CN117457561B - Wafer positioning carrier for chip packaging - Google Patents
Wafer positioning carrier for chip packaging Download PDFInfo
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- CN117457561B CN117457561B CN202311774079.9A CN202311774079A CN117457561B CN 117457561 B CN117457561 B CN 117457561B CN 202311774079 A CN202311774079 A CN 202311774079A CN 117457561 B CN117457561 B CN 117457561B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 230000033001 locomotion Effects 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 230000001360 synchronised effect Effects 0.000 claims description 78
- 239000012528 membrane Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer positioning carrier for chip packaging, which comprises a carrier body, wherein a rotary table mechanism is arranged at the top of the carrier body, a frame type transmission arm is arranged at the top of the carrier body, a film frame positioning mechanism is arranged at the top of the carrier body, a Y-direction movement assembly is arranged at the bottom of the carrier body, a film stretching motor mechanism is arranged at the bottom of the carrier body, and an X-direction movement assembly is arranged at the top of the carrier body. According to the wafer positioning carrier for chip packaging, according to the process requirement of a wafer after cutting, the wafer is positioned by utilizing a tool structure in the cutting process, the wafer is positioned in a horizontal plane by utilizing a film stretching mode, each grain is separated from each other in the film stretching process by utilizing the stretching characteristic of a film, and the effect of horizontally placing the wafer and separating the grains from each other is synchronously realized after the film frame positioning is finished by utilizing the film stretching structure.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a wafer positioning carrier for chip packaging.
Background
With the rapid rise of the semiconductor industry, the chip is continuously developed towards miniaturization and precision, and the precision requirements on various packaging equipment such as FCDFN, FCQFN, BGA, fan-out and the like are also higher and higher.
In the prior art, the wafer is subjected to the detection and packaging process after the wafer is segmented, the wafer is segmented on the film in the film frame, the film frame and the segmented wafer are circulated together after the wafer is segmented, and the film frame and the wafer thereon are required to be positioned during packaging, so that a wafer positioning carrier for chip packaging is provided to solve the problems.
Disclosure of Invention
(one) solving the technical problems
The invention provides a wafer positioning carrier for chip packaging, which has the advantages of positioning a film frame, adopting a mode of tightening a film, facilitating the pick-up of crystal grains in the packaging process and the like, and solves the problems that a wafer enters a detection and packaging link after the wafer is divided, the division of the wafer is completed on the film in the film frame, the film frame and the divided wafer are circulated together after the division of the wafer is completed, and the film frame and the wafer on the film frame need to be positioned during packaging.
(II) technical scheme
In order to realize the positioning of the film frame, the mode of tightening the film is adopted, so that the purpose of picking up crystal grains in the packaging process is facilitated, and the following technical scheme is provided: the utility model provides a wafer location carrier for chip package, includes the carrier body, its characterized in that: the top of carrier body is provided with revolving stage mechanism, the top of carrier body is provided with frame type transmission arm, the top of carrier body is provided with film frame positioning mechanism, the bottom of carrier body is provided with Y to motion subassembly, the bottom of carrier body is provided with membrane stretching motor mechanism, the top of carrier body is provided with X to motion subassembly.
Preferably, the rotating table mechanism comprises a rotating motor, the rotating motor is arranged in the carrying table body, a synchronous pulley disc is arranged at the top of the carrying table body, a first synchronous belt is sleeved on the outer surface of the synchronous pulley disc, a wire ball bearing is arranged on the outer surface of the synchronous pulley disc, a lower limit switch of a film pressing ring is arranged at the top of the carrying table body, and an upper limit switch of the film pressing ring is arranged at the top of the lower limit switch of the film pressing ring.
Preferably, the film frame positioning mechanism comprises a film pressing ring mounting plate, a film pressing ring, a film stretching ring mounting plate and a film stretching ring, wherein the film pressing ring mounting plate is arranged in the synchronous wheel turntable, the film pressing ring is mounted on the film pressing ring mounting plate, the film stretching ring mounting plate is arranged in the synchronous wheel turntable, the film stretching ring is mounted on the film stretching ring mounting plate, a guide assembly is arranged at the top of the film stretching ring mounting plate, a synchronous wheel screw body is arranged at the top of the film stretching ring mounting plate, a second synchronous belt is connected with the synchronous wheel screw body in a transmission way, an upper clutch is arranged at the bottom of the film stretching ring mounting plate, the film stretching ring mounting plate is mounted on the synchronous wheel turntable without lifting movement, and synchronous wheels on the clutch drive the synchronous wheel screw bodies to rotate, so that the screw shafts move up and down; the top of going up the clutch is provided with synchronous pulley, the left side of going up the clutch is provided with the locating pin, the surface of synchronous pulley screw rod body is provided with kingpin thrust bearing, kingpin thrust bearing's bottom is provided with deep groove ball bearing, deep groove ball bearing's bottom is provided with the nut, kingpin thrust bearing's inside is provided with the screw thread axle. The synchronous wheel screw body, the membrane stretching ring mounting plate, the clutch, the synchronous pulley and the synchronous pulley are mounted on the synchronous wheel turntable and rotate along with the synchronous wheel turntable.
The upper ends of the threaded shafts in the screw bodies of the synchronous wheels are connected with the mounting plate of the film pressing ring, and when the clutch rotates, the synchronous wheels on the clutch drive the synchronous wheels in the screw bodies of the synchronous wheels to rotate through the synchronous belt. Thereby the threaded shaft in each synchronizing wheel screw body simultaneously moves up and down to drive the film pressing ring mounting plate to move up and down.
The wheels on the locating pin and the wheels on two sides of the screw body of each synchronous wheel play a role in ensuring the meshing tooth number and tensioning of the synchronous pulley and the synchronous belt, and the locating pin does not rotate.
Preferably, the membrane stretching motor mechanism comprises a motor mounting plate, the bottom of the carrying platform body is provided with the motor mounting plate, the bottom of the motor mounting plate is provided with a clutch motor, the top of the motor mounting plate is provided with a positioning block, the top of the motor mounting plate is provided with a lower clutch, the top of the motor mounting plate is provided with a motor lifting cylinder, the outer surface of the motor lifting cylinder is provided with a first motor cylinder sensor, the outer surface of the motor lifting cylinder is provided with a second motor cylinder sensor, the top of the motor mounting plate is provided with a positioning block mounting plate, the side surface of the motor mounting plate is provided with a positioning block lifting cylinder, the outer surface of the positioning block lifting cylinder is provided with a first positioning block cylinder sensor, and the outer surface of the positioning block lifting cylinder is provided with a second positioning block cylinder sensor.
Preferably, the left side of the synchronous pulley is engaged on the right side of the locating pin.
Preferably, the output shaft of the rotating motor is sleeved with a first synchronous belt, and the first synchronous belt is sleeved on the outer surface of the wire ball bearing.
Preferably, the Y-direction motion assembly and the X-direction motion assembly comprise a driving motor, a limiting sliding seat, a screw rod and a sliding block, an output shaft of the driving motor is fixedly connected with the screw rod, the sliding block is sleeved on the outer surface of the screw rod, and the driving motor, the screw rod and the sliding block are both positioned on the limiting sliding seat.
Preferably, the mounting holes matched with the positioning blocks and the lower clutches are formed in the carrier body, and the tops of the positioning blocks and the lower clutches extend to the upper side of the carrier body.
Preferably, the top of the synchronizing wheel screw body extends to the upper side of the needle roller thrust bearing, the diameter of the synchronizing wheel turntable is larger than that of the membrane stretching ring mounting plate, and the diameter of the membrane pressing ring mounting plate is larger than that of the membrane stretching ring mounting plate.
(III) beneficial effects
Compared with the prior art, the invention provides the wafer positioning carrier for chip packaging, which has the following beneficial effects:
according to the wafer positioning carrier for chip packaging, according to the technological requirements of a wafer after cutting, the wafer is positioned by utilizing a tool structure in the cutting process, the wafer is positioned in a horizontal plane by utilizing a film stretching mode, grains are separated from each other in the film stretching process by utilizing the stretching characteristic of a film, the effect of horizontally placing the wafer and mutually separating the grains is synchronously realized after the film frame positioning is finished by utilizing the film stretching structure, and the possibility of damaging the grains in the grain picking process is reduced while the grain picking is facilitated.
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a schematic perspective view of a turntable mechanism according to the present invention;
FIG. 3 is a schematic perspective view of a film frame positioning mechanism according to the present invention;
FIG. 4 is a schematic diagram of a positioning mechanism for a membrane frame according to the present invention;
FIG. 5 is a schematic view of the structure of the stretching ring of the present invention;
FIG. 6 is a schematic diagram of a membrane stretching motor mechanism in a three-dimensional structure according to the present invention;
FIG. 7 is a perspective view of the clutch of the present invention;
fig. 8 is a cross-sectional perspective view of the needle thrust bearing of the present invention.
In the figure: 1. a carrier body; 2. a rotary table mechanism; 201. a rotating electric machine; 202. a synchronous wheel turntable; 203. a first synchronization belt; 204. a wire ball bearing; 205. a membrane pressing ring lower limit switch; 206. a limit switch is arranged on the film pressing ring; 3. a frame type transmission arm; 4. a film frame positioning mechanism; 401. a film pressing ring mounting plate; 402. a membrane stretching ring mounting plate; 403. a guide assembly; 404. a synchronizing wheel screw body; 405. a second timing belt; 406. an upper clutch; 407. a synchronous pulley; 408. a positioning pin; 409. needle roller thrust bearings; 410. deep groove ball bearings; 411. a nut; 412. a threaded shaft; 413 film pressing rings; 414 stretching the membrane ring; 5. a Y-direction movement assembly; 6. a film stretching motor mechanism; 601. a motor mounting plate; 602. a clutch motor; 603. a positioning block; 604. a lower clutch; 605. a motor lifting cylinder; 606. a first motor cylinder sensor; 607. a second motor cylinder sensor; 608. a positioning block mounting plate; 609. a positioning block lifting cylinder; 610. a first positioning block cylinder sensor; 611. the second positioning block cylinder is used for sensing; 7. an X-direction movement assembly.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to the drawings, a wafer positioning carrier for chip packaging comprises a carrier body 1, wherein a rotary table mechanism 2 is arranged at the top of the carrier body 1, a frame type transmission arm 3 is arranged at the top of the carrier body 1, a film frame positioning mechanism 4 is arranged at the top of the carrier body 1, a Y-direction movement assembly 5 is arranged at the bottom of the carrier body 1, a film stretching motor mechanism 6 is arranged at the bottom of the carrier body 1, and an X-direction movement assembly 7 is arranged at the top of the carrier body 1.
In the embodiment, through the setting of the carrier body 1, can provide the installation fixedly for equipment to can also provide operation platform, the setting of revolving stage mechanism 2 can be with membrane frame positioning mechanism 4 motion to appointed position, and the rotating electrical machines 201 motion on revolving stage mechanism 2, make last angle modulation with the wafer, prepare for the grain pick-up, the setting of frame type transmission arm 3 can carry the membrane frame to membrane frame positioning mechanism 4, the setting of membrane frame positioning mechanism 4 can fix a position the wafer, the setting of membrane stretching motor mechanism 6 for accomplish the membrane stretching motion, the setting of Y to motion subassembly 5 and X to motion subassembly 7 can make equipment carry Y axle and X axial direction.
Example 1
The rotating table mechanism 2 comprises a rotating motor 201, the rotating motor 201 is arranged in the carrying table body 1, a synchronous pulley 202 is arranged at the top of the carrying table body 1, a first synchronous belt 203 is sleeved on the outer surface of the synchronous pulley 202, a wire ball bearing 204 is arranged below the synchronous pulley 202, the wire ball bearing is arranged in the carrying table body 1, the synchronous pulley 202 rotates under the driving of the rotating motor 201 through the wire ball bearing 204, a film pressing ring lower limit switch 205 is arranged at the top of the carrying table body 1, a film pressing ring upper limit switch 206 is arranged at the top of the film pressing ring lower limit switch 205, the rotating motor 201 rotates on the rotating table mechanism 2, the synchronous pulley 202 is driven to move a film frame positioning mechanism 4 to a specified position through the first synchronous belt 203, the X-direction moving assembly 7 and the Y-direction moving assembly 5 move the rotating table mechanism 2 to a grain picking position, the rotating motor 201 moves on the rotating table mechanism 2, and finally the wafer is subjected to angle adjustment to prepare for grain picking.
Example 2
The film frame positioning mechanism 4 comprises a film pressing ring mounting plate 401, a film pressing ring 413, a film stretching ring mounting plate 402 and a film stretching ring 414, wherein the film pressing ring mounting plate 401 is arranged in the synchronous pulley 202, the film pressing ring 413 is mounted on the film pressing ring mounting plate 401, the film stretching ring mounting plate 402 is arranged in the synchronous pulley 202, the film stretching ring is mounted on the film stretching ring mounting plate, the film pressing ring 413 is mounted on the film pressing ring mounting plate 401, and a gap is reserved between the film pressing ring mounting plate and the film pressing ring mounting plate for placing the wafer film frame. Before the wafer film frame is placed, the film pressing ring 413 and the film pressing ring mounting plate 401 are lifted to the position of the limit switch 206 on the film pressing ring under the action of the threaded shaft 412, and the frame type transmission arm 3 takes the wafer film frame out of the carrier box, places the wafer film frame between the film pressing ring 413 and the film pressing ring mounting plate 401, and positions the wafer film frame.
The synchronous wheel turntable 202 is provided with a synchronous wheel screw body 404, a stretched film ring mounting plate 402, a clutch 406, a synchronous pulley 407 and an upper clutch 406 at the lower end of the synchronous pulley 407, a clutch motor 602 drives a lower clutch 604 so as to drive the upper clutch 406, the synchronous pulley 407 at the upper end of the upper clutch 406 drives a second synchronous belt 405 to move so as to drive the synchronous pulleys 407 on each synchronous screw body 404 to rotate, a nut 411 in the synchronous screw body 404 rotates along with the step pulley 407 so as to drive a threaded shaft 412 to ascend or descend, a needle roller thrust bearing 409 is arranged on the outer surface of the synchronous wheel screw body 404, a deep groove ball bearing 410 is arranged at the bottom of the needle roller thrust bearing 409, a nut 411 is arranged at the bottom of the deep groove ball bearing 410, a threaded shaft 412 is arranged inside the needle roller thrust bearing 409, a wafer can be positioned by a film frame positioning mechanism 4, and the film frame positioning mechanism 4 and the stretched film motor mechanism 6 are mutually matched to operate so as to complete stretched film movement.
The upper clutch 406 rotates to drive the synchronous pulley 407 to rotate, the synchronous pulley screw bodies 404 rotate under the action of the synchronous belt, the threaded shafts 412 together with the film pressing ring 413, the film pressing ring mounting plate 401 and the film frames inside the film pressing ring mounting plate descend, after the film frames contact the film stretching ring 414, the film pressing ring 408 descends continuously, the diameter of the film pressing ring 413 is larger than that of the film stretching ring 414, and when the lower surface of the film pressing ring is lower than that of the film stretching ring, the film in the film frame of the wafer passes through the gap between the film pressing ring 413 and the film stretching ring 414. The film pressing ring 413 continues to move downwards to the lower limit switch 205 of the film pressing ring, at this time, the upper surface of the film pressing ring 413 is lower than the upper surface of the film stretching ring 414, the wafer film frame in the circular area of the upper surface of the film stretching ring 414 is continuously stretched, and the crystal grains are separated from each other by utilizing the ductility of the film in the wafer film frame.
Example 3
The membrane stretching motor mechanism 6 comprises a motor mounting plate 601, a motor mounting plate 601 is arranged at the bottom of the carrier body 1, a clutch motor 602 is arranged at the bottom of the motor mounting plate 601, a positioning block 603 is arranged at the top of the motor mounting plate 601, a lower clutch 604 is arranged at the top of the motor mounting plate 601, a motor lifting cylinder 605 is arranged at the top of the motor mounting plate 601, a first motor cylinder sensor 606 is arranged on the outer surface of the motor lifting cylinder 605, a second motor cylinder sensor 607 is arranged on the outer surface of the motor lifting cylinder 605, a positioning block mounting plate 608 is arranged at the top of the motor mounting plate 601, a positioning block lifting cylinder 609 is arranged on the side surface of the motor mounting plate 601, a first positioning block cylinder sensor 610 is arranged on the outer surface of the positioning block lifting cylinder 609, a second positioning block cylinder sensor 611 is arranged on the outer surface of the positioning block lifting cylinder 609, signals can be transmitted, and driving equipment can move in position.
The method is implemented by the following steps:
when the film frame loaded with the wafer needs to be positioned on the carrier body 1, the Y-direction moving component 5 and the X-direction moving component 7 on the carrier body 1 move the carrier body 1 to a designated position, the rotating motor 201 on the rotating platform mechanism 2 rotates, the synchronous wheel disc 202 is driven by the first synchronous belt 203 to move the film frame positioning mechanism 4 to the designated position, the frame type transmission arm 3 carries the film frame to the film frame positioning mechanism 4, after the wafer is positioned on the film frame positioning mechanism 4, the positioning block lifting cylinder 609 in the film stretching motor mechanism 6 retracts, the positioning block mounting plate 608 is driven to rise, the positioning block 603 on the positioning block mounting plate 608 also rises, after the positioning hole on the positioning block 603 and the positioning pin 408 on the film frame positioning mechanism 4 are positioned, the second positioning block cylinder sensor 611 on the film stretching motor mechanism 6 outputs a signal, the action enters the next step, if no signal is output, the equipment alarms, when the second positioning block cylinder sensor 611 has signal output, the motor lifting cylinder 605 is retracted, at this time, the motor mounting plate 601 rises together with the clutch motor 602 and the lower clutch 604, after the lower clutch 604 is successfully meshed with the upper clutch 406, the second motor cylinder sensor 607 has signal output, when the second motor cylinder sensor 607 does not have signal output, the motor lifting cylinder 605 extends, the clutch motor 602 rotates by a certain angle, the meshing action is repeated, after the upper clutch 406 is successfully meshed with the lower clutch 604, the clutch motor 602 rotates, the lower clutch 604 and the upper clutch 406 rotate the synchronous pulleys 407 under the action of the clutch motor 602, the synchronous pulleys 407 connect all synchronous pulley screw bodies 404 through the second synchronous belts 405 and drive the second synchronous belts 405 in all the synchronous pulley screw bodies 404 to rotate, the second synchronous belt 405 is tightly connected with the nut 411, the second synchronous belt 405 drives the nut 411 to rotate simultaneously, lifting movement of the threaded shaft 412 is achieved through threaded connection, the film pressing ring mounting plate 401 moves up and down under the action of the guide component 403 and the synchronous wheel screw body 404, after the film pressing ring mounting plate 401 moves to the position of the lower limit switch 205 of the film pressing ring, the clutch motor 602 stops rotating, the movement of the film pressing ring mounting plate 401 stops, then the motor lifting cylinder 605 stretches out, the motor mounting plate 601 and the clutch motor 602 move downwards under the action of the motor lifting cylinder 605, the lower clutch 604 is separated from the upper clutch 406, after the motor lifting cylinder 605 stretches out, the first motor cylinder sensor 606 outputs a signal, the positioning block lifting cylinder 609 stretches out, the positioning block mounting plate 608 and the positioning block 603 move downwards, after the positioning block lifting cylinder 609 stretches out to the position, the first positioning block cylinder sensor 610 outputs a signal, at this time, the positioning block 603 is separated from the positioning pin 408, the X-direction moving component 7 and the Y-direction moving component 5 move the mechanism 2 to a grain pickup position, the rotating motor 201 moves down on the rotating table, and finally the angle of the rotating table 2 moves to prepare the grains for pickup.
In summary, according to the wafer positioning carrier for chip packaging, the wafer is positioned by utilizing the tooling structure in the cutting process according to the process requirement of the wafer after the cutting process, the wafer is positioned in the horizontal plane by utilizing the stretching mode, the grains are separated from each other in the stretching process by utilizing the stretching characteristic of the film, the effect of horizontally placing the wafer and mutually separating the grains is synchronously realized after the positioning of the film frame is finished by applying the stretching structure, and the possibility of damaging the grains in the picking process of the grains is reduced while the picking of the grains is facilitated.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a wafer location carrier for chip package, includes the carrier body, its characterized in that: the top of the carrier body is provided with a rotating table mechanism, the top of the carrier body is provided with a frame type transmission arm, the top of the carrier body is provided with a film frame positioning mechanism, the bottom of the carrier body is provided with a Y-direction movement assembly, the bottom of the carrier body is provided with a film stretching motor mechanism, and the top of the carrier body is provided with an X-direction movement assembly;
the top of the carrier body is provided with a synchronous wheel disc,
the membrane frame positioning mechanism comprises a membrane pressing ring mounting plate, a membrane pressing ring, a membrane stretching ring mounting plate and a membrane stretching ring, wherein the membrane pressing ring mounting plate is arranged in the synchronous wheel disc, the membrane pressing ring is arranged on the membrane pressing ring mounting plate, a gap is arranged between the membrane pressing ring mounting plate and the membrane pressing ring,
a membrane stretching ring mounting plate is arranged in the synchronous wheel disc, a membrane stretching ring is arranged on the membrane stretching ring mounting plate,
the top of membrane stretching ring mounting panel is provided with guiding component, the top of membrane stretching ring mounting panel is provided with the synchronizing wheel screw rod body, synchronizing wheel screw rod body transmission is connected with the second hold-in range, the top of membrane stretching ring mounting panel is provided with the clutch, synchronizing wheel screw rod body, membrane stretching ring mounting panel, clutch, synchronous pulley are all installed on the synchronizing wheel carousel, the top of going up the clutch is provided with synchronous pulley, the left side of going up the clutch is provided with the locating pin, the surface of synchronizing wheel screw rod body is provided with bearing, bearing's bottom is provided with deep groove ball bearing, bearing's bottom is provided with the nut, bearing's inside is provided with the screw thread axle, the upper end of screw thread axle all is connected with the membrane pressing ring mounting panel in the synchronizing wheel screw rod body.
2. A wafer positioning stage for chip packaging as defined in claim 1, wherein: the rotary table mechanism comprises a rotary motor, the rotary motor is arranged in the carrier table body, a first synchronous belt is sleeved on the outer surface of the synchronous pulley disc, a wire ball bearing is arranged on the outer surface of the synchronous pulley disc, a film pressing ring lower limit switch is arranged at the top of the carrier table body, and a film pressing ring upper limit switch is arranged at the top of the film pressing ring lower limit switch.
3. A wafer positioning stage for chip packaging as defined in claim 1, wherein: the membrane stretching motor mechanism comprises a motor mounting plate, the bottom of the carrying platform body is provided with the motor mounting plate, the bottom of the motor mounting plate is provided with a clutch motor, the top of the motor mounting plate is provided with a positioning block, the top of the motor mounting plate is provided with a lower clutch, the top of the motor mounting plate is provided with a motor lifting cylinder, the outer surface of the motor lifting cylinder is provided with a first motor cylinder sensor, the outer surface of the motor lifting cylinder is provided with a second motor cylinder sensor, the top of the motor mounting plate is provided with a positioning block mounting plate, the side surface of the motor mounting plate is provided with a positioning block lifting cylinder, the outer surface of the positioning block lifting cylinder is provided with a first positioning block cylinder sensor, and the outer surface of the positioning block lifting cylinder is provided with a second positioning block cylinder sensor.
4. A wafer positioning stage for chip packaging according to claim 3, wherein: the left side of the synchronous pulley is meshed with the right side of the locating pin, and the synchronous pulley screw body is connected to the locating pin through a second synchronous belt in a transmission mode.
5. A wafer positioning stage for chip packaging according to claim 2, wherein: the output shaft of the rotating motor is sleeved with a first synchronous belt, and the first synchronous belt is sleeved on the outer surface of the wire ball bearing.
6. A wafer positioning stage for chip packaging as defined in claim 1, wherein: the Y-direction motion assembly and the X-direction motion assembly comprise a driving motor, a limiting sliding seat, a screw rod and a sliding block, an output shaft of the driving motor is fixedly connected with the screw rod, the sliding block is sleeved on the outer surface of the screw rod, and the driving motor, the screw rod and the sliding block are both positioned on the limiting sliding seat.
7. A wafer positioning stage for chip packaging according to claim 3, wherein: the inside of the carrier body is provided with a mounting hole matched with the positioning block and the lower clutch, and the tops of the positioning block and the lower clutch extend to the upper part of the carrier body.
8. A wafer positioning stage for chip packaging as defined in claim 1, wherein: the top of synchronizing wheel screw rod body extends to the top of kingpin thrust bearing, and the diameter of synchronizing wheel carousel is greater than the diameter of membrane stretching ring mounting panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311774079.9A CN117457561B (en) | 2023-12-22 | 2023-12-22 | Wafer positioning carrier for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311774079.9A CN117457561B (en) | 2023-12-22 | 2023-12-22 | Wafer positioning carrier for chip packaging |
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| Publication Number | Publication Date |
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| CN117457561A CN117457561A (en) | 2024-01-26 |
| CN117457561B true CN117457561B (en) | 2024-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311774079.9A Active CN117457561B (en) | 2023-12-22 | 2023-12-22 | Wafer positioning carrier for chip packaging |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409385A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Machining device for wafer bearing frame |
| CN113526117A (en) * | 2021-07-22 | 2021-10-22 | 苏州拓多智能科技有限公司 | Automatic expansion and feeding mechanism for wafer bottom film of chip sorting machine |
| CN215118859U (en) * | 2021-06-20 | 2021-12-10 | 东莞市思榕智能装备有限公司 | Wafer taking device |
| CN217588872U (en) * | 2022-06-28 | 2022-10-14 | 厦门柯尔自动化设备有限公司 | Wafer moving and expanding platform |
| CN115588639A (en) * | 2022-12-12 | 2023-01-10 | 常州铭赛机器人科技股份有限公司 | Chip supply device and chip supply method |
| CN116544151A (en) * | 2023-07-05 | 2023-08-04 | 砺铸智能设备(天津)有限公司 | Detection and packaging equipment for chip |
-
2023
- 2023-12-22 CN CN202311774079.9A patent/CN117457561B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409385A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Machining device for wafer bearing frame |
| CN215118859U (en) * | 2021-06-20 | 2021-12-10 | 东莞市思榕智能装备有限公司 | Wafer taking device |
| CN113526117A (en) * | 2021-07-22 | 2021-10-22 | 苏州拓多智能科技有限公司 | Automatic expansion and feeding mechanism for wafer bottom film of chip sorting machine |
| CN217588872U (en) * | 2022-06-28 | 2022-10-14 | 厦门柯尔自动化设备有限公司 | Wafer moving and expanding platform |
| CN115588639A (en) * | 2022-12-12 | 2023-01-10 | 常州铭赛机器人科技股份有限公司 | Chip supply device and chip supply method |
| CN116544151A (en) * | 2023-07-05 | 2023-08-04 | 砺铸智能设备(天津)有限公司 | Detection and packaging equipment for chip |
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