CN104701199A - Flip chip bonding equipment - Google Patents
Flip chip bonding equipment Download PDFInfo
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- CN104701199A CN104701199A CN201510124424.3A CN201510124424A CN104701199A CN 104701199 A CN104701199 A CN 104701199A CN 201510124424 A CN201510124424 A CN 201510124424A CN 104701199 A CN104701199 A CN 104701199A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Abstract
The invention provides flip chip bonding equipment, comprising a chip transmission mechanism, a first chip grabbing mechanism and a second chip grabbing mechanism; the chip transmission mechanism comprises a mounting part and a drive part for driving the mounting part to move; the mounting part comprises a plurality of work stations for holding chips; the chips on one working station move from a first position to a second position by mean of the motion of the mounting part; the first chip grabbing mechanism is adopted to turn upward the chips from the lower side after the chips are grabbed, and place the chips on the working station of the mounting part at the first position after the chips are turned; and the second chip grabbing mechanism is adopted to take out the chips on the work station of the mounting part at the second position and bond the chips. The precise chip transmission mechanism is introduced and is high in reliability, so that the flip chip bonding equipment is applicable to the flip-chip bonding of large-size substrates without lowering the efficiency; therefore, the mounting precision is improved greatly.
Description
Technical field
The present invention relates to flip-chip bonding techniques field, particularly relate to a kind of flip-chip bonding apparatus.
Background technology
Along with developing rapidly of global electronic information technology, consumer needs less portable type electronic product, makes advanced encapsulation and interconnection technique just in beyond tradition technology.Advanced Packaging combines semiconductor packages and packaging technology to reduce product price together, improves performance, improves density and reduce product size, and this makes the market demand of flip chip semiconductor package just increase rapidly.Flip-chip is not only a kind of high-density chip interconnections technology, or a kind of desirable die bonding technology, is obtained for and applies widely in PGA, BGA and CSP.The interconnection line of flip-chip is very short, and I/O exit distributes whole chip surface, and flip-chip industry is applicable to using the technological means of SMT to produce in batches simultaneously, and therefore flip-chip has become the main development direction of High Density Packaging Technology.
Flip-chip bonding is picked up from blue film by the chip with salient point and overturns, and makes its pad patterns down, be placed on base material by Machine Vision Recognition to brigadier's chip.Reverse chip key binder decides the precision of flip-chip bonding technology, efficiency and reliability, is the key equipment of Flip-Chip Using technique.Reverse chip key binder is a kind of high-speed, high precision equipment, can produce various vibration when equipment runs, and has a huge impact chip bonding precision.In addition along with semiconductor production efficiency improves further, wafer size is just towards larger future development, and the distance from pick-up chip wafer to base material bonding position constantly increases, and bonding efficiency is reduced greatly.
In existing flip-chip bonding technology and equipment, the international monopoly WO2003/058708 of all brightness magnitude people applications of ASM company of Singapore discloses a kind of abovementioned.This equipment, from pick-up chip blue film, is handed off on bonding head by upset, then by bonding head load on lead frame, its switching mechanism has 4 suction nozzles, keying features has 8 suction nozzles, by upset, picks up, dips in the parallel processing of the technique such as glue, bonding, thus improves the load efficiency of equipment.This device structure is complicated, realizes difficulty large.The Chinese patent CN200610171125.6 of people's applications such as the Patrick Bu Laixin of ESEC SA of Switzerland discloses a kind of flip-chip bonding apparatus adopting bonding head swing mechanism to realize chip transmission, this equipment can compensate the impact being caused separate part movement by heat, but it adopts swing mechanism to reduce load precision.The patent CN201310173823.X of people's applications such as the Zheng Xianquan of Hanmi Semiconductor Co. Ltd discloses a kind of flip-chip welding equipment, this equipment adopts two cover keying features to raise the efficiency, but due to chip pickup position and bonding position distance, and base material alignment cameras is arranged on the bonding head of motion, efficiency and precision is caused all to reduce.
Summary of the invention
In order to overcome the above-mentioned problems in the prior art, the invention provides a kind of flip-chip bonding apparatus, flip-chip bonding apparatus of the present invention introduces accurate chip transport sector, reliability is high, making equipment adapt to the back bonding of large scale base material when not lowering efficiency, substantially increasing load precision.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
According to an aspect of the embodiment of the present invention, provide a kind of flip-chip bonding apparatus, comprising:
Chip transport sector, described chip transport sector comprises: installation portion and the drive division for driving described installation portion to move, and described installation portion comprises multiple station for chip placement; Wherein, by the motion of described installation portion, the chip be positioned on a wherein station is moved to second position from first position;
First chip grasping mechanism, for upwards being overturn by downside by described chip after grab chips, and after being overturn by described chip, is placed on described chip on described installation portion and is positioned on a station of described first position;
Second chip grasping mechanism, takes out for the chip that will described installation portion be positioned on the station of described second position, to carry out bonding.
Wherein, described flip-chip bonding apparatus also comprises:
Wafer case, described wafer case comprises: wafer case body, and in described wafer case body, relative both sides are arranged with multiple slot in parallel, and described slot is used for the substrate that clamping is placed with wafer; First motor, described first motor comprises: the first output device; Be positioned at the support below described wafer case body, described first output device is connected with described support.
Wherein, described flip-chip bonding apparatus also comprises:
Table mechanism, described table mechanism comprises: the first workbench and the second workbench, wherein, described first chip grasping mechanism is from pick-up chip described first workbench, and described chip is placed on described installation portion, the chip that described installation portion picks up is placed on described second workbench by described second chip grasping mechanism.
Wherein, described second workbench comprises:
The base-material platform of at least one carrying base-material; X is to kinematic nest and Y-direction kinematic nest, and wherein, described X is in a predeterminated position to kinematic nest and the adjustable described base-material platform of Y-direction kinematic nest.
Wherein, described installation portion comprises: the first conveyer belt, and described station is multiple first vacuum holes being arranged on described first conveyer belt; Described drive division comprises: the first driving wheel and the first driven pulley, and wherein, described first conveyer belt connects the first driving wheel and the first driven pulley.
Wherein, described multiple first vacuum hole is single row or multiple rows arrangement on described first conveyer belt.
Wherein, described installation portion comprises: the second conveyer belt and the chip tray be positioned on outside described second conveyer belt, and described station is multiple second vacuum holes be arranged on described chip tray; Described drive division comprises: the second driving wheel and the second driven pulley, and wherein, described second conveyer belt connects the second driving wheel and the second driven pulley.
Wherein, described chip transport sector also comprises: vacuum suction structure, described vacuum suction structure comprises multiple vacuum tube joint, described multiple vacuum tube joint is positioned on described installation portion, and multiple vacuum tube joint is corresponding one by one with the station on described installation portion, by described vacuum tube joint, described station adopts vacuum suction mode to fix described chip.
Wherein, described first chip grasping mechanism comprises:
First chip placement unit, is positioned over described first workbench by described wafer after capturing wafer;
Be positioned at the first chip detection unit above the first workbench, for detecting the positional information of described wafer chips;
Be positioned at the chip jack-up unit below the first workbench, for by described chip upwards jack-up one preset height;
Roll-over unit between the first chip detection unit and the first workbench, for capturing described chip and the end face of described chip and bottom surface being overturn;
Second chip placement unit, between described first chip detection unit and described roll-over unit, for adsorbing the chip after upset, and is placed on the first position of transport sector by described chip.
Wherein, described roll-over unit comprises: dwang; Be positioned at the first suction nozzle and second suction nozzle at dwang two ends; Regulate the height adjustment mechanism that described dwang moves up and down; And regulate the rotation regulating mechanism of described dwang rotary motion.
Wherein, described second chip grasping mechanism comprises:
Second chip detection unit, is positioned at the top of described chip transport sector, for detecting the positional information of described chip in described second position;
Be positioned at the bonding units above the second workbench, for capturing the chip be positioned in the described second place;
Accommodate the impregnating unit of solder flux or bonded adhesives, for flooding the projection in the described die bottom surface captured by described bonding units;
3rd chip detection unit, is positioned at the top of described bonding units, treats the positional information of patch location for detection chip on described second workbench.
Wherein, described bonding units comprises:
Bonding head, vacuum adapter, Compressed Gas joint and bonding head cylinder; Wherein, after Compressed Gas joint passes into Compressed Gas, for bonding head cylinder provides pressure, vacuum adapter is positioned at the outside of described bonding head cylinder, and with bonding head cylinders, bonding head is positioned at the below of described bonding head cylinder, with bonding head cylinders.
Wherein, described impregnating unit comprises: dip in glue unit,
The described glue unit that dips in comprises: the 3rd motor, the 3rd conveyer belt, connecting plate, dress glue box and glue scraping plate,
Described 3rd motor comprises: the second output device, and described second output device is connected with described 3rd conveyer belt;
The inner side of described 3rd conveyer belt is gear structure;
One end and the described gear mechanism of described connecting plate are connected with a joggle;
Glue scraping plate is connected with the other end of described connecting plate, and described glue scraping plate is provided with groove; Be positioned at the dress glue box above described glue scraping plate, in described dress glue box, be equipped with solder flux or bonded adhesives.
Wherein, described depth of groove is 10 ~ 100um.
Wherein, described flip-chip bonding apparatus also comprises:
4th chip detecting unit, for obtaining the positional information of described chip on described bonding units, is positioned at the below of described glue scraping plate.
Wherein, described impregnating unit comprises: some glue unit, described some glue unit comprises: Glue dripping head, Glue dripping head X are to motor, Glue dripping head Y-direction motor and Glue dripping head Z-direction motor, described Glue dripping head X, to motor, Glue dripping head Y-direction motor and the mating reaction of Glue dripping head Z-direction motor, carries out a glue to drive Glue dripping head on base-material.
Wherein, described flip-chip bonding apparatus also comprises: base-material transport sector, and described base-material transport sector comprises: manipulator controller, the manipulator being positioned at the stand above described manipulator controller and being positioned at above described stand.
Beneficial effect of the present invention: flip-chip bonding apparatus provided by the invention comprises chip transport sector, the first chip grasping mechanism and the second chip grasping mechanism, in the process of chip transport sector transmission chip, first chip grasping mechanism is placed on chip transport sector after being picked up by chip and is positioned on the station of first position, when chip motion is to second position, chip takes out from the second place and carries out bonding by the second chip grasping mechanism.The introducing of chip transport sector, making flip-chip bonding apparatus adapt to the back bonding of large scale base material when not lowering efficiency, substantially increasing load precision.
Accompanying drawing explanation
Fig. 1 is the vertical view of the flip-chip bonding apparatus of the embodiment of the present invention;
Fig. 2 is the front view of the flip-chip bonding apparatus of the embodiment of the present invention;
Fig. 3 is the structural representation of the wafer case of the embodiment of the present invention;
Fig. 4 is the structural representation of the second workbench of the embodiment of the present invention;
Fig. 5 is one of structural representation of the chip transmission structure of the embodiment of the present invention;
Fig. 6 is the structural representation two of the chip transmission structure of the embodiment of the present invention;
Fig. 7 is the structural representation of the bonding units of the embodiment of the present invention;
Fig. 8 is the structural representation dipping in glue unit of the embodiment of the present invention;
Fig. 9 is the structural representation of the some glue unit of the embodiment of the present invention;
Figure 10 is the structural representation of the base-material transport sector of the embodiment of the present invention.
Wherein in figure: 1, chip transport sector; 101, the first conveyer belt; 102, the first vacuum hole; 103, the first driving wheel; 104, the first driven pulley; 105, the second conveyer belt; 106, chip tray; 107 second vacuum holes; 108, the second driving wheel; 109, the second driven pulley; 2, wafer case; 201, slot; 202, the first motor; 203, support; 3, the first workbench; 4, the second workbench; 401, base-material platform; 402, X is to kinematic nest; 403, Y-direction kinematic nest; 5, the first chip placement unit; 6, the first chip detection unit; 7, chip jack-up unit; 8, roll-over unit; 801, dwang; 802, the first suction nozzle; 803, the second suction nozzle; 9, the second chip placement unit; 901, head motion is picked up; 902, head are picked up; 10, the second chip detection unit; 11, bonding units; 1101, bonding head motion; 1102, bonding head mechanism; 1103, bonding head; 1104, vacuum adapter; 1105, Compressed Gas joint; 1106, bonding head cylinder; 1107, the second motor; 1108, correcting mechanism; 12, the 3rd chip detection unit; 13, glue unit is dipped in; 1301, the 3rd motor; 1302, the 3rd conveyer belt; 1303, connecting plate; 1304, glue box is filled; 1305, glue scraping plate; 14, the 4th chip detecting unit; 15, glue unit is put; 1501, Glue dripping head; 1502, Glue dripping head X is to motor; 1503, Glue dripping head Y-direction motor; 1504, Glue dripping head Z-direction motor; 16, base-material transport sector; 1601, manipulator controller; 1602, stand; 1603, manipulator.
Embodiment
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
As depicted in figs. 1 and 2, embodiments provide a kind of flip-chip bonding apparatus, comprise: chip transport sector 1, described chip transport sector 1 comprises: installation portion and the drive division for driving described installation portion to move, and described installation portion comprises multiple station for chip placement; Wherein, by the motion of described installation portion, the chip be positioned on a wherein station is moved to second position from first position; First chip grasping mechanism, for upwards being overturn by downside by described chip after grab chips, and after being overturn by described chip, is placed on described chip on described installation portion and is positioned on a station of described first position; Second chip grasping mechanism, takes out for the chip that will described installation portion be positioned on the station of described second position, to carry out bonding.
The flip-chip bonding apparatus of the embodiment of the present invention comprises chip transport sector, the first chip grasping mechanism and the second chip grasping mechanism, in the process of chip transport sector transmission chip, first chip grasping mechanism is placed on chip transport sector after being picked up by chip and is positioned on the station of first position, when chip motion is to second position, chip takes out from the second place and carries out bonding by the second chip grasping mechanism.The introducing of chip transport sector, making flip-chip bonding apparatus adapt to the back bonding of large scale base material when not lowering efficiency, substantially increasing load precision.
Further, continue see Fig. 1, flip-chip bonding apparatus also comprises: wafer case 2, as the concrete structure schematic diagram that Fig. 3 is wafer case 2, comprise: wafer case body, in described wafer case body, relative both sides are arranged with multiple slot 201 in parallel, and described slot 201 is placed with the substrate of wafer for clamping; First motor 202, described first motor 202 comprises: the first output device; Be positioned at the support 203 below described wafer case body, described first output device is connected with described support 203, after the first chip grasping mechanism takes out wafer in the wafer case 2 that multi-layer crystal chip is housed, lower chip is pushed into working position by support 203 under the driving of the first motor 202.
Further, continue see Fig. 1, flip-chip bonding apparatus also comprises: table mechanism, table mechanism comprises: the first workbench 3 and the second workbench 4, wherein, described chip from pick-up chip described first workbench 3, and is placed on described installation portion by described first chip grasping mechanism, and the chip that described installation portion picks up is placed on described second workbench 4 by described second chip grasping mechanism.See Fig. 4, the second workbench 4 comprises: the base-material platform 401 of at least one carrying base-material; X is to kinematic nest 402 and Y-direction kinematic nest 403, and wherein, described X is in a predeterminated position to kinematic nest 402 and the adjustable described base-material platform 401 of Y-direction kinematic nest 403.Wherein, the shape of the base-material platform 401 shown in Fig. 4 is square, and quantity is two.Be understandable that, the shape of base-material platform 401 can be set to square or circular according to actual needs, and quantity can be set to one or more.
Chip transport sector 1 mainly realizes the long-distance transmissions of chip, it is the major part of flip-chip bonding apparatus, introduce down the structure of this chip transport sector 1 below, as shown in Figure 5, for a kind of structural representation of chip transport sector 1, comprise: the first conveyer belt 101, described station is multiple first vacuum holes 102 being arranged on described first conveyer belt 101; Described drive division comprises: the first driving wheel 103 and the first driven pulley 104, wherein, described first conveyer belt 101 connects the first driving wheel 103 and the first driven pulley 104, first driving wheel 103 drives the first driven pulley 104 to rotate, drive the first conveyer belt 101 that chip is sent to opposite side from side, to complete the transmission work of chip.
Wherein, further, described multiple first vacuum hole 102 can be single row or multiple rows arrangement on described first conveyer belt 101.
As shown in Figure 6, for the another kind of structural representation of chip transport sector 1, comprise: described installation portion comprises: the second conveyer belt 105 and the chip tray 106 be positioned on outside described second conveyer belt 105, described station is multiple second vacuum holes 107 be arranged on described chip tray 106; Described drive division comprises: the second driving wheel 108 and the second driven pulley 109, wherein, described second conveyer belt 105 connects the second driving wheel 108 and the second driven pulley 109, second driving wheel 108 drives the second driven pulley 109 to rotate, drive the second conveyer belt 105 and chip tray 106 that chip is sent to opposite side from side, to complete the transmission work of chip.
Here should be understood that; chip transport sector 1 can have various ways; the embodiment of the present invention only lists above two kinds; under every prerequisite not departing from principle described in chip transport sector 1; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Further, chip transport sector 1 also comprises: vacuum suction structure, described vacuum suction structure comprises multiple vacuum tube joint, described multiple vacuum tube joint is positioned on described installation portion, and multiple vacuum tube joint is corresponding one by one with the station on described installation portion, by described vacuum tube joint, described station adopts vacuum suction mode to fix described chip.
Continue see Fig. 1 and Fig. 2, described first chip grasping mechanism comprises:
First chip placement unit 5, is positioned over described first workbench 3 by described wafer after capturing wafer; Be positioned at the first chip detection unit 6 above the first workbench 3, for detecting the positional information of described wafer chips; Be positioned at the chip jack-up unit 7 below the first workbench 3, for by described chip upwards jack-up one preset height; Roll-over unit 8 between the first chip detection unit 6 and the first workbench 3, for capturing described chip and the end face of described chip and bottom surface being overturn; Wherein, described roll-over unit 8 comprises: dwang 801; Be positioned at first suction nozzle 802 and second suction nozzle 803 at dwang 801 two ends; Regulate the height adjustment mechanism that described dwang 801 moves up and down; And regulate the rotation regulating mechanism of described dwang 801 rotary motion; Second chip placement unit 9, between described first chip detection unit 6 and described roll-over unit 8, for adsorbing the chip after upset, and is placed on the first position of transport sector 1 by described chip.Wherein, described second chip placement unit 9 comprises: pick up head motion 901 and pick up head 902, picks up head 902 and can pick up motion on head motion 901, and can arrange the quantity of picking up head 902 as required.
Continue see Fig. 1 and Fig. 2, described second chip grasping mechanism comprises:
Second chip detection unit 10, is positioned at the top of described chip transport sector 1, for detecting the positional information of described chip in described second position; Be positioned at the bonding units 11 above the second workbench 4, for capturing the chip be positioned in the described second place; Bonding units 11 comprises: bonding head motion 1101 and bonding head mechanism 1102; Accommodate the impregnating unit of solder flux or bonded adhesives, for flooding the projection in the described die bottom surface captured by described bonding units 11; 3rd chip detection unit 12, is positioned at the top of described bonding units 11, for the positional information of detection chip 4 positions to be bonded on described second workbench.
Continue see Fig. 7, Fig. 7 the concrete structure schematic diagram of the bonding head mechanism 1102 being bonding units 11, comprising: bonding head 1103, vacuum adapter 1104, Compressed Gas joint 1105 and bonding head cylinder 1106; Wherein, after Compressed Gas joint 1105 passes into Compressed Gas, for bonding head cylinder 1106 provides pressure, vacuum adapter 1104 is positioned at the outside of described bonding head cylinder 1106, be connected with bonding head cylinder 1106, bonding head 1103 is positioned at the below of described bonding head cylinder 1106, is connected with bonding head cylinder 1106.
Further, see Fig. 1 and Fig. 8, Fig. 8 is an embodiment of described impregnating unit, this embodiment correspond to the flip-chip bonding technology needing to dip solder flux or bonded adhesives, in this case, impregnating unit comprises: dip in glue unit 13, the described glue unit 13 that dips in comprises: the 3rd motor 1301,3rd conveyer belt 1302, connecting plate 1303, dress glue box 1304 and glue scraping plate 1305, described 3rd motor 1301 comprises: the second output device, and described second output device is connected with described 3rd conveyer belt 1302; The inner side of described 3rd conveyer belt 1302 is gear structure; One end and the described gear mechanism of described connecting plate 1303 are connected with a joggle; Glue scraping plate 1305 is connected with the other end of described connecting plate 1303, and described glue scraping plate 1305 is provided with groove, and wherein, described depth of groove can be set to 10 ~ 100um; Be positioned at the dress glue box 1304 above described glue scraping plate 1305, in described dress glue box 1304, be equipped with solder flux or bonded adhesives.When chip motion is to dipping in above glue unit 13,3rd motor 1301 drives the 3rd conveyer belt 1302 to move a certain distance, 3rd conveyer belt 1302 drives glue scraping plate 1305 to move by connecting plate 1303, to the groove in glue scraping plate 1305 completely by above dress glue box 1304, now, 3rd motor 1301 rotates backward, and drive glue scraping plate 1305 to stretch out, the solder flux in glue box 1304 or bonded adhesives fill up the groove in glue scraping plate 1305.
Continue see Fig. 2, when correspond to the flip-chip bonding technology needing to dip solder flux or bonded adhesives, described flip-chip bonding apparatus also comprises: the 4th chip detecting unit 14, for obtaining the positional information of described chip on described bonding units 11, the 4th chip detecting unit 14 is arranged at the below of described glue scraping plate 1305.
Further, see Fig. 2 and Fig. 9, Fig. 9 is another embodiment of described impregnating unit, this embodiment correspond to the flip-chip bonding technology not needing to dip solder flux or bonded adhesives, in this case, impregnating unit comprises: some glue unit 15, described some glue unit 15 comprises: Glue dripping head 1501, Glue dripping head X are to motor 1502, Glue dripping head Y-direction motor 1503 and Glue dripping head Z-direction motor 1504, described Glue dripping head X, to motor 1502, Glue dripping head Y-direction motor 1503 and the mating reaction of Glue dripping head Z-direction motor 1504, carries out a glue to drive Glue dripping head 1501 on base-material.By the coordination of sequential, bonding head 1103 by chip bonding on the base-material completing a glue.
Further, see Fig. 1, described flip-chip bonding apparatus also comprises: base-material transport sector 16, see Figure 10, described base-material transport sector 16 comprises: manipulator controller 1601, the manipulator 1603 being positioned at the stand 1602 above described manipulator controller 1601 and being positioned at above described stand.When after the complete base-material of flip-chip bonding, manipulator 1603 puts in the second workbench 4 and is held up by base-material, manipulator controller 1601 controls manipulator 1603 and the base-material finished is put into base-material box, and the base-material holding up a non-load from base-material box is placed on the second workbench 4.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (17)
1. a flip-chip bonding apparatus, is characterized in that, comprising:
Chip transport sector, described chip transport sector comprises: installation portion and the drive division for driving described installation portion to move, and described installation portion comprises multiple station for chip placement; Wherein, by the motion of described installation portion, the chip be positioned on a wherein station is moved to second position from first position;
First chip grasping mechanism, for upwards being overturn by downside by described chip after grab chips, and after being overturn by described chip, is placed on described chip on described installation portion and is positioned on a station of described first position;
Second chip grasping mechanism, takes out for the chip that will described installation portion be positioned on the station of described second position, to carry out bonding.
2. flip-chip bonding apparatus according to claim 1, is characterized in that, also comprise:
Wafer case, described wafer case comprises: wafer case body, and in described wafer case body, relative both sides are arranged with multiple slot in parallel, and described slot is used for the substrate that clamping is placed with wafer; First motor, described first motor comprises: the first output device; Be positioned at the support below described wafer case body, described first output device is connected with described support.
3. flip-chip bonding apparatus according to claim 1, is characterized in that, also comprise:
Table mechanism, described table mechanism comprises: the first workbench and the second workbench, wherein, described first chip grasping mechanism is from pick-up chip described first workbench, and described chip is placed on described installation portion, the chip that described installation portion picks up is placed on described second workbench by described second chip grasping mechanism.
4. flip-chip bonding apparatus according to claim 3, is characterized in that, described second workbench comprises:
The base-material platform of at least one carrying base-material; X is to kinematic nest and Y-direction kinematic nest, and wherein, described X is in a predeterminated position to kinematic nest and the adjustable described base-material platform of Y-direction kinematic nest.
5. flip-chip bonding apparatus according to claim 1, is characterized in that, described installation portion comprises: the first conveyer belt, and described station is multiple first vacuum holes being arranged on described first conveyer belt; Described drive division comprises: the first driving wheel and the first driven pulley, and wherein, described first conveyer belt connects the first driving wheel and the first driven pulley.
6. flip-chip bonding apparatus according to claim 5, is characterized in that, described multiple first vacuum hole is single row or multiple rows arrangement on described first conveyer belt.
7. flip-chip bonding apparatus according to claim 1, it is characterized in that, described installation portion comprises: the second conveyer belt and the chip tray be positioned on outside described second conveyer belt, and described station is multiple second vacuum holes be arranged on described chip tray; Described drive division comprises: the second driving wheel and the second driven pulley, and wherein, described second conveyer belt connects the second driving wheel and the second driven pulley.
8. flip-chip bonding apparatus according to claim 1, it is characterized in that, described chip transport sector also comprises: vacuum suction structure, described vacuum suction structure comprises multiple vacuum tube joint, described multiple vacuum tube joint is positioned on described installation portion, and multiple vacuum tube joint is corresponding one by one with the station on described installation portion, by described vacuum tube joint, described station adopts vacuum suction mode to fix described chip.
9. flip-chip bonding apparatus according to claim 3, is characterized in that, described first chip grasping mechanism comprises:
First chip placement unit, is positioned over described first workbench by described wafer after capturing wafer;
Be positioned at the first chip detection unit above the first workbench, for detecting the positional information of described wafer chips;
Be positioned at the chip jack-up unit below the first workbench, for by described chip upwards jack-up one preset height;
Roll-over unit between the first chip detection unit and the first workbench, for capturing described chip and the end face of described chip and bottom surface being overturn;
Second chip placement unit, between described first chip detection unit and described roll-over unit, for adsorbing the chip after upset, and is placed on the first position of transport sector by described chip.
10. flip-chip bonding apparatus according to claim 9, is characterized in that, described roll-over unit comprises: dwang; Be positioned at the first suction nozzle and second suction nozzle at dwang two ends; Regulate the height adjustment mechanism that described dwang moves up and down; And regulate the rotation regulating mechanism of described dwang rotary motion.
11. flip-chip bonding apparatus according to claim 3, is characterized in that, described second chip grasping mechanism comprises:
Second chip detection unit, is positioned at the top of described chip transport sector, for detecting the positional information of described chip in described second position;
Be positioned at the bonding units above the second workbench, for capturing the chip be positioned in the described second place;
Accommodate the impregnating unit of solder flux or bonded adhesives, for flooding the projection in the described die bottom surface captured by described bonding units;
3rd chip detection unit, is positioned at the top of described bonding units, treats the positional information of patch location for detection chip on described second workbench.
12. flip-chip bonding apparatus according to claim 11, it is characterized in that, described bonding units comprises:
Bonding head, vacuum adapter, Compressed Gas joint and bonding head cylinder;
Wherein, after Compressed Gas joint passes into Compressed Gas, for bonding head cylinder provides pressure, vacuum adapter is positioned at the outside of described bonding head cylinder, and with bonding head cylinders, bonding head is positioned at the below of described bonding head cylinder, with bonding head cylinders.
13. flip-chip bonding apparatus according to claim 11, it is characterized in that, described impregnating unit comprises: dip in glue unit,
The described glue unit that dips in comprises: the 3rd motor, the 3rd conveyer belt, connecting plate, dress glue box and glue scraping plate;
Described 3rd motor comprises: the second output device, and described second output device is connected with described 3rd conveyer belt;
The inner side of described 3rd conveyer belt is gear structure;
One end and the described gear mechanism of described connecting plate are connected with a joggle;
Glue scraping plate is connected with the other end of described connecting plate, and described glue scraping plate is provided with groove; Be positioned at the dress glue box above described glue scraping plate, in described dress glue box, be equipped with solder flux or bonded adhesives.
14. flip-chip bonding apparatus according to claim 13, is characterized in that, described depth of groove is 10 ~ 100um.
15. flip-chip bonding apparatus according to claim 13, is characterized in that, described flip-chip bonding apparatus also comprises:
4th chip detecting unit, for obtaining the positional information of described chip on described bonding units, is positioned at the below of described glue scraping plate.
16. flip-chip bonding apparatus according to claim 11, it is characterized in that, described impregnating unit comprises: some glue unit, described some glue unit comprises: Glue dripping head, Glue dripping head X are to motor, Glue dripping head Y-direction motor and Glue dripping head Z-direction motor, described Glue dripping head X, to motor, Glue dripping head Y-direction motor and the mating reaction of Glue dripping head Z-direction motor, carries out a glue to drive Glue dripping head on base-material.
17. flip-chip bonding apparatus according to claim 1, it is characterized in that, described flip-chip bonding apparatus also comprises: base-material transport sector, and described base-material transport sector comprises: manipulator controller, the manipulator being positioned at the stand above described manipulator controller and being positioned at above described stand.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510124424.3A CN104701199B (en) | 2015-03-20 | 2015-03-20 | A kind of flip-chip bonding apparatus |
| PCT/CN2015/087199 WO2016150080A1 (en) | 2015-03-20 | 2015-08-17 | Flip chip bonding device |
| TW104126667A TWI579935B (en) | 2015-03-20 | 2015-08-17 | A flip chip bonding device |
| SG11201510597TA SG11201510597TA (en) | 2015-03-20 | 2015-08-17 | Flip-chip bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510124424.3A CN104701199B (en) | 2015-03-20 | 2015-03-20 | A kind of flip-chip bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104701199A true CN104701199A (en) | 2015-06-10 |
| CN104701199B CN104701199B (en) | 2018-03-13 |
Family
ID=53348181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510124424.3A Expired - Fee Related CN104701199B (en) | 2015-03-20 | 2015-03-20 | A kind of flip-chip bonding apparatus |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN104701199B (en) |
| SG (1) | SG11201510597TA (en) |
| TW (1) | TWI579935B (en) |
| WO (1) | WO2016150080A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI579935B (en) | 2017-04-21 |
| SG11201510597TA (en) | 2016-10-28 |
| WO2016150080A1 (en) | 2016-09-29 |
| TW201635399A (en) | 2016-10-01 |
| CN104701199B (en) | 2018-03-13 |
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