CN104701199B - A kind of flip-chip bonding apparatus - Google Patents
A kind of flip-chip bonding apparatus Download PDFInfo
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- CN104701199B CN104701199B CN201510124424.3A CN201510124424A CN104701199B CN 104701199 B CN104701199 B CN 104701199B CN 201510124424 A CN201510124424 A CN 201510124424A CN 104701199 B CN104701199 B CN 104701199B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a kind of flip-chip bonding apparatus, including：Chip transmission mechanism, the chip transmission mechanism include：Installation portion and the drive division for driving the installation portion motion, the installation portion include multiple stations for chip placement；Wherein, by the motion of the installation portion, the chip being located therein on a station is moved to the second place at first position；First chip grasping mechanism, for being flipped up the chip by downside after grab chips, and after the chip is overturn, the chip is placed on the installation portion on the station at the first position；Second chip grasping mechanism, for the chip being located on the installation portion on the station of the second place to be taken out, to be bonded.Invention introduces the chip transmission mechanism of precision, reliability are high so that flip-chip bonding apparatus adapts to the back bonding of large scale base material in the case where not reducing efficiency, substantially increases load precision.
Description
Technical field
The present invention relates to flip-chip bonding techniques field, more particularly to a kind of flip-chip bonding apparatus.
Background technology
With developing rapidly for global electronic information technology, consumer needs smaller portable type electronic product so that first
The encapsulation entered and interconnection technique are just in beyond tradition technology.Advanced Packaging combines semiconductor packages and package technique together
To reduce product price, improve performance, improve density and reduce product size, this causes the city of flip chip semiconductor package
Field demand just increases rapidly.Flip-chip is not only a kind of high-density chip interconnections technology, or a kind of preferably chip glues
Connection technology, it is obtained for and is widely applied in PGA, BGA and CSP.The interconnection line of flip-chip is very short, and I/O is drawn
End is distributed whole chip surface, while flip-chip industry is adapted to be produced in batches using SMT technological means, therefore upside-down mounting
Chip has turned into the main direction of development of High Density Packaging Technology.
Flip-chip bonding be that the chip with salient point is picked up and overturn from blue film so that its pad patterns down,
Brigadier's chip is placed on base material by Machine Vision Recognition.Reverse chip key binder decides flip-chip bonding technology
Precision, efficiency and reliability, it is the key equipment of Flip-Chip Using technique.Reverse chip key binder is a kind of high-speed, high precision
Equipment, various vibrations can be produced when equipment is run, chip bonding precision is had a huge impact.In addition as semiconductor is given birth to
Production efficiency further improves, and wafer size just develops towards bigger direction, picked up from wafer chip to base material bonding position away from
From being continuously increased so that bonding efficiency substantially reduces.
Existing flip-chip bonding technology and the world that in equipment, all brightness magnitude people of ASM companies of Singapore apply are special
Sharp WO2003/058708 discloses a kind of abovementioned.The equipment picks up chip from blue film, is handed off to by upset
On bonding head, then by the way that on bonding head load to lead frame, its switching mechanism has 4 suction nozzles, keying features have 8 suction nozzles,
It will overturn, pick up, dipping in the technique parallel processing such as glue, bonding, so as to improve the load efficiency of equipment.The device structure is complicated, real
Existing difficulty is big.The Chinese patent CN200610171125.6 of Patrick Bu Laixin of ESEC SA of Switzerland et al. applications is disclosed
A kind of flip-chip bonding apparatus that chip transmission is realized using bonding head swing mechanism, the equipment can compensate by thermally-induced
The influence of separate part movement, but it uses swing mechanism to reduce load precision.The Zheng Xianquan of Hanmi Semiconductor Co. Ltd
Et al. application patent CN201310173823.X disclose a kind of flip-chip welding equipment, the equipment uses two sets of bonders
Structure improves efficiency, but because chip pickup position and bonding position distance are remote, and base material alignment cameras is arranged on the bonding head of motion
On, cause efficiency and precision all to reduce.
The content of the invention
In order to overcome the above-mentioned problems in the prior art, the invention provides a kind of flip-chip bonding apparatus, sheet
The flip-chip bonding apparatus of invention introduces accurate chip transmission mechanism, and reliability is high so that equipment is not reducing efficiency
In the case of adapt to large scale base material back bonding, substantially increase load precision.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme that：
One side according to the embodiment of the present invention, there is provided a kind of flip-chip bonding apparatus, including：
Chip transmission mechanism, the chip transmission mechanism include：Installation portion and the drive for driving the installation portion motion
Dynamic portion, the installation portion include multiple stations for chip placement；Wherein, by the motion of the installation portion, it will be located at
In chip on a station second place is moved at first position；
First chip grasping mechanism, for being flipped up the chip by downside after grab chips, and by the core
After piece upset, the chip is placed on the installation portion on the station at the first position；
Second chip grasping mechanism, taken for the chip on the station of the second place will to be located on the installation portion
Go out, to be bonded；
Wherein, the first chip grasping mechanism includes：
First chip placement unit, the chip is positioned over the first workbench after chip for capturing；
The first chip detection unit above the first workbench, the position for detecting the chip chips are believed
Breath；
Chip below the first workbench jacks up unit, for the chip to be jacked up into a preset height upwards；
Roll-over unit between the first chip detection unit and the first workbench, for capturing the chip and by institute
State top surface and the bottom surface upset of chip；
Second chip placement unit, between the first chip detection unit and the roll-over unit, for adsorbing
Chip after upset, and the chip is placed at the first position of transmission mechanism.
Wherein, the flip-chip bonding apparatus also includes：
Wafer case, the wafer case include：Chip box body, relative both sides are arranged with parallel in the chip box body
Multiple slots, the slot are used for the substrate that clamping is placed with chip；First motor, first motor include：First output
Device；Support below the chip box body, first output device are connected with the support.
Wherein, the flip-chip bonding apparatus also includes：
Table mechanism, the table mechanism include：First workbench and the second workbench, wherein, first core
Piece grasping mechanism picks up chip from first workbench, and the chip is placed on the installation portion, described second
The chip picked up on the installation portion is placed on second workbench by chip grasping mechanism.
Wherein, second workbench includes：
The base-material platform of at least one carrying base-material；X to kinematic nest and Y-direction kinematic nest, wherein, the X is to kinematic nest and Y
The base-material platform, which is can adjust, to kinematic nest is in a predeterminated position.
Wherein, the installation portion includes：First conveyer belt, the station are be arranged on first conveyer belt multiple
One vacuum hole；The drive division includes：First driving wheel and the first driven pulley, wherein, the first transmission band connection first is led
Driving wheel and the first driven pulley.
Wherein, the multiple first vacuum hole is arranged on first conveyer belt for single row or multiple rows.
Wherein, the installation portion includes：Second conveyer belt and the chip tray on second conveyer belt outside, institute
It is multiple second vacuum holes being arranged on the chip tray to state station；The drive division includes：Second driving wheel and second
Driven pulley, wherein, the second transmission driving wheel of band connection second and the second driven pulley.
Wherein, the chip transmission mechanism also includes：Vacuum suction structure, the vacuum suction structure include multiple vacuum
Pipe joint, the multiple vacuum tube joint are located on the installation portion, and multiple vacuum tube joints and the work on the installation portion
Position is corresponding one by one, and by the vacuum tube joint, the station fixes the chip using vacuum suction mode.
Wherein, the first chip grasping mechanism includes：
First chip placement unit, the chip is positioned over first workbench after chip for capturing；
The first chip detection unit above the first workbench, the position for detecting the chip chips are believed
Breath；
Chip below the first workbench jacks up unit, for the chip to be jacked up into a preset height upwards；
Roll-over unit between the first chip detection unit and the first workbench, for capturing the chip and by institute
State top surface and the bottom surface upset of chip；
Second chip placement unit, between the first chip detection unit and the roll-over unit, for adsorbing
Chip after upset, and the chip is placed at the first position of transmission mechanism.
Wherein, the roll-over unit includes：Rotating bar；The first suction nozzle and the second suction nozzle positioned at rotating bar both ends；Regulation
The height adjustment mechanism that the rotating bar moves up and down；And the rotation regulating mechanism of the regulation rotating bar rotary motion.
Wherein, the second chip grasping mechanism includes：
Second chip detection unit, positioned at the top of the chip transmission mechanism, for detecting the chip described
The positional information of two opening positions；
Bonding units above the second workbench, for capturing the chip on the second place；
The impregnating unit of solder flux or bonded adhesives is accommodated, for impregnating the die bottom surface captured by the bonding units
On projection；
3rd chip detection unit, positioned at the top of the bonding units, for detection chip in second workbench
On treat the positional information of patch location.
Wherein, the bonding units include：
Bonding head, vacuum adapter, compressed gas joint and bonding head cylinder；Wherein, compressed gas joint is passed through compression
After gas, pressure is provided for bonding head cylinder, vacuum adapter is located at the outside of the bonding head cylinder, with bonding head cylinder phase
Even, bonding head is located at the lower section of the bonding head cylinder, with bonding head cylinders.
Wherein, the impregnating unit includes：Glue unit is dipped in,
The glue unit that dips in includes：3rd motor, the 3rd conveyer belt, connecting plate, glue box and glue scraping plate are filled,
3rd motor includes：Second output device, second output device and the described 3rd transmission band connection；
The inner side of 3rd conveyer belt is gear structure；
Connection is engaged with the gear mechanism in one end of the connecting plate；
Glue scraping plate is connected with the other end of the connecting plate, is set on the glue scraping plate fluted；Positioned at the glue scraping plate
The dress glue box of top, described fill in glue box are equipped with solder flux or bonded adhesives.
Wherein, the depth of groove is 10~100um.
Wherein, the flip-chip bonding apparatus also includes：
Fourth chip detection unit, for obtaining positional information of the chip on the bonding units, positioned at described
The lower section of glue scraping plate.
Wherein, the impregnating unit includes：Dispensing unit, the dispensing unit include：Glue dripping head, Glue dripping head X to motor,
Glue dripping head Y-direction motor and Glue dripping head Z-direction motor, the Glue dripping head X are electric to motor, Glue dripping head Y-direction motor and Glue dripping head Z-direction
Machine mating reaction, to drive Glue dripping head to carry out dispensing on base-material.
Wherein, the flip-chip bonding apparatus also includes：Base-material transmission mechanism, the base-material transmission mechanism include：Machine
Tool hand control device, the stand above the manipulator controller and the manipulator above the stand.
Beneficial effects of the present invention：Flip-chip bonding apparatus provided by the invention includes chip transmission mechanism, the first core
Piece grasping mechanism and the second chip grasping mechanism, during chip transmission mechanism transmits chip, the first chip grasping mechanism
It is placed on after chip is picked up on chip transmission mechanism on the station at first position, in chip motion to the second place
When, the second chip grasping mechanism takes out chip from the second place to be bonded.The introducing of chip transmission mechanism so that upside-down mounting
Chip bonding equipment adapts to the back bonding of large scale base material in the case where not reducing efficiency, substantially increases load precision.
Brief description of the drawings
Fig. 1 is the top view of the flip-chip bonding apparatus of the embodiment of the present invention；
Fig. 2 is the front view of the flip-chip bonding apparatus of the embodiment of the present invention；
Fig. 3 is the structural representation of the wafer case of the embodiment of the present invention；
Fig. 4 is the structural representation of the second workbench of the embodiment of the present invention；
Fig. 5 is one of structural representation of chip transmission structure of the embodiment of the present invention；
Fig. 6 is the two of the structural representation of the chip transmission structure of the embodiment of the present invention；
Fig. 7 is the structural representation of the bonding units of the embodiment of the present invention；
Fig. 8 is the structural representation for dipping in glue unit of the embodiment of the present invention；
Fig. 9 is the structural representation of the dispensing unit of the embodiment of the present invention；
Figure 10 is the structural representation of the base-material transmission mechanism of the embodiment of the present invention.
Wherein in figure：1st, chip transmission mechanism；101st, the first conveyer belt；102nd, the first vacuum hole；103rd, the first driving wheel；
104th, the first driven pulley；105th, the second conveyer belt；106th, chip tray；107 second vacuum holes；108th, the second driving wheel；109、
Second driven pulley；2nd, wafer case；201st, slot；202nd, the first motor；203rd, support；3rd, the first workbench；4th, the second workbench；
401st, base-material platform；402nd, X is to kinematic nest；403rd, Y-direction kinematic nest；5th, the first chip placement unit；6th, the detection of the first chip is single
Member；7th, chip jacks up unit；8th, roll-over unit；801st, rotating bar；802nd, the first suction nozzle；803rd, the second suction nozzle；9th, the second chip
Placement unit；901st, head motion is picked up；902nd, head are picked up；10th, the second chip detection unit；11st, bonding units；1101、
Bonding head motion；1102nd, bonding head mechanism；1103rd, bonding head；1104th, vacuum adapter；1105th, compressed gas joint；
1106th, bonding head cylinder；1107th, the second motor；1108th, correcting mechanism；12nd, the 3rd chip detection unit；13rd, glue unit is dipped in；
1301st, the 3rd motor；1302nd, the 3rd conveyer belt；1303rd, connecting plate；1304th, glue box are filled；1305th, glue scraping plate；14th, fourth chip
Detection unit；15th, dispensing unit；1501st, Glue dripping head；1502nd, Glue dripping head X is to motor；1503rd, Glue dripping head Y-direction motor；1504、
Glue dripping head Z-direction motor；16th, base-material transmission mechanism；1601st, manipulator controller；1602nd, stand；1603rd, manipulator.
Embodiment
To make the technical problem to be solved in the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and tool
Body embodiment is described in detail.
As depicted in figs. 1 and 2, the embodiments of the invention provide a kind of flip-chip bonding apparatus, including：Chip conveyer
Structure 1, the chip transmission mechanism 1 include：Installation portion and the drive division for driving the installation portion motion, the installation portion bag
Include multiple stations for chip placement；Wherein, by the motion of the installation portion, by the chip being located therein on a station from
The second place is moved at first position；First chip grasping mechanism, for after grab chips by the chip by lower lateral
Upper upset, and after the chip is overturn, the chip is placed on the installation portion at the first position
On one station；Second chip grasping mechanism, for the chip that will be located on the installation portion on the station of the second place
Take out, to be bonded.
The flip-chip bonding apparatus of the embodiment of the present invention includes chip transmission mechanism, the first chip grasping mechanism and second
Chip grasping mechanism, during chip transmission mechanism transmits chip, the first chip grasping mechanism is placed after chip is picked up
On chip transmission mechanism on the station at first position, when chip motion is to the second place, the crawl of the second chip
Chip is taken out and is bonded by mechanism from the second place.The introducing of chip transmission mechanism so that flip-chip bonding apparatus exists
The back bonding of large scale base material is adapted in the case of not reducing efficiency, substantially increases load precision.
Further, also include with continued reference to Fig. 1, flip-chip bonding apparatus：Wafer case 2, as Fig. 3 is wafer case 2
Concrete structure schematic diagram, including：Chip box body, relative both sides are arranged with multiple slots in parallel in the chip box body
201, the slot 201 is used for the substrate that clamping is placed with chip；First motor 202, first motor 202 include：First
Output device；Support 203 below the chip box body, first output device are connected with the support 203, when
After first chip grasping mechanism takes out chip out of wafer case 2 equipped with multi-layer crystal chip, drive of the support 203 in the first motor 202
Lower chip is pushed into working position under dynamic.
Further, also include with continued reference to Fig. 1, flip-chip bonding apparatus：Table mechanism, table mechanism bag
Include：First workbench 3 and the second workbench 4, wherein, the first chip grasping mechanism picks up from first workbench 3
Chip, and the chip is placed on the installation portion, the second chip grasping mechanism will pick up on the installation portion
Chip is placed on second workbench 4.Referring to Fig. 4, the second workbench 4 includes：The base-material of at least one carrying base-material is put down
Platform 401；X to kinematic nest 402 and Y-direction kinematic nest 403, wherein, the X can adjust institute to kinematic nest 402 and Y-direction kinematic nest 403
State base-material platform 401 and be in a predeterminated position.Wherein, the base-material platform 401 shown in Fig. 4 be shaped as it is square, quantity be two.
It is understood that the shape of base-material platform 401 can be arranged to square or circular according to being actually needed, quantity can be set
For one or more.
Chip transmission mechanism 1 mainly realizes the long-distance transmissions of chip, is the major part of flip-chip bonding apparatus, under
Face introduces down the structure of the chip transmission mechanism 1, as shown in figure 5, be a kind of structural representation of chip transmission mechanism 1,
Including：First conveyer belt 101, the station are multiple first vacuum holes 102 for being arranged on first conveyer belt 101；It is described
Drive division includes：First driving wheel 103 and the first driven pulley 104, wherein, first conveyer belt 101 connects the first driving wheel
103 and first driven pulley 104, the first driving wheel 103 drive the first driven pulley 104 to rotate, the first conveyer belt 101 of driving is by chip
Opposite side is sent to from side, to complete the transmission work of chip.
Wherein, further, the multiple first vacuum hole 102 can be single or more on first conveyer belt 101
Row's arrangement.
As shown in fig. 6, be another structural representation of chip transmission mechanism 1, including：The installation portion includes：Second
Conveyer belt 105 and the chip tray 106 on the outside of the second conveyer belt 105, the station are to be arranged on the chip
Multiple second vacuum holes 107 on pallet 106；The drive division includes：Second driving wheel 108 and the second driven pulley 109, its
In, second conveyer belt 105 connects the second driving wheel 108 and the second driven pulley 109, the second driving wheel 108 drive second from
Driving wheel 109 rotates, and drives the second conveyer belt 105 and chip tray 106 that chip is sent into opposite side from side, to complete chip
Transmission work.
Here it should be understood that chip transmission mechanism 1 can have a diversified forms, the embodiment of the present invention only list with
It is upper two kinds, every on the premise of principle described in chip transmission mechanism 1 is not departed from, some improvements and modifications can also be made, this
A little improvements and modifications also should be regarded as protection scope of the present invention.
Further, chip transmission mechanism 1 also includes：Vacuum suction structure, the vacuum suction structure include multiple true
Blank pipe joint, the multiple vacuum tube joint are located on the installation portion, and on multiple vacuum tube joints and the installation portion
Station is corresponding one by one, and by the vacuum tube joint, the station fixes the chip using vacuum suction mode.
With continued reference to Fig. 1 and Fig. 2, the first chip grasping mechanism includes：
First chip placement unit 5, the chip is positioned over first workbench 3 after chip for capturing；Position
The first chip detection unit 6 above the first workbench 3, for detecting the positional information of the chip chips；Positioned at
The chip of the lower section of one workbench 3 jacks up unit 7, for the chip to be jacked up into a preset height upwards；Examined positioned at the first chip
The roll-over unit 8 surveyed between the workbench 3 of unit 6 and first, for capturing the chip and by the top surface of the chip and bottom surface
Upset；Wherein, the roll-over unit 8 includes：Rotating bar 801；The first suction nozzle 802 and second positioned at the both ends of rotating bar 801 is inhaled
Mouth 803；Adjust the height adjustment mechanism that the rotating bar 801 moves up and down；And the regulation rotary motion of rotating bar 801
Rotation regulating mechanism；Second chip placement unit 9, between the first chip detection unit 6 and the roll-over unit 8,
For adsorbing the chip after upset, and the chip is placed at the first position of transmission mechanism 1.Wherein, described second
Chip placement unit 9 includes：Pick up head motion 901 and pick up head 902, head motion 901 can picked up by picking up head 902
Upper motion, and can be arranged as required to pick up the quantity of head 902.
With continued reference to Fig. 1 and Fig. 2, the second chip grasping mechanism includes：
Second chip detection unit 10, positioned at the top of the chip transmission mechanism 1, for detecting the chip described
The positional information of the second place；Bonding units 11 above the second workbench 4, it is located at the second place for capturing
On chip；Bonding units 11 include：Bonding head motion 1101 and bonding head mechanism 1102；Accommodate solder flux or bonded adhesives
Impregnating unit, for impregnating the projection in the die bottom surface captured by the bonding units 11；The detection of 3rd chip is single
Member 12, positioned at the top of the bonding units 11, the position for detection chip position to be bonded on second workbench 4
Information.
With continued reference to Fig. 7, Fig. 7 is the concrete structure schematic diagram of the bonding head mechanism 1102 of bonding units 11, including：Bonding
First 1103, vacuum adapter 1104, compressed gas joint 1105 and bonding head cylinder 1106；Wherein, compressed gas joint 1105
After being passed through compressed gas, pressure is provided for bonding head cylinder 1106, vacuum adapter 1104 is located at the bonding head cylinder 1106
Outside, it is connected with bonding head cylinder 1106, bonding head 1103 is located at the lower section of the bonding head cylinder 1106, with bonding head cylinder
1106 are connected.
Further, referring to Fig. 1 and Fig. 8, Fig. 8 is one embodiment of the impregnating unit, and the embodiment correspond to need
The flip-chip bonding technology of solder flux or bonded adhesives is dipped, in this case, impregnating unit includes：Dip in glue unit 13, institute
State and dip in glue unit 13 and include：3rd motor 1301, the 3rd conveyer belt 1302, connecting plate 1303, fill glue box 1304 and glue scraping plate
1305, the 3rd motor 1301 includes：Second output device, second output device connect with the 3rd conveyer belt 1302
Connect；The inner side of 3rd conveyer belt 1302 is gear structure；Engaged with the gear mechanism one end of the connecting plate 1303
Connection；Glue scraping plate 1305 is connected with the other end of the connecting plate 1303, set on the glue scraping plate 1305 it is fluted, wherein,
The depth of groove may be configured as 10~100um；Dress glue box 1304 above the glue scraping plate 1305, the dress glue box
Solder flux or bonded adhesives are equipped with 1304.When chip motion transmits to the top of glue unit 13, the 3rd motor 1301 driving the 3rd is dipped in
Band 1302 moves a certain distance, and the 3rd conveyer belt 1302 drives glue scraping plate 1305 to move by connecting plate 1303, to glue scraping plate
Groove in 1305 is completely by filling the top of glue box 1304, and now, the 3rd motor 1301 rotates backward, and driving glue scraping plate 1305 is stretched
Go out, the groove that the solder flux or bonded adhesives in glue box 1304 are filled up in glue scraping plate 1305.
It is described in the case of the flip-chip bonding technology that correspond to need to dip solder flux or bonded adhesives with continued reference to Fig. 2
Flip-chip bonding apparatus also includes：Fourth chip detection unit 14, for obtaining the chip in the bonding units 11
Positional information, fourth chip detection unit 14 is arranged at the lower section of the glue scraping plate 1305.
Further, it is another embodiment of the impregnating unit referring to Fig. 2 and Fig. 9, Fig. 9, the embodiment correspond to
The flip-chip bonding technology of solder flux or bonded adhesives need not be dipped, in this case, impregnating unit includes：Dispensing unit
15, the dispensing unit 15 includes：Glue dripping head 1501, Glue dripping head X are to motor 1502, Glue dripping head Y-direction motor 1503 and dispensing
Head Z-direction motor 1504, the Glue dripping head X matches somebody with somebody to motor 1502, Glue dripping head Y-direction motor 1503 and Glue dripping head Z-direction motor 1504
Cooperation is used, to drive Glue dripping head 1501 to carry out dispensing on base-material.By the coordination of sequential, bonding head 1103 exists chip bonding
Complete on base-material for dispensing glue.
Further, also include referring to Fig. 1, the flip-chip bonding apparatus：Base-material transmission mechanism 16, referring to Figure 10,
The base-material transmission mechanism 16 includes：Manipulator controller 1601, the platform above the manipulator controller 1601
Frame 1602 and the manipulator 1603 above the stand.After flip-chip has been bonded a base-material, manipulator 1603 is stretched
Enter in the second workbench 4 and hold up base-material, the base-material finished is put into base by the control machinery hand 1603 of manipulator controller 1601
In magazine, and the base-material of one non-load of picking-up is placed on the second workbench 4 from base-material box.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, on the premise of principle of the present invention is not departed from, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (16)
- A kind of 1. flip-chip bonding apparatus, it is characterised in that including：Chip transmission mechanism, the chip transmission mechanism include：Installation portion and the drive division for driving the installation portion motion, The installation portion includes multiple stations for chip placement；Wherein, by the motion of the installation portion, a work will be located therein Chip on position is moved to the second place at first position；First chip grasping mechanism, for being flipped up the chip by downside after grab chips, and turned over by the chip After turning, the chip is placed on the installation portion on the station at the first position；Second chip grasping mechanism, for the chip being located on the installation portion on the station of the second place to be taken out, To be bonded；Wherein, the first chip grasping mechanism includes：First chip placement unit, the chip is positioned over the first workbench after chip for capturing；The first chip detection unit above the first workbench, for detecting the positional information of the chip chips；Chip below the first workbench jacks up unit, for the chip to be jacked up into a preset height upwards；Roll-over unit between the first chip detection unit and the first workbench, for capturing the chip and by the core The top surface of piece and bottom surface upset；Second chip placement unit, between the first chip detection unit and the roll-over unit, for adsorbing through turning over Chip after turning, and the chip is placed at the first position of transmission mechanism.
- 2. flip-chip bonding apparatus according to claim 1, it is characterised in that also include：Wafer case, the wafer case include：Chip box body, relative both sides are arranged with parallel multiple in the chip box body Slot, the slot are used for the substrate that clamping is placed with chip；First motor, first motor include：First output device； Support below the chip box body, first output device are connected with the support.
- 3. flip-chip bonding apparatus according to claim 1, it is characterised in that also include：Table mechanism, the table mechanism include：First workbench and the second workbench, wherein, first chip is grabbed Take mechanism to pick up chip from first workbench, and the chip is placed on the installation portion, second chip The chip picked up on the installation portion is placed on second workbench by grasping mechanism.
- 4. flip-chip bonding apparatus according to claim 3, it is characterised in that second workbench includes：The base-material platform of at least one carrying base-material；X to kinematic nest and Y-direction kinematic nest, wherein, the X transports to kinematic nest and Y-direction Dynamic seat can adjust the base-material platform and be in a predeterminated position.
- 5. flip-chip bonding apparatus according to claim 1, it is characterised in that the installation portion includes：First transmission Band, the station are multiple first vacuum holes for being arranged on first conveyer belt；The drive division includes：First driving wheel and First driven pulley, wherein, the first transmission driving wheel of band connection first and the first driven pulley.
- 6. flip-chip bonding apparatus according to claim 5, it is characterised in that the multiple first vacuum hole is described Arranged on first conveyer belt for single row or multiple rows.
- 7. flip-chip bonding apparatus according to claim 1, it is characterised in that the installation portion includes：Second transmission Band and on the outside of second conveyer belt on chip tray, the station is multiple the be arranged on the chip tray Two vacuum holes；The drive division includes：Second driving wheel and the second driven pulley, wherein, the second transmission band connection second is led Driving wheel and the second driven pulley.
- 8. flip-chip bonding apparatus according to claim 1, it is characterised in that the chip transmission mechanism also includes： Vacuum suction structure, the vacuum suction structure include multiple vacuum tube joints, and the multiple vacuum tube joint is located at the peace In dress portion, and multiple vacuum tube joints are corresponding one by one with the station on the installation portion, described by the vacuum tube joint Station fixes the chip using vacuum suction mode.
- 9. flip-chip bonding apparatus according to claim 1, it is characterised in that the roll-over unit includes：Rotating bar； The first suction nozzle and the second suction nozzle positioned at rotating bar both ends；Adjust the height adjustment mechanism that the rotating bar moves up and down；And Adjust the rotation regulating mechanism of the rotating bar rotary motion.
- 10. flip-chip bonding apparatus according to claim 3, it is characterised in that the second chip grasping mechanism bag Include：Second chip detection unit, positioned at the top of the chip transmission mechanism, for detecting the chip in the second Put the positional information at place；Bonding units above the second workbench, for capturing the chip on the second place；The impregnating unit of solder flux or bonded adhesives is accommodated, for impregnating in the die bottom surface captured by the bonding units Projection；3rd chip detection unit, positioned at the top of the bonding units, treated for detection chip on second workbench The positional information of patch location.
- 11. flip-chip bonding apparatus according to claim 10, it is characterised in that the bonding units include：Bonding head, vacuum adapter, compressed gas joint and bonding head cylinder；Wherein, after compressed gas joint is passed through compressed gas, pressure is provided for bonding head cylinder, vacuum adapter is located at the bonding The outside of head cylinder, with bonding head cylinders, bonding head is located at the lower section of the bonding head cylinder, with bonding head cylinder phase Even.
- 12. flip-chip bonding apparatus according to claim 10, it is characterised in that the impregnating unit includes：Dip in glue Unit,The glue unit that dips in includes：3rd motor, the 3rd conveyer belt, connecting plate, dress glue box and glue scraping plate；3rd motor includes：Second output device, second output device and the described 3rd transmission band connection；The inner side of 3rd conveyer belt is gear structure；Connection is engaged with the gear mechanism in one end of the connecting plate；Glue scraping plate is connected with the other end of the connecting plate, is set on the glue scraping plate fluted；Above the glue scraping plate Dress glue box, it is described dress glue box in be equipped with solder flux or bonded adhesives.
- 13. flip-chip bonding apparatus according to claim 12, it is characterised in that the depth of groove be 10~ 100um。
- 14. flip-chip bonding apparatus according to claim 12, it is characterised in that the flip-chip bonding apparatus is also Including：Fourth chip detection unit, for obtaining positional information of the chip on the bonding units, positioned at the frictioning The lower section of plate.
- 15. flip-chip bonding apparatus according to claim 10, it is characterised in that the impregnating unit includes：Dispensing Unit, the dispensing unit include：Glue dripping head, Glue dripping head X are to motor, Glue dripping head Y-direction motor and Glue dripping head Z-direction motor, institute Glue dripping head X is stated to motor, Glue dripping head Y-direction motor and Glue dripping head Z-direction motor mating reaction, to drive Glue dripping head enterprising in base-material Row dispensing.
- 16. flip-chip bonding apparatus according to claim 1, it is characterised in that the flip-chip bonding apparatus is also Including：Base-material transmission mechanism, the base-material transmission mechanism include：Manipulator controller, positioned at the manipulator controller The stand of top and the manipulator above the stand.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510124424.3A CN104701199B (en) | 2015-03-20 | 2015-03-20 | A kind of flip-chip bonding apparatus |
| SG11201510597TA SG11201510597TA (en) | 2015-03-20 | 2015-08-17 | Flip-chip bonding equipment |
| PCT/CN2015/087199 WO2016150080A1 (en) | 2015-03-20 | 2015-08-17 | Flip chip bonding device |
| TW104126667A TWI579935B (en) | 2015-03-20 | 2015-08-17 | A flip chip bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510124424.3A CN104701199B (en) | 2015-03-20 | 2015-03-20 | A kind of flip-chip bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104701199A CN104701199A (en) | 2015-06-10 |
| CN104701199B true CN104701199B (en) | 2018-03-13 |
Family
ID=53348181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510124424.3A Expired - Fee Related CN104701199B (en) | 2015-03-20 | 2015-03-20 | A kind of flip-chip bonding apparatus |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN104701199B (en) |
| SG (1) | SG11201510597TA (en) |
| TW (1) | TWI579935B (en) |
| WO (1) | WO2016150080A1 (en) |
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|---|---|---|---|---|
| KR102281279B1 (en) * | 2016-03-14 | 2021-07-23 | 캡콘 리미티드 | Chip packaging device and method therefor |
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Also Published As
| Publication number | Publication date |
|---|---|
| SG11201510597TA (en) | 2016-10-28 |
| TW201635399A (en) | 2016-10-01 |
| CN104701199A (en) | 2015-06-10 |
| TWI579935B (en) | 2017-04-21 |
| WO2016150080A1 (en) | 2016-09-29 |
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