CN114019356A - Bad recognition equipment of chip outward appearance and chip test system thereof - Google Patents
Bad recognition equipment of chip outward appearance and chip test system thereof Download PDFInfo
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- CN114019356A CN114019356A CN202111324202.8A CN202111324202A CN114019356A CN 114019356 A CN114019356 A CN 114019356A CN 202111324202 A CN202111324202 A CN 202111324202A CN 114019356 A CN114019356 A CN 114019356A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2894—Aspects of quality control [QC]
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Abstract
The invention discloses a chip appearance defect recognition device and a chip testing system thereof, and the chip appearance defect recognition device comprises a workbench, wherein a fixed column is arranged on the surface of the workbench, a rotating table is arranged outside the fixed column, a feeding conveying belt and a blanking conveying belt are arranged on the surface of the workbench in parallel, a feeding support is arranged between the feeding conveying belt and the blanking conveying belt, a movable plate and a driving assembly are arranged on the inner top surface of the feeding support, and a feeding cylinder and a blanking cylinder are respectively arranged at two ends of the movable plate; the bottom surface detection station is provided with a bottom surface image acquisition assembly, and the surface detection station is provided with a surface image acquisition assembly. Has the advantages that: through snatching the cylinder and snatching the snatching that the chip was realized to the sucking disc, cooperation revolving stage is rotatory and breach, makes the chip bottom surface expose completely in the field of vision of bottom surface image acquisition subassembly, carries out the appearance quality detection of chip bottom surface, need not the upset chip, simple structure, and with low costs, and can not cause the damage to the chip, excellent in use effect.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a chip appearance defect identification device and a chip test system thereof.
Background
Chips are integrated circuits, also called thin film integrated circuits, that are circuits fabricated on the surface of a semiconductor chip. Another type of thick film integrated circuit is a miniaturized circuit formed by a discrete semiconductor device and passive components integrated into a substrate or wiring board. In the production process of chips, appearance detection is an important detection item, and in order to improve the detection effect and efficiency of chip appearance quality, machine vision is often adopted to detect the chip appearance. However, the current chip appearance quality detection device needs to turn over the chip to complete the appearance detection of the surface and the bottom surface of the chip in the chip detection process, and has the disadvantages of complex structure, high cost, influence on detection efficiency, damage to the chip surface, influence on the chip production quality and unsatisfactory use effect.
Disclosure of Invention
The present invention is directed to provide a chip appearance defect recognition apparatus and a chip testing system thereof, which are described in detail below, to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a chip appearance defect identification device and a chip test system thereof, which comprise a workbench, wherein a fixed column is arranged on the surface of the workbench, a rotating table is arranged on the outer side of the fixed column, and a feeding station, a bottom surface detection station, a defective product collection station, a surface detection station, a defective product collection station and a discharging station are sequentially arranged around the rotating table along the rotating direction of the rotating table;
the edge part of the rotating platform is provided with a plurality of gaps in a penetrating manner, the gaps are uniformly distributed by taking the axis of the rotating platform as a reference circumference, and a to-be-detected placing position and a detection placing position are sequentially arranged between every two adjacent gaps along the rotating direction of the rotating platform and are respectively used for placing a to-be-detected chip and a chip for completing detection;
a feeding conveying belt and a discharging conveying belt are arranged on the surface of the workbench in parallel, jigs for placing chips are uniformly arranged on the surfaces of the feeding conveying belt and the discharging conveying belt, the feeding conveying belt and the discharging conveying belt respectively correspond to a feeding station and a discharging station, a feeding support is arranged between the feeding conveying belt and the discharging conveying belt, the feeding support is in a 7-shaped structure, a movable plate and a driving assembly for driving the movable plate to be close to or far away from the rotary table are arranged on the inner top surface of the feeding support, a feeding cylinder and a discharging cylinder are respectively arranged at two ends of the movable plate, the feeding cylinder and the discharging cylinder respectively correspond to the feeding station and the discharging station, and the working ends of the feeding cylinder and the discharging cylinder are vertically downward and are respectively connected with a suction sucker;
the bottom surface detection station is provided with a bottom surface image acquisition assembly, the surface detection station is provided with a surface image acquisition assembly, the bottom surface image acquisition assembly and the surface image acquisition assembly correspond to a distribution circle of the detection placement position, the upper end of the fixed column is connected with a horizontally extending bearing plate, the surface of the bearing plate is provided with a grabbing cylinder, the working end of the grabbing cylinder is vertically downward and is connected with a grabbing sucker, and the grabbing sucker is positioned right above the bottom surface image acquisition assembly; two defective products collection station are provided with the subassembly of taking and the collecting box, the subassembly of taking with the distribution circle of detection position is corresponding for take the defective products and put into the collecting box.
Preferably, the drive assembly includes guide rail and horizontal push cylinder, the guide rail sets up the interior top surface of feed support, the guide rail to the revolving stage extends, guide rail bottom sliding connection has the slider, the slider with the movable plate is connected, horizontal push cylinder sets up the inner wall of feed support, horizontal push cylinder's work end to the revolving stage extends and with the movable plate is connected.
Preferably, the revolving stage includes driving motor and bearing sleeve, bearing sleeve passes through the bearing and rotates to be installed the fixed column outside, bearing sleeve upper end is connected with places the board, it is provided with to place the board surface the breach wait to pick up and place the position with the detection places the position, the fixed column upper end runs through place the board, the bearing sleeve outside is provided with the ring gear, driving motor's output is connected with the driving gear, the driving gear with the ring gear meshes mutually.
As preferred, bottom surface image acquisition subassembly with the structure of surface image acquisition subassembly is the same, bottom surface image acquisition subassembly orientation is upwards, surface image acquisition subassembly orientation is downwards, the workstation surface runs through and is provided with through-hole, bottom surface image acquisition subassembly includes the mount, the mount is "L" font structure and is located run through the hole below, the mount horizontal part has the screw thread through connection to increase the double-screw bolt, it runs through to increase the double-screw bolt upper end run through-hole and rotation are connected with the lifter plate, the lifter plate bottom surface is connected with the guide bar, the guide bar bottom is run through the horizontal part of mount, the lifter plate surface is provided with the CCD camera.
Preferably, the surface of the lifting plate is provided with an annular lamp, and the periphery of the CCD camera is positioned inside the annular lamp.
Preferably, a connecting sleeve is arranged on the bottom surface of the lifting plate, and the height-adjusting stud is rotatably connected with the connecting sleeve through a bearing.
Preferably, the assembly of taking includes revolving cylinder, revolving cylinder's rotatory end is connected with the cylinder of taking, the flexible end of cylinder of taking is vertical upwards just to be connected with the mounting panel, the mounting panel bottom surface is provided with the sucking disc of taking.
The test method of the chip appearance defect identification equipment comprises the following steps:
a. placing a chip to be detected in a jig on the surface of the feeding conveying belt, conveying the chip to the rotary table through the feeding conveying belt, driving the movable plate to be far away from the rotary table to a feeding station by the driving assembly, driving the suction sucking disc to descend by the telescopic end of the feeding air cylinder, sucking the chip positioned on the feeding station by the suction sucking disc, driving the suction sucking disc to ascend by the feeding air cylinder, driving the movable plate to move towards the rotary table by the driving assembly, enabling the feeding air cylinder to be positioned above the position to be picked and placed, driving the suction sucking disc to descend by the feeding air cylinder, placing the chip on the position to be picked and placed, and realizing the feeding of the chip;
b. the chip is moved to a bottom surface detection station, the grabbing cylinder drives the grabbing sucker to descend, the grabbing sucker adsorbs the chip, the rotary table rotates to enable the notch to move to the position above the bottom surface image acquisition assembly, the bottom surface of the chip is completely exposed through the notch, the bottom surface image acquisition assembly acquires image information of the bottom surface of the chip and transmits the information to an upper computer for analysis, after the image acquisition is completed, the rotary table rotates to enable the detection placement position to move to the position below the grabbing sucker, and the grabbing cylinder drives the grabbing sucker to descend to place the chip on the detection placement position;
c. the rotary table rotates, the chips which finish the bottom surface appearance detection move to a defective product collecting station, if the bottom surface appearance of the chips is unqualified, the taking assembly takes the unqualified chips down from the detection placing position and places the unqualified chips into the collecting box, the defective products are removed and collected, and the chips with qualified bottom surface appearance continue to move along with the rotation of the rotary table;
d. the rotary table rotates, the chip moves to a surface monitoring station, the surface image acquisition assembly is positioned right above the chip, image information of the surface of the chip is acquired through the surface image acquisition assembly, and the information is transmitted to an upper computer for analysis, so that the detection of the surface appearance of the chip is completed;
e. the rotary table rotates, the chips which finish the surface appearance detection move to a defective product collecting station, if the surface appearance of the chips is unqualified, the taking assembly takes the unqualified chips down from the detection placing position and places the unqualified chips into the collecting box, the defective products are removed and collected, and the chips with qualified surface appearance continue to move along with the rotation of the rotary table;
f. the rotary table rotates, a chip which finishes surface appearance detection moves to a blanking station, the driving assembly drives the movable plate to be close to the rotary table to the blanking station, the telescopic end of the blanking cylinder drives the material sucking disc to descend, the chip located at the blanking station is adsorbed by the material sucking disc, the blanking cylinder drives the material sucking disc to ascend, the driving assembly drives the movable plate to be far away from the rotary table, so that the blanking cylinder is located above the blanking conveying belt, the blanking cylinder drives the material sucking disc to descend, and the chip is placed in a jig on the surface of the blanking conveying belt, so that the chip is blanked;
g. and (c) repeatedly and continuously generating the processes of the steps a to f along with the rotation of the rotating platform, so as to realize the automatic and continuous detection of the appearance of the chip.
Has the advantages that: 1. the grabbing cylinder and the grabbing sucker are used for grabbing the chip, the rotary table is matched for rotation and the notch, so that the bottom surface of the chip is completely exposed in the visual field of the bottom surface image acquisition assembly, the appearance quality of the bottom surface of the chip is detected, the chip does not need to be turned over, the structure is simple, the cost is low, the chip cannot be damaged, and the using effect is good;
2. the chip is moved by adopting a rotating mode of the rotating table, so that each station is convenient to arrange, and the feeding conveying belt and the discharging conveying belt are distributed in parallel, so that the whole device is more compact, and the occupied area is reduced;
3. the height adjustment of the CCD camera can be realized, the accuracy of image acquisition is ensured, and the accuracy of chip appearance detection is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a left side view of the present invention;
FIG. 4 is a schematic structural view of a floor image capture assembly of the present invention;
FIG. 5 is a schematic view of a turntable according to the present invention;
fig. 6 is a schematic view of the structure of the pickup assembly of the present invention.
The reference numerals are explained below:
1. a work table; 101. a through opening; 2. a feeding conveyer belt; 3. blanking a conveying belt; 4. a feeding support; 5. a drive assembly; 501. a guide rail; 502. a slider; 503. a horizontal pushing cylinder; 6. moving the plate; 7. a blanking cylinder; 8. a feeding cylinder; 9. a bottom image acquisition assembly; 901. a fixed mount; 902. a guide bar; 903. heightening the stud; 904. connecting sleeves; 905. a lifting plate; 906. an annular lamp; 907. a CCD camera; 10. a rotating table; 1001. a notch; 1002. a to-be-placed position; 1003. detecting a placement position; 1004. a drive motor; 1005. a driving gear; 1006. a bearing sleeve; 1007. a ring gear; 1008. placing the plate; 11. grabbing a sucker; 12. a carrier plate; 13. taking the component; 1301. a rotating cylinder; 1302. taking a cylinder; 1303. mounting a plate; 1304. taking the sucker; 14. a collection box; 15. a grabbing cylinder; 16. a surface image acquisition assembly; 17. and (5) fixing the column.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Referring to fig. 1 to 6, the invention provides a chip appearance defect recognition device and a chip testing system thereof, comprising a workbench 1, wherein a fixed column 17 is arranged on the surface of the workbench 1, a rotating table 10 is arranged outside the fixed column 17, and a feeding station, a bottom surface detection station, a defective product collection station, a surface detection station, a defective product collection station and a blanking station are sequentially arranged around the rotating table 10 along the rotating direction of the rotating table 10;
a feeding conveyer belt 2 and a discharging conveyer belt 3 are arranged on the surface of the workbench 1 in parallel, jigs for placing chips are uniformly arranged on the surfaces of the feeding conveyer belt 2 and the discharging conveyer belt 3, the feeding conveyer belt 2 and the discharging conveyer belt 3 respectively correspond to a feeding station and a discharging station, a feeding support 4 is arranged between the feeding conveyer belt 2 and the discharging conveyer belt 3, the feeding support 4 is in a 7-shaped structure, a movable plate 6 and a driving assembly 5 for driving the movable plate 6 to be close to or far away from the rotating table 10 are arranged on the inner top surface of the feeding support 4, a feeding cylinder 8 and a discharging cylinder 7 are respectively arranged at two ends of the movable plate 6, the feeding cylinder 8 and the discharging cylinder 7 respectively correspond to the feeding station and the discharging station, and the working ends of the feeding cylinder 8 and the discharging cylinder 7 are vertically downward and are respectively connected with a suction cup;
the bottom surface detection station is provided with a bottom surface image acquisition assembly 9, the surface detection station is provided with a surface image acquisition assembly 16, the bottom surface image acquisition assembly 9 and the surface image acquisition assembly 16 both correspond to a distribution circle of the detection placement station 1003, the upper end of the fixed column 17 is connected with a horizontally extending bearing plate 12, the surface of the bearing plate 12 is provided with a grabbing cylinder 15, the working end of the grabbing cylinder 15 is vertically downward and is connected with a grabbing sucker 11, and the grabbing sucker 11 is positioned right above the bottom surface image acquisition assembly 9; the two defective product collecting stations are provided with a taking component 13 and a collecting box 14, the taking component 13 corresponds to the distribution circle of the detection placing position 1003, and the taking component is used for taking defective products and placing the defective products into the collecting box 14.
As an optional embodiment, the driving assembly 5 includes a guide rail 501 and a horizontal pushing cylinder 503, the guide rail 501 is disposed on the inner top surface of the feeding support 4, the guide rail 501 extends toward the rotating platform 10, a slider 502 is slidably connected to the bottom of the guide rail 501, the slider 502 is connected to the moving plate 6, the horizontal pushing cylinder 503 is disposed on the inner wall of the feeding support 4, the working end of the horizontal pushing cylinder 503 extends toward the rotating platform 10 and is connected to the moving plate 6, the moving plate 6 is limited and guided by the slider 502 and the guide rail 501, and the horizontal pushing cylinder 503 is matched to drive the moving plate 6 to be stably close to or far away from the rotating platform 10, so as to ensure the stability of loading and unloading of chips.
The rotating platform 10 comprises a driving motor 1004 and a bearing sleeve 1006, the bearing sleeve 1006 is rotatably installed on the outer side of a fixed column 17 through a bearing, a placing plate 1008 is connected to the upper end of the bearing sleeve 1006, a notch 1001 is formed in the surface of the placing plate 1008, a placing position and a detection placing position 1003 are to be picked up and placed, the placing plate 1008 is penetrated through the upper end of the fixed column 17, a gear ring 1007 is arranged on the outer side of the bearing sleeve 1006, a driving gear 1005 is connected to the output end of the driving motor 1004, the driving gear 1005 is meshed with the gear ring 1007, the driving gear 1005 and the gear ring 1007 are arranged, the driving motor 1004 works, meshing transmission is carried out through the driving gear 1005 and the gear ring 1007, and the placing plate 1008 is enabled to rotate intermittently at a fixed angle on the outer side of the fixed column 17.
The structure of the bottom image acquisition component 9 is the same as that of the surface image acquisition component 16, the bottom image acquisition component 9 faces upwards, the surface image acquisition component 16 faces downwards, the surface of the workbench 1 is provided with a through hole 101 in a penetrating manner, the bottom image acquisition component 9 comprises a fixing frame 901, the fixing frame 901 is of an L-shaped structure and is positioned below the through hole 101, the horizontal part of the fixing frame 901 is in through connection with a heightening stud 903 through threads, the upper end of the heightening stud 903 penetrates through the through hole 101 and is rotatably connected with a lifting plate 905, the bottom surface of the lifting plate 905 is connected with a guide rod 902, the bottom end of the guide rod 902 penetrates through the horizontal part of the fixing frame 901, the surface of the lifting plate 905 is provided with a CCD camera 907, the arrangement is that the lifting plate 905 is limited and guided through the guide rod 902, the heightening stud 903 is screwed, so that the heightening stud 903 drives the lifting plate 905 to lift, and the distance between the CCD camera 907 and the chip is adjusted, the image capturing effect of the CCD camera 907 is ensured.
The surface of the lifting plate 905 is provided with an annular lamp 906, and the periphery of the CCD camera 907 is positioned inside the annular lamp 906, so that the image acquisition effect of the CCD camera 907 can be improved.
The bottom surface of the lifting plate 905 is provided with a connecting sleeve 904, and the heightening stud 903 is rotatably connected with the connecting sleeve 904 through a bearing, so that the heightening stud 903 can be rotatably connected with the lifting plate 905, the heightening stud 903 is convenient to drive the lifting plate 905 to lift, and the distance between the CCD camera 907 and a chip is adjusted.
The taking assembly 13 comprises a rotary cylinder 1301, the rotary end of the rotary cylinder 1301 is connected with a taking cylinder 1302, the telescopic end of the taking cylinder 1302 is vertically upward and is connected with a mounting plate 1303, a taking sucker 1304 is arranged on the bottom surface of the mounting plate 1303, the taking cylinder 1301 is arranged in such a way that the taking cylinder 1302 is driven to rotate when a defective product is taken, the taking cylinder 1302 is made to move to the upper side of the defective product, the taking cylinder 1302 is made to drive the mounting plate 1303 to descend, the taking sucker 1304 is made to suck the defective chip, the taking cylinder 1302 is made to drive the mounting plate 1303 to ascend, the rotary cylinder 1301 is made to drive the taking cylinder 1302 to rotate, the taking sucker 1304 is made to be located above the collecting box 14, the taking cylinder 1302 is made to drive the taking sucker 1304 to descend, the defective chip is placed into the collecting box 14, and collection of the defective chip is achieved.
The test method of the chip appearance defect identification equipment comprises the following steps:
a. placing a chip to be detected in a jig on the surface of a feeding conveyer belt 2, conveying the chip to a rotary table 10 through the feeding conveyer belt 2, driving a movable plate 6 to be far away from the rotary table 10 to a feeding station by a driving assembly 5, driving a material sucking sucker to descend by a telescopic end of a feeding cylinder 8, sucking the chip positioned on the feeding station by the material sucking sucker, driving the material sucking sucker to ascend by the feeding cylinder 8, driving the movable plate 6 to move to the rotary table 10 by the driving assembly 5, enabling the feeding cylinder 8 to be positioned above a position to be picked and placed, driving the material sucking sucker to descend by the feeding cylinder 8, placing the chip on the position to be picked and placed, and realizing the feeding of the chip;
b. the chip is moved to a bottom surface detection station, a grabbing cylinder 15 drives a grabbing sucker 11 to descend, the chip is adsorbed by the grabbing sucker 11, a rotating table 10 rotates to enable a notch 1001 to be moved to the position above a bottom surface image acquisition assembly 9, the bottom surface of the chip is completely exposed through the notch 1001, image information of the bottom surface of the chip is acquired through the bottom surface image acquisition assembly 9 and is transmitted to an upper computer for analysis, after the image acquisition is completed, the rotating table 10 rotates to enable a detection placing position 1003 to be moved to the position below the grabbing sucker 11, the grabbing cylinder 15 drives the grabbing sucker 11 to descend, and the chip is placed on the detection placing position 1003;
c. the rotating platform 10 rotates, the chips which finish the bottom surface appearance detection move to a defective product collecting station, if the bottom surface appearance of the chips is unqualified, the taking component 13 takes the unqualified chips down from the detection placing station 1003 and places the unqualified chips into the collecting box 14, so that the defective products are removed and collected, and the chips with qualified bottom surface appearance continue to move along with the rotation of the rotating platform 10;
d. the rotary table 10 rotates, the chip moves to a surface monitoring station, the surface image acquisition assembly 16 is positioned right above the chip, image information of the surface of the chip is acquired through the surface image acquisition assembly 16, the information is transmitted to an upper computer for analysis, and the detection of the surface appearance of the chip is completed;
e. the rotating platform 10 rotates, the chips which finish the surface appearance detection move to a defective product collecting station, if the surface appearance of the chips is unqualified, the taking component 13 takes the unqualified chips down from the detection placing station 1003 and places the unqualified chips into the collecting box 14, the defective products are removed and collected, and the chips with qualified surface appearance continue to move along with the rotation of the rotating platform 10;
f. the rotary table 10 rotates, a chip which is subjected to surface appearance detection moves to a blanking station, the driving assembly 5 drives the movable plate 6 to be close to the rotary table 10 to the blanking station, the telescopic end of the blanking cylinder 7 drives the material sucking sucker to descend, the chip located at the blanking station is adsorbed by the material sucking sucker, the blanking cylinder 7 drives the material sucking sucker to ascend, the driving assembly 5 drives the movable plate 6 to be far away from the rotary table 10, so that the blanking cylinder 7 is located above the blanking conveying belt 3, the blanking cylinder 7 drives the material sucking sucker to descend, and the chip is placed in a jig on the surface of the blanking conveying belt 3 to achieve blanking of the chip;
g. the process of steps a-f repeatedly and continuously occurs as the rotary table 10 rotates, and automatic and continuous detection of the appearance of the chip is realized.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. Bad recognition equipment of chip outward appearance, its characterized in that: the device comprises a workbench (1), wherein a fixed column (17) is arranged on the surface of the workbench (1), a rotating table (10) is arranged on the outer side of the fixed column (17), and a feeding station, a bottom surface detection station, a defective product collection station, a surface detection station, a defective product collection station and a discharging station are sequentially arranged around the rotating table (10) along the rotating direction of the rotating table (10);
a notch (1001) is arranged at the edge part of the rotating platform (10) in a penetrating manner, the notches (1001) are provided with a plurality of notches which are uniformly distributed by taking the axis of the rotating platform (10) as a reference circumference, and a to-be-detected placing position (1002) and a detection placing position (1003) are sequentially arranged between every two adjacent notches (1001) along the rotating direction of the rotating platform (10) and are respectively used for placing a to-be-detected chip and a detected chip;
the automatic chip feeding and discharging device is characterized in that a feeding conveying belt (2) and a discharging conveying belt (3) are arranged on the surface of the workbench (1) in parallel, jigs used for placing chips are evenly arranged on the surfaces of the feeding conveying belt (2) and the discharging conveying belt (3), the feeding conveying belt (2) and the discharging conveying belt (3) correspond to a feeding station and a discharging station respectively, a feeding support (4) is arranged between the feeding conveying belt (2) and the discharging conveying belt (3), the feeding support (4) is of a 7-shaped structure, a movable plate (6) and a driving assembly (5) used for driving the movable plate (6) to be close to or far away from the rotating table (10) are arranged on the inner top surface of the feeding support (4), a feeding cylinder (8) and a discharging cylinder (7) are arranged at the two ends of the movable plate (6) respectively, the feeding cylinder (8) and the discharging cylinder (7) correspond to the feeding station and the discharging station respectively, the working ends of the feeding cylinder (8) and the discharging cylinder (7) are vertically downward and are respectively connected with a material sucking sucker;
the bottom surface detection station is provided with a bottom surface image acquisition assembly (9), the surface detection station is provided with a surface image acquisition assembly (16), the bottom surface image acquisition assembly (9) and the surface image acquisition assembly (16) correspond to a distribution circle of the detection placement position (1003), the upper end of the fixed column (17) is connected with a horizontally extending bearing plate (12), the surface of the bearing plate (12) is provided with a grabbing cylinder (15), the working end of the grabbing cylinder (15) is vertically downward and is connected with a grabbing sucker (11), and the grabbing sucker (11) is positioned right above the bottom surface image acquisition assembly (9); two defective products collection station are provided with subassembly (13) of taking and collecting box (14), subassembly (13) of taking with the distribution circle of detection position (1003) is corresponding for take the defective products and put into collecting box (14).
2. The apparatus for recognizing a defective appearance of a chip according to claim 1, wherein: drive assembly (5) are including guide rail (501) and flat push cylinder (503), guide rail (501) set up the interior top surface of feed support (4), guide rail (501) to revolving stage (10) extend, guide rail (501) bottom sliding connection has slider (502), slider (502) with movable plate (6) are connected, flat push cylinder (503) set up the inner wall of feed support (4), the working end of flat push cylinder (503) to revolving stage (10) extend and with movable plate (6) are connected.
3. The apparatus for recognizing a defective appearance of a chip according to claim 1, wherein: the rotating table (10) comprises a driving motor (1004) and a bearing sleeve (1006), the bearing sleeve (1006) is rotatably mounted on the outer side of the fixing column (17) through a bearing, a placing plate (1008) is connected to the upper end of the bearing sleeve (1006), the surface of the placing plate (1008) is provided with the notch (1001), the placing position to be picked and the detecting placing position (1003), the upper end of the fixing column (17) penetrates through the placing plate (1008), a gear ring (1007) is arranged on the outer side of the bearing sleeve (1006), the output end of the driving motor (1004) is connected with a driving gear (1005), and the driving gear (1005) is meshed with the gear ring (1007).
4. The apparatus for recognizing a defective appearance of a chip according to claim 1, wherein: the bottom surface image acquisition assembly (9) and the surface image acquisition assembly (16) have the same structure, the bottom surface image acquisition assembly (9) faces upwards, the surface image acquisition assembly (16) faces downwards, a through hole (101) is arranged on the surface of the workbench (1) in a penetrating way, the bottom image acquisition assembly (9) comprises a fixed frame (901), the fixing frame (901) is in an L-shaped structure and is positioned below the through hole (101), the horizontal part of the fixed frame (901) is in through connection with a height-adjusting stud (903) through a thread, the upper end of the height-adjusting stud (903) penetrates through the through hole (101) and is rotatably connected with a lifting plate (905), the bottom surface of the lifting plate (905) is connected with a guide rod (902), the bottom end of the guide rod (902) penetrates through the horizontal part of the fixed frame (901), and the surface of the lifting plate (905) is provided with a CCD camera (907).
5. The device for identifying defective appearance of chip according to claim 4, wherein: the surface of the lifting plate (905) is provided with an annular lamp (906), and the periphery of the CCD camera (907) is positioned inside the annular lamp (906).
6. The device for identifying defective appearance of chip according to claim 4, wherein: the bottom surface of the lifting plate (905) is provided with a connecting sleeve (904), and the height-adjusting stud (903) is rotatably connected with the connecting sleeve (904) through a bearing.
7. The apparatus for recognizing a defective appearance of a chip according to claim 1, wherein: the taking assembly (13) comprises a rotary cylinder (1301), the rotary end of the rotary cylinder (1301) is connected with a taking cylinder (1302), the telescopic end of the taking cylinder (1302) is vertically upward and is connected with a mounting plate (1303), and a taking sucker (1304) is arranged on the bottom surface of the mounting plate (1303).
8. The system for testing the device for identifying poor appearance of a chip according to claim 1, comprising the steps of:
a. placing a chip to be detected in a jig on the surface of the feeding conveyor belt (2), conveying the chip to the rotary table (10) through the feeding conveyor belt (2), driving the movable plate (6) to be far away from the rotary table (10) to a feeding station by the driving assembly (5), driving the suction sucker to descend by the telescopic end of the feeding cylinder (8), adsorbing the chip positioned at the feeding station by the suction sucker, driving the suction sucker to ascend by the feeding cylinder (8), driving the movable plate (6) to move towards the rotary table (10) by the driving assembly (5), enabling the feeding cylinder (8) to be positioned above the position to be picked and placed, driving the suction sucker to descend by the feeding cylinder (8), placing the chip on the position to be picked and placed, and realizing the feeding of the chip;
b. the chip is moved to a bottom surface detection station, the grabbing cylinder (15) drives the grabbing sucker (11) to descend, the chip is adsorbed by the grabbing sucker (11), the rotating platform (10) rotates to enable the notch (1001) to move to the position above the bottom surface image acquisition assembly (9), the bottom surface of the chip is completely exposed through the notch (1001), the bottom surface image acquisition assembly (9) acquires image information of the bottom surface of the chip and transmits the information to an upper computer for analysis, after the image acquisition is completed, the rotating platform (10) rotates to enable the detection placement position (1003) to move to the position below the grabbing sucker (11), the grabbing cylinder (15) drives the grabbing sucker (11) to descend, and the chip is placed on the detection placement position (1003);
c. the rotating table (10) rotates, the chips which finish the bottom surface appearance detection move to a defective product collecting station, if the bottom surface appearance of the chips is unqualified, the taking component (13) takes the unqualified chips down from the detection placing station (1003) and places the unqualified chips into the collecting box (14), so that the unqualified chips are removed and collected, and the chips with qualified bottom surface appearance continue to move along with the rotation of the rotating table (10);
d. the rotary table (10) rotates, the chip moves to a surface monitoring station, the surface image acquisition assembly (16) is positioned right above the chip, image information of the surface of the chip is acquired through the surface image acquisition assembly (16), and the information is transmitted to an upper computer for analysis, so that the detection of the surface appearance of the chip is completed;
e. the rotary table (10) rotates, the chips which finish surface appearance detection move to a defective product collecting station, if the surface appearance of the chips is unqualified, the taking component (13) takes the unqualified chips down from the detection placing station (1003) and places the unqualified chips into the collecting box (14), so that the unqualified chips are removed and collected, and the chips with qualified surface appearance continue to move along with the rotation of the rotary table (10);
f. the rotary table (10) rotates, a chip which is used for finishing surface appearance detection moves to a blanking station, the driving assembly (5) drives the movable plate (6) to be close to the rotary table (10) to the blanking station, the telescopic end of the blanking cylinder (7) drives the suction sucker to descend, the chip located at the blanking station is adsorbed by the suction sucker, the blanking cylinder (7) drives the suction sucker to ascend, the driving assembly (5) drives the movable plate (6) to be far away from the rotary table (10), so that the blanking cylinder (7) is located above the blanking conveying belt (3), the blanking cylinder (7) drives the suction sucker to descend, the chip is placed in a jig on the surface of the blanking conveying belt (3), and blanking of the chip is achieved;
g. the process of steps a-f is repeated and continuously generated along with the rotation of the rotating platform (10), and the automatic and continuous detection of the appearance of the chip is realized.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111324202.8A CN114019356A (en) | 2021-11-10 | 2021-11-10 | Bad recognition equipment of chip outward appearance and chip test system thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111324202.8A CN114019356A (en) | 2021-11-10 | 2021-11-10 | Bad recognition equipment of chip outward appearance and chip test system thereof |
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| CN114019356A true CN114019356A (en) | 2022-02-08 |
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| CN202111324202.8A Withdrawn CN114019356A (en) | 2021-11-10 | 2021-11-10 | Bad recognition equipment of chip outward appearance and chip test system thereof |
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Application publication date: 20220208 |