CN104409385A - Machining device for wafer bearing frame - Google Patents
Machining device for wafer bearing frame Download PDFInfo
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- CN104409385A CN104409385A CN201410559475.4A CN201410559475A CN104409385A CN 104409385 A CN104409385 A CN 104409385A CN 201410559475 A CN201410559475 A CN 201410559475A CN 104409385 A CN104409385 A CN 104409385A
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- wafer carrying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The invention discloses a machining device for a wafer bearing frame. The machining device is characterized by comprising a film tightening device and a support table, wherein the film tightening device is used for tightening a film in order that the film has tension; the film tightening device is arranged movably; the support table is arranged opposite to the film tightening device, and is used for supporting a film tightening frame; the film tightening device is pressed against the film after moving towards the film in order to tighten the film; and after the film tightening device moves relative to the support table, the film is pressed against the film tightening frame positioned on the support table. Through adoption of the machining device for the wafer bearing frame provided by the invention, machining automation of the wafer bearing frame is realized, and the production efficiency and production yield of the wafer bearing frame are increased greatly.
Description
Technical field
The present invention relates to wafer and manufacture field, particularly a kind of film sticking apparatus of pad pasting on the film frame that stretches tight at carrying wafer.
Background technology
Wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer.Wafer can manufacture various circuit component structure, usually the face with circuit component structure is called front, namely on the other side be called the back side.In wafer fabrication processes, in multiple tracks procedure, need wafer to stick on wafer carrying frame carry out.As illustrated in fig. 1 and 2, wafer carrying frame comprises one and to stretch tight film frame 01 and film 02.Film 02 sticks to and stretches tight on film frame 01.During use, wafer 03 sticks on film 02.Cut in the process of multiple little wafer by monoblock wafer 03 at cutting tool, the film 02 with some tension can avoid multiple little wafer to scatter, thus avoids little wafer breakage.In the process of thinned wafer 03, the film 02 with some tension can effectively avoid the wafer 03 of lower thickness be out of shape or rupture.
The high-quality film frame that stretches tight needs film to have certain tension force, to keep the levelness of wafer.The processing technology of traditional wafer carrying frame, by one or more workman's manual operations, stretches tight being attached to after manual for film tightening on film frame 01, then in rolling on film frame 01 of stretching tight after pressing film by cylinder, makes to treat that film cements with the film frame 01 that stretches tight.The film frame 01 that stretches tight excises with the film of exterior domain by hand-held cutter again.In above-mentioned technique, the stability of the film that stretches tight by hand is very poor, and cannot adjust and control the tension force of film, the film precision that stretches tight is low.The pulling force of workman crosses conference makes film stretch tight brokenly and scrap, and reduces production qualification rate; The too small meeting of pulling force makes membrane tension not enough.Stretch tight the problems such as film also can cause the tension distribution of film uneven by hand.The tension force of film is not enough or skewness can make film loosen, and creases easily, when wafer sticks on film, cannot keep smooth, very easily cause wafer to scatter, be out of shape, rupture or breakage, lose and reduce wafer carrying frame to the carrying effect of wafer, affect subsequent technique.Stability and the precision of cutting by hand film are also poor, very easily scrap because the misoperation of workman makes breakage of thin film applied.Above-mentioned technique also has the low defect of production efficiency, cannot meet suitability for industrialized production.
Summary of the invention
The object of the invention is to overcome deficiency of the prior art, a kind of convenient wafer carrying plate processing unit (plant) controlling membrane tension is provided.
For realizing above object, the present invention is achieved through the following technical solutions:
The processing unit (plant) of wafer carrying frame, is characterized in that, comprising:
Stretch tight film device, for tightening film, makes thin film tensioned; The described film device that stretches tight is arranged movingly;
Brace table; Described brace table and the described film device that stretches tight are oppositely arranged, for supporting the film frame that stretches tight;
The described film device that stretches tight supports film after film movement, is tightened by film; After described stretch tight film device and described brace table relative motion, thin film is leaned against and is positioned at the stretching tight on film frame of brace table.
Preferably, described in the film device that stretches tight be arranged on above described brace table, described brace table is liftably arranged; Also comprise reciprocating first drive unit; Described first drive unit is driven described brace table to rise and declines or risen by brace table described in the first actuator drives and decline.
Preferably, described first drive unit is the first cylinder.
Preferably, described brace table can be arranged with moving horizontally; Also comprise shuttle second drive unit; Described second drive unit is driven described brace table to move horizontally or is moved horizontally by brace table described in the second actuator drives.
Preferably, described second drive unit is Rodless cylinder; Rodless cylinder comprises guide rod and slide block; Described slide block is arranged on described guide rod, and can move along described guide rod; Described brace table is arranged on described slide block.
Preferably, the film device that stretches tight described in comprises the fixture for clamping film and expands film bucket; Described expansion film bucket can be arranged by relatively described fixture movably; Described holder film, described expansion film bucket moves towards film supports film, makes film tensioning.
Preferably, described fixture comprises the first folder film frame and the second folder film frame; It is setting up and down that described first folder film frame and described second presss from both sides film frame; Described first folder film frame and described second folder film frame can close to each other or remotely be arranged; Described first folder film frame and described second folder film frame rear clamping films close to each other.
Preferably, described first folder film frame is arranged movablely; Also comprise for driving described first folder film to frame shift dynamic reciprocating 3rd drive unit; Described 3rd drive unit drives described first folder film frame move back and forth or frame shift dynamic by the first folder film described in the 3rd actuator drives.
Preferably, described 3rd drive unit is moved up and down by the first folder film frame described in the 3rd actuator drives.
Preferably, described 3rd drive unit is motor; Described 3rd transmission device comprises screw mandrel and screw shell; Described screw mandrel and described screw shell threaded engagement; Described screw mandrel and screw shell one of them arrange rotationally, another presss from both sides film frame be connected with described first; Described motor drives described screw mandrel or described screw shell to rotate.
Preferably, described brace table is arranged on the mobile route of described expansion film bucket; Also comprise the shuttle four-drive device for driving the movement of described expansion film bucket; Described four-drive device drives described expansion film bucket to move back and forth or moves back and forth by expanding film bucket described in the 4th actuator drives.
Preferably, described four-drive device is the second cylinder.
Preferably, the film cutting apparatus for cutting film is also comprised; Described film cutting apparatus is arranged rotationally, and liftably arranges.
Preferably, described film cutting apparatus comprises cuts membrane support; Described cutting on membrane support is provided with cutting knife and at least one cylinder; Described cylinder is arranged rotationally; Described cutting knife to be arranged on cylinder described at least one and to be positioned at outside described cylinder.
Preferably, the number of described cylinder is two, cuts membrane support two ends described in being separately positioned on; Described cutting in the middle part of membrane support is provided with runing rest, and described runing rest is arranged rotationally.
Preferably, the 5th drive unit is also comprised; Described 5th drive unit drives described runing rest to cut membrane support rotation or described in driving, cut membrane support rotation by runing rest described in the 5th actuator drives described in driving.
Preferably, shuttle 6th drive unit is also comprised; Described 6th drive unit is driven described film cutting apparatus to rise and declines or risen by film cutting apparatus described in the 6th actuator drives and decline.
Preferably, described 5th drive unit is electric rotating machine; Described 6th drive unit is the 3rd cylinder.
Preferably, the film device that stretches tight described in comprises expansion film bucket; Described expansion film bucket has a barrel chamber; Described film cutting apparatus is liftably installed in barrel chamber.
Preferably, also comprise and put film device and winder device; Described put film device and described winder device be separately positioned on described in stretch tight film device both sides; Described film device of putting is rolled up for support membrane, and releases film in film volume rotation process; Described winder device is for collecting the surplus film after having attached.
The processing unit (plant) of the wafer carrying frame in the present invention, by the process automation of wafer carrying frame, production efficiency improves greatly.Being pasted onto after tightening film by the film device that stretches tight stretches tight on film frame again, and more traditional craft membrane stability that stretches tight improves greatly.The film device that stretches tight can make film tighten and the convenient control of Tensity size and adjustment, film is made to have the tension force of carrying needed for wafer, effectively avoid that film Yin Lali in the manual film that stretches tight is excessive and breakage is scrapped, Yin Lali is too small and a hypodynamic defect, greatly improve the production qualification rate of wafer carrying frame.The film device that stretches tight can realize the adjustment to membrane tension size, and the tension force had by film quantizes, and improves the film precision that stretches tight, improves the quality of wafer carrying frame.The wafer carrying frame carrying wafer adopting processing unit (plant) of the present invention to process to obtain, more stable, reliable, greatly reduce and even eliminate wafer and scatter, be out of shape and rupture or the possibility of breakage.
Accompanying drawing explanation
Fig. 1 is the structural representation of wafer carrying frame;
Fig. 2 is the structure cutaway view of the wafer carrying frame carrying wafer;
Fig. 3 is the Facad structure view of the processing unit (plant) of wafer carrying frame in the present invention;
Fig. 4 is the structure view of the processing unit (plant) of wafer carrying frame in the present invention;
Fig. 5 is the structural front view of the processing unit (plant) of wafer carrying frame in the present invention;
Fig. 6 is the partial structurtes view of the processing unit (plant) of wafer carrying frame in the present invention;
Fig. 7 is the partial structurtes schematic diagram of the processing unit (plant) of wafer carrying frame in the present invention;
Fig. 8 is the film frame scheme of installation that stretches tight in the processing unit (plant) use procedure of wafer carrying frame in the present invention;
Fig. 9 is the schematic diagram using tightening device to tighten film.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
As shown in figs. 4-7, the processing unit (plant) of wafer carrying frame, comprises support 1.Support 1 left and right sides is respectively arranged with puts film device 91 and winder device 92.Put film device 91 for support membrane volume, and release film in film volume rotation process.Winder device 92 is for collecting the surplus film after having attached.Support 1 is provided with the film device that stretches tight.Film is from process below the film device that stretches tight, and the film device that stretches tight supports film after film movement, is tightened by film, makes thin film tensioned.The stretch tight below of film device is provided with brace table 2 for supporting the film frame 01 that stretches tight.Stretch tight film device and brace table 2 can close to each other or remotely be arranged.Stretch tight film device and brace table 2 close to each other after, thin film is leaned against the film frame 01 that stretches tight being positioned at brace table 2.
Brace table 2 can move horizontally and arrange up and down.In the preferred embodiments of the present invention, compound first drive unit is adopted to drive brace table 2 to rise and decline.The first cylinder 31 selected by first drive unit.First cylinder 31 arranges the below being positioned at brace table 2.The piston rod of the first cylinder 31 is connected with brace table 2, drives brace table 2 to rise and decline, thus regulates the height and position of brace table 2.
The present invention adopts reciprocating second drive unit to drive brace table 2 to move horizontally.Preferably Rodless cylinder 32 selected by the second drive unit.Rodless cylinder 32 comprises guide rod 321 and slide block 322.Guide rod 321 is horizontally set on the below of brace table 2.Slide block 322 is arranged on guide rod 321, and can move along guide rod 321.First drives cylinder 31 to be arranged on slide block 322.The piston (not shown) of Rodless cylinder 32 can drive slide block 322 to move along guide rod 321, thus drives brace table 2 to move horizontally.Rodless cylinder 32 also can use linear electric motors to replace.
The film device that stretches tight comprises the fixture for clamping film.Fixture and brace table 2 can close to each other or remotely be arranged.Fixture comprises the first folder film frame 41 and the second folder film frame 42.First folder film frame 41 and the second folder film frame 42 can close to each other or remotely be arranged.Film press from both sides between film frame 42 from the first folder film frame 41 and second and passes, and the first folder film frame 41 and second presss from both sides film frame 42 rear clamping films close to each other.Wherein, the second folder film frame 42 is fixedly mounted on support 1, and is positioned at the top of brace table 2.First folder film frame 41 is liftably arranged on support 1, and is positioned at the top of the second folder film frame 41.
Originally implement and adopt reciprocating 3rd drive unit to drive the first folder film frame 41 to move.3rd drive unit presss from both sides film frame 41 by the 3rd actuator drives first and moves up and down.3rd drive unit is motor 33.3rd transmission device comprises four screw mandrels 51 and four screw shells 52.Each screw shell 52 is installed in rotation on the fixed head 11 that is fixedly connected with support 1, each screw mandrel 51 and screw shell 52 threaded engagement.Screw mandrel 51 presss from both sides film frame 41 through the second folder film frame 42 and first and is connected.The lower end and first of screw mandrel 51 presss from both sides film frame 41 and is connected, and drives the first folder film frame 41 to rise or declines, make the first folder film frame 41 near or press from both sides film frame 42 away from second.Screw mandrel 51 is all provided with first drive pulley 61, first drive pulley 61 to be in transmission connection by the first driving-belt 62, thus makes four screw mandrel 51 synchronization liftings.
On motor 33 mounting plate 11, rotated by actuator drives screw mandrel 51.Transmission device comprises the second drive pulley 63 and the second driving-belt 64.Second drive pulley 63 is arranged on one of them screw mandrel 51, on the power output shaft that the two ends of the second driving-belt 64 are enclosed within stepping motor 33 respectively and the second drive pulley 63.The power output shaft of motor 33 rotates, and drives one of them screw mandrel 51, then drive three screw mandrels 51 by the first drive pulley 61 and the first driving-belt 62 by the second driving-belt 64 and the second drive pulley 63.
The film device that stretches tight also comprises expansion film bucket 7.Expand film bucket 7 can arrange movably by opposed jaw.The present invention adopts reciprocating four-drive device to drive expansion film bucket 7 to move.Four-drive device selects the second cylinder 34.Second cylinder 34 is arranged on fixed head 11, and is positioned at the top expanding film bucket 7.The piston rod of the second cylinder 34 is connected with the first portable plate 12 on support 1, expands film bucket 7 and is connected with the first portable plate 12 by connecting rod 71.The piston rod of the second cylinder 34 is stretched or contracts, and drives portable plate 12 to decline or rises, drives further to expand film bucket 7 and decline or rise, thus makes expansion film bucket 7 close or away from fixture.First folder film frame 41 and the second folder film frame 42 by film clamp on the descent path expanding film bucket 7.Linear electric motors 32 can drive brace table 2 to move on the descent path of expansion film bucket 7.Expansion film bucket 7 moves towards the film of holder and supports film, makes film tensioning.
The processing unit (plant) of wafer carrying frame also comprises the film cutting apparatus for cutting film.Film cutting apparatus comprises the roller of two flexible materials of outer layer covers (as rubber), is respectively the first roller 81 and the second roller 82, two rollers are installed in rotation on the two ends of cutting membrane support 83 respectively.The outside of the first roller 81 is provided with cutting knife 811.Wherein, when the first roller 81 rolls along the film frame that stretches tight, section 811 can cut the film stretched tight on film frame.The middle part of cutting membrane support 83 is provided with runing rest 351, and runing rest 351 is vertically arranged.Runing rest 351 can around its center axis thereof.
The processing unit (plant) of wafer carrying frame also comprises the 5th drive unit, and electric rotating machine 35 selected by the 5th drive unit.Electric rotating machine 35 is arranged on the second portable plate 13 of support 1, and the second portable plate 13 between the first portable plate 12 and brace table 2, and can rise or decline by relative first portable plate 12.The power output shaft of electric rotating machine 35 is connected with runing rest 351, drives runing rest 351 to rotate, thus drives two rollers to rotate around runing rest 351.Cutting knife 811 is arranged in the bucket chamber of expansion film bucket 7.
The processing unit (plant) of wafer carrying frame also comprises reciprocating 6th drive unit, and the 3rd cylinder 36 selected by the 6th drive unit.3rd cylinder 36 is arranged on the first portable plate 12, and its piston rod is connected with the second portable plate 13.The piston rod of the 3rd cylinder 36 is stretched or contracts, and drives the second portable plate 13 to decline or rise, and drive electric rotating machine 35 to decline or rise further, thus driving rolls and cutting knife 811 declines or rise.
The using method of the processing unit (plant) of wafer carrying frame of the present invention is as follows:
Film is installed---and film 04 is wrapped in a rolled-up condition and puts on film device 91.Put film device 91 and constantly release film 04 by rotating.Starter motor 33, drives four screw mandrels 51 to rise, thus drives the first folder film frame 41 away from the second folder film frame 42, makes to leave space between the first folder film frame 41 and the second folder film frame 42.Film 04 is through the space the first folder film frame 41 and the second folder film frame 42, and end is wrapped on winder device 92.Starter motor 33 again, drives four rhizoid bars 51 to decline, thus drives the first folder film frame 41 to coordinate clamping films 04 near the second folder film frame 42, first folder film frame 41 and the second folder film frame 42.
The film frame that stretches tight is installed---and the film frame 01 that will stretch tight is placed on brace table 2, and is locked at the assigned address on brace table 2 by existing locking device (as claw).Start Rodless cylinder 32, drive the first cylinder 31 to move right along guide rod 321 level, thus drive brace table 2 to move to the below of the second folder film frame 42, the film frame 01 that makes to stretch tight be positioned at expand film bucket 7 descent path on.Start the first cylinder 31, drive brace table 2 to rise, near the second folder film frame 42, main film body 04 in the vertical direction of the upper surface of the film frame 01 that stretches tight and the second folder film frame 42 frame inner region maintains a certain distance (as shown in Figure 8).
Stretch tight film and sticking film---and start the second cylinder 34, drive expansion film bucket 7 to decline.After the main film body 04 that the lower surface and second expanding film bucket 7 presss from both sides film frame 42 frame inner region contacts, the main film body 04 supporting this region moves down, and main film body 04 is tightened.Fixture coordinates with expansion film bucket 7, the main film body 04 of the second folder film frame 42 frame inner region is stretched, thus has certain tension force.Stretch tight film device entire lowering, the film tightened finally is resisted against and stretches tight (as shown in Figure 9) on film frame 01.
Cutting film---start the 3rd cylinder 36, driving is cut membrane support 83 and is declined, thus makes two rollers near brace table 2, finally makes roller stretch tight in the main film body 04 of film frame 01 by being pressed in cover.Start electric rotating machine 35, drive runing rest 351 to rotate, thus pushing rolling wheels rolls along the film frame 01 that stretches tight.By pressing, the rolling of roller, make main film body 04 firmly bonding with the film frame 01 that stretches tight.When first roller 81 rolls along the film frame 01 that stretches tight, section 811 and first roller 81 synchronous rolling, cut film, and the covering film frame 01 that stretches tight is separated with main film body 04 with the film of the film frame 01 frame inner region that stretches tight.
Start the first cylinder 31, brace table 2 is declined, take off from brace table 2 the wafer carrying frame completed.So far, the making of a wafer carrying frame is namely completed.
Starter motor 33, drives four screw mandrels 51 to rise, thus drives the first folder film frame 41 away from the second folder film frame 42, makes to leave space between the first folder film frame 41 and the second folder film frame 42.Start winder device 92, used main film body 04 is collected, and drive and put film device 91 and release new film, carry out the processing of next wafer carrying frame.
Upper and lower, left and right in the present invention, level, being vertically all reference with Fig. 3, for clearly describing the present invention and the relative concept used, not forming the restriction to right.
Embodiment in the present invention, only for the present invention will be described, does not form the restriction to right, other equivalent in fact substituting, all in scope that those skilled in that art can expect.
Claims (20)
1. the processing unit (plant) of wafer carrying frame, is characterized in that, comprising:
Stretch tight film device, for tightening film, makes thin film tensioned; The described film device that stretches tight is arranged movingly;
Brace table; Described brace table and the described film device that stretches tight are oppositely arranged, for supporting the film frame that stretches tight;
The described film device that stretches tight supports film after film movement, is tightened by film; After described stretch tight film device and described brace table relative motion, thin film is leaned against and is positioned at the stretching tight on film frame of brace table.
2. the processing unit (plant) of wafer carrying frame according to claim 1, is characterized in that, described in the film device that stretches tight be arranged on above described brace table, described brace table is liftably arranged; Also comprise reciprocating first drive unit; Described first drive unit is driven described brace table to rise and declines or risen by brace table described in the first actuator drives and decline.
3. the processing unit (plant) of wafer carrying frame according to claim 2, is characterized in that, described first drive unit is the first cylinder.
4. the processing unit (plant) of wafer carrying frame according to claim 1, is characterized in that, described brace table can be arranged with moving horizontally; Also comprise shuttle second drive unit; Described second drive unit is driven described brace table to move horizontally or is moved horizontally by brace table described in the second actuator drives.
5. the processing unit (plant) of wafer carrying frame according to claim 4, is characterized in that, described second drive unit is Rodless cylinder; Rodless cylinder comprises guide rod and slide block; Described slide block is arranged on described guide rod, and can move along described guide rod; Described brace table is arranged on described slide block.
6. the processing unit (plant) of wafer carrying frame according to claim 1, is characterized in that, described in the film device that stretches tight comprise fixture for clamping film and expand film bucket; Described expansion film bucket can be arranged by relatively described fixture movably; Described holder film, described expansion film bucket moves towards film supports film, makes film tensioning.
7. the processing unit (plant) of wafer carrying frame according to claim 6, is characterized in that, described fixture comprises the first folder film frame and the second folder film frame; It is setting up and down that described first folder film frame and described second presss from both sides film frame; Described first folder film frame and described second folder film frame can close to each other or remotely be arranged; Described first folder film frame and described second folder film frame rear clamping films close to each other.
8. the processing unit (plant) of wafer carrying frame according to claim 7, is characterized in that, described first folder film frame is arranged movablely; Also comprise for driving described first folder film to frame shift dynamic reciprocating 3rd drive unit; Described 3rd drive unit drives described first folder film frame move back and forth or frame shift dynamic by the first folder film described in the 3rd actuator drives.
9. the processing unit (plant) of wafer carrying frame according to claim 8, is characterized in that, described 3rd drive unit is moved up and down by the first folder film frame described in the 3rd actuator drives.
10. the processing unit (plant) of wafer carrying frame according to claim 9, is characterized in that, described 3rd drive unit is motor; Described 3rd transmission device comprises screw mandrel and screw shell; Described screw mandrel and described screw shell threaded engagement; Described screw mandrel and screw shell one of them arrange rotationally, another presss from both sides film frame be connected with described first; Described motor drives described screw mandrel or described screw shell to rotate.
The processing unit (plant) of 11. wafer carrying frames according to claim 6, is characterized in that, described brace table is arranged on the mobile route of described expansion film bucket; Also comprise the shuttle four-drive device for driving the movement of described expansion film bucket; Described four-drive device drives described expansion film bucket to move back and forth or moves back and forth by expanding film bucket described in the 4th actuator drives.
The processing unit (plant) of 12. wafer carrying frames according to claim 11, it is characterized in that, described four-drive device is the second cylinder.
The processing unit (plant) of 13. wafer carrying frames according to claim 1, is characterized in that, also comprises the film cutting apparatus for cutting film; Described film cutting apparatus is arranged rotationally, and liftably arranges.
The processing unit (plant) of 14. wafer carrying frames according to claim 13, is characterized in that, described film cutting apparatus comprises cuts membrane support; Described cutting on membrane support is provided with cutting knife and at least one cylinder; Described cylinder is arranged rotationally; Described cutting knife to be arranged on cylinder described at least one and to be positioned at outside described cylinder.
The processing unit (plant) of 15. wafer carrying frames according to claim 14, is characterized in that, the number of described cylinder is two, cuts membrane support two ends described in being separately positioned on; Described cutting in the middle part of membrane support is provided with runing rest, and described runing rest is arranged rotationally.
The processing unit (plant) of 16. wafer carrying frames according to claim 15, is characterized in that, also comprises the 5th drive unit; Described 5th drive unit drives described runing rest to cut membrane support rotation or described in driving, cut membrane support rotation by runing rest described in the 5th actuator drives described in driving.
The processing unit (plant) of 17. wafer carrying frames according to claim 16, is characterized in that, also comprises shuttle 6th drive unit; Described 6th drive unit is driven described film cutting apparatus to rise and declines or risen by film cutting apparatus described in the 6th actuator drives and decline.
The processing unit (plant) of 18. wafer carrying frames according to claim 17, is characterized in that, described 5th drive unit is electric rotating machine; Described 6th drive unit is the 3rd cylinder.
The processing unit (plant) of 19. wafer carrying frames according to claim 13, is characterized in that, described in the film device that stretches tight comprise and expand film bucket; Described expansion film bucket has a barrel chamber; Described film cutting apparatus is liftably installed in barrel chamber.
The processing unit (plant) of 20. wafer carrying frames according to claim 1, is characterized in that, also comprises and puts film device and winder device; Described put film device and described winder device be separately positioned on described in stretch tight film device both sides; Described film device of putting is rolled up for support membrane, and releases film in film volume rotation process; Described winder device is for collecting the surplus film after having attached.
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| CN201410559475.4A CN104409385B (en) | 2014-10-20 | 2014-10-20 | The processing unit (plant) of wafer carrying frame |
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| CN201410559475.4A CN104409385B (en) | 2014-10-20 | 2014-10-20 | The processing unit (plant) of wafer carrying frame |
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| CN104409385B CN104409385B (en) | 2017-12-01 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI631607B (en) * | 2017-08-09 | 2018-08-01 | 志聖工業股份有限公司 | Film cutting device and film cutting method thereof |
| CN109192697A (en) * | 2018-08-29 | 2019-01-11 | 中国科学院光电技术研究所 | A kind of fexible film tightens fixed device |
| CN110744910A (en) * | 2019-11-22 | 2020-02-04 | 重庆电子工程职业学院 | Wafer film covering device |
| CN110828352A (en) * | 2018-08-07 | 2020-02-21 | 福科胶研股份有限公司 | Wafer bearing method |
| CN112718304A (en) * | 2021-01-04 | 2021-04-30 | 深圳市腾盛精密装备股份有限公司 | Precise film-coated ink-jet structure |
| CN113764311A (en) * | 2021-08-30 | 2021-12-07 | 大连佳峰自动化股份有限公司 | Corner platform mechanism |
| CN115384883A (en) * | 2022-10-27 | 2022-11-25 | 佛山市川东磁电股份有限公司 | Film-coated packaging equipment for processing thermopile sensor chip |
| CN117227158A (en) * | 2023-11-13 | 2023-12-15 | 沈阳和研科技股份有限公司 | Film drawing mechanism and film sticking machine |
| CN117457561A (en) * | 2023-12-22 | 2024-01-26 | 砺铸智能设备(天津)有限公司 | Wafer positioning carrier for chip packaging |
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| CN202205803U (en) * | 2011-08-04 | 2012-04-25 | 厦门市弘瀚电子科技有限公司 | Full-automatic film and chip mounter |
| CN204271048U (en) * | 2014-10-20 | 2015-04-15 | 上海技美电子科技有限公司 | The processing unit (plant) of wafer carrying frame |
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| CN201769431U (en) * | 2010-08-20 | 2011-03-23 | 惠州泰科立集团股份有限公司 | Film sticking machine |
| CN202156098U (en) * | 2011-08-04 | 2012-03-07 | 厦门市弘瀚电子科技有限公司 | LED (light-emitting diode) glue film sticking machine |
| CN202205803U (en) * | 2011-08-04 | 2012-04-25 | 厦门市弘瀚电子科技有限公司 | Full-automatic film and chip mounter |
| CN204271048U (en) * | 2014-10-20 | 2015-04-15 | 上海技美电子科技有限公司 | The processing unit (plant) of wafer carrying frame |
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| TWI631607B (en) * | 2017-08-09 | 2018-08-01 | 志聖工業股份有限公司 | Film cutting device and film cutting method thereof |
| CN110828352A (en) * | 2018-08-07 | 2020-02-21 | 福科胶研股份有限公司 | Wafer bearing method |
| CN109192697A (en) * | 2018-08-29 | 2019-01-11 | 中国科学院光电技术研究所 | A kind of fexible film tightens fixed device |
| CN110744910A (en) * | 2019-11-22 | 2020-02-04 | 重庆电子工程职业学院 | Wafer film covering device |
| CN110744910B (en) * | 2019-11-22 | 2021-11-30 | 重庆电子工程职业学院 | Wafer film covering device |
| CN112718304B (en) * | 2021-01-04 | 2021-12-21 | 深圳市腾盛精密装备股份有限公司 | Precise film-coated ink-jet structure |
| CN112718304A (en) * | 2021-01-04 | 2021-04-30 | 深圳市腾盛精密装备股份有限公司 | Precise film-coated ink-jet structure |
| CN113764311A (en) * | 2021-08-30 | 2021-12-07 | 大连佳峰自动化股份有限公司 | Corner platform mechanism |
| CN113764311B (en) * | 2021-08-30 | 2024-02-02 | 大连佳峰自动化股份有限公司 | Corner platform mechanism |
| CN115384883A (en) * | 2022-10-27 | 2022-11-25 | 佛山市川东磁电股份有限公司 | Film-coated packaging equipment for processing thermopile sensor chip |
| CN115384883B (en) * | 2022-10-27 | 2023-02-03 | 佛山市川东磁电股份有限公司 | Film-coated packaging equipment for processing thermopile sensor chip |
| CN117227158A (en) * | 2023-11-13 | 2023-12-15 | 沈阳和研科技股份有限公司 | Film drawing mechanism and film sticking machine |
| CN117227158B (en) * | 2023-11-13 | 2024-01-19 | 沈阳和研科技股份有限公司 | Film drawing mechanism and film sticking machine |
| CN117457561A (en) * | 2023-12-22 | 2024-01-26 | 砺铸智能设备(天津)有限公司 | Wafer positioning carrier for chip packaging |
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