CN113941521A - Chip detection sorting machine and operation method - Google Patents
Chip detection sorting machine and operation method Download PDFInfo
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- CN113941521A CN113941521A CN202111214023.9A CN202111214023A CN113941521A CN 113941521 A CN113941521 A CN 113941521A CN 202111214023 A CN202111214023 A CN 202111214023A CN 113941521 A CN113941521 A CN 113941521A
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- 238000001514 detection method Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 198
- 238000012360 testing method Methods 0.000 claims abstract description 112
- 230000005540 biological transmission Effects 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 51
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 230000001360 synchronised effect Effects 0.000 claims description 49
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 description 10
- 230000032258 transport Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
Abstract
The invention relates to a chip detection sorting machine which comprises a feeding station, a first material taking mechanism and a feeding mechanism, wherein the feeding mechanism is used for transmitting a first chip test board; the pre-positioning station comprises a transmission mechanism, a first pre-positioning sliding seat and a second pre-positioning sliding seat, the first pre-positioning sliding seat loads the chips transferred by the first material taking mechanism, and the transmission mechanism transmits the first pre-positioning sliding seat to the testing station; the test station comprises an optical test module, a test seat and a material taking module, wherein the material taking module moves and lifts to absorb the chip in the first pre-positioning sliding seat into the test seat; after the chip detection is finished, the material taking module transfers the chip to a second pre-positioning sliding seat; and the blanking station comprises a second material taking mechanism and a first blanking mechanism, the first blanking mechanism is used for transmitting the second chip test board, and the second material taking mechanism is used for transferring the chips to the second chip test board. The invention greatly improves the detection efficiency.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a chip detection sorting machine and an operation method.
Background
The IC chip has the characteristics of small volume, convenient carrying, low price and the like, and is widely applied to various industrial electronic equipment, various household appliances, instruments and the like.
With the integration of electronic products becoming higher and higher, the demand for IC chips is also becoming larger and larger. The quality of the IC chip will affect the quality of the whole electronic product, so the testing and sorting of the IC chip is an important process. If manual testing and sorting are adopted, missing test or error test is easily caused, the qualification rate of products is influenced, the labor cost is increased, and the testing and sorting efficiency is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention discloses a chip detection sorting machine and an operation method.
The technical scheme adopted by the invention is as follows:
a chip detecting and sorting machine comprises
The feeding station comprises a first material taking mechanism and a feeding mechanism, the feeding mechanism is used for transmitting a first chip test board, and the first material taking mechanism is used for moving, lifting and sucking the chips in the first chip test board;
the pre-positioning station comprises a transmission mechanism, a first pre-positioning sliding seat and a second pre-positioning sliding seat, the first pre-positioning sliding seat loads the chips transferred by the first material taking mechanism, and the transmission mechanism transmits the first pre-positioning sliding seat to the testing station;
the test system comprises at least one test station, a test platform and at least one material taking module, wherein the material taking module moves and lifts to absorb the chip in the first pre-positioning sliding seat into the test platform; the optical test module moves, lifts and presses the test seat; after the chip detection is finished, the material taking module moves, lifts and sucks the chip in the test seat, and transfers the chip to the second pre-positioning sliding seat;
and the blanking station comprises a second material taking mechanism and a first blanking mechanism, the first blanking mechanism is used for transmitting a second chip test board, and the second material taking mechanism is used for moving, lifting and absorbing the chips in the second pre-positioning sliding seat and transferring the chips to the second chip test board.
The method is further technically characterized in that: the first material taking mechanism comprises a first linear moving module, a first lifting module and a first vacuum suction nozzle mechanism; the first lifting module is arranged on the first linear moving module, and the first vacuum suction nozzle mechanism is arranged on one side of the first lifting module.
The method is further technically characterized in that: the feeding mechanism comprises a first transmission frame, the first transmission frame is provided with a first transmission mechanism, the first transmission mechanism is provided with a first clamping transmission mechanism, the first clamping transmission mechanism clamps the first chip test board, and the first transmission mechanism transports along the length direction of the first transmission frame the first clamping transmission mechanism.
The method is further technically characterized in that: the testing seat is provided with a plurality of chip testing grooves which are arranged in an MXN matrix mode, wherein M is larger than or equal to 1, and N is larger than or equal to 1.
The method is further technically characterized in that: the transmission mechanism comprises a second driving module, a second synchronous wheel, a third driving module, a second synchronous belt, a second guide rail, a third synchronous belt, a fourth synchronous wheel, a fifth synchronous wheel and two groups of second sliding blocks; the first pre-positioning sliding seat is arranged on one group of second sliding blocks, and the second pre-positioning sliding seat is arranged on the other group of second sliding blocks; the second sliding block and the second guide rail are mutually embedded; the second synchronous belt is tensioned on the second synchronous wheel and the fourth synchronous wheel, and the second driving module is connected with the second synchronous wheel; the third synchronous belt is tensioned on the third synchronous wheel and a fifth synchronous wheel, and the third driving module is connected with the third synchronous wheel; the second hold-in range with the third hold-in range all passes first prepositioning slide with the second prepositioning slide, and through friction drive.
The method is further technically characterized in that: the testing station further comprises a linear module, the material taking module and the optical testing module are mounted on the linear module, and the linear module drives the material taking module and the optical testing module to move along the length direction of the linear module.
The method is further technically characterized in that: the second material taking mechanism comprises a fourth linear moving module, an eighth lifting module and a fifth vacuum suction nozzle mechanism; the eighth lifting module is mounted on the fourth linear moving module, and the fifth vacuum suction nozzle mechanism is mounted on one side of the eighth lifting module.
The method is further technically characterized in that: the first blanking mechanism comprises a second transmission frame, a second transmission mechanism is arranged on the second transmission frame, a second clamping transmission mechanism is installed on the second transmission mechanism, the second clamping transmission mechanism clamps the second chip test board, and the second transmission mechanism transports the second clamping transmission mechanism along the length direction of the second transmission frame.
The method is further technically characterized in that: the blanking device is characterized by further comprising a second blanking mechanism, wherein the second blanking mechanism comprises a blanking disc, a sliding seat and a fifth linear movement module, the sliding seat supports the blanking disc, and the fifth linear movement module drives the sliding seat to move along the length direction of the fifth linear movement module.
A chip detection and sorting method comprises the following steps:
step S1: feeding; the loading station positions and clamps the first chip test disc, and the chip is sent to a pre-positioning station;
step S2: pre-positioning; correcting the position of the chip by the pre-positioning station, and transmitting the position to the detection station;
step S3: detecting; detecting the optical performance of the chip by a detection station;
step S4: blanking; and (4) sorting qualified chips and unqualified chips in the detected chips by the blanking station.
The invention has the following beneficial effects:
the integral driving mode of the first moving linear module is a belt + motor driving mode, and the screw rotates to generate resonance when the stroke of the screw is too long, so that the precision is influenced.
The feeding mechanism, the first blanking mechanism and the second blanking mechanism are automatic feeding and blanking mechanisms, and the material taking mechanism is used for circularly feeding and blanking, so that the feeding and blanking of products are ensured not to stop.
The invention has higher test precision and strong working reliability, and obviously improves the detection and separation efficiency when being applied to the actual detection process.
Drawings
Fig. 1 is a schematic structural diagram of a first viewing angle according to the present invention.
Fig. 2 is a structural diagram of a second viewing angle according to the present invention.
Fig. 3 is a structural diagram of a third viewing angle according to the present invention.
Fig. 4 is a structural diagram of a fourth viewing angle according to the present invention.
Fig. 5 is a front view of the present invention.
Fig. 6 is a side view of the present invention.
Fig. 7 is a top view of the present invention.
Fig. 8 is a front view of a first take off mechanism.
Fig. 9 is a side view of a first take off mechanism.
FIG. 10 is a schematic view of a first vacuum nozzle.
FIG. 11 is a top view of the first vacuum nozzle.
FIG. 12 is a cross-sectional view of a first vacuum nozzle.
Fig. 13 is a side view of the feeding mechanism.
Fig. 14 is a front view of the feeding mechanism.
Fig. 15 is a top view of the feeding mechanism.
Fig. 16 is a side view of the first testing mechanism.
Fig. 17 is a front view of the first test mechanism.
Fig. 18 is a top view of the first test mechanism.
Fig. 19 is a side view of the second testing mechanism.
Fig. 20 is a front view of the second testing mechanism.
Fig. 21 is a top view of the second testing mechanism.
FIG. 22 is a front view of the pre-positioning mechanism.
FIG. 23 is a side view of the pre-positioning mechanism.
FIG. 24 is a top view of the pre-positioning mechanism.
Fig. 25 is a front view of a second take off mechanism.
Fig. 26 is a side view of a second take off mechanism.
FIG. 27 is a schematic view of a second vacuum nozzle.
FIG. 28 is a top view of the second vacuum nozzle.
FIG. 29 is a cross-sectional view of a second vacuum nozzle.
Fig. 30 is a side view of the blanking mechanism.
Fig. 31 is a front view of the blanking mechanism.
Fig. 32 is a plan view of the blanking mechanism.
In the figure: 100. a first material taking mechanism; 101. a first linear moving module; 102. a first lifting module; 103. a first vacuum nozzle mechanism; 104. a first mounting plate; 105. a first synchronization belt; 106. a first synchronizing wheel; 107. a first slider; 108. a first guide rail; 109. a first slide plate; 200. a feeding mechanism; 201. a first clamping and conveying mechanism; 202. a first guide mechanism; 203. a first jacking cylinder; 204. a first limit mechanism; 205. a first transmission mechanism; 206. a second limiting mechanism; 207. a second divided cylinder; 208. a first driving module; 209. a second guide mechanism; 210. a first transport rack; 300. a first testing mechanism; 301. a second lifting module; 302. a second linear moving module; 303. a first vacuum nozzle; 304. a third lifting module; 305. a second vacuum nozzle; 306. a fourth lifting module; 307. a first test section; 400. a second testing mechanism; 401. a fifth lifting module; 402. a third linear moving module; 403. a third vacuum nozzle; 404. a sixth lifting module; 405. a fourth vacuum nozzle; 406. a seventh lifting module; 407. a second testing section; 500. a test seat; 600. a pre-positioning mechanism; 601. a second driving module; 602. a second synchronizing wheel; 603. a third synchronizing wheel; 604. a third driving module; 605. a first pre-positioning sliding seat; 606. a second synchronous belt; 607. a second guide rail; 608. a third synchronous belt; 609. a second pre-positioning sliding seat; 610. a fourth synchronizing wheel; 611. a fifth synchronizing wheel; 612. a second slider; 700. a second material taking mechanism; 701. a fourth linear moving module; 702. an eighth lifting module; 703. a fifth vacuum nozzle mechanism; 704. a second mounting plate; 705. a fourth synchronous belt; 706. a sixth synchronizing wheel; 707. a third slider; 708. a third guide rail; 709. a second slide plate; 800. a first blanking mechanism; 801. a second clamping and conveying mechanism; 802. a third guide mechanism; 803. a second jacking cylinder; 804. a third limiting mechanism; 805. a second transmission mechanism; 806. a fourth limiting mechanism; 807. a second divided cylinder; 208. a fourth driving module; 809. a fourth guide mechanism; 810. a second transport rack; 900. a second blanking mechanism; 901. discharging a material tray; 902. a sliding seat; 903. a fifth linear moving module.
Detailed Description
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Therefore, the directional terminology used is for the purpose of describing, but not limiting, the invention, and moreover, like reference numerals designate like elements throughout the embodiments.
The following describes a specific embodiment of the present embodiment with reference to the drawings.
Referring to FIGS. 1 to 7, a chip detecting and sorting machine includes
The feeding station comprises a first material taking mechanism 100 and a feeding mechanism 200, the feeding mechanism 200 transmits a first chip testing board, and the first material taking mechanism 100 moves and lifts to absorb chips in the first chip testing board.
And the pre-positioning station comprises a transmission mechanism, a first pre-positioning sliding seat 605 and a second pre-positioning sliding seat 609, the first pre-positioning sliding seat 605 loads the chips transferred by the first material taking mechanism 100, and the transmission mechanism transmits the first pre-positioning sliding seat 605 to the testing station.
And the at least one test station comprises an optical test module, a test seat 500 and at least one material taking module, and the material taking module moves and lifts to absorb the chip in the first pre-positioning sliding seat 605 into the test seat 500. The optical test module moves, lifts and presses the test socket 500. After the chip detection is finished, the material taking module moves, lifts and sucks the chip in the test socket 500, and transfers the chip to the second pre-positioning sliding socket 609.
And the blanking station comprises a second material taking mechanism 700 and a first blanking mechanism 800, the first blanking mechanism 800 transmits the second chip test board, and the second material taking mechanism 700 moves and lifts to suck the chips in the second pre-positioning sliding seat 609 and transfer the chips to the second chip test board.
In this embodiment, the chip detecting and sorting machine includes two testing stations, which are the first testing mechanism 300 and the second testing mechanism 400, respectively, for convenience of description.
Referring to fig. 8 to 12, the first material taking mechanism 100 includes a first linear moving module 101, a first lifting module 102, and a first vacuum nozzle mechanism 103. The first lifting module 102 is installed on the first linear moving module 101, and a first vacuum nozzle mechanism 103 is installed at one side of the first lifting module 102. Specifically, the first lifting module 102 includes a first servo motor, a first mounting plate 104, a first synchronous belt 105, two first synchronous wheels 106, a first slider 107, a first guide rail 108 and a first sliding plate 109, the first vacuum suction nozzle 101 is mounted on the first sliding plate 109, the first sliding plate 109 is mounted on the first slider 107, the first slider 107 and the first guide rail 108 are embedded with each other, the first synchronous belt 105 is tensioned on the two first synchronous wheels 106, the first synchronous belt 105 is clamped on one side of the first slider 107, the first synchronous belt 105 and the first slider 107 are in friction transmission, an output shaft of the first servo motor penetrates through one of the first synchronous wheels 106 to drive the first synchronous wheel 106 to rotate, and the first sliding plate 109 is driven to lift.
With reference to fig. 13 to 15, the feeding mechanism 200 includes a first transmission frame 210, the first transmission frame 210 is provided with a first transmission mechanism 205, a first clamping transmission mechanism 201 is installed on the first transmission mechanism 205, the first clamping transmission mechanism 201 clamps the first chip test board, and the first transmission mechanism 205 transports the first clamping transmission mechanism 201 along the length direction of the first transmission frame 210. Specifically, the first transmission mechanism 205 is a belt transmission mechanism. First centre gripping transmission device 201 includes the clamping jaw base plate, installs double-acting cylinder under the clamping jaw base plate, and double-acting cylinder's output is through connecting the clamping jaw, and the clamping jaw presss from both sides tight first chip and surveys test panel, and first chip surveys test panel and offers a plurality of chips and places the recess.
The first transmission frame 210 is further provided with a first jacking mechanism and a second jacking mechanism, and the first jacking mechanism and the second jacking mechanism are respectively arranged on two sides of the first transmission frame 210. The first jacking mechanism comprises a first guide mechanism 108, a first separation cylinder, a first jacking cylinder 203 and a first limiting mechanism 204, the first limiting mechanism 204 comprises a group of first upright posts, the cross sections of the first upright posts are L-shaped, and the first upright posts are fixed on the first transmission frame 210 to limit the movement of the first chip test board. The first separation cylinder is fixed to the outer side of the first limit mechanism 2064, and the action end of the first separation cylinder passes through the first limit mechanism 206. The output end of the first jacking cylinder 203 is connected to the first guiding mechanism 108, so as to push the first guiding mechanism 108 to ascend and descend, and the first guiding mechanism 108 can abut against the first chip testing board in the ascending process.
The second jacking mechanism comprises a second limiting mechanism 206, a second separating cylinder 207, a first driving module 208 and a second guiding mechanism 209, the second limiting mechanism 206 comprises a group of second upright columns, the cross sections of the second upright columns are L-shaped, and the second upright columns are fixed on the first transmission frame 210 and limit the movement of the first chip test board. The second partition cylinder 207 is fixed to the outer side of the second stopper mechanism 206, and the action end of the second partition cylinder 207 passes through the second stopper mechanism 206. First drive module 208 includes second servo motor and ball screw, through synchronous belt drive between second servo motor and the ball screw, the band pulley overlaps respectively and establishes on the output shaft of second servo motor and the screw rod of ball screw promptly, the belt tensioning is on the band pulley, and ball screw and second guiding mechanism 209 are connected, and ball screw turns into rectilinear motion with rotary motion, promotes the lift of second guiding mechanism 209, but second guiding mechanism 209 is at the first chip testing board of lift in-process butt.
The first guide mechanism 108 and the second guide mechanism 209 both comprise a lifting plate and four guide rods, the four guide rods all penetrate through the lifting plate, the four guide rods are in a group, and the end parts of the guide rods in each group are connected with a push plate.
The working principle of taking out a single tray is as follows:
a plurality of first chip test boards are manually placed into a tray placing groove formed by the first limiting mechanism 204. The first jacking mechanism is started, when the acting end of the first jacking cylinder 203 extends out, the lifting plate of the first guide mechanism 108 is driven to move along the setting direction of the guide rod of the first guide mechanism 108, and the movement of the guide rod of the first guide mechanism 108 drives the push plate to move upwards to support the first chip test board.
Then the piston rod of first separation cylinder retrieves and holds in the palm at the charging tray dog that first chip surveyed the board bottom, and a plurality of first chip survey test board wholly descend a charging tray thickness, and the piston rod of first separation cylinder stretches out, and the charging tray dog drags remaining a plurality of first chip survey test boards in top, places a single first chip survey test board on the guide rail groove, is got the transport by a centre gripping transport mechanism 201 clamp again, accomplishes a single first chip survey test board and takes out.
The first driving module 208 is started, the output shaft of the second servo motor rotates, the driving belt wheel rotates, the belt wheel transmits power to the ball screw through a belt, the ball screw converts the rotary motion into linear motion, so that the lifting plate of the second guiding mechanism 209 is driven to move upwards, the lifting plate of the second guiding mechanism 209 moves along the setting direction of the guide rod of the second guiding mechanism 209, and the guide rod of the second guiding mechanism 209 moves to drive the pushing plate to move upwards to support the material tray. The piston rod of the second separating cylinder 207 retracts, and after the single first chip testing board is conveyed to the material tray placing groove, the piston rod of the second separating cylinder 207 extends out to push the material tray stop block to clamp the first chip testing board, so that the stacking of the single material tray is completed at one time.
Referring to fig. 16 to 21, the first testing mechanism 300 includes a second lifting module 301, a second moving linear module 302, a third lifting module 304 and a fourth lifting module 306, the second lifting module 301, the third lifting module 304 and the fourth lifting module 306 are all mounted on the second moving linear module 302, the second lifting module 301 is connected to a first vacuum nozzle 303, the third lifting module 304 is connected to a second vacuum nozzle 305, and the fourth lifting module 306 is connected to a first testing part 307.
The second testing mechanism 400 includes a fifth lifting module 401, a third moving linear module 402, a sixth lifting module 404 and a seventh lifting module 406, the fifth lifting module 401, the sixth lifting module 404 and the seventh lifting module 406 are all installed on the third moving linear module 402, the fifth lifting module 401 is connected to the third vacuum nozzle 403, the sixth lifting module 404 is connected to the fourth vacuum nozzle 405, and the seventh lifting module 406 is connected to the second testing portion 407.
The second lifting module 301, the second moving linear module 302, the third lifting module 304, the fourth lifting module 306, the fifth lifting module 401, the third moving linear module 402, the sixth lifting module 404 and the seventh lifting module 406 are all commercially available linear modules, and a person skilled in the art can select the type of the linear module as required.
The first test portion 307 and the second test portion 407 are both LED light boxes.
The test socket 500 is provided with four chip test slots, which are arranged in a 2 × 2 matrix.
With reference to fig. 22 to 24, the transport mechanism includes a second driving module 601, a second synchronizing wheel 602, a third synchronizing wheel 603, a third driving module 604, a second timing belt 606, a second guide rail 607, a third timing belt 608, a fourth synchronizing wheel 610, a fifth synchronizing wheel 611, and two sets of second sliders 612. First pre-positioning slide 605 is mounted on one set of second slides 612 and second pre-positioning slide 609 is mounted on the other set of second slides 612. The second slider 612 and the second guide rail 607 are fitted to each other. The second timing belt 606 is tensioned on the second timing wheel 602 and the fourth timing wheel 610, and the second driving module 601 is connected to the second timing wheel 602. The third timing belt 608 is tensioned on the third timing wheel 603 and the fifth timing wheel 611, and the third driving module 604 is connected to the third timing wheel 603. A second timing belt 606 and a third timing belt 608 both pass through a first pre-positioning slide 605 and a second pre-positioning slide 609 and are driven by friction.
The back of the first pre-positioning slide seat 605 and the back of the second pre-positioning slide seat 609 are both provided with a vibration motor, and the position of the chip is corrected through the vibration of the vibration motors.
Referring to fig. 25 to 29, the second material taking mechanism 700 includes a fourth linear moving module 701, an eighth lifting module 702, and a fifth vacuum nozzle mechanism 703. The eighth lifting module 702 is installed on the fourth linear moving module 701, and a fifth vacuum nozzle mechanism 703 is installed at one side of the eighth lifting module 702. Specifically, the eighth lifting module 702 includes a third servo motor, a second mounting plate 704, a fourth synchronous belt 705, two sixth synchronous wheels 706, a third sliding block 707, a third guide rail 708 and a second sliding plate 709, the fifth vacuum suction nozzle 703 is mounted on the second sliding plate 709, the second sliding plate 709 is mounted on the third sliding block 707, the third sliding block 707 and the third guide rail 708 are embedded with each other, the fourth synchronous belt 705 is tensioned on the two sixth synchronous wheels 706, the fourth synchronous belt 705 is clamped on one side of the third sliding block 707, the fourth synchronous belt 705 and the third sliding block 707 are in friction transmission, an output shaft of the third servo motor penetrates through one of the sixth synchronous wheels 706 to drive the sixth synchronous wheel 706 to rotate, and the second sliding plate 709 is driven to lift.
With reference to fig. 30 to fig. 32, the first blanking mechanism 800 includes a second transmission frame 810, the second transmission frame 810 is provided with a second transmission mechanism 805, the second transmission mechanism 805 is provided with a second clamping transmission mechanism 801, the second clamping transmission mechanism 801 clamps the second chip test board, and the second transmission mechanism 805 transports the second clamping transmission mechanism 801 along the length direction of the second transmission frame 810. Specifically, the second transmission mechanism 805 is a belt transmission mechanism. The second transmission mechanism 805 comprises a clamping jaw base plate, a double-acting cylinder is mounted below the clamping jaw base plate, the output end of the double-acting cylinder is connected with a clamping jaw, the clamping jaw clamps a second chip testing plate, and the second chip testing plate is provided with a plurality of chip placing grooves.
The operation principle of taking out and stacking a single tray of the first blanking mechanism 800 is the same as that of taking out and stacking a single tray of the loading mechanism 200.
The chip detection sorting machine further comprises a second blanking mechanism 900, the second blanking mechanism 900 comprises a blanking disc 901, a sliding seat 902 and a fifth linear moving module 903, the sliding seat 902 supports the blanking disc 901, and the fifth linear moving module 903 drives the sliding seat 902 to move along the length direction of the fifth linear moving module 903.
The working principle of the invention is as follows:
step S1: feeding; the loading station positions and clamps the first chip test disc, and the chip is sent to a pre-positioning station;
step S2: pre-positioning; correcting the position of the chip by the pre-positioning station, and transmitting the position to the detection station;
step S3: detecting; a material taking module of the testing mechanism takes materials for the chip at the pre-positioning station, the chip is placed in the testing seat 500, and the testing part detects the optical performance of the chip;
step S4: blanking; and sorting the detected chips at the discharging station, wherein the qualified chips are transferred to the first discharging mechanism 800, and the unqualified chips are transferred to the second discharging mechanism 900.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing description is illustrative of the present invention and is not to be construed as limiting thereof, the scope of the invention being defined by the appended claims, which may be modified in any manner without departing from the basic structure thereof.
Claims (10)
1. The utility model provides a chip detects sorter which characterized in that: comprises that
The feeding station comprises a first material taking mechanism (100) and a feeding mechanism (200), the feeding mechanism (200) transmits a first chip test board, and the first material taking mechanism (100) moves, lifts and sucks a chip in the first chip test board;
the pre-positioning station comprises a transmission mechanism, a first pre-positioning sliding seat (605) and a second pre-positioning sliding seat (609), the first pre-positioning sliding seat (605) loads the chips transferred by the first material taking mechanism (100), and the transmission mechanism transmits the first pre-positioning sliding seat (605) to the testing station;
the test system comprises at least one test station, a test device and a control device, wherein the test station comprises an optical test module, a test seat (500) and at least one material taking module, and the material taking module moves and lifts to suck the chip in the first pre-positioning sliding seat (605) into the test seat (500); the optical test module moves, lifts and presses the test seat (500); after the chip detection is finished, the material taking module moves, lifts and sucks the chip in the test seat (500), and transfers the chip to the second pre-positioning sliding seat (609);
and the blanking station comprises a second material taking mechanism (700) and a first blanking mechanism (800), the first blanking mechanism (800) transmits a second chip testing plate, and the second material taking mechanism (700) moves, lifts and absorbs the chips in the second pre-positioning sliding seat (609) to be transferred to the second chip testing plate.
2. The chip detecting and sorting machine according to claim 1, wherein: the first material taking mechanism (100) comprises a first linear moving module (101), a first lifting module (102) and a first vacuum suction nozzle mechanism (103); the first lifting module (102) is installed on the first linear moving module (101), and the first vacuum nozzle mechanism (103) is installed on one side of the first lifting module (102).
3. The chip detecting and sorting machine according to claim 1, wherein: feeding mechanism (200) includes first transmission frame (210), first transmission frame (210) are provided with first drive mechanism (205), install first centre gripping transport mechanism (201) on first drive mechanism (205), first centre gripping transport mechanism (201) centre gripping is surveyed the board at first chip, just first drive mechanism (205) are followed the length direction transportation of first transmission frame (210) first centre gripping transport mechanism (201).
4. The chip detecting and sorting machine according to claim 1, wherein: the testing seat (500) is provided with a plurality of chip testing slots, the chip testing slots are arranged in an MXN matrix mode, M is larger than or equal to 1, and N is larger than or equal to 1.
5. The chip detecting and sorting machine according to claim 1, wherein: the transmission mechanism comprises a second driving module (601), a second synchronous wheel (602), a third synchronous wheel (603), a third driving module (604), a second synchronous belt (606), a second guide rail (607), a third synchronous belt (608), a fourth synchronous wheel (610), a fifth synchronous wheel (611) and two groups of second sliding blocks (612); the first pre-positioning slide (605) is mounted on one set of second slides (612), and the second pre-positioning slide (609) is mounted on the other set of second slides (612); the second slider (612) and the second guide rail (607) are fitted to each other; the second synchronous belt (606) is tensioned on the second synchronous wheel (602) and the fourth synchronous wheel (610), and the second driving module (601) is connected with the second synchronous wheel (602); the third synchronous belt (608) is tensioned on the third synchronous wheel (603) and a fifth synchronous wheel (611), and the third driving module (604) is connected with the third synchronous wheel (603); the second synchronous belt (606) and the third synchronous belt (608) penetrate through the first pre-positioning sliding seat (605) and the second pre-positioning sliding seat (609) and are in friction transmission.
6. The chip detecting and sorting machine according to claim 1, wherein: the testing station further comprises a linear module, the material taking module and the optical testing module are mounted on the linear module, and the linear module drives the material taking module and the optical testing module to move along the length direction of the linear module.
7. The chip detecting and sorting machine according to claim 1, wherein: the second material taking mechanism (700) comprises a fourth linear moving module (701), an eighth lifting module (702) and a fifth vacuum suction nozzle mechanism (703); the eighth lifting module (702) is installed on the fourth linear moving module (701), and the fifth vacuum suction nozzle mechanism (703) is installed at one side of the eighth lifting module (702).
8. The chip detecting and sorting machine according to claim 1, wherein: first unloading mechanism (800) includes second transmission frame (810), second transmission frame (810) are provided with second drive mechanism (805), install second centre gripping transmission device (801) on second drive mechanism (805), second centre gripping transmission device (801) centre gripping the second chip is surveyed the board, just second drive mechanism (805) are followed the length direction of second transmission frame (810) is transported second centre gripping transmission device (801).
9. The chip detecting and sorting machine according to claim 1, wherein: the blanking device is characterized by further comprising a second blanking mechanism (900), wherein the second blanking mechanism (900) comprises a blanking disc (901), a sliding seat (902) and a fifth linear moving module (903), the sliding seat (902) supports the blanking disc (901), and the fifth linear moving module (903) drives the sliding seat (902) to move along the length direction of the fifth linear moving module (903).
10. A chip detection and sorting method is characterized by comprising the following steps:
step S1: feeding; the loading station positions and clamps the first chip test disc, and the chip is sent to a pre-positioning station;
step S2: pre-positioning; correcting the position of the chip by the pre-positioning station, and transmitting the position to the detection station;
step S3: detecting; detecting the optical performance of the chip by a detection station;
step S4: blanking; and (4) sorting qualified chips and unqualified chips in the detected chips by the blanking station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111214023.9A CN113941521A (en) | 2021-10-19 | 2021-10-19 | Chip detection sorting machine and operation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111214023.9A CN113941521A (en) | 2021-10-19 | 2021-10-19 | Chip detection sorting machine and operation method |
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| CN113941521A true CN113941521A (en) | 2022-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111214023.9A Pending CN113941521A (en) | 2021-10-19 | 2021-10-19 | Chip detection sorting machine and operation method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377986A (en) * | 2022-01-20 | 2022-04-22 | 无锡昌鼎电子有限公司 | Chip sorting machine |
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| CN112657855A (en) * | 2020-12-28 | 2021-04-16 | 无锡市宝御达机械设备制造有限公司 | Chip detection sorting machine and detection method thereof |
| CN213949891U (en) * | 2020-12-28 | 2021-08-13 | 无锡市宝御达机械设备制造有限公司 | Clamping and conveying mechanism for chip testing and sorting machine |
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| US20190162630A1 (en) * | 2017-11-30 | 2019-05-30 | Citic Dicastal Co., Ltd | Device for detecting wheel hop |
| CN211501584U (en) * | 2019-12-20 | 2020-09-15 | 东莞市嘉翼智能装备有限公司 | Two-stage transmission low-noise light synchronous belt linear module |
| CN112657855A (en) * | 2020-12-28 | 2021-04-16 | 无锡市宝御达机械设备制造有限公司 | Chip detection sorting machine and detection method thereof |
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