CN109979856A - Upside-down mounting die bond device and method thereof - Google Patents
Upside-down mounting die bond device and method thereof Download PDFInfo
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- CN109979856A CN109979856A CN201910266979.XA CN201910266979A CN109979856A CN 109979856 A CN109979856 A CN 109979856A CN 201910266979 A CN201910266979 A CN 201910266979A CN 109979856 A CN109979856 A CN 109979856A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The present invention relates to a kind of upside-down mounting die bond device and method thereof, the upside-down mounting die bond equipment includes material storage mechanism, feed mechanism, chip ejecting mechanism, picks up turnover mechanism, transshipment acitivity and die bond mechanism, and the feed mechanism is used to grab tablet from the material storage mechanism and is transferred to the chip ejecting mechanism；The chip ejecting mechanism includes clamp assemblies and ejector pin component, and the clamp assemblies are for gripping tablet, and the ejector pin component for jacking up the chip on the film upwards；The pickup turnover mechanism includes absorbent module, imaging unit and driving assembly, the imaging unit can move to the top of the chip ejecting mechanism and for obtaining by the location information of jack-up chip, the driving component can drive the absorbent module to be moved to the surface for being ejected chip along the y axis according to the positional information, and the absorbent module is for picking up the chip jacked up and the chip being driven to overturn 180 °.Above-mentioned upside-down mounting die bond device structure is simplified and high production efficiency.
Description
Technical field
The present invention relates to chip encapsulation technology fields, more particularly to a kind of upside-down mounting die bond device and method thereof.
Background technique
Flip chip (COF: full name be Chip On Flex or Chip On Film) are a kind of to fix driving chip
Technology is filled in the crystal mantle structure in flexible circuit board.It is complete that this technology develops into the pin on chip by surrounding distribution
Chip surface distribution, and the pin on counterpart substrate also helps substrate distribution by surrounding distribution development.Existing bound device is raw
It is lower to produce efficiency.
Summary of the invention
Based on this, a kind of upside-down mounting die bond device and method are provided, it is intended to improve the production efficiency of flip-chip.
A kind of upside-down mounting die bond equipment, including material storage mechanism, feed mechanism, chip ejecting mechanism, pickup turnover mechanism, transhipment
Mechanism and die bond mechanism,
For the material storage mechanism for storing tablet, the tablet includes film and several chips for being adhered to the film；
The feed mechanism is used to grab tablet from the material storage mechanism and is transferred to the chip ejecting mechanism；
The chip ejecting mechanism includes clamp assemblies and ejector pin component, and the clamp assemblies are used to grip tablet,
For the ejector pin component for jacking up the chip on the film upwards, the clamp assemblies are able to drive the tablet along X-axis
Direction is mobile and the ejector pin component can move along the y axis；
The pickup turnover mechanism includes absorbent module, imaging unit and driving assembly, and the imaging unit can move
To the chip ejecting mechanism top and for obtaining by the location information of jack-up chip, the driving component can be according to institute
Stating location information drives the absorbent module to be moved to the surface for being ejected chip along the y axis, and the absorbent module is used for
It picks up the chip jacked up and the chip is driven to overturn 180 °；
The transshipment acitivity can be accepted the chip by the pickup turnover mechanism and is transferred to the chip described
Die bond mechanism.
Above-mentioned upside-down mounting die bond equipment realizes that the removing, overturning and die bond of chip operate by the mutual cooperation of each mechanism, respectively
A mechanism linking is close, and production efficiency is higher.Clamp assemblies drive tablet moves along the x axis and ejector pin component can be along Y-axis
Direction is mobile, successively to eject the chip on film.Since clamp assemblies are moved with ejector pin component along Y-axis along the x axis
Direction movement can synchronize progress, can shorten productive temp, improve production efficiency.Also, tablet is moved along the x axis and is pushed up
Needle assemblies move along the y axis, and absorbent module need to only move to reach along the y axis by right above jack-up chip, so as to thimble
Component cooperation is removed chip by film, that is to say, that absorbent module need to only carry out motion in one dimension, so that picking up turnover mechanism
Structure is more simplified and to control precision higher.
The pickup turnover mechanism further includes Y-axis moving parts in one of the embodiments, for driving the absorption
Component is mobile, and the Y-axis moving parts are set side by side with the driving component, and the pickup turnover mechanism further includes link block,
The link block is set between the driving component and the imaging unit.
The turnover mechanism that picks up further includes the Z axis movement set on the Y-axis moving parts in one of the embodiments,
Component, the Z axis moving parts are for driving the absorbent module close to or far from the chip ejecting mechanism.
The clamp assemblies include lid and support base in one of the embodiments, the lid and the support base
Between be formed with clamping position for placing tablet, the lid includes connecting plate and the force fit plate set on the connecting plate, institute
It states and is formed with gap between force fit plate and the connecting plate, the tablet can enter the clamping position via the gap.
The feed mechanism includes X-axis moving parts and clamping jaw, shape in the middle part of the force fit plate in one of the embodiments,
At having window so that the chip on the film exposes, the force fit plate is also provided with the escape port being connected to the window, institute
X-axis moving parts are stated to be able to drive the clamping jaw by the escape port to enter the clamp assemblies described the tablet to be put into
Clamp position.
The clamp assemblies further include pressing unit in one of the embodiments, the pressing unit include actuator,
Matching board and several adjusting rods, the matching board and the lid interval are arranged, the adjusting rod successively wear the lid and
The matching board, and the adjusting rod is threadedly coupled with the matching board, the actuator is able to drive the adjusting rod rotation
So that the lid is close to the matching board.
The clamp assemblies further include two brackets, pedestal and rotary unit in one of the embodiments, described in two
Bracket is oppositely arranged, and the pedestal is set between two brackets, and the support base and the base rotation cooperate, the rotation
Turn unit for driving the relatively described base rotation of the support base.
The rotary unit includes motor and transmission belt in one of the embodiments, and the motor is located therein one
On the bracket, the transmission belt is set around the output end of the motor and the periphery of the support base.
The material storage mechanism includes lifting assembly and magazine in one of the embodiments, and the lifting assembly is used for band
It moves the magazine to rise or fall, the magazine is equipped with multiple accommodating layers, is used to place described in one in each accommodating layer
Tablet.
A kind of die-bonding method of the upside-down mounting die bond equipment, comprising the following steps:
Feed mechanism is grabbed by material storage mechanism and tablet and is transferred to chip ejecting mechanism, wherein chip ejecting mechanism includes
Clamp assemblies and ejector pin component, the clamp assemblies carry out expansion film to film, and the ejector pin component ejects chip upwards；
Imaging unit moves to the top of chip ejecting mechanism to obtain the location information for being ejected chip, driving assembly root
It is moved to the surface for being ejected chip along the y axis according to location information drive absorbent module, absorbent module pickup is ejected
Chip and drive the chip to overturn 180 °；
Transshipment acitivity accepts chip by pickup turnover mechanism and chip is transferred to die bond mechanism；
Die bond mechanism is by chip bonding in substrate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of tablet；
Fig. 2 is the schematic diagram of upside-down mounting die bond equipment in an embodiment；
Fig. 3 is the schematic diagram of material storage mechanism in upside-down mounting die bond equipment shown in Fig. 2；
Fig. 4 is the schematic diagram of feed mechanism in upside-down mounting die bond equipment shown in Fig. 2；
Fig. 5 is the schematic diagram of chip ejecting mechanism in upside-down mounting die bond equipment shown in Fig. 2；
Fig. 6 is the partial structural diagram of chip ejecting mechanism shown in Fig. 5；
Fig. 7 is the structural schematic diagram of clamp assemblies in chip ejecting mechanism shown in Fig. 5；
Fig. 8 is the partial structural diagram of clamp assemblies shown in Fig. 7；
Fig. 9 is the schematic diagram of ejector pin component in chip ejecting mechanism shown in Fig. 5；
Figure 10 is the schematic diagram that turnover mechanism is picked up in upside-down mounting die bond equipment shown in Fig. 2；
Figure 11 is the schematic diagram that absorbent module in turnover mechanism is picked up shown in Figure 10；
The schematic diagram of transshipment acitivity in upside-down mounting die bond equipment shown in Figure 12 Fig. 2；
Figure 13 is the schematic diagram of die bond mechanism in upside-down mounting die bond equipment shown in Fig. 2.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
Referring to Fig. 1, tablet 200 includes film 210 and several chips 220 for being adhered to film 210, chip 220 is in X-axis
Direction and Y direction are respectively separated arrangement, and chip 220 is generally rectangular shaped.Upside-down mounting die bond equipment 100 of the present invention can be to aforementioned
Chip 220 on film 210 realizes removing, overturning and die bond operation.The upside-down mounting die bond equipment is for the driving to flip chip
Chip is packaged.
Referring to Fig. 2, upside-down mounting die bond equipment 100 includes material storage mechanism 10, feed mechanism 20, chip ejecting mechanism 30, picks up
Take turnover mechanism 40, transshipment acitivity 50 and die bond mechanism 60.For storing tablet 200, feed mechanism 20 is used for material storage mechanism 10
Tablet 200 is grabbed from material storage mechanism 10 and is transferred to chip ejecting mechanism 30；Chip ejecting mechanism 30 can will be on film 210
Chip 220 jacks up upwards, picks up turnover mechanism 40 and picks up chip 220 by chip ejecting mechanism 30 and chip 220 is driven to overturn；Turn
Fortune mechanism 50 can be accepted chip 220 by pickup turnover mechanism 40 and chip 220 is transferred to die bond mechanism 60.
Referring to Fig. 3, material storage mechanism 10 includes lifting assembly 11 and magazine 12, lifting assembly 11 is for driving magazine 12
It rises or decline, magazine 12 is equipped with multiple accommodating layers, each accommodating layer is for placing a tablet 200.Tablet in magazine 12
After 200 are removed, lifting assembly 11 drives magazine 12 to rise setting height, so that feed mechanism 20 can pick up at sustained height
Feeding piece 200.
Referring to Fig. 4, feed mechanism 20 includes X-axis moving parts 21, extending arm 22 and clamping jaw 23, the sliding of extending arm 22 is set
In on X-axis moving parts 21, clamping jaw 23 is set to the end of extending arm 22.After clamping jaw 23 picks up tablet 200 by magazine 12, Neng Gou
It is moved in the horizontal direction under the drive of X-axis moving parts 21 and tablet 200 is put into chip ejecting mechanism 30.
Referring to Fig. 5, chip ejecting mechanism 30 includes clamp assemblies 31 and ejector pin component 32, clamp assemblies 31 are for clamping
Fixed tablet 200, ejector pin component 32 are used to upwards eject the chip 220 on film 210, and clamp assemblies 31 are able to drive tablet
200 move and ejector pin component 32 can move along the y axis along the x axis, and chip 220 is successively jacked up.
The drive tablet 200 of clamp assemblies 31 moves along the x axis and ejector pin component 32 can move along the y axis, so as to
Chip 220 is successively jacked up.Since clamp assemblies 31 are mobile along the x axis, movement can be same along the y axis with ejector pin component 32
Step carries out, and can shorten productive temp, improves production efficiency.Also, tablet 200 moves along the x axis and ejector pin component 32 is along Y
Axis direction is mobile, and the movement that the absorbent module 43 of pickup turnover mechanism 40 need to carry out Y direction, which reaches, is ejected chip
220 top, to remove chip 220 by film 210 with the cooperation of ejector pin component 32, that is to say, that absorbent module 32 only need to be into
Row motion in one dimension, so that the structure for picking up turnover mechanism 40 is more simplified and to control precision higher.
Specifically, chip ejecting mechanism 30 further includes the first driving unit 33 and the second driving unit 34, wherein first drives
Moving cell 33 is for driving clamp assemblies 31 to move along the x axis, referring to Fig. 6, the second driving unit 34 is for driving thimble
Component 32 moves along the y axis.
Referring to Fig. 7, clamp assemblies 31 include lid 311, support base 312 and pressing unit 313, lid 311 and support
The clamping position for placing tablet 200 is formed between seat 312, pressing unit 313 is for driving lid 311 close to support base
312 so that film 210 is tensioned.
Lid 311 includes connecting plate 311a and the force fit plate 311b set on connecting plate 311a, force fit plate 311b and connecting plate
Gap is formed between 311a, tablet 200 can enter clamping position via gap, conveniently be put into tablet 200.As force fit plate 311b
When moving downward, expansion membrane operations are carried out to film 210 with the cooperation of support base 312.
Window is formed with so that the chip 220 on film 210 exposes in the middle part of force fit plate 311b, and force fit plate 311b is also provided with
The escape port 311c being connected to window, the X-axis moving parts 21 of feed mechanism 20 be able to drive clamping jaw 23 by escape port 311c into
Enter clamp assemblies 31 so that tablet 200 is put into clamping position.
It should be understood that the number of escape port 311c is two, clamping jaw 23 enters clamping by one of escape port 311c
Component 31, and left by another escape port 311c.It should be noted that after the chip 220 on film 210 is all removed,
Feed mechanism 20 accommodates layer along original route counter motion discarded tablet 200 to be carried in magazine 12 accordingly.
Pressing unit 313 includes actuator 313a, matching board 313b and several adjusting rod 313c, matching board 313b and lid
311 interval settings, adjusting rod 313c successively wear lid 311 and matching board 313b, and adjusting rod 313c and matching board 313b spiral shell
Line connection, actuator 313a are able to drive adjusting rod 313c and rotate so that lid 311 is close to matching board 313b.
Since adjusting rod 313c is threadedly coupled with matching board 313b, when adjusting rod 313c occurs under actuator 313a drive
When rotation, adjusting rod 313c relative engagement plate 313b is down or up, and then drives lid 311 close to or far from support base 312.
In one embodiment, when adjusting rod 313c is counterclockwise rotated, lid 311 is able to drive close to support base 312；Adjusting rod
When 313c is rotated toward the clockwise direction, lid 311 is able to drive far from support base 312.
It is understood that the number of matching board 313b is 2, each matching board 313b is correspondingly provided with two adjusting rods
313c, to improve the structural strength of clamp assemblies 31.Further, pressing unit 313 further includes driving belt 313d, the transmission
Belt 313d is successively set around the end of adjusting rod 313c, and actuator 313a drives multiple adjusting rods by driving belt 313d
313c rotates.Actuator 313a is rotating electric machine.
Deep groove ball bearing, angular contact ball bearing or tapered roller bearing are equipped between lid 311 and adjusting rod 313c, so that
Adjusting rod 313c can play a supporting role to lid 311.Adjusting rod 313c and the rotation connection of lid 311 and lid 311 and tune
Pole 313c keeps opposing stationary in Z-direction, thus when adjusting rod 313c relative engagement plate 313b spiral or decline, energy
Enough lid 311 is driven to move together.
Referring to Fig. 8, clamp assemblies 31 further include two brackets 314, pedestal 315 and rotary unit 316, two brackets
314 are oppositely arranged and slide set on the first driving unit 33, and pedestal 315 is set between two brackets 314, support base 312 and bottom
Seat 315 is rotatably assorted, and rotary unit 316 is for driving support base 312 to rotate relative to pedestal 315.
Rotary unit 316 includes motor 316a and transmission belt 316b, and motor 316a is located therein on a bracket 314, is passed
The periphery of the dynamic output end that motor 316a is set around with 316b and support base 312.The imaging unit 41 for picking up turnover mechanism 40 obtains
After the image for taking chip 220 to be picked up, control system identifies the location information of the chip 220, when the length for detecting chip 220
When the angle of side and Y direction is greater than 0 °, motor 316a drives support base 312 to rotate by transmission belt 316b, so that tablet 200
Position deflect, it is ensured that the long side of chip 220 is parallel with Y-axis.
Referring to Fig. 9, ejector pin component 32 include cylinder 321 and it is several push pin, the end of cylinder 321 offers through-hole and true
Emptying aperture, pushing pin can move up and down in through-hole.Ejector pin component 32 further includes stepper motor 322 and cam 323, stepper motor
322 are pushed pin by the drive of cam 323 rises or falls in the through-hole of cylinder 321；Vacuum cavity is formed with inside cylinder 321.
When absorbent module 43 reaches the top by jack-up chip 220, absorbent module 43 generates suction-operated to chip 220 from top,
Cylinder 321 generates suction-operated to film 210 from below, and chip 220 and film 210 is promoted to remove.
Referring to Fig. 10, picking up turnover mechanism 40 includes imaging unit 41, driving assembly 42 and absorbent module 43, imaging is single
Member 41 can move to the top of chip ejecting mechanism 30 and for obtaining the location information for being ejected chip 220, driving assembly
42 can drive absorbent module 43 to be moved to the surface for being ejected chip 220, absorbent module along the y axis according to location information
43 for picking up the chip 220 being ejected and chip 220 being driven to overturn 180 °.
Picking up turnover mechanism 40 further includes Y-axis moving parts 44, for driving imaging unit 41 mobile.
Y-axis moving parts 44 are set side by side with driving assembly 42, and picking up turnover mechanism 40 further includes link block 45, link block
45 are set between driving assembly 42 and imaging unit 41.The setting of link block 45 so that imaging unit 41 and driving assembly 42 it
Between be formed with the avoiding space passed through for absorbent module 43, the movement of the movement and absorbent module 43 that avoid imaging unit 41 is mutual
Between generate interference.
Picking up turnover mechanism 40 further includes the Z axis moving parts 46 set on Y-axis moving parts 44, and Z axis moving parts 46 are used
In drive absorbent module 43 close to or far from chip ejecting mechanism 30.Absorbent module 43 in moving process, is adsorbed in the horizontal direction
Component 43 need to be maintained at certain altitude, in case absorbent module 43 and chip ejecting mechanism 30 are hit；When absorbent module 43 is transported
When moving to 220 top of chip to be picked up, Z axis moving parts 46 drive the decline of absorbent module 43 to pick up chip 220.
Figure 11 is please referred to, absorbent module 43 includes vacuum slot 431, Z axis voice coil motor 432 and overturning motor 433, vacuum
Suction nozzle 431 is connected with the output end of Z axis voice coil motor 432, and overturning motor 433 is for driving Z axis voice coil motor 432 and vacuum to inhale
Mouth 431 is whole to carry out flip-flop movement.Z axis moving parts 46 drive absorbent module 43 to drop to certain position, Z axis voice coil motor
432 can adjust by a small margin vacuum slot 431 between chip 220 at a distance from, improve vacuum slot 431 position precision.
Please refer to Figure 12, transshipment acitivity 50 include the linear mould group 51 of X-axis, the linear mould group 52 of Y-axis, z axis mould group 53 and
Head 54 is picked and placed, the linear mould group 51 of X-axis, the linear mould group 52 of Y-axis and z axis mould group 53 pick and place head 54 respectively along the side X for driving
It is mobile to dock with the absorbent module 43 for picking up turnover mechanism 40 to pick up chip 220 to, Y-direction and Z-direction, then by core
Piece 220 is transferred to the buffer platform 63 of die bond mechanism 60.
Figure 13 is please referred to, die bond mechanism 60 includes binding by platform 61, binding head 62, buffer platform 63 and guide rail 64, transhipment
Chip 220 is transferred to buffer platform 63 by mechanism 50, and buffer platform 63 can move under dynamical element drive along guide rail 64.
Fig. 2 is please referred to, banding substrate is transferred to binding by above platform 61, is provided with contraposition phase in buffer platform 63
Machine module, the contraposition camera model can shoot the mark point on substrate and chip 220, and control system controls dynamical element and drives
Buffer platform 63 is mobile until the mark point of chip 220 is aligned with setting position on substrate, and binding head 62 moves down pickup chip
220, buffer platform 63 is removed, and chip 220 is bundled in the setting position of substrate by binding head 62, completes die bond movement.
The workflow of above-mentioned upside-down mounting die bond equipment 100 is as follows:
Feed mechanism is grabbed by material storage mechanism and tablet and is transferred to chip ejecting mechanism, wherein chip ejecting mechanism includes
Clamp assemblies and ejector pin component, clamp assemblies carry out expansion film to film, and ejector pin component ejects chip upwards；
Imaging unit moves to the top of chip ejecting mechanism to obtain the location information for being ejected chip, driving assembly root
It is moved to the surface for being ejected chip along the y axis according to location information drive absorbent module, absorbent module pickup is ejected
Chip and drive the chip to overturn 180 °；
Transshipment acitivity accepts chip by pickup turnover mechanism and chip is transferred to die bond mechanism；
Die bond mechanism is by chip bonding on substrate.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of upside-down mounting die bond equipment, which is characterized in that including material storage mechanism, feed mechanism, chip ejecting mechanism, pick up overturning
Mechanism, transshipment acitivity and die bond mechanism,
For the material storage mechanism for storing tablet, the tablet includes film and several chips for being adhered to the film；
The feed mechanism is used to grab tablet from the material storage mechanism and is transferred to the chip ejecting mechanism；
The chip ejecting mechanism includes clamp assemblies and ejector pin component, and the clamp assemblies are described for gripping tablet
For ejector pin component for jacking up the chip on the film upwards, the clamp assemblies are able to drive the tablet along the x axis
The mobile and described ejector pin component can move along the y axis；
The pickup turnover mechanism includes absorbent module, imaging unit and driving assembly, and the imaging unit can move to institute
It states the top of chip ejecting mechanism and is used to obtain by the location information of jack-up chip, the driving component can be according to institute's rheme
Confidence breath drives the absorbent module to be moved to along the y axis by the surface of jack-up chip, and the absorbent module is for picking up
The chip that is ejected simultaneously drives the chip to overturn 180 °；
The transshipment acitivity can be accepted the chip by the pickup turnover mechanism and the chip is transferred to the die bond
Mechanism.
2. upside-down mounting die bond equipment according to claim 1, which is characterized in that the pickup turnover mechanism further includes Y-axis fortune
Dynamic component, for driving the absorbent module mobile, the Y-axis moving parts are set side by side with the driving component, described to pick up
Taking turnover mechanism further includes link block, and the link block is set between the driving component and the imaging unit.
3. upside-down mounting die bond equipment according to claim 2, which is characterized in that the pickup turnover mechanism further includes being set to institute
The Z axis moving parts of Y-axis moving parts are stated, the Z axis moving parts are for driving the absorbent module close to or far from described
Chip ejecting mechanism.
4. upside-down mounting die bond equipment according to claim 1, which is characterized in that the clamp assemblies include lid and support
Seat, is formed with the clamping position for placing tablet between the lid and the support base, the lid includes connecting plate and sets
Gap is formed between the force fit plate of the connecting plate, the force fit plate and the connecting plate, the tablet can be via institute
Gap is stated into the clamping position.
5. upside-down mounting die bond equipment according to claim 4, which is characterized in that the feed mechanism includes X-axis moving parts
And clamping jaw, be formed with window in the middle part of the force fit plate so that the chip on the film exposes, the force fit plate be also provided with and
The escape port of the window connection, the X-axis moving parts are able to drive the clamping jaw and enter the clamping by the escape port
Component is to be put into the clamping position for the tablet.
6. upside-down mounting die bond equipment according to claim 4, which is characterized in that the clamp assemblies further include pressing unit,
The pressing unit includes actuator, matching board and several adjusting rods, and the matching board and the lid interval are arranged, the tune
Pole successively wears the lid and the matching board, and the adjusting rod is threadedly coupled with the matching board, the actuator
The adjusting rod is able to drive to rotate so that the lid is close to the matching board.
7. upside-down mounting die bond equipment according to claim 4, which is characterized in that the clamp assemblies further include two brackets,
Pedestal and rotary unit, two brackets are oppositely arranged, and the pedestal is set between two brackets, the support base with
The base rotation cooperation, the rotary unit is for driving the relatively described base rotation of the support base.
8. upside-down mounting die bond equipment according to claim 7, which is characterized in that the rotary unit includes motor and transmission
Band, the motor are located therein on the bracket, the transmission belt be set around the motor output end and the support
The periphery of seat.
9. upside-down mounting die bond equipment according to claim 1, which is characterized in that the material storage mechanism includes lifting assembly and material
Box, for the lifting assembly for driving the magazine to rise or fall, the magazine is equipped with multiple accommodating layers, each accommodating
For placing a tablet in layer.
10. a kind of die-bonding method of the upside-down mounting die bond equipment as described in claim 1-9, which comprises the following steps:
Feed mechanism grabs tablet by material storage mechanism and is transferred to chip ejecting mechanism, wherein chip ejecting mechanism includes clamping
Component and ejector pin component, the clamp assemblies carry out expansion film to film, and the ejector pin component ejects chip upwards；
Imaging unit moves to the top of chip ejecting mechanism to obtain the location information for being ejected chip, and driving assembly is according to this
Location information drives absorbent module to be moved to the surface for being ejected chip along the y axis, and absorbent module picks up the core being ejected
Piece simultaneously drives the chip to overturn 180 °；
Transshipment acitivity accepts chip by pickup turnover mechanism and chip is transferred to die bond mechanism；
Die bond mechanism is by chip bonding on substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910266979.XA CN109979856B (en) | 2019-04-03 | 2019-04-03 | Flip chip die bonding equipment and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910266979.XA CN109979856B (en) | 2019-04-03 | 2019-04-03 | Flip chip die bonding equipment and method thereof |
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| CN109979856A true CN109979856A (en) | 2019-07-05 |
| CN109979856B CN109979856B (en) | 2021-03-30 |
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| CN113314440A (en) * | 2021-05-13 | 2021-08-27 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN113380674A (en) * | 2021-06-08 | 2021-09-10 | 广东合芯微电子装备有限公司 | Grain needling demoulding method |
| CN113510610A (en) * | 2021-07-30 | 2021-10-19 | 深圳市诺泰芯装备有限公司 | Crystal disc automatic feeding and expand membrane equipment |
| CN113600505A (en) * | 2021-08-02 | 2021-11-05 | 深圳市诺泰芯装备有限公司 | Sensor element detects sorting facilities |
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| CN112735982A (en) * | 2020-12-30 | 2021-04-30 | 江苏新智达新能源设备有限公司 | Crystal wafer blue film crystal taking and fixing device |
| CN112735982B (en) * | 2020-12-30 | 2021-09-14 | 江苏新智达新能源设备有限公司 | Crystal wafer blue film crystal taking and fixing device |
| CN112735982B9 (en) * | 2020-12-30 | 2021-10-08 | 江苏新智达新能源设备有限公司 | Crystal taking and crystal fixing device for blue film of wafer |
| CN113071909A (en) * | 2021-03-22 | 2021-07-06 | 科尔迅智能科技(深圳)有限公司 | Automatic sheet arranging machine for high-precision prisms |
| CN113314440A (en) * | 2021-05-13 | 2021-08-27 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN113380674A (en) * | 2021-06-08 | 2021-09-10 | 广东合芯微电子装备有限公司 | Grain needling demoulding method |
| CN113510610A (en) * | 2021-07-30 | 2021-10-19 | 深圳市诺泰芯装备有限公司 | Crystal disc automatic feeding and expand membrane equipment |
| CN113600505A (en) * | 2021-08-02 | 2021-11-05 | 深圳市诺泰芯装备有限公司 | Sensor element detects sorting facilities |
| CN113972157A (en) * | 2021-10-19 | 2022-01-25 | 科尔迅智能科技(深圳)有限公司 | Single crystal silicon chip flip-chip equipment |
| CN114084870A (en) * | 2021-12-17 | 2022-02-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Thin-shell device cover plate combined type picking mechanism in high vacuum state |
| CN114211248A (en) * | 2021-12-31 | 2022-03-22 | 深圳新益昌科技股份有限公司 | Automatic chip mounting device |
| CN114918157A (en) * | 2022-05-25 | 2022-08-19 | 佑光智能半导体科技(深圳)有限公司 | Blue film sorting machine and sorting method |
| CN114918157B (en) * | 2022-05-25 | 2023-12-01 | 佑光智能半导体科技(深圳)有限公司 | Blue film separator and separation method |
| CN116960047A (en) * | 2023-09-21 | 2023-10-27 | 恩纳基智能科技无锡有限公司 | Multi-chip flip packaging equipment and packaging method |
| CN116960047B (en) * | 2023-09-21 | 2023-12-08 | 恩纳基智能科技无锡有限公司 | Multi-chip flip packaging equipment and packaging method |
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