CN208368542U - The full-automatic bonder of mini-LED - Google Patents
The full-automatic bonder of mini-LED Download PDFInfo
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- CN208368542U CN208368542U CN201821106927.3U CN201821106927U CN208368542U CN 208368542 U CN208368542 U CN 208368542U CN 201821106927 U CN201821106927 U CN 201821106927U CN 208368542 U CN208368542 U CN 208368542U
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- brilliant
- die bond
- brilliant ring
- led
- ring
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Abstract
The utility model discloses a kind of full-automatic bonder of mini-LED, which includes platen and the feeding mechanism and receiving mechanism for being respectively arranged at platen both ends, and multiple die bond units are equipped between the feeding mechanism and receiving mechanism.LED support is transported in die bond unit adjacent thereto by it by the feeding mechanism, each die bond unit is delivered to next die bond unit after completing die bond twice to LED support, die bond until completing LED support, the receiving mechanism receive the LED support that die bond is completed.The bonder is directed to the die bond mode that need to carry out the LED support of a variety of LED wafer die bonds, and compared with traditional die bond mode, which reduce the middle swivel links of multiple die bond, greatly improve production efficiency, and reduce fraction defective；Meanwhile it is compact-sized, land occupation it is smaller.
Description
Technical field
The utility model relates to LED processing technique fields, particularly relate to a kind of full-automatic bonder of mini-LED
And its die-bonding method.
Background technique
Light emitting diode (Light Emitting Diode, LED) is a kind of to convert electrical energy into shining for luminous energy
Element.The multiple fields such as LED product can be used for illuminating, show, signal designation.In recent years, with LED wafer and encapsulation technology
Progress, the LED spacing that cuttings is presented can be reduced, small space distance LED display screen can have higher resolution, and picture effect is more
It is good, therefore demand of the client to small space distance LED display screen is increasing.But small space distance LED display screen, due to the contracting of its spacing
Small, LED display of the same area, the LED quantity used is significantly increased, therefore has to the die bond speed of bonder higher
Requirement.Meanwhile it being used as display screen LED, each of which LED unit requires the LED wafer of fixed tri- kinds of brightness of R/G/B.
The die bond process of current existing LED bonder is: since LED wafer is usually to be concentrated to be sticked to crystalline substance by supplier
On ring film, therefore it is that ejector pin mechanism jacks up specified LED wafer from brilliant ring film first, is then drawn by die bond mechanism
The LED wafer being ejected, which is fixed on LED support, completes die bond.This working method is facing a variety of LED wafers of this fixation
Bracket when, it is of different sizes due to LED wafer, need more bonder coordinating operations.In this way, it need to pass through in repeatedly
Turn, so that working efficiency is slow；Meanwhile die bond individually is carried out for LED support by a die bond mechanism, low efficiency, speed is slow.
In view of the drawbacks described above and the market demand of the prior art, there is an urgent need to research and develop a kind of novel LED bonder.
Utility model content
Aiming at the shortcomings in the prior art, the technical problem to be solved by the present invention is to provide a kind of mini-LED
Full-automatic bonder and its die-bonding method.
In order to solve the above technical problems, the utility model is realized by following scheme: the full-automatic bonder of mini-LED
And its die-bonding method, the LED bonder include platen and the feeding mechanism and receiving mechanism for being set to the platen both ends, it is described
Multiple die bond units are equipped between feeding mechanism and receiving mechanism；
The feeding mechanism includes storing component, and storing component rear end is provided with feeding material component, the feeding material component
For the LED support on storing component to be pushed to and the die bond unit on storing component adjacent, storing component side
It is provided with connection platform, the connection platform with other boards for docking；
The die bond unit includes that fixture mobile platform, portal frame, the first brilliant ring mobile platform, the second brilliant ring are mobile flat
Platform, die bond lens assembly, barcode scanning lens assembly, the first die bond mechanism, the second die bond mechanism, first take brilliant lens assembly, second
Brilliant lens assembly, the first ejector pin component, first is taken to move brilliant ring assemblies certainly from brilliant ring assemblies, the second ejector pin component, second is moved,
Portal frame is provided with above the fixture mobile platform, two sides are respectively arranged with the first brilliant ring mobile platform and the second brilliant ring moves
Moving platform on the portal frame and is located to be arranged side by side above jig platform and has die bond lens assembly and barcode scanning lens assembly, institute
It states die bond lens assembly and barcode scanning lens assembly two sides is respectively arranged with the first die bond mechanism and the second die bond mechanism, described first
The die bond mechanism other side is provided with first and takes brilliant lens assembly, and second die bond mechanism other side is provided with second and takes brilliant camera lens
Component, the described first brilliant ring mobile platform lower section are provided with the first ejector pin component, and the other side is provided with first and moves brilliant ring group certainly
Part, the described second brilliant ring mobile platform lower section are provided with the second ejector pin component, and the other side is provided with second and moves brilliant ring assemblies certainly；
The receiving mechanism includes rewinding connection platform, and rewinding connection platform side is provided with magazine storage assembly；It is described
Rewinding connection platform with external board for docking, and the magazine storage assembly is for receiving the LED support that die bond is completed.
Further, the storing component includes storing mounting base, storing motor, screw rod, supporting plate, magazine, the storing
Storing motor is provided in mounting base, the storing motor is connected with screw rod, and the screw rod is connected with supporting plate, sets on the supporting plate
It is equipped with the magazine for storing LED support；The storing motor drives the supporting plate to carry out vertical motion by screw rod, thus band
It moves the magazine and moves to designated position；
The feeding material component includes feeding pedestal, feeding motor mounting base, feeding motor, idler wheel, push rod, metal plate cover, institute
It states and is provided with feeding motor mounting base on feeding pedestal, feeding motor, the feeding are provided in the feeding motor mounting base
Motor is connected with idler wheel, and the idler wheel is connected with push rod, is additionally provided with the metal plate cover to shield above the push rod, described
Feeding motor drives idler wheel rotation, so that push rod level be driven to move forward and backward the push for carrying out LED support；
The connection platform includes connection platform pedestal, guide plate, driving wheel, driven wheel, connection platform motor, belt, described to connect
It refutes and is provided with guide plate on platform pedestal, intermediate on the guide plate to be provided with driving wheel, both ends are each provided with a driven wheel,
The driving wheel is connected with connection platform motor, is arranged with belt on the driving wheel and driven wheel；The connection platform motor driven
The driving wheel rotation, so that the belt be driven to rotate on the driving wheel and driven wheel, and then drives on the belt
LED bracket it is mobile.
Further, the jig platform include the first laterally driven component being laterally arranged, first longitudinal direction driving assembly,
Belt Conveying component, first longitudinal direction driving assembly is vertically arranged on the first laterally driven component, and the first longitudinal direction is driven
Belt Conveying component is provided on dynamic component；The Belt Conveying component utilizes the described first laterally driven component and first longitudinal direction
Driving assembly carries out lateral longitudinal movement, so that LED support be driven to be moved to designated position；
Further, the barcode scanning lens assembly includes barcode scanning lens mount, barcode scanning camera lens, barcode scanning camera, the barcode scanning phase
Machine lower end connects barcode scanning camera lens, and barcode scanning lens mount side connects barcode scanning camera, and the barcode scanning camera lens and barcode scanning camera, which are matched, to be shared
It drives the LED support to be moved to designated position in the assistance jig platform, then carries out the identification of two dimensional code on LED support,
Thus come the information for reading the LED support；
Further, the die bond lens assembly includes die bond lens mount, die bond camera lens, die bond camera, the die bond phase
Machine lower end connects die bond camera lens, and die bond lens mount side connects the die bond camera, and the die bond camera lens and die bond camera are matched
It shares and drives the LED support to be moved to designated position in the assistance jig platform, and obtain the distribution of LED on LED support
Image；
Described first takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described first brilliant ring mobile
Platform drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring；
Described second takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described second brilliant ring mobile
Platform drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring.
Further, the described first brilliant ring mobile platform includes the second laterally driven component being laterally arranged, second longitudinal direction
Driving assembly, the first brilliant ring transition plate, the first brilliant ring rotary components, the first brilliant ring, it is longitudinal on the second laterally driven component
It is provided with second longitudinal direction driving assembly, the first brilliant ring transition plate is provided on the second longitudinal direction driving assembly, described first is brilliant
It is provided with the first brilliant ring rotary components on ring transition plate, is placed on the described first brilliant ring rotary components for carrying LED wafer
The first brilliant ring；Described first brilliant ring rotary components are carried out laterally using the second laterally driven component and second longitudinal direction driving assembly
Longitudinal movement, so that the disposed thereon first brilliant ring be driven to be moved to designated position, then the described first brilliant ring rotary components band
Dynamic first brilliant ring rotation carries out the correction of chip；
Described second brilliant ring mobile platform is consistent with the first brilliant ring mobile platform structure, is used to drive crystalline substance disposed thereon
Chip automatically corrects in the movement of ring and brilliant ring.
Further, first ejector pin component includes the first thimble driving assembly and the first thimble；First thimble
Driving assembly is for driving the first thimble vertical motion, so that specified LED wafer be ejected from brilliant ring；
Second ejector pin component is consistent with the first ejector pin component structure, is used to eject positioned at the second brilliant ring mobile platform
The specified LED wafer of upper crystalline substance ring is ejected from brilliant ring.
Further, the second drive that first die bond mechanism includes the first vertically arranged driving assembly, is laterally arranged
Dynamic component and the first die bond swing arm being set on the first driving assembly；First driving assembly is for driving the first die bond
Swing arm rotates horizontally, and second driving assembly is for driving the first die bond swing arm to move up and down, thus by specified LED wafer
It is carried on the LED support；
Second die bond mechanism is consistent with the first die bond mechanism structure, is used to be ejected by the second ejector pin component
The absorption and carrying of LED wafer.
Further, described first from move brilliant ring assemblies include the first brilliant ring gripper assembly, the first brilliant ring storage assembly,
First brilliant loopback receives component, and the described first brilliant ring gripper assembly side is provided with the first brilliant ring storage assembly, the described first brilliant ring
It is provided with the first brilliant loopback below storage assembly and receives component；The first brilliant ring storage assembly is used for the storage of brilliant ring, and described the
One brilliant ring gripper assembly clamps brilliant ring from the described first brilliant ring storage assembly, is carried on the first brilliant ring mobile platform, institute
It states after the LED wafer on brilliant ring exhausts, the described first brilliant ring gripper assembly is carried to the first brilliant loopback again and receives component
It is interior；
Described second is consistent from brilliant ring assemblies structure is moved with first from brilliant ring assemblies are moved, and it is mobile to be used for the second brilliant ring
The automatic charging of platform and automatic recycling.
Compared with the existing technology, the beneficial effects of the utility model are:
1, for the LED support that need to consolidate a variety of LED wafers, which realizes line compared with traditional bonder
Die bond operation, and the middle swivel link of multiple die bond is eliminated, it greatly improves work efficiency.
2, it is directed to a LED support alternately die bond by Liang Ge die bond mechanism, greatly accelerates LED support die bond
Speed is completed, working efficiency is further improved.
3, its described feeding mechanism and receiving mechanism can all be docked with other boards, eliminate the transhipment of material, greatly
Cost of labor is saved greatly.
4, the die bond information of its LED support stored by the storage device, and the information can be shared to local area network
Or wide area network reads for other terminating machines and uses, so that subsequent handling can carry out the selection of LED according to the information, this mode is grasped
Make simply, it is convenient for management, working efficiency can be effectively improved.
5, its is compact-sized, saves production site for enterprise, can effectively improve the performance of enterprises.
Detailed description of the invention
Fig. 1 is the full-automatic bonder of mini-LED of the utility model and its structural schematic diagram of die-bonding method.
Fig. 2 is the full-automatic bonder of mini-LED of the utility model and its perspective view of the explosion of die-bonding method.
Fig. 3 is the structural representation of the full-automatic bonder of mini-LED of the utility model and its feeding mechanism of die-bonding method
Figure.
Fig. 4 is the storing component of the full-automatic bonder of mini-LED of the utility model and its feeding mechanism of die-bonding method
Structural schematic diagram.
Fig. 5 is the feeding material component of the full-automatic bonder of mini-LED of the utility model and its feeding mechanism of die-bonding method
Structural schematic diagram.
Fig. 6 is the connection platform knot of the full-automatic bonder of mini-LED of the utility model and its feeding mechanism of die-bonding method
Structure schematic diagram.
Fig. 7 is the structural representation of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
Figure.
Fig. 8 is the jig platform of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
Structural schematic diagram.
Fig. 9 is the barcode scanning camera lens of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
The structural schematic diagram of component.
Figure 10 is the die bond mirror of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
Head assembly structural schematic diagram.
Figure 11 is the first crystalline substance of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
The structural schematic diagram of ring mobile platform.
Figure 12 is the first top of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
The structural schematic diagram of needle assemblies.
Figure 13 consolidates for the first of the full-automatic bonder of mini-LED of the utility model and its die bond unit of die-bonding method
The structural schematic diagram of brilliant mechanism.
Figure 14 be the utility model the full-automatic bonder of mini-LED and its die-bonding method die bond unit first from
Move the structural schematic diagram of brilliant ring assemblies.
Figure 15 shows for the structure of the full-automatic bonder of mini-LED of the utility model and its receiving mechanism of die-bonding method
It is intended to.
Specific embodiment
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model
It can be easier to be readily appreciated by one skilled in the art with feature, to make the protection scope of the utility model apparent clear
Define.
Fig. 1 to Figure 15 is please referred to, it is complete certainly to present embodiments provide the mini-LED that a kind of die bond speed is fast, work efficiency is high
Dynamic bonder and its die-bonding method.
The full-automatic bonder of mini-LED and its die-bonding method, including platen 1 and the both ends for being set to the platen 1 into
Expect mechanism 2 and receiving mechanism 4, multiple die bond units 3 are equipped between the feeding mechanism 2 and receiving mechanism 4.
The feeding mechanism 2 includes storing component 2-1, is provided with feeding material component 2-2 behind the storing component 2-1,
Side is provided with connection platform 2-3.The feeding material component 2-2 is used for pushing to for the LED support of storing component 2-1 is adjacent thereto
Die bond unit 3.The connection platform 2-3 for dock with other boards, by the LED support of the upper process of completion be delivered to and its
Adjacent die bond unit 3.
The storing component 2-1 includes storing mounting base 2-1-1, and storing electricity is provided on the storing mounting base 2-1-1
Machine 2-1-2, the storing motor 2-1-2 are connected with screw rod 2-1-3, and the screw rod 2-1-3 is connected with supporting plate 2-1-4, the support
The magazine 2-1-5 for storing LED support is provided on plate 2-1-4.The storing motor 2-1-3 is driven by screw rod 2-1-3
The supporting plate 2-1-4 carries out vertical motion, so that the magazine 2-1-5 be driven to move to designated position.
The feeding material component 2-2 includes feeding pedestal 2-2-1, and feeding motor peace is provided on the feeding pedestal 2-2-1
Seat 2-2-2 is filled, is provided with feeding motor 2-2-3, the feeding motor 2-2-3 connection on the feeding motor mounting base 2-2-2
There are idler wheel 2-2-4, the idler wheel 2-2-4 to be connected with push rod 2-2-5, is additionally provided with and shields above the push rod 2-2-5
Metal plate cover 2-2-6.The feeding motor 2-2-3 driving idler wheel 2-2-4 rotation, to drive the horizontal front and back fortune of push rod 2-2-5
The dynamic push for carrying out LED support.
The connection platform 2-3 includes connection platform pedestal 2-3-1, is provided with guide plate 2- on the connection platform pedestal 2-3-1
Intermediate on 3-2, the guide plate 2-3-2 to be provided with driving wheel 2-3-3, both ends are each provided with a driven wheel 2-3-4, the master
Driving wheel 2-3-4 is connected with connection platform motor 2-3-5, is arranged with belt 2-3- on the driving wheel 2-3-3 and driven wheel 2-3-4
6.The connection platform motor 2-3-5 drives the driving wheel 2-3-3 rotation, to drive the belt 2-3-6 in the active
It is rotated on wheel 2-3-3 and driven wheel 2-3-4, and then drives the LED support on the belt 2-3-6 mobile.
The die bond unit 3 includes fixture mobile platform 3-1, is provided with portal frame above the fixture mobile platform 3-1
3-14, two sides are respectively arranged with the brilliant ring mobile platform 3-5, the portal frame 3-14 of the first crystalline substance ring mobile platform 3-4 and second
Being arranged side by side above and above jig platform 3-1 has die bond lens assembly 3-3 and barcode scanning lens assembly 3-2, the die bond mirror
Head assembly 3-3 and the two sides barcode scanning lens assembly 3-2 are respectively arranged with the first die bond mechanism 3-10 and the second die bond mechanism 3-11,
The other side first die bond mechanism 3-10 is provided with first and takes brilliant lens assembly 3-6, and second die bond mechanism 3-11 is another
Side is provided with second and takes brilliant lens assembly 3-7, is provided with the first ejector pin component 3-8 below the described first brilliant ring mobile platform 3-4,
The other side is provided with first from brilliant ring assemblies 3-12 is moved, and is provided with the second thimble below the described second brilliant ring mobile platform 3-5
Component 3-9, the other side are provided with second and move brilliant ring assemblies 3-13 certainly.
The jig platform 3-1 includes the first laterally driven component 3-1-1 being laterally arranged, and described first laterally driven group
It is vertically arranged with first longitudinal direction driving assembly 3-1-2 on part 3-1-1, is provided with skin on the first longitudinal direction driving assembly 3-1-2
Band conveying assembly 3-1-3.The Belt Conveying component 3-1-3 utilizes the described first laterally driven component 3-1-1 and first longitudinal direction
Driving assembly 3-1-2 carries out lateral longitudinal movement, so that LED support disposed thereon be driven to be moved to designated position.
The barcode scanning lens assembly 3-2 includes barcode scanning lens mount 3-2-1, barcode scanning camera lens 3-2-2, barcode scanning camera 3-2-3, institute
Barcode scanning camera lens 3-2-2 and barcode scanning camera 3-2-3 cooperation is stated for assisting the jig platform 3-1 to drive the LED support mobile
To designated position, then the identification of two dimensional code on LED support is carried out, thus to read the information of the LED support.
The die bond lens assembly 3-3 includes die bond lens mount 3-3-1, die bond camera lens 3-3-2, die bond camera 3-3-3,
By die bond camera lens 3-3-2 and die bond camera 3-3-3 cooperation for assisting the jig platform 3-1 that the LED support is driven to move
It moves to designated position, and obtains the distributed image of LED on LED support.
Described first takes brilliant lens assembly 3-6 consistent with die bond lens assembly 3-3 structure, is used to assist first crystalline substance
Ring mobile platform 3-4 drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distribution of LED wafer on the crystalline substance ring
Image；
Described second takes brilliant lens assembly 3-7 consistent with die bond lens assembly 3-3 structure, is used to assist second crystalline substance
Ring mobile platform 3-5 drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distribution of LED wafer on the crystalline substance ring
Image.
The first crystalline substance ring mobile platform 3-4 includes the second laterally driven component 3-4-1 being laterally arranged, and described second is horizontal
Second longitudinal direction driving assembly 3-4-2 is vertically arranged on driving assembly 3-4-1, on the second longitudinal direction driving assembly 3-4-2
It is provided with the first brilliant ring transition plate 3-4-3, the first brilliant ring rotary components 3-4- is provided on the described first brilliant ring transition plate 3-4-3
The first brilliant ring 3-4-5 for carrying LED wafer is placed on 4, the described first brilliant ring rotary components 3-4-4.Described first is brilliant
Ring rotary components 3-4-4 carries out laterally longitudinal fortune using the second laterally driven component 3-4-1 and second longitudinal direction driving assembly 3-4-2
It is dynamic, so that the first crystalline substance ring 3-4-5 disposed thereon be driven to be moved to designated position, then the first crystalline substance ring rotary components 3-4-
4 drive the correction of the first crystalline substance ring 3-4-5 rotation progress chip.
The second crystalline substance ring mobile platform 3-5 is consistent with the first brilliant ring mobile platform 3-4 structure, is used to drive positioned at it
On the movement of brilliant ring and automatically correcting for chip on brilliant ring.
The first ejector pin component 3-8 includes the first thimble driving assembly 3-8-1 and the first thimble 3-8-2.Described first
Thimble driving assembly 3-8-1 is for driving the first thimble 3-8-2 vertical motion, so that specified LED wafer be pushed up from brilliant ring
Out.
The second ejector pin component 3-9 is consistent with the first ejector pin component 3-8 structure, is used to eject and move positioned at the second brilliant ring
The specified LED wafer of brilliant ring is ejected from brilliant ring on moving platform 3-5.
The second drive that first die bond mechanism 3-10 includes the first vertically arranged driving assembly 3-10-1, is laterally arranged
Dynamic component 3-10-2 and the first die bond swing arm 3-10-3 being set on the first driving assembly 3-10-1.First driving group
Part 3-10-1 is for driving the first die bond swing arm 3-10-3 to rotate horizontally, and the second driving assembly 3-10-2 is for driving the
One die bond swing arm 3-10-3 moves up and down.
Second die bond mechanism is consistent with the first die bond mechanism structure, is used to be ejected by the second ejector pin component
The absorption and carrying of LED wafer.
Described first includes the first brilliant ring gripper assembly 3-12-1, the described first brilliant ring clamping from brilliant ring assemblies 3-12 is moved
The side component 3-12-1 is provided with the first brilliant ring storage assembly 3-12-2, sets below the described first brilliant ring storage assembly 3-12-2
It is equipped with the first brilliant loopback and receives component 3-12-3.Storage of the first crystalline substance ring storage assembly 3-12-2 for brilliant ring, described first
Brilliant ring gripper assembly 3-12-1 clamps brilliant ring from the first crystalline substance ring storage assembly 3-12-2, and it is mobile to be carried to the first brilliant ring
On platform 3-4, after the LED wafer on the crystalline substance ring exhausts, the first crystalline substance ring gripper assembly 3-12-1 is carried again
It is received in component 3-12-3 to the first brilliant loopback.
Described second is consistent from brilliant ring assemblies 3-12 structure is moved with first from brilliant ring assemblies 3-13 is moved, and is used for second
The automatic charging of brilliant ring mobile platform and automatic recycling.
The receiving mechanism 4 includes rewinding connection platform 4-1, and the side rewinding connection platform 4-1 is provided with magazine storage group
Part 4-2.For docking with other boards, the magazine storage assembly 4-2 is completed admittedly the rewinding connection platform 4-1 for receiving
Brilliant LED bracket.
The utility model also provides a kind of method for carrying out continuous LED die bond using above-mentioned double end line bonder, packet
Include following steps:
Step 1 firstly, the LED support in storing component is delivered to jig platform by the feeding material component, or passes through
The LED support of a upper process is directly delivered to jig platform by connection platform.
Step 2, then, the fixed LED support of the jig platform, then the LED support disposed thereon is driven to transport
It moves below the barcode scanning lens assembly, the identification of two dimensional code is carried out by barcode scanning lens assembly.The die bond lens assembly association
Help the jig platform that the LED support disposed thereon is driven to be moved to die bond position.
Step 3, then, described first takes brilliant lens assembly and second that brilliant lens assembly is taken to assist first crystalline substance respectively
Ring mobile platform and the second brilliant ring mobile platform drive brilliant ring disposed thereon to be moved to designated position and be corrected, and described the
One ejector pin component and the second ejector pin component respectively eject the LED wafer specified in the brilliant ring being positioned above, and described first is solid
Brilliant mechanism and the second die bond mechanism draw the LED wafer being ejected respectively again, and are alternately carried on the LED support
Designated position, completes die bond, and die bond information to the storage device that the die bond camera lens transmits the LED support is stored.
Step 4, secondly, the LED support complete to be delivered to by the jig platform after the die bond of this kind of chip it is next solid
Brilliant unit.
Step 5 repeats Step 2: step 3 and step 4, complete the fixation of all kinds LED wafer.
Finally, being received by the magazine storage assembly, or subsequent processing is delivered to by the rewinding connection platform.
In conclusion the full-automatic bonder of the mini-LED of the utility model and its die-bonding method reduce multiple die bond
Middle swivel link, greatly improves work efficiency, and uses Liang Ge die bond mechanism alternately to carry out die bond to same LED support, significantly
Die bond speed is accelerated, working efficiency is further improved.In addition, its is compact-sized, occupied area is greatly saved.
Above description is merely a prefered embodiment of the utility model, is not intended to limit the patent model of the utility model
Enclose, equivalent structure or equivalent flow shift made by using the description of the utility model and the drawings, or directly or
It connects and is used in other relevant technical fields, be also included in the patent protection scope of the utility model.
Claims (9)
- The full-automatic bonder of 1.mini-LED, it is characterised in that: the LED bonder includes platen and is respectively arranged at the platen The feeding mechanism and receiving mechanism at both ends are equipped with multiple die bond units between the feeding mechanism and receiving mechanism；The feeding mechanism includes storing component, and storing component rear end is provided with feeding material component, and the feeding material component is used for LED support on storing component is pushed to and the die bond unit on storing component adjacent, the setting of storing component side There is connection platform, the connection platform with other boards for docking；The die bond unit includes fixture mobile platform, portal frame, the first brilliant ring mobile platform, the second brilliant ring mobile platform, consolidates Brilliant lens assembly, barcode scanning lens assembly, the first die bond mechanism, the second die bond mechanism, first take brilliant lens assembly, second to take brilliant mirror Head assembly, the first ejector pin component, first are from brilliant ring assemblies, the second ejector pin component, second is moved from moving brilliant ring assemblies, the folder Portal frame is provided with above tool mobile platform, two sides are respectively arranged with the first brilliant ring mobile platform and the second brilliant ring is mobile flat Platform on the portal frame and is located to be arranged side by side above jig platform and has die bond lens assembly and barcode scanning lens assembly, described solid Brilliant lens assembly and barcode scanning lens assembly two sides are respectively arranged with the first die bond mechanism and the second die bond mechanism, first die bond The mechanism other side is provided with first and takes brilliant lens assembly, and second die bond mechanism other side is provided with second and takes brilliant lens group Part, the described first brilliant ring mobile platform lower section are provided with the first ejector pin component, and the other side is provided with first and moves brilliant ring assemblies certainly, The second ejector pin component is provided with below described second brilliant ring mobile platform, the other side is provided with second and moves brilliant ring assemblies certainly；The receiving mechanism includes rewinding connection platform, and rewinding connection platform side is provided with magazine storage assembly；The rewinding Connection platform with external board for docking, and the magazine storage assembly is for receiving the LED support that die bond is completed.
- 2. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that the storing component includes storing Mounting base, storing motor, screw rod, supporting plate, magazine, storing motor is provided in the storing mounting base, and the storing motor connects It is connected to screw rod, the screw rod is connected with supporting plate, the magazine for storing LED support is provided on the supporting plate；The storing electricity Machine drives the supporting plate to carry out vertical motion by screw rod, so that the magazine be driven to move to designated position；The feeding material component includes feeding pedestal, feeding motor mounting base, feeding motor, idler wheel, push rod, metal plate cover, described to send It is provided with feeding motor mounting base on material pedestal, feeding motor, the feeding motor are provided in the feeding motor mounting base It is connected with idler wheel, the idler wheel is connected with push rod, is additionally provided with the metal plate cover to shield, the feeding above the push rod Motor driven idler wheel rotation, so that push rod level be driven to move forward and backward the push for carrying out LED support；The connection platform includes connection platform pedestal, guide plate, driving wheel, driven wheel, connection platform motor, belt, the connection platform Guide plate is provided on pedestal, centre is provided with driving wheel on the guide plate, and both ends are each provided with a driven wheel, described Driving wheel is connected with connection platform motor, is arranged with belt on the driving wheel and driven wheel；Described in the connection platform motor driven Driving wheel rotation so that the belt be driven to rotate on the driving wheel and driven wheel, and then drives the LED on the belt Bracket is mobile.
- 3. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that the jig platform includes laterally The laterally driven component of first be arranged, first longitudinal direction driving assembly, Belt Conveying component are indulged on the first laterally driven component To first longitudinal direction driving assembly is provided with, Belt Conveying component is provided on the first longitudinal direction driving assembly；The belt is defeated Sending component carries out lateral longitudinal movement using the described first laterally driven component and first longitudinal direction driving assembly, to drive LED Bracket is moved to designated position.
- 4. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that the barcode scanning lens assembly includes Barcode scanning lens mount, barcode scanning camera lens, barcode scanning camera, barcode scanning camera lower end connect barcode scanning camera lens, and barcode scanning lens mount side connects Barcode scanning camera is connect, the barcode scanning camera lens and the cooperation of barcode scanning camera are for assisting the jig platform to drive the LED support mobile To designated position, then the identification of two dimensional code on LED support is carried out, thus to read the information of the LED support.
- 5. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that the die bond lens assembly includes Die bond lens mount, die bond camera lens, die bond camera, die bond camera lower end connect die bond camera lens, and die bond lens mount side connects The die bond camera is connect, the die bond camera lens and the cooperation of die bond camera are for assisting the jig platform to drive the LED support It is moved to designated position, and obtains the distributed image of LED on LED support；Described first takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described first brilliant ring mobile platform It drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring；Described second takes brilliant lens assembly consistent with die bond lens assembly structure, is used to assist the described second brilliant ring mobile platform It drives the brilliant ring disposed thereon to be moved to designated position, and obtains the distributed image of LED wafer on the crystalline substance ring.
- 6. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that the described first brilliant ring mobile platform The second laterally driven component, second longitudinal direction driving assembly, the first brilliant ring transition plate, the first brilliant ring rotation group including being laterally arranged Part, the first brilliant ring are vertically arranged with second longitudinal direction driving assembly, the second longitudinal direction driving on the second laterally driven component It is provided with the first brilliant ring transition plate on component, is provided with the first brilliant ring rotary components on the described first brilliant ring transition plate, described the The brilliant ring for carrying LED wafer is placed on one brilliant ring rotary components；Described first brilliant ring rotary components are lateral using second Driving assembly and second longitudinal direction driving assembly carry out lateral longitudinal movement, so that brilliant ring disposed thereon be driven to be moved to specific bit It sets, then the described first brilliant ring rotary components drive the correction of brilliant ring rotation progress chip；Described second brilliant ring mobile platform is consistent with the first brilliant ring mobile platform structure, is used to drive brilliant ring disposed thereon Chip automatically corrects on mobile and brilliant ring.
- 7. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that first ejector pin component includes First thimble driving assembly and the first thimble；The first thimble driving assembly is used to drive the first thimble vertical motion, thus The specified LED wafer of brilliant ring on first brilliant ring mobile platform is ejected from brilliant ring；Second ejector pin component is consistent with the first ejector pin component structure, is used to eject brilliant on the second brilliant ring mobile platform The specified LED wafer of ring is ejected from brilliant ring.
- 8. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that first die bond mechanism includes It vertically arranged the first driving assembly, the second driving assembly being laterally arranged and is set on the first driving assembly first solid Brilliant swing arm；First driving assembly is for driving the first die bond swing arm to rotate horizontally, and second driving assembly is for driving First die bond swing arm moves up and down, so that specified LED wafer is carried on the LED support；Second die bond mechanism is consistent with the first die bond mechanism structure, and the LED for being used to be ejected by the second ejector pin component is brilliant The absorption and carrying of piece.
- 9. the full-automatic bonder of mini-LED according to claim 1, which is characterized in that described first moves brilliant ring group certainly Part includes the first brilliant ring gripper assembly, the first brilliant ring storage assembly, the first brilliant loopback receipts component, the described first brilliant ring gripper assembly Side is provided with the first brilliant ring storage assembly, and the first brilliant loopback is provided with below the described first brilliant ring storage assembly and receives component；Institute The storage that the first crystalline substance ring storage assembly is used for brilliant ring is stated, the described first brilliant ring gripper assembly is pressed from both sides from the described first brilliant ring storage assembly Brilliant ring is taken, is carried on the first brilliant ring mobile platform, after the LED wafer on the crystalline substance ring exhausts, described first is brilliant Ring gripper assembly is carried to the first brilliant loopback again and is received in component；Described second is consistent from brilliant ring assemblies structure is moved with first from brilliant ring assemblies are moved, and is used for the second brilliant ring mobile platform Automatic charging and automatic recycling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821106927.3U CN208368542U (en) | 2018-07-12 | 2018-07-12 | The full-automatic bonder of mini-LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821106927.3U CN208368542U (en) | 2018-07-12 | 2018-07-12 | The full-automatic bonder of mini-LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208368542U true CN208368542U (en) | 2019-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821106927.3U Withdrawn - After Issue CN208368542U (en) | 2018-07-12 | 2018-07-12 | The full-automatic bonder of mini-LED |
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| Country | Link |
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| CN (1) | CN208368542U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615804A (en) * | 2018-07-12 | 2018-10-02 | 中山市新益昌自动化设备有限公司 | The full-automatic bonders of mini-LED and its die-bonding method |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN110534464B (en) * | 2019-09-27 | 2023-05-23 | 先进光电器材（深圳）有限公司 | Double-end die bonder |
-
2018
- 2018-07-12 CN CN201821106927.3U patent/CN208368542U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615804A (en) * | 2018-07-12 | 2018-10-02 | 中山市新益昌自动化设备有限公司 | The full-automatic bonders of mini-LED and its die-bonding method |
| CN108615804B (en) * | 2018-07-12 | 2023-08-22 | 中山市新益昌自动化设备有限公司 | Mini-LED full-automatic die bonder and die bonding method thereof |
| CN110534464B (en) * | 2019-09-27 | 2023-05-23 | 先进光电器材（深圳）有限公司 | Double-end die bonder |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
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