CN117594499A - Full-automatic multi-head machine power module sticking equipment - Google Patents
Full-automatic multi-head machine power module sticking equipment Download PDFInfo
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- CN117594499A CN117594499A CN202410073881.3A CN202410073881A CN117594499A CN 117594499 A CN117594499 A CN 117594499A CN 202410073881 A CN202410073881 A CN 202410073881A CN 117594499 A CN117594499 A CN 117594499A
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- 230000007246 mechanism Effects 0.000 claims abstract description 122
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 81
- 238000003825 pressing Methods 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims description 23
- 230000008275 binding mechanism Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 16
- 238000003756 stirring Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the technical field of semiconductor packaging, in particular to full-automatic multi-head machine power module bonding equipment, which comprises a conveying track, a tin drawing and pressing mechanism, a first wafer table mechanism, a second wafer table mechanism and a pickup device, wherein a heating module is arranged in the conveying track and is used for heating a conveyed frame; the tin drawing and pressing mechanism is positioned at one side of the conveying track and is used for drawing and pressing tin on the frame; the first wafer table mechanism and the second wafer table mechanism are positioned on the other side of the conveying track, a first type of chips are adsorbed and fixed on the first wafer table mechanism, and a second type of chips are adsorbed and fixed on the second wafer table mechanism; the pick-up device is used for picking up the first chip and the second chip which are adsorbed and fixed on the first wafer platform mechanism and the second wafer platform mechanism to the tin drawing and pressing position on the frame so as to finish the fixation of the two chips. The packaging quality can be improved by bonding more than two different chips to the frame through one-time heating and cooling.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to full-automatic multi-head machine power module bonding equipment.
Background
The existing power module single-tube packaging technology needs two piece-sticking equipment to realize the sticking of two different chips, so that the cost and the resource energy consumption of the existing power module single-tube packaging equipment are high, and more space and required equipment operators are occupied.
When bonding the chip in the traditional packaging process, the frame needs to be heated through two piece of bonding equipment, and due to the adoption of soldering tin with the same melting point, the soldering tin of the first chip can be melted when bonding the second chip, so that the problems of position deviation, uneven soldering tin thickness, bubble increase and the like occur. If the second chip is bonded by adopting the soldering tin with a lower melting point, the series resistance is increased, the use is affected, the frame is heated and cooled twice, the influence on the physical and mechanical properties is caused, and the time cost is increased. And expansion with heat and contraction with cold in the heating and cooling process can also cause deformation of the frame, influence the passing of the second sticking sheet, cause clamping and scrap.
Therefore, in order to cope with the increasingly complex module packaging requirements, the application proposes equipment capable of packaging various chips with different types and different sizes at one time, thereby improving the reliability of products and the productivity of the equipment, and simultaneously saving occupied production areas and reducing equipment operators.
Disclosure of Invention
Based on the above, it is necessary to provide a full-automatic multi-head power module die bonding device, which can bond more than two different chips to a frame through one-time heating and cooling, thereby completing and improving the packaging quality and efficiency of the product.
The invention provides full-automatic multi-head machine power module sticking equipment, which comprises:
the conveying rail is internally provided with a heating module and is used for heating the conveyed frame;
the tin drawing and pressing mechanism is positioned at one side of the conveying track and is used for drawing and pressing tin on the frame;
the first wafer table mechanism and the second wafer table mechanism are positioned on the other side of the conveying track, one type of chip is adsorbed and fixed on the first wafer table mechanism, and the second type of chip is adsorbed and fixed on the second wafer table mechanism;
and the pick-up device is used for picking up the first chip and the second chip which are adsorbed and fixed on the first wafer table mechanism and the second wafer table mechanism to the tin drawing and pressing position on the frame so as to finish the fixation of the two chips.
In one embodiment, the pick-up device includes a shifting mechanism; the moving and cutting mechanism is used for picking up a chip of the type adsorbed and fixed on the first wafer table mechanism onto the chip transfer table, the chip transfer table adsorbs and fixes the chip of the type, and the chip transfer table and the second wafer table mechanism are arranged in parallel.
In one embodiment, the pickup device further includes a multi-binding mechanism, where the multi-binding mechanism is configured to pick up a first chip on the turntable of the chip and a second chip that is adsorbed and fixed on the second turntable mechanism onto the frame.
In one embodiment, the first wafer table mechanism is provided with a left wafer table upper camera, the left wafer table upper camera is used for identifying and positioning a type of chips adsorbed and fixed on the first wafer table mechanism, and the moving and cutting mechanism picks up the type of chips to the chip middle turntable according to the identifying and positioning result of the left wafer table upper camera.
In one embodiment, the second wafer table mechanism is provided with a right wafer table upper camera, and the right wafer table upper camera is used for identifying and positioning the second-class chips adsorbed and fixed on the second wafer table mechanism; the chip transferring table is provided with a transferring table upper camera which is used for identifying and positioning a chip of the type adsorbed and fixed on the chip transferring table; and the multi-binding head mechanism picks up the first chip and the second chip on the frame according to the identification and positioning results of the camera on the right wafer table and the camera on the middle turntable.
In one embodiment, after the identification and positioning of the first type of chips by the camera on the left wafer table are completed, the first thimble mechanism below the first wafer table mechanism is started, and the chips adsorbed by the first wafer table mechanism are loosened.
In one embodiment, after the camera on the right wafer table completes the identification and positioning of the second type of chips, the second thimble mechanism below the second wafer table mechanism is started, and the chips adsorbed by the second wafer table mechanism are loosened.
In one embodiment, the device further comprises an on-track camera which is positioned above the conveying track and used for identifying and positioning the frame conveyed by the conveying track, and the multi-binding head mechanism picks up the first chip and the second chip to the tin drawing and pressing position on the frame according to the identification and positioning result of the on-track camera.
In one embodiment, the frame loading device further comprises a loading device, wherein the loading device is positioned at the head end of the conveying track and is used for taking the frame out of the frame carrier and conveying the frame into the conveying track.
In one embodiment, the device further comprises a material receiving mechanism, wherein the material receiving mechanism is positioned at the tail end of the conveying track and is used for stacking the frame layer with the chips fixed into the material box.
Above-mentioned full-automatic bull machine power module bonding device, the delivery track can carry the frame when using to carry the in-process that carries to the frame heats, draws tin on the frame after the tin pressing mechanism can heat afterwards and draw tin, and adds tin and press into suitable structure, and the first mechanism of binding of many this moment can pick up two chips (or a plurality of different types of chips) that adsorb on first wafer platform mechanism and the second wafer platform mechanism, and fixes drawing tin pressing position on the frame, thereby accomplish the bonding. The wafer bonding device integrates the functions of two original devices into one device, so that the cost of the device, the energy consumption of resources and occupied space and operators are reduced. And the device can bond more than two different chips to the frame through one-time heating and cooling, thereby completing and improving the packaging quality and efficiency of the product.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a die bonding apparatus according to the present invention;
fig. 2 is a schematic perspective view of internal components of the die bonding apparatus according to the present invention;
FIG. 3 is a schematic structural view of the loader provided by the invention;
FIG. 4 is a schematic view of a conveying track according to the present invention;
FIG. 5 is a schematic diagram of a camera on a left wafer stage according to the present invention;
FIG. 6 is a schematic diagram of a structure of a tin drawing and pressing mechanism provided by the invention;
fig. 7 is a schematic structural diagram of an on-track camera according to the present invention;
FIG. 8 is a schematic diagram of a multi-binding mechanism according to the present invention;
FIG. 9 is a second schematic diagram of a multi-binding mechanism according to the present invention;
FIG. 10 is a schematic diagram of a wafer table mechanism according to the present invention;
FIG. 11 is a schematic structural view of a shifting mechanism according to the present invention;
fig. 12 is a schematic structural diagram of a receiving mechanism provided by the invention.
Reference numerals:
1. feeding a material device; 2. a conveying rail; 3. a left wafer table upper camera; 4. drawing tin and pressing tin mechanism; 5. an on-track camera; 6. a multi-binding mechanism; 7. a first wafer stage mechanism; 8. a moving and cutting mechanism; 9. a second wafer stage mechanism; 10. a material receiving mechanism; 11. a Y-axis feeding motor; 12. a feeding rail; 13. vacuum suction claw; 14. a feed rail motor; 15. a Z-axis feeding motor; 16. a frame stage; 17. a waste bin; 18. a track body; 19. a track linear bearing base; 20. an X-axis stirring motor; 21. a Z-axis stirring motor; 22. a frame material poking rod; 23. z-axis drawing tin press frame motor; 24. z-axis drawing tin press frame sliding block; 25. z-axis tin-pressing frame motor; 26. an air pipe; 27. a heating rod; 28. a camera fixing seat; 29. a first camera; 30. a first zoom lens; 31. a first light source; 32. drawing tin and pressing tin motor on Y axis; 33. y-axis drawing tin pressing sliding block; 34. x-axis drawing tin pressing motor; 35. x-axis drawing tin pressing sliding block; 36. z-axis tin drawing motor; 37. z-axis drawing tin slide block; 38. a first tin drawing motor; 39. drawing tin heads; 40. z-axis tin pressing motor; 41. z-axis tin pressing sliding block; 42. a tin pressing head; 43. a second camera; 44. a second zoom lens; 45. a second light source; 46. a Y-axis readhead sensor; 47. a camera Y-axis motor; 48. a camera Y-axis guide rail; 49. x-axis double-welding-head guide rail; 50. z-axis double-welding-head motor; 51. a camera on the right wafer table; 52. a third zoom lens; 53. a camera is arranged on the middle rotary table; 54. y-axis double-welding-head motor; 55. y-axis double-welding-head guide rail; 56. a third light source; 57. a first lens; 58. a chip transfer table; 59. a point light source; 60. an ion blower; 61. z-axis double-welding-head sliding rail; 62. a Z-axis transfer table welding head motor; 63. z-axis transfer table welding head sliding rail; 64. a Z-axis transfer table welding head reading head sensor; 65. z-axis double-welding-head reading head sensor; 66. a welding head rotating motor; 67. a Z-axis voice coil motor; 68. a first Z-axis displacement sensor; 69. a first horn nozzle; 70. z-axis round table lifting motor; 71. round bench; 72. lifting the screw rod; 73. a Z-axis round table rotating motor; 74. an X-axis round table motor; 75. x-axis circular table motor guide rail; 76. a thimble mechanism; 77. y-axis round table motor guide rail; 78. a Y-axis round table motor; 79. an X-axis moving and cutting motor; 80. x-axis moving and cutting a motor guide rail; 81. y-axis moving and cutting motor; 82. a Z-axis moving and cutting motor; 83. z-axis moving and cutting a motor guide rail; 84. a second Z-axis displacement sensor; 85. a first voice coil motor; 86. a second horn nozzle; 87. a first displacement sensor; 88. a material receiving motor; 89. a first cylinder; 90. a magazine; 91. a magazine carrying bar; 92. a magazine push rod; 93. and a second cylinder.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The full-automatic multi-head power module die bonding apparatus of the present invention is described below with reference to fig. 1 to 12.
As shown in fig. 1, in one embodiment, a full-automatic multi-head power module bonding apparatus includes a conveying track 2, a tin drawing and pressing mechanism 4, a first wafer table mechanism 7, a second wafer table mechanism 9 and a pickup device; the conveying track 2 is internally provided with a heating module for heating the conveyed frame; the tin drawing and pressing mechanism 4 is positioned at one side of the conveying track 2 and is used for drawing and pressing tin on the frame; the first wafer table mechanism 7 and the second wafer table mechanism 9 are positioned on the other side of the conveying track 2, one type of chip is adsorbed and fixed on the first wafer table mechanism 7, and the second type of chip is adsorbed and fixed on the second wafer table mechanism 9; the pick-up device is used for picking up the first chip and the second chip which are adsorbed and fixed on the first wafer table mechanism 7 and the second wafer table mechanism 9 to the drawing tin and pressing tin position on the frame so as to finish the fixation of the two chips.
Preferably, the first wafer table mechanism 7 and the second wafer table mechanism 9 respectively adopt an 8-inch wafer table mechanism and a 12-inch wafer table mechanism to fix two types of chips.
The full-automatic multi-head machine power module bonding device is characterized in that the conveying track 2 can convey the frame when in use, the frame is heated in the conveying process, then the tin drawing and pressing mechanism 4 can draw tin on the heated frame and add tin to press the tin into a proper structure, at the moment, the multi-binding head mechanism 6 can pick up two chips (or a plurality of chips of different types) adsorbed on the first wafer table mechanism 7 and the second wafer table mechanism 9 and fix the tin drawing and pressing position on the frame, so that bonding is completed. The wafer bonding device integrates the functions of two original devices into one device, so that the cost of the device, the energy consumption of resources and occupied space and operators are reduced. And the device can bond more than two different chips to the frame through one-time heating and cooling, thereby completing and improving the packaging quality and efficiency of the product.
As shown in fig. 4, the conveying track 2 comprises a track body 18, a track linear bearing base 19, an X-axis material stirring motor 20, a Z-axis material stirring motor 21, a frame material stirring rod 22, an air pipe 26, a heating rod 27, a Z-axis tin-drawing frame motor 23, a Z-axis tin-drawing frame sliding block 24 and a Z-axis tin-drawing frame motor 25; the upper cover of the track body 18 is provided with a cover plate, the cover plate is used for providing a relatively closed environment for the frame on the track body 18, the track linear bearing base 19 is used for realizing self-adaptive thermal expansion and contraction of the track, the X-axis material stirring motor 20 is used for driving the frame material stirring rod 22 to move in the X direction, the Z-axis material stirring motor 21 is used for driving the frame material stirring rod 22 to move in the Z direction, the Z-axis tin drawing and pressing frame motor 23 is used for flattening the frame, the position is prevented from being moved during tin drawing operation, the Z-axis tin drawing and pressing frame motor 25 is used for flattening the frame, the position is prevented from being moved during tin pressing operation, the air pipe 26 is used for connecting the cover plate so as to communicate with the protective gas, and the heating rod 27 is used for heating the track body 18.
As shown in fig. 6, the drawing tin pressing mechanism 4 includes a Y-axis drawing tin pressing motor 32, a Y-axis drawing tin pressing slider 33, an X-axis drawing tin pressing motor 34, an X-axis drawing tin pressing slider 35, a Z-axis drawing tin motor 36, a Z-axis drawing tin slider 37, a first drawing tin motor 38, a drawing tin head 39, a Z-axis tin pressing motor 40, a Z-axis tin pressing slider 41, and a tin pressing head 42; the Y-axis drawing tin pressing motor 32 is used for respectively moving the moving picture tin and the pressing tin along the Y direction, the X-axis drawing tin pressing motor 34 is used for respectively moving the moving picture tin and the pressing tin along the X direction, the Z-axis drawing tin motor 36 is used for moving the moving picture tin head 39 along the Z direction, the first drawing tin motor 38 is used for conveying tin wires, the drawing tin head 39 is used for drawing tin for the frame, the Z-axis tin pressing motor 40 is used for driving the pressing tin head 42 to move along the Z direction, and the pressing tin head 42 is used for pressing tin for the frame.
Specifically, as shown in fig. 10, the first wafer table mechanism 7 and the second wafer table mechanism 9 have the same structure, and include a Z-axis table lifting motor 70, a table 71, a lifting screw 72, a Z-axis table rotating motor 73, an X-axis table motor 74, an X-axis table motor guide rail 75, a thimble mechanism 76, a Y-axis table motor guide rail 77, and a Y-axis table motor 78; the Z-axis round table lifting motor 70 is used for driving the lifting screw rod 72 to finish lifting adjustment of the round table 71, the Z-axis round table rotating motor 73 is used for driving the round table 71 to rotate, the X-axis round table motor 74 is used for driving the round table 71 to adjust in the X direction, the thimble mechanism 76 is used for pushing and loosening chips adsorbed on the round table 71, and the Y-axis round table motor 78 is used for driving the round table 71 to adjust in the Y direction.
In one embodiment, the pick-up device comprises a moving cutting mechanism 8; the moving and cutting mechanism 8 is used for picking up a chip of a type adsorbed and fixed on the first wafer table mechanism 7 onto the chip turntable 58, the chip turntable 58 adsorbs and fixes the chip of the type, and the chip turntable 58 and the second wafer table mechanism 9 are arranged in parallel.
As shown in fig. 11, the shift cutting mechanism 8 includes an X-axis shift cutting motor 79, an X-axis shift cutting motor guide 80, a Y-axis shift cutting motor 81, a Z-axis shift cutting motor 82, a Z-axis shift cutting motor guide 83, a second Z-axis displacement sensor 84, a first voice coil motor 85, a second horn suction nozzle 86, and a first displacement sensor 87. The X-axis moving and cutting motor 79 is used for driving the second welding head suction nozzle 86 to move along the X-direction, the Y-axis moving and cutting motor 81 is used for driving the second welding head suction nozzle 86 to adjust along the Y-position, the Z-axis moving and cutting motor 82 is used for driving the second welding head suction nozzle 86 to adjust along the Z-position, the second Z-axis displacement sensor 84 is used for detecting the Z-axis moving distance of the second welding head suction nozzle 86, and the second welding head suction nozzle 86 is responsible for taking and placing chips.
In one embodiment, the pick-up device further comprises a multi-binding mechanism 6, and the multi-binding mechanism 6 is used for picking up the first type of chips on the chip turntable 58 and the second type of chips adsorbed and fixed on the second wafer table mechanism 9 onto the frame.
Specifically, as shown in fig. 8 and 9, the multi-bonding-head mechanism 6 includes an X-axis twin-horn guide rail 49, a Z-axis twin-horn motor 50, a third zoom lens 52, a Y-axis twin-horn motor 54, a Y-axis twin-horn guide rail 55, a third light source 56, a first lens 57, a point light source 59, an ion blower 60, a Z-axis twin-horn guide rail 61, a Z-axis transfer-table horn motor 62, a Z-axis transfer-table horn guide rail 63, a Z-axis transfer-table horn head sensor 64, a Z-axis twin-horn head sensor 65, a horn rotating motor 66, a Z-axis voice coil motor 67, a first Z-axis displacement sensor 68, and a first horn suction nozzle 69; the X-axis double-welding-head guide rail 49 is used for driving the first welding-head suction nozzle 69 to adjust in the X direction, the Z-axis double-welding-head motor 50 is used for driving the first welding-head suction nozzle 69 to adjust in the Z direction, the third zoom lens 52 is arranged on the right wafer table upper camera 51, the Y-axis double-welding-head motor 54 is arranged on the Y-axis double-welding-head guide rail 55 and used for driving the first welding-head suction nozzle 69 to adjust in the Y direction, the third light source 56 is used for providing a light source for the right wafer table upper camera 51, the first lens 57 is arranged on the right wafer table upper camera 51, the point light source 59 is used for providing a light source for the middle turntable upper camera 53, the ion fan 60 is used for providing wind power absorption for the chip middle turntable 58, the Z-axis middle turntable welding-head motor 62 is used for driving the first welding-head suction nozzle 69 to move in the Z direction, the welding-head rotating motor 66 is used for positioning the rotation angle position of the chip, and the first welding-head suction nozzle 69 is used for taking and placing the chip.
In one embodiment, the first wafer table mechanism 7 is provided with a left wafer table upper camera 3, the left wafer table upper camera 3 is used for identifying and positioning a type of chips adsorbed and fixed on the first wafer table mechanism 7, and the moving and cutting mechanism 8 picks up the type of chips to the chip middle turntable 58 according to the identifying and positioning result of the left wafer table upper camera 3.
In one embodiment, the second wafer table mechanism 9 is provided with a right wafer table upper camera 51, and the right wafer table upper camera 51 is used for identifying and positioning the two kinds of chips adsorbed and fixed on the second wafer table mechanism 9; the chip turntable 58 is provided with a turntable upper camera 53, and the turntable upper camera 53 is used for identifying and positioning a chip of the type adsorbed and fixed on the chip turntable 58; the multi-binding head mechanism 6 picks up the first chip and the second chip on the frame according to the recognition and positioning results of the right wafer table upper camera 51 and the middle turntable upper camera 53.
Specifically, as shown in fig. 5, the left wafer stage upper camera 3 has the same structure as the right wafer stage upper camera 51, and the left wafer stage upper camera 3 includes a camera fixing base 28, a first camera 29, a first zoom lens 30, and a first light source 31, where the camera fixing base 28 is used to fix the first camera 29, the first zoom lens 30 is mounted on the first camera 29, and the first light source 31 is used to provide a light source for the first camera 29.
In one embodiment, after the camera 3 on the left wafer table completes the identification and positioning of a type of chip, the first ejector pin mechanism below the first wafer table mechanism 7 is started, and the chip adsorbed by the first wafer table mechanism 7 is ejected loose.
In one embodiment, after the camera 51 on the right wafer table completes the identification and positioning of the second type of chips, the second ejector mechanism below the second wafer table mechanism 9 is started, and the chips adsorbed by the second wafer table mechanism 9 are ejected loose.
In one embodiment, the device further comprises an on-track camera 5, which is located above the conveying track 2 and is used for identifying and positioning the frame conveyed by the conveying track 2, and the multi-binding head mechanism 6 picks up the first chip and the second chip to the tin drawing and pressing position on the frame according to the identification and positioning result of the on-track camera 5.
Specifically, as shown in fig. 7, the on-track camera 5 includes a second camera 43, a second zoom lens 44, a second light source 45, a Y-axis readhead sensor 46, a camera Y-axis motor 47, and a camera Y-axis guide rail 48; the second zoom lens 44 is disposed on the second camera 43, the second light source 45 is used for providing a light source for the second camera 43, and the camera Y-axis motor 47 is used for driving the second camera 43 to adjust.
In one embodiment, the die bonding apparatus further comprises an upper feeder 1, the upper feeder 1 being located at the head end of the conveyor track 2 for taking the frame out of the frame carrier 16 and carrying it into the conveyor track 2.
Specifically, as shown in fig. 3, the loader 1 includes a Y-axis loading motor 11, a loading rail 12, a vacuum suction gripper, a feeding rail motor 14, a Z-axis loading motor 15, a frame carrier 16 and a waste box 17; the Y-axis feeding motor 11 is used for driving the vacuum suction claw 13 to move along the Y direction, the feeding track 12 is used for conveying frames, the vacuum suction claw 13 is used for moving the frames from the frame carrying platform 16 to the feeding track 12, the feeding track motor 14 is used for driving the material rods to push the frames into the conveying track 2 for heating, the frame carrying platform 16 is used for retracting the frames, and the waste box 17 is used for placing frame spacers.
In one embodiment, the device further comprises a receiving mechanism 10, and the receiving mechanism 10 is located at the tail end of the conveying track 2 and is used for stacking the frame layer with the chips fixed into the material box 90.
Specifically, as shown in fig. 12, the collecting mechanism 10 includes a collecting motor 88, a first cylinder 89, a cartridge 90, a cartridge carrier 91, a cartridge push rod 92, and a second cylinder 93; the receiving motor 88 is used for adjusting the height of the cartridge loading rod 91 so as to change the height of the cartridge 90, the first cylinder 89 is used for pushing out the cartridge 90 filled below against the upper cartridge 90, the cartridge 90 is used for loading the frame, the cartridge loading rod 91 is used for supporting the cartridge 90, and the cartridge pushing rod 92 is driven by the second cylinder 93 to push out the cartridge 90.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A full-automatic multi-head machine power module glues piece equipment, its characterized in that includes:
the conveying rail is internally provided with a heating module and is used for heating the conveyed frame;
the tin drawing and pressing mechanism is positioned at one side of the conveying track and is used for drawing and pressing tin on the frame;
the first wafer table mechanism and the second wafer table mechanism are positioned on the other side of the conveying track, one type of chip is adsorbed and fixed on the first wafer table mechanism, and the second type of chip is adsorbed and fixed on the second wafer table mechanism;
the pick-up device is used for picking up the first chip and the second chip which are adsorbed and fixed on the first wafer table mechanism and the second wafer table mechanism to the tin drawing and pressing position on the frame so as to finish the fixation of the two types of chips, more than two types of different chips can be adhered to the frame through one-time heating and cooling, and multiple chips with different types and different sizes can be packaged at one time.
2. The full-automatic multi-head machine power module die bonding equipment according to claim 1, wherein the pick-up device comprises a moving and cutting mechanism; the moving and cutting mechanism is used for picking up a chip of the type adsorbed and fixed on the first wafer table mechanism onto the chip transfer table, the chip transfer table adsorbs and fixes the chip of the type, and the chip transfer table and the second wafer table mechanism are arranged in parallel.
3. The full-automatic multi-head machine power module bonding equipment according to claim 2, wherein the pick-up device further comprises a multi-head binding mechanism, and the multi-head binding mechanism is used for picking up a first type of chips on the chip turntable and a second type of chips adsorbed and fixed on the second wafer table mechanism onto a frame.
4. The full-automatic multi-head machine power module bonding equipment according to claim 3, wherein a left wafer table upper camera is arranged on the first wafer table mechanism and used for identifying and positioning a type of chips adsorbed and fixed on the first wafer table mechanism, and the moving and cutting mechanism picks up the type of chips to a chip middle turntable according to the identification and positioning result of the left wafer table upper camera.
5. The full-automatic multi-head machine power module bonding equipment according to claim 4, wherein a right wafer table upper camera is arranged on the second wafer table mechanism, and the right wafer table upper camera is used for identifying and positioning a second type of chips adsorbed and fixed on the second wafer table mechanism; the chip transferring table is provided with a transferring table upper camera which is used for identifying and positioning a chip of the type adsorbed and fixed on the chip transferring table; and the multi-binding head mechanism picks up the first chip and the second chip on the frame according to the identification and positioning results of the camera on the right wafer table and the camera on the middle turntable.
6. The full-automatic multi-head machine power module die bonding equipment according to claim 5, wherein after the identification and positioning of a type of chips by the camera on the left wafer table are completed, a first ejector pin mechanism below the first wafer table mechanism is started, and the chips adsorbed by the first wafer table mechanism are loosened.
7. The full-automatic multi-head machine power module bonding equipment according to claim 6, wherein after the identification and positioning of the second type of chips by the camera on the right wafer table are completed, the second ejector pin mechanism below the second wafer table mechanism is started, and the chips adsorbed by the second wafer table mechanism are ejected loose.
8. The full-automatic multi-head machine power module die bonding equipment according to claim 7, further comprising an on-track camera, wherein the on-track camera is located above the conveying track and used for identifying and positioning a frame conveyed by the conveying track, and the multi-head binding mechanism picks up a first chip and a second chip to a tin drawing and pressing position on the frame according to the identifying and positioning result of the on-track camera.
9. The fully automatic multi-head machine power module die bonding apparatus of claim 8, further comprising a feeder positioned at a head end of the conveyor track for removing and transporting the frame from the frame carrier into the conveyor track.
10. The full-automatic multi-head machine power module die bonding apparatus of claim 9, further comprising a receiving mechanism located at a tail end of the conveying track for stacking the frame layer with the chips fixed therein into a magazine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410073881.3A CN117594499A (en) | 2024-01-18 | 2024-01-18 | Full-automatic multi-head machine power module sticking equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410073881.3A CN117594499A (en) | 2024-01-18 | 2024-01-18 | Full-automatic multi-head machine power module sticking equipment |
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| CN117594499A true CN117594499A (en) | 2024-02-23 |
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| CN202410073881.3A Pending CN117594499A (en) | 2024-01-18 | 2024-01-18 | Full-automatic multi-head machine power module sticking equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117936443A (en) * | 2024-03-22 | 2024-04-26 | 深圳新控半导体技术有限公司 | Full-automatic die bonding equipment |
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| US20050106778A1 (en) * | 2002-12-06 | 2005-05-19 | Samsung Electronics Co., Ltd. | In-line die attaching and curing apparatus for a multi-chip package |
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| US20050106778A1 (en) * | 2002-12-06 | 2005-05-19 | Samsung Electronics Co., Ltd. | In-line die attaching and curing apparatus for a multi-chip package |
| CN110611996A (en) * | 2018-06-15 | 2019-12-24 | 朗微士光电（苏州）有限公司 | Chip mounter |
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