CN116727302A - A chip detection and selection machine and a chip detection and selection method - Google Patents

Abstract

The invention relates to the technical field of chip production, and in particular, refers to a chip detection and sorting machine, which includes a frame, a first silo, a feeding device, a first chip detection device, a chip grabbing device, a film expansion device, and a waste recycling structure. The second chip detection device and the mounting workbench, the feeding device reciprocates between the first silo, the first chip detection device and the film expansion device; the chip grabbing device can move between the film expansion device, the second chip There is reciprocating movement between the detection device, the scrap recovery structure and the placement workbench. and chip detection and selection methods. The chip detection accuracy of the present invention is high, and the chips that pass the detection are mounted on another carrier one by one in an orderly manner, which is beneficial to subsequent processing, or the chips that fail the detection are transported to the scrap recycling structure for processing. Recycle. The top of the chip is detected synchronously and quickly through the first chip detection device, which improves the detection efficiency of the chip and realizes fully automatic detection and selection of the chip.

Description

A chip detection and selection machine and a chip detection and selection method

Technical field

The present invention relates to the field of chip production technology, and in particular, to a chip detection and selection machine and a chip detection and selection method.

Background technique

The wafer wafer is attached to the membrane, and the membrane is encapsulated on a stainless steel ring. After the complete wafer is cut into individual chips, a sorting operation needs to be performed based on the quality of the chip to remove the defective chips from the membrane, thus requiring the membrane to be The chips on the chip are tested and selected. In the patent application number CN201310007497.5, the patent application title is a fully automatic grain sorting equipment and a fully automatic grain sorting method. It is disclosed that this equipment consists of a wafer workbench, a sorting workbench, and a transportation conveyor. The system, wafer workbench pushing device, sorting workbench pushing device, swing arm mechanism, and chip sorting material library are composed of the above seven main parts. The present invention improves the traditional layout and mechanical structure in the prior art, and provides an optimal layout structure on the machine platform. The discs are placed between the workbench, the push device and the chip sorting library through the transportation and transmission system. It can be picked and placed freely in and out of the room, realizing fully automatic grain sorting. In this patent application, the chip detection effect is poor, and the top and bottom ends of the chip cannot be accurately detected. In addition, this patent application lacks a waste recycling structure, and defective chips cannot be directly recycled after chip selection. The swing arm mechanism can only complete the chip sorting action, and the swing arm mechanism has a single function. Therefore, the flaws are obvious and a solution is urgently needed.

Contents of the invention

In order to solve the above technical problems, the purpose of the present invention is to provide a chip detection and selection machine and a chip detection and selection method that have good chip detection effects, convenient recovery of defective chips, and a swing arm mechanism that can drive chips for detection and recovery.

In order to achieve the above objects, the present invention adopts the following technical solutions:

A chip detection and sorting machine, which includes a frame and a first silo, a feeding device, a first chip detection device, a chip grabbing device, a film expansion device, a waste recycling structure, and a second chip detection device respectively arranged on the frame device and a mounting workbench. A plurality of carriers are stored in the first bin; the feeding device reciprocates between the first bin, the first chip detection device and the film expansion device to move the carriers from The first material bin is transported to the first chip detection device and the film expansion device in sequence. The first chip detection device is used to detect the chips on the carrier transported by the feeding device; the film expansion device is used to place the carrier. The device can also tighten the film on the carrier; the mounting workbench is adsorbed with the carrier; the chip grabbing device can be used in the film expansion device, the second chip detection device, the waste recycling structure and the mounting workbench. reciprocating movement to transport the expanded chip on the carrier to the second chip detection device. After the second chip detection device detects the chip captured by the chip grabbing device, the second chip detection device then The chip is mounted on the carrier of the placement workbench or transported to the scrap recycling structure for recycling.

Furthermore, the chip detection and sorting machine also includes a second feeding mechanism and a second silo respectively provided on the frame. The second feeding mechanism is used to transport the carrier on the film expansion device to the second silo. Inside; the second bin is used to store carriers.

Furthermore, the chip detection and sorting machine also includes a third feeding mechanism and a third silo respectively provided on the frame. The third feeding mechanism is used to transport the carrier on the mounting workbench to the third material hopper. The carriers in the warehouse or the third bin are transported to the placement workbench; the third bin is used to store the carriers.

Further, the feeding device includes a detection platform and a transfer mechanism, a first feeding mechanism, an adjustment mechanism and a material retrieval mechanism respectively arranged on the frame; the output end of the adjustment mechanism is connected to the detection platform; the material retrieval mechanism It is used to take out the carriers in the first bin. The transfer mechanism can reciprocate between the material picking mechanism, the detection platform and the first feeding mechanism to sequentially transport the carriers taken out by the material picking mechanism to the detection platform and The first feeding mechanism; the adjustment mechanism is used to drive the detection platform to reciprocate between the first chip detection device and the transfer mechanism; the detection platform is used to adsorb the carrier; the first chip detection device is used to adjust the detection platform The chip on the chip is detected; the first feeding mechanism is used to transport the carrier to the film expansion device.

Further, the first feeding mechanism includes a slide rail provided on the frame, a linear driver provided on the slide rail, a clamping member slidably connected to the slide rail, and two sides provided on the frame and respectively located on the slide rail. There are two placing platforms on the side. The transfer mechanism is used to transfer the detected carrier to the two placing platforms. The two placing platforms cooperate to support the carrier. The output end of the clamping member is connected to the linear drive. The clamping member can clamp the carrier, and the linear driver is used to drive the clamping member closer to or away from the film expansion device.

Further, the chip grabbing device includes a first grabbing device mechanism, a transfer platform and a second grabbing device mechanism respectively provided on the frame. The first grabbing device mechanism is used to operate between the film expansion device and the third grabbing device. The two chip detection devices, the waste recycling structure and the transfer table move back and forth to transport the chips on the expanded film to the second chip detection device. After the chips are detected by the second chip detection device, the first grab The device mechanism selects to transport the chip to the transfer table or the waste recycling structure according to the detection results; the second grabbing device mechanism is used to reciprocate between the transfer table and the placement workbench to transport the chip on the transfer table to the placement workbench. Mount it on the carrier placed on the placement workbench.

Further, the chip detection and sorting machine also includes a first moving mechanism and a second moving mechanism respectively provided on the frame, and the film expansion device is connected to the output end of the first moving mechanism; the mounting workbench is connected to the output end of the first moving mechanism. The output end of the second moving mechanism is connected.

Furthermore, the chip detection and sorting machine also includes a second visual detection device and a third visual detection device respectively provided on the frame. The second visual detection device is used to detect whether the chip to be grasped on the film expansion device is Move to the working end of the first grabbing device mechanism; the third visual detection device is used to detect whether the position of the chip to be mounted on the film on the mounting workbench moves to the working end of the second grabbing device mechanism.

Further, the first grabbing device mechanism includes a swing arm drive assembly provided on the frame, a swing arm body provided at the output end of the swing arm drive assembly, and a suction assembly provided on the swing arm body. The arm drive assembly is used to drive the swing arm body to rotate and lift.

A chip detection and selection method, which includes the chip detection and selection machine mentioned above. The steps of the chip detection and selection method are as follows:

Step 1: The feeding device takes out the carrier in the first bin and transports the carrier to the first chip detection device;

Step 2: Use the first chip detection device to simultaneously detect multiple chips on the carrier, and send the detected signals to the feeding device and the chip grabbing device respectively;

Step 3: The feeding device continues to transport the inspected carrier to the film expansion device, where the carrier is placed through the film expansion device and the film on the carrier is tensioned;

Step 4: The chip grabbing device grabs the chips on the film of the tensioned carrier one by one to the second chip detection device;

Step 5: Detect the chip of the chip grabbing device through the second chip detection device, and send the detected signal to the chip grabbing device;

Step 6: The mounting workbench absorbs the carrier to be mounted; if the chip detection results sent by the first chip detection device and the second chip detection device to the chip grabbing device are both qualified, the chip grabbing device continues to transport the chip to the placement workbench, and mount the chip on the carrier adsorbed by the placement workbench; if one of the chip detection results sent by the first chip detection device or the second chip detection device to the chip grabbing device is unqualified, Then the chip grabbing device continues to transport the chip to the waste recycling structure, and the chip is recycled through the waste recycling structure.

Beneficial effects of the present invention: The structure of the present invention is simple and compact. The chip grabbing device grabs the chips one by one, which not only facilitates the second chip detection device to detect the bottom ends of the chips on the carrier one by one, but also improves the detection accuracy of the chips. , it also facilitates the orderly placement of qualified chips on another carrier one by one, which is beneficial to subsequent processing, or transports unqualified chips to a scrap recycling structure for recycling. The feeding device transports the carrier to the first chip detection device, and the top of the chip is synchronously and quickly detected by the first chip detection device, thereby improving the detection efficiency of the chip. By coordinating the chip grabbing device and the feeding device with each different work station, fully automatic detection and selection of chips is realized.

Description of drawings

Figure 1 is a schematic three-dimensional structural diagram of the present invention.

Figure 2 is a schematic three-dimensional structural diagram of the feeding device, the first bunker and the first chip detection device of the present invention.

Figure 3 is a schematic three-dimensional structural diagram of the feeding device and the first silo of the present invention.

Figure 4 is a partial three-dimensional structural diagram of the present invention.

Figure 5 is a schematic diagram of the first three-dimensional structure of the first grabbing device mechanism of the present invention.

Figure 6 is a second schematic diagram of the three-dimensional structure of the first grabbing device mechanism of the present invention.

Figure 7 is a partial three-dimensional structural diagram of the first grabbing device mechanism of the present invention.

Explanation of reference symbols:

1. Frame; 2. First silo; 3. Feeding device; 4. First chip detection device; 5. Chip grabbing device; 6. Film expansion device; 7. Waste recycling structure; 8. Second chip detection Device; 9. Mounting workbench; 10. First moving mechanism; 11. Second moving mechanism; 12. Second visual inspection device; 13. Third visual inspection device; 14. Ejecting device; 15. Second feeding device Mechanism; 16. Second silo; 17. Third feeding mechanism; 18. Third silo; 31. Inspection table; 32. Transfer mechanism; 33. First feeding mechanism; 34. Adjustment mechanism; 35. Retrieval mechanism ; 36. Slide rail; 37. Linear drive; 38. Clamp; 39. Placement table; 51. First grabbing device mechanism; 52. Second grabbing device mechanism; 53. Transfer table; 54. First vision Detection device; 55. Swing arm drive assembly; 56. Swing arm body; 57. Suction assembly; 58. Mounting seat; 59. First rotary driver; 60. Second rotary driver; 61. Connection assembly; 62. Output shaft ; 63. Eccentric shaft; 64. Driving part; 65. Swinging part; 66. Sleeve.

Detailed ways

In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and drawings. The contents mentioned in the embodiments do not limit the present invention.

As shown in Figures 1 to 7, the present invention provides a chip detection and sorting machine, which includes a frame 1 and a first bin 2, a feeding device 3, and a first chip detection device 4 respectively arranged on the frame 1 , chip grabbing device 5, film expansion device 6, waste recycling structure 7, second chip detection device 8 and placement workbench 9, the first bin 2 stores multiple carriers; the feeding device 3 Reciprocating movement between the first bin 2, the first chip detection device 4 and the film expansion device 6 to transport the carriers one by one from the first bin 2 to the first chip detection device 4 and the film expansion device 6 in sequence , the first chip detection device 4 is used to simultaneously detect the surfaces of the tops of multiple chips on the carrier transported by the feeding device 3; the film expansion device 6 is used to place the carrier and can place the carrier on the carrier. The film is tensioned; a carrier is adsorbed on the mounting workbench 9; the chip grabbing device 5 can be used between the film expansion device 6, the second chip detection device 8, the waste recycling structure 7 and the mounting workbench 9 The second chip detection device 8 performs a reciprocating motion to transport the chips on the expanded film of the carrier to the second chip detection device 8 . The surface of the bottom end of the chip captured or transported by the chip grabbing device 5 is inspected by the second chip detection device 8 . After detection, the second chip detection device 8 chooses to mount the chip on the film of the carrier of the mounting workbench 9 or transport it to the waste recycling structure 7 according to the detection result; the waste recycling structure 7 is used to recycle the chip.

Specifically, the film expansion device 6 and the mounting workbench 9 are located on both sides of the chip grabbing device 5 respectively. The carrier includes an iron ring and a film, the film is packaged on the iron ring, and a plurality of chips are respectively attached to the film. The carriers stored in the first bin 2 are in a fully loaded state, that is, multiple chips are mounted on the carriers; the carriers adsorbed on the mounting workbench 9 are in an empty state, that is, the carriers are waiting for placement. chip.

A chip detection and selection method, which includes the chip detection and selection machine mentioned above. The steps of the chip detection and selection method are as follows:

Step 1: The feeding device 3 takes out the carrier in the first bin 2 and transports the carrier to the first chip detection device 4;

Step 2: Use the first chip detection device 4 to simultaneously detect the tops of multiple chips on the carrier, identify the barcode on the carrier, or/and determine the relative position between the carrier and the working end of the feeding device 3 Detect and send the detected signals to the feeding device 3 and the chip grabbing device 5 respectively;

Step 3: The feeding device 3 continues to transport the detected carrier to the film expansion device 6, places the carrier through the film expansion device 6 and tensions the film on the carrier;

The first chip detection device 4 detects the relative position between the carrier and the working end of the feeding device 3, so that the feeding device 3 can accurately transport the carrier to the film expansion device 6.

Step 4: The chip grabbing device 5 grabs the chips on the film of the tensioned carrier one by one to the second chip detection device 8;

Step 5: Use the second chip detection device 8 to detect the surface of the bottom end of the chip captured by the chip grabbing device 5, and send the detected signal to the chip grabbing device 5;

Step 6: The carrier to be mounted is adsorbed on the mounting workbench 9; if the chip detection results sent by the first chip detection device 4 and the second chip detection device 8 to the chip capture device 5 are both qualified, the chip capture The device 5 continues to transport the chip to the mounting workbench 9, and mounts the chip on the carrier adsorbed by the mounting workbench 9; if the first chip detection device 4 or the second chip detection device 8 sends it to the chip grabbing device If one of the 5 chip test results is unqualified, the chip grabbing device 5 continues to transport the chip to the waste recycling structure 7, and the chip is recycled through the waste recycling structure 7;

Step 7: The chip grabbing device 5 and the feeding device 3 are reset respectively.

Repeat the above actions to achieve automatic detection and selection of chips. The structure of the present invention is simple and compact. The chip grabbing device 5 grabs the chips one by one, which not only facilitates the second chip detection device 8 to detect the bottom ends of the chips on the carrier one by one, improves the detection accuracy of the chips, but also facilitates the detection of the chips. The chips that pass the test are mounted on another carrier one by one in an orderly manner, which is beneficial to subsequent processing, or the chips that fail the test are transported to the scrap recycling structure 7 for recycling. The transport steps of the chips are simple. The feeding device 3 transports the carrier to the first chip detection device 4, and the top of the chip is detected synchronously and quickly through the first chip detection device 4, thereby improving the detection efficiency of the chip. By cooperating with each different work station respectively, the chip grabbing device 5 and the feeding device 3 realize fully automatic detection and selection of chips.

Specifically, the scrap recycling structure 7 includes a scrap recycling frame. The chip grabbing device 5 transports unqualified chips to the top of the scrap recycling frame and then releases them. The chips automatically fall into the scrap recycling frame for recycling.

Furthermore, the chip detection and sorting machine also includes a second feeding mechanism 15 and a second bunker 16 respectively provided on the frame 1. The second feeding mechanism 15 is used to transport the carrier on the film expansion device 6. to the second bin 16; the second bin 16 is used to store carriers. Specifically, the second silo 16 is disposed on the frame 1 in an elevating manner, so that the material storage height of the second silo 16 can be adapted to the output end of the second feeding mechanism 15 . The second feeding mechanism 15 and the second silo 16 are respectively arranged in the circumferential direction of the film expansion device 6 .

In actual use, after the chip grabbing device 5 selects all the chips on the carrier of the film expansion device 6, the second feeding mechanism 15 then transports the carriers on the film expansion device 6 to the second silo 16 It is stored in the container, and then the feeding device 3 transports another fully loaded carrier to the touching device 6, which improves the automation level of the present invention.

Furthermore, the chip detection and sorting machine also includes a third feeding mechanism 17 and a third bunker 18 respectively provided on the frame 1 . The third feeding mechanism 17 is used to transfer the carrier on the mounting workbench 9 The carriers transported into the third bin 18 or the parts in the third bin 18 are transported to the mounting workbench 9; the third bin 18 is used to store the carriers.

Specifically, the third silo 18 is disposed on the frame 1 in an elevating manner, so that the material storage height of the third silo 18 can be adapted to the output end of the third feeding mechanism 17 . When the carrier on the placement workbench 9 is filled with chips, the carrier on the placement workbench 9 is transported to the third bin 18 for storage through the third feeding mechanism 17, and then the third bin 18 rises or Descend so that the height of the carrier to be mounted in the bin is adapted to the height of the output end of the third feeding mechanism 17, and then the third feeding mechanism 17 transports the carrier of the chip to be mounted in the bin to the placement Waiting for mounting on the workbench 9 further improves the degree of automation of the present invention.

Further, the feeding device 3 includes a detection platform 31 and a transfer mechanism 32, a first feeding mechanism 33, an adjustment mechanism 34 and a retrieval mechanism 35 respectively provided on the frame 1; the output end of the adjustment mechanism 34 is connected to the detection mechanism. The platform 31 is connected; the retrieval mechanism 35 is used to take out the carrier in the first bin 2, and the transfer mechanism 32 can reciprocate between the retrieval mechanism 35, the detection platform 31 and the first feeding mechanism 33. The carriers taken out by the material picking mechanism 35 are sequentially transported to the detection stage 31 and the first feeding mechanism 33; the adjustment mechanism 34 is used to drive the detection stage 31 to reciprocate between the first chip detection device 4 and the transfer mechanism 32; The detection stage 31 is used to adsorb the carrier; the first chip detection device 4 is used to detect the chip on the detection stage 31 ; the first feeding mechanism 33 is used to transport the carrier to the film expansion device 6 .

During actual use, the material picking mechanism 35 , the adjusting mechanism 34 and the first feeding mechanism 33 are arranged in sequence along the conveying direction of the transfer mechanism 32 . The carriers in the first bin 2 are taken out through the retrieval mechanism 35 and transported to below the output end of the transfer mechanism 32. At the same time, the adjustment mechanism 34 drives the detection table 31 to move below the output end of the transfer mechanism 32. , and then the carrier is transported from the picking mechanism 35 to the detection platform 31 through the transfer mechanism 32, and then the adjustment mechanism 34 continues to drive the detection platform 31 to move below the first chip detection device 4. After the first chip detection device 4 completes the detection, The adjustment mechanism 34 drives the detection platform 31 to move to the output end of the transfer mechanism 32. The transfer mechanism 32 continues to transport the carrier to the first feeding mechanism 33, and then transports the carrier to the film expansion device 6 through the first feeding mechanism 33, waiting for further steps. Chip detection. The present invention adds an adjustment mechanism 34 to facilitate the detection platform 31 to meet the different position requirements of the transfer mechanism 32 and the first chip detection device 4, which is beneficial to the accurate and stable movement of the carrier and the rapid detection of chips. Specifically, the transfer mechanism 32 can use the existing multi-axis linear module and the drive structure of the clamping jaw cylinder, and the adjustment mechanism 34 can use the existing multi-axis linear module, which will not be described again here. The first silo 2 is connected to the frame 1 via a lifting drive, and the first silo 2 is raised and lowered so that the height of the carrier in the horizontal direction is adapted to the output end of the picking mechanism 35 .

Further, the first feeding mechanism 33 includes a slide rail 36 provided on the frame 1 , a linear driver 37 provided on the slide rail 36 , a clamping member 38 slidingly connected to the slide rail 36 and a clamping member 38 provided on the frame 1 The transfer mechanism 32 is used to transfer the detected carrier to the two placement platforms 39 and is located on both sides of the slide rail 36 respectively. The two placement platforms 39 cooperate to support the carrier. The output end of the clamping member 38 is connected to a linear driver 37 , the clamping member 38 can clamp the carrier, and the linear driver 37 is used to drive the clamping member 38 toward or away from the film expansion device 6 .

In actual use, the linear driver 37 adopts an existing driving structure in which a motor and a screw rod cooperate. The linear drive 37 drives the clamping member 38 to slide relative to the slide rail 36 along the length direction of the slide rail 36. The clamping member 38 approaches the carrier and clamps the carrier located on the placement table 39, and then the linear drive 37 continues to drive the carrier. Moving in a direction closer to the film expansion device 6 , the clamping member 38 passes through the two placement stages 39 and then places the carrier on the film expansion device 6 . The two placement platforms 39 are respectively arranged on two of the slide rails 36. The height of the carrier placed on the placement platform 39 is adapted to the height of the clamping member 38. This not only facilitates the clamping member 38 to clamp the carrier, but also facilitates the clamping member 38 to hold the carrier. Interference with the conveying movement of the clamping member 38 can be avoided. The structure of the first feeding mechanism 33 is simple and ingenious, realizing rapid transfer of the carrier. The material picking mechanism 35, the second feeding mechanism 15 and the third feeding mechanism 17 have the same or similar structure as the first feeding mechanism 33. The clamping member 38 can use an existing cylinder clamp, which will not be described again here.

Further, the chip grabbing device 5 includes a first grabbing device mechanism 51, a transfer platform 53 and a second grabbing device mechanism 52 respectively provided on the frame 1. The first grabbing device mechanism 51 is used for The film expansion device 6, the second chip detection device 8, the waste recycling structure 7 and the transfer table 53 move back and forth to transport the chips on the expanded film to the second chip detection device 8, and pass the second chip detection After the device 8 detects the chip, the first grabbing device mechanism 51 selects to transport the chip to the transfer table 53 or the waste recycling structure 7 according to the detection results; the second grabbing device mechanism 52 is used to transfer the chip to the transfer table 53 and the placement The worktables 9 reciprocate to transport the chips on the transfer table 53 to the film mounted on the carrier placed on the placement worktable 9 .

Specifically, the chip grabbing device 5 also includes a first visual detection device 54 for detecting the position of the chip on the transfer table 53 . During actual use, the first grabbing device mechanism 51 grabs the expanded chips and sends them to the second chip detection device 8 for detection, and transports the qualified chips to the transfer stage 53 for analysis by the first visual detection device 54 The chip is located on the transfer platform 53, and then the position information of the chip is sent to the second grabbing device mechanism 52, which facilitates the second grabbing device mechanism 52 to accurately grab the chip, and also facilitates the second grabbing device mechanism 52 to accurately grab the chip. Mounting the chip on the sheet on the mounting workbench 9 improves the positional accuracy of the chip and the sheet, which is beneficial to placing the chips on the sheet in an orderly manner. The chip and the sheet can be fixed by adhesive.

Further, the chip detection and sorting machine also includes a first moving mechanism 10 and a second moving mechanism 11 respectively provided on the frame 1, and the film expansion device 6 is connected to the output end of the first moving mechanism 10; The mounting workbench 9 is connected to the output end of the second moving mechanism 11 .

When the first grabbing device mechanism 51 needs to grab the chip on the film expansion device 6 , the first moving mechanism 10 drives the film expansion device 6 to move relative to the frame 1 so that the chip to be grabbed moves to the chip grabbing device 5 below to facilitate the chip grabbing device 5 to grab the chip next time. When the second grabbing device mechanism 52 needs to attach the chip to the carrier of the placement workbench 9, the second moving mechanism 11 drives the placement workbench 9 to move relative to the frame 1, so that the position where the chip is to be placed moves. to the bottom of the chip grabbing device 5 to facilitate the chip grabbing device 5 to mount or place chips next time. Both the first moving mechanism 10 and the second moving mechanism 11 can adopt linear drive modules.

Furthermore, the chip detection and sorting machine also includes a second visual detection device 12 and a third visual detection device 13 respectively provided on the frame 1. The second visual detection device 12 is used to detect the chips to be processed on the film expansion device 6. Whether the captured chip moves to below the working end of the first grabbing device mechanism 51; the third visual detection device 13 is used to detect whether the position of the chip to be placed on the film on the mounting workbench 9 moves to the second Below the working end of the gripper mechanism 52 .

During actual use, the first moving mechanism 10 drives the film expansion device 6 to move relative to the frame 1 so that the chips to be grabbed move below the chip grabbing device 5 , and the second visual detection device 12 detects the moved chips. Whether the chip to be grabbed is moved into place will further improve the accuracy of the first grabbing device mechanism 51 in grabbing the chip. The second moving mechanism 11 drives the mounting workbench 9 to move relative to the frame 1, so that the position where the chip is to be placed moves to the bottom of the chip grabbing device 5. After the second grabbing device mechanism 52 mounts the chip, the third The visual inspection device 13 can also perform a visual re-inspection of the position of the chip and the surface of the top of the chip to detect whether the chip is mounted in place or whether the chip surface is qualified, which not only further improves the accuracy of the second grabbing device mechanism 52 in grabbing the chip, It also improves the detection accuracy of the chip.

Furthermore, the chip detection and sorting machine also includes a lifting device 14, which is used to lift the expanded sheet.

In actual use, the ejection device 14 includes an ejection driver and an ejection piece provided at the output end of the ejection driver. The ejection driver can use an existing cylinder. The ejector driver drives the ejector member to push up the sheet, and the chip where the ejector member pushes up the sheet bulges upward, making it easier for the first grabbing device mechanism 51 to pick up. The central axis of the ejection piece and the second visual inspection device 12 are located on the same vertical line. The second visual detection device 12 can also transmit the detected position of the chip on the film to the ejection driver. The ejection driver drives the ejection piece to move to the chip to be picked up by the first grabbing device mechanism 51 according to the received position signal. and lift it up. The chip is lifted up conveniently and accurately.

Further, the first grabbing device mechanism 51 includes a swing arm drive assembly 55 disposed on the frame 1 , a swing arm body 56 disposed at the output end of the swing arm drive assembly 55 , and a suction pump disposed on the swing arm body 56 . Material assembly 57, the swing arm driving assembly 55 is used to drive the swing arm body 56 to rotate and lift, so that the suction assembly 57 can rotate to the film expansion device 6, the second chip detection device 8 and the transfer table 53, and also facilitate the suction of materials. Component 57 picks up or releases the chip.

In actual use, the swing arm driving assembly 55 can adopt an existing structure in which a rotary driver and a lifting driver cooperate. The suction component 57 can use an existing suction cup component. The swing arm body 56 and the suction assembly 57 are driven to rotate by the swing arm driving assembly 55. The swing arm body 56 rotates with the connection between the output end of the swing arm driving assembly 55 and the swing arm body 56 as an axis. The material assembly 57 can accurately rotate to the top of the film expansion device 6, the second chip detection device 8 and the transfer table 53. The swing arm driving assembly 55 drives the swing arm body 56 and the suction assembly 57 to rise and fall to facilitate the suction assembly 57 to absorb the material. Or release the chip. The first grabbing device mechanism 51 has a simple mechanism and can transport chips accurately and conveniently.

Further, the swing arm driving assembly 55 includes a mounting base 58 provided on the frame 1 , a first rotation driver 59 and a second rotation driver 60 respectively provided on the mounting base 58 , and The connecting component 61 at the output end, the output shaft 62 provided at the output end of the second rotary driver 60 , the eccentric shaft 63 eccentrically connected to the output shaft 62 , the swinging member 65 with one end rotatably connected to the eccentric shaft 63 and the other end of the swinging member 65 The driving member 64 is rotationally connected. The swing arm body 56 is slidingly connected to the connecting assembly 61. The driving member 64 is used for driving connection with the swing arm body 56; the first rotating driver 59 can be used to drive the connecting assembly 61 and the connecting assembly 61. The swing arm body 56 rotates; the second rotary driver 60 is used to drive the output shaft 62 to rotate, and the output shaft 62 drives the swing arm body 56 to rise and fall relative to the connecting assembly 61 through the eccentric shaft 63, the swing member 65 and the driving member 64. slide.

Specifically, the top end of the driving member 64 conflicts with the swing arm body 56, and the swing arm body 56 can rotate relative to the driving member 64. The output shaft 62 and the eccentric shaft 63 are both arranged parallel to the horizontal plane. In actual use, first, the chips that need to be moved are sucked through the suction component 57, and then the first rotation driver 59 drives the connecting component 61, the swing arm body 56 and the chip to rotate along the vertical axis. At this time, the swing arm body 56 is relatively Rotate the driving member 64 until the chip rotates to the appropriate position. Then the second rotary driver 60 drives the output shaft 62 and the eccentric shaft 63 to rotate synchronously, drives the swing member 65 and the driving member 64 to rise or fall relative to the vertical direction through the eccentric shaft 63, and then drives and supports the swing arm body 56 through the driving member 64 The swing arm body 56 moves upward, or the driving member 64 moves downward and no longer supports the swing arm body 56, and the swing arm body 56 moves downward under the action of gravity; the swing arm body 56 can slide relative to the connecting component 61 during the lifting process, and then absorb material The component 57 absorbs or releases the chip, thereby realizing automated handling of the chip. The chip of the present invention is convenient to transport and has simple transport steps. Both the first rotary driver 59 and the second rotary driver 60 can use rotary motors. The movement strokes of the first rotary driver 59 and the second rotary driver 60 are precise, and the accuracy during chip transportation is high; the connection component 61 and the swing arm body 56 The connection structure between the driving member 64 and the eccentric shaft 63 is simple and compact, and the rotation and lifting movements of the swing arm body 56 do not interfere with each other.

Specifically, the swing arm driving assembly 55 also includes a sleeve 66 that is sleeved outside the output shaft 62 and is keyed to the output shaft 62. One end of the eccentric shaft 63 is eccentrically arranged on the sleeve 66, and the eccentric shaft 63 is eccentrically mounted on the sleeve 66. The other end of the shaft 63 is rotatably connected to the swing member 65 . The structure of the second grabbing device mechanism 52 is the same or similar to the structure of the first grabbing device mechanism 51 and will not be described again here.

In actual use, the eccentric shaft 63 and the sleeve 66 are of an integrated structure. After the sleeve 66 is keyed to the output shaft 62, the eccentric shaft 63 is rotationally connected to the swinging member 65, and then the swinging member 65 is connected. Connected to drive member 64. The structure of the eccentric shaft 63, the sleeve 66, the output shaft 62 and the driving part 64 is simple and easy to connect.

Specifically, the first chip detection device 4 and the second chip detection device 8 can now use existing AOI detection components, and the first visual detection device 54 , the second visual detection device 12 and the third visual detection device 13 can all be used. The existing CCD visual inspection device; the film expansion device can use the existing film expansion mechanism; the mounting workbench 9 can use the existing chip solidification platform, which will not be described again here.

All technical features in this embodiment can be freely combined according to actual needs.

The above embodiments are preferred implementation solutions of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious substitutions are within the protection scope of the present invention without departing from the concept of the technical solution.

Claims (10)

1. A chip detection and sorting machine, characterized in that: it includes a frame (1) and a first bunker (2), a feeding device (3), a first chip detection device (3) respectively arranged on the frame (1) 4), chip grabbing device (5), film expansion device (6), waste recycling structure (7), second chip detection device (8) and placement workbench (9), the first material bin (2 ) stores multiple carriers; the feeding device (3) reciprocates between the first silo (2), the first chip detection device (4) and the film expansion device (6) to move the carriers from The first silo (2) is sequentially transported to the first chip detection device (4) and the film expansion device (6). The first chip detection device (4) is used to detect the carrier transported by the feeding device (3). The chip on the carrier is detected; the film expansion device (6) is used to place the carrier and can tighten the film on the carrier; the mounting workbench (9) is adsorbed with the carrier; the chip grab The device (5) can reciprocate between the film expansion device (6), the second chip detection device (8), the waste recycling structure (7) and the mounting workbench (9) to put the expanded film onto the carrier. The chip is transported to the second chip detection device (8). After the chip captured by the chip grabbing device (5) is detected by the second chip detection device (8), the second chip detection device (8) then affixes the chip to the second chip detection device (8). Mount it on the carrier of the placement workbench (9) or transport it to the waste recycling structure (7) for recycling. 2. A chip detection and sorting machine according to claim 1, characterized in that: the chip detection and sorting machine further includes a second feeding mechanism (15) and a second silo respectively arranged on the frame (1). (16), the second feeding mechanism (15) is used to transport the carriers on the film expansion device (6) to the second silo (16); the second silo (16) is used to store the carriers. Tool. 3. A chip detection and sorting machine according to claim 1, characterized in that: the chip detection and sorting machine further includes a third feeding mechanism (17) and a third silo respectively arranged on the frame (1). (18), the third feeding mechanism (17) is used to transport the carrier on the placement workbench (9) to the third silo (18) or the carrier in the third silo (18) Transported to the mounting workbench (9); the third bin (18) is used to store the carrier. 4. A chip detection and sorting machine according to claim 1, characterized in that: the feeding device (3) includes a detection table (31) and a transfer mechanism (32) respectively provided on the frame (1). The first feeding mechanism (33), the adjusting mechanism (34) and the picking up mechanism (35); the output end of the adjusting mechanism (34) is connected to the detection platform (31); the picking up mechanism (35) is used to The carrier in the first material bin (2) is taken out, and the transfer mechanism (32) can reciprocate between the material picking mechanism (35), the detection table (31) and the first feeding mechanism (33) to transfer the material taken out. The carriers taken out by the material mechanism (35) are sequentially transported to the detection table (31) and the first feeding mechanism (33); the adjustment mechanism (34) is used to drive the detection table (31) in the first chip detection device (4) and the transfer mechanism (32); the detection stage (31) is used to adsorb the carrier; the first chip detection device (4) is used to detect the chip on the detection stage (31); The first feeding mechanism (33) is used to transport the carrier to the film expansion device (6). 5. A chip detection and sorting machine according to claim 4, characterized in that: the first feeding mechanism (33) includes a slide rail (36) provided on the frame (1), and a slide rail (36) provided on the frame (1). The linear actuator (37) on the slide rail (36), the clamping member (38) slidingly connected with the slide rail (36), and the two placement platforms provided on the frame (1) and located on both sides of the slide rail (36). (39), the transfer mechanism (32) is used to transfer the inspected carrier to two placement platforms (39), and the two placement platforms (39) cooperate to support the carrier, and the clamping member (38 ) is connected to the linear drive (37), the clamping member (38) can clamp the carrier, and the linear drive (37) is used to drive the clamping member (38) close to or away from the film expansion device (6 ). 6. A chip detection and sorting machine according to claim 1, characterized in that: the chip grabbing device (5) includes a first grabbing device mechanism (51) respectively arranged on the frame (1). The transfer platform (53) and the second grabbing device mechanism (52), the first grabbing device mechanism (51) is used in the film expansion device (6), the second chip detection device (8), the waste recycling structure ( 7) and the transfer stage (53) to transport the chips on the expanded film to the second chip detection device (8). After the chips are detected by the second chip detection device (8), the A grabbing device mechanism (51) selects to transport the chip to the transfer table (53) or the waste recycling structure (7) according to the detection results; the second grabbing device mechanism (52) is used to transfer the chips between the transfer table (53) and the sticker. The chip on the transfer table (53) is reciprocated between the mounting workbench (9) to be mounted on the carrier placed on the mounting workbench (9). 7. A chip detection and sorting machine according to claim 1, characterized in that: the chip detection and sorting machine further includes a first moving mechanism (10) and a second moving mechanism respectively arranged on the frame (1). (11), the film expansion device (6) is connected to the output end of the first moving mechanism (10); the mounting workbench (9) is connected to the output end of the second moving mechanism (11). 8. A chip detection and sorting machine according to claim 6, characterized in that: the chip detection and sorting machine further includes a second visual detection device (12) and a third visual detection device respectively arranged on the frame (1). Detection device (13), the second visual detection device (12) is used to detect whether the chip to be grasped on the film expansion device (6) moves to the working end of the first grasping device mechanism (51); the second visual detection device (12) The three-vision detection device (13) is used to detect whether the position of the chip to be mounted on the film on the mounting workbench (9) moves to the working end of the second grabbing device mechanism (52). 9. A chip detection and sorting machine according to claim 6, characterized in that: the first grabbing device mechanism (51) includes a swing arm drive assembly (55) provided on the frame (1), The swing arm body (56) at the output end of the swing arm driving assembly (55) and the suction assembly (57) provided on the swing arm body (56), the swing arm driving assembly (55) is used to drive the swing arm body (56) Rotation and lifting. 10. A chip detection and selection method, characterized in that: it includes a chip detection and selection machine according to any one of claims 1-9, and the steps of the chip detection and selection method are as follows: Step 1: The feeding device (3) takes out the carrier in the first bin (2) and transports the carrier to the first chip detection device (4); Step 2: Use the first chip detection device (4) to simultaneously detect multiple chips on the carrier, and send the detected signals to the feeding device (3) and the chip grabbing device (5) respectively; Step 3: The feeding device (3) continues to transport the inspected carrier to the film expansion device (6), places the carrier through the film expansion device (6) and tensions the film on the carrier; Step 4: The chip grabbing device (5) grabs the chips on the film of the tensioned carrier one by one to the second chip detection device (8); Step 5: Detect the chip of the chip grabbing device (5) through the second chip detection device (8), and send the detected signal to the chip grabbing device (5); Step 6: The carrier to be mounted is adsorbed on the mounting workbench (9); if the first chip detection device (4) and the second chip detection device (8) send the chip detection results to the chip grabbing device (5) If all are qualified, the chip grabbing device (5) will continue to transport the chip to the mounting workbench (9), and mount the chip on the carrier adsorbed by the mounting workbench (9); if the first chip detection device (4) or if one of the chip detection results sent by the second chip detection device (8) to the chip capture device (5) is unqualified, the chip capture device (5) continues to transport the chip to the waste recycling structure (7), The chips are recycled through the scrap recycling structure (7).