CN110744910B - Wafer film covering device - Google Patents
Wafer film covering device Download PDFInfo
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- CN110744910B CN110744910B CN201911156807.3A CN201911156807A CN110744910B CN 110744910 B CN110744910 B CN 110744910B CN 201911156807 A CN201911156807 A CN 201911156807A CN 110744910 B CN110744910 B CN 110744910B
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- slide rail
- film
- wafer
- fixedly connected
- telescopic rod
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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Abstract
The invention discloses a wafer film laminating device, wherein a clamping assembly clamps a wafer and drives the wafer to be close to a first cutting tool on a straight slide rail, a traction telescopic rod stretches towards an accommodating frame, clamps a film in the accommodating frame and drives the film to move towards the direction far away from the accommodating frame, so that the film is clamped between the traction telescopic rod and the accommodating frame, the clamping assembly drives the wafer to be in contact with the film, an annular slide rail drives a connecting arm to rotate, the first cutting tool is further driven to cut the film along the periphery of the wafer until the film is cut for a circle, the film is completely attached to the wafer, the film is cut in a fully mechanical mode, the cutting precision is higher, the stability is better, and the film laminating effect is better.
Description
Technical Field
The invention relates to the field of chip processing, in particular to a wafer film laminating device.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. Various circuit element structures can be manufactured on a wafer, and the circuit surface of the wafer, i.e. the surface that performs the function of a chip, is generally called a front surface, and the other surface is a back surface. In a wafer processing process, a dicing process is usually performed, and before dicing the wafer, a thin film, i.e., a dicing film, is usually attached to the back surface of the wafer in order to protect the wafer during dicing. In the traditional film pasting process, a film is arranged in a coiled mode, the film is continuously discharged after the film coil rotates, and the area of the film is larger than that of a wafer. After the film is attached to the surface of the wafer, the film is cut along the edge of the wafer by holding the blade, and the redundant film which exceeds the wafer is cut off, so that the process of attaching the film to the surface of the wafer is completed.
However, in the process of manually cutting the film, because the cutting personnel can not ensure that the shape of each cutting is the same, the deviation of the cut film often occurs, and the film covering effect is further influenced.
Disclosure of Invention
The invention aims to provide a wafer film covering device, and aims to solve the technical problem that in the process of manually cutting a film in the prior art, because a cutting person cannot guarantee that the shape of each cutting is the same, the film is frequently cut to generate deviation, and the film covering effect is further influenced.
In order to achieve the purpose, the invention adopts a wafer film coating device, which comprises an operation substrate, a straight slide rail, a first cutting tool, a clamping assembly and a film coating assembly; the straight slide rail is fixedly connected with the operation substrate and is positioned on the surface of the operation substrate, the first cutting tool is positioned on one side, close to the straight slide rail, of the operation substrate, the clamping assembly is slidably connected with the straight slide rail, the sliding direction of the clamping assembly faces the direction of the first cutting tool and is positioned on one side, far away from the operation substrate, of the straight slide rail, and the film covering assembly is fixedly connected with the operation substrate and is abutted against the straight slide rail; the film covering assembly comprises a storage frame, a traction telescopic rod and a cutting member, the storage frame is fixedly connected with the operating substrate and is positioned on one side of the straight slide rail and faces the direction of the straight slide rail, the traction telescopic rod is fixedly connected with the operating substrate and is abutted against the storage frame and is positioned on one side of the straight slide rail, which is far away from the storage frame, and the cutting member is fixedly connected with the operating substrate and is rotatably connected with the first cutting tool and is positioned between the storage frame and the traction telescopic rod; the cutting member includes annular slide rail, linking arm, annular slide rail with operation base plate fixed connection, and be located accomodate the frame with pull between the telescopic link, the linking arm with annular slide rail sliding connection, and with first cutting tool fixed connection, and be located annular slide rail is close to accomodate one side of frame.
The cutting component further comprises a rotary bearing, the rotary bearing is fixedly connected with the connecting arm, is rotatably connected with the first cutting tool and is positioned between the connecting arm and the first cutting tool.
The film covering assembly further comprises a first clamping block and a second clamping block, the first clamping block is fixedly connected with the traction telescopic rod and is positioned at one end, close to the containing frame, of the traction telescopic rod; the second clamping block is fixedly connected with the storage rack and is positioned on one side, close to the traction telescopic rod, of the storage rack to clamp the film.
The film covering assembly further comprises a second cutting tool, the second cutting tool is connected with the storage rack in a sliding mode and is located on one side, close to the traction telescopic rod, of the storage rack, close to the second clamping block, and the film covering assembly cuts the film.
The film laminating assembly further comprises a recycling conveying rail, wherein the recycling conveying rail is fixedly connected with the operation substrate and is positioned on one side, close to the storage rack, of the operation substrate and faces the direction of the storage rack.
The clamping assembly comprises a telescopic arm and a telescopic spring, the telescopic arm is connected with the straight slide rail in a sliding mode, faces the direction close to the annular slide rail and is located on one side, far away from the operation substrate, of the straight slide rail; the telescopic spring is abutted to the telescopic arm and is positioned in the telescopic arm.
The clamping assembly further comprises two supporting rods, the supporting rods are fixedly connected with the telescopic arms and are respectively located on two sides of the supporting rods and are respectively abutted to the storage rack and the traction telescopic rods.
The wafer film covering device further comprises an atomizing nozzle, wherein the atomizing nozzle is fixedly connected with the storage frame and faces towards the storage frame and the traction telescopic rod, and the atomizing nozzle is located on one side, close to the traction telescopic rod, of the storage frame.
The wafer film covering device further comprises a blower, wherein the blower is fixedly connected with the annular slide rail, is positioned in the annular slide rail and faces the traction telescopic rod and the storage rack.
The wafer film covering device further comprises a water collecting tank, wherein the water collecting tank is fixedly connected with the operation substrate, extends into the operation substrate, and is located between the traction telescopic rod and the storage rack.
According to the wafer film laminating device, the clamping assembly clamps a wafer and drives the wafer to be close to the first cutting tool on the straight slide rail, the traction telescopic rod stretches towards the accommodating frame and clamps a film in the accommodating frame and drives the film to move towards the direction far away from the accommodating frame, so that the film is clamped between the traction telescopic rod and the accommodating frame, the clamping assembly drives the wafer to be in contact with the film, the annular slide rail drives the connecting arm to rotate, the first cutting tool is further driven to cut the film along the periphery of the wafer until the film is cut for a circle, the film is completely attached to the wafer, the film is cut fully mechanically, the cutting precision is higher, the stability is better, and the film laminating effect is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall external structure of the film covering device of the present invention.
FIG. 2 is a schematic structural view of a membrane module of the present invention.
Fig. 3 is a schematic view of the structure of the cutting member of the present invention.
Fig. 4 is a schematic view of the internal structure of the storage rack of the present invention.
Fig. 5 is a schematic structural view of the clamping assembly of the present invention.
In the figure: 1-an operation substrate, 2-a straight slide rail, 3-a first cutting tool, 4-a clamping component, 5-a film coating component, 6-an atomizing nozzle, 7-a blower, 8-a water collecting tank, 41-a telescopic arm, 42-a telescopic spring, 43-a supporting rod, 51-a containing frame, 52-a traction telescopic rod, 53-a cutting component, 54-a first clamping block, 55-a second clamping block, 56-a second cutting tool, 57-a recycling transport rail, 100-a wafer film coating device, 531-an annular slide rail, 532-a connecting arm and 533-a rotary bearing.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In a first example of the present embodiment:
referring to fig. 1 to 4, the present invention provides a wafer film covering apparatus 100, which includes an operation substrate 1, a straight slide rail 2, a first cutting tool 3, a clamping assembly 4 and a film covering assembly 5; the straight-moving slide rail 2 is fixedly connected with the operation substrate 1 and is positioned on the surface of the operation substrate 1, the first cutting tool 3 is positioned on one side of the operation substrate 1 close to the straight-moving slide rail 2, the clamping component 4 is slidably connected with the straight-moving slide rail 2, the sliding direction of the clamping component faces the direction of the first cutting tool 3 and is positioned on one side of the straight-moving slide rail 2 far away from the operation substrate 1, and the film covering component 5 is fixedly connected with the operation substrate 1 and is abutted to the straight-moving slide rail 2; the film laminating assembly 5 comprises a storage frame 51, a traction telescopic rod 52 and a cutting member 53, wherein the storage frame 51 is fixedly connected with the operation substrate 1 and is positioned on one side of the straight slide rail 2 and faces the direction of the straight slide rail 2, the traction telescopic rod 52 is fixedly connected with the operation substrate 1 and is abutted against the storage frame 51 and is positioned on one side of the straight slide rail 2 away from the storage frame 51, and the cutting member 53 is fixedly connected with the operation substrate 1 and is rotatably connected with the first cutting tool 3 and is positioned between the storage frame 51 and the traction telescopic rod 52; the cutting member 53 includes an annular slide rail 531 and a connecting arm 532, the annular slide rail 531 is fixedly connected to the operating substrate 1, and is located between the accommodating frame 51 and the traction telescopic rod 52, the connecting arm 532 is slidably connected to the annular slide rail 531, is fixedly connected to the first cutting tool 3, and is located on one side of the accommodating frame 51 close to the annular slide rail 531.
Further, the cutting member 53 further comprises a rotary bearing 533, wherein the rotary bearing 533 is fixedly connected to the connecting arm 532, is rotatably connected to the first cutting tool 3, and is located between the connecting arm 532 and the first cutting tool 3.
Further, the film covering assembly 5 further comprises a first clamping block 54 and a second clamping block 55, wherein the first clamping block 54 is fixedly connected with the traction telescopic rod 52 and is located at one end of the traction telescopic rod 52 close to the storage rack 51; the second clamping block 55 is fixedly connected with the storage rack 51 and is positioned on one side of the storage rack 51 close to the traction telescopic rod 52 to clamp the film.
Further, the film covering assembly 5 further includes a second cutting tool 56, and the second cutting tool 56 is slidably connected to the storage rack 51, and is located on one side of the storage rack 51 close to the traction telescopic rod 52 and close to the second clamping block 55 to cut the film.
Further, the film covering assembly 5 further comprises a recycling transportation rail 57, and the recycling transportation rail 57 is fixedly connected with the operation substrate 1, is located on one side of the operation substrate 1 close to the storage rack 51, and faces the direction of the storage rack 51.
In this embodiment, the operation substrate 1 is connected with a robot arm by a screw, the robot arm drives the operation substrate 1 and the wafer clamped on the operation substrate 1 to move, when the film coating process is performed, the robot arm supports the operation substrate 1 to be vertical to a horizontal plane, the front surface of the operation base plate 1 is provided with the straight slide rail 2 in a threaded manner, the straight slide rail 2 is arranged along the vertical direction, and is positioned at the center of the operating base plate 1, the interior of the straight slide rail 2 is connected with a conveyor belt and a gear through a bracket, a driving motor is arranged in the straight slide rail 2 in a threaded manner, is connected with the gear through an output shaft of the driving motor and drives the axis of the gear to rotate, thereby driving the conveyor belt to rotate in the straight slide rail 2, the telescopic arm 41 is fixed with the conveyor belt through a threaded buckle plate, the wafer is clamped at the free end part and slides along the straight slide rail 2 under the driving of the conveyor belt; the annular slide rail 531 is a circular slide rail and is fixed on one side of the operating substrate 1 close to the straight slide rail 2 through a support and close to the end of the straight slide rail 2, the annular slide rail 531 is provided with a limit groove towards one side of the straight slide rail 2, a rotary table is internally threaded in the limit groove, the connecting arm 532 and the first cutting tool 3 are threadedly mounted on the front surface of the rotary table, the connecting arm 532 is a supporting arm of the first cutting tool 3 and enables the first cutting tool 3 and the rotary table to form a 30-degree included angle towards the outer side of the annular slide rail 531, the rotating bearing 533 is threadedly fixed between the connecting arm 532 and the first cutting tool 3, the first cutting tool 3 is fixed with the rotating inner shell of the rotating bearing 533 and is driven by a motor to rotate the rotating bearing 533 so as to drive the first cutting tool 3 to axially rotate, the cutting direction is changed, the connecting arm 532 and the first cutting tool 3 are driven to axially rotate through the rotation of the rotary table, the rear surface of the rotary table is uniformly provided with convex clamping teeth, the driving motor is arranged on the operation substrate 1 and is positioned on one side of the annular slide rail 531 away from the straight slide rail 2, the output shaft extends into the annular slide rail 531, and the rotary table is driven to rotate around the circle center; the storage rack 51 and the traction telescopic rod 52 are respectively positioned at the left side and the right side of the straight slide rail 2 and are oppositely installed, the storage rack 51 is internally provided with a rotating shaft, a film is stored in the storage rack 51 and is provided with an entrance, the film is enabled to enter and exit the storage rack 51 from the entrance of the storage rack 51, the second clamping block 55 is installed beside the entrance of the storage rack 51 through threads, the opening and the closing of the second clamping block 55 are controlled through a motor and are towards the direction of the film, the film is clamped and fixed, the first clamping block 54 is installed at the free end part of the traction telescopic rod 52 through threads, the first clamping block 54 is connected through the motor and drives the first clamping block 54 to clamp the film, and then the film is pulled out of the storage rack 51 through the traction telescopic rod 52 and supports the film; the second cutting tool 56 is slidably mounted at the entrance and exit of the storage rack 51, the second cutting tool 56 slides towards the direction of the film covering and cuts off the film covering, the surface of the recovery transportation rail 57 has a puncture connected with the film covering, after the film covering is cut by the first cutting tool 3, the recovery transportation rail 57 rotates and punctures the puncture into the film covering, the transportation rail is driven by a motor to rotate so as to drive the film covering to be recovered, thus, the clamping component 4 clamps the wafer and drives the wafer to be close to the first cutting tool 3 on the straight slide rail 2, the traction telescopic rod 52 extends and retracts towards the storage rack 51, clamps the film covering in the storage rack 51 through the first clamping block 54 and drives the film covering to move towards the direction far away from the storage rack 51, and the second clamping block 55 clamps one end of the film covering far away from the first clamping block 54, and the second cutting tool 56 cuts off the film, so that the film is positioned between the traction telescopic rod 52 and the containing frame 51 and is clamped, the clamping assembly 4 drives the wafer to be in contact with the film, the annular slide rail 531 drives the connecting arm 532 to rotate, and then drives the first cutting tool 3 to cut the film along the periphery of the wafer until a circle of cutting is finished, so that the film is completely attached to the wafer, the second clamping block 55 releases the film, the traction telescopic rod 52 drives the first clamping block 54 to drive the used film to move, meanwhile, the recovery conveying rail 57 is in contact with the film and drives the film to leave the first clamping block 54 for recovery, so that the film is cut fully mechanically, the cutting precision is higher, the stability is better, and the film covering effect is better.
In a second example of the present embodiment:
referring to fig. 1, fig. 2, fig. 3 and fig. 5, the present invention provides a wafer film covering apparatus 100, which includes an operation substrate 1, a straight slide rail 2, a first cutting tool 3, a clamping assembly 4 and a film covering assembly 5; the straight-moving slide rail 2 is fixedly connected with the operation substrate 1 and is positioned on the surface of the operation substrate 1, the first cutting tool 3 is positioned on one side of the operation substrate 1 close to the straight-moving slide rail 2, the clamping component 4 is slidably connected with the straight-moving slide rail 2, the sliding direction of the clamping component faces the direction of the first cutting tool 3 and is positioned on one side of the straight-moving slide rail 2 far away from the operation substrate 1, and the film covering component 5 is fixedly connected with the operation substrate 1 and is abutted to the straight-moving slide rail 2; the film laminating assembly 5 comprises a storage frame 51, a traction telescopic rod 52 and a cutting member 53, wherein the storage frame 51 is fixedly connected with the operation substrate 1 and is positioned on one side of the straight slide rail 2 and faces the direction of the straight slide rail 2, the traction telescopic rod 52 is fixedly connected with the operation substrate 1 and is abutted against the storage frame 51 and is positioned on one side of the straight slide rail 2 away from the storage frame 51, and the cutting member 53 is fixedly connected with the operation substrate 1 and is rotatably connected with the first cutting tool 3 and is positioned between the storage frame 51 and the traction telescopic rod 52; the cutting member 53 includes an annular slide rail 531 and a connecting arm 532, the annular slide rail 531 is fixedly connected to the operating substrate 1, and is located between the accommodating frame 51 and the traction telescopic rod 52, the connecting arm 532 is slidably connected to the annular slide rail 531, is fixedly connected to the first cutting tool 3, and is located on one side of the accommodating frame 51 close to the annular slide rail 531.
Further, the clamping assembly 4 comprises a telescopic arm 41 and a telescopic spring 42, wherein the telescopic arm 41 is slidably connected with the straight slide rail 2 and faces to the direction close to the annular slide rail 531, and is located on one side of the straight slide rail 2 away from the operation substrate 1; the extension spring 42 is in contact with the extension arm 41 and is located inside the extension arm 41.
Further, the clamping assembly 4 further includes two support rods 43, the two support rods 43 are fixedly connected to the telescopic arm 41, and are respectively located on two sides of the support rods 43 and respectively abutted to the storage rack 51 and the traction telescopic rod 52.
In this embodiment, the telescopic arm 41 has a fixed section and a telescopic section, the fixed section of the telescopic arm 41 is slidably connected to the rectilinear slide rail 2 through a bracket and faces the same direction as the rectilinear slide rail 2, the telescopic section of the telescopic arm 41 is driven by the telescopic spring 42 to extend and retract, a wafer fixing clamp is screwed on the free end portion of the telescopic arm 41 and faces a direction away from the telescopic arm 41, the telescopic spring 42 is abutted between the fixed section and the telescopic section of the telescopic arm 41 to enable the telescopic arm 41 to rebound, so that a wafer is squeezed from the front side and the rear side, the number of the support rods 43 is two, the two support rods are respectively screwed on two sides of the telescopic arm 41 and form an included angle of 30 degrees with the telescopic arm 41 and are respectively abutted on the bracket of the storage rack 51 and the bracket of the traction telescopic rod 52, thereby preventing the wafer from being coated with a film, at the moment when the first cutting tool 3 finishes cutting the film, the telescopic arm 41 is not supported, so that the wafer is not stably clamped, the stress of the wafer in the film covering process is more stable, and the film covering effect is better.
In a third example of the present embodiment:
referring to fig. 1 and 2, the present invention provides a wafer film covering apparatus 100, which includes an operation substrate 1, a straight slide rail 2, a first cutting tool 3, a clamping assembly 4 and a film covering assembly 5; the straight-moving slide rail 2 is fixedly connected with the operation substrate 1 and is positioned on the surface of the operation substrate 1, the first cutting tool 3 is positioned on one side of the operation substrate 1 close to the straight-moving slide rail 2, the clamping component 4 is slidably connected with the straight-moving slide rail 2, the sliding direction of the clamping component faces the direction of the first cutting tool 3 and is positioned on one side of the straight-moving slide rail 2 far away from the operation substrate 1, and the film covering component 5 is fixedly connected with the operation substrate 1 and is abutted to the straight-moving slide rail 2; the film laminating assembly 5 comprises a storage frame 51, a traction telescopic rod 52 and a cutting member 53, wherein the storage frame 51 is fixedly connected with the operation substrate 1 and is positioned on one side of the straight slide rail 2 and faces the direction of the straight slide rail 2, the traction telescopic rod 52 is fixedly connected with the operation substrate 1 and is abutted against the storage frame 51 and is positioned on one side of the straight slide rail 2 away from the storage frame 51, and the cutting member 53 is fixedly connected with the operation substrate 1 and is rotatably connected with the first cutting tool 3 and is positioned between the storage frame 51 and the traction telescopic rod 52; the cutting member 53 includes an annular slide rail 531 and a connecting arm 532, the annular slide rail 531 is fixedly connected to the operating substrate 1, and is located between the accommodating frame 51 and the traction telescopic rod 52, the connecting arm 532 is slidably connected to the annular slide rail 531, is fixedly connected to the first cutting tool 3, and is located on one side of the accommodating frame 51 close to the annular slide rail 531.
Further, the wafer film covering device 100 further comprises an atomizing nozzle 6, wherein the atomizing nozzle 6 is fixedly connected with the storage rack 51, faces between the storage rack 51 and the traction telescopic rod 52, and is located on one side of the storage rack 51 close to the traction telescopic rod 52.
Further, the wafer film covering device 100 further comprises a blower 7, and the blower 7 is fixedly connected with the annular slide rail 531, is located inside the annular slide rail 531, and faces between the telescopic pulling rod 52 and the storage rack 51.
Further, the wafer film covering device 100 further includes a water collecting tank 8, wherein the water collecting tank 8 is fixedly connected to the operation substrate 1, extends into the operation substrate 1, and is located between the traction telescopic rod 52 and the storage rack 51.
In this embodiment, 6 threaded fixing of atomizer is in the side of storage rack 51 to towards the direction of tectorial membrane, through atomizer 6 passes through pipe connection outside storage water tank, and through water pump compression blowout, make the surface of tectorial membrane and wafer contact moist, has avoided having the bubble behind the tectorial membrane laminating wafer the central thread of annular slide rail 531 is installed hair-dryer 7, hair-dryer 7 is towards the direction of tectorial membrane to after the wafer tectorial membrane is accomplished, blow to the tectorial membrane, make the water droplet between wafer and the tectorial membrane flow, and then the entering is located inside operation substrate 1 in the header tank 8, so can effectively avoid the tectorial membrane in-process bubble to appear, make the tectorial membrane effect better.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A wafer film covering device is characterized by comprising an operation substrate, a straight slide rail, a first cutting tool, a clamping assembly and a film covering assembly;
the straight slide rail is fixedly connected with the operation substrate and is positioned on the surface of the operation substrate, the first cutting tool is positioned on one side, close to the straight slide rail, of the operation substrate, the clamping assembly is slidably connected with the straight slide rail, the sliding direction of the clamping assembly faces the direction of the first cutting tool and is positioned on one side, far away from the operation substrate, of the straight slide rail, and the film covering assembly is fixedly connected with the operation substrate and is abutted against the straight slide rail;
the film covering assembly comprises a storage frame, a traction telescopic rod and a cutting member, the storage frame is fixedly connected with the operating substrate and is positioned on one side of the straight slide rail and faces the direction of the straight slide rail, the traction telescopic rod is fixedly connected with the operating substrate and is abutted against the storage frame and is positioned on one side of the straight slide rail, which is far away from the storage frame, and the cutting member is fixedly connected with the operating substrate and is rotatably connected with the first cutting tool and is positioned between the storage frame and the traction telescopic rod;
the cutting member includes annular slide rail, linking arm, annular slide rail with operation base plate fixed connection, and be located accomodate the frame with pull between the telescopic link, the linking arm with annular slide rail sliding connection, and with first cutting tool fixed connection, and be located annular slide rail is close to accomodate one side of frame.
2. The wafer coating device of claim 1,
the cutting component further comprises a rotary bearing, wherein the rotary bearing is fixedly connected with the connecting arm, is rotatably connected with the first cutting tool and is positioned between the connecting arm and the first cutting tool.
3. The wafer coating device of claim 1,
the film laminating assembly further comprises a first clamping block and a second clamping block, the first clamping block is fixedly connected with the traction telescopic rod and is positioned at one end, close to the containing frame, of the traction telescopic rod; the second clamping block is fixedly connected with the storage rack and is positioned on one side, close to the traction telescopic rod, of the storage rack to clamp the film.
4. The wafer coating device of claim 3,
the film covering assembly further comprises a second cutting tool, the second cutting tool is connected with the storage rack in a sliding mode and is located on one side, close to the traction telescopic rod, of the storage rack, and is close to the second clamping block to cut the film.
5. The wafer coating device of claim 4,
the laminating assembly further comprises a recycling conveying rail, the recycling conveying rail is fixedly connected with the operation substrate and is located on one side, close to the storage rack, of the operation substrate, and faces the direction of the storage rack.
6. The wafer coating device of claim 1,
the clamping assembly comprises a telescopic arm and a telescopic spring, the telescopic arm is connected with the straight slide rail in a sliding mode, faces to the direction close to the annular slide rail and is located on one side, away from the operation substrate, of the straight slide rail; the telescopic spring is abutted to the telescopic arm and is positioned in the telescopic arm.
7. The wafer coating device of claim 6,
the clamping assembly further comprises two supporting rods, the supporting rods are fixedly connected with the telescopic arms and are respectively located on two sides of the supporting rods and are respectively abutted to the storage rack and the traction telescopic rod.
8. The wafer coating device of claim 1,
the wafer film covering device further comprises an atomizing nozzle, wherein the atomizing nozzle is fixedly connected with the storage frame and faces towards the storage frame and the traction telescopic rod, and the storage frame is close to one side of the traction telescopic rod.
9. The wafer coating device of claim 8,
the wafer film covering device further comprises a blower, wherein the blower is fixedly connected with the annular slide rail, is positioned in the annular slide rail and faces towards the traction telescopic rod and the storage rack.
10. The wafer coating device of claim 9,
the wafer film covering device further comprises a water collecting tank, wherein the water collecting tank is fixedly connected with the operation substrate and extends into the operation substrate, and the water collecting tank is located between the traction telescopic rod and the storage rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911156807.3A CN110744910B (en) | 2019-11-22 | 2019-11-22 | Wafer film covering device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911156807.3A CN110744910B (en) | 2019-11-22 | 2019-11-22 | Wafer film covering device |
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| CN110744910A CN110744910A (en) | 2020-02-04 |
| CN110744910B true CN110744910B (en) | 2021-11-30 |
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| CN201911156807.3A Active CN110744910B (en) | 2019-11-22 | 2019-11-22 | Wafer film covering device |
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| CN109390248A (en) * | 2017-08-09 | 2019-02-26 | 志圣科技（广州）有限公司 | Film cutting apparatus and its cut film method |
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