CN116153817B - Adjusting device and method for monitoring yield based on chip - Google Patents
Adjusting device and method for monitoring yield based on chip Download PDFInfo
- Publication number
- CN116153817B CN116153817B CN202310107077.8A CN202310107077A CN116153817B CN 116153817 B CN116153817 B CN 116153817B CN 202310107077 A CN202310107077 A CN 202310107077A CN 116153817 B CN116153817 B CN 116153817B
- Authority
- CN
- China
- Prior art keywords
- chip
- piece
- fixedly connected
- seat
- monitoring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012544 monitoring process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title abstract description 16
- 238000001125 extrusion Methods 0.000 claims description 46
- 238000012545 processing Methods 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 28
- 238000012806 monitoring device Methods 0.000 claims description 27
- 210000000078 claw Anatomy 0.000 claims description 22
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000003860 storage Methods 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 230000003993 interaction Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 44
- 238000006073 displacement reaction Methods 0.000 description 21
- 230000033001 locomotion Effects 0.000 description 12
- 239000000428 dust Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 10
- 230000001105 regulatory effect Effects 0.000 description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 6
- 235000017491 Bambusa tulda Nutrition 0.000 description 6
- 241001330002 Bambuseae Species 0.000 description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 6
- 239000011425 bamboo Substances 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 210000005056 cell body Anatomy 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000739 chaotic effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses an adjusting device and method for monitoring yield based on a chip, and particularly relates to the technical field of yield monitoring and adjustment. According to the adjusting device and the method for monitoring the chip yield, through the interaction of the electrified rotation of the screw rod and the sleeve, the limiting guide is gradually twisted to move upwards, the limiting guide plays an auxiliary role in guiding, and the positioning plate can rotate to the upper part of the placement shell in order to facilitate the absorption of the adjusting piece on the chip workpiece inside the placement shell, the adjusting piece absorbs the chip workpiece to the square plate of the chip, and all-direction adjustment of the chip is completed, so that the device has the function of automatic convenient adjustment, and the working efficiency of work is promoted.
Description
Technical Field
The invention relates to the technical field of yield monitoring and adjusting, in particular to an adjusting device and method for monitoring yield based on a chip.
Background
Integrated circuits, microcircuits, microchips, wafers/chips, are one way of miniaturizing circuits in electronics, mainly including semiconductor devices, also including passive components, etc., and are often manufactured on the surface of semiconductor wafers, quality and reliability are, to a certain extent, life, good quality, long endurance are often competitive with an excellent IC product, chip yield is of considerable importance in the whole semiconductor manufacturing process, and chip yield monitoring and regulation techniques are indispensable.
In the prior art, engineers are mainly used for extracting test data from a test log by adopting special software and then analyzing yield data by using data analysis software such as EXCEL, JMP and the like, but the yield needs to be judged according to actual operation conditions and experience, the conditions of easy missed judgment or misjudgment exist in operation, the missing condition is difficult to be known in the first time, the yield of certain chips is not accurate enough, and the yield of good products is easy to be out of careless due to monitoring, regulation and analysis.
Disclosure of Invention
Aiming at the defects of the prior art, the invention solves the technical problems by adopting the following technical scheme:
an adjusting device for monitoring yield based on a chip specifically comprises,
the device comprises a base, wherein a drawing box body is movably connected to the left side of the base, a treatment seat is fixedly connected to the right side of the top of the base, and a storage box seat is movably connected to the middle of the top of the base;
the storage box seat is provided with an early warning chip and a monitoring device movably connected with the top of the storage box seat, through the arrangement of the monitoring device, the transmitted data are further monitored through a display screen, so that the effect and the effect of automatic real-time monitoring are achieved, meanwhile, the condition that the adjusting screw is too large to shake and fall off and the like are prevented, the effect of automatic protection is achieved, the stable and safe processing environment is realized, a metal support is movably connected inside the drawing box body, the adjusting device is fixedly connected to the left side of the top of the metal support, the condition that the fall off and the like are caused by too large shaking during the processing of the adjusting screw is avoided through the arrangement of the adjusting device, the effect of automatic protection is achieved, the stable and safe processing environment is realized, an adjusting piece is fixedly installed on the left side of the top of the adjusting piece, a chip square disc is fixedly connected to the bottom of the adjusting piece, and the chip square disc is provided with a collecting pad;
the adjusting device comprises:
the cleaning device is characterized in that a screw is fixedly connected to the axis of the cleaning device, the screw is provided with a cushion piece, a sleeve barrel is fixedly arranged on the outer surface of the screw, a limiting guide is movably connected between the sleeve barrel and the screw, and a setting plate is fixedly connected to the top end of the screw.
Further, the pull box runs through the base and extends to screw rod department, the screw rod is linked together through setting up board and regulating part, through monitoring devices's setting, and then monitors the data of transmission through the display screen to reach automatic real-time supervision's effect and effect, prevent simultaneously that adjusting screw from rocking too big and appearing the condition such as drop, play automatic protection's effect, be provided with evenly distributed's collection pad on the chip square dish, monitoring devices inside is provided with the conveyer belt.
Further, the diameter ratio of screw rod is less than the diameter of cup jointing a section of thick bamboo, the lower right corner fixedly connected with regulating part of locating plate, cup jointing a section of thick bamboo and cup jointing the cell body between the section of thick bamboo and correspond, cleaning device still includes the action dish, action dish top swing joint has the swash plate, swash plate back fixedly connected with laminating plate, laminating plate back fixedly connected with circular arc piece, fixedly connected with metal support body in the middle of the circular arc piece bottom, the swash plate passes through laminating plate and circular arc piece effect circular arc piece motion, and circular arc piece is from top and displacement to below, and circular arc piece down displacement produces the incline force, metal support body bottom fixedly connected with assembly, assembly surface swing joint has the claw, the claw uses the central axis of metal support body as reference and evenly distributed, the claw is cotton velvet material, the contained angle between assembly and the metal support body is ninety degrees design, circular arc piece is linked together with the assembly through the metal support body, the metal support body is located circular arc piece under, the assembly is circular slice design.
Further, monitoring devices includes the conveying shell, conveying shell inner chamber swing joint has the bow member, bow member top fixedly connected with places the casing, bow member left side and right side equal fixedly connected with powerful spring, powerful spring play the effect of buffering, avoid the contact force too big and influence the quality, and auxiliary plate is towards the direction displacement that is close to the screw rod, and the cell body of auxiliary plate self cup joints to the screw rod outside, bow member right side swing joint has T die cavity seat, bow member left side swing joint has auxiliary plate, one side swing joint that bow member was kept away from to T die cavity seat has the pendulum, pendulum body inner chamber swing joint has the extrusion piece, extrusion rear end fixedly connected with transverse pushing rod, the extrusion has main shaft and draw-in bar, and the pendulum is pegged graft gradually to inside the extrusion piece, and the extrusion piece extrudees the transverse pushing rod takes place certain swing, and transverse pushing rod is linked together with the main shaft, and the transverse pushing rod influences the extrusion piece to twist, twists and peg graft to in the lockhole of T die cavity seat department, powerful spring quantity is two altogether, and powerful spring with the central axis of bow member even symmetry, auxiliary plate inside and the corresponding length of auxiliary plate and the equal size of pendulum, the length of pendulum plate and the equal size of pendulum plate, the equal size of pendulum plate and the equal size of pendulum.
An adjusting method for monitoring yield based on a chip comprises the following steps:
the first step: when the device is used, firstly, the installation and fixation and safety protection of the device are checked, the servo motor is started, one end of the screw is fixedly connected with one end of the motor, the screw is electrified to rotate to a certain extent, the monitoring device is internally provided with the conveyor belt, the chip is placed in the placing shell of the monitoring device, the drawing box body is pushed into the base, the placing shell above the monitoring device is transported from back to front by the transportation effect of the conveyor belt in the monitoring device, and the placing shell slides along the inner cavity of the conveying shell, so that the device has an automatic adjustment basis, a good condition for automatic detection is laid, and a foundation is laid for subsequent adjustment treatment.
And a second step of: when the data transmitted by the chip is required to be operated and processed, the placing shell is acted by the transmission belt to displace, the placing shell drives the bow-shaped piece to synchronously displace, when the bow-shaped piece moves to the position of the T-shaped cavity seat, the powerful spring is contacted with the T-shaped cavity seat and the transverse pushing rod, the T-shaped cavity seat is acted on to push outwards, the T-shaped cavity seat pushes the swinging body to displace away from the direction of the transmission shell, the swinging body is gradually spliced into the extrusion part, the extrusion part extrudes the transverse pushing rod, a certain swing motion occurs to the transverse pushing rod, the transverse pushing rod is communicated with the main shaft of the extrusion part, the extrusion part is influenced by the transverse pushing rod to twist, the twisting is spliced into a lock hole at the T-shaped cavity seat, the extrusion part is contacted with the T-shaped cavity seat, the T-shaped cavity seat is contacted with the extrusion part to collect data information transmitted from the extrusion part, and the data information instruction is transmitted to the inside the processing seat, the data signal is fed back to the display screen through the central processing unit inside the processing seat, and then the display screen monitors the transmitted data in real-time, and the effect of automatic monitoring are achieved.
And a third step of: when the chip workpieces need to be collected, the screw is electrified to rotate anticlockwise, the screw is matched with the rotating textures in the sleeve barrel, the corresponding sleeve barrel is arranged between the screw and the sleeve barrel, the screw is electrified to rotate and is interacted with the sleeve barrel, the limiting guide is extruded, the limiting guide is gradually twisted to move upwards, the limiting guide plays a guiding auxiliary role, the positioning plate can rotate above the positioning shell according to rotation so that the adjusting piece can absorb the chip workpieces in the positioning shell, the sucking disc is arranged on the adjusting piece, the adjusting piece absorbs the chip workpieces to the chip square disc, and all-direction adjustment of the chip is completed, so that the device has an automatic and convenient adjustment function, and the working efficiency is improved.
Fourth step: when limiting the protection to the deflection displacement size of the screw rod, when the bow-shaped piece is displaced, the bow-shaped piece is contacted with the auxiliary plate, the auxiliary plate is extruded by the displacement force of the bow-shaped piece to move, the powerful spring plays a buffering role, the influence of overlarge contact force on the quality is avoided, the auxiliary plate is displaced towards the direction close to the screw rod, the groove body of the auxiliary plate is sheathed outside the screw rod, the auxiliary plate forms a certain range of motion limit, the situations of falling off and the like due to overlarge shaking during the treatment of the adjusting screw rod are avoided, the automatic protection effect is achieved, and the stable and safe processing environment is realized.
Fifth step: when the chip that probably miss when needs to monitor device transmission is collected and is handled, the chip work piece is missed from placing the casing and is fallen to the conveying shell inboard, conveying shell left and right sides all is provided with the diagonal brace, the diagonal brace defaults to be parallel state with the base, the diagonal brace is by the extrusion force effect of T die cavity seat and auxiliary plate outside displacement and becomes the decurrent state, and be provided with the gap between auxiliary plate and the two of T die cavity seat and the diagonal brace, the chip work piece drops to the containing box seat inside gradually in the effect of conveying shell diagonal brace, the containing box seat is collected it, and the containing box seat is inside to be provided with the early warning chip, the early warning chip is touched by the chip work piece and is set off the switch, the early warning chip is with signal feedback to the central processing unit of handling the seat inside, and then carry out the transmission processing of missing signal to make equipment have automatic omission early warning, reach in time obtain the function of missing chip signal, realize preventing that the chip yield from missing and not enough accurate condition send because of missing, prevent the condition that the random and fall down from appearing simultaneously, avoid causing the condition of collecting, have the automatic and neatly collect the chaotic effect of chip work piece that falls, promote automatic operation degree.
Sixth step: when needs carry out dust clearance to inside, the rotatory action dish motion in the clearance device that pulls gradually of screw rod upward movement, produce displacement force when action dish goes up and down, action dish and swash plate are collided each other, the swash plate is promoted by the action dish and upward, the swash plate turns over through laminating board and circular arc piece effect circular arc piece motion, the circular arc piece is from top and displacement to the below, the circular arc piece down displacement produces tilting force, the circular arc piece takes place the displacement under tilting force effect, the circular arc piece drives the claw motion, the claw is clean the processing to the dust or the sweeps that the inside perhaps processing produced of base gradually, the claw is the surface and is cotton velvet material, the claw can adhere to the dust, the inside effect that drives body dust can be cleared up has been guaranteed, realize the purpose of quick operation.
The invention provides a device and a method for adjusting yield monitoring based on a chip. The beneficial effects are as follows:
1. according to the adjusting device and the method for monitoring the chip yield, the screw is electrified to rotate to a certain extent, the conveyor belt is arranged in the monitoring device, the chip is placed in the placing shell in the monitoring device, the drawing box body is pushed to the inside of the base, the placing shell above the conveyor belt is transported from back to front by the transportation function of the conveyor belt in the monitoring device, and the placing shell slides along the inner cavity of the conveying shell, so that the device has an automatic adjusting basis, a good condition for automatic detection is laid, and a foundation is laid for subsequent adjusting treatment.
2. According to the chip yield monitoring adjusting device and method, when the arched piece moves to the position of the T-shaped cavity seat, the powerful spring is contacted with the T-shaped cavity seat and the transverse pushing rod, the T-shaped cavity seat is acted on and pushed to the outside, the T-shaped cavity seat pushes the swinging body to move away from the direction of the conveying shell, the swinging body is gradually inserted into the extrusion piece, the extrusion piece extrudes the transverse pushing rod, the transverse pushing rod swings to a certain extent, the transverse pushing rod is communicated with the main shaft of the extrusion piece, the extrusion piece is influenced to twist, the extrusion piece is inserted into a lock hole at the T-shaped cavity seat in a twisting manner, the extrusion piece is contacted with the T-shaped cavity seat, the T-shaped cavity seat is internally provided with the processing piece, data information transmitted from the extrusion piece is collected, and a data information instruction is transmitted to the inside the processing seat, the data signal is fed back to the display screen through the central processor inside the processing seat, and then the transmitted data is monitored through the display screen, and therefore the effect and the effect of automatic real-time monitoring are achieved.
3. This adjusting device and method for chip yield monitoring is based on screw rod circular telegram rotation and cup joint section of thick bamboo interact to the screw rod extrudees limiting guide, limiting guide is by torsion effect and upward motion gradually, limiting guide plays the auxiliary role of direction, and the setting plate can be according to rotatory to placing the casing top in order to the regulating part absorbs the inside chip work piece of placing the casing, is provided with the sucking disc on the regulating part, and the regulating part absorbs the chip work piece to chip square dish department, accomplishes each position regulation of chip, thereby makes equipment have the effect of automatic convenient adjustment, promotes the machining efficiency of work.
4. This adjusting device and method for monitoring based on chip yield is extruded by bow member displacement force through supplementary plate and is moved, and powerful spring plays the effect of buffering, avoids the excessive and influence quality of contact force, and supplementary plate is towards the direction displacement that is close to the screw rod, and the cell body of supplementary plate self cup joints to the screw rod outside, and supplementary plate forms the range of motion limit to a certain extent, avoids rocking too big and appearing the condition such as drop when handling because of adjusting the screw rod, plays automatic protection's effect, realizes stable safe processing environment.
5. This adjusting device and method for chip yield monitoring is based on all be provided with the diagonal brace through conveying shell left and right sides, the diagonal brace defaults to be parallel state with the base, the diagonal brace is by the extrusion force effect of T die cavity seat and auxiliary plate toward outside displacement and becomes the decurrent state, and be provided with the gap between auxiliary plate and T die cavity seat two and the diagonal brace, the chip work piece gradually in conveying shell diagonal brace's effect and drop to the containing box seat inside, the containing box seat collects it, and the containing box seat is inside to be provided with the early warning chip, the early warning chip is touched by the chip work piece and starts the switch, the early warning chip will signal feedback is to the central processing unit of handling the seat inside, and then carry out the transmission processing of missing signal to the display screen, thereby make equipment have automatic omission early warning, reach in time obtain the function of chip signal, realize preventing that the chip yield from consequently missing and not accurate condition send, prevent the condition that the random from drifting down from appearing, avoid causing the chaotic condition of collecting, have the effect of automatic clean collection and missing chip work piece, promote automatic degree of operation.
6. This adjusting device and method for chip yield monitoring is based on, push up by the action dish through the swash plate, the swash plate turns over, the swash plate is through laminating board and circular arc piece effect circular arc piece motion, circular arc piece is from the top and the displacement is to the below, circular arc piece down displacement produces the incline force, circular arc piece takes place the displacement under the effect of incline force, circular arc piece drives the claw motion, the claw is cleaned the processing to the dust or the sweeps that the inside possible processing of base produced gradually, the claw is the surface and is the cotton velvet material, the claw can adhere to the dust, the effect that inside drive body dust can be cleared up has been guaranteed, realize the purpose of quick operation.
Drawings
FIG. 1 is a schematic diagram of the flow of the present invention;
FIG. 2 is a schematic diagram of the overall structure of the present invention;
FIG. 3 is a schematic view of a storage box seat according to the present invention;
FIG. 4 is a schematic view of the structure of the placement housing of the present invention;
FIG. 5 is a schematic view of the construction of the bow of the present invention;
FIG. 6 is a schematic view of the structure of the power spring of the present invention;
FIG. 7 is a schematic view of the structure of the swing body of the present invention;
FIG. 8 is an enlarged schematic view of a portion of the structure of the extrusion of FIG. 7A in accordance with the present invention;
FIG. 9 is a schematic view of the structure of the screw of the present invention;
FIG. 10 is a schematic view of the structure of the bonding board of the present invention;
FIG. 11 is a schematic view of the structure of the pawl of the present invention;
fig. 12 is a schematic view of the structure of fig. 7 at C in accordance with the present invention.
In the figure: 1. a base; 2. drawing the box body; 3. a treatment base; 4. a monitoring device; 5. a storage box seat; 6. a metal bracket; 7. an adjusting device; 8. an adjusting member; 9. a chip square tray; 41. a transport housing; 42. placing a shell; 43. a bow; 44. a strong spring; 45. a T-shaped cavity seat; 46. a swinging body; 47. an extrusion; 48. a transverse pushing rod; 49. an auxiliary plate member; 71. a cleaning device; 72. a screw; 73. a sleeve joint cylinder; 74. defining a guide; 75. a setting plate; 710. an action plate; 711. a sloping plate; 712. bonding plates; 713. a circular arc piece; 714. a metal support body; 715. an assembly; 716. a claw.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Example 1
Referring to fig. 1-8 and 12, the present invention provides a technical solution: an adjusting device for monitoring yield based on a chip specifically comprises,
the device comprises a base 1, wherein a drawing box body 2 is movably connected to the left side of the base 1, a treatment seat 3 is fixedly connected to the right side of the top of the base 1, and a storage box seat 5 is movably connected to the middle of the top of the base 1;
the storage box seat 5 is provided with an early warning chip and a monitoring device 4 movably connected to the top of the storage box seat 5, and the transmitted data is monitored through the arrangement of the monitoring device 4 and a display screen, so that the effect and the effect of automatic real-time monitoring are achieved, meanwhile, the condition that the adjusting screw 72 is too large to shake and fall off and the like is prevented, the effect of automatic protection is achieved, a stable and safe processing environment is realized, and the metal bracket 6 is movably connected to the inside of the drawing box body 2;
the monitoring device 4 comprises a conveying shell 41, an arc piece 43 is movably connected to the inner cavity of the conveying shell 41, a placing shell 42 is fixedly connected to the top of the arc piece 43, a powerful spring 44 is fixedly connected to the left side and the right side of the arc piece 43, the powerful spring 44 plays a role in buffering, the quality is prevented from being influenced by overlarge contact force, an auxiliary plate 49 is displaced towards the direction close to a screw 72, a groove body of the auxiliary plate 49 is sleeved on the outer side of the screw 72, the right side of the arc piece 43 is movably connected with a T-shaped cavity seat 45, the left side of the arc piece 43 is movably connected with the auxiliary plate 49, one side, far away from the arc piece 43, of the T-shaped cavity seat 45 is movably connected with a swinging body 46, the inner cavity of the swinging body 46 is movably connected with an extrusion piece 47, the rear end of the extrusion piece 47 is fixedly connected with a transverse push rod 48, the extrusion piece 47 is provided with a main shaft and clamping strips, the swinging body 46 is gradually spliced into the extrusion piece 47, the extrusion piece 47 extrusions the transverse push rod 48, the transverse push rod 48 swings to a certain extent, the transverse push rod 48 is communicated with the extrusion piece 47, the extrusion piece 47 twists to the groove body, the groove body is spliced into the T-shaped cavity seat 45, the T-shaped cavity seat 45 is provided with two in quantity of the same powerful spring 44, and the length is equal to the length of the whole of the extrusion piece 43, and the length is equal to the length of the inner than the T-shaped cavity 46, and the inner side of the T-shaped cavity 46 is equal to the length of the extrusion piece 46.
The first step: when the device is used, firstly, the installation and fixation and safety protection of the device are checked, the servo motor is started, one end of the screw 72 is fixedly connected with one end of the motor, the screw 72 is electrified to rotate to a certain extent, the inside of the monitoring device 4 is provided with a conveyor belt, the chip is placed in the placement shell 42 of the monitoring device 4, the drawing box body 2 is pushed into the base 1, the placement shell 42 above the inside of the monitoring device 4 is transported from back to front under the transportation effect of the conveyor belt, and the placement shell 42 slides along the inner cavity of the conveying shell 41, so that the device has an automatic adjustment basis, a good condition of automatic detection is laid, and a foundation is laid for subsequent adjustment treatment.
And a second step of: when the data transmitted by the chip is required to be operated and processed, as the placing shell 42 is displaced under the action of the transmission belt, the placing shell 42 drives the bow-shaped piece 43 to synchronously displace, when the bow-shaped piece 43 moves to the position of the T-shaped cavity seat 45, the powerful spring 44 contacts with the T-shaped cavity seat 45 and the transverse push rod 48, the T-shaped cavity seat 45 is acted and pushed outwards, the T-shaped cavity seat 45 pushes the swinging body 46 to displace away from the transmission shell 41, the swinging body 46 is gradually inserted into the extrusion piece 47, the extrusion piece 47 extrudes the transverse push rod 48, the transverse push rod 48 is swung to a certain extent, the transverse push rod 48 is communicated with the main shaft of the extrusion piece 47, the transverse push rod 48 influences the extrusion piece 47 to twist, the extrusion piece 47 twists and is inserted into a lock hole at the T-shaped cavity seat 45, the extrusion piece 47 contacts with the T-shaped cavity seat 45, the T-shaped cavity seat 45 contains a processing piece, the T-shaped cavity seat 45 contacts with the extrusion piece 47, the transmitted data information is collected, and the data information instruction is transmitted into the processing seat 3, the central processing unit in the processing seat 3 feeds back the data signal to the display screen, and the automatic monitoring effect is achieved through the display screen.
Fourth step: when limiting protection is required to the deflection displacement size of the screw 72, when the bow-shaped piece 43 is displaced, the bow-shaped piece 43 is contacted with the auxiliary plate 49, the auxiliary plate 49 is extruded by the displacement force of the bow-shaped piece 43 to move, the strong spring 44 plays a role in buffering, the influence of overlarge contact force on quality is avoided, the auxiliary plate 49 is displaced towards the direction close to the screw 72, the groove body of the auxiliary plate 49 is sleeved on the outer side of the screw 72, the auxiliary plate 49 forms a certain degree of movement range limitation, the situation that falling and the like occur due to overlarge shaking when the screw 72 is adjusted is avoided, the automatic protection effect is achieved, and the stable and safe processing environment is realized.
Fifth step: when the chip that probably misses when needs to monitor device 4 transmission is collected the processing, the chip work piece is missed from placing the casing 42 and is fallen to the conveying shell 41 inboard, conveying shell 41 left and right sides all is provided with the diagonal brace, the diagonal brace defaults to be parallel state with base 1, the diagonal brace is by the extrusion force effect of T die cavity seat 45 and auxiliary plate 49 outside displacement and becomes the decurrent state, and be provided with the gap between auxiliary plate 49 and T die cavity seat 45 and the diagonal brace, the chip work piece is gradually in the effect of conveying shell 41 diagonal brace and drop to the containing box seat 5 inside, containing box seat 5 collects it, and the containing box seat 5 inside is provided with the early warning chip, early warning chip is touched by the chip work piece and is set off the switch, the early warning chip is with the signal feedback to the central processing unit of handling seat 3 inside, and then carry out the sending processing of missing signal to the display screen, thereby make equipment have automatic early warning, reach and in time obtain the function of missing chip signal, realize preventing that the chip yield from missing and not enough accurate condition send because of missing, prevent simultaneously that random condition from appearing and leaving out the condition, the circumstances, it is mixed to collect automatically, the effect of lifting the chip is had the automatic operation degree of falling.
Example 2
Referring to fig. 1-12, the present invention provides a technical solution: on the basis of the first embodiment of the present invention,
the left side of the top of the metal supporting frame 6 is fixedly connected with an adjusting device 7, through the arrangement of the adjusting device 7, the situation that the metal supporting frame falls off due to overlarge shaking during the processing of an adjusting screw 72 is avoided, the effect of automatic protection is achieved, the stable and safe processing environment is realized, the left side of the top of the adjusting device 7 is fixedly provided with an adjusting piece 8, the bottom of the adjusting piece 8 is fixedly connected with a chip square disk 9, the chip square disk 9 is provided with a collecting pad,
this adjusting device for monitoring based on chip yield, adjusting device 7 includes:
the cleaning device 71, the fixed connection of cleaning device 71 axle center department has screw rod 72, and this screw rod 72 has the bed course spare to and set up at screw rod 72 surface fixed mounting cup joint section of thick bamboo 73, cup joint between section of thick bamboo 73 and the screw rod 72 swing joint has and prescribes a limit to guide 74, screw rod 72 top fixedly connected with settling plate 75.
The pull box 2 runs through base 1 and extends to screw rod 72 department, and screw rod 72 is linked together through setting plate 75 and regulating part 8, through the setting of monitoring devices 4, and then monitor the data of transmission through the display screen to reach automatic real-time supervision's effect and effect, prevent simultaneously that regulating screw rod 72 from rocking too big and appearing the condition such as drop, play automatic protection's effect, be provided with evenly distributed's collecting pad on the chip square dish 9, monitoring devices 4 inside is provided with the conveyer belt.
The diameter of the screw 72 is smaller than that of the sleeve barrel 73, an adjusting piece 8 is fixedly connected to the right lower corner of the mounting plate 75, the sleeve barrel 73 corresponds to a groove body between the sleeve barrel 73, the cleaning device 71 further comprises an action disc 710, an inclined plate 711 is movably connected to the top of the action disc 710, an attaching plate 712 is fixedly connected to the back of the inclined plate 711, an arc piece 713 is fixedly connected to the back of the attaching plate 712, a metal support 714 is fixedly connected to the middle of the bottom of the arc piece 713, the inclined plate 711 moves through the attaching plate 712 and the arc piece 713, the arc piece 713 moves from the upper side to the lower side, an inclined force is generated by downward displacement of the arc piece 713, an assembly 715 is fixedly connected to the bottom end of the metal support 714, a claw 716 is movably connected to the outer surface of the assembly 715, the claw 716 is uniformly distributed by taking the central axis of the metal support 714 as a reference, the claw 716 is made of cotton velvet material, an included angle between the assembly 715 and the metal support 714 is designed to be ninety degrees, the arc piece 713 is communicated with the assembly 713 through the metal support 714, and the metal support 713 is located under the arc piece 713, and the assembly 715 is in a circular sheet-shaped design.
An adjusting method for monitoring yield based on a chip comprises the following steps:
the first step: when the device is used, firstly, the installation and fixation and safety protection of the device are checked, the servo motor is started, one end of the screw 72 is fixedly connected with one end of the motor, the screw 72 is electrified to rotate to a certain extent, the inside of the monitoring device 4 is provided with a conveyor belt, the chip is placed in the placement shell 42 of the monitoring device 4, the drawing box body 2 is pushed into the base 1, the placement shell 42 above the inside of the monitoring device 4 is transported from back to front under the transportation effect of the conveyor belt, and the placement shell 42 slides along the inner cavity of the conveying shell 41, so that the device has an automatic adjustment basis, a good condition of automatic detection is laid, and a foundation is laid for subsequent adjustment treatment.
And a third step of: when the chip workpieces need to be collected, the screw 72 is electrified to rotate anticlockwise, the screw 72 is matched with the rotating textures in the sleeve barrel 73, the corresponding sleeve barrel 73 is arranged between the screw 72 and the sleeve barrel 73, the screw 72 is electrified to rotate to interact with the sleeve barrel 73, the limiting guide 74 is extruded by the screw 72, the limiting guide 74 is gradually twisted to move upwards, the limiting guide 74 plays a role in guiding assistance, the through arranging plate 75 can rotate to the upper side of the placing shell 42 so that the adjusting piece 8 absorbs the chip workpieces in the placing shell 42, the sucking disc is arranged on the adjusting piece 8, the adjusting piece 8 absorbs the chip workpieces to the position of the chip square disc 9, and all-direction adjustment of the chip is completed, so that the device has the function of automatic convenient adjustment, and the working efficiency is promoted.
Sixth step: when dust cleaning is required to be carried out inside, the screw 72 rotates to move upwards to gradually drag the action disc 710 in the cleaning device 71 to move, displacement force is generated when the action disc 710 ascends and descends, the action disc 710 and the inclined plate 711 mutually collide, the inclined plate 711 is pushed by the action disc 710 to move upwards, the inclined plate 711 turns over, the inclined plate 711 moves through the action of the bonding plate 712 and the arc piece 713, the arc piece 713 moves from above to below, the arc piece 713 moves downwards to generate inclination force, the arc piece 713 moves under the action of the inclination force, the arc piece 713 drives the claw 716 to move, the claw 716 gradually wipes dust or scraps possibly produced by processing inside the base 1, the surface of the claw 716 is made of cotton wool, the claw 716 can adhere to the dust, the cleaning effect of the dust of an internal driving body is guaranteed, and the purpose of rapid operation is achieved.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (3)
1. An adjusting device for monitoring yield based on a chip specifically comprises,
the device comprises a base (1), wherein a drawing box body (2) is movably connected to the left side of the base (1), a treatment seat (3) is fixedly connected to the right side of the top of the base (1), and a storage box seat (5) is movably connected to the middle of the top of the base (1);
the storage box seat (5), this storage box seat (5) have early warning chip to and set up at storage box seat (5) top swing joint's monitoring devices (4), inside swing joint of pull box (2) has metal strut (6), metal strut (6) top left side fixedly connected with adjusting device (7), adjusting device (7) top left side fixedly mounted has adjusting part (8), adjusting part (8) bottom fixedly connected with chip square dish (9), chip square dish (9) have and collect the pad, its characterized in that: the adjusting device (7) comprises:
the cleaning device (71), a screw (72) is fixedly connected to the axis of the cleaning device (71), the screw (72) is provided with a cushion layer piece, a sleeve barrel (73) is fixedly arranged on the outer surface of the screw (72), a limiting guide (74) is movably connected between the sleeve barrel (73) and the screw (72), and a setting plate (75) is fixedly connected to the top end of the screw (72);
the drawing box body (2) penetrates through the base (1) and extends to the screw rod (72), the screw rod (72) is communicated with the adjusting piece (8) through the mounting plate (75), the chip square disc (9) is provided with uniformly distributed collecting pads, and the monitoring device (4) is internally provided with a conveying belt;
the diameter of the screw rod (72) is smaller than that of the sleeve joint cylinder (73), an adjusting piece (8) is fixedly connected to the right lower corner of the placement plate (75), and the sleeve joint cylinder (73) corresponds to a groove body between the sleeve joint cylinders (73);
the cleaning device (71) further comprises an action disc (710), the top of the action disc (710) is movably connected with an inclined plate (711), the back of the inclined plate (711) is fixedly connected with a bonding plate (712), the back of the bonding plate (712) is fixedly connected with an arc piece (713), a metal support body (714) is fixedly connected in the middle of the bottom of the arc piece (713), the bottom of the metal support body (714) is fixedly connected with an assembly piece (715), and the outer surface of the assembly piece (715) is movably connected with a claw (716);
the claws (716) are uniformly distributed by taking the central axis of the metal support body (714) as a reference, the claws (716) are made of cotton velvet materials, and an included angle between the assembly piece (715) and the metal support body (714) is ninety degrees;
the arc piece (713) is communicated with the assembly piece (715) through a metal support body (714), the metal support body (714) is positioned right below the arc piece (713), and the assembly piece (715) is of a circular sheet-shaped design;
monitoring devices (4) are including conveying shell (41), conveying shell (41) inner chamber swing joint has bow member (43), bow member (43) top fixedly connected with places casing (42), bow member (43) left side and right side all fixedly connected with powerful spring (44), bow member (43) right side swing joint has T die cavity seat (45), bow member (43) left side swing joint has auxiliary plate (49), one side swing joint that bow member (43) were kept away from to T die cavity seat (45) has pendulum body (46), pendulum body (46) inner chamber swing joint has extrusion piece (47), extrusion piece (47) rear end fixed connection transverse pushing rod (48).
2. The chip yield monitoring-based adjusting device according to claim 1, wherein: the extrusion piece (47) is provided with a main shaft and clamping strips, the number of the powerful springs (44) is two, the powerful springs (44) are uniformly symmetrical with the central axis of the bow piece (43), and the inside of the auxiliary plate (49) is provided with a groove body corresponding to the screw rod (72).
3. The chip yield monitoring-based adjusting device according to claim 2, wherein: the transverse pushing rod (48), the swinging bodies (46) and the extrusion pieces (47) are all located inside the processing seat (3), the length specification of the auxiliary plate (49) is longer than that of the T-shaped cavity seat (45), the number of the swinging bodies (46) is four, and the swinging bodies (46) are made of metal stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310107077.8A CN116153817B (en) | 2023-02-07 | 2023-02-07 | Adjusting device and method for monitoring yield based on chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310107077.8A CN116153817B (en) | 2023-02-07 | 2023-02-07 | Adjusting device and method for monitoring yield based on chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116153817A CN116153817A (en) | 2023-05-23 |
| CN116153817B true CN116153817B (en) | 2023-11-03 |
Family
ID=86373099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310107077.8A Active CN116153817B (en) | 2023-02-07 | 2023-02-07 | Adjusting device and method for monitoring yield based on chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116153817B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621299U (en) * | 1992-05-26 | 1994-03-18 | 富士通テン株式会社 | Component drop detector |
| WO2008111758A1 (en) * | 2007-03-13 | 2008-09-18 | Intekplus Co., Ltd | Apparatus for inspection of semiconductor device and method for inspection by the same |
| CN213691961U (en) * | 2020-11-17 | 2021-07-13 | 深圳市惟禾自动化设备有限公司 | IC chip outward appearance detects with inhaling material device |
| CN113426701A (en) * | 2021-05-31 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Chip detecting and sorting equipment |
| CN216310185U (en) * | 2021-10-15 | 2022-04-15 | 嘉兴市扬佳科技合伙企业(有限合伙) | Detection equipment for packaging semiconductor packaging integrated block |
| CN114937617A (en) * | 2022-05-23 | 2022-08-23 | 无锡昌德微电子股份有限公司 | Testing arrangement is used in MOS chip production |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4539685B2 (en) * | 2007-06-22 | 2010-09-08 | セイコーエプソン株式会社 | Component conveyor and IC handler |
-
2023
- 2023-02-07 CN CN202310107077.8A patent/CN116153817B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621299U (en) * | 1992-05-26 | 1994-03-18 | 富士通テン株式会社 | Component drop detector |
| WO2008111758A1 (en) * | 2007-03-13 | 2008-09-18 | Intekplus Co., Ltd | Apparatus for inspection of semiconductor device and method for inspection by the same |
| CN213691961U (en) * | 2020-11-17 | 2021-07-13 | 深圳市惟禾自动化设备有限公司 | IC chip outward appearance detects with inhaling material device |
| CN113426701A (en) * | 2021-05-31 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Chip detecting and sorting equipment |
| CN216310185U (en) * | 2021-10-15 | 2022-04-15 | 嘉兴市扬佳科技合伙企业(有限合伙) | Detection equipment for packaging semiconductor packaging integrated block |
| CN114937617A (en) * | 2022-05-23 | 2022-08-23 | 无锡昌德微电子股份有限公司 | Testing arrangement is used in MOS chip production |
Non-Patent Citations (1)
| Title |
|---|
| 《单目标跟踪技术发展研究》;王林茜 等;《空间电子技术》;第16卷(第1期);第2页左栏第1行-第9页左栏第36行 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116153817A (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009012171A (en) | Machine tool for bringing workpiece part to carrying-out position from support position and its method | |
| CN113426701A (en) | Chip detecting and sorting equipment | |
| CN109454323A (en) | Automatic assembly line multistation ultrasonic welding device | |
| CN116153817B (en) | Adjusting device and method for monitoring yield based on chip | |
| CN112517953A (en) | Automatic drilling equipment for rack | |
| CN111805619A (en) | Gantry type water cutting equipment and cutting method thereof | |
| CN113695498B (en) | Automatic thread rolling mechanism of material loading | |
| CN103311137B (en) | A kind of superchip packaging solder ball location auto supply equipment | |
| CN111933554B (en) | Chip packaging manufacturing equipment | |
| CN105458812A (en) | Stock bin mechanism for shaft parts | |
| CN115744277A (en) | Chip detection and collection equipment | |
| CN207606397U (en) | A kind of tablet computer erection welding automatic production line | |
| CN215845350U (en) | Limiting plate punching press loading attachment | |
| CN214163578U (en) | Single crystal bar material connects material feeding unit | |
| JP3314560B2 (en) | Alignment method and alignment device for cylindrical fittings | |
| CN115372466A (en) | Bar detecting equipment | |
| CN209796178U (en) | Material placing frame | |
| CN108466833B (en) | Feeding device | |
| CN118465511B (en) | Automatic chip detection device for LED display module | |
| JP7073173B2 (en) | Nozzle inspection equipment and manufacturing work equipment | |
| CN214107908U (en) | Automatic riveting detection equipment | |
| CN221968315U (en) | Cutting machine for furniture production | |
| CN112269094A (en) | Electronic product chip detection equipment | |
| CN216965231U (en) | Stone screening and conveying device for thicknessing machine | |
| CN220177566U (en) | Chip appearance detection and classification rejecting equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |