CN110148578A - Crystal solidifying apparatus - Google Patents
Crystal solidifying apparatus Download PDFInfo
- Publication number
- CN110148578A CN110148578A CN201910573763.8A CN201910573763A CN110148578A CN 110148578 A CN110148578 A CN 110148578A CN 201910573763 A CN201910573763 A CN 201910573763A CN 110148578 A CN110148578 A CN 110148578A
- Authority
- CN
- China
- Prior art keywords
- ring assemblies
- fixed
- brilliant ring
- brilliant
- fixed mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 129
- 230000000712 assembly Effects 0.000 claims abstract description 69
- 238000000429 assembly Methods 0.000 claims abstract description 69
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 1
- 239000004990 Smectic liquid crystal Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a kind of crystal solidifying apparatus, including rack, for the first fixed mechanism of fixed brilliant ring assemblies and for support bracket fastened second fixed mechanism, first fixed mechanism and the second fixed mechanism are fixedly installed on respectively in the rack, it further include the vision-based detection mechanism for positioning LED chip, for ejecting the ejecting mechanism of LED chip, second driving mechanism of the first driving mechanism and driving ejecting mechanism movement that drive the first fixed mechanism to move, brilliant ring assemblies on first fixed mechanism are located at the top of the bracket on second fixed mechanism, the ejecting mechanism includes ejection piece, the ejection piece is located at the top of the brilliant ring assemblies.Entire die bond crosses engineering support without movement, shifts without by LED chip taking-up, can greatly improve die bond efficiency and die bond quality；The operation of small size LED chip can be met, can avoid that suction nozzle hole is too small to cause die bond unstable or suction nozzle hole is excessive touches the neighbouring good LED chip of die bond.
Description
Technical field
The present invention relates to semiconductor packaging device technical field more particularly to a kind of crystal solidifying apparatus.
Background technique
Crystal solidifying apparatus is the key equipment after LED in road packing producing line, and die bond process is: glue applying mechanism is first in bracket
Die bond station dispensing, single thimble is directed at LED chip center, and thimble jacks up the LED chip on blue film, and die bond arm is by LED core
Piece takes out from brilliant ring indigo plant film, is rotated by 90 °, then is transferred on the die bond station for having put glue, completes die bond.
Since LED chip is smaller and smaller, the spacing of die bond point is more and more closer, increasingly to the die bond required precision of equipment
Height, rate request are getting faster, and the mode of conventional assimilating type transfer LED chip much fails to meet production requirements.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of crystal solidifying apparatus, it is greatly improved die bond efficiency and die bond
Quality.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows:
A kind of crystal solidifying apparatus, including rack, for the first fixed mechanism of fixed brilliant ring assemblies and for support bracket fastened
Second fixed mechanism, first fixed mechanism and the second fixed mechanism are fixedly installed on respectively in the rack, further include using
In the vision-based detection mechanism of positioning LED chip, the ejecting mechanism for ejecting LED chip, driving the first fixed mechanism fortune
Dynamic the first driving mechanism and the second driving mechanism for driving the ejecting mechanism movement, the brilliant ring on first fixed mechanism
Component is located at the top of the bracket on second fixed mechanism, and the ejecting mechanism includes ejection piece, and the ejection piece is located at
The top of the crystalline substance ring assemblies.
It further, further include feed rail and discharging track, the feed rail and discharging track are respectively arranged at institute
State the opposite two sides of the second fixed mechanism.
It further, further include brilliant ring feeding machanism, the crystalline substance ring feeding machanism includes storing component, reload component and drive
The third driving assembly of the dynamic component movement that reloads, the storing component is equipped at least two brilliant ring assemblies, described to change
Material component includes the loading plate for carrying brilliant ring assemblies.
Further, the brilliant ring assemblies include brilliant ring and the fixture for fixed brilliant ring, and the fixture is equipped with protrusion
Portion, first fixed mechanism include the first fixing piece, and first fixing piece is equipped with the card matched with the lug boss
Slot.
Further, the fixture is equipped with location hole, and the component that reloads further includes locating piece and the driving positioning
The fourth drive member that part moves up and down, the locating piece are correspondingly arranged with the location hole.
Further, the storing component includes the flexible gas of fixed frame, the first telescopic cylinder, the second telescopic cylinder and third
Cylinder, the crystalline substance ring assemblies are successively overlapped on the fixed frame, and first telescopic cylinder is corresponding with the second telescopic cylinder
Setting, and first telescopic cylinder and the second telescopic cylinder support undermost brilliant ring assemblies respectively, the third are stretched gas
Cylinder supports undermost upper one layer of brilliant ring assemblies, and the loading plate is located at the lower section of the brilliant ring assemblies.
Further, the storing component further includes the first locating part and the second locating part, first locating part and
Two locating parts are fixedly installed on respectively on the fixed frame, and the first locating part and the second locating part are located at the brilliant ring group
The opposite two sides of part.
It further, further include brilliant ring recovering mechanism, the crystalline substance ring recovering mechanism is arranged close to the brilliant ring feeding machanism.
The beneficial effects of the present invention are: it can detecte and record the die bond position on bracket by vision-based detection mechanism,
Then instruct the first driving mechanism that brilliant ring assemblies are moved to the top of bracket, and it is solid to be directed at the LED chip on brilliant ring assemblies
Brilliant position, the second driving mechanism can drive ejection piece to move to the surface of LED chip, and LED chip ejection is transferred to
On the die bond position of bracket, entire die bond crosses engineering support without movement, shifts without by LED chip taking-up, Ke Yi great
It is big to improve die bond efficiency and die bond quality；LED chip is drawn without suction nozzle, the operation of small size LED chip can be met, can avoid
Suction nozzle hole is too small, which to cause die bond unstable, or suction nozzle hole is excessive touches the neighbouring good LED chip of die bond.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the crystal solidifying apparatus of the embodiment of the present invention one；
Fig. 2 is another overall structure diagram of the crystal solidifying apparatus of the embodiment of the present invention one；
Fig. 3 is the partial structure diagram of the crystal solidifying apparatus of the embodiment of the present invention one；
Fig. 4 is the structural schematic diagram of the fixture of the crystal solidifying apparatus of the embodiment of the present invention one；
Fig. 5 is the structural schematic diagram of the first fixed mechanism of the crystal solidifying apparatus of the embodiment of the present invention one.
Label declaration:
1, rack；2, the first fixed mechanism；21, the first fixing piece；211, card slot；22, the first mounting plate；3, second is fixed
Mechanism；4, vision-based detection mechanism；5, ejecting mechanism；51, the second mounting plate；
6, feed rail；7, discharging track；8, storing component；81, fixed frame；82, the first telescopic cylinder；83, second stretches
Contracting cylinder；84, third telescopic cylinder；85, the first locating part；86, the second locating part；9, reload component；91, loading plate；10, it presss from both sides
Tool；101, lug boss；102, location hole；
11, brilliant ring recovering mechanism.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and cooperate attached
Figure is explained.
The most critical design of the present invention is: the brilliant ring assemblies on the first fixed mechanism are located at the branch on the second fixed mechanism
The top of frame, ejection piece are located at the top of the brilliant ring assemblies, and entire die bond crosses engineering support without movement, without by LED core
Piece taking-up is shifted, and die bond efficiency and die bond quality can be greatly improved.
Please refer to Fig. 1 to Fig. 5, a kind of crystal solidifying apparatus, including rack 1, for the first fixed mechanism 2 of fixed brilliant ring assemblies
With for support bracket fastened second fixed mechanism 3, first fixed mechanism 2 and the second fixed mechanism 3 are fixedly installed on respectively
In the rack 1, further include for positioning the vision-based detection mechanism 4 of LED chip, the ejecting mechanism 5 for ejecting LED chip,
The first driving mechanism for driving first fixed mechanism 2 to move and the second driving mechanism for driving the ejecting mechanism 5 to move,
Brilliant ring assemblies on first fixed mechanism 2 are located at the top of the bracket on second fixed mechanism 3, the ejecting mechanism
5 include ejection piece, and the ejection piece is located at the top of the brilliant ring assemblies.
As can be seen from the above description, the beneficial effects of the present invention are: it can detecte by vision-based detection mechanism and record branch
Die bond position on frame, then instructs the first driving mechanism that brilliant ring assemblies are moved to the top of bracket, and makes on brilliant ring assemblies
LED chip be directed at die bond position, the second driving mechanism can drive ejection piece to move to the surface of LED chip, and by LED
Chip ejection be transferred on the die bond position of bracket, entire die bond cross engineering support without movement, without by LED chip take out into
Row transfer, can greatly improve die bond efficiency and die bond quality；LED chip is drawn without suction nozzle, small size LED chip can be met
Operation, can avoid that suction nozzle hole is too small to cause die bond unstable or suction nozzle hole is excessive touches the neighbouring good LED chip of die bond.
First driving mechanism can drive the first fixed mechanism to move upwards in tri- sides XYZ, and the second driving mechanism can also drive top
Mechanism is moved upwards in tri- sides XYZ out, so as to the best die bond position of determination.
It further, further include feed rail 6 and discharging track 7, the feed rail 6 and discharging track 7 are respectively set
In the opposite two sides of second fixed mechanism 3.
Seen from the above description, the bracket before die bond and after die bond can be transported by feed rail and discharging track
It is defeated.
It further, further include brilliant ring feeding machanism, the crystalline substance ring feeding machanism includes storing component 8, reload 9 and of component
The third driving assembly of the component 9 that reloads described in driving movement, the storing component 8 are equipped at least two brilliant ring assemblies, institute
Stating the component 9 that reloads includes the loading plate 91 for carrying brilliant ring assemblies.
Seen from the above description, after the completion of a brilliant ring assemblies die bond, storing component can be shifted by the component that reloads
On brilliant ring assemblies, to achieve the purpose that replace brilliant ring.
Further, the brilliant ring assemblies include brilliant ring and the fixture 10 for fixed brilliant ring, and the fixture 10 is equipped with
Lug boss 101, first fixed mechanism 2 include the first fixing piece 21, and first fixing piece 21 is equipped with and the protrusion
The card slot 211 that portion 101 matches.
Seen from the above description, it is cooperated by the lug boss on the card slot and fixture on the first fixing piece, it can be very
Brilliant ring assemblies are fixed and are shifted well, the number of card slot and lug boss can be two, to improve fixed effect.
Further, the fixture 10 is equipped with location hole 102, and the component 9 that reloads further includes locating piece and driving institute
The fourth drive member of locating piece up and down motion is stated, the locating piece is correspondingly arranged with the location hole 102.
Seen from the above description, by the mutual cooperation of location hole and locating piece, it can prevent the first fixing piece from shifting
Brilliant ring assemblies are displaced during brilliant ring assemblies.
Further, the storing component 8 includes fixed frame 81, the first telescopic cylinder 82, the second telescopic cylinder 83 and the
Three telescopic cylinders 84, the crystalline substance ring assemblies are successively overlapped on the fixed frame 81, first telescopic cylinder 82 and the
Two telescopic cylinders 83 are correspondingly arranged, and first telescopic cylinder 82 and the second telescopic cylinder 83 support undermost brilliant ring respectively
Component, the third telescopic cylinder 84 support undermost upper one layer of brilliant ring assemblies, and the loading plate 91 is located at the brilliant ring
The lower section of component.
It seen from the above description, can be by undermost crystalline substance by the cooperation of the first telescopic cylinder and the second telescopic cylinder
Ring assemblies are placed on loading plate, and by third telescopic cylinder support effect can guarantee once on loading plate only place
One brilliant ring assemblies.
Further, the storing component 8 further includes the first locating part 85 and the second locating part 86, first locating part
85 and second locating part 86 be fixedly installed on the fixed frame 81 respectively, and the first locating part 85 and the second locating part 86 difference
The two sides opposite positioned at the brilliant ring assemblies.
Seen from the above description, the neat heap of brilliant ring assemblies can be made by the cooperation of the first locating part and the second locating part
It is folded.
It further, further include brilliant ring recovering mechanism 11, the crystalline substance ring recovering mechanism 11 is close to the brilliant ring feeding machanism
Setting.
Seen from the above description, brilliant ring recovering mechanism is arranged by smectic ring feeding machanism, carries out convenient for the first fixed mechanism
It reloads.
Please refer to Fig. 1 to Fig. 5, the embodiment of the present invention one are as follows:
A kind of crystal solidifying apparatus, as depicted in figs. 1 and 2, including rack 1, for the first fixed mechanism 2 of fixed brilliant ring assemblies
With for support bracket fastened second fixed mechanism 3, first fixed mechanism 2 and the second fixed mechanism 3 are fixedly installed on respectively
In the rack 1, the bracket of the present embodiment is pcb board.The crystal solidifying apparatus further includes examining for positioning the vision of LED chip
Survey the first driving mechanism that mechanism 4, the ejecting mechanism 5 for ejecting LED chip, driving first fixed mechanism 2 move and
The second driving mechanism for driving the ejecting mechanism 5 to move, the vision-based detection mechanism 4, ejecting mechanism 5, the first driving mechanism
It is also fixedly installed in the rack 1 with the second driving mechanism, can detecte the die bond on bracket by vision-based detection mechanism 4
Position, thus the movement of guidance the first driving mechanism and the second driving mechanism.First driving mechanism of the present embodiment can drive
First fixed mechanism 2 is moved upwards in tri- sides XYZ, and the first fixed mechanism 2 is fixed by the first mounting plate 22, and second drives
Motivation structure can drive ejecting mechanism 5 to move upwards in tri- sides XYZ, and ejecting mechanism 5 is fixed by the second mounting plate 51.
When die bond, the brilliant ring assemblies on first fixed mechanism 2 are located at the top of the bracket on second fixed mechanism 3, described
Ejecting mechanism 5 includes ejection piece (not shown), and the ejection piece is located at the top of the brilliant ring assemblies, can be with by ejection piece
Directly the LED chip on brilliant ring assemblies is fixed on the die bond position of bracket.
The crystal solidifying apparatus further includes feed rail 6 and discharging track 7, and the feed rail 6 and discharging track 7 are set respectively
The opposite two sides of second fixed mechanism 3 are placed in, bracket enters from feed rail 6, then carries out on the second fixed mechanism 3
It is fixed, specifically, bracket can be fixed by way of vacuum suction, it is defeated from discharging track 7 after the completion of die bond
Out.
As shown in figure 3, the crystal solidifying apparatus further includes brilliant ring feeding machanism, the crystalline substance ring feeding machanism includes storing component
8, reload component 9 and driving described in reload component 9 movement third driving assembly, the storing component 8 be equipped at least two
Brilliant ring assemblies, the component 9 that reloads includes the loading plate 91 for carrying brilliant ring assemblies.The storing component 8 includes fixing
Frame 81, the first telescopic cylinder 82, the second telescopic cylinder 83 and third telescopic cylinder 84, it is described crystalline substance ring assemblies successively overlap in
On the fixed frame 81, first telescopic cylinder 82 is correspondingly arranged with the second telescopic cylinder 83, and first telescopic cylinder
82 and second telescopic cylinder 83 support undermost brilliant ring assemblies respectively, the third telescopic cylinder 84 supports undermost upper one
The brilliant ring assemblies of layer, the loading plate 91 is located at the lower section of the brilliant ring assemblies when reloading.It preferably, can be in the first flexible gas
An extension is respectively set on cylinder 82 and the second telescopic cylinder 83, undermost crystalline substance ring assemblies are placed on the extension.
The storing component 8 further includes the first locating part 85 and the second locating part 86, first locating part 85 and the second locating part 86
It is fixedly installed on the fixed frame 81 respectively, and the first locating part 85 and the second locating part 86 are located at the brilliant ring assemblies
Opposite two sides.It further include brilliant ring recovering mechanism 11 in the present embodiment, the crystalline substance ring recovering mechanism 11 is fed close to the brilliant ring
Mechanism setting.
The crystalline substance ring assemblies include brilliant ring and the fixture 10 for fixed brilliant ring, as shown in figure 4, the fixture 10 is equipped with
Lug boss 101, as shown in figure 5, first fixed mechanism 2 includes the first fixing piece 21, first fixing piece 21 is equipped with
The card slot 211 matched with the lug boss 101.In the present embodiment, the number of lug boss 101 and card slot 211 is two.Institute
It states and is additionally provided with location hole 102 on fixture 10, the component 9 that reloads further includes locating piece and the locating piece is driven to move up and down
Fourth drive member, the locating piece are correspondingly arranged with the location hole 102.In the present embodiment, locating piece is positioning pin, 4 wheel driven
Moving part can be telescopic cylinder.
The course of work of the crystal solidifying apparatus of the present embodiment are as follows: firstly, bracket enters from feed rail 6, it is then solid second
Determine to be fixed in mechanism 3, vision-based detection mechanism 4 detects the die bond position determined on bracket, then passes through the first driving mechanism
It drives brilliant ring assemblies to move to the top of bracket, and the LED chip on brilliant ring assemblies is made to be directed at die bond position, by LED chip pair
The second driving mechanism driving ejection piece moves to the surface of LED chip behind quasi- die bond position, then drives ejection piece ejection, will
LED chip is fixed on die bond position.After die bond is completed in all die bond positions on bracket, the second fixed mechanism 3 unclamps branch
Frame is exported bracket by discharging track 7.After LED chip all on brilliant ring assemblies completes die bond, the first driving mechanism band
Dynamic first fixed mechanism 2 moves at brilliant ring recovering mechanism 11, and the brilliant ring assemblies after the completion of die bond are recycled, and then first
Driving mechanism drives the first fixed mechanism 2 to move at the component 9 that reloads, and is placed with one on the loading plate 91 for the component 9 that reloads at this time
A crystalline substance ring assemblies, the locating piece for the component 9 that reloads are located in location hole 102, and the first driving mechanism drives the movement of the first fixing piece 21,
So that the lug boss 101 that card slot 211 is stuck in completely on fixture 10 is to be fixed brilliant ring assemblies, then locating piece bounces back,
The top that first driving mechanism drives brilliant ring assemblies to move to bracket carries out die bond next time.When the brilliant ring assemblies on loading plate 91
After being carried away, third driving assembly drive loading plate 91 moves to the lower section of the fixed frame 81 of storing component 8, and then first is flexible
Cylinder 82 and the second telescopic cylinder 83 unclamp undermost brilliant ring assemblies, and undermost brilliant ring assemblies is made to drop down onto loading plate 91
Top, last third driving assembly drive 91 return of loading plate, and waiting is reloaded next time.
In conclusion a kind of crystal solidifying apparatus provided by the invention, entire die bond process can automate progress, not have to LED
Chip taking-up is shifted, and die bond efficiency and die bond quality can be greatly improved；The operation of small size LED chip can be met, Gu
Brilliant process is stablized.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, similarly include
In scope of patent protection of the invention.
Claims (8)
1. a kind of crystal solidifying apparatus, including rack, for the first fixed mechanism of fixed brilliant ring assemblies and for support bracket fastened the
Two fixed mechanisms, first fixed mechanism and the second fixed mechanism are fixedly installed on respectively in the rack, which is characterized in that
It further include for positioning the vision-based detection mechanism of LED chip, the ejecting mechanism for ejecting LED chip, driving described first to consolidate
Determine the first driving mechanism of mechanism kinematic and drives the second driving mechanism of the ejecting mechanism movement, first fixed mechanism
On brilliant ring assemblies be located at the top of the bracket on second fixed mechanism, the ejecting mechanism includes ejection piece, the top
Part is located at the top of the brilliant ring assemblies out.
2. crystal solidifying apparatus according to claim 1, which is characterized in that further include feed rail and discharging track, it is described into
Material track and discharging track are respectively arranged at the opposite two sides of second fixed mechanism.
3. crystal solidifying apparatus according to claim 1, which is characterized in that it further include brilliant ring feeding machanism, the crystalline substance ring feed
Mechanism includes storing component, reload the third driving assembly of component movement of reloading described in component and driving, on the storing component
Equipped at least two brilliant ring assemblies, the component that reloads includes the loading plate for carrying brilliant ring assemblies.
4. crystal solidifying apparatus according to claim 3, which is characterized in that the crystalline substance ring assemblies include brilliant ring and are used for fixed brilliant
The fixture of ring, the fixture are equipped with lug boss, and first fixed mechanism includes the first fixing piece, on first fixing piece
Equipped with the card slot matched with the lug boss.
5. crystal solidifying apparatus according to claim 4, which is characterized in that the fixture is equipped with location hole, the group of reloading
Part further includes locating piece and the fourth drive member for driving the locating piece up and down motion, and the locating piece is corresponding with the location hole
Setting.
6. crystal solidifying apparatus according to claim 3, which is characterized in that the storing component includes fixed frame, first flexible
Cylinder, the second telescopic cylinder and third telescopic cylinder, the crystalline substance ring assemblies are successively overlapped on the fixed frame, and described the
One telescopic cylinder is correspondingly arranged with the second telescopic cylinder, and first telescopic cylinder and the second telescopic cylinder support respectively it is most lower
The brilliant ring assemblies of layer, the third telescopic cylinder support undermost upper one layer of brilliant ring assemblies, and the loading plate is located at described
The lower section of brilliant ring assemblies.
7. crystal solidifying apparatus according to claim 6, which is characterized in that the storing component further includes the first locating part and
Two locating parts, first locating part and the second locating part are fixedly installed on respectively on the fixed frame, and the first locating part and
Second locating part is located at the opposite two sides of the brilliant ring assemblies.
8. crystal solidifying apparatus according to claim 3, which is characterized in that further include brilliant ring recovering mechanism, the crystalline substance loopback is received
Mechanism is arranged close to the brilliant ring feeding machanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910573763.8A CN110148578A (en) | 2019-06-28 | 2019-06-28 | Crystal solidifying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910573763.8A CN110148578A (en) | 2019-06-28 | 2019-06-28 | Crystal solidifying apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110148578A true CN110148578A (en) | 2019-08-20 |
Family
ID=67596770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910573763.8A Pending CN110148578A (en) | 2019-06-28 | 2019-06-28 | Crystal solidifying apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110148578A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111443272A (en) * | 2020-05-12 | 2020-07-24 | 中南大学 | Laser bar testing method and device |
| CN112436084A (en) * | 2020-11-29 | 2021-03-02 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
| CN112928052A (en) * | 2021-02-04 | 2021-06-08 | 深圳新益昌科技股份有限公司 | Die bonder |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016150080A1 (en) * | 2015-03-20 | 2016-09-29 | 北京中电科电子装备有限公司 | Flip chip bonding device |
| CN107275447A (en) * | 2017-07-28 | 2017-10-20 | 先进光电器材（深圳）有限公司 | A kind of grip device in LED bonders |
| CN108615804A (en) * | 2018-07-12 | 2018-10-02 | 中山市新益昌自动化设备有限公司 | The full-automatic bonders of mini-LED and its die-bonding method |
| CN208256722U (en) * | 2018-05-25 | 2018-12-18 | 中山市新益昌自动化设备有限公司 | A kind of LED crystal solidifying apparatus |
| CN109786311A (en) * | 2019-01-28 | 2019-05-21 | 深圳市新益昌自动化设备有限公司 | A kind of mini-LED high speed bonder and die-bonding method |
| CN209804625U (en) * | 2019-06-28 | 2019-12-17 | 先进光电器材（深圳）有限公司 | Die bonder |
-
2019
- 2019-06-28 CN CN201910573763.8A patent/CN110148578A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016150080A1 (en) * | 2015-03-20 | 2016-09-29 | 北京中电科电子装备有限公司 | Flip chip bonding device |
| CN107275447A (en) * | 2017-07-28 | 2017-10-20 | 先进光电器材（深圳）有限公司 | A kind of grip device in LED bonders |
| CN208256722U (en) * | 2018-05-25 | 2018-12-18 | 中山市新益昌自动化设备有限公司 | A kind of LED crystal solidifying apparatus |
| CN108615804A (en) * | 2018-07-12 | 2018-10-02 | 中山市新益昌自动化设备有限公司 | The full-automatic bonders of mini-LED and its die-bonding method |
| CN109786311A (en) * | 2019-01-28 | 2019-05-21 | 深圳市新益昌自动化设备有限公司 | A kind of mini-LED high speed bonder and die-bonding method |
| CN209804625U (en) * | 2019-06-28 | 2019-12-17 | 先进光电器材（深圳）有限公司 | Die bonder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111443272A (en) * | 2020-05-12 | 2020-07-24 | 中南大学 | Laser bar testing method and device |
| CN112436084A (en) * | 2020-11-29 | 2021-03-02 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
| CN112928052A (en) * | 2021-02-04 | 2021-06-08 | 深圳新益昌科技股份有限公司 | Die bonder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110148578A (en) | Crystal solidifying apparatus | |
| US7077262B2 (en) | Device and method for conveying and holding plate-like member | |
| KR100921231B1 (en) | Electronic Component Mounting Apparatus and Electronic Component Mounting Method | |
| CN109786311B (en) | Mini-LED high-speed die bonder and die bonding method | |
| JPH08206825A (en) | Device for mounting solder ball and method therefor | |
| CN215248106U (en) | Automatic chip testing equipment | |
| JPWO2007026433A1 (en) | Work handling device | |
| CN108615804A (en) | The full-automatic bonders of mini-LED and its die-bonding method | |
| CN211350607U (en) | MiniLED double-head die bonder | |
| CN107248501A (en) | A kind of relay-type quickly takes piece, loading device and its uses its loader | |
| CN205248235U (en) | IC chip bonding machine | |
| JP2013145872A (en) | Film peeling system and method for dfsr | |
| CN108630116A (en) | Full-automatic electronic paper make-up machine | |
| CN102340981A (en) | Mounting apparatus | |
| KR101511294B1 (en) | Apparatus and method for fabricating semiconductor chip package with film attached on | |
| CN208368542U (en) | The full-automatic bonder of mini-LED | |
| CN113183451A (en) | Protective film laminating and check out test set of product | |
| CN106455473B (en) | Tray conveying device and mounting device | |
| CN117096066A (en) | Full-automatic coil stock high-speed high-precision eutectic and dispensing switchable equipment | |
| EP3062339B1 (en) | Substrate working apparatus | |
| CN208856021U (en) | The automatic reading code device for labeling of SMT charging tray | |
| CN102340980A (en) | Mounting apparatus | |
| CN103299725B (en) | The mode and device of fluid application in the paster cycle | |
| CN212263741U (en) | Transfer device and die bonder | |
| TWM611245U (en) | Semiconductor annular die bonding all-in-one machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |