CN112436084A - LED high-speed die bonder and automatic feeding and discharging device thereof - Google Patents
LED high-speed die bonder and automatic feeding and discharging device thereof Download PDFInfo
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- CN112436084A CN112436084A CN202011367089.7A CN202011367089A CN112436084A CN 112436084 A CN112436084 A CN 112436084A CN 202011367089 A CN202011367089 A CN 202011367089A CN 112436084 A CN112436084 A CN 112436084A
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- 238000007599 discharging Methods 0.000 title abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 92
- 238000002347 injection Methods 0.000 claims abstract description 90
- 239000007924 injection Substances 0.000 claims abstract description 90
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims description 69
- 230000001070 adhesive effect Effects 0.000 claims description 69
- 230000009471 action Effects 0.000 claims description 21
- 239000013078 crystal Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 34
- 230000008569 process Effects 0.000 abstract description 24
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000033001 locomotion Effects 0.000 description 11
- 239000007787 solid Substances 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 229920000742 Cotton Polymers 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000010009 beating Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000010837 adhesive waste Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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Abstract
The invention relates to the technical field of die bonding equipment, in particular to LED high-speed die bonding equipment and an automatic feeding and discharging device thereof, wherein the LED high-speed die bonding equipment comprises a wafer control table and a clamp control table; the wafer control console is used for clamping and expanding the wafer ring; the upper end of the wafer expanding ring is wrapped with a blue film; a chip is arranged on the blue film; the chips are uniformly distributed at the upper end of the blue film; according to the LED high-speed die bonding equipment, one motor drives the corresponding screw rod slider pair to move and is matched with the electric push rod driving the material injection unit to move, so that the dispensing process is completed, the other motor drives the corresponding screw rod slider pair to move and is matched with the electric push rod driving the material injection unit to move, so that the core placing process is completed, a plurality of chips can be fixed simultaneously, the effect of simultaneously performing a plurality of die bonding is realized, the die bonding efficiency of an LED is improved, and the production efficiency of the LED is improved.
Description
Technical Field
The invention relates to the technical field of die bonding equipment, in particular to LED high-speed die bonding equipment and an automatic loading and unloading device thereof.
Background
The light emitting diode is abbreviated as LED; is prepared from gallium, As, P, N and other compounds; when the electrons and the holes are combined, visible light can be radiated, so that the light-emitting diode can be manufactured; the LED lamp is used as an indicator light in circuits and instruments or forms character or number display; die bonding or Die bonding; die bonding, namely bonding the wafer on a designated area of the bracket through an adhesive to form a thermal path or an electric path and provide conditions for subsequent routing connection; the existing LED is subjected to die bonding through a die bonding machine; the LED die bonder is a special die bonder for LED products, is controlled by a computer and is provided with a CCD image sensing system, a CCD system scans the LED die bonder to determine a correct path, a set programming program is input, and a button is pressed easily, so that the whole working process can be realized: firstly, fixing a product to be subjected to die bonding on a jig, dispensing red glue, sucking the LED through a suction nozzle, and fixing the LED on the product; the existing die bonding is to bond one chip first and then bond the other chip, so that the problem of low LED preparation efficiency is caused, and the yield of the LED is influenced.
The prior art also discloses some technical schemes related to an LED high-speed die bonder and an automatic loading and unloading device thereof, for example, a patent with application number CN201921569239.5 discloses an LED high-speed die bonder and an automatic loading and unloading device thereof, which includes a rotary die ring picking and placing mechanism suspended on an upright post of the LED high-speed die bonder and a feeding mechanism disposed on a platform of the LED high-speed die bonder, wherein the rotary die ring picking and placing mechanism can place a die ring on a wafer worktable of the LED high-speed die bonder from a lifting component of the feeding mechanism or can recycle a used die ring from the wafer worktable of the LED high-speed die bonder to a recycling box of the feeding mechanism through lifting motion and rotating motion, and the feeding mechanism is used for providing the rotary die ring picking and placing mechanism with the die ring and recycling and storing the used die ring; the technical scheme improves the automation degree of the LED high-speed die bonding equipment and improves the productivity; however, the technical scheme can only carry out die bonding on a single chip, so that the production efficiency of the technical scheme is low, and the limitation of the scheme is further caused.
In view of this, in order to overcome the above technical problems, the invention provides an LED high-speed die bonding apparatus and an automatic loading and unloading device thereof, which adopt a special die bonding device to solve the above technical problems.
Disclosure of Invention
In order to make up for the defects of the prior art, the LED high-speed die bonder and the automatic feeding and discharging device thereof provided by the invention have the advantages that one motor drives the corresponding screw rod slide block pair to move and match with the electric push rod driving the material injection unit to move, so that the dispensing process is finished, the other motor drives the corresponding screw rod slide block pair to move and match with the electric push rod driving the material injection unit to move, so that the core placing process is finished, a plurality of chips can be fixed simultaneously, a plurality of die bonding effects are realized simultaneously, the die bonding efficiency of an LED is improved, and the production efficiency of the LED is improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to LED high-speed die bonding equipment which comprises a wafer control table and a clamp control table; the wafer control console is used for clamping and expanding the wafer ring; the upper end of the wafer expanding ring is wrapped with a blue film; a chip is arranged on the blue film; the chips are uniformly distributed at the upper end of the blue film; the fixture control console is used for clamping the bracket; the bracket is provided with a core placing table; the LED high-speed die bonder further comprises an annular frame, a material injection unit, a dispensing disc and a controller; two screw rod sliding block pairs are arranged on the inner wall of the annular frame; the screw rod sliding block pair comprises a screw rod, a sliding rod and a sliding plate; two first motors are mounted on the outer wall of the annular frame; the first motor is used for driving the corresponding screw rod sliding block pair to operate; the running tracks of the two sliding plates are mutually vertical; a first electric push rod is fixedly connected below one of the sliding plates; the end part of the first electric push rod is fixedly connected with a connecting plate; the side of the connecting plate is fixedly connected with a material injection unit; the material injection unit comprises a top plate, a connecting rod, an air cylinder, a push plate and a material injection plate; the connecting plate is fixedly connected with the top plate; the lower end of the top plate is connected with a material injection plate through a connecting rod; the upper end of the material injection plate is provided with a groove; the groove is connected with a push plate in a sliding way; an air cylinder is arranged between the push plate and the top plate; one end of the cylinder is connected with the top plate, and the other end of the cylinder is connected with the upper end of the push plate; a through hole is formed in the bottom of the groove; the through holes are uniformly distributed at the bottom of the groove, the distance between every two adjacent through holes is the same as the distance between every two adjacent chip placing platforms, and the distance between every two adjacent through holes is the same as the distance between every two adjacent chips; the orifice of the through hole is fixedly connected with a suction nozzle; a second electric push rod is fixedly connected below the other sliding plate; the end part of the second electric push rod is fixedly connected with a material injection unit; a dispensing disc is fixedly connected inside the annular frame; a rectangular groove is formed in the upper end of the dispensing disc; the rectangular groove is internally provided with an adhesive; one of the sliding plates can drive the material injection unit to move right above the dispensing disc; the clamp control table is positioned on the inner side of the annular frame; the two material injection units are positioned right above the clamp control console under the action of the corresponding sliding plates; the through holes on the two material injection units are in one-to-one correspondence with the positions of the core placing tables under the action of the corresponding sliding plates; the wafer control table is positioned on the inner side of the annular frame; the other sliding plate can drive the corresponding material injection unit to be positioned right above the wafer control table; the through holes on the other material injection unit correspond to the positions of the chips one by one under the action of the corresponding sliding plates; the controller is used for controlling the LED high-speed die bonding equipment to automatically operate;
when the LED die is in work, the conventional die bonding is performed on one chip firstly and then on the other chip, so that the problem of low LED preparation efficiency is caused, and the yield of the LED is influenced; therefore, in the invention, a worker starts a controller to control one of the motors to rotate, the motor drives the corresponding screw rod sliding block pair to move, so that one of the material injection units is driven by the screw rod sliding block pair to move to the position right above the dispensing disc, the electric push rod one drives the lower end of the material injection plate to be close to the upper surface of the adhesive, the controller controls the air cylinder to drive the push plate to slide upwards along the groove so as to suck the adhesive into the groove, the electric push rod one drives the material injection plate to be far away from the dispensing disc, the screw rod sliding block pair one drives the material injection unit to move to the position right above the clamp control table, and simultaneously ensures that the suction nozzles and the core placing tables are in one-to-one correspondence, the electric push rod one drives the suction nozzles to be close to the core placing tables, the push plate slides downwards along the groove so that the adhesive is extruded on the core placing tables along the, one of the screw rod sliding block pairs drives the material injection unit to be far away from the clamp control console; the controller controls another motor to rotate, the other motor drives another material injection unit to move right above the wafer control platform through the screw rod sliding block pair, meanwhile, the through hole on the other material injection unit is ensured to be in one-to-one correspondence with the chip, the second electric push rod drives the suction nozzle to be close to and contact with the attached chip, the air cylinder drives the push plate to slide upwards along the groove and move upwards through the push plate, so that the chip is adsorbed on the suction nozzle, the second electric push rod drives the suction nozzle to be away from the wafer control platform, the other screw rod sliding block pair drives the material injection unit to move right above the clamp control platform, meanwhile, the suction nozzle is ensured to be in one-to-one correspondence with the core placing platform, the second electric push rod drives the suction nozzle to be close to the core placing platform, the air cylinder drives the push rod to slide downwards along the groove, under the action of gravity, the chip is separated from the suction nozzle, thereby completing the die bonding process; according to the invention, one motor drives the corresponding screw rod sliding block pair to move and is matched with the electric push rod driving the material injection unit to move, so that the dispensing process is completed, and the other motor drives the corresponding screw rod sliding block pair to move and is matched with the electric push rod driving the material injection unit to move, so that the core placing process is completed, and the LED chip fixing device can be used for fixing a plurality of chips simultaneously, so that the effect of simultaneously carrying out a plurality of crystal fixing is realized, the crystal fixing efficiency of an LED is further improved, and the production efficiency of the LED is improved.
Preferably, the two groove walls of the rectangular groove are connected with the rotating rod in a twisting manner through a torsion spring; the outer wall of the rotating rod is fixedly connected with a blade; the blades are uniformly distributed on the outer wall of the rotating rod; a thread rope is wound in the middle of the rotating rod; the rope is in a tightened state under the action of the torsion spring, and the other end of the rope is connected with one side wall of the material injection plate; when the adhesive dispensing device works, in the process that one motor drives the material injection plate to be far away from the adhesive dispensing disc, the material injection plate can pull the cord to move, so that the rotating rod rotates along the two groove walls of the rectangular groove under the action of the cord, the rotating rod rotates to drive the blades to rotate, and accordingly adhesives in the rectangular groove are stirred through the blades, in the process that the motor drives the material injection plate to be close to the adhesive dispensing disc, the rotating rod rotates under the action of the torsion spring, the cord is tightened by the rotating rod, and meanwhile, the rotating rod drives the blades to reversely stir the adhesives in the rectangular groove; according to the invention, the one-number motor drives the material injection plate to move and the rotating rod drives the blades to rotate and match, so that the effect of uniformly mixing the adhesive in the dispensing disc is achieved, the consistency of the viscosity of the adhesive adsorbed by each suction nozzle is ensured, and the effect of adhering the chip on the chip placing table is ensured.
Preferably, two end faces of the blade are fixedly connected with fin plates; the fin plates are randomly distributed on two end faces of the blade, the cross section of each fin plate is triangular, and the two end faces of each fin plate are perpendicular to the two end faces of the blade; the during operation, the blade removes the in-process and can drive the fin motion to reached the effect of shunting the adhesive through the fin, simultaneously because of the fin random distribution at the both ends face of blade, guaranteed that the adhesive shunts the direction difference around the fin, and then increased the particle dispersion degree of adhesive in the rectangular channel, and then improved the practical application effect of adhesive, simultaneously through setting the cross sectional shape of fin to triangle-shaped, guaranteed the intensity of fin, and then improved the life and the practical application effect of fin.
Preferably, the outer wall of the rotating rod is hinged with a knocking rod; the end part of the knocking rod can be in contact with the bottom of the rectangular groove, and the diameter of the outer wall of the knocking rod is increased along with the distance from the rotating rod; during operation, electric putter drives and annotates the flitch and keep away from some adhesive disk and remove the in-process, it receives the cotton rope effect and rotates to change the stick, it can drive and beat the stick and remove to change the stick rotation, thereby strike through the tank bottom of beating the rectangular channel with the stick, make some adhesive disk receive and produce vibrations after striking, some adhesive disk receive vibrations after transmit the shaking force to changeing the stick, at last again through cotton rope transmission to annotating the flitch by changeing the stick, the rethread annotates the flitch with shaking force transmission to suction nozzle, thereby make the adhesive of suction nozzle surface adhesion receive under the vibrations effect and drop, the adhesive that drops can fall in the rectangular channel, thereby avoided the adhesive to scatter outside the rectangular channel, cause the extravagant condition of adhesive, and then practiced thrift the cost of producing LED.
Preferably, the outer wall of the knocking rod is fixedly connected with an elastic rope; the elastic ropes are randomly distributed on the outer wall of the knocking rod, and the other end of each elastic rope is fixedly connected with the knocking block; the cross section of the knocking block is semicircular; the during operation, it can drive the stretch cord and remove to strike excellent removal, the stretch cord can drive the piece motion of beating, thereby it strikes to strike the stick to drive the piece through the stretch cord, thereby make to strike the stick and receive the striking back, the dynamics that the stick strikeed the rectangular channel tank bottom has been increased, and then the vibrations effect of commentaries on classics stick has been improved, the dynamics of vibrations on the suction nozzle has been improved, make the adhesive of suction nozzle surface adhesion drop sooner, prevent that the adhesive of suction nozzle surface adhesion from coming too late to drop just the condition of skew rectangular channel top, and then the practical application effect of knocking the stick has been improved.
An automatic loading and unloading device is applied to the LED high-speed die bonding equipment and comprises a turntable and a second motor; the second motor is positioned on the inner side of the annular frame, and an output shaft of the second motor is connected with the turntable; the upper end of the rotary table is fixedly connected with a hydraulic cylinder; the hydraulic cylinders are uniformly distributed at the upper end of the turntable, and the end parts of the hydraulic cylinders are fixedly connected with the bottom of the clamp control console; during operation, the controller can drive the carousel and move, the carousel can drive one of them pneumatic cylinder and move to operating position, one of them pneumatic cylinder extension, thereby drive corresponding anchor clamps control cabinet upward movement to operating position, treat solid brilliant completion back, one of them pneumatic cylinder shortens, thereby drive corresponding anchor clamps control cabinet downward movement, the carousel drives another anchor clamps control cabinet again and moves to operating position, support on one of them anchor clamps control cabinet is at solid brilliant in-process, the staff can change the support on other anchor clamps control cabinets, thereby need not stop LED solid brilliant equipment wholly, the steady operation of solid brilliant has been guaranteed, LED's solid brilliant efficiency has been improved, and then LED's production efficiency is improved.
The invention has the following beneficial effects:
1. according to the LED high-speed die bonding equipment, one motor drives the corresponding screw rod slider pair to move and is matched with the electric push rod driving the material injection unit to move, so that the dispensing process is completed, the other motor drives the corresponding screw rod slider pair to move and is matched with the electric push rod driving the material injection unit to move, so that the core placing process is completed, a plurality of chips can be fixed simultaneously, the effect of simultaneously performing a plurality of die bonding is realized, the die bonding efficiency of an LED is improved, and the production efficiency of the LED is improved.
2. According to the LED high-speed die bonder, the one-motor drives the material injection plate to move and the rotating rod drives the blades to rotate and match, so that the effect of uniformly mixing the adhesive in the dispensing disc is achieved, the consistency of the viscosity of the adhesive adsorbed by each suction nozzle is ensured, and the effect of adhering a chip on the chip placing table is ensured.
3. The blades of the LED high-speed die bonder can drive the fins to move in the moving process, so that the adhesive shunting effect is achieved through the fins, meanwhile, the fins are randomly distributed on two end faces of the blades, the adhesive shunting directions around the fins are guaranteed to be different, the particle dispersion degree of the adhesive in the rectangular groove is further increased, the actual application effect of the adhesive is further improved, meanwhile, the cross section of each fin is triangular, the strength of the fin is guaranteed, and the service life and the actual application effect of the fin are further improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a perspective view of an LED high speed die attach apparatus of the present invention;
FIG. 2 is an enlarged view at A in FIG. 1;
FIG. 3 is a top view of the LED high speed die attach apparatus of the present invention;
FIG. 4 is a cross-sectional view taken at B-B of FIG. 3;
FIG. 5 is an enlarged view at C of FIG. 4;
FIG. 6 is an enlarged view at D of FIG. 4;
FIG. 7 is a perspective view of a blade in the LED high-speed die bonding apparatus of the present invention;
FIG. 8 is an enlarged view at E in FIG. 7;
in the figure: the device comprises a wafer control platform 1, a wafer expanding ring 11, a blue film 12, a chip 13, a clamp control platform 2, a support 21, a core placing platform 22, a ring-shaped frame 3, a first motor 31, a material injecting unit 4, a top plate 41, a connecting rod 42, an air cylinder 43, a push plate 44, a material injecting plate 45, a groove 46, a through hole 47, a suction nozzle 48, a dispensing disc 5, a rectangular groove 51, a torsion spring 52, a rotating rod 53, a blade 54, a thread rope 55, a fin plate 56, a knocking rod 57, an elastic rope 58, a knocking block 59, a screw rod slide block pair 6, a screw 61, a slide rod 62, a slide plate 63, a first electric push rod 64, a connecting plate 65, a second electric push rod 66, a rotary table 7, a second motor 71 and a hydraulic.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 8, the LED high-speed die bonding apparatus according to the present invention includes a wafer console 1 and a clamp console 2; the wafer control platform 1 is used for clamping the wafer expanding ring 11; the upper end of the wafer expanding ring 11 is wrapped with a blue film 12; the blue film 12 is provided with a chip 13; the chips 13 are uniformly distributed at the upper end of the blue film 12; the fixture control table 2 is used for clamping the bracket 21; the support 21 is provided with a core placing table 22; the LED high-speed die bonder further comprises an annular frame 3, a material injection unit 4, a dispensing disc 5 and a controller; the inner wall of the annular frame 3 is provided with two screw rod sliding block pairs 6; the screw rod sliding block pair 6 comprises a screw rod 61, a sliding rod 62 and a sliding plate 63; two first motors 31 are mounted on the outer wall of the annular frame 3; the first motor 31 is used for driving the corresponding screw rod sliding block pair 6 to operate; the running tracks of the two sliding plates 63 are perpendicular to each other; a first electric push rod 64 is fixedly connected below one sliding plate 63; the end part of the first electric push rod 64 is fixedly connected with a connecting plate 65; the side of the connecting plate 65 is fixedly connected with a material injection unit 4; the material injection unit 4 comprises a top plate 41, a connecting rod 42, a cylinder 43, a push plate 44 and a material injection plate 45; the connecting plate 65 is fixedly connected with the top plate 41; the lower end of the top plate 41 is connected with a material injection plate 45 through a connecting rod 42; the upper end of the material injection plate 45 is provided with a groove 46; the groove 46 is connected with the push plate 44 in a sliding way; a cylinder 43 is arranged between the push plate 44 and the top plate 41; one end of the cylinder 43 is connected with the top plate 41, and the other end is connected with the upper end of the push plate 44; a through hole 47 is formed at the bottom of the groove 46; the through holes 47 are uniformly distributed at the bottom of the groove 46, the distance between the adjacent through holes 47 is the same as the distance between the adjacent core placing platforms 22, and the distance between the adjacent through holes 47 is the same as the distance between the adjacent chips 13; the orifice of the through hole 47 is fixedly connected with a suction nozzle 48; a second electric push rod 66 is fixedly connected below the other sliding plate 63; the end part of the second electric push rod 66 is fixedly connected with the material injection unit 4; a dispensing disc 5 is fixedly connected inside the annular frame 3; the upper end of the dispensing disc 5 is provided with a rectangular groove 51; the rectangular groove 51 is filled with adhesive; one of the sliding plates 63 can drive the material injection unit 4 to move right above the dispensing disc 5; the clamp console 2 is positioned on the inner side of the annular frame 3; the two material injection units 4 are positioned right above the clamp control table 2 under the action of the corresponding sliding plates 63; the through holes 47 on the two material injection units 4 correspond to the positions of the core placing tables 22 one by one under the action of the corresponding sliding plates 63; the wafer control platform 1 is positioned on the inner side of the annular frame 3; the other sliding plate 63 can drive the corresponding material injection unit 4 to be positioned right above the wafer control table 1; the through holes 47 on the other material injection unit 4 are in one-to-one correspondence with the positions of the chips 13 under the action of the corresponding sliding plates 63; the controller is used for controlling the LED high-speed die bonding equipment to automatically operate;
when the LED die bonding device works, the conventional die bonding is performed on one chip 13 firstly, and then the other chip 13 is subjected to die bonding, so that the problem of low LED preparation efficiency is caused, and the yield of an LED is influenced; therefore, in the invention, a worker starts the controller to control one of the motors 31 to rotate, the motor 31 drives the corresponding screw rod sliding block pair 6 to move, so that the screw rod sliding block pair 6 drives one of the material injection units 4 to move to the position right above the dispensing disc 5, the electric push rod 64 drives the lower end of the material injection plate 45 to be close to the upper surface of the adhesive, the controller controls the air cylinder 43 to drive the push plate 44 to slide upwards along the groove 46, so that the adhesive is sucked into the groove 46, the electric push rod 64 drives the material injection plate 45 to be far away from the dispensing disc 5, one of the screw rod sliding block pairs 6 drives the material injection unit 4 to move to the position right above the clamp control table 2, and simultaneously the suction nozzles 48 are ensured to correspond to the core placing tables 22 one by one, the electric push rod 64 drives the suction nozzles 48 to be close to the core placing tables 22, and the push plate 44 slides downwards along the groove 46, so that the adhesive, then, the first electric push rod 64 drives the suction nozzle 48 to be far away from the core placing table 22, and one of the screw rod slide block pairs 6 drives the material injection unit 4 to be far away from the clamp control table 2; the controller controls the other first motor 31 to rotate, the other first motor 31 drives the other material injection unit 4 to move right above the wafer control platform 1 through the screw rod sliding block pair 6, meanwhile, the through holes 47 on the other material injection unit 4 are ensured to be in one-to-one correspondence with the chips 13, the second electric push rod 66 drives the suction nozzle 48 to be close to and contact with the attached chip 13, the air cylinder 43 drives the push plate 44 to slide upwards along the groove 46, the chips 13 are adsorbed on the suction nozzle 48 through the push plate 44 moving upwards, the second electric push rod 66 drives the suction nozzle 48 to be far away from the wafer control platform 1, the other screw rod sliding block pair 6 drives the material injection unit 4 to move right above the clamp control platform 2, meanwhile, the suction nozzles 48 are ensured to be in one-to-one correspondence with the core placing platforms 22, the second electric push rod 66 drives the suction nozzle 48 to be close to the core placing platform 22, the air cylinder 43 drives the, the chip 13 is ensured to fall on the chip placing table 22, and the second electric push rod 66 drives the material injection unit 4 to be far away from the clamp control table 2, so that the die bonding process is completed; according to the invention, one motor 31 drives the corresponding screw rod slide block pair 6 to move and the electric push rod 64 drives the material injection unit 4 to move and match, so that the dispensing process is completed, and the other motor 31 drives the corresponding screw rod slide block pair 6 to move and the electric push rod 66 drives the material injection unit 4 to move and match, so that the core placing process is completed, and the invention can simultaneously fix a plurality of chips 13, thereby realizing the effect of simultaneously carrying out a plurality of die bonding, further improving the die bonding efficiency of the LED, and improving the production efficiency of the LED.
As an embodiment of the present invention, a rotating rod 53 is twisted between two groove walls of the rectangular groove 51 through a torsion spring 52; the outer wall of the rotating rod 53 is fixedly connected with a blade 54; the blades 54 are uniformly distributed on the outer wall of the rotating rod 53; a wire rope 55 is wound around the middle part of the rotating rod 53; the wire rope 55 is in a tightened state under the action of the torsion spring 52, and the other end of the wire rope 55 is connected with one side wall of the material injection plate 45; during operation, in the process that one of the motors 31 drives the material injection plates 45 to be away from the dispensing disc 5, the material injection plates 45 can pull the cord 55 to move, so that the rotating rod 53 rotates along the two groove walls of the rectangular groove 51 under the action of the cord 55, the rotating rod 53 rotates to drive the blades 54 to rotate, the adhesives in the rectangular groove 51 are stirred through the blades 54, in the process that the motor 31 drives the material injection plates 45 to be close to the dispensing disc 5, the rotating rod 53 rotates under the action of the torsion spring 52, the cord 55 can be tightened by the rotating rod 53, and meanwhile, the rotating rod 53 can drive the blades 54 to reversely stir the adhesives in the rectangular groove 51; according to the invention, one of the motors 31 drives the material injection plate 45 to move and the rotating rod 53 drives the blades 54 to rotate and match, so that the effect of uniformly mixing the adhesive in the dispensing disc 5 is achieved, the consistency of the viscosity of the adhesive adsorbed by each suction nozzle 48 is ensured, and the effect of adhering the chip 13 on the chip placing table 22 is ensured.
As an embodiment of the present invention, two end faces of the blade 54 are fixedly connected with fins 56; the fins 56 are randomly distributed on two end faces of the blade 54, the cross section of each fin 56 is triangular, and the two end faces of each fin 56 are perpendicular to the two end faces of the blade 54; the during operation, blade 54 removes the in-process and can drive fin 56 motion, thereby reached the effect of shunting the adhesive through fin 56, simultaneously because of fin 56 distributes at the both ends face of blade 54 at random, it is different to have guaranteed that the adhesive shunts the direction around fin 56, and then increased the particle dispersion degree of adhesive in rectangular channel 51, and then improved the practical application effect of adhesive, simultaneously through setting fin 56's cross sectional shape to triangle-shaped, fin 56's intensity has been guaranteed, and then fin 56's life and practical application effect have been improved.
In one embodiment of the present invention, the outer wall of the rotating rod 53 is hinged with a knocking rod 57; the end of the knocking rod 57 can contact with the bottom of the rectangular groove 51, and the diameter of the outer wall of the knocking rod 57 is increased along with the distance from the rotating rod 53; during operation, No. one electric putter 64 drives annotate the flitch 45 and keeps away from some adhesive disk 5 and removes the in-process, it receives cotton rope 55 effect and rotates to change excellent 53, it can drive and beat excellent 57 and remove to change excellent 53 rotation, thereby strike through the tank bottom of beating excellent 57 to rectangular channel 51, make some adhesive disk 5 receive and strike the back and produce vibrations, some adhesive disk 5 receives vibrations back and transmits the shaking force to changeing excellent 53, at last transmit to annotating flitch 45 through cotton rope 55 by changeing excellent 53 again, rethread annotates flitch 45 and transmits the shaking force to suction nozzle 48, thereby make the adhesive of suction nozzle 48 surface adhesion receive the vibrations effect down and drop, the adhesive that drops can fall in rectangular channel 51, thereby avoided the adhesive to scatter outside rectangular channel 51, cause the extravagant condition of adhesive, and then practiced thrift the cost of producing the LED.
As an embodiment of the present invention, an elastic rope 58 is fixedly connected to the outer wall of the knock bar 57; the elastic ropes 58 are randomly distributed on the outer wall of the knocking rod 57, and the other ends of the elastic ropes 58 are fixedly connected with knocking blocks 59; the cross section of the knocking block 59 is semicircular; during operation, the removal of rapping bar 57 can drive bungee cord 58 and remove, bungee cord 58 can drive the motion of knockout 59, thereby it strikes to take place to strike excellent 57 to drive knockout 59 through bungee cord 58, thereby make rapping bar 57 receive the striking back, the dynamics that rapping bar 57 strikes rectangular channel 51 tank bottom has been increased, and then the vibrations effect of commentaries on classics stick 53 has been improved, the dynamics of vibrations on suction nozzle 48 has been improved, make the adhesive of suction nozzle 48 surface adhesion drop sooner, prevent that the adhesive of suction nozzle 48 surface adhesion from coming too late to drop just deviating the condition in rectangular channel 51 top, and then improved the actual application effect of rapping bar 57.
An automatic loading and unloading device is applied to the LED high-speed die bonding equipment and comprises a turntable 7 and a second motor 71; the second motor 71 is positioned on the inner side of the annular frame 3, and the output shaft of the second motor 71 is connected with the turntable 7; the upper end of the rotary table 7 is fixedly connected with a hydraulic cylinder 72; the hydraulic cylinders 72 are uniformly distributed at the upper end of the turntable 7, and the end parts of the hydraulic cylinders 72 are fixedly connected with the bottom of the clamp control platform 2; during operation, the controller can drive the carousel 7 to remove, carousel 7 can drive one of them pneumatic cylinder 72 and remove to operating position, one of them pneumatic cylinder 72 extension, thereby drive corresponding anchor clamps control cabinet 2 upward movement to operating position, treat that solid brilliant back is accomplished, one of them pneumatic cylinder 72 shortens, thereby drive corresponding anchor clamps control cabinet 2 downward movement, carousel 7 drives another anchor clamps control cabinet 2 again and removes to operating position, support 21 on one of them anchor clamps control cabinet 2 is at solid brilliant in-process, the staff can change support 21 on other anchor clamps control cabinet 2, thereby need not stop LED solid brilliant equipment wholly, the steady operation of solid brilliant has been guaranteed, the solid brilliant efficiency of LED has been improved, and then improve LED's production efficiency.
When the automatic adhesive dispensing machine works, a worker starts the controller to control one of the motors 31 to rotate, the motor 31 drives the corresponding screw rod sliding block pair 6 to move, so that the screw rod sliding block pair 6 drives one of the material injection units 4 to move right above the dispensing disc 5, the electric push rod 64 drives the lower end of the material injection plate 45 to be close to the upper surface of an adhesive, the controller controls the air cylinder 43 to drive the push plate 44 to slide upwards along the groove 46 so as to suck the adhesive into the inside of the groove 46, the electric push rod 64 drives the material injection plate 45 to be far away from the dispensing disc 5, one of the screw rod sliding block pairs 6 drives the material injection unit 4 to move right above the clamp control table 2, and meanwhile, the suction nozzles 48 are ensured to correspond to the core placing tables 22 one by one, the electric push rod 64 drives the suction nozzles 48 to be close to the core placing tables 22, and the push plate 44 slides downwards along the groove 46 so as to extrude the adhesive on, then, the first electric push rod 64 drives the suction nozzle 48 to be far away from the core placing table 22, and one of the screw rod slide block pairs 6 drives the material injection unit 4 to be far away from the clamp control table 2; the controller controls the other first motor 31 to rotate, the other first motor 31 drives the other material injection unit 4 to move right above the wafer control platform 1 through the screw rod sliding block pair 6, meanwhile, the through holes 47 on the other material injection unit 4 are ensured to be in one-to-one correspondence with the chips 13, the second electric push rod 66 drives the suction nozzle 48 to be close to and contact with the attached chip 13, the air cylinder 43 drives the push plate 44 to slide upwards along the groove 46, the chips 13 are adsorbed on the suction nozzle 48 through the push plate 44 moving upwards, the second electric push rod 66 drives the suction nozzle 48 to be far away from the wafer control platform 1, the other screw rod sliding block pair 6 drives the material injection unit 4 to move right above the clamp control platform 2, meanwhile, the suction nozzles 48 are ensured to be in one-to-one correspondence with the core placing platforms 22, the second electric push rod 66 drives the suction nozzle 48 to be close to the core placing platform 22, the air cylinder 43 drives the, the chip 13 is ensured to fall on the chip placing table 22, and the second electric push rod 66 drives the material injection unit 4 to be far away from the clamp control table 2, so that the die bonding process is completed; in the process that one of the motors 31 drives the material injection plate 45 to be far away from the dispensing disc 5, the material injection plate 45 can pull the cord 55 to move, so that the rotating rod 53 rotates along the two groove walls of the rectangular groove 51 under the action of the cord 55, the rotating rod 53 rotates to drive the blade 54 to rotate, the adhesive in the rectangular groove 51 is stirred through the blade 54, in the process that the motor 31 drives the material injection plate 45 to be close to the dispensing disc 5, the rotating rod 53 rotates under the action of the torsion spring 52, the cord 55 can be tightened by the rotating rod 53, and meanwhile, the rotating rod 53 can drive the blade 54 to reversely stir the adhesive in the rectangular groove 51; the blades 54 can drive the fins 56 to move in the moving process, so that the adhesive shunting effect is achieved through the fins 56, meanwhile, the fins 56 are randomly distributed on two end faces of the blades 54, the adhesive shunting directions around the fins 56 are different, the particle dispersion degree of the adhesive in the rectangular groove 51 is increased, the actual application effect of the adhesive is improved, meanwhile, the strength of the fins 56 is ensured by setting the cross section of the fins 56 to be triangular, and the service life and the actual application effect of the fins 56 are improved; in the moving process that the first electric push rod 64 drives the material injection plate 45 to be far away from the dispensing disc 5, the rotating rod 53 rotates under the action of the thread rope 55, the rotating rod 53 rotates to drive the knocking rod 57 to move, so that the knocking rod 57 collides the bottom of the rectangular groove 51, the dispensing disc 5 generates vibration after being collided, the dispensing disc 5 transmits vibration force to the rotating rod 53 after being vibrated, finally the rotating rod 53 transmits the vibration force to the material injection plate 45 through the thread rope 55, and the material injection plate 45 transmits the vibration force to the suction nozzle 48, so that the adhesive adhered to the outer surface of the suction nozzle 48 falls off under the vibration action, and the fallen adhesive falls into the rectangular groove 51, thereby avoiding the situation that the adhesive is scattered outside the rectangular groove 51 to cause adhesive waste, and further saving the cost for producing LEDs; the elastic rope 58 is driven by the movement of the knocking rod 57, the knocking block 59 is driven by the elastic rope 58 to move, so that the knocking block 59 is driven by the elastic rope 58 to impact the knocking rod 57, the force of the knocking rod 57 knocking the bottom of the rectangular groove 51 is increased after the knocking rod 57 is impacted, the vibration effect of the rotating rod 53 is improved, the vibration force on the suction nozzle 48 is improved, the adhesive adhered to the outer surface of the suction nozzle 48 can fall off more quickly, the situation that the adhesive adhered to the outer surface of the suction nozzle 48 deviates from the upper part of the rectangular groove 51 due to too late falling of the adhesive is prevented, and the actual application effect of the knocking rod 57 is improved; the controller can drive the turntable 7 to move, the turntable 7 can drive one of the hydraulic cylinders 72 to move to a working position, one of the hydraulic cylinders 72 is extended, thereby driving the corresponding fixture control platform 2 to move upwards to the working position, after die bonding is completed, one of the hydraulic cylinders 72 is shortened, thereby driving the corresponding fixture control platform 2 to move downwards, the turntable 7 drives the other fixture control platform 2 to move to the working position, the support 21 on one of the fixture control platform 2 is in the die bonding process, a worker can replace the support 21 on the other fixture control platform 2, thereby the LED die bonding equipment does not need to be stopped integrally, the stable operation of die bonding is ensured, the die bonding efficiency of the LED is improved, and the production efficiency of the LED is improved.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims; the scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. An LED high-speed die bonding device comprises a wafer control table (1) and a clamp control table (2); the wafer control platform (1) is used for clamping a wafer expanding ring (11); the upper end of the crystal expansion ring (11) is wrapped with a blue film (12); a chip (13) is arranged on the blue film (12); the chips (13) are uniformly distributed at the upper end of the blue film (12); the clamp control console (2) is used for clamping a bracket (21); a core placing table (22) is arranged on the support (21); the method is characterized in that: the LED high-speed die bonder further comprises an annular frame (3), a material injection unit (4), a dispensing disc (5) and a controller; two screw rod sliding block pairs (6) are arranged on the inner wall of the annular frame (3); the screw rod sliding block pair (6) comprises a screw rod (61), a sliding rod (62) and a sliding plate (63); two first motors (31) are mounted on the outer wall of the annular frame (3); the first motor (31) is used for driving the corresponding screw rod sliding block pair (6) to operate; the running tracks of the two sliding plates (63) are perpendicular to each other; a first electric push rod (64) is fixedly connected below one sliding plate (63); the end part of the first electric push rod (64) is fixedly connected with a connecting plate (65); the side of the connecting plate (65) is fixedly connected with a material injection unit (4); the material injection unit (4) comprises a top plate (41), a connecting rod (42), a cylinder (43), a push plate (44) and a material injection plate (45); the connecting plate (65) is fixedly connected with the top plate (41); the lower end of the top plate (41) is connected with a material injection plate (45) through a connecting rod (42); the upper end of the material injection plate (45) is provided with a groove (46); the groove (46) is connected with a push plate (44) in a sliding way; an air cylinder (43) is arranged between the push plate (44) and the top plate (41); one end of the cylinder (43) is connected with the top plate (41), and the other end of the cylinder is connected with the upper end of the push plate (44); a through hole (47) is formed in the bottom of the groove (46); the through holes (47) are uniformly distributed at the bottom of the groove (46), the distance between the adjacent through holes (47) is the same as the distance between the adjacent core placing platforms (22), and the distance between the adjacent through holes (47) is the same as the distance between the adjacent chips (13); the orifice of the through hole (47) is fixedly connected with a suction nozzle (48); a second electric push rod (66) is fixedly connected below the other sliding plate (63); the end part of the second electric push rod (66) is fixedly connected with a material injection unit (4); a dispensing disc (5) is fixedly connected inside the annular frame (3); the upper end of the dispensing disc (5) is provided with a rectangular groove (51); the rectangular groove (51) is filled with adhesive; one of the sliding plates (63) can drive the material injection unit (4) to move to the position right above the dispensing disc (5); the clamp control console (2) is positioned on the inner side of the annular frame (3); the two material injection units (4) are positioned right above the clamp control table (2) under the action of the corresponding sliding plates (63); through holes (47) on the two material injection units (4) are in one-to-one correspondence with the positions of the core placing tables (22) under the action of corresponding sliding plates (63); the wafer control platform (1) is positioned on the inner side of the annular frame (3); the other sliding plate (63) can drive the corresponding material injection unit (4) to be positioned right above the wafer control table (1); the through holes (47) on the other material injection unit (4) are in one-to-one correspondence with the positions of the chips (13) under the action of the corresponding sliding plates (63); the controller is used for controlling the LED high-speed die bonding equipment to automatically operate.
2. The LED high-speed die bonding equipment according to claim 1, wherein: the two groove walls of the rectangular groove (51) are connected with a rotating rod (53) in a twisting way through a torsion spring (52); the outer wall of the rotating rod (53) is fixedly connected with a blade (54); the blades (54) are uniformly distributed on the outer wall of the rotating rod (53); a wire rope (55) is wound at the middle part of the rotating rod (53); the wire rope (55) is in a tightening state under the action of the torsion spring (52), and the other end of the wire rope (55) is connected with one side wall of the material injection plate (45).
3. The LED high-speed die bonding equipment according to claim 2, wherein: two end surfaces of the blade (54) are fixedly connected with fin plates (56); the fin plates (56) are randomly distributed on two end faces of the blade (54), the cross section of each fin plate (56) is triangular, and the two end faces of each fin plate (56) are perpendicular to the two end faces of the blade (54).
4. The LED high-speed die bonding equipment according to claim 3, wherein: the outer wall of the rotating rod (53) is hinged with a knocking rod (57); the end part of the knocking rod (57) can be in contact with the bottom of the rectangular groove (51), and the diameter of the outer wall of the knocking rod (57) is increased along with the distance from the rotating rod (53).
5. The LED high-speed die bonding equipment according to claim 4, wherein: the outer wall of the knocking rod (57) is fixedly connected with an elastic rope (58); the elastic ropes (58) are randomly distributed on the outer wall of the knocking rod (57), and the other end of each elastic rope (58) is fixedly connected with the knocking block (59); the cross section of the knocking block (59) is semicircular.
6. The utility model provides an automatic unloader that goes up which characterized in that: the automatic loading and unloading device is applied to the LED high-speed die bonding equipment as claimed in any one of claims 1 to 5, and comprises a turntable (7) and a second motor (71); the second motor (71) is positioned on the inner side of the annular frame (3), and an output shaft of the second motor (71) is connected with the turntable (7); the upper end of the rotary table (7) is fixedly connected with a hydraulic cylinder (72); the hydraulic cylinders (72) are uniformly distributed at the upper end of the turntable (7), and the end parts of the hydraulic cylinders (72) are fixedly connected with the bottom of the clamp control table (2).
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