CN114937617A - Testing arrangement is used in MOS chip production - Google Patents
Testing arrangement is used in MOS chip production Download PDFInfo
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- CN114937617A CN114937617A CN202210559799.2A CN202210559799A CN114937617A CN 114937617 A CN114937617 A CN 114937617A CN 202210559799 A CN202210559799 A CN 202210559799A CN 114937617 A CN114937617 A CN 114937617A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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Abstract
The invention belongs to the technical field of MOS chip production, and discloses a testing device for MOS chip production, which comprises a base, wherein a fixed disc is arranged above the base, a supporting seat is fixedly arranged on the outer side surface of the fixed disc at equal angles, the fixed disc is fixedly connected with the top end of the base through the supporting seat, and a movable disc is arranged above the fixed disc. According to the invention, the rotation speed of the servo motor is matched with the transmission speed of the feeding conveyor by utilizing the servo control, so that the MOS chips can be automatically conveyed to the test base, and the test work can be automatically completed after the conveying is completed, and only the MOS chips need to be manually placed according to the specification, so that the manual participation degree is greatly reduced, the problem that the efficiency is influenced by the fact that the traditional test device needs to be manually placed or mechanically placed and then tested one by one is solved, the automation degree is higher, the feeding and the testing of the single MOS chip can be automatically completed, the test efficiency is obviously improved, and the influence on the production efficiency is reduced.
Description
Technical Field
The invention belongs to the technical field of MOS chip production, and particularly relates to a testing device for MOS chip production.
Background
The MOS chip is also called as an MOS tube, and the MOS tube is a metal-oxide-semiconductor field effect transistor or a metal-insulator-semiconductor; the MOS chip manufactured by MOS chip MOS transistors is a basic structure for forming various control circuits, and the manufactured MOS chip needs to be tested before being mounted on a circuit to be controlled by the MOS chip.
In the production test process of the MOS chip, the MOS chip is mainly subjected to power-on test, namely the MOS chip is subjected to power-on test by using a test base and a test electrode, however, the test method adopted in the prior art is that the MOS chip is placed on the test base one by one, the MOS chip is subjected to power-on test by using an electrode test tool, the MOS chip is placed inside the test base in the feeding process of the MOS chip by manpower or a vacuum chuck, the MOS chip is tested one by using the electrode test tool after the placement, the occasion that the MOS chip is required to be manually participated in the test process is low, the automation degree is low, the test efficiency of the MOS chip is reduced, and the production efficiency is influenced.
Meanwhile, in the MOS chip testing process, if a single MOS chip or a plurality of MOS chips are abnormal in power-on, the single MOS chip or the plurality of MOS chips need to be rejected at the moment to screen out unqualified products.
Disclosure of Invention
The present invention is directed to a testing apparatus for producing a MOS chip, so as to solve the problems mentioned in the background art.
In order to achieve the above purpose, the invention provides the following technical scheme: a testing device for MOS chip production comprises a base, wherein a fixed disc is arranged above the base, supporting seats are fixedly arranged on the outer side surface of the fixed disc at equal angles, the fixed disc is fixedly connected with the top end of the base through the supporting seats, a movable disc is arranged above the fixed disc and can rotate relative to the fixed disc, through grooves are formed in the top end of the movable disc at equal angles, testing base assemblies are fixedly arranged above the through grooves, the testing base assemblies are four in number and distributed above the movable disc at intervals of ninety degrees, a feeding assembly positioned above the front end testing base assembly is fixedly arranged at the front end of the base, a testing assembly positioned above the right end testing base assembly is fixedly arranged at the right end of the base, a screening assembly positioned right below the rear end testing base assembly is fixedly arranged at the bottom end of the base, and a discharging conveyor positioned under the left end test base component is fixedly installed at the left end of the base.
As a further scheme of the invention, the diameters of the fixed disc and the movable disc are the same, the left end of the fixed disc is provided with a screening groove which is positioned right above the discharging conveyor and right below the left end test base component, and the rear end of the fixed disc is provided with a material conveying groove which is positioned right above the screening component and right below the rear end test base component.
As a further scheme of the invention, a servo motor is fixedly mounted at the top end of the base, a main shaft is fixedly mounted at the top end of an output shaft of the servo motor, and the top end of the main shaft penetrates through the top end of the fixed disc and is fixedly sleeved with the movable disc.
Before the use of device, at first need place the base on smooth subaerial to the power of switch on device, servo system of control servo motor makes its angle of rotation at every turn be ninety degrees simultaneously, and the rate of delivery of control material loading subassembly suits with the rate of rotation of activity dish, makes when every MOS chip of carrying of material loading subassembly to the top, and the test base subassembly just is located the inside that the MOS chip can get into the test base subassembly smoothly this moment in the below of material loading subassembly.
As a further scheme of the invention, the test base assembly comprises two guide rails which are symmetrically arranged, the guide rails are arranged on the left side and the right side of the through groove, sliding strips are arranged at the top ends of the guide rails, a limiting base is fixedly connected between the two sliding strips, the limiting base is movably clamped with the guide rails through the sliding strips at the left end and the right end, and the bottom end of the limiting base penetrates through the through groove and is in contact with the top end of the fixed disc.
Before the use of device, need utilize the draw runner to make and realize the joint between spacing base and the guide rail, and need guarantee that the bottom of spacing base contacts with the top of fixed disk, and spacing base can pass logical groove and be located the central point that leads to the groove and put and can accomplish the preparation work.
As a further scheme of the invention, the feeding assembly comprises an extension seat, the extension seat is fixedly connected with the front side of the top end of the base, a feeding conveyor is fixedly installed at the top end of the extension seat, a limiting seat positioned on the front-end testing base assembly is movably connected to the right end of the feeding conveyor, the limiting seat and the testing base assembly are parallel to each other, supporting rods are fixedly installed at the left end and the right end of the limiting seat, and the other end of each supporting rod is fixedly connected with the base.
As a further scheme of the invention, the outer surface of the feeding conveyor is fixedly provided with limiting convex strips at equal intervals, the included angle between the feeding conveyor and the extension seat is forty-five degrees, and the extension seat and the limiting seat are parallel to each other.
As a further scheme of the invention, the testing component comprises a base, the bottom end of the base is fixedly connected with the right side of the top end of the base, a telescopic rod is fixedly arranged on the base, an installation plate is fixedly arranged at the top end of the telescopic rod, a CCD camera is fixedly arranged on the front side of the bottom end of the installation plate, an electrode testing tool positioned behind the CCD camera is fixedly arranged at the bottom end of the installation plate, the electrode testing tool is positioned right above the right side testing base component,
when in actual use, at first can place single MOS chip perpendicularly in the top of material loading conveyer, and make the bottom of MOS chip supported by spacing sand grip, it is spacing to accomplish, along with the single MOS chip of the transport of material loading conveyer is carried the top of material loading conveyer, the bottom of MOS chip no longer receives the supporting role this moment, single MOS chip is carried the inside of spacing seat, and inside the test base subassembly of entering below along with gravity free fall, accomplish the material loading process, and the activity dish makes its below that gets into test assembly in the ninety degrees of anticlockwise rotation under servo motor's drive, the telescopic link starts this moment and can drive the mounting panel decline and drive electrode test tool decline and make it contact with the MOS chip and carry out the circular telegram test, CCD camera can shoot in order to carry out the outward appearance test to MOS chip surface simultaneously.
Make its rotational speed and material loading conveyer's transmission speed looks adaptation through the servo motor who utilizes servo control, make on the MOS chip can be carried the test base automatically, and can accomplish test work automatically after accomplishing the transport, only need artifical according to the regulation put the MOS chip can, artifical participation degree has been reduced to very big degree, the problem of traditional testing arrangement need artifical the placing or mechanical placing again carry out test influence efficiency one by one has been avoided, degree of automation is higher, can accomplish material loading and the test of single MOS chip automatically, show and improve efficiency of software testing, reduce the influence to production efficiency.
As a further scheme of the invention, the screening assembly comprises a guide pipe, the guide pipe is positioned below the rear through groove, the guide pipe is fixedly connected with the bottom end of the fixed disc, the bottom end of the guide pipe is fixedly communicated with a waste bin, and the bottom end of the waste bin is fixedly connected with the top end of the base.
As a further scheme of the invention, the screening assembly further comprises a fixed frame, the fixed frame is arranged at the rear of the guide pipe and is fixedly connected with the fixed disc, a movable block is arranged inside the fixed frame, the front end of the movable block is positioned right below the through groove, sliding grooves are formed in the left side and the right side of the inner side surface of the fixed frame, sliding blocks are fixedly arranged at the left end and the right end of the movable block, and the movable block is movably clamped with the sliding grooves through the sliding blocks.
As a further scheme of the invention, a return spring is fixedly mounted in the middle of the bottom end of the movable block, the bottom end of the return spring is fixedly connected with the bottom end of the inner side of the fixed frame, electromagnets are fixedly mounted on the left side and the right side of the bottom end of the inner side of the fixed frame, and the movable block is made of cast iron.
After the test is finished, the servo motor can drive the movable disc to continue rotating, when the test base assembly which is loaded with the MOS chip and is tested enters the position right above the screening assembly, if the test is qualified, the servo motor can continue to drive the movable disc to rotate ninety degrees, make MOS chip directly be located discharging conveyor directly over, because the existence of defeated silo this moment, the qualified MOS chip of test can directly drop to discharging conveyor directly through defeated silo directly over and accomplish the transport through discharging conveyor, if the test is unqualified, the unqualified signal of test can conduct to electro-magnet department this moment, the electro-magnet can produce the appeal to the movable block this moment and drive and adsorb between movable block and the electro-magnet, limit stop no longer is located the below in screening groove this moment, unqualified MOS chip bottom no longer receives the holding power, free fall gets into the stand pipe of below and gets into the dump bin department of below and accomplishes the storage.
Through the servo motor cooperation screening subassembly that utilizes servo control make qualified MOS chip can carry out the automatic transportation that the short time stops the back and directly be carried to the top of discharge conveyor and accomplish the certified products when screening the subassembly, and unqualified product can directly get into the inside of screening subassembly and accomplish the storage, with this separation process who realizes certified products and defective products, the process of having avoided traditional device to need manual or mechanical mode to reject it when discovering the defective products and carrying out the certified products to carry out, whether it is qualified to make it change into earlier judgement, the automatic certified products direct transportation that drops of defective products, and whole process automation moves, the test flow is comparatively simple, effectively reduced test time.
When the device faces MOS chips with different specifications and sizes, the limiting base with proper cross section area can be selected according to the size of the MOS chips, the inner side surface area of the limiting base is matched with the MOS, the limiting base is clamped with the guide rail, the replacement of the testing base can be completed, the MOS chips with different specifications can be tested by starting the device, meanwhile, the servo motor, the rotation speed and the conveying speed of the feeding conveyor can be synchronously adjusted, the synchronous operation is ensured, the testing time is correspondingly accelerated or reduced, and the device is suitable for different MOS chips.
The test base component through modular design makes it can change as required and comes to adapt to the MOS chip of different specifications, satisfy the test demand, cooperate servo control's servo motor simultaneously, can carry out synchronous adjustment to test speed through the speed of adjustment servo motor and material loading conveyer and adapt to different MOS chip test time, make the commonality of device show the improvement, satisfy different test demands, the producer that is fit for batch production MOS chip uses.
The invention has the following beneficial effects:
1. according to the invention, the rotation speed of the servo motor is matched with the transmission speed of the feeding conveyor by utilizing the servo motor under servo control, so that the MOS chip can be automatically conveyed to the test base, and the test work can be automatically completed after the conveying is completed, only the MOS chip needs to be manually placed according to the specification, the manual participation degree is greatly reduced, the problem that the traditional test device needs to be manually placed or mechanically placed and then the one-by-one test is carried out is avoided, the automation degree is higher, the feeding and the test of the single MOS chip can be automatically completed, the test efficiency is obviously improved, and the influence on the production efficiency is reduced.
2. According to the automatic sorting device, the servo motor under servo control is matched with the screening assembly, so that qualified MOS chips can be directly conveyed to the upper part of the discharging conveyor after being temporarily stopped when passing through the screening assembly to complete automatic conveying of qualified products, unqualified products can directly enter the interior of the screening assembly to complete storage, the sorting process of the qualified products and the unqualified products is achieved, the problem that the traditional device needs to manually or mechanically reject the unqualified products during conveying of the qualified products when finding the unqualified products is solved, the unqualified products are automatically dropped and directly conveyed, the whole process is automatically operated, the testing process is simple, and the testing time is effectively reduced.
3. The invention can be changed according to the needs through the testing base component with the modularized design to adapt to MOS chips with different specifications, thereby meeting the testing requirements, and simultaneously matching with the servo motor controlled by a servo motor, the testing speed can be synchronously adjusted by adjusting the speed of the servo motor and the feeding conveyor to adapt to the testing time of different MOS chips, thereby obviously improving the universality of the device, meeting different testing requirements and being suitable for manufacturers producing MOS chips in batches.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a backside structure of the present invention;
FIG. 3 is an exploded view of the removable disk structure of the present invention;
FIG. 4 is a schematic view of the separate structure of the loading assembly of the present invention;
FIG. 5 is a schematic diagram of an isolated configuration of a test assembly of the present invention;
FIG. 6 is a schematic view of the mating of the holding pan and the screen assembly of the present invention;
FIG. 7 is an exploded view of the screen assembly of the present invention;
FIG. 8 is an exploded view of the test base assembly of the present invention.
In the figure: 1. a base; 2. fixing the disc; 3. a movable tray; 4. a servo motor; 5. a main shaft; 6. a screening tank; 7. a material conveying groove; 8. a supporting seat; 9. testing the base assembly; 901. a guide rail; 902. a slide bar; 903. a limiting base; 10. a discharge conveyor; 11. a feeding assembly; 111. an extension base; 112. a support bar; 113. a feeding conveyor; 114. limiting convex strips; 115. a limiting seat; 12. testing the component; 121. a base; 122. a telescopic rod; 123. mounting a plate; 124. an electrode testing tool; 125. a CCD camera; 13. a screening component; 131. a guide tube; 132. a waste bin; 133. a limit stop block; 134. a movable block; 135. a fixed mount; 136. a chute; 137. a slider; 138. a return spring; 139. an electromagnet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, in the embodiment of the present invention, a testing apparatus for MOS chip production includes a base 1, a fixed tray 2 is disposed above the base 1, a supporting seat 8 is fixedly installed on the outer side surface of the fixed tray 2 at an equal angle, the fixed tray 2 is fixedly connected to the top end of the base 1 through the supporting seat 8, a movable tray 3 is disposed above the fixed tray 2, the movable tray 3 can rotate relative to the fixed tray 2, a through slot is formed at the top end of the movable tray 3 at an equal angle, a testing base assembly 9 is fixedly installed above the through slot, the testing base assemblies 9 are four in number and distributed above the movable tray 3 at intervals of ninety degrees, a feeding assembly 11 located above a front end testing base assembly 9 is fixedly installed at the front end of the base 1, a testing assembly 12 located above a right end testing base assembly 9 is fixedly installed at the right end of the base 1, a screening assembly 13 located right below the rear end testing base assembly 9 is fixedly installed at the bottom end of the base 1, base 1's left end fixed mounting has the ejection of compact conveyer 10 that is located under left end test base subassembly 9, fixed disk 2 is the same with the diameter of activity dish 3, the left end of fixed disk 2 has been seted up and has been located ejection of compact conveyer 10 directly over and be located the screening groove 6 under left end test base subassembly 9, the rear end of fixed disk 2 has been seted up and has been located screening subassembly 13 directly over and be located the defeated silo 7 under rear end test base subassembly 9, base 1's top fixed mounting has servo motor 4, the top fixed mounting of servo motor 4 output shaft has main shaft 5, the top of main shaft 5 run through fixed disk 2 the top and with the activity dish between the fixed cup joint 3.
Before the use of device, at first need place base 1 on smooth subaerial to the power of switch on device, the servo of control servo motor 4 makes its angle of rotation at every turn be ninety degrees simultaneously, and the rate of delivery of control material loading subassembly 11 suits with the rate of rotation of activity dish 3, when making material loading subassembly 11 every carry a MOS chip to the top, test base subassembly 9 just is located the below of material loading subassembly 11 this moment and guarantees that the MOS chip can get into the inside of test base subassembly 9 smoothly.
As shown in fig. 3 and 8, the test base assembly 9 includes two guide rails 901 symmetrically arranged, the guide rails 901 are installed on the left and right sides of the through groove, a slide 902 is arranged on the top end of the guide rail 901, a limiting base 903 is fixedly connected between the two slide 902, the limiting base 903 is movably clamped with the guide rails 901 through the slide 902 on the left and right ends, and the bottom end of the limiting base 903 penetrates through the through groove and contacts with the top end of the fixed disk 2.
Before the device is used, the slide strips 902 are needed to be utilized to enable the limiting base 903 and the guide rails 901 to be clamped, the bottom end of the limiting base 903 is required to be in contact with the top end of the fixed disk 2, and the limiting base 903 can penetrate through the through groove and is located in the central position of the through groove to complete preparation.
As shown in fig. 3, 4 and 5, the feeding assembly 11 includes an extension seat 111, the extension seat 111 is fixedly connected with the front side of the top end of the base 1, a feeding conveyor 113 is fixedly installed at the top end of the extension seat 111, a limiting seat 115 located on the front end testing base assembly 9 is movably connected with the right end of the feeding conveyor 113, the limiting seat 115 is parallel to the testing base assembly 9, support rods 112 are fixedly installed at the left and right ends of the limiting seat 115, the other end of the support rod 112 is fixedly connected with the base 1, limiting convex strips 114 are fixedly installed on the outer surface of the feeding conveyor 113 at equal intervals, an included angle between the feeding conveyor 113 and the extension seat 111 is forty-five degrees, the extension seat 111 is parallel to the limiting seat 115, the testing assembly 12 includes a base 121, the bottom end of the base 121 is fixedly connected with the right side of the top end of the base 1, a telescopic rod 122 is fixedly installed on the base 121, the top end of the telescopic rod 122 is fixedly provided with a mounting plate 123, the front side of the bottom end of the mounting plate 123 is fixedly provided with a CCD camera 125, the bottom end of the mounting plate 123 is fixedly provided with an electrode testing tool 124 positioned behind the CCD camera 125, the electrode testing tool 124 is positioned right above the right side testing base component 9,
the first embodiment:
in practical use, a single MOS chip may be first vertically placed above the feeding conveyor 113, and the bottom end of the MOS chip is supported by the limit raised line 114 to complete the limit, and the single MOS chip is conveyed to the upper part of the feeding conveyor 113 along with the conveying of the feeding conveyor 113, at this time, the bottom end of the MOS chip is no longer supported, the single MOS chip is conveyed to the inner part of the limit seat 115, and freely falls into the testing base component 9 below along with the gravity to finish the feeding process, and the movable plate 3 rotates ninety degrees counterclockwise under the driving of the servo motor 4 to enter the lower part of the testing component 12, at this time, the telescopic rod 122 is started to drive the mounting plate 123 to descend and drive the electrode testing tool 124 to descend to make it contact with the MOS chip for conducting the power-on test, meanwhile, the CCD camera 125 can photograph the surface of the MOS chip for appearance test.
Make its rotational speed and the transmission speed looks adaptation of material loading conveyer 113 through servo motor 4 who utilizes servo control, make on the MOS chip can be carried the test base automatically, and can accomplish test work automatically after accomplishing the transport, only need the manual work put the MOS chip according to the regulation can, artifical participation degree has been reduced to very big degree, the problem of traditional testing arrangement need artifical the placing or mechanical placing again to carry out test influence efficiency one by one has been avoided, degree of automation is higher, can accomplish the material loading and the test of single MOS chip automatically, show and improve efficiency of software testing, reduce the influence to production efficiency.
As shown in fig. 6 and 7, the screening assembly 13 includes a guide tube 131, the guide tube 131 is located below the rear through groove, the guide tube 131 is fixedly connected with the bottom end of the fixed tray 2, the bottom end of the guide tube 131 is fixedly communicated with a waste bin 132, the bottom end of the waste bin 132 is fixedly connected with the top end of the base 1, the screening assembly 13 further includes a fixed frame 135, the fixed frame 135 is arranged behind the guide tube 131 and fixedly connected with the fixed tray 2, a movable block 134 is arranged inside the fixed frame 135, the front end of the movable block 134 is located right below the through groove, sliding grooves 136 are respectively arranged on the left and right sides of the inner side surface of the fixed frame 135, sliding blocks 137 are respectively and fixedly arranged on the left and right sides of the movable block 134, the movable block 134 is movably clamped with the sliding grooves 136 through the sliding blocks 137, a return spring 138 is fixedly arranged in the middle of the bottom end of the movable block 134, the bottom end of the return spring 138 is fixedly connected with the bottom end inside of the fixed frame 135, electromagnets 139 are fixedly mounted on the left side and the right side of the bottom end of the inner side of the fixed frame 135, and the movable block 134 is made of cast iron.
The second embodiment:
after the test is finished, the servo motor 4 can drive the movable disc 3 to continuously rotate, when the test base assembly 9 which is loaded with the MOS chip and is tested enters the position right above the screening assembly 13, if the test is qualified, the servo motor 4 can continuously drive the movable disc 3 to rotate ninety degrees, so that the MOS chip is directly positioned right above the discharging conveyor 10, at the moment, due to the existence of the material conveying groove 7, the MOS chip which is qualified in the test can directly fall to the position right above the discharging conveyor 10 through the material conveying groove 7 and is conveyed through the discharging conveyor 10, if the test is unqualified, a signal which is unqualified in the test can be transmitted to the electromagnet 139, at the moment, the electromagnet 139 can generate attraction force on the movable block 134 and drive the movable block 134 to be adsorbed between the electromagnet 139, at the moment, the limit stop block 133 is no longer positioned below the screening groove 6, the bottom end of the unqualified MOS chip can not receive the supporting force any more, free fall into the lower guide tube 131 and into the lower waste bin 132 for storage.
Through the servo motor 4 that utilizes servo control to cooperate screening subassembly 13 to make qualified MOS chip can carry out the automatic transportation that is accomplished the certified products by direct transport to the top of unloading conveyer 10 after short-term the stopping when screening subassembly 13, and unqualified product can directly get into the inside of screening subassembly 13 and accomplish the storage, with this separation process who realizes certified products and defective work, the process of traditional device need manual or mechanical mode to reject it and carrying out the certified products transport when finding the defective work has been avoided, make it change into and judge earlier whether qualified, the defective work automatic qualified product direct transportation that drops, and whole process automation is operated, the test flow is comparatively simple, effectively reduced test time.
The third embodiment:
when the device faces MOS chips with different specifications and sizes, the limiting base 903 with proper cross section area can be selected according to the size of the MOS chip, the inner side surface area of the limiting base 903 is matched with the MOS, the limiting base is clamped with the guide rail 901, the replacement of a test base can be completed, the MOS chips with different specifications can be tested by starting the device, meanwhile, the servo motor 4, the rotation speed and the conveying speed of the feeding conveyor 113 can be synchronously adjusted, the synchronization is ensured, the testing time is correspondingly accelerated or reduced, and the device is suitable for different MOS chips.
The test base component 9 through the modular design can be changed as required to adapt to MOS chips of different specifications, the test requirement is met, the servo motor 4 matched with servo control is used, the test speed can be synchronously adjusted to adapt to different MOS chip test time by adjusting the speed of the servo motor 4 and the speed of the feeding conveyor 113, the universality of the device is obviously improved, different test requirements are met, and the device is suitable for manufacturers producing MOS chips in batches.
The working principle and the using process are as follows:
before the device is used, the base 1 is firstly placed on a flat ground, a power supply of the device is connected, a servo system of the servo motor 4 is controlled to enable the angle of rotation of the servo system to be ninety degrees each time, the conveying speed of the feeding assembly 11 is controlled to be matched with the rotating speed of the movable disk 3, and when the feeding assembly 11 conveys an MOS chip to the upper part, the testing base assembly 9 is just positioned below the feeding assembly 11 at the moment to ensure that the MOS chip can smoothly enter the testing base assembly 9;
before the device is used, the limiting base 903 is clamped with the guide rail 901 by using the sliding strip 902, the bottom end of the limiting base 903 is ensured to be contacted with the top end of the fixed disk 2, and the limiting base 903 can pass through the through groove and is positioned in the center of the through groove to complete preparation work;
in actual use, a single MOS chip may be first vertically placed above the feeding conveyor 113, and the bottom end of the MOS chip is supported by the limit raised line 114 to complete the limit, and the single MOS chip is conveyed to the upper part of the feeding conveyor 113 along with the conveying of the feeding conveyor 113, at this time, the bottom end of the MOS chip is no longer supported, the single MOS chip is conveyed to the inside of the limit seat 115, and freely falls into the testing base component 9 below along with the gravity to finish the feeding process, and the movable disc 3 rotates ninety degrees counterclockwise under the driving of the servo motor 4 to enter the lower part of the testing component 12, at this time, the telescopic rod 122 is started to drive the mounting plate 123 to descend and drive the electrode testing tool 124 to descend to make it contact with the MOS chip for conducting the power-on test, meanwhile, the CCD camera 125 can photograph the surface of the MOS chip for appearance test;
after the test is finished, the servo motor 4 can drive the movable disc 3 to continuously rotate, when the test base assembly 9 which is loaded with the MOS chip and is tested enters the position right above the screening assembly 13, if the test is qualified, the servo motor 4 can continuously drive the movable disc 3 to rotate ninety degrees, so that the MOS chip is directly positioned right above the discharging conveyor 10, at the moment, due to the existence of the material conveying groove 7, the MOS chip which is qualified in the test can directly fall to the position right above the discharging conveyor 10 through the material conveying groove 7 and is conveyed through the discharging conveyor 10, if the test is unqualified, a signal which is unqualified in the test can be transmitted to the electromagnet 139, at the moment, the electromagnet 139 can generate attraction force on the movable block 134 and drive the movable block 134 to be adsorbed between the electromagnet 139, at the moment, the limit stop block 133 is no longer positioned below the screening groove 6, the bottom end of the unqualified MOS chip can not receive the supporting force any more, freely falls into the guide pipe 131 below and enters the waste bin 132 below for storage;
when the device faces MOS chips of different specifications and sizes, the limiting base 903 with a proper cross section area can be selected according to the size of the MOS chip, the inner side surface area of the limiting base 903 is matched with the MOS, the limiting base is clamped with the guide rail 901, the replacement of a test base can be completed, the MOS chips of different specifications can be tested by starting the device, meanwhile, the servo motor 4, the rotation speed and the conveying speed of the feeding conveyor 113 can be synchronously adjusted, the synchronization is guaranteed, the test time is correspondingly accelerated or reduced, and the device is suitable for different MOS chips.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a testing arrangement is used in MOS chip production, includes base (1), its characterized in that: the testing device is characterized in that a fixed disc (2) is arranged above the base (1), a supporting seat (8) is fixedly arranged at angles such as the outer side surface of the fixed disc (2), the fixed disc (2) is fixedly connected with the top end of the base (1) through the supporting seat (8), a movable disc (3) is arranged above the fixed disc (2), the movable disc (3) can rotate relative to the fixed disc (2), a through groove is formed at angles such as the top end of the movable disc (3), a testing base assembly (9) is fixedly arranged above the through groove, the testing base assemblies (9) are four in number and distributed above the movable disc (3) at intervals of ninety degrees, a feeding assembly (11) positioned above the front end testing base assembly (9) is fixedly arranged at the front end of the base (1), a testing assembly (12) positioned above the right end testing base assembly (9) is fixedly arranged at the right end of the base (1), the screening device is characterized in that a screening component (13) located right below the rear end testing base component (9) is fixedly mounted at the bottom end of the base (1), and a discharging conveyor (10) located right below the left end testing base component (9) is fixedly mounted at the left end of the base (1).
2. The MOS chip production test apparatus of claim 1, wherein: the diameter of fixed disk (2) is the same with activity dish (3), screening groove (6) that are located directly over discharging conveyer (10) and are located under left end test base subassembly (9) have been seted up to the left end of fixed disk (2), defeated material groove (7) that are located directly over screening subassembly (13) and are located under rear end test base subassembly (9) have been seted up to the rear end of fixed disk (2).
3. The testing device for producing the MOS chip according to claim 1, wherein: the top fixed mounting of base (1) has servo motor (4), the top fixed mounting of servo motor (4) output shaft has main shaft (5), the top of main shaft (5) run through the top of fixed disk (2) and with movable dish (3) between fixed cup joint.
4. The testing device for producing the MOS chip according to claim 1, wherein: the test base assembly (9) comprises two guide rails (901) which are symmetrically arranged, the guide rails (901) are arranged on the left side and the right side of the through groove, sliding strips (902) are arranged on the top ends of the guide rails (901), two limit bases (903) are fixedly connected between the sliding strips (902), the limit bases (903) are movably clamped with the guide rails (901) through the sliding strips (902) on the left end and the right end, and the bottom ends of the limit bases (903) penetrate through the through groove and are in contact with the top end of the fixed disc (2).
5. The testing device for producing the MOS chip according to claim 1, wherein: material loading subassembly (11) are including extension seat (111), the front side fixed connection on extension seat (111) and base (1) top, the top fixed mounting of extension seat (111) has material loading conveyer (113), the right-hand member swing joint of material loading conveyer (113) has spacing seat (115) that are located on front end test base subassembly (9), be parallel to each other between spacing seat (115) and test base subassembly (9), the equal fixed mounting in both ends has bracing piece (112) about spacing seat (115), fixed connection between the other end of bracing piece (112) and base (1).
6. The test device for producing the MOS chip according to claim 5, wherein: limiting convex strips (114) are fixedly mounted on the outer surface of the feeding conveyor (113) at equal intervals, an included angle between the feeding conveyor (113) and the extension seat (111) is forty-five degrees, and the extension seat (111) and the limiting seat (115) are parallel to each other.
7. The testing device for producing the MOS chip according to claim 1, wherein: test assembly (12) includes base (121), the bottom of base (121) and the right side fixed connection on base (1) top, the fixed mounting of base (121) has telescopic link (122), the top fixed mounting of telescopic link (122) has mounting panel (123), the front side fixed mounting of mounting panel (123) bottom has CCD camera (125), the bottom fixed mounting of mounting panel (123) has electrode testing tool (124) that is located CCD camera (125) rear, electrode testing tool (124) are located right side test base subassembly (9) directly over.
8. The testing device for producing the MOS chip according to claim 1, wherein: screening subassembly (13) are including stand pipe (131), stand pipe (131) are located the below that the rear led to the groove, the bottom fixed connection of stand pipe (131) and fixed disk (2), the bottom mounting intercommunication of stand pipe (131) has dump bin (132), the bottom of dump bin (132) and the top fixed connection of base (1).
9. The testing device for producing the MOS chip according to claim 1, wherein: screening subassembly (13) still include mount (135), mount (135) set up be located the rear of stand pipe (131) and with fixed disk (2) between fixed connection, the inside of mount (135) is equipped with movable block (134), the front end of movable block (134) is located logical groove under, spout (136) have all been seted up to the left and right sides of mount (135) medial surface, the equal fixed mounting in both ends has slider (137) about movable block (134), movable block (134) are through the activity joint between slider (137) and spout (136).
10. The testing device for producing the MOS chip according to claim 9, wherein: the middle part fixed mounting of movable block (134) bottom has reset spring (138), the bottom of reset spring (138) and the inboard bottom fixed connection of mount (135), the equal fixed mounting in the left and right sides of the inboard bottom of mount (135) has electro-magnet (139), movable block (134) are made for cast iron.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116153817A (en) * | 2023-02-07 | 2023-05-23 | 江苏振宁半导体研究院有限公司 | Adjusting device and method for monitoring yield based on chip |
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| KR101266662B1 (en) * | 2012-12-27 | 2013-05-28 | 주식회사 세라텍 | Semiconductor chip testing system |
| WO2022048039A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾宾斯信息技术有限公司 | Computer chip encapsulation test device |
| CN214473774U (en) * | 2021-03-22 | 2021-10-22 | 深圳群芯微电子有限责任公司 | Multi-station integrated chip test equipment |
| CN114019356A (en) * | 2021-11-10 | 2022-02-08 | 李佳祺 | Bad recognition equipment of chip outward appearance and chip test system thereof |
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| CN116153817A (en) * | 2023-02-07 | 2023-05-23 | 江苏振宁半导体研究院有限公司 | Adjusting device and method for monitoring yield based on chip |
| CN116153817B (en) * | 2023-02-07 | 2023-11-03 | 江苏振宁半导体研究院有限公司 | Adjusting device and method for monitoring yield based on chip |
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