CN208861944U - Continuous Qu Jing die bond mechanism - Google Patents
Continuous Qu Jing die bond mechanism Download PDFInfo
- Publication number
- CN208861944U CN208861944U CN201821558644.2U CN201821558644U CN208861944U CN 208861944 U CN208861944 U CN 208861944U CN 201821558644 U CN201821558644 U CN 201821558644U CN 208861944 U CN208861944 U CN 208861944U
- Authority
- CN
- China
- Prior art keywords
- indigo plant
- pick
- pallet
- die bond
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model provides a kind of continuous Qu Jing die bond mechanism, including placing the pallet of wafer indigo plant film and placing the platform for placing material of tablet, it is provided with to pick and place the crystal grain on wafer indigo plant film between the pallet and platform for placing material and gets rid of arm to the tablet, it further include blue film handling equipment, the indigo plant film handling equipment includes blue coating materials storehouse and pick-up claw, it is placed in the indigo plant coating materials storehouse wait take the brilliant wafer indigo plant film operated, the pick-up claw is mobile between the blue coating materials storehouse and the pallet and can pick and place the wafer indigo plant film, being allowed by the pick-up claw that setting can automatically switch wafer indigo plant film entirely takes brilliant die bond process to be carried out continuously, operator only needs to be responsible for feed supplement in blue coating materials storehouse, switching wafer indigo plant film is carried out by pick-up claw, alleviate the labor intensity of operator, improve the efficiency for taking brilliant die bond.
Description
Technical field
The utility model relates to chip diode encapsulation field more particularly to a kind of continuous Qu Jing die bond mechanisms.
Background technique
In the packaging process of chip diode, it is placed to by taking-up wafer on wafer indigo plant film and completes to take brilliant die bond on tablet
Operation be relatively conventional work step, in the prior art, after the completion of the wafer on one piece of wafer indigo plant film is won, it usually needs
By equipment downtime, the operation for switching new wafer indigo plant film is completed by operator, needs operator's moment to pay close attention to and takes brilliant progress,
And equipment downtime is caused, so that taking brilliant die bond work can not be continuous, production efficiency be lower.
Utility model content
Technical problem to be solved by the utility model is: existing take wafer indigo plant film in brilliant die bond to switch manual operation, efficiency
Lower, the utility model provides a kind of continuous Qu Jing die bond mechanism to solve the above problems.
The technical scheme adopted by the utility model to solve the technical problem is as follows: a kind of continuous Qu Jing die bond mechanism, including
It places the pallet of wafer indigo plant film and places the platform for placing material of tablet, being provided between the pallet and platform for placing material will be on wafer indigo plant film
Crystal grain pick and place and get rid of arm to the tablet, further include blue film handling equipment, the indigo plant film handling equipment includes blue film
Feed bin and pick-up claw are placed with wait take the brilliant wafer indigo plant film operated in the indigo plant coating materials storehouse, and the pick-up claw is in the blue coating materials
It is mobile between storehouse and the pallet simultaneously to pick and place the wafer indigo plant film.
Further: being provided with horizontal guide rail between the pallet and the blue coating materials storehouse, be arranged on the horizontal guide rail
There is the horizontal slider that can be moved along the horizontal guide rail, the pick-up claw is arranged on the horizontal slider, on the pick-up claw
It is provided with the suction nozzle that can draw the wafer indigo plant film.
Further: the continuous Qu Jing die bond mechanism further includes vertical lead screw, upright slide block and vertical driving motor, institute
It states upright slide block to be mounted on the vertical lead screw, the vertical lead screw is rotated by simultaneously energy the vertical driving motor
Drive the upright slide block vertically moving, the indigo plant coating materials storehouse is fixed on the upright slide block.
Further: clamping tool is provided on the pallet, the clamping tool includes cylinder, stationary half and activity
Semi-ring, the cylinder body of the cylinder are fixed on the pallet, and the activity semi-ring is fixed at the piston of the cylinder
On bar, the piston rod of the cylinder is protruding by the circumferential stationary half direction pushing tow of the activity half and described in capable of clamping
The periphery of wafer indigo plant film.
Further: the pallet is rotatably arranged on support, and first motor, first electricity are provided on the support
Driving wheel is provided in the shaft of machine, the driving wheel can drive the pallet to rotate.
Further: the arm that gets rid of is arranged in the drive shaft of the second motor.
The utility model has the beneficial effects that the utility model continuous Qu Jing die bond mechanism can be automatically switched by setting
The pick-up claw of wafer indigo plant film, which allows, entirely takes brilliant die bond process to be carried out continuously, and operator only needs to be responsible in blue coating materials storehouse
Feed supplement, switching wafer indigo plant film are carried out by pick-up claw, alleviate the labor intensity of operator, improve the efficiency for taking brilliant die bond.
Detailed description of the invention
The present invention will be further described with reference to the accompanying drawings and examples.
Fig. 1, Fig. 2 are the structural schematic diagrams of the utility model continuous Qu Jing die bond mechanism;
Fig. 3 is the structural schematic diagram that clamping tool is mounted on pallet.
1, pallet in figure, 2, platform for placing material, 3, get rid of arm, 4, blue coating materials storehouse, 5, pick-up claw, 6, horizontal guide rail, 7, horizontal slider,
8, cylinder, 9, stationary half, 10, movable semi-ring, 11, first motor, 12, driving wheel, the 13, second motor, 14, driving motor,
15, upright slide block, 16, support.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model
Limitation.On the contrary, the embodiments of the present invention include falling into owning within the scope of the spirit and intension of attached claims
Variation, modification and equivalent.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " axis
To ", " radial direction ", the orientation or positional relationship of the instructions such as " circumferential direction " be to be based on the orientation or positional relationship shown in the drawings, be only for
Convenient for the description present invention and simplify description, rather than the device or element of indication or suggestion meaning there must be specific side
Position is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply relatively important
Property.In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " connected " " connects
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected;It can be machine
Tool connection, is also possible to be electrically connected;It can be directly connected, it can also be indirectly connected through an intermediary.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.In addition, in this reality
With in novel description, unless otherwise indicated, the meaning of " plurality " is two or more.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of preferred embodiments of the present invention includes other realization, wherein can not be by shown or discussion
Sequence, including according to related function by it is basic simultaneously in the way of or in the opposite order, Lai Zhihang function, this should be by this
The embodiment person of ordinary skill in the field of utility model is understood.
As shown in Figure 1 and Figure 2, the utility model provides a kind of continuous Qu Jing die bond mechanism, including placing wafer indigo plant film
Pallet 1 and the platform for placing material 2 for placing tablet, are provided between the pallet 1 and platform for placing material 2 and pick and place the crystal grain on wafer indigo plant film
Arm 3 is got rid of on to the tablet, further includes blue film handling equipment, the indigo plant film handling equipment includes blue coating materials storehouse 4 and takes
Expect pawl 5, is placed in the indigo plant coating materials storehouse 4 wait take the brilliant wafer indigo plant film operated, the pick-up claw 5 is in 4 He of blue coating materials storehouse
It is mobile between the pallet 1 simultaneously to pick and place the wafer indigo plant film.
When taking brilliant die bond operation to carry out, gets rid of arm 3 and swing back and forth between pallet 1 and platform for placing material 2, it will be on wafer indigo plant film
Crystal grain is picked and placed onto the tablet of platform for placing material 2, with the progress for taking brilliant die bond, is finished when the crystal grain on wafer indigo plant film is gradually picked and placed
Afterwards, pick-up claw 5 is moved to the top of pallet 1, takes brilliant wafer indigo plant film to take away for having been completed, then be moved to blue coating materials storehouse 4
Top will in blue coating materials storehouse 4 wait take the brilliant wafer indigo plant film operated to pick and place into pallet 1, getting rid of arm 3 can work on completion
Brilliant die bond is taken to operate.
Long-time process caused by when this mode avoids artificial replacement wafer indigo plant film is paused, while also not needing to operate
Human attendance notices that single wafer indigo plant film takes the progress of brilliant die bond the moment by equipment, and operator only needs when operating beginning
The wafer indigo plant film for being ready to sufficient in blue coating materials storehouse 4, which can be realized, continuously takes brilliant die bond to work, and alleviates operator's
Working strength, while avoiding abnormal process and pausing, it improves work efficiency.
It is provided with horizontal guide rail 6 between the pallet 1 and the blue coating materials storehouse 4, being provided on the horizontal guide rail 6 can edge
The horizontal slider 7 that the horizontal guide rail 6 moves, the pick-up claw 5 are arranged on the horizontal slider 7, set on the pick-up claw 5
It is equipped with the suction nozzle that can draw the wafer indigo plant film.
The continuous Qu Jing die bond mechanism further includes vertical lead screw, upright slide block 15 and vertical driving motor 14, described perpendicular
Straight sliding block 15 is mounted on the vertical lead screw, and the vertical lead screw is rotated by simultaneously energy the vertical driving motor 14
Drive the upright slide block 15 vertically moving, the indigo plant coating materials storehouse 4 is fixed on the upright slide block 15.
First level sliding block 7 moves on first level guide rail 6, is able to achieve pick-up claw 5 and moves in the horizontal direction, so that taking
Expect that pawl 5 has the freedom degree of horizontal direction, complete the transfer action between pallet 1 and blue coating materials storehouse 4, upright slide block 15 can drive
The 4 vertical direction movement of indigo plant coating materials storehouse enables to wafer indigo plant film close to or far away from pick-up claw 5, can be convenient feeding in this way
Pawl 5 acts the pick-and-place of wafer indigo plant film, and pick-up claw 5 is enabled quick and precisely to carry out the pick-and-place of wafer indigo plant film, and suction nozzle can be protected
Card, which is stablized, draws phenomena such as wafer indigo plant film is not in scuffing.
As shown in figure 3, being provided with clamping tool on the pallet 1, the clamping tool includes cylinder 8,9 and of stationary half
Movable semi-ring 10, the cylinder body of the cylinder 8 are fixed on the pallet 1, and the activity semi-ring 10 is fixed at described
On the piston rod of cylinder 8, the piston rod of the cylinder 8 it is protruding by the movable semi-ring 10 to 9 direction of stationary half
Pushing tow can simultaneously clamp the periphery of the wafer indigo plant film.
The flexible movement clamped and released that can be realized clamping tool of the piston cylinder of cylinder 8, the piston cylinder of cylinder 8 are stretched
Clamping tool can be made to fix to clamp wafer indigo plant film out, the piston rod retraction of cylinder 8 can be realized folded by clamping tool release
The reliable grip to wafer indigo plant film may be implemented in tight wafer indigo plant film, this mode, while discharging simple rapid.
The pallet 1 is rotatably arranged on support 16, and first motor 11, the first motor are provided on the support 16
Driving wheel 12 is provided in 11 shaft, the driving wheel 12 can drive the pallet 1 to rotate.First motor 11 drives driving wheel
12 rotations, can drive pallet 1 to rotate, when wafer indigo plant film is placed on pallet 1, wafer indigo plant film position is in a rotational direction
Random, it is not refined and reliably positions, drive pallet 1 to rotate by first motor 11, wafer indigo plant film can rotated
Direction is adjusted to presetting position, facilitate get rid of arm 3 take brilliant die bond to operate.
The arm 3 that gets rid of is arranged in the drive shaft of the second motor 13, and the drive shaft of the second motor 13, which directly drives, gets rid of arm 3
Whipping is returned, is completed and takes brilliant fixed operation, the movement speed for getting rid of arm 3 can be improved in this driving method, and raising takes brilliant and fixed
Efficiency.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of the term
Stating may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be
It can be combined in any suitable manner in any one or more embodiment or examples.
It is enlightenment, through the above description, related work people with the above-mentioned desirable embodiment according to the utility model
Member can carry out various changes and amendments in the range of without departing from this item utility model technical idea completely.This item is real
It is not limited to the contents of the specification with novel technical scope, it is necessary to its technology is determined according to scope of the claims
Property range.
Claims (6)
1. a kind of continuous Qu Jing die bond mechanism, including placing the pallet (1) of wafer indigo plant film and placing the platform for placing material (2) of tablet,
It is provided with to pick and place the crystal grain on wafer indigo plant film between the pallet (1) and platform for placing material (2) and gets rid of arm (3) to the tablet,
It is characterized by also including blue film handling equipment, the indigo plant film handling equipment includes blue coating materials storehouse (4) and pick-up claw (5),
Be placed in indigo plant coating materials storehouse (4) wait take the brilliant wafer indigo plant film operated, the pick-up claw (5) in the blue coating materials storehouse (4) and
It is mobile between the pallet (1) simultaneously to pick and place the wafer indigo plant film.
2. continuous Qu Jing die bond mechanism as described in claim 1, it is characterised in that: the pallet (1) and the blue coating materials storehouse
(4) it is provided between horizontal guide rail (6), the level that can be moved along the horizontal guide rail (6) is provided on the horizontal guide rail (6)
Sliding block (7), the pick-up claw (5) are arranged on the horizontal slider (7), are provided with described in capable of drawing on the pick-up claw (5)
The suction nozzle of wafer indigo plant film.
3. continuous Qu Jing die bond mechanism as claimed in claim 2, it is characterised in that: the continuous Qu Jing die bond mechanism is also wrapped
Vertical lead screw, upright slide block (15) and vertical driving motor (14) are included, the upright slide block (15) is mounted on the vertical lead screw
On, the vertical lead screw simultaneously can drive the upright slide block (15) along perpendicular in being rotated by for the vertical driving motor (14)
Histogram is fixed on the upright slide block (15) to movement, the indigo plant coating materials storehouse (4).
4. continuous Qu Jing die bond mechanism as claimed in claim 3, it is characterised in that: be provided with clamping work on the pallet (1)
Dress, the clamping tool include cylinder (8), stationary half (9) and movable semi-ring (10), and the cylinder body fixation of the cylinder (8) is set
It sets on the pallet (1), the activity semi-ring (10) is fixed on the piston rod of the cylinder (8), the cylinder (8)
Piston rod protruding by described movable semi-ring (10) Xiang Suoshu stationary half (9) direction pushing tow and can clamp the wafer indigo plant
The periphery of film.
5. continuous Qu Jing die bond mechanism as claimed in claim 4, it is characterised in that: the pallet (1) is rotatably arranged on support
(16) it on, is provided with first motor (11) on the support (16), is provided with driving wheel in the shaft of the first motor (11)
(12), the driving wheel (12) can drive the pallet (1) to rotate.
6. continuous Qu Jing die bond mechanism as claimed in claim 5, it is characterised in that: described get rid of arm (3) are arranged in the second motor
(13) in drive shaft.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821558644.2U CN208861944U (en) | 2018-09-21 | 2018-09-21 | Continuous Qu Jing die bond mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821558644.2U CN208861944U (en) | 2018-09-21 | 2018-09-21 | Continuous Qu Jing die bond mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208861944U true CN208861944U (en) | 2019-05-14 |
Family
ID=66418994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821558644.2U Active CN208861944U (en) | 2018-09-21 | 2018-09-21 | Continuous Qu Jing die bond mechanism |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208861944U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112436084A (en) * | 2020-11-29 | 2021-03-02 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
-
2018
- 2018-09-21 CN CN201821558644.2U patent/CN208861944U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112436084A (en) * | 2020-11-29 | 2021-03-02 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109216245A (en) | Continuous Qu Jing die bond mechanism | |
CN107305916B (en) | A kind of chip mounter and its processing technology of CSP encapsulation LED | |
CN104029878B (en) | Rubberizing paper equipment | |
CN109243814B (en) | Butterfly winding method inductance winding machine | |
CN202780785U (en) | Automatic sandpaper-sending device of polishing machine | |
CN208861944U (en) | Continuous Qu Jing die bond mechanism | |
CN108792781A (en) | A kind of full-automatic wrapping wire production line | |
CN102896546A (en) | Automatic loading and unloading device | |
CN217513049U (en) | Automatic vision positioning welding machine | |
CN205129843U (en) | Mechanism is got to four degree of freedom clamps | |
CN110255112A (en) | Optical lens tests automatic removable disk equipment | |
CN112571984B (en) | Piston pin marking production line | |
CN105537556B (en) | A kind of die-cast steel-aluminum fin feeding extractor | |
CN112170113A (en) | Detect ejection of compact formula work piece gluing machine | |
CN202952462U (en) | Automatic production device suitable for plastic forming | |
CN108655572A (en) | A kind of automation rearview mirror laser marking device | |
CN207680916U (en) | A kind of lamp cap adhesive supplier of LED lamp tube | |
CN207657185U (en) | Automatic winding formula gluing device | |
CN209334933U (en) | Turntable assembly welding device | |
CN214234748U (en) | Detect ejection of compact formula work piece gluing machine | |
CN208869064U (en) | One kind pasting two-sided gluing equipment automatically | |
CN211471774U (en) | Full-automatic serging machine | |
CN214732634U (en) | Bottle taking device on ganoderma lucidum tightening and pulling cream production line | |
CN109693104B (en) | Top cover screw locking device of crawling robot matched with rotary carrier | |
CN204937644U (en) | A kind of rice packaging system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |