechanism 48 is arranged on the wafer position adjusting mechanism, and the wafer expanding mechanism 48 is used for stretching a wafer film on the wafer to expand the distance between adjacent chips; the chip ejection device 47 is installed on the platform 40, the chip ejection device 47 is positioned below the wafer expanding mechanism 48, and the chip ejection device 47 is used for ejecting a chip from a wafer film; the wafer loading and unloading mechanism is arranged on the platform 40 and is used for grabbing wafers with chips from the wafer box 401 to the wafer expanding mechanism 48 or grabbing wafers without chips from the wafer expanding mechanism 48 to the wafer box 401; the wafer expanding mechanism 48 includes: the wafer positioning device comprises a jacking ring 482, a wafer mounting mechanism and a driving unit 489, wherein the jacking ring 482 is detachably mounted on a wafer position adjusting mechanism; the wafer mounting mechanism is arranged on the jacking ring 482 and used for placing wafers, and the size of the wafer mounting mechanism is matched with the wafers with different sizes; the active unit 489 is located at the side of the wafer mounting mechanism, and the active unit 489 can be close to or far away from the wafer mounting mechanism; after the active unit 489 approaches the wafer mounting mechanism, the active unit 489 establishes a transmission relationship with the wafer mounting mechanism and can drive the wafer mounting mechanism to approach or leave the lifting ring 482 to complete the wafer expanding operation; after the active unit 489 is moved away from the wafer mounting mechanism, the active unit 489 is disengaged from the wafer mounting mechanism.

That is, the wafer loading and unloading mechanism mainly supplies and unloads the whole wafer, the wafer with chips is taken out from the wafer box 401, the wafer is sent back to the wafer box 401 after the chips on the wafer are completely mounted, the cycle can be realized after the wafer box 401 is replaced with a new wafer box 401, the wafer is placed on the wafer expanding mechanism 48, the wafer expanding mechanism 48 expands the chip spacing on the wafer film by stretching the wafer film, so that the chip ejection device 47 can eject the chips conveniently, and the wafer position adjusting mechanism is mainly used for adjusting the positions of the wafer on the wafer expanding mechanism 48 and the wafer on the wafer expanding mechanism 48, so that the chips are aligned with the chip ejection device 47, and meanwhile, the chips on the wafer are aligned with the mounting positions of the chips on the lead frame, so that the chips can be ejected by the chip ejection device 47 conveniently.

Among them, as shown in fig. 8 to 14, for the wafer position adjusting mechanism:

the wafer position adjusting mechanism includes: a y-direction moving mechanism 44, an x-direction moving mechanism 45 and a circumferential rotating mechanism 46, wherein the y-direction moving mechanism 44 is arranged on the platform 40; the x-direction moving mechanism 45 is arranged on the y-direction moving mechanism 44, and the y-direction moving mechanism 44 drives the x-direction moving mechanism 45 to move along the y direction; the circumferential rotating mechanism 46 is installed on the x-direction moving mechanism 45, the x-direction moving mechanism 45 drives the circumferential rotating mechanism 46 to move along the x direction, the crystal expanding mechanism 48 is installed on the circumferential rotating mechanism 46, and the circumferential rotating mechanism 46 drives the crystal expanding mechanism 48 to rotate in the circumferential direction.

In other words, the y-direction moving mechanism 44 and the x-direction moving mechanism 45 in the wafer position adjusting mechanism are mainly used for adjusting the position of the chip on the horizontal plane, when a chip above the chip ejection device 47 is grabbed away for mounting, another chip needs to be moved above the chip ejection device 47 through the combined action of the y-direction moving mechanism 44 and the x-direction moving mechanism 45, the circumferential rotating mechanism 46 is used for controlling the rotation angle of the chip, the chip is generally square, the chip and the lead frame need to keep a corresponding angle for completing the mounting, and the angle of the chip can be adjusted through the circumferential rotating mechanism 46.

On this basis, the y-direction moving mechanism 44 includes: the y-direction linear guide rail 441, the y-direction moving plate 443 and the y-direction linear motor 442 are arranged on the platform 40, and the y-direction linear guide rail 441 is arranged on the platform 40; the y-direction moving plate 443 is positioned above the platform 40, and the y-direction moving plate 443 is connected with the platform 40 in a sliding manner through the y-direction linear guide rail 441; the y-direction linear motor 442 is mounted on the platform 40, and the output of the y-direction linear motor 442 is connected to the y-direction moving plate 443.

The y-direction linear guide 441 is preferably provided in two numbers, and the y-direction linear motor 442 is disposed between the two y-direction linear guide 441, so that stability of the y-direction moving plate 443 during movement is improved.

Further, two y-direction photoelectric switches 444 and two y-direction limit blocks 445 are mounted on the platform 40, the two y-direction photoelectric switches 444 are oppositely arranged along the y direction, the y-direction moving plate 443 triggers the y-direction photoelectric switches 444 when moving along the y direction, the two y-direction limit blocks 445 are oppositely arranged along the y direction, and the y-direction limit blocks 445 are used for abutting and limiting when the y-direction moving plate 443 moves along the y direction.

Furthermore, a magnetic scale is mounted on the lower surface of the y-direction moving plate 443 along the y-direction, and a reading head matched with the magnetic scale is mounted on the platform 40. This allows the movement distance of the y-direction moving plate 443 to be accurately measured, which facilitates accurate positioning.

In addition, the x-direction moving mechanism 45 includes: an x-direction linear guide 451, an x-direction moving plate 453 and an x-direction linear motor 452, wherein the x-direction linear guide 451 is provided on the y-direction moving plate 443; the x-direction moving plate 453 is located above the y-direction moving plate 443, and the x-direction moving plate 453 and the y-direction moving plate 443 are slidably connected by an x-direction linear guide 451; the x-direction linear motor 452 is mounted on the y-direction moving plate 443, and the output terminal of the x-direction linear motor 452 is connected to the x-direction moving plate 453.

The number of the x-direction linear guides 451 is preferably two, and the x-direction linear motor 452 is positioned between the two x-direction linear guides 451, so that stability when the x-direction moving plate 453 moves can be improved.

According to an embodiment of the present invention, two x-direction photoelectric switches 454 and two x-direction limit blocks 455 are mounted on the y-direction moving plate 443, the two x-direction photoelectric switches 454 are disposed opposite to each other, the x-direction photoelectric switches 454 are triggered when the x-direction moving plate 453 moves in the x-direction, the two x-direction limit blocks 455 are disposed opposite to each other, and the x-direction limit blocks 455 are used for limiting the x-direction moving plate 453 in the x-direction. Of course, the precision measurement during movement may be performed by providing a magnetic scale and a reading head between the y-direction moving plate 443 and the x-direction moving plate 453.

On this basis, the circumferential rotation mechanism 46 includes: a plurality of rollers 461, a driving ring 462, a first synchronous belt 463, a motor 464 and an encoder 465, wherein the plurality of rollers 461 are uniformly arranged on the x-direction moving plate 453 along the circumferential direction; the driving ring 462 is arranged at the outer side of the rollers 461, and the driving ring 462 is connected with the rollers 461 in a rolling way; the first synchronous belt 463 is in transmission connection with the driving ring 462; the motor 464 is arranged on the x-direction moving plate 453, and the output end of the motor 464 is connected with the first synchronous belt 463 in a transmission way; the encoder 465 is mounted on the x-direction moving plate 453, and the encoder 465 is in drive connection with a first synchronous belt 463.

Further, an annular groove matched with the roller 461 is formed in the inner peripheral surface of the driving ring 462, the cross section of the annular groove is V-shaped, and teeth matched with the first synchronous belt 463 are formed in the outer peripheral surface of the driving ring 462.

In this embodiment, the number of the rollers 461 is preferably eight, each roller 461 is clamped in an annular groove on the inner circumferential surface of the driving ring 462 and is in rolling connection with the annular groove, and the rollers 461 support the driving ring 462 on one hand, so that the driving ring 462 is suspended on the x-direction moving plate 453, and simultaneously, the stability of the driving ring 462 during rotation can be ensured; the first synchronous belt 463 drives the whole driving ring 462 to rotate by meshing with the teeth; and the encoder 465 follows the first timing belt 463 to precisely detect the rotation angle of the driving ring 462, which enables precise control of the rotation angle of the wafer.

Furthermore, a tensioning adjusting block 467 is arranged on the x-direction moving plate 453 in a sliding mode, a tensioning bearing 466 is installed on the tensioning adjusting block 467, the tensioning bearing 466 is connected with the first synchronous belt 463 in a rolling mode, and the tensioning bearing 466 is close to or far away from the first synchronous belt 463 by moving the tensioning adjusting block 467 so as to change the tensioning degree of the first synchronous belt 463; the x-direction moving plate 453 is further provided with a circumferential photoelectric switch 468, the driving ring 462 can trigger the circumferential photoelectric switch 468 when rotating, the circumferential photoelectric switch 468 is at a zero position of the driving ring 462, and when the driving ring 462 triggers the circumferential photoelectric switch 468, the driving ring 462 is at an original position.

It should be noted that the output ends of the driving ring 462, the encoder 465 and the motor 464 are all engaged with the inner surface of the first synchronous belt 463 to complete the synchronous transmission, and the tensioning bearing 466 is attached to the outer surface of the first synchronous belt 463 to complete the tensioning effect on the first synchronous belt 463.

According to an embodiment of the present invention, a feeding rod 4531 is mounted on the x-direction moving plate 453, the feeding rod 4531 is located at one side of the circumferential rotation mechanism 46, a feeding photoelectric electrode 4533 is disposed at the middle of the feeding rod 4531, and feeding guide blocks 4532 are disposed at both ends of the feeding rod 4531, wherein the feeding guide blocks 4532 are used for guiding the wafer during the conveying process. That is, during the wafer feeding process, the wafer is guided by the feeding guide 4532 so as to be horizontally moved to the wafer spreading mechanism 48, and the feeding photo-electric 4533 detects whether or not the wafer passes through. The wafer loading and unloading mechanism grabs the wafer to pass between the two feeding guide blocks 4532, and the wafer is located above the feeding rod 4531 when moving.

The wafer position adjusting mechanism is simple and compact in structure, the circumferential rotating mechanism 46 drives the wafer expanding mechanism 48 to horizontally move in an xy plane, and can drive the wafer expanding mechanism 48 to circumferentially rotate, so that the wafer on the wafer expanding mechanism 48 is positioned and adjusted in angle, and alignment operation with a lead frame is conveniently completed during subsequent mounting.

Among them, as shown in fig. 15 to 22, for the wafer spreading mechanism 48:

the wafer expanding mechanism 48 is mounted on a driving ring 462 of the wafer position adjusting mechanism, the driving ring 462 is rotatably mounted on the x-direction moving plate 453, and the wafer expanding mechanism 48 includes: the lifting ring 482, the wafer mounting mechanism and the active unit 489 are detachably connected, and the lifting ring 482 is detachably connected with the driving ring 462; the wafer mounting mechanism is arranged on the jacking ring 482, is of a circular structure, is internally provided with wafers, is matched with the wafers with different sizes in size, and is replaced when the wafers with different sizes are processed; the active unit 489 is located at the side of the wafer mounting mechanism, the active unit 489 is located at the same level as the wafer mounting mechanism, the active unit 489 can move toward or away from the wafer mounting mechanism along the direction pointing to the center of the wafer mounting mechanism (the moving direction of the active unit 489 is the y direction in this embodiment), and the active unit 489 is used to drive the wafer mounting mechanism to move toward or away from the lift ring 482.

In other words, the wafer expanding mechanism 48 is detachably disposed on the drive ring 462, the size of the wafer mounting mechanism on the wafer expanding mechanism 48 corresponds to the size of the wafer, the jacking ring 482 is matched with the drive ring 462, only the wafer mounting mechanism in the wafer expanding mechanisms 48 corresponding to wafers with different sizes is different, when the size of the processed wafer is changed, the corresponding jacking ring 482 and the wafer mounting mechanism are directly replaced, the driving unit 489 can disconnect the transmission relationship with the wafer mounting mechanism, so that the jacking ring 482 and the wafer mounting mechanism can be replaced conveniently, because the driving unit 489 does not need to be replaced, the driving motor 4894 for providing power does not need to be replaced and rewired, the cylinder 4893 does not need to be re-electrified, because the electrical components are not replaced, the electrical components do not need to be reset and error compensation, and the wafer mounting mechanism can be put into use immediately after replacement.

According to one embodiment of the invention, a fixing pin 4621 is arranged on the driving ring 462, a locking wrench 483 is arranged on the jacking ring 482, one end of the locking wrench 483 is rotatably connected with the jacking ring 482, and the locking wrench 483 is used for being clamped with the fixing pin 4621. In this embodiment, the number of the securing pins 4621 and the locking wrench 483 is two, two securing pins 4621 are simultaneously placed on one diameter of the driving ring 462, two locking wrenches 483 are simultaneously placed on one diameter of the jacking ring 482, an annular groove is formed on the outer circumferential surface of the securing pin 4621, a notch is formed on the locking wrench 483, and when the fixing pin 4621 is inserted through the jacking ring 482, and then the locking wrench 483 is rotated to engage the annular groove of the securing pin 4621 with the notch.

On the basis, the wafer mounting mechanism comprises: a pressure plate base 484, two pressure plates 485, and a plurality of height adjustment units 486, the pressure plate base 484 being located above the lift ring 482; the two pressing plates 485 are oppositely arranged, the two pressing plates 485 are arranged on the pressing plate base 484, the clamping jaw assembly moves between the two pressing plates 485, and the wafer is clamped between the pressing plate base 484 and the pressing plates 485; a plurality of height adjustment units 486 are uniformly arranged in a circumferential direction, and the plurality of height adjustment units 486 are located between the pressure plate base 484 and the lift ring 482 to adjust a distance between the pressure plate base 484 and the lift ring 482.

In this embodiment, be provided with the locating pin between clamp plate base 484 and the clamp plate 485, set up on the wafer ring with locating pin complex opening, when the last clamping jaw subassembly of unloading mechanism snatchs the wafer and gets into between clamp plate base 484 and the clamp plate 485 on the wafer, the opening cooperatees with the locating pin to make the wafer fix accurately between clamp plate base 484 and clamp plate 485, spaced certain distance between two clamp plates 485, the clamping jaw subassembly of being convenient for passes through, prevents to take place to interfere.

According to one embodiment of the present invention, the height adjusting unit 486 comprises: an adjusting screw 4861 and a first synchronous pulley 4862, wherein one end of the adjusting screw 4861 is fixedly installed on the pressure plate base 484; the first synchronous pulley 4862 is rotatably provided on the lift ring 482, and the other end of the adjusting screw 4861 is screw-coupled to the inner circumference of the first synchronous pulley 4862.

That is to say, by using the screw connection relationship between the adjusting screw rod 4861 and the first synchronous pulley 4862, when the first synchronous pulley 4862 is driven by the second synchronous belt 4883 to rotate, the adjusting screw rod 4861 can only move up and down without rotating, so as to drive the platen base 484 and the wafer to move up and down.

Preferably, the platen base 484 is provided with a driven unit 488 and a tensioning unit 487, the tensioning unit 487 and the plurality of height adjusting units 486 are both in transmission connection with the driven unit 488, the driven unit 488 is arranged opposite to the driving unit 489, and after the driving unit 489 approaches, the driven unit 488 is in transmission connection with the driving unit 489.

Further, the driven unit 488 includes: a transmission shaft 4881, a driven gear 4882 and a second synchronous belt 4883, wherein the transmission shaft 4881 is vertically arranged on the jacking ring 482; a driven gear 4882 is rotatably sleeved on the transmission shaft 4881, and the driven gear 4882 is in transmission connection with the driving unit 489; the second synchronous belt 4883 is drivingly connected to the driven gear 4882, and the second synchronous belt 4883 is drivingly connected to the first synchronous pulley 4862.

In other words, during operation, the driven gear 4882 needs to maintain a meshing relationship with the driving wheel set 4895 while being in transmission connection with the second synchronous belt 4883, so as to ensure that the power output from the driving unit 489 is transmitted to the height adjustment unit 486 for height adjustment.

Further, the tension unit 487 includes: an eccentric shaft 4871 and a second synchronous belt wheel 4872, wherein the lower part of the eccentric shaft 4871 is installed on a pressure plate base 484, and the axis of the upper part of the eccentric shaft 4871 is not coaxial with the axis of the lower part; the second synchronous belt wheel 4872 is rotatably sleeved on the upper portion of the eccentric shaft 4871, and the second synchronous belt wheel 4872 is in transmission connection with a second synchronous belt 4883. The upper part and the lower part of the eccentric shaft 4871 are both cylinders, but the upper part and the lower part of the eccentric shaft 4871 are not coaxial, and since the lower part of the eccentric shaft 4871 is mounted on the pressure plate base 484, only the eccentric shaft 4871 needs to be rotated, the upper part of the eccentric shaft 4871 can be close to or far away from the second synchronous belt 4883 in the rotating process, and the tensioning effect on the second synchronous belt 4883 is realized by adjusting the position of the eccentric shaft 4871.

According to one embodiment of the invention, the active unit 489 includes: initiative support 4891, initiative motor 4894 and transmission wheelset 4895, initiative motor 4894 installs on initiative support 4891, and transmission wheelset 4895 links to each other with initiative motor 4894's output, and transmission wheelset 4895 is used for being connected with driven gear 4882 transmission.

Preferably, the driving support 4891 is mounted on the cross beam 422, the driving support 4891 is slidably connected to the cross beam 422 through a sliding rail assembly 4892, the cross beam 422 is mounted near the air cylinder 4893, an output end near the air cylinder 4893 is connected to the driving support 4891, and the driving unit 489 is driven to approach or depart from the driven unit 488 near the air cylinder 4893.

More preferably, the active mount 4891 has an adjustment light and a meshing calibration light mounted thereon, the wafer mount mechanism triggers the adjustment light when the wafer mount mechanism is moved in place, and the meshing calibration light when the drive wheel set 4895 and the driven gear 4882 are engaged.

The number of the rail assemblies 4892 is preferably two to improve the stability during movement, the approach cylinder 4893 provides a driving unit 489 with power approaching or departing from the second timing pulley 4872, the driving motor 4894 provides power driving the driving wheel set 4895 and the second timing pulley 4872 to rotate, the meshing calibration photo-electricity is used to identify whether the driving wheel set 4895 and the driven gear 4882 are meshed, and the adjustment photo-electricity is used to identify whether the wafer is moved in the up-and-down direction.

According to an embodiment of the present invention, the lifting ring 482 is provided with a lower limit hook 4822, the pressure plate base 484 is provided with an upper limit hook 4841, and when the upper limit hook 4841 moves, the lower limit hook 4822 abuts against the upper limit hook 4841 for limiting. During the up-and-down movement of the wafer mounting mechanism, the wafer mounting mechanism is restricted by the cooperation between the lower restricting hook 4822 and the upper restricting hook 4841.

According to one embodiment of the present invention, a magnetic switch assembly 481 is mounted on the x-direction moving plate 453, and the magnetic switch assembly 481 is used for identifying the size of the replaced wafer expanding mechanism 48. There are 3 magnetic switches on the correspondence of magnetic switch subassembly 481, expand and install the magnetic part on brilliant mechanism 48, and the magnetic part mounted position is different on the brilliant mechanism 48 of expanding of different sizes, and the brilliant mechanism 48 of expanding of different sizes can trigger different magnetic switches, and every magnetic switch corresponds the wafer of different sizes, and magnetic switch is used for detecting that the brilliant mechanism 48 of expanding of installation corresponds in 6 cun wafers, 8 cun wafers and 12 cun wafers.

According to an embodiment of the present invention, the top surface of the lift ring 482 is provided with an annular protrusion 4821, and the wafer mounting mechanism is located outside the annular protrusion 4821, so that when the wafer mounting mechanism approaches the lift ring 482, the wafer film on the wafer is lifted by the annular protrusion 4821. That is, in order to realize the stretching action of the wafer film on the wafer, the wafer mounting mechanism drives the wafer to move downward, the edge portion of the wafer film is driven by the wafer ring to move downward, and the middle portion of the wafer film is hindered by the annular protrusion 4821, so that the wafer film is stretched in the radial direction.

In the embodiment, a hair drier device is arranged below the wafer mounting mechanism and used for heating the wafer film on the wafer. The electric hair drier can soften the wafer film after heating the wafer film.

The y-direction moving plate 443 and the x-direction moving plate 453 have openings in the middle thereof so that the hot air of the hair dryer can be blown to the wafer film and the chip ejection device 47 can eject the wafer film.

In summary, the wafer includes an annular wafer ring, a wafer film and a chip, the periphery of the wafer film is connected to the wafer ring, the chip is placed on the wafer film, and the main steps of the wafer expanding method are as follows: but design a quick assembly disassembly's connection structure and install and expand brilliant mechanism, but select the brilliant mechanism of expanding of corresponding size to change through quick assembly disassembly's connection structure according to production needs, place the wafer on expanding brilliant mechanism, expand brilliant mechanism and drive the brilliant ring downstream, it is protruding through setting up an annular in the below of wafer film, wafer film in the downward movement blocks, the edge of wafer film is driven by the brilliant ring and continues the downstream, make the wafer film stretched to the four weeks by the center, thereby make the distance of the adjacent chip on the wafer film expand.

Among them, as shown in fig. 23 to 30, with respect to the chip ejection device 47:

the chip ejection device 47 includes: the lifting installation seat 471 is installed on the platform 40, a wafer film is arranged above the platform 40, and a plurality of chips are placed on the wafer film; lift assembly 472 is disposed on lift mount 471; the ejection assembly 473 is mounted on the lifting assembly 472, the lifting assembly 472 drives the ejection assembly 473 to perform lifting movement so as to be close to or far away from the wafer film, the ejection assembly 473 is provided with a housing assembly 47314 and ejector pins 47313 arranged in the housing assembly 47314, negative pressure is arranged in the housing assembly 47314 so as to downwards adsorb the wafer film, and the ejector pins 47313 can move upwards and protrude out of the housing assembly 47314 so as to upwards eject the chip.

According to one embodiment of the present invention, the lift assembly 472 includes: the lifting device comprises a lifting seat 4725, a lifting motor 4723, a lifting lead screw 4721 and a lifting slider 4722, wherein the lifting seat 4725 is connected with one side of a lifting installation seat 471 in a sliding way through a lifting linear guide rail 4724; the lifting motor 4723 is installed on the other side of the lifting installation seat 471; one end of the lifting screw 4721 is rotatably mounted on the lifting mounting seat 471, and the other end of the lifting screw 4721 is connected with the output end of the lifting motor 4723; the lifting slide block 4722 is sleeved on the lifting screw rod 4721, and the lifting slide block 4722 is connected with the lifting seat 4725.

In other words, the number of the lifting linear guides 4724 is two, and the lifting assembly 472 has high stability during lifting through the guiding function of the lifting lead screw 4721 and the lifting linear guide 4724.

According to an embodiment of the present invention, the lifting installation seat 471 is further provided with a plurality of lifting detection photoelectricity 4727, so as to identify the position of the lifting seat 4725.

On this basis, the ejection assembly 473 includes: an ejection mounting block 4731 and an eccentric wheel driving mechanism, wherein the ejection mounting block 4731 is arranged on the lifting seat 4725, and the encloser assembly 47314 is arranged on the ejection mounting block 4731; the eccentric wheel driving mechanism is arranged on the ejection mounting block 4731, is connected with the ejector pin 47313 and can drive the ejector pin 47313 to move along the height direction. The shroud assembly 47314 may be formed by a plurality of cylindrical shells that are sequentially interconnected.

According to one embodiment of the invention, the ejecting mounting block 4731 is connected to the lifting seat 4725 by a plurality of leveling bolt assemblies 4732, the leveling bolt assemblies 4732 being used to level the ejecting mounting block 4731. The number of the leveling bolt assemblies 4732 is three, three points determine a plane, and leveling can be realized by using the three leveling bolt assemblies 4732.

Further, the leveling bolt assembly 4732 includes: the lifting seat 4725 is provided with a stepped hole, the gasket 47321 is arranged in the stepped hole, the lower end of the leveling bolt 47322 is abutted against the gasket 47321, the leveling nut 47323 is positioned above the ejection mounting block 4731, the leveling nut 47323 and the ejection mounting block 4731 are both in threaded connection with the leveling bolt 47322, and the ejection mounting block 4731 is fixed on the lifting seat 4725 after the locking bolt assembly 47324 passes through the leveling nut 47323, the gasket 47321 and the stepped hole. Leveling the liftout assembly 473 with leveling bolt assembly 4732 ensures that the liftout assembly 473 keeps lifting vertically when lifting the chip, avoiding tilting.

According to one embodiment of the present invention, an eccentric wheel driving mechanism includes: a jacking servo motor 4733, an eccentric wheel 4734 and a bearing 4735, wherein the jacking servo motor 4733 is arranged on the jacking mounting block 4731; the eccentric wheel 4734 is sleeved on an output shaft of the ejection servo motor 4733, and the axis of the output shaft of the ejection servo motor 4733 is horizontally arranged; the bearing 4735 is sleeved on the eccentric wheel 4734, and the relative position between the upper edge of the bearing 4735 and the thimble 47313 is kept fixed.

Further, the eccentric wheel drive mechanism further includes: an intermediate shaft 4739, a shaft sleeve 47310 and a spring 47311, wherein the intermediate shaft 4739 is arranged in a housing component 47314, the upper end of the intermediate shaft 4739 is provided with a clamp 47312, an ejector pin 47313 is detachably arranged on the clamp 47312, the lower end of the intermediate shaft 4739 is provided with an ejection block 4738, and the ejection block 4738 is positioned above the bearing 4735 and is abutted against the side surface of the bearing 4735; the shaft sleeve 47310 is sleeved on the intermediate shaft 4739 in a sliding manner, and the shaft sleeve 47310 is clamped in the housing component 47314; a spring 47311 is sleeved on the intermediate shaft 4739, and the spring 47311 is positioned between the shaft sleeve 47310 and the ejection block 4738. Wherein, the surface of jackshaft 4739 is seted up the intercommunication groove, and the intercommunication groove sets up along the axial for provide the intercommunication passageway between negative pressure hole 47316 and pneumatic joint 47315.

That is, the ejection servo motor 4733 is horizontally arranged, the intermediate shaft 4739 is vertically arranged, when the eccentric wheel 4734 rotates, the intermediate shaft 4739 changes along with the height change of the eccentric wheel 4734, the shaft sleeve 47310 is used for guiding the intermediate shaft 4739, the movement direction of the intermediate shaft 4739 is ensured to be vertical, the deviation during ejection is avoided, the spring 47311 is in a pressed state and can push the ejection block 4738 to move downwards, and therefore the ejection block 4738 is ensured to be always attached to the outer peripheral surface of the eccentric wheel 4734.

In this embodiment, a rotary flap 4736 is attached to an output shaft of the ejection servo motor 4733, a zero photoelectric element 4737 is attached to the ejection attachment block 4731, and the rotary flap 4736 is used to trigger the zero photoelectric element 4737. When the rotary blocking piece 4736 rotates for a circle, the thimble 47313 completes a reciprocating motion from bottom to top and then from top to bottom.

According to an embodiment of the invention, a pneumatic connector 47315 is installed on the exterior of the casing assembly 47314, the pneumatic connector 47315 is connected with a vacuum generator, a middle hole 47317 and a plurality of negative pressure holes 47316 are formed on the upper surface of the casing assembly 47314, the ejector pins 47313 can penetrate through the middle hole 47317 to jack up a chip, and the plurality of negative pressure holes 47316 are distributed around the middle hole 47317. The negative pressure holes 47316 are used for adsorbing the wafer film downwards, and the middle holes 47317 are used for allowing the thimble 47313 to penetrate through so as to jack up the chip, and meanwhile, after the chip is jacked up, the wafer film is kept at a certain distance from the edge of the chip so as to be sucked away by a subsequent chip.

Wherein, for the wafer loading and unloading mechanism, as shown in fig. 1-7:

unloading mechanism includes on wafer: the lifting mechanism 41 is arranged on the platform 40, and the lifting mechanism 41 is positioned at one side of the wafer expanding mechanism 48; the wafer box 401 is mounted on the lifting mechanism 41, a plurality of wafers are stacked in the wafer box 401, and the lifting mechanism 41 drives the wafer box 401 to perform lifting movement; the pick-and-place mechanism 42 is installed on the platform 40, the pick-and-place mechanism 42 is located at one side of the wafer expanding mechanism 48, and the pick-and-place mechanism 42 is used for grabbing wafers to move between the wafer box 401 and the wafer expanding mechanism 48.

That is, the lifting mechanism 41 can move the wafer box 401 up and down, after the first wafer is taken away by the pick-and-place mechanism 42 and processed, the pick-and-place mechanism 42 returns the first wafer to the wafer box 401, and then the lifting mechanism 41 moves the wafer box 401 up so that the pick-and-place mechanism 42 takes away the second wafer, and so on until all the wafers in the wafer box 401 are processed.

On this basis, the lifting mechanism 41 includes: the base plate 411, the guide rail sliding block assembly 412, the lead screw nut assembly 413 and the mounting seat 415, wherein the base plate 411 is vertically arranged on the platform 40; the guide rail slider assembly 412 is arranged on the seat plate 411; the lead screw nut component 413 is arranged on the seat plate 411, and the lead screw nut component 413 is parallel to the guide rail sliding block component 412; the slider on the guide rail slider assembly 412 and the nut on the lead screw nut assembly 413 are connected to the mounting base 415, and the wafer cassette 401 is placed on the mounting base 415. In this embodiment, the number of the guide rail slider assemblies 412 is two, and the lead screw nut assembly 413 is located between the two guide rail slider assemblies 412, so as to improve the stability during the lifting movement.

According to an embodiment of the present invention, the upper end and the lower end of the seat plate 411 are provided with first stoppers 414, and the mounting seat 415 is movable between the two first stoppers 414. The two first stoppers 414 are used for limiting the mounting seat 415.

According to one embodiment of the present invention, the lead screw of the lead screw nut assembly 413 is directly connected to the motor 416 through the coupling 417, and the motor 416 is installed on the seat plate 411.

Preferably, a plurality of second stoppers 418 and a plurality of photoelectric switches 419 are disposed on the upper surface of the mounting base 415, the second stoppers 418 are detachably connected to the mounting base 415, the second stoppers 418 are used for limiting when the wafer cassette 401 is placed, and the photoelectric switches 419 are used for identifying the wafer cassette 401 with a corresponding size.

That is to say, because the sizes of the wafer boxes 401 corresponding to wafers of different sizes are different, the sizes of the wafer boxes 401 placed are identified through the photoelectric switches 419 at different positions, so as to identify the sizes of the wafers to be processed, and when the wafer boxes 401 of different sizes are selected, the second limiting blocks 418 can be installed at corresponding positions to limit the wafer boxes 401.

On this basis, the pick and place mechanism 42 includes: the device comprises a support 421, a synchronous belt component 423, a first linear guide rail 424 and a clamping jaw support 425, wherein the support 421 is installed on a platform 40, and a cross beam 422 is installed on the support 421; a timing belt assembly 423 is provided on the cross beam 422; the first linear guide rail 424 is arranged on the cross beam 422, and the first linear guide rail 424 is parallel to the synchronous belt component 423; one end of jaw support 425 is connected with timing belt assembly 423, one end of jaw support 425 is connected with first linear guide 424 in a sliding manner, and the other end of jaw support 425 is provided with a jaw assembly. The timing belt assembly 423 and the first linear guide 424 cooperate to move the jaw assembly between the wafer cassette 401 and the wafer expansion mechanism 48.

According to one embodiment of the invention, a jaw assembly comprises: the lifting cylinder 426, the first mounting block 427, the lower clamping jaw 428 and the upper clamping jaw 4281, wherein the lifting cylinder 426 is mounted at the other end of the clamping jaw support 425; the first mounting block 427 is connected with the output end of the lifting cylinder 426; the lower jaw 428 is mounted on the first mounting block 427; an upper jaw 4281 is provided on the first mounting block 427, the upper jaw 4281 is located above the lower jaw 428, and the upper jaw 4281 can be moved toward or away from the lower jaw 428.

Preferably, the upper clamping jaw 4281 is mounted on a second mounting block 4271, the second mounting block 4271 is slidably connected with the first mounting block 427 through a second linear guide rail 4272, a pressing cylinder 429 is arranged on the first mounting block 427, and an output end of the pressing cylinder 429 is connected with the second mounting block 4271.

More preferably, the upper jaw 4281 is bent downward toward one end of the wafer cassette 401, and the lower jaw 428 is mounted with a sensor for identifying the wafer, so as to avoid an empty grasping action.

That is, the upper clamping jaw 4281 and the lower clamping jaw 428 can integrally move up and down, meanwhile, the upper clamping jaw 4281 can be close to the lower clamping jaw 428 to clamp a wafer, the upper clamping jaw 4281 and the lower clamping jaw 428 are mainly used for clamping a wafer ring on the wafer, and a part bent downwards on the upper clamping jaw 4281 can hook the inner surface of the wafer ring.

According to one embodiment of the invention, a limit photoelectric sensor 4233 is arranged on the cross beam 422, the limit photoelectric sensor 4233 is positioned on one side of the synchronous belt assembly 423 away from the wafer cassette 401, a driven wheel on the synchronous belt assembly 423 is rotatably installed on a driven wheel installation block 4231, the driven wheel installation block 4231 is installed on the cross beam 422, and the position of the driven wheel installation block 4231 on the cross beam 422 is adjustable. That is, the distance between the driven wheel and the driving wheel is adjusted by moving the driven wheel mounting block 4231, so that the tension degree is adjusted.

The invention discloses a chip supply method, which adopts the chip supply device to supply chips and comprises the following steps:

the method comprises the following steps: determining the size of the wafer to be supplied, and placing the corresponding wafer box 401 on the lifting mechanism 41 in the wafer loading and unloading mechanism according to the size of the wafer;

step two: according to the size of the wafer, installing a corresponding wafer installing mechanism on the wafer expanding mechanism 48 on the wafer position adjusting mechanism;

step three: a pick-and-place mechanism 42 in the wafer loading and unloading mechanism picks and places the wafer in the wafer box 401 on the wafer expanding mechanism 48, namely between the pressure plate base 484 and the pressure plate 485;

step four: the wafer expanding mechanism 48 stretches the wafer film to increase the distance between the chips on the wafer film; that is, as shown in fig. 31, the active unit 489 is close to the wafer mounting mechanism and is in transmission connection with the wafer mounting mechanism, and at the same time, the wafer film on the wafer is blown and heated to soften the wafer film, and then the active unit 489 drives the wafer on the wafer mounting mechanism to move downward to approach the jacking ring 482, the wafer film on the wafer is blocked by the annular protrusion 4821 upward, and the edge of the wafer film is stretched downward by the annular ring of the wafer, so that the wafer film is stretched from inside to outside, and the distance between two adjacent wafers on the wafer film is further increased;

step five: the wafer position adjusting mechanism moves the chips to be right above the chip ejection device 47, the angle of the chips is adjusted at the same time, the chip ejection device 47 ejects the chips upwards while adsorbing the wafer film downwards so as to be convenient for taking the chips away, and the step is repeated until all the chips on the wafer are taken away;

step six: the wafer position adjusting mechanism resets, and the wafer loading and unloading mechanism grabs the wafer back into the wafer box 401;

step seven: the lifting mechanism 41 is lifted, another wafer is lifted to the position of the previous wafer, and the third step to the sixth step are repeated until all the wafers in the wafer box 401 are completely supplied.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip supply apparatus, comprising:

a platform (40);

the wafer position adjusting mechanism is arranged on the platform (40) and is used for driving the wafer to carry out position adjustment along the y direction, the x direction and the circumferential direction;

the wafer expanding mechanism (48) is installed on the wafer position adjusting mechanism, and the wafer expanding mechanism (48) is used for stretching a wafer film on a wafer to expand the distance between adjacent chips;

the chip ejection device (47), the chip ejection device (47) is installed on the platform (40), the chip ejection device (47) is positioned below the wafer expanding mechanism (48), and the chip ejection device (47) is used for ejecting a chip from a wafer film;

the wafer loading and unloading mechanism is arranged on the platform (40) and is used for grabbing wafers with chips from a wafer box (401) to the wafer expanding mechanism (48);

the wafer expanding mechanism (48) comprises:

the jacking ring (482), the jacking ring (482) is installed on the said wafer position regulating mechanism removably;

the wafer mounting mechanism is arranged on the jacking ring (482), and is used for placing wafers, and the size of the wafer mounting mechanism is matched with the size of wafers with different sizes;

an active unit (489), the active unit (489) being located at a side of the wafer mounting mechanism, the active unit (489) being capable of approaching or departing from the wafer mounting mechanism;

after the active unit (489) approaches the wafer mounting mechanism, the active unit (489) establishes a transmission relationship with the wafer mounting mechanism and can drive the wafer mounting mechanism to approach or depart from the jacking ring (482) to complete wafer expanding operation; after the active unit (489) is away from the wafer mounting mechanism, the active unit (489) is disconnected from the transmission relationship with the wafer mounting mechanism.

2. The chip supplying apparatus according to claim 1, wherein the wafer loading and unloading mechanism comprises:

the lifting mechanism (41) is installed on the platform (40), the lifting mechanism (41) is located on one side of the wafer expanding mechanism (48), the wafer box (401) is installed on the lifting mechanism (41), a plurality of wafers are stacked in the wafer box (401), and the lifting mechanism (41) drives the wafer box (401) to move up and down;

the pick-and-place mechanism (42) is installed on the platform (40), the pick-and-place mechanism (42) is located on one side of the wafer expanding mechanism (48), and the pick-and-place mechanism (42) is used for grabbing the wafers to move between the wafer box (401) and the wafer expanding mechanism (48).

3. The chip supplying apparatus according to claim 2, wherein the elevating mechanism (41) comprises:

a seat plate (411), the seat plate (411) being vertically mounted on the platform (40);

a rail slider assembly (412), the rail slider assembly (412) being disposed on the seat plate (411);

a lead screw nut assembly (413), the lead screw nut assembly (413) being disposed on the seat plate (411), the lead screw nut assembly (413) being parallel to the rail slider assembly (412);

the guide rail slider assembly (412) and the lead screw nut assembly (413) are connected with the mounting seat (415), and the wafer box (401) is placed on the mounting seat (415).

4. The chip supply apparatus according to claim 2, wherein the pick-and-place mechanism (42) comprises:

the support (421), the said support (421) is installed on said terrace (40), install the crossbeam (422) on the said support (421);

a timing belt assembly (423), wherein the timing belt assembly (423) is arranged on the cross beam (422);

the first linear guide rail (424), the first linear guide rail (424) is set up on the said crossbeam (422), the said first linear guide rail (424) is parallel to the said hold-in range assembly (423);

the synchronous belt conveyor comprises a jaw support (425), one end of the jaw support (425) is connected with the synchronous belt assembly (423), one end of the jaw support (425) is connected with the first linear guide rail (424) in a sliding mode, and the other end of the jaw support (425) is provided with a jaw assembly.

5. The chip supply apparatus according to claim 4, wherein the jaw assembly comprises:

the lifting cylinder (426), the lifting cylinder (426) is installed at the other end of the clamping jaw support (425);

a first mounting block (427), the first mounting block (427) connected to an output of the lift cylinder (426);

a lower jaw (428), the lower jaw (428) mounted on the first mounting block (427);

an upper jaw (4281), the upper jaw (4281) being provided on the first mounting block (427), the upper jaw (4281) being located above the lower jaw (428), the upper jaw (4281) being able to move closer to or away from the lower jaw (428).

6. The chip supplying apparatus according to claim 1, wherein the wafer position adjusting mechanism comprises:

a y-direction moving mechanism (44), wherein the y-direction moving mechanism (44) is installed on the platform (40);

the x-direction moving mechanism (45) is installed on the y-direction moving mechanism (44), and the y-direction moving mechanism (44) drives the x-direction moving mechanism (45) to move along the y direction;

circumferential direction mechanism (46), circumferential direction mechanism (46) are installed x is to moving mechanism (45) on, x drives to moving mechanism (45) circumferential direction mechanism (46) are along x to the activity, install on circumferential direction mechanism (46) and expand brilliant mechanism (48), circumferential direction mechanism (46) drive expand brilliant mechanism (48) and rotate in circumference.

7. The chip supplying apparatus according to claim 6, wherein said y-direction moving mechanism (44) comprises:

the y-direction linear guide rail (441), the y-direction linear guide rail (441) is arranged on the platform (40);

the y-direction moving plate (443), the y-direction moving plate (443) is positioned above the platform (40), and the y-direction moving plate (443) is connected with the platform (40) in a sliding mode through the y-direction linear guide rail (441);

a y-direction linear motor (442), wherein the y-direction linear motor (442) is installed on the platform (40), and the output end of the y-direction linear motor (442) is connected with the y-direction moving plate (443).

8. The chip supplying apparatus according to claim 7, wherein the x-direction moving mechanism (45) comprises:

an x-direction linear guide rail (451), wherein the x-direction linear guide rail (451) is arranged on the y-direction moving plate (443);

the x-direction moving plate (453) is positioned above the y-direction moving plate (443), and the x-direction moving plate (453) is connected with the y-direction moving plate (443) in a sliding mode through the x-direction linear guide rail (451);

the x-direction linear motor (452) is mounted on the y-direction moving plate (443), and the output end of the x-direction linear motor (452) is connected with the x-direction moving plate (453).

9. The chip supplying apparatus according to claim 8, wherein said circumferential rotation mechanism (46) comprises:

a plurality of rollers (461), wherein the plurality of rollers (461) are uniformly arranged on the x-direction moving plate (453) along the circumferential direction;

the driving ring (462), the said driving ring (462) is set up in the outside of a plurality of said gyro wheels (461), the said driving ring (462) is connected with said gyro wheel (461) rolling;

a first synchronous belt (463), wherein the first synchronous belt (463) is in transmission connection with the driving ring (462);

the motor (464), the motor (464) is installed on the x-direction moving plate (453), and the output end of the motor (464) is in transmission connection with the first synchronous belt (463);

the encoder (465) is installed on the x-direction moving plate (453), and the encoder (465) is in transmission connection with the first synchronous belt (463).

10. The chip supply device according to claim 4, wherein the wafer expanding mechanism (48) is mounted on the drive ring (462) of the wafer position adjusting mechanism, when wafers with different sizes are processed, the wafer expanding mechanism (48) with the corresponding size is replaced, the jacking ring (482) is detachably connected with the drive ring (462), the upper surface of the jacking ring (482) is provided with an annular protrusion (4821), the wafer mounting mechanism is located at the outer side of the annular protrusion (4821), and when the wafer mounting mechanism is close to the jacking ring (482), the wafer film on the wafer is jacked up by the annular protrusion (4821).

11. The chip supplying apparatus according to claim 10, wherein the wafer mounting mechanism comprises:

a platen base (484), the platen base (484) being located above the jacking ring (482);

the two pressing plates (485) are oppositely arranged, the two pressing plates (485) are arranged on the pressing plate base (484), the clamping jaw assembly moves between the two pressing plates (485), and the wafer is clamped between the pressing plate base (484) and the pressing plates (485);

the height adjusting units (486) are uniformly arranged in the circumferential direction, and the height adjusting units (486) are all positioned between the pressure plate base (484) and the jacking ring (482) so as to adjust the distance between the pressure plate base (484) and the jacking ring (482).

12. The chip supplying apparatus according to claim 11, wherein a driven unit (488) and a tension unit (487) are disposed on said platen base (484), said tension unit (487) and said plurality of height adjusting units (486) are each in transmission connection with said driven unit (488), said driven unit (488) is disposed opposite to said driving unit (489), and said driven unit (488) is in transmission connection with said driving unit (489) after said driving unit (489) approaches.

13. The chip supplying device according to claim 1, wherein the chip ejecting device (47) comprises:

the lifting mounting seat (471) is mounted on the platform (40), a wafer film is arranged above the platform (40), and a plurality of chips are placed on the wafer film;

a lift assembly (472), the lift assembly (472) disposed on the lift mount (471);

the ejection assembly (473) is mounted on the lifting assembly (472), the lifting assembly (472) drives the ejection assembly (473) to move up and down to be close to or far away from the wafer film, the ejection assembly (473) is provided with a housing assembly (47314) and ejector pins (47313) arranged in the housing assembly (47314), negative pressure is arranged in the housing assembly (47314) to adsorb the wafer film downwards, and the ejector pins (47313) can move upwards and protrude out of the housing assembly (47314) to eject the chips upwards.

14. A chip supply method for supplying chips by using the chip supply apparatus according to any one of claims 1 to 13, comprising the steps of:

the method comprises the following steps: determining the size of a wafer to be supplied, and placing a corresponding wafer box (401) on a wafer loading and unloading mechanism according to the size of the wafer;

step two: installing a corresponding wafer installation mechanism on the wafer position adjusting mechanism according to the size of the wafer;

step three: the wafer loading and unloading mechanism grabs and places the wafer in the wafer box (401) on the wafer expanding mechanism (48);

step four: the wafer expanding mechanism (48) stretches the wafer film to increase the distance between chips on the wafer film;

step five: the wafer position adjusting mechanism moves the chips to be right above the chip ejection device (47), the angle of the chips is adjusted at the same time, the chip ejection device (47) ejects the chips upwards while adsorbing the wafer film downwards so as to take the chips away, and the step is repeated until all the chips on the wafer are taken away;

step six: the wafer position adjusting mechanism resets, and the wafer loading and unloading mechanism grabs the wafer back into the wafer box (401).