CN108615804A - The full-automatic bonders of mini-LED and its die-bonding method - Google Patents
The full-automatic bonders of mini-LED and its die-bonding method Download PDFInfo
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- CN108615804A CN108615804A CN201810767038.XA CN201810767038A CN108615804A CN 108615804 A CN108615804 A CN 108615804A CN 201810767038 A CN201810767038 A CN 201810767038A CN 108615804 A CN108615804 A CN 108615804A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a kind of full-automatic bonders of mini LED and its die-bonding method, full-automatic bonder includes platen and is respectively arranged at the feeding mechanism and receiving mechanism at platen both ends, and multiple die bond units are equipped between the feeding mechanism and receiving mechanism.LED support is transported in die bond unit adjacent thereto by it by the feeding mechanism, each die bond unit is delivered to next die bond unit after completing die bond twice to LED support, die bond until completing LED support, the receiving mechanism receive the LED support that die bond is completed.The bonder is directed to the die bond mode for the LED support that need to carry out a variety of LED wafer die bonds, and compared with traditional die bond mode, which reduce the middle swivel links of multiple die bond, greatly improve production efficiency, and reduce fraction defective；Meanwhile it is compact-sized, take up an area it is smaller.
Description
Technical field
The present invention relates to LED processing technique fields, particularly relate to a kind of full-automatic bonder of mini-LED and its
Die-bonding method.
Background technology
Light emitting diode (Light Emitting Diode, LED) is a kind of to convert electrical energy into shining for luminous energy
Element.The multiple fields such as LED product can be used for illuminating, show, signal designation.In recent years, with LED wafer and encapsulation technology
Progress can reduce the LED spacing that cuttings is presented, and small space distance LED display screen can have higher resolution, and picture effect is more preferable,
Therefore demand of the client to small space distance LED display screen is increasing.But small space distance LED display screen, due to the diminution of its spacing,
LED display of the same area, the LED quantity used are significantly increased, therefore have to the die bond speed of bonder higher
It is required that.Meanwhile it being used as display screen LED, each of which LED unit is required for the LED wafer of tri- kinds of brightness of fixed R/G/B.
The die bond process of existing LED bonders is at present：Since LED wafer is typically to be concentrated to be sticked to crystalline substance by supplier
On ring film, therefore it is that ejector pin mechanism jacks up specified LED wafer from brilliant ring film first, is then drawn by die bond mechanism
The LED wafer being ejected, which is fixed on LED support, completes die bond.This working method, in face of a variety of LED wafers of this fixation
Holder when, it is of different sizes due to LED wafer, need more bonder coordinating operations.In this way, during it need to pass through repeatedly
Turn, to which working efficiency is slow；Meanwhile die bond individually is carried out for LED support by a die bond mechanism, efficiency is low, and speed is slow.
In view of the drawbacks described above and the market demand of the prior art, there is an urgent need to research and develop a kind of novel LED bonders.
Invention content
For deficiency in the prior art, it is complete certainly that the technical problem to be solved in the present invention is the provision of a kind of mini-LED
Dynamic bonder and its die-bonding method.
In order to solve the above technical problems, the present invention is realized by following scheme：The full-automatic bonders of mini-LED and its
Die-bonding method, the LED bonders include platen and the feeding mechanism and receiving mechanism for being set to the platen both ends, the charging
Multiple die bond units are equipped between mechanism and receiving mechanism；
The feeding mechanism includes storing component, and storing component rear end is provided with feeding material component, the feeding material component
For the LED support on storing component to be pushed to and the die bond unit on storing component adjacent, storing component side
It is provided with connection platform, the connection platform with other boards for docking；
The die bond unit includes that fixture mobile platform, portal frame, the first brilliant ring mobile platform, the second brilliant ring movement are flat
Platform, die bond lens assembly, barcode scanning lens assembly, the first die bond mechanism, the second die bond mechanism, first take brilliant lens assembly, second
Brilliant lens assembly, the first ejector pin component, first is taken to move brilliant ring assemblies certainly from brilliant ring assemblies, the second ejector pin component, second is moved,
Portal frame is provided with above the fixture mobile platform, both sides are respectively arranged with the first brilliant ring mobile platform and the second brilliant ring moves
Moving platform, being arranged side by side on the portal frame and above jig platform has die bond lens assembly and barcode scanning lens assembly, institute
It states die bond lens assembly and barcode scanning lens assembly both sides is respectively arranged with the first die bond mechanism and the second die bond mechanism, described first
The die bond mechanism other side is provided with first and brilliant lens assembly, second die bond mechanism other side is taken to be provided with second and take brilliant camera lens
Component, the described first brilliant ring mobile platform lower section are provided with the first ejector pin component, and the other side is provided with first and moves brilliant ring group certainly
Part, the described second brilliant ring mobile platform lower section are provided with the second ejector pin component, and the other side is provided with second and moves brilliant ring assemblies certainly；
The receiving mechanism includes rewinding connection platform, and rewinding connection platform side is provided with magazine storage assembly；It is described
Rewinding connection platform with external board for docking, and the magazine storage assembly is for receiving the LED support that die bond is completed.
Further, the storing component includes storing mounting base, storing motor, lead screw, supporting plate, magazine, the storing
Storing motor is provided in mounting base, the storing motor is connected with lead screw, and the lead screw is connected with supporting plate, is set on the supporting plate
It is equipped with the magazine for storing LED support；The storing motor drives the supporting plate to carry out vertical motion by lead screw, to band
It moves the magazine and moves to designated position；
The feeding material component includes feeding pedestal, feeding motor mounting base, feeding motor, idler wheel, push rod, metal plate cover, institute
It states and is provided with feeding motor mounting base on feeding pedestal, feeding motor, the feeding are provided in the feeding motor mounting base
Motor is connected with idler wheel, and the idler wheel is connected with push rod, the metal plate cover to shield is additionally provided with above the push rod, described
Feeding motor drives idler wheel rotation, to drive push rod level to move forward and backward the push of progress LED support；
The connection platform includes connection platform pedestal, guide plate, driving wheel, driven wheel, connection platform motor, belt, described to connect
It refutes and is provided with guide plate on platform pedestal, intermediate on the guide plate to be provided with driving wheel, both ends are each provided with a driven wheel,
The driving wheel is connected with connection platform motor, and belt is arranged on the driving wheel and driven wheel；The connection platform motor driving
The driving wheel rotation, to drive the belt to be rotated on the driving wheel and driven wheel, and then drives on the belt
LED support movement.
Further, the jig platform include the first laterally driven component being laterally arranged, first longitudinal direction drive component,
Belt Conveying component, first longitudinal direction drive component is vertically arranged on the first laterally driven component, and the first longitudinal direction is driven
It is provided with Belt Conveying component on dynamic component；The Belt Conveying component utilizes the described first laterally driven component and first longitudinal direction
Drive component carries out lateral longitudinal movement, to drive LED support to be moved to designated position；
Further, the barcode scanning lens assembly includes barcode scanning lens mount, barcode scanning camera lens, barcode scanning camera, the barcode scanning phase
Machine lower end connects barcode scanning camera lens, and barcode scanning lens mount side connects barcode scanning camera, and the barcode scanning camera lens and barcode scanning camera, which are matched, to be shared
It drives the LED support to be moved to designated position in the assistance jig platform, then carries out the identification of Quick Response Code on LED support,
To read the information of the LED support；
Further, the die bond lens assembly includes die bond lens mount, die bond camera lens, die bond camera, the die bond phase
Machine lower end connects die bond camera lens, and die bond lens mount side connects the die bond camera, and the die bond camera lens and die bond camera are matched
It shares and drives the LED support to be moved to designated position in the assistance jig platform, and obtain the distribution of LED on LED support
Image；
Described first takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described first brilliant ring movement
Platform drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring；
Described second takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described second brilliant ring movement
Platform drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring.
Further, the described first brilliant ring mobile platform includes the second laterally driven component being laterally arranged, second longitudinal direction
Drive component, the first brilliant ring transition plate, the first brilliant ring rotary components, the first brilliant ring, it is longitudinal on the second laterally driven component
It is provided with second longitudinal direction drive component, the first brilliant ring transition plate is provided on the second longitudinal direction drive component, described first is brilliant
It is provided with the first brilliant ring rotary components on ring transition plate, is placed on the described first brilliant ring rotary components for carrying LED wafer
The first brilliant ring；Described first brilliant ring rotary components are carried out laterally using the second laterally driven component and second longitudinal direction drive component
Longitudinal movement, to drive the disposed thereon first brilliant ring to be moved to designated position, then the described first brilliant ring rotary components band
Dynamic first brilliant ring rotation carries out the correction of chip；
Described second brilliant ring mobile platform is consistent with the first brilliant ring mobile platform structure, is used to drive crystalline substance disposed thereon
Chip automatically corrects in the movement of ring and brilliant ring.
Further, first ejector pin component includes the first thimble drive component and the first thimble；First thimble
Drive component is for driving the first thimble vertical motion, to eject the LED wafer specified from brilliant ring；
Second ejector pin component is consistent with the first ejector pin component structure, is used to eject positioned at the second brilliant ring mobile platform
The specified LED wafer of upper crystalline substance ring is ejected from brilliant ring.
Further, first die bond mechanism include vertically arranged the first drive component, second driving of being laterally arranged
Dynamic component and the first die bond swing arm being set on the first drive component；First drive component is for driving the first die bond
Swing arm rotates horizontally, and second drive component is for driving the first die bond swing arm to move up and down, the LED wafer to specify
It is carried on the LED support；
Second die bond mechanism is consistent with the first die bond mechanism structure, is used to be ejected by the second ejector pin component
The absorption and carrying of LED wafer.
Further, described first from move brilliant ring assemblies include the first brilliant ring gripper assembly, the first brilliant ring storage assembly,
First brilliant loopback receives component, and the described first brilliant ring gripper assembly side is provided with the first brilliant ring storage assembly, the described first brilliant ring
It is provided with the first brilliant loopback below storage assembly and receives component；The first brilliant ring storage assembly is used for the storage of brilliant ring, and described the
One brilliant ring gripper assembly is carried on the first brilliant ring mobile platform, institute from the described first brilliant brilliant ring of ring storage assembly gripping
It states after the LED wafer on brilliant ring exhausts, the described first brilliant ring gripper assembly is carried to the first brilliant loopback and receives component again
It is interior；
Described second is consistent from brilliant ring assemblies structure is moved with first from brilliant ring assemblies are moved, and is used for the second brilliant ring movement
The automatic charging of platform and automatic recycling.
The die-bonding method of the full-automatic bonders of mini-LED and its die-bonding method, this approach includes the following steps：
LED support in storing component is delivered to jig platform by step 1, first, the feeding material component, or is passed through
The LED support of a upper process is directly delivered to jig platform by connection platform；
Step 2, then, the jig platform fix the LED support, then the LED support disposed thereon is driven to transport
It moves below the barcode scanning lens assembly, the identification of Quick Response Code is carried out by barcode scanning lens assembly；The die bond lens assembly association
Help the jig platform that the LED support disposed thereon is driven to be moved to die bond position；
Step 3, then, described first takes brilliant lens assembly and second that brilliant lens assembly is taken to assist first crystalline substance respectively
Ring mobile platform and the second brilliant ring mobile platform drive brilliant ring disposed thereon to be moved to designated position and be corrected, and described the
One ejector pin component and the second ejector pin component respectively eject the LED wafer specified in the brilliant ring being positioned above, and described first is solid
Brilliant mechanism and the second die bond mechanism draw the LED wafer being ejected respectively again, and are alternately carried on the LED support
Designated position, completes die bond, and die bond information to the storage device that the die bond camera lens transmits the LED support is stored；
Step 4, secondly, the LED support are completed to be delivered to by the jig platform after the die bond of this kind of chip next solid
Brilliant unit；
Step 5 repeats Step 2: step 3 and step 4, complete the fixation of all kinds LED wafer；
Finally, it is received by the magazine storage assembly, or subsequent processing is delivered to by the rewinding connection platform.
Compared with the existing technology, the beneficial effects of the invention are as follows：
1, for the LED support that need to consolidate a variety of LED wafers, which realizes line compared with traditional bonder
Die bond operation, and the middle swivel link of multiple die bond is eliminated, it greatly improves work efficiency.
2, it is directed to a LED support alternately die bond by Liang Ge die bonds mechanism, greatly accelerates LED support die bond
Speed is completed, working efficiency is further improved.
3, its described feeding mechanism and receiving mechanism can all be docked with other boards, eliminate the transhipment of material, greatly
Save cost of labor greatly.
4, the die bond information of its LED support stored by the storage device, and can be by the Information Sharing to LAN
Or wide area network reads for other terminating machines and uses, to which subsequent handling can carry out the selection of LED according to the information, this mode is grasped
Make simply, management is convenient, can effectively improve working efficiency.
5, its is compact-sized, saves production site for enterprise, can effectively improve the performance of enterprises.
Description of the drawings
Fig. 1 is the full-automatic bonders of mini-LED of the present invention and its structural schematic diagram of die-bonding method.
Fig. 2 is the full-automatic bonders of mini-LED of the present invention and its exploded perspective view of die-bonding method.
Fig. 3 is the structural schematic diagram of the full-automatic bonders of mini-LED of the present invention and its feeding mechanism of die-bonding method.
Fig. 4 is the storing modular construction of the full-automatic bonders of mini-LED of the present invention and its feeding mechanism of die-bonding method
Schematic diagram.
Fig. 5 is the full-automatic bonders of mini-LED of the present invention and its feeding material component structure of the feeding mechanism of die-bonding method
Schematic diagram.
Fig. 6 is that the connection platform structure of the feeding mechanism of the full-automatic bonders of mini-LED and its die-bonding method of the invention is shown
It is intended to.
Fig. 7 is the structural schematic diagram of the full-automatic bonders of mini-LED of the present invention and its die bond unit of die-bonding method.
Fig. 8 is the knot of the jig platform of the full-automatic bonders of mini-LED of the present invention and its die bond unit of die-bonding method
Structure schematic diagram.
Fig. 9 is the barcode scanning lens assembly of the full-automatic bonders of mini-LED of the present invention and its die bond unit of die-bonding method
Structural schematic diagram.
Figure 10 is the full-automatic bonders of mini-LED of the present invention and its die bond lens group of the die bond unit of die-bonding method
Part structural schematic diagram.
Figure 11 is the first brilliant ring shifting of the full-automatic bonders of mini-LED of the present invention and its die bond unit of die-bonding method
The structural schematic diagram of moving platform.
Figure 12 is the full-automatic bonders of mini-LED of the present invention and its first thimble group of the die bond unit of die-bonding method
The structural schematic diagram of part.
Figure 13 is the full-automatic bonders of mini-LED of the present invention and its first bonder of the die bond unit of die-bonding method
The structural schematic diagram of structure.
Figure 14 moves certainly for the first of the full-automatic bonders of mini-LED of the present invention and its die bond unit of die-bonding method
The structural schematic diagram of brilliant ring assemblies.
Figure 15 is the structural schematic diagram of the full-automatic bonders of mini-LED of the present invention and its receiving mechanism of die-bonding method.
Specific implementation mode
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Figure 15 is please referred to Fig.1, it is complete certainly to present embodiments provide the mini-LED that a kind of die bond speed is fast, work efficiency is high
Dynamic bonder and its die-bonding method.
The full-automatic bonders of mini-LED and its die-bonding method, including platen 1 and be set to the platen 1 both ends into
Expect mechanism 2 and receiving mechanism 4, multiple die bond units 3 are equipped between the feeding mechanism 2 and receiving mechanism 4.
The feeding mechanism 2 includes being provided with feeding material component 2-2 behind storing component 2-1, the storing component 2-1,
Side is provided with connection platform 2-3.The feeding material component 2-2 is used for pushing to for the LED support of storing component 2-1 is adjacent thereto
Die bond unit 3.The connection platform 2-3 for dock with other boards, by the LED support of the upper process of completion be delivered to and its
Adjacent die bond unit 3.
The storing component 2-1 includes storing mounting base 2-1-1, and storing electricity is provided on the storing mounting base 2-1-1
Machine 2-1-2, the storing motor 2-1-2 are connected with lead screw 2-1-3, the lead screw 2-1-3 and are connected with supporting plate 2-1-4, the support
The magazine 2-1-5 for storing LED support is provided on plate 2-1-4.The storing motor 2-1-3 is driven by lead screw 2-1-3
The supporting plate 2-1-4 carries out vertical motion, to drive the magazine 2-1-5 to move to designated position.
The feeding material component 2-2 includes feeding pedestal 2-2-1, and feeding motor peace is provided on the feeding pedestal 2-2-1
It is provided with feeding motor 2-2-3, the feeding motor 2-2-3 connections on dress seat 2-2-2, the feeding motor mounting base 2-2-2
There are idler wheel 2-2-4, the idler wheel 2-2-4 to be connected with push rod 2-2-5, the tops push rod 2-2-5, which are additionally provided with, to shield
Metal plate cover 2-2-6.The feeding motor 2-2-3 driving idler wheels 2-2-4 rotations, to drive the horizontal front and back fortune of push rod 2-2-5
The dynamic push for carrying out LED support.
The connection platform 2-3 includes connection platform pedestal 2-3-1, and guide plate 2- is provided on the connection platform pedestal 2-3-1
Intermediate on 3-2, the guide plate 2-3-2 to be provided with driving wheel 2-3-3, both ends are each provided with a driven wheel 2-3-4, the master
Driving wheel 2-3-4 is connected on connection platform motor 2-3-5, the driving wheel 2-3-3 and driven wheel 2-3-4 and is arranged with belt 2-3-6.
The connection platform motor 2-3-5 drives the driving wheel 2-3-3 rotations, to drive the belt 2-3-6 in the driving wheel
It is rotated on 2-3-3 and driven wheel 2-3-4, and then drives the LED support movement on the belt 2-3-6.
The die bond unit 3 includes fixture mobile platform 3-1, and portal frame is provided with above the fixture mobile platform 3-1
3-14, both sides are respectively arranged with the brilliant ring mobile platform 3-5, the portal frame 3-14 of the first crystalline substance ring mobile platform 3-4 and second
Being arranged side by side above and above jig platform 3-1 has die bond lens assembly 3-3 and barcode scanning lens assembly 3-2, the die bond mirror
Head assembly 3-3 and the both sides barcode scanning lens assembly 3-2 are respectively arranged with the first die bond mechanism 3-10 and the second die bond mechanism 3-11, institute
It states first other sides die bond mechanism 3-10 and is provided with first and take brilliant lens assembly 3-6, the other sides second die bond mechanism 3-11
It is provided with second and takes brilliant lens assembly 3-7, be provided with the first ejector pin component 3-8 below the described first brilliant ring mobile platform 3-4, separately
Side is provided with first from brilliant ring assemblies 3-12 is moved, and the second thimble group is provided with below the described second brilliant ring mobile platform 3-5
Part 3-9, the other side are provided with second and move brilliant ring assemblies 3-13 certainly.
The jig platform 3-1 includes the first laterally driven component 3-1-1 being laterally arranged, described first laterally driven group
It is vertically arranged on part 3-1-1 on first longitudinal direction drive component 3-1-2, the first longitudinal direction drive component 3-1-2 and is provided with skin
Band conveying assembly 3-1-3.The Belt Conveying component 3-1-3 utilizes the described first laterally driven component 3-1-1 and first longitudinal direction
Drive component 3-1-2 carries out lateral longitudinal movement, to drive LED support disposed thereon to be moved to designated position.
The barcode scanning lens assembly 3-2 includes barcode scanning lens mount 3-2-1, barcode scanning camera lens 3-2-2, barcode scanning camera 3-2-3, institute
Barcode scanning camera lens 3-2-2 and barcode scanning camera 3-2-3 cooperations are stated for assisting the jig platform 3-1 to drive the LED support movement
To designated position, then the identification of Quick Response Code on LED support is carried out, to read the information of the LED support.
The die bond lens assembly 3-3 includes die bond lens mount 3-3-1, die bond camera lens 3-3-2, die bond camera 3-3-3,
By die bond camera lens 3-3-2 and the 3-3-3 cooperations of die bond camera for assisting the jig platform 3-1 that the LED support is driven to move
It moves to designated position, and obtains the distributed image of LED on LED support.
Described first takes brilliant lens assembly 3-6 consistent with die bond lens assembly 3-3 structures, is used to assist first crystalline substance
Ring mobile platform 3-4 drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distribution of LED wafer on the crystalline substance ring
Image；
Described second takes brilliant lens assembly 3-7 consistent with die bond lens assembly 3-3 structures, is used to assist second crystalline substance
Ring mobile platform 3-5 drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distribution of LED wafer on the crystalline substance ring
Image.
The first crystalline substance ring mobile platform 3-4 includes the second laterally driven component 3-4-1 being laterally arranged, and described second is horizontal
It is vertically arranged on drive component 3-4-1 on second longitudinal direction drive component 3-4-2, the second longitudinal direction drive component 3-4-2
It is provided with the first brilliant ring transition plate 3-4-3, the first brilliant ring rotary components 3-4- is provided on the described first brilliant ring transition plate 3-4-3
The first brilliant ring 3-4-5 for carrying LED wafer is placed on 4, the described first brilliant ring rotary components 3-4-4.Described first is brilliant
Ring rotary components 3-4-4 carries out laterally longitudinal fortune using the second laterally driven component 3-4-1 and second longitudinal direction drive component 3-4-2
It is dynamic, to drive the first crystalline substance ring 3-4-5 disposed thereon to be moved to designated position, then the first crystalline substance ring rotary components 3-4-
4 drive the correction of the first brilliant ring 3-4-5 rotations progress chip.
The second crystalline substance ring mobile platform 3-5 is consistent with the first brilliant ring mobile platform 3-4 structures, is used to drive positioned at it
On the movement of brilliant ring and automatically correcting for chip on brilliant ring.
The first ejector pin component 3-8 includes the first thimble drive component 3-8-1 and the first thimble 3-8-2.Described first
Thimble drive component 3-8-1 is for driving the first thimble 3-8-2 vertical motions, to push up the LED wafer specified from brilliant ring
Go out.
The second ejector pin component 3-9 is consistent with the first ejector pin component 3-8 structures, is used to eject and be moved positioned at the second brilliant ring
The specified LED wafer of brilliant ring is ejected from brilliant ring on moving platform 3-5.
First die bond mechanism 3-10 includes vertically arranged the first drive component 3-10-1, second driving of being laterally arranged
Dynamic component 3-10-2 and the first die bond swing arm 3-10-3 being set on the first drive component 3-10-1.First driving group
Part 3-10-1 is for driving the first die bond swing arm 3-10-3 to rotate horizontally, and the second drive component 3-10-2 is for driving first
Die bond swing arm 3-10-3 moves up and down.
Second die bond mechanism is consistent with the first die bond mechanism structure, is used to be ejected by the second ejector pin component
The absorption and carrying of LED wafer.
Described first includes the first brilliant ring gripper assembly 3-12-1, the described first brilliant ring gripping from brilliant ring assemblies 3-12 is moved
The sides component 3-12-1 are provided with the first brilliant ring storage assembly 3-12-2, are arranged below the described first brilliant ring storage assembly 3-12-2
There is the first brilliant loopback to receive component 3-12-3.Described first brilliant ring storage assembly 3-12-2 is used for the storage of brilliant ring, and described first is brilliant
It is flat to be carried to the first brilliant ring movement from the described first brilliant brilliant ring of ring storage assembly 3-12-2 grippings by ring gripper assembly 3-12-1
On platform 3-4, after the LED wafer on the crystalline substance ring exhausts, the first crystalline substance ring gripper assembly 3-12-1 is carried to again
First brilliant loopback is received in component 3-12-3.
Described second is consistent from brilliant ring assemblies 3-12 structures are moved with first from brilliant ring assemblies 3-13 is moved, and is used for second
The automatic charging of brilliant ring mobile platform and automatic recycling.
The receiving mechanism 4 includes rewinding connection platform 4-1, and the sides rewinding connection platform 4-1 are provided with magazine storage group
Part 4-2.For being docked with other boards, the magazine storage assembly 4-2 is completed admittedly the rewinding connection platform 4-1 for receiving
Brilliant LED support.
The present invention also provides a kind of methods carrying out continuous LED die bonds using above-mentioned double end line bonder comprising with
Lower step：
LED support in storing component is delivered to jig platform by step 1, first, the feeding material component, or is passed through
The LED support of a upper process is directly delivered to jig platform by connection platform.
Step 2, then, the jig platform fix the LED support, then the LED support disposed thereon is driven to transport
It moves below the barcode scanning lens assembly, the identification of Quick Response Code is carried out by barcode scanning lens assembly.The die bond lens assembly association
Help the jig platform that the LED support disposed thereon is driven to be moved to die bond position.
Step 3, then, described first takes brilliant lens assembly and second that brilliant lens assembly is taken to assist first crystalline substance respectively
Ring mobile platform and the second brilliant ring mobile platform drive brilliant ring disposed thereon to be moved to designated position and be corrected, and described the
One ejector pin component and the second ejector pin component respectively eject the LED wafer specified in the brilliant ring being positioned above, and described first is solid
Brilliant mechanism and the second die bond mechanism draw the LED wafer being ejected respectively again, and are alternately carried on the LED support
Designated position, completes die bond, and die bond information to the storage device that the die bond camera lens transmits the LED support is stored.
Step 4, secondly, the LED support are completed to be delivered to by the jig platform after the die bond of this kind of chip next solid
Brilliant unit.
Step 5 repeats Step 2: step 3 and step 4, complete the fixation of all kinds LED wafer.
Finally, it is received by the magazine storage assembly, or subsequent processing is delivered to by the rewinding connection platform.
In conclusion the full-automatic bonders of mini-LED and its die-bonding method of the present invention reduce the transfer of multiple die bond
Link greatly improves work efficiency, and uses Liang Ge die bonds mechanism alternately to carry out die bond to same LED support, greatly speeds up
Die bond speed, further improves working efficiency.In addition, its is compact-sized, floor space is greatly saved.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every profit
The equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other phases
The technical field of pass, is included within the scope of the present invention.
Claims (10)
- The full-automatic bonders of 1.mini-LED, it is characterised in that：The LED bonders include platen and are respectively arranged at the platen The feeding mechanism and receiving mechanism at both ends are equipped with multiple die bond units between the feeding mechanism and receiving mechanism；The feeding mechanism includes storing component, and storing component rear end is provided with feeding material component, and the feeding material component is used for LED support on storing component is pushed to and the die bond unit on storing component adjacent, the setting of storing component side There is connection platform, the connection platform with other boards for docking；The die bond unit includes fixture mobile platform, portal frame, the first brilliant ring mobile platform, the second brilliant ring mobile platform, consolidates Brilliant lens assembly, barcode scanning lens assembly, the first die bond mechanism, the second die bond mechanism, first take brilliant lens assembly, second to take brilliant mirror Head assembly, the first ejector pin component, first move brilliant ring assemblies, the folder certainly from brilliant ring assemblies, the second ejector pin component, second is moved Portal frame is provided with above tool mobile platform, both sides are respectively arranged with the first brilliant ring mobile platform and the second brilliant ring movement is flat Platform, being arranged side by side on the portal frame and above jig platform has die bond lens assembly and barcode scanning lens assembly, described solid Brilliant lens assembly and barcode scanning lens assembly both sides are respectively arranged with the first die bond mechanism and the second die bond mechanism, first die bond The mechanism other side is provided with first and brilliant lens assembly, second die bond mechanism other side is taken to be provided with second and take brilliant lens group Part, the described first brilliant ring mobile platform lower section are provided with the first ejector pin component, and the other side is provided with first and moves brilliant ring assemblies certainly, The second ejector pin component is provided with below described second brilliant ring mobile platform, the other side is provided with second and moves brilliant ring assemblies certainly；The receiving mechanism includes rewinding connection platform, and rewinding connection platform side is provided with magazine storage assembly；The rewinding Connection platform with external board for docking, and the magazine storage assembly is for receiving the LED support that die bond is completed.
- 2. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that the storing component includes storing Mounting base, storing motor, lead screw, supporting plate, magazine, storing motor is provided in the storing mounting base, and the storing motor connects It is connected to lead screw, the lead screw is connected with supporting plate, the magazine for storing LED support is provided on the supporting plate；The storing electricity Machine drives the supporting plate to carry out vertical motion by lead screw, to drive the magazine to move to designated position；The feeding material component includes feeding pedestal, feeding motor mounting base, feeding motor, idler wheel, push rod, metal plate cover, described to send It is provided with feeding motor mounting base on material pedestal, feeding motor, the feeding motor are provided in the feeding motor mounting base It is connected with idler wheel, the idler wheel is connected with push rod, the metal plate cover to shield, the feeding are additionally provided with above the push rod Motor drives idler wheel rotation, to drive push rod level to move forward and backward the push of progress LED support；The connection platform includes connection platform pedestal, guide plate, driving wheel, driven wheel, connection platform motor, belt, the connection platform Guide plate is provided on pedestal, centre is provided with driving wheel on the guide plate, and both ends are each provided with a driven wheel, described Driving wheel is connected with connection platform motor, and belt is arranged on the driving wheel and driven wheel；Described in the connection platform motor driving Driving wheel rotates, and to drive the belt to be rotated on the driving wheel and driven wheel, and then drives the LED on the belt Holder moves.
- 3. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that the jig platform includes laterally The first laterally driven component, first longitudinal direction drive component, the Belt Conveying component being arranged are indulged on the first laterally driven component To first longitudinal direction drive component is provided with, Belt Conveying component is provided on the first longitudinal direction drive component；The belt is defeated Sending component carries out lateral longitudinal movement using the described first laterally driven component and first longitudinal direction drive component, to drive LED Holder is moved to designated position.
- 4. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that the barcode scanning lens assembly includes Barcode scanning lens mount, barcode scanning camera lens, barcode scanning camera, barcode scanning camera lower end connect barcode scanning camera lens, and barcode scanning lens mount side connects Barcode scanning camera, the barcode scanning camera lens and the cooperation of barcode scanning camera are connect for assisting the jig platform to drive the LED support movement To designated position, then the identification of Quick Response Code on LED support is carried out, to read the information of the LED support.
- 5. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that the die bond lens assembly includes Die bond lens mount, die bond camera lens, die bond camera, die bond camera lower end connect die bond camera lens, and die bond lens mount side connects The die bond camera is connect, the jig platform is driven the LED branch by the die bond camera lens and the cooperation of die bond camera for assisting Frame is moved to designated position, and obtains the distributed image of LED on LED support；Described first takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described first brilliant ring mobile platform It drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring；Described second takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described second brilliant ring mobile platform It drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring.
- 6. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that the described first brilliant ring mobile platform The second laterally driven component, second longitudinal direction drive component, the first brilliant ring transition plate including being laterally arranged, the first brilliant ring rotation group Part, the first brilliant ring are vertically arranged with second longitudinal direction drive component, the second longitudinal direction driving on the second laterally driven component It is provided with the first brilliant ring transition plate on component, is provided with the first brilliant ring rotary components on the described first brilliant ring transition plate, described the The brilliant ring for carrying LED wafer is placed on one brilliant ring rotary components；Described first brilliant ring rotary components are lateral using second Drive component and second longitudinal direction drive component carry out lateral longitudinal movement, to drive brilliant ring disposed thereon to be moved to specific bit It sets, then the described first brilliant ring rotary components drive the correction of brilliant ring rotation progress chip；Described second brilliant ring mobile platform is consistent with the first brilliant ring mobile platform structure, is used to drive brilliant ring disposed thereon Chip automatically corrects on mobile and brilliant ring.
- 7. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that first ejector pin component includes First thimble drive component and the first thimble；The first thimble drive component is used to drive the first thimble vertical motion, to The specified LED wafer of brilliant ring on first brilliant ring mobile platform is ejected from brilliant ring；Second ejector pin component is consistent with the first ejector pin component structure, is used to eject brilliant on the second brilliant ring mobile platform The specified LED wafer of ring is ejected from brilliant ring.
- 8. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that first die bond mechanism includes It vertically arranged the first drive component, the second drive component being laterally arranged and is set on the first drive component first solid Brilliant swing arm；First drive component is for driving the first die bond swing arm to rotate horizontally, and second drive component is for driving First die bond swing arm moves up and down, to which the LED wafer specified to be carried on the LED support；Second die bond mechanism is consistent with the first die bond mechanism structure, and the LED for being used to be ejected by the second ejector pin component is brilliant The absorption and carrying of piece.
- 9. the full-automatic bonders of mini-LED according to claim 1, which is characterized in that described first moves brilliant ring group certainly Part includes the first brilliant ring gripper assembly, the first brilliant ring storage assembly, the first brilliant loopback receipts component, the described first brilliant ring gripper assembly Side is provided with the first brilliant ring storage assembly, and the first brilliant loopback is provided with below the described first brilliant ring storage assembly and receives component；Institute The storage that the first crystalline substance ring storage assembly is used for brilliant ring is stated, the described first brilliant ring gripper assembly is pressed from both sides from the described first brilliant ring storage assembly Brilliant ring is taken, is carried on the first brilliant ring mobile platform, after the LED wafer on the crystalline substance ring exhausts, described first is brilliant Ring gripper assembly is carried to the first brilliant loopback and is received in component again；Described second is consistent from brilliant ring assemblies structure is moved with first from brilliant ring assemblies are moved, and is used for the second brilliant ring mobile platform Automatic charging and automatic recycling.
- 10. a kind of die-bonding method with the full-automatic bonders of mini-LED described in any one of claim 1-9, feature exists In this approach includes the following steps：LED support in storing component is delivered to jig platform by step 1, first, the feeding material component, or by plugging into The LED support of a upper process is directly delivered to jig platform by platform；Step 2, then, the jig platform fix the LED support, then the LED support disposed thereon is driven to move to Below the barcode scanning lens assembly, the identification of Quick Response Code is carried out by barcode scanning lens assembly；The die bond lens assembly assists institute Stating jig platform drives the LED support disposed thereon to be moved to die bond position；Step 3, then, described first takes brilliant lens assembly and second to take brilliant lens assembly that the described first brilliant ring is assisted to move respectively Moving platform and the second brilliant ring mobile platform drive brilliant ring disposed thereon to be moved to designated position and be corrected, first top Needle assemblies and the second ejector pin component respectively eject the LED wafer specified in the brilliant ring being positioned above, first bonder Structure and the second die bond mechanism draw the LED wafer being ejected respectively again, and are alternately carried to specified on the LED support Position, completes die bond, and die bond information to the storage device that the die bond camera lens transmits the LED support is stored；Step 4, secondly, the LED support are completed to be delivered to next die bond list by the jig platform after the die bond of this kind of chip Member；Step 5 repeats Step 2: step 3 and step 4, complete the fixation of all kinds LED wafer；Finally, it is received by the magazine storage assembly, or subsequent processing is delivered to by the rewinding connection platform.
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| CN201810767038.XA CN108615804B (en) | 2018-07-12 | 2018-07-12 | Mini-LED full-automatic die bonder and die bonding method thereof |
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