CN108615804B - Mini-LED full-automatic die bonder and die bonding method thereof - Google Patents
Mini-LED full-automatic die bonder and die bonding method thereof Download PDFInfo
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- CN108615804B CN108615804B CN201810767038.XA CN201810767038A CN108615804B CN 108615804 B CN108615804 B CN 108615804B CN 201810767038 A CN201810767038 A CN 201810767038A CN 108615804 B CN108615804 B CN 108615804B
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 72
- 235000012431 wafers Nutrition 0.000 claims abstract description 57
- 239000013078 crystal Substances 0.000 claims description 209
- 238000003860 storage Methods 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 42
- 238000011084 recovery Methods 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 9
- 210000001503 joint Anatomy 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 230000009993 protective function Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 14
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a mini-LED full-automatic die bonder and a die bonding method thereof. The LED bracket is conveyed into the adjacent die bonding units through the feeding mechanism, each die bonding unit completes die bonding of the LED bracket twice and then conveys the LED bracket to the next die bonding unit until die bonding of the LED bracket is completed, and the receiving mechanism receives the LED bracket after die bonding is completed. Compared with the traditional die bonding method, the die bonding machine reduces the transfer links of multiple die bonding, greatly improves the production efficiency and reduces the reject ratio aiming at the die bonding method of the LED bracket for die bonding of various LED wafers; meanwhile, the structure is compact, and the occupied area is small.
Description
Technical Field
The invention relates to the technical field of LED processing, in particular to a mini-LED full-automatic die bonder and a die bonding method thereof.
Background
A light emitting diode (Light Emitting Diode, LED) is a luminescent element that converts electrical energy into light energy. The LED product can be used in various fields of illumination, display, signal indication and the like. In recent years, with the progress of LED chips and packaging technology, the LED spacing for scribing can be reduced, and the small-spacing LED display screen can have higher resolution and better picture effect, so that the requirements of customers on the small-spacing LED display screen are increasing. However, the small-spacing LED display screen has a larger number of LEDs adopted by the LED display screen with the same area due to the reduced spacing, so that the die bonding speed of the die bonder is higher. Meanwhile, the LED unit is used as an LED for a display screen, and each LED unit needs to fix an LED wafer with three brightness of R/G/B.
The current die bonding process of the LED die bonder is as follows: because the LED wafers are generally adhered to the wafer ring film in a concentrated manner by a supplier, firstly, the designated LED wafers are jacked up from the wafer ring film by the ejector pin mechanism, and then the jacked LED wafers are sucked by the die bonding mechanism to be fixed on the LED support to finish die bonding. In this working mode, when the bracket for fixing a plurality of LED wafers faces, a plurality of die bonders are required to cooperate due to different sizes of the LED wafers. Therefore, the device needs to be transferred for a plurality of times, so that the working efficiency is low; meanwhile, the LED bracket is subjected to die bonding by a die bonding mechanism, so that the efficiency is low and the speed is low.
In view of the above-mentioned drawbacks and market demands of the prior art, there is an urgent need to develop a novel LED die bonder.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a mini-LED full-automatic die bonder and a die bonding method thereof.
In order to solve the technical problems, the invention is realized by the following scheme: the mini-LED full-automatic die bonder comprises a bedplate, a feeding mechanism and a receiving mechanism which are arranged at two ends of the bedplate, wherein a plurality of die bonding units are arranged between the feeding mechanism and the receiving mechanism;
the feeding mechanism comprises a storage component, a feeding component is arranged at the rear end of the storage component, the feeding component is used for pushing an LED bracket on the storage component to a die bonding unit adjacent to the storage component, a connection platform is arranged on one side of the storage component, and the connection platform is used for being in butt joint with other machine platforms;
the die bonding unit comprises a clamp moving platform, a portal frame, a first crystal ring moving platform, a second crystal ring moving platform, a die bonding lens assembly, a code scanning lens assembly, a first die bonding mechanism, a second die bonding mechanism, a first die bonding lens assembly, a second die bonding lens assembly, a first thimble assembly, a first automatic die changing ring assembly, a second thimble assembly and a second automatic die changing ring assembly, wherein the portal frame is arranged above the clamp moving platform, the first crystal ring moving platform and the second crystal ring moving platform are respectively arranged on two sides of the portal frame, the die bonding lens assembly and the code scanning lens assembly are arranged on the portal frame and above the clamp platform side by side, the first die bonding mechanism and the second die bonding mechanism are respectively arranged on two sides of the die bonding lens assembly and the code scanning lens assembly, the first die bonding lens assembly is arranged on the other side of the first die bonding mechanism, the second die bonding mechanism is arranged on the other side of the second die bonding mechanism, the first die bonding ring assembly is arranged below the first die bonding ring moving platform, the first die assembly is arranged on the other side of the second die bonding mechanism, the first die bonding ring assembly is arranged on the other side of the die bonding mechanism, the die bonding assembly is arranged on the second thimble assembly is arranged on the second die bonding mechanism, the die bonding assembly is arranged on the other side, and the die bonding assembly is automatically;
the material receiving mechanism comprises a material receiving and connecting table, and a material box storage assembly is arranged on one side of the material receiving and connecting table; the material receiving and connecting platform is used for being connected with an external machine in a butt joint mode, and the material box storage component is used for receiving the LED support after die bonding is completed.
Further, the storage assembly comprises a storage mounting seat, a storage motor, a screw rod, a supporting plate and a material box, wherein the storage motor is arranged on the storage mounting seat, the storage motor is connected with the screw rod, the screw rod is connected with the supporting plate, and the material box for storing the LED bracket is arranged on the supporting plate; the material storage motor drives the supporting plate to vertically move through the screw rod, so that the material box is driven to move to a designated position;
the feeding assembly comprises a feeding base, a feeding motor mounting seat, a feeding motor, rollers, a push rod and a metal plate cover, wherein the feeding motor mounting seat is arranged on the feeding base, the feeding motor is arranged on the feeding motor mounting seat, the feeding motor is connected with the rollers, the rollers are connected with the push rod, the metal plate cover with a protective function is further arranged above the push rod, and the rollers are driven to rotate by the feeding motor so as to drive the push rod to horizontally move back and forth to push the LED bracket;
the connecting platform comprises a connecting platform base, a guide plate, a driving wheel, driven wheels, a connecting platform motor and a belt, wherein the guide plate is arranged on the connecting platform base, the driving wheel is arranged in the middle of the guide plate, two driven wheels are respectively arranged at two ends of the guide plate, the driving wheel is connected with the connecting platform motor, and the belt is sleeved on the driving wheel and the driven wheels; the connection table motor drives the driving wheel to rotate, so that the belt is driven to rotate on the driving wheel and the driven wheel, and the LED support on the belt is driven to move.
Further, the clamp platform comprises a first transverse driving assembly, a first longitudinal driving assembly and a belt conveying assembly which are transversely arranged, wherein the first longitudinal driving assembly is longitudinally arranged on the first transverse driving assembly, and the belt conveying assembly is arranged on the first longitudinal driving assembly; the belt conveying assembly performs transverse and longitudinal movement by utilizing the first transverse driving assembly and the first longitudinal driving assembly, so that the LED bracket is driven to move to a designated position;
further, the code scanning lens assembly comprises a code scanning lens seat, a code scanning lens and a code scanning camera, the lower end of the code scanning camera is connected with the code scanning lens, the side of the code scanning lens seat is connected with the code scanning camera, the code scanning lens and the code scanning camera are matched to assist the clamp platform to drive the LED support to move to a designated position, and then two-dimensional code identification on the LED support is carried out, so that information of the LED support is read;
further, the die-bonding lens assembly comprises a die-bonding lens seat, a die-bonding lens and a die-bonding camera, the lower end of the die-bonding camera is connected with the die-bonding lens, the die-bonding lens seat side is connected with the die-bonding camera, and the die-bonding lens and the die-bonding camera are matched to assist the fixture platform to drive the LED bracket to move to a designated position and obtain a distribution image of LEDs on the LED bracket;
the first crystal taking lens component and the crystal fixing lens component are consistent in structure and are used for assisting the first crystal ring moving platform to drive the crystal ring positioned on the first crystal ring moving platform to move to a designated position and obtaining a distribution image of the LED wafers on the crystal ring;
the second crystal taking lens component is consistent with the crystal fixing lens component in structure and is used for assisting the second crystal ring moving platform to drive the crystal ring positioned on the second crystal ring moving platform to move to a designated position and acquiring a distribution image of the LED wafers on the crystal ring.
Further, the first crystal ring moving platform comprises a second transverse driving assembly, a second longitudinal driving assembly, a first crystal ring adapter plate, a first crystal ring rotating assembly and a first crystal ring which are transversely arranged, wherein the second longitudinal driving assembly is longitudinally arranged on the second transverse driving assembly, the first crystal ring adapter plate is arranged on the second longitudinal driving assembly, the first crystal ring rotating assembly is arranged on the first crystal ring adapter plate, and a first crystal ring for bearing an LED wafer is arranged on the first crystal ring rotating assembly; the first crystal ring rotating assembly performs transverse and longitudinal movement by utilizing the second transverse driving assembly and the second longitudinal driving assembly, so that the first crystal ring positioned on the first crystal ring rotating assembly is driven to move to a designated position, and then the first crystal ring rotating assembly drives the first crystal ring to rotate for correcting the wafer;
the second crystal ring moving platform is consistent with the first crystal ring moving platform in structure and is used for driving the crystal ring on the second crystal ring moving platform to move and automatically correcting the wafer on the crystal ring.
Further, the first thimble assembly comprises a first thimble driving assembly and a first thimble; the first thimble driving assembly is used for driving the first thimble to move vertically so as to eject the appointed LED wafer from the crystal ring;
the second thimble assembly is consistent with the first thimble assembly in structure and is used for ejecting the appointed LED wafer positioned on the crystal ring on the second crystal ring moving platform out of the crystal ring.
Further, the first die bonding mechanism comprises a first driving assembly arranged vertically, a second driving assembly arranged horizontally and a first die bonding swing arm arranged on the first driving assembly; the first driving assembly is used for driving the first die-bonding swing arm to horizontally rotate, and the second driving assembly is used for driving the first die-bonding swing arm to vertically move, so that the designated LED wafer is conveyed to the LED bracket;
the second die bonding mechanism is consistent with the first die bonding mechanism in structure and is used for sucking and carrying the LED wafer ejected by the second ejector pin assembly.
Further, the first automatic crystal ring replacing assembly comprises a first crystal ring clamping assembly, a first crystal ring storage assembly and a first crystal ring recovery assembly, wherein the first crystal ring storage assembly is arranged at one side of the first crystal ring clamping assembly, and the first crystal ring recovery assembly is arranged below the first crystal ring storage assembly; the first crystal ring storage component is used for storing crystal rings, the first crystal ring clamping component clamps the crystal rings from the first crystal ring storage component and conveys the crystal rings to the first crystal ring moving platform, and after all LED wafers on the crystal rings are used up, the first crystal ring clamping component conveys the crystal rings into the first crystal ring recovery component;
the second automatic crystal changing ring assembly is consistent with the first automatic crystal changing ring assembly in structure and is used for automatic feeding and automatic recovery of the second crystal ring moving platform.
The die bonding method of the mini-LED full-automatic die bonder and the die bonding method thereof comprises the following steps:
firstly, the feeding assembly conveys the LED support in the storage assembly to the clamp platform, or directly conveys the LED support in the previous procedure to the clamp platform through the connection platform;
secondly, the fixture platform fixes the LED bracket, and then drives the LED bracket positioned on the fixture platform to move below the code scanning lens assembly, and two-dimensional code recognition is carried out through the code scanning lens assembly; the die bonding lens assembly assists the clamp platform to drive the LED bracket positioned on the clamp platform to move to a die bonding position;
thirdly, the first crystal taking lens component and the second crystal taking lens component respectively assist the first crystal ring moving platform and the second crystal ring moving platform to drive the crystal ring positioned on the first crystal ring moving platform and the second crystal ring moving platform to move to a designated position and correct, the first thimble component and the second thimble component respectively eject the designated LED wafer in the crystal ring positioned above the first thimble component, the first crystal fixing mechanism and the second crystal fixing mechanism respectively absorb the ejected LED wafer and alternately convey the ejected LED wafer to the designated position on the LED support to finish crystal fixing, and the crystal fixing lens transmits crystal fixing information of the LED support to a storage device for storage;
secondly, after the LED bracket completes the die bonding of the wafer, the wafer is conveyed to a next die bonding unit by the clamp platform;
step five, repeating the step two, the step three and the step four to finish the fixation of all kinds of LED wafers;
finally, the material box storage component receives the material, or the material receiving and connecting platform conveys the material to the next working procedure.
Compared with the prior art, the invention has the beneficial effects that:
1. compared with the traditional die bonder, the die bonder realizes the wire bonding operation aiming at the LED bracket needing to bond various LED wafers, omits the transfer link of multiple die bonding and greatly improves the working efficiency.
2. According to the LED bracket fixing device, the two fixing mechanisms alternately fix the LED bracket, so that the LED bracket fixing completion speed is greatly increased, and the working efficiency is further improved.
3. The feeding mechanism and the receiving mechanism can be in butt joint with other machine stations, so that the material transfer is omitted, and the labor cost is greatly saved.
4. The LED chip fixing device has the advantages that the LED chip fixing information stored by the storage device can be shared to a local area network or a wide area network for reading by other terminals, so that the follow-up procedure can be used for selecting LEDs according to the information, the operation is simple, the management is convenient, and the working efficiency can be effectively improved.
5. The device has compact structure, saves production sites for enterprises, and can effectively improve the benefits of enterprises.
Drawings
Fig. 1 is a schematic structural diagram of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 2 is an exploded schematic view of the mini-LED full-automatic die bonder and the die bonding method thereof according to the present invention.
Fig. 3 is a schematic structural diagram of a feeding mechanism of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 4 is a schematic diagram of a storage component of a feeding mechanism of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 5 is a schematic diagram of a feeding assembly of a feeding mechanism of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 6 is a schematic diagram of a docking station structure of a feeding mechanism of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 7 is a schematic structural diagram of a die bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 8 is a schematic structural diagram of a fixture platform of a die bonding unit of the mini-LED full-automatic die bonder and the die bonding method thereof according to the present invention.
Fig. 9 is a schematic structural diagram of a code scanning lens assembly of a die bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 10 is a schematic diagram of a die bonding lens assembly of a die bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 11 is a schematic structural diagram of a first crystal ring moving platform of a die bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 12 is a schematic structural diagram of a first ejector pin assembly of a die bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 13 is a schematic structural diagram of a first die bonding mechanism of a die bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 14 is a schematic structural diagram of a first automatic die-changing ring assembly of a die-bonding unit of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Fig. 15 is a schematic structural diagram of a receiving mechanism of a mini-LED full-automatic die bonder and a die bonding method thereof according to the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Referring to fig. 1 to 15, the present embodiment provides a mini-LED full-automatic die bonder with fast die bonding speed and high working efficiency and a die bonding method thereof.
The mini-LED full-automatic die bonder and the die bonding method thereof comprise a bedplate 1, a feeding mechanism 2 and a receiving mechanism 4 which are arranged at two ends of the bedplate 1, wherein a plurality of die bonding units 3 are arranged between the feeding mechanism 2 and the receiving mechanism 4.
The feeding mechanism 2 comprises a storage component 2-1, a feeding component 2-2 is arranged behind the storage component 2-1, and a connection table 2-3 is arranged on one side of the feeding component. The feeding component 2-2 is used for pushing the LED support of the storage component 2-1 to the die bonding unit 3 adjacent to the LED support. The connection platform 2-3 is used for being connected with other machines in a butt joint mode, and the LED support after the last procedure is conveyed to the die bonding unit 3 adjacent to the LED support.
The storage assembly 2-1 comprises a storage mounting seat 2-1-1, a storage motor 2-1-2 is arranged on the storage mounting seat 2-1-1, the storage motor 2-1-2 is connected with a screw rod 2-1-3, the screw rod 2-1-3 is connected with a supporting plate 2-1-4, and a material box 2-1-5 for storing an LED bracket is arranged on the supporting plate 2-1-4. The material storage motor 2-1-3 drives the supporting plate 2-1-4 to vertically move through the screw rod 2-1-3, so that the material box 2-1-5 is driven to move to a designated position.
The feeding assembly 2-2 comprises a feeding base 2-2-1, a feeding motor mounting seat 2-2-2 is arranged on the feeding base 2-2-1, a feeding motor 2-2-3 is arranged on the feeding motor mounting seat 2-2, the feeding motor 2-2-3 is connected with a roller 2-2-4, the roller 2-2-4 is connected with a push rod 2-2-5, and a sheet metal cover 2-2-6 with a protection function is further arranged above the push rod 2-2-5. The feeding motor 2-2-3 drives the roller 2-2-4 to rotate, so that the push rod 2-2-5 is driven to horizontally move back and forth to push the LED bracket.
The connecting table 2-3 comprises a connecting table base 2-3-1, a guide plate 2-3-2 is arranged on the connecting table base 2-3-1, a driving wheel 2-3-3 is arranged in the middle of the guide plate 2-3-2, driven wheels 2-3-4 are respectively arranged at two ends of the guide plate, the driving wheel 2-3-4 is connected with a connecting table motor 2-3-5, and belts 2-3-6 are sleeved on the driving wheel 2-3-3 and the driven wheels 2-3-4. The motor 2-3-5 of the connection table drives the driving wheel 2-3-3 to rotate, so that the belt 2-3-6 is driven to rotate on the driving wheel 2-3-3 and the driven wheel 2-3-4, and then the LED support on the belt 2-3-6 is driven to move.
The die bonding unit 3 comprises a clamp moving platform 3-1, a portal frame 3-14 is arranged above the clamp moving platform 3-1, a first crystal ring moving platform 3-4 and a second crystal ring moving platform 3-5 are respectively arranged on two sides of the portal frame, a die bonding lens component 3-3 and a code scanning lens component 3-2 are arranged on the portal frame 3-14 and above the clamp platform 3-1 side by side, a first crystal bonding mechanism 3-10 and a second crystal bonding mechanism 3-11 are respectively arranged on two sides of the die bonding lens component 3-3 and the code scanning lens component 3-2, a first crystal taking lens component 3-6 is arranged on the other side of the first crystal bonding mechanism 3-10, a second crystal taking lens component 3-7 is arranged on the other side of the second crystal bonding mechanism 3-11, a first crystal ring moving platform 3-4 is provided with a first ejector pin component 3-8 on the lower side, a first automatic crystal ring replacing component 3-12 is arranged on the other side, an automatic crystal ring replacing component 3-9 is arranged on the other side of the second crystal ring moving platform 3-5, and a second ejector pin component 3-13 is arranged on the other side.
The clamp platform 3-1 comprises a first transverse driving assembly 3-1-1 which is transversely arranged, a first longitudinal driving assembly 3-1-2 is longitudinally arranged on the first transverse driving assembly 3-1-1, and a belt conveying assembly 3-1-3 is arranged on the first longitudinal driving assembly 3-1-2. The belt conveying assembly 3-1-3 performs transverse and longitudinal movement by using the first transverse driving assembly 3-1-1 and the first longitudinal driving assembly 3-1-2, so that the LED bracket positioned on the belt conveying assembly is driven to move to a designated position.
The code scanning lens assembly 3-2 comprises a code scanning lens seat 3-2-1, a code scanning lens 3-2-2 and a code scanning camera 3-2-3, and the code scanning lens 3-2-2 and the code scanning camera 3-2-3 are matched to assist the clamp platform 3-1 to drive the LED support to move to a specified position, and then two-dimensional code identification on the LED support is carried out, so that information of the LED support is read.
The die bonding lens assembly 3-3 comprises a die bonding lens seat 3-3-1, a die bonding lens 3-3-2 and a die bonding machine 3-3-3, and the die bonding lens 3-3-2 and the die bonding machine 3-3 are matched to assist the fixture platform 3-1 to drive the LED support to move to a designated position, and obtain a distribution image of LEDs on the LED support.
The first crystal taking lens component 3-6 is consistent with the crystal fixing lens component 3-3 in structure, and is used for assisting the first crystal ring moving platform 3-4 to drive the crystal ring positioned on the first crystal ring moving platform to move to a designated position and obtaining a distribution image of LED wafers on the crystal ring;
the second crystal taking lens component 3-7 has the same structure as the crystal fixing lens component 3-3, and is used for assisting the second crystal ring moving platform 3-5 to drive the crystal ring positioned on the second crystal ring moving platform to move to a designated position and acquiring a distribution image of the LED wafers on the crystal ring.
The first crystal ring moving platform 3-4 comprises a second transverse driving assembly 3-4-1 which is transversely arranged, a second longitudinal driving assembly 3-4-2 is longitudinally arranged on the second transverse driving assembly 3-4-1, a first crystal ring adapter plate 3-4-3 is arranged on the second longitudinal driving assembly 3-4-2, a first crystal ring rotating assembly 3-4-4 is arranged on the first crystal ring adapter plate 3-4-3, and a first crystal ring 3-4-5 for bearing an LED wafer is arranged on the first crystal ring rotating assembly 3-4-4. The first crystal ring rotating assembly 3-4-4 performs transverse and longitudinal movement by using the second transverse driving assembly 3-4-1 and the second longitudinal driving assembly 3-4-2, so as to drive the first crystal ring 3-4-5 positioned on the first crystal ring rotating assembly to move to a designated position, and then the first crystal ring rotating assembly 3-4-4 drives the first crystal ring 3-4-5 to rotate for correcting the wafer.
The second crystal ring moving platform 3-5 is consistent with the first crystal ring moving platform 3-4 in structure, and is used for driving the crystal ring arranged on the second crystal ring moving platform to move and automatically correcting the wafer on the crystal ring.
The first thimble assembly 3-8 comprises a first thimble driving assembly 3-8-1 and a first thimble 3-8-2. The first thimble driving assembly 3-8-1 is used for driving the first thimble 3-8-2 to move vertically, so that the appointed LED wafer is ejected out of the wafer ring.
The second thimble assembly 3-9 has the same structure as the first thimble assembly 3-8, and is used for ejecting the appointed LED wafer positioned on the crystal ring on the second crystal ring moving platform 3-5 out of the crystal ring.
The first die bonding mechanism 3-10 comprises a first driving assembly 3-10-1 arranged vertically, a second driving assembly 3-10-2 arranged transversely and a first die bonding swing arm 3-10-3 arranged on the first driving assembly 3-10-1. The first driving component 3-10-1 is used for driving the first die-bonding swing arm 3-10-3 to horizontally rotate, and the second driving component 3-10-2 is used for driving the first die-bonding swing arm 3-10-3 to vertically move.
The second die bonding mechanism is consistent with the first die bonding mechanism in structure and is used for sucking and carrying the LED wafer ejected by the second ejector pin assembly.
The first automatic crystal ring replacing assembly 3-12 comprises a first crystal ring clamping assembly 3-12-1, a first crystal ring storage assembly 3-12-2 is arranged on one side of the first crystal ring clamping assembly 3-12-1, and a first crystal ring recovery assembly 3-12-3 is arranged below the first crystal ring storage assembly 3-12-2. The first crystal ring storage component 3-12-2 is used for storing crystal rings, the first crystal ring clamping component 3-12-1 clamps crystal rings from the first crystal ring storage component 3-12-2 and conveys the crystal rings to the first crystal ring moving platform 3-4, and after all LED wafers on the crystal rings are used up, the first crystal ring clamping component 3-12-1 conveys the crystal rings into the first crystal ring recovery component 3-12-3.
The second automatic crystal changing ring assembly 3-13 is identical to the first automatic crystal changing ring assembly 3-12 in structure, and is used for automatic feeding and automatic recovery of the second crystal ring moving platform.
The material receiving mechanism 4 comprises a material receiving and connecting table 4-1, and a material box storage component 4-2 is arranged on one side of the material receiving and connecting table 4-1. The material receiving and connecting platform 4-1 is used for being in butt joint with other machine platforms, and the material box storage component 4-2 is used for receiving the LED support after die bonding is completed.
The invention also provides a method for continuously fixing LED crystals by adopting the double-head wire die bonder, which comprises the following steps:
firstly, the feeding assembly conveys the LED support in the storage assembly to the clamp platform, or directly conveys the LED support in the previous procedure to the clamp platform through the connection platform.
And secondly, fixing the LED bracket by the clamp platform, driving the LED bracket positioned on the clamp platform to move below the code scanning lens assembly, and recognizing the two-dimensional code through the code scanning lens assembly. The die bonding lens assembly assists the clamp platform to drive the LED support located on the clamp platform to move to a die bonding position.
And thirdly, respectively assisting the first crystal ring moving platform and the second crystal ring moving platform to drive the crystal ring positioned on the first crystal ring moving platform and the second crystal ring moving platform to move to a designated position and correct, respectively ejecting the designated LED wafer in the crystal ring positioned above the first ejector pin assembly and the second ejector pin assembly, respectively absorbing the ejected LED wafer by the first crystal fixing mechanism and the second crystal fixing mechanism, alternately carrying the ejected LED wafer to the designated position on the LED support, and completing crystal fixing, wherein the crystal fixing lens transmits crystal fixing information of the LED support to the storage device for storage.
And fourthly, conveying the LED bracket to a next die bonding unit by the clamp platform after die bonding of the wafer is completed.
And fifthly, repeating the second step, the third step and the fourth step to finish the fixation of all kinds of LED wafers.
Finally, the material box storage component receives the material, or the material receiving and connecting platform conveys the material to the next working procedure.
In summary, the mini-LED full-automatic die bonder and the die bonding method thereof reduce the transfer links of multiple die bonding, greatly improve the working efficiency, and adopt two die bonding mechanisms to alternately bond the same LED bracket, greatly accelerate the die bonding speed and further improve the working efficiency. In addition, the structure is compact, and the occupied area is greatly saved.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (10)
- Full-automatic die bonder of mini-LED, its characterized in that: the LED die bonder comprises a platen, and a feeding mechanism and a receiving mechanism which are respectively arranged at two ends of the platen, wherein a plurality of die bonders are arranged between the feeding mechanism and the receiving mechanism;the feeding mechanism comprises a storage component, a feeding component is arranged at the rear end of the storage component, the feeding component is used for pushing an LED bracket on the storage component to a die bonding unit adjacent to the storage component, a connection platform is arranged on one side of the storage component, and the connection platform is used for being in butt joint with other machine platforms;the die bonding unit comprises a clamp moving platform, a portal frame, a first crystal ring moving platform, a second crystal ring moving platform, a die bonding lens assembly, a code scanning lens assembly, a first die bonding mechanism, a second die bonding mechanism, a first die bonding lens assembly, a second die bonding lens assembly, a first thimble assembly, a first automatic die changing ring assembly, a second thimble assembly and a second automatic die changing ring assembly, wherein the portal frame is arranged above the clamp moving platform, the first crystal ring moving platform and the second crystal ring moving platform are respectively arranged on two sides of the portal frame, the die bonding lens assembly and the code scanning lens assembly are arranged on the portal frame and above the clamp platform side by side, the first die bonding mechanism and the second die bonding mechanism are respectively arranged on two sides of the die bonding lens assembly and the code scanning lens assembly, the first die bonding lens assembly is arranged on the other side of the first die bonding mechanism, the second die bonding mechanism is arranged on the other side of the second die bonding mechanism, the first die bonding ring assembly is arranged below the first die bonding ring moving platform, the first die assembly is arranged on the other side of the second die bonding mechanism, the first die bonding ring assembly is arranged on the other side of the die bonding mechanism, the die bonding assembly is arranged on the second thimble assembly is arranged on the second die bonding mechanism, the die bonding assembly is arranged on the other side, and the die bonding assembly is automatically;the material receiving mechanism comprises a material receiving and connecting table, and a material box storage assembly is arranged on one side of the material receiving and connecting table; the material receiving and connecting platform is used for being connected with an external machine in a butt joint mode, and the material box storage component is used for receiving the LED support after die bonding is completed.
- 2. The mini-LED full-automatic die bonder according to claim 1, wherein the storage assembly comprises a storage mounting seat, a storage motor, a screw rod, a supporting plate and a material box, wherein the storage motor is arranged on the storage mounting seat, the storage motor is connected with the screw rod, the screw rod is connected with the supporting plate, and the material box for storing an LED bracket is arranged on the supporting plate; the material storage motor drives the supporting plate to vertically move through the screw rod, so that the material box is driven to move to a designated position;the feeding assembly comprises a feeding base, a feeding motor mounting seat, a feeding motor, rollers, a push rod and a metal plate cover, wherein the feeding motor mounting seat is arranged on the feeding base, the feeding motor is arranged on the feeding motor mounting seat, the feeding motor is connected with the rollers, the rollers are connected with the push rod, the metal plate cover with a protective function is further arranged above the push rod, and the rollers are driven to rotate by the feeding motor so as to drive the push rod to horizontally move back and forth to push the LED bracket;the connecting platform comprises a connecting platform base, a guide plate, a driving wheel, driven wheels, a connecting platform motor and a belt, wherein the guide plate is arranged on the connecting platform base, the driving wheel is arranged in the middle of the guide plate, two driven wheels are respectively arranged at two ends of the guide plate, the driving wheel is connected with the connecting platform motor, and the belt is sleeved on the driving wheel and the driven wheels; the connection table motor drives the driving wheel to rotate, so that the belt is driven to rotate on the driving wheel and the driven wheel, and the LED support on the belt is driven to move.
- 3. The mini-LED full-automatic die bonder according to claim 1, wherein the clamp platform comprises a first transverse driving assembly, a first longitudinal driving assembly and a belt conveying assembly which are transversely arranged, wherein the first transverse driving assembly is longitudinally provided with the first longitudinal driving assembly, and the first longitudinal driving assembly is provided with the belt conveying assembly; the belt conveying assembly performs transverse and longitudinal movement by utilizing the first transverse driving assembly and the first longitudinal driving assembly, so that the LED bracket is driven to move to a designated position.
- 4. The mini-LED full-automatic die bonder of claim 1, wherein the code scanning lens assembly comprises a code scanning lens base, a code scanning lens and a code scanning camera, the lower end of the code scanning camera is connected with the code scanning lens, the side of the code scanning lens base is connected with the code scanning camera, the code scanning lens and the code scanning camera are matched to assist the clamp platform to drive the LED support to move to a designated position, and then two-dimensional code identification on the LED support is performed, so that information of the LED support is read.
- 5. The mini-LED full-automatic die bonder of claim 1, wherein the die bonding lens assembly comprises a die bonding lens base, a die bonding lens and a die bonding camera, the lower end of the die bonding lens is connected with the die bonding lens, the side of the die bonding lens base is connected with the die bonding camera, and the die bonding lens and the die bonding camera are matched to assist in driving the fixture platform to move the LED support to a specified position and acquire a distribution image of LEDs on the LED support;the first crystal taking lens component and the crystal fixing lens component are consistent in structure and are used for assisting the first crystal ring moving platform to drive the crystal ring positioned on the first crystal ring moving platform to move to a designated position and obtaining a distribution image of the LED wafers on the crystal ring;the second crystal taking lens component is consistent with the crystal fixing lens component in structure and is used for assisting the second crystal ring moving platform to drive the crystal ring positioned on the second crystal ring moving platform to move to a designated position and acquiring a distribution image of the LED wafers on the crystal ring.
- 6. The mini-LED full-automatic die bonder of claim 1, wherein the first die ring moving platform comprises a second transverse driving assembly, a second longitudinal driving assembly, a first die ring adapter plate, a first die ring rotating assembly and a first die ring which are transversely arranged, wherein the second transverse driving assembly is longitudinally provided with the second longitudinal driving assembly, the second longitudinal driving assembly is provided with the first die ring adapter plate, the first die ring adapter plate is provided with the first die ring rotating assembly, and the first die ring rotating assembly is provided with a die ring for bearing an LED wafer; the first crystal ring rotating assembly performs transverse and longitudinal movement by utilizing the second transverse driving assembly and the second longitudinal driving assembly, so that a crystal ring positioned on the first crystal ring rotating assembly is driven to move to a designated position, and then the first crystal ring rotating assembly drives the crystal ring to rotate for correcting a wafer;the second crystal ring moving platform is consistent with the first crystal ring moving platform in structure and is used for driving the crystal ring on the second crystal ring moving platform to move and automatically correcting the wafer on the crystal ring.
- 7. The mini-LED full-automatic die bonder of claim 1, wherein the first ejector pin assembly comprises a first ejector pin drive assembly and a first ejector pin; the first thimble driving assembly is used for driving the first thimble to move vertically, so that the appointed LED wafer of the crystal ring on the first crystal ring moving platform is ejected out of the crystal ring;the second thimble assembly is consistent with the first thimble assembly in structure and is used for ejecting the appointed LED wafer positioned on the crystal ring on the second crystal ring moving platform out of the crystal ring.
- 8. The mini-LED full-automatic die bonder of claim 1, wherein the first die bonding mechanism comprises a first drive assembly arranged vertically, a second drive assembly arranged horizontally, and a first die bonding swing arm arranged on the first drive assembly; the first driving assembly is used for driving the first die-bonding swing arm to horizontally rotate, and the second driving assembly is used for driving the first die-bonding swing arm to vertically move, so that the designated LED wafer is conveyed to the LED bracket;the second die bonding mechanism is consistent with the first die bonding mechanism in structure and is used for sucking and carrying the LED wafer ejected by the second ejector pin assembly.
- 9. The mini-LED full-automatic die bonder of claim 1, wherein the first automatic die change ring assembly comprises a first die ring clamping assembly, a first die ring storage assembly and a first die ring recovery assembly, wherein one side of the first die ring clamping assembly is provided with the first die ring storage assembly, and a first die ring recovery assembly is arranged below the first die ring storage assembly; the first crystal ring storage component is used for storing crystal rings, the first crystal ring clamping component clamps the crystal rings from the first crystal ring storage component and conveys the crystal rings to the first crystal ring moving platform, and after all LED wafers on the crystal rings are used up, the first crystal ring clamping component conveys the crystal rings into the first crystal ring recovery component;the second automatic crystal changing ring assembly is consistent with the first automatic crystal changing ring assembly in structure and is used for automatic feeding and automatic recovery of the second crystal ring moving platform.
- 10. A die bonding method of a mini-LED full-automatic die bonder according to any one of claims 1 to 9, comprising the steps of:firstly, the feeding assembly conveys the LED support in the storage assembly to the clamp platform, or directly conveys the LED support in the previous procedure to the clamp platform through the connection platform;secondly, the fixture platform fixes the LED bracket, and then drives the LED bracket positioned on the fixture platform to move below the code scanning lens assembly, and two-dimensional code recognition is carried out through the code scanning lens assembly; the die bonding lens assembly assists the clamp platform to drive the LED bracket positioned on the clamp platform to move to a die bonding position;thirdly, the first crystal taking lens component and the second crystal taking lens component respectively assist the first crystal ring moving platform and the second crystal ring moving platform to drive the crystal ring positioned on the first crystal ring moving platform and the second crystal ring moving platform to move to a designated position and correct, the first thimble component and the second thimble component respectively eject the designated LED wafer in the crystal ring positioned above the first thimble component, the first crystal fixing mechanism and the second crystal fixing mechanism respectively absorb the ejected LED wafer and alternately convey the ejected LED wafer to the designated position on the LED support to finish crystal fixing, and the crystal fixing lens transmits crystal fixing information of the LED support to a storage device for storage;secondly, after the LED bracket completes the die bonding of the wafer, the wafer is conveyed to a next die bonding unit by the clamp platform;step five, repeating the step two, the step three and the step four to finish the fixation of all kinds of LED wafers;finally, the material box storage component receives the material, or the material receiving and connecting platform conveys the material to the next working procedure.
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| CN109786311B (en) * | 2019-01-28 | 2020-04-03 | 深圳新益昌科技股份有限公司 | Mini-LED high-speed die bonder and die bonding method |
| CN110224052B (en) * | 2019-05-28 | 2024-02-06 | 深圳新益昌科技股份有限公司 | Double-swing-arm die bonding device for LED die bonding and die bonding method thereof |
| CN110165038B (en) * | 2019-05-28 | 2024-02-06 | 深圳新益昌科技股份有限公司 | Novel LED die bonder and die bonder method thereof |
| WO2020237497A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Double-swing-arm die-bonding device for led die bonding and die bonding method therefor |
| CN110148578A (en) * | 2019-06-28 | 2019-08-20 | 先进光电器材（深圳）有限公司 | Crystal solidifying apparatus |
| CN111490147B (en) * | 2020-04-21 | 2021-03-26 | 深圳新益昌科技股份有限公司 | Full-automatic planar IC die bonder and die bonding method |
| CN111584698B (en) * | 2020-05-21 | 2021-01-26 | 中山市新益昌自动化设备有限公司 | Die bonder |
| CN112436084B (en) * | 2020-11-29 | 2021-09-07 | 盐城东山精密制造有限公司 | LED high-speed die bonder and automatic feeding and discharging device thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8933473B1 (en) * | 2012-06-01 | 2015-01-13 | Valery Dubin | Method, apparatus and system for providing light source structures on a flexible substrate |
| CN106505141A (en) * | 2016-12-29 | 2017-03-15 | 深圳市微恒自动化设备有限公司 | A kind of bonder and die-bonding method |
| CN107369639A (en) * | 2017-07-27 | 2017-11-21 | 深圳市新益昌自动化设备有限公司 | A kind of line LED bonders |
| CN206921798U (en) * | 2017-07-27 | 2018-01-23 | 深圳市新益昌自动化设备有限公司 | A kind of line LED bonders |
| CN208368542U (en) * | 2018-07-12 | 2019-01-11 | 中山市新益昌自动化设备有限公司 | The full-automatic bonder of mini-LED |
-
2018
- 2018-07-12 CN CN201810767038.XA patent/CN108615804B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8933473B1 (en) * | 2012-06-01 | 2015-01-13 | Valery Dubin | Method, apparatus and system for providing light source structures on a flexible substrate |
| CN106505141A (en) * | 2016-12-29 | 2017-03-15 | 深圳市微恒自动化设备有限公司 | A kind of bonder and die-bonding method |
| CN107369639A (en) * | 2017-07-27 | 2017-11-21 | 深圳市新益昌自动化设备有限公司 | A kind of line LED bonders |
| CN206921798U (en) * | 2017-07-27 | 2018-01-23 | 深圳市新益昌自动化设备有限公司 | A kind of line LED bonders |
| CN208368542U (en) * | 2018-07-12 | 2019-01-11 | 中山市新益昌自动化设备有限公司 | The full-automatic bonder of mini-LED |
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