KR100454583B1 - Apparatus for manufacturing semiconductor package - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package manufacturing apparatus, and more specifically, to a dispensing unit, a glass bonding unit, an UV cure unit, and a hot cure unit integrally configured and automated. The present invention relates to a semiconductor package manufacturing equipment that can improve productivity by reducing work time and manufacturing cost. To this end, the present invention, the loader to move the magazine to the work area and to take out the boat loaded in the magazine in order to supply sequentially, the dispensing unit for applying epoxy to the package of the boat transported from the loader A glass bonding unit for transporting the glass to the package on the boat on which the dispensing operation is completed, the glass bonding unit for ejecting the poor bonding state by inspecting the finished glass bonding operation on the glass bonding unit; UV cured part for curing the epoxy of the package passing through the ejection part with ultraviolet rays, Hot Cure part for curing the package cured in the UV cured part with hot air, from the hot cure part An unloader part for separating the cured package from the boat, the loader part, the dispensing part, the glass bonding part, Tingbu object, including yubeuyi curing unit, the hot-cure unit, unloader control unit for controlling the driving portion to provide a semiconductor package manufacturing equipment, characterized in that configured.

Description

Semiconductor Package Manufacturing Equipment {APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package manufacturing equipment, and more particularly, to automate a dispensing process, a glass bonding process, and a curing process during a semiconductor package manufacturing process, thereby reducing work time and reducing manufacturing costs. The present invention relates to a semiconductor package manufacturing equipment capable of improving productivity.

In general, a semiconductor chip assembly using a lead frame generally includes a molding process of molding a resin body to maintain a gap between leads and to prevent deformation of the leads, and to insert an IC chip on a pad of the lead frame. A die bonding process for mounting, a wire bonding process for electrically connecting the ice chip and the inner lead, and a thermoplastic epoxy resin filled in the upper portion of the resin body and the upper portion of the resin chip and the inner lead through the dispensing head It is assembled through a dispensing process that protects circuit elements such as chips.

The present invention corresponds to a later step in the semiconductor process, and corresponds to a dispensing process of filling a thermoplastic epoxy resin in a package in which the die bonding process and the wire bonding process are completed, a glass bonding process, and a curing process thereof.

FIG. 1 shows a side view showing a dispensing apparatus according to the prior art, and as shown in FIG. 1, a head unit 5 is used in a state in which a lead frame is fixed through a backup unit 3 of a conveyor 2. Fill an epoxy resin on the lead frame. In the drawings, reference numeral 1 denotes a support, and 4 denotes a robot capable of moving the X and Y axes.

In the prior art, it is understood that the dispensing process is performed by the dispensing apparatus 10 as described above, and the dispensing apparatus 10 performing the process is independently configured.

In addition, in order to bond the glass to the package after the dispensing process, after applying epoxy to the package, the worker picks up the glass to secure the glass to the package with a clip, and then put the package with the glass fixed to the curing portion I had to work on it.

Therefore, in the related art, since the operations after the dispensing process are all made by hand, there is a problem that a lot of working time is required.

In addition, there was a problem that the quality of the product is lowered because the poor quality of the product was generated during the process by hand.

In addition, it takes a long time to complete a package has a problem that mass production of the package is difficult.

In addition, since the labor cost is generated a lot of manufacturing cost of the semiconductor package was a problem that causes the price increase of the package.

In addition, since the dispensing process itself is a method of filling the epoxy resin directly on the lead frame using a head unit, it takes a lot of work time, there is a problem that it is difficult to fill the epoxy resin in the correct position on the lead frame.

The present invention has been made to solve the above problems, to provide a semiconductor package manufacturing equipment that can significantly reduce the work time by automating the dispensing process, glass bonding process, the curing process The purpose is.

Another object of the present invention is to provide a semiconductor package manufacturing equipment capable of inspecting a package to expel a package having a poor glass bonding state.

Another object of the present invention is to provide a semiconductor package manufacturing equipment that can produce a large amount of packages.

Another object of the present invention is to provide a semiconductor package manufacturing equipment that can significantly reduce the labor cost according to the package manufacturing to reduce the manufacturing cost of the semiconductor package.

Another object of the present invention is to provide a semiconductor package manufacturing equipment that can quickly and accurately perform the dispensing process.

1 is a side view showing a dispensing apparatus according to the prior art.

Figure 2 is a perspective view showing a semiconductor package manufacturing apparatus according to the present invention.

Figure 3 is a front view showing a semiconductor package manufacturing apparatus according to the present invention.

Figure 4 is a plan view showing a semiconductor package manufacturing apparatus according to the present invention.

5 is a left side view showing a semiconductor package manufacturing apparatus according to the present invention.

6 is a right side view showing a semiconductor package manufacturing apparatus according to the present invention.

Figure 7a, 7b, 7c is a plan view, front view and side view of the height adjustment means according to another embodiment applied to the semiconductor package manufacturing equipment according to the present invention.

FIG. 8 is a perspective view of a stamp jig applied to FIG. 7. FIG.

(Explanation of symbols for the main parts of the drawing)

20; Loader section 21; Conveying belt

23,24; Pulley 25; Drive motor

26; Gripper 27; magazine

28; Y axis robot 29; X-axis robot

30; Dispensing unit 31; Gripper

33; Backup unit 35; Cd camera

36; Laser probe 37; Head unit

38; Dispensing head 39; X, Y axis robot

41; Linear motor 50; Glass Bonding Part

51; Glass tray loaders and unloaders 52; magazine

54; Guide rail 55; Y-axis robot

56; Gripper 57; Glass pickup unit

58; Simple UV cure portion 59; Centering device

61; Bonding unit 70; UV Curing

71; UV Cure Frame 72; UV irradiation

73; Induction motor 75; stopper

77; Backup unit 80; Hot cure

81; Hot cure oven 82; Hood duct

83; Magazine up and down robots 84; Heating

90; Unloader section 91; Package pickup unit

93; Boat pickup unit 95; X, Y axis robot

100; Ejecting section 101; camera

102; Sensing means 103; Ejecting unit

104; X, Y axis robot 105; Eviction box

106; Stopper 107; Backup unit

110; Epoxy height adjusting means 111; Epoxy holder

112; Sliding block 113; cylinder

114; LM block 115; Guide Bracket

116; Coil spring 117; Epoxy Storage Groove (Epoxy Storage)

118; Stamp jig 118a; Pin holder

118b; Probe pin

C1, C2, C3, C4, C5; conveyor

In order to achieve the above object, the present invention is to move the magazine to the work area as well as to take out the boat loaded in the magazine sequentially (Loader), epoxy to the package of the boat transported from the loader The dispensing unit for applying a coating, the glass bonding unit for transporting the glass to the package on the boat, the dispensing operation is completed, the glass bonding unit, and the glass bonding operation to inspect the package after the glass bonding operation in the package that is in poor bonding state Ejecting part to evict, UV cured part to cure the epoxy of the package passed through the ejection part with ultraviolet rays, Hot cure part to cure the package cured in the hot cure part with hot air (Hot Cure), An unloader part, the loader part, and the dispenser that separate the cured package from the hot cure part from the boat. Part, the glass bonding portion, yijek tingbu, yubeuyi curing unit, the hot-curing unit, the semiconductor package manufacturing equipment is provided, characterized in that is configured to brace a control unit for controlling the driving portion.

The loader unit includes a transfer belt having a plurality of magazines mounted thereon, pulleys disposed at both ends of the transfer belt, a driving motor connected to the one side pulley to provide power, a gripper for transferring the magazine to a work area of the conveyor, and the gripper It is configured to include X, Y-axis robot to move in the X-axis direction and Y-axis direction.

The dispensing unit may include a conveyor connected to the loader unit, a gripper installed at a distal end of the conveyor to draw a boat from the magazine of the loader unit and to move the boat to the conveyor, and to be disposed below the conveyor to perform a dispensing operation. A backup unit for fixing a package, a dispensing head for applying epoxy onto a package fixed by the backup unit, an X and Y axis robot for transferring the dispensing head, and installed at a lower portion of the backup unit to drive a backup unit It is configured to include a linear motor.

The dispensing unit may include a conveyor connected to the loader unit, a gripper installed at a distal end of the conveyor to draw a boat from the magazine of the loader unit and to move the boat to the conveyor, and to be disposed below the conveyor to perform a dispensing operation. A backup unit for fixing the package, a dispensing head having a stamp jig for applying epoxy onto the package fixed by the backup unit, an X and Y axis robot for transporting the dispensing head, and installed at the bottom of the backup unit. And a linear motor for driving a backup unit, an epoxy accommodating part containing epoxy supplied to a stamp jig provided in the dispensing head, and an epoxy installed on the conveyor to uniformly maintain the height of the epoxy contained in the epoxy accommodating part. It is configured to include a height adjustment means.

Wherein the epoxy height adjusting means includes an epoxy holder in which epoxy is stored and penetrates up and down, a sliding block in which the epoxy holder slides, a cylinder for sliding the epoxy holder, an LM block for fixing the epoxy holder to the cylinder, A guide bracket for guiding the epoxy holder, and one end is fixed to the guide bracket and the other end is fixed to the LM block is characterized in that it is composed of a coil spring for tightly contacting the epoxy holder to the upper surface of the sliding block.

The glass bonding unit is a conveyor connected to the dispensing unit, a backup unit installed at a lower portion of the conveyor and fixing a package on a boat to perform a glass bonding operation, and a glass tray installed at the front of the conveyor to automatically exchange a glass tray. A loader and an unloader, a pickup unit for picking up the glass supplied from the glass tray loader, a centering device for aligning the glass transferred from the pickup unit, and a glass aligned through the centering device, picked up and seated on the package It comprises a bonding unit, the pick-up unit and the Y-axis robot for transferring the bonding unit.

Here, the glass bonding portion is characterized in that it further comprises a simple yube cure portion disposed around the package to which the glass is bonded to irradiate ultraviolet rays while pressing the glass.

The ejecting unit is a camera for inspecting the position of the package, a sensing means for measuring the presence or absence of defects on the glass bonded surface, an ejecting unit for ejecting a defective package, X, Y for driving the camera and the ejecting unit It consists of an axis robot, a stopper for stopping the boat containing the package, a backup unit installed in the lower portion of the stopper to rise to perform the ejecting operation to secure the package on the boat with a vacuum, and an ejection box containing a defective package.

The detecting means of the ejecting unit is characterized in that the laser sensor.

The UV cured part is a conveyor connected to the glass bonding part, a UV cured frame disposed around the conveyor, an ultraviolet irradiation part installed at one side of the UV cured frame, and a boat installed at one end of the conveyor and transported into the UV cured frame. A stopper for stopping, and a backup unit is installed below the stopper to move the boat on the belt of the conveyor during the ultraviolet irradiation time.

The hot cure unit is a magazine up, down robot for vertically arranging a conveyor connected to the uv cure unit, a cure oven disposed around the conveyor, a heating unit installed inside the cure oven, and a boat transferred into the cure oven in order. It is configured to include a hood duct formed on one side of the cure oven.

The unloader unit includes a conveyor connected to the hot cure unit, a package pickup unit installed at an upper portion of the conveyor to pick up a glass-bonded package from a boat, and load the package onto a tray. It comprises a boat pick-up unit, the package pick-up unit and the X, Y axis robot for transporting the boat pick-up unit.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 to 6 show a semiconductor package manufacturing apparatus according to the present invention, FIG. 2 is a perspective view, FIG. 3 is a front view, FIG. 4 is a plan view, FIG. 5 is a left side view, and FIG. 6 is a right side view. Each one is seen.

As shown in the drawing, the semiconductor package manufacturing apparatus according to the present invention is connected to a loader 20 for transporting a boat loaded in a magazine to a conveyor, and connected to the loader 20 and a conveyor C1. Dispensing unit 30 for applying UV epoxy to the package on the boat, Glass bonding unit 50 is connected to the dispensing unit 30 and bonded to the package on the boat on which the dispensing operation is completed and In the glass bonding unit 50, the glass bonding operation is inspected for the finished package, and an ejecting (Ejecting) unit 100 for ejecting a package having a poor bonding state, and the glass bonding unit 50 and the conveyor C3. A UV cured portion 70 connected to the UV bond of the package after the glass bonding operation is cured, and the UV cured portion 70 and the conveyor C4 are connected to the UV cured portion and the first curing is performed at the UV cured portion. Packaged packages An unloader connected to the hot cure unit 80 to harden and the hot cure unit 80 and the conveyor C5 to remove the package after taking out the boat from the hot cure unit 80. The unit 90 and a control unit (not shown) for controlling the driving of each unit.

The loader unit 20 includes a transfer belt 21 mounted with a plurality of magazines 27 loaded with a boat as shown in FIG. 5, pulleys 23 and 24 disposed at both ends of the transfer belt 21. A driving motor 25 connected to the one side pulley 24 to provide power, a gripper 26 for moving the magazines 27 one by one to the working area of the conveyor, and a gripper connected to the gripper 26. The Y-axis robot 28 which moves 26 to the Y-axis direction, and the X-axis robot 29 which moves the said Y-axis robot 28 to an X-axis direction are comprised.

The boat loaded in the magazine 27 contains a package, and the ion generator 22 is installed at the position where the boat is introduced into the conveyor C1 from the magazine to increase the cleanliness of the package.

The dispensing unit 30 is installed at the distal end of the conveyor C1 connected to the loader unit 20 and the conveyor C1 and draws a boat from the magazine 27 of the loader unit 20 to convey the conveyor C1. A gripper 31 to be moved to the bottom of the conveyor, a backup unit 33 installed at a lower portion of the conveyor C1, which is lifted to perform a dispensing operation, and fixes the package on the boat by vacuum, and the backup unit 33 to the backup unit 33. Dispensing head 38 to apply epoxy onto the fixed package by the X, Y, Y-axis robot 39 for transporting the dispensing head 38, and installed in the lower portion of the backup unit 33 to dispense It consists of the linear motor 41 which moves the completed boat to the glass bonding part 50. FIG.

The dispensing head 38 may include a guide block installed at end portions of the X and Y axis robots 39, a CD camera 35 installed at the guide block to check the position of the package, and the CD camera 35. It is composed of a laser probe 36 installed on one side of the lower side and checking the height of the raised package for the dispensing operation, and a head unit 37 installed on the guide block and applying the epoxy on the package.

The glass bonding unit 50 is configured to bond the glass to a package on a boat on which a dispensing operation is completed. The glass bonding unit 50 is installed at a lower portion of the conveyor C2 and the conveyor C2 connected to the dispensing unit 30. A backup unit 53 for fixing a package on a boat to a predetermined position so as to perform a glass bonding operation, and a glass tray loader and an unloader 51 installed in front of the conveyor C2 to automatically exchange glass trays. ), A Y-axis robot 55 installed on one side of the conveyor, a glass pickup unit 57 connected to the Y-axis robot and picked up a glass supplied from a glass tray loader, and the picked-up glass The centering device 59 is connected to the Y-axis robot is installed and the glass aligned through the centering device 59 is picked up one by one to seat on the package It consists of the coding unit (61).

In addition, the simple UV curing unit 58 is disposed around the package to which the glass is bonded to irradiate ultraviolet rays while pressing the glass.

The glass tray loader and unloader 51 has a magazine 52 (see FIG. 4) loaded with a tray containing a large amount of glass, and a glass tray withdrawn from the magazine 52 to the guide rail 54. A gripper 56 to be moved, a backup unit 62 installed at a lower portion of the guide rail 54 to fix the glass tray using a vacuum pin with the lift, and the backup unit 62 in the X-axis direction. It consists of the X-axis robot 63 which moves a step.

The ejecting unit 100 is a camera 101 for inspecting the position of the package, the detection means 102 for measuring the presence or absence of defects on the surface to which the glass G is bonded, the ejecting unit 103 for ejecting the defective package ), An X and Y axis robot 104 for driving the camera 101 and the ejecting unit 103, a stopper 106 for stopping the boat containing the package, and a lower portion of the stopper 106. The back-up unit 107 is fixed to the package on the boat by the vacuum to rise to perform the ejecting operation, and the eviction box 105 containing the defective package.

The sensing means 102 may be installed at the lower end of the camera 101, a laser sensor is preferably used as the sensing means 102.

Meanwhile, the UV curing unit 70 is connected to the glass bonding unit 50 and driven by a belt, an induction motor 73 installed below the conveyor, and the conveyor C3. ) UV cured frame 71 disposed in the form of a box around the UV curable frame 71, an ultraviolet irradiator 72 for irradiating ultraviolet rays to a package in which glass is bonded to the UV cured frame 71, and the conveyor C3. A stopper 75 installed at one side of the stopper to stop the boat transported into the cured frame 71, and a backup unit installed at the lower part of the stopper 75 to move the boat onto the belt during the irradiation time of the irradiation unit ( 77).

The hot cure unit 80 is connected to the uv cure unit 70 and driven by a belt, a conveyor C4, a hot cure oven 81 disposed around the conveyor C4, and the hot cure oven A magazine up and down robot, which is installed inside the 81 and circulates hot air in a package in which glass is bonded, and vertically arranges a boat transferred into the hot cure oven 81 by the conveyor C4 in this order. And a hood duct 82 formed on one side of the hot cure oven 81 to discharge the heat inside.

The pusher P is installed between the yuv cure part 70 and the hot cure part 80 to push the boat exiting the yuv cure part 70 by the conveyor into the hot cure part 80.

The unloader unit 90 is connected to the hot cure unit 80 and is driven by a belt driven by a belt, and installed on top of the conveyor C5 to pick up a package that has been glued to glass from the boat and transported. The package pick-up unit 91 mounted thereon, the boat pick-up unit 93 which loads the empty boat in which the said package was picked up in the magazine, and the X which conveys the package pick-up unit 91 and the boat pick-up unit 93 Y-axis robot (95), the tray loader and unloader (97) for automatically supplying the tray containing the finished package, and the magazine loader and unloader (99) for automatically supplying the magazine containing the empty boat It is composed.

Referring to the operation and effects of the semiconductor package manufacturing equipment according to the present invention configured as described above are as follows.

First, the magazine 27 in which the boat is loaded by the loader 20 is moved to the gripper 26 and moved to the work area of the conveyor C1. A plurality of boats loaded in the magazine 27 are moved up and down by the Y-axis robot 28 and fed to the conveyor C1 one by one by a gripper 31 mounted on the conveyor, where one magazine ( When 27) is transferred to the work area by the gripper 26, the remaining magazines 27 are moved forward by the transfer belt 21 by the operation of the drive motor 25 to wait for the next work. In addition, the magazine 27 in which all the boats loaded in the work area are taken out is lowered by the Y-axis robot 28 and the magazine is placed in the space for loading the empty magazine, and then the magazine 27 waiting for work is grippered. Use (26) to move to the work area to perform the same task.

On the other hand, since the operation requires a high cleanliness, the ion generator 22 is installed in the middle of the magazine 27 to the conveyor (C1) to increase the cleanliness of the package.

The boat transferred from the magazine 27 to the conveyor C1 is fed into the conveyor C1 by the gripper 31, which is lifted by the backup unit 33 waiting at the lower part of the conveyor C1 and vacuumed. It is fixed by the device and pins. At this time, the current work is not a boat, but a package, so the lifted package is lifted about 1 to 2 mm further from the lifted boat. The backup unit 33 which lifts the package and prepares the work is transferred to the working area of the dispensing unit 30 waiting by the linear motor 41.

The package transferred to the dispensing unit 30 checks the position of the package by the CD camera 35, checks the height of the package lifted by the laser probe 36, and then the X- and Y-axis robots 39. The dispensing process using the head unit 37 is performed.

Current workspaces require high cleanliness. For this reason, in order to reduce the dust incidence rate in all the components which go inside, the conveyor type is difficult to drive by a belt, and adopts the conveyance of the boat using the backup unit 33. Since the backup unit 33 is configured to move using the linear motor 41, the generation of dust is small, and the internal dust is removed using the air filter F provided on the upper portion.

When the dispensing operation is completed, the backup unit 33 lowers the boat on which the dispensing operation is completed and moves to bring the newly supplied boat, and when the backup unit moves, the backup unit 33 waits at another position. The other backup unit 53 moves to the boat where the dispensing work is completed, fixes the boat, and moves to the glass bonding unit 50.

Glass bonding is a process of bonding glass to a package where dispensing is completed. First, the gripper draws one glass tray from the magazine 52 of the glass tray loader and unloader 51 and supplies it to the guide rail 54. In addition, the backup unit 62 waiting at the lower portion of the guide rail 54 is raised to fix the glass tray using the vacuum and the pin. The backup unit 62 steps by using the X-axis robot 63 and supplies a tray.

When the tray is fixed and prepared in the working position, the glass pickup unit 57 waiting at the upper side is moved by the Y-axis robot 55 to pick up 2 to 4 glasses G, and the picked up glass G ) Is transferred to the centering device 59. The centering device 59 aligns the position of the transferred glass G, and the bonding unit 61 picks up the glass G which has been aligned by the Y-axis robot 55 one by one and seats the package on the boat. Let's do it.

At this time, when the epoxy is dispensed and the glass is adhered thereon, the yuv is transferred to the cure portion 70 immediately, and the air between the glass and the package expands due to the heat of the ultraviolet rays of the uv cure portion 70 and the yuv is epoxy and the epoxy. A gap between the glasses may be caused to occur, and the glass may be lifted up. In the present invention, in order to prevent such a phenomenon, the simple UV curing unit 58 is installed around the package to which the glass is bonded, thereby bonding the bonding unit 61. After mounting the glass (G) in the package, the ultraviolet light is irradiated through the simple UV curer 58 to perform primary ultraviolet curing.

When all the glass in the tray is used, the empty tray is inserted into the magazine 52 again, and a new tray is withdrawn from the magazine 52 to resume work.

Thereafter, the first cured package is transferred to the ejecting unit 100.

When the boat containing the package is transferred to the ejecting unit 100, the stopper 106 stops and the backup unit 107, which is waiting at the bottom, rises to fix the package and the boat together.

When the position of the package is fixed, the X and Y axis robots 104 move to check the position of the package with the camera 101.

When the position of the package is confirmed, the corners of the portion where the package and the glass G are bonded are measured by the sensing means 102 to inspect whether the bonding surface is defective.

If defective, the corresponding package is picked up by the ejecting unit 103 and put into the eviction box 105, and only the good quality package is transferred to the UV curing unit 70.

Conveyor C3 transfers the boat to the UV cures 70 to cure the epoxy between the package and the glass. The previous dispensing and glass bonding processes refrained from transporting the boat by belts to maintain high cleanliness, but the subsequent processes including the UV cue 70 had a slight degree of cleanliness, so the conveyor transport by belts was adopted. do.

The boat transported into the UV cured frame 71 by the conveyor C3 driven by the belt is stopped by the stopper 75 installed at the end of the conveyor C3, and the backup unit is waiting under the stopper 75. 77 raises the boat onto the belt. This is to avoid dust and noise when the boat is on the belt during the irradiation time of ultraviolet rays, which may generate dust and noise due to friction between the belt and the boat which is continuously driven.

When the curing operation of the epoxy is completed, the backup unit 77 and the stopper 75 are lowered, and the boat is transferred to the hot cure unit 80 by leaving the UV cured frame 71 by driving the belt.

At this time, the pusher P installed at the rear end of the UV cured frame 71 pushes the boat and supplies it into the hot cure oven 81 of the hot cure part 80.

Subsequently, up to 15 boats arriving at the magazine inside the hot cure oven 81 by the belt conveyor C4 and the pusher P are magazines inside the hot cure oven 81 by the magazine up and down robots 83. Are stacked vertically. In this stacked state, the heating unit 84 inside the cure oven is driven to circulate hot air to completely cure the epoxy bonding the package and the glass. When overheating occurs during hot curing, the hood duct 82 of the upper portion of the hot cure oven 81 is opened to discharge the internal heat to the outside.

After the designated time that the epoxy can cure elapses and the cure is completed, the conveyor C5 transfers the boat from the magazine to the unloader section 90.

When the boat is transported to the unloader unit 90, the package pickup unit 91 picks up the package that has been bonded with the glass from the transported boat and mounts the prepared tray on the prepared tray, and the boat pickup unit 93 picks up the package. I pick up an empty boat and load it into a pre-designed magazine to complete my work.

Product productivity can be increased by additionally installing a tray loader and unloader 97 for automatically supplying a tray containing a finished package and a magazine loader and unloader 99 for automatically supplying a magazine for empty boats.

Another embodiment of the dispensing unit according to the present invention will be described with reference to FIGS. 7A, 7B, 7C and 8.

The method of bonding the glass to the package is largely divided into dam and dotting methods, so that the UV epoxy resin applied by the bonding method is not connected by a single line, but there is an empty space between the applied epoxy resins. Since the air inside the package is discharged when the glass is bonded, there is no space between the epoxy resins coated in this way, so that an air cushion phenomenon occurs. In the application of the double dam method, the epoxy is rapidly spreading and the epoxy is connected by the surface tension, so the dotting method is mainly used.

In consideration of this, the dispensing unit according to another embodiment of the present invention is configured to apply an epoxy resin by a coating method using a stamp jig.

As shown in Figure 7a to 7c, the dispensing unit according to another embodiment of the present invention is the configuration of the epoxy height adjusting means 110 for adjusting the storage height of the epoxy supplied to the stamp jig is as follows. Epoxy is accommodated and the upper and lower through the epoxy holder 111, the sliding block 112 for sliding the epoxy holder 111, the cylinder 113 for sliding the epoxy holder 111, and the epoxy holder 111 An LM block 114 fixed to the cylinder 113, guide brackets 115 installed on both sides of the epoxy holder 111 to guide the epoxy holder 111, and one end thereof are fixed to the guide bracket 115. The other end of the coil spring 116 is fixed to the LM block 114 to tightly close the epoxy holder 111 to the upper surface of the sliding block 112.

At this time, the sliding block 112 is provided on the conveyor (C1), the square epoxy receiving groove 117, which is an epoxy storage portion is formed in the center of the upper surface of the sliding block (112).

In addition, the dispensing unit according to another embodiment of the present invention is provided with a stamp jig 118, as shown in FIG. 8, in the head unit 37 in the dispensing head. The stamp jig 118 is provided with a plurality of probe pins 118b arranged on the top surface of the pin holder 118a having a two-stepped portion in a shape that is doped on the lead frame, and the probe pins 118b. ) Has a spring (not shown) for elastically supporting the probe pin to the outside. The end of the probe pin 118b is preferably formed to be round, and an air cushion device may be installed in place of the spring installed inside the probe pin 118b to prevent damage of the stamp jig 118.

The dispensing action according to another embodiment of the present invention configured as described above will be described.

When the cylinder 113 of the epoxy height adjusting means 110 is driven in the state in which the boat is supplied to the conveyor C1 and the piston of the cylinder 113 is moved to the left in the drawing, an LM block connected to the cylinder 113 ( 114 and the epoxy holder 111 are moved at the same time. At this time, the epoxy holder 111 is elastically supported in the downward direction by the coil spring 116 is moved in a state where the lower surface of the epoxy holder 111 is in close contact with the upper surface of the sliding block 112.

Since the epoxy holder 111 that is slid is opened, the epoxy resin is introduced into the epoxy storage groove 117 while passing through the epoxy storage groove 117 formed in the center of the upper surface of the sliding block 111. At this time, since the epoxy holder 111 is slid in a state where the bottom surface of the epoxy holder 111 is in close contact with the top surface of the sliding block 112, the epoxy resin accommodated in the epoxy receiving groove 117 may have a top surface of the sliding block 112. Since the epoxy resin is cut to the same height, the epoxy resin accommodated in the epoxy storage groove 117 becomes a height that does not overflow from the epoxy storage groove 117.

As such, the stamp jig 118 installed in the dispensing head unit 37 is lowered while the epoxy resin is supplied into the epoxy receiving groove 117 formed in the sliding block 112, and the epoxy is fixed to the probe pin 118b. After the resin is buried, the head unit 37 is moved to dope the epoxy resin on the lead frame.

As described above, after the one-time dotting operation, the cylinder 113 is driven again so that the epoxy holder 111 slides on the sliding block 112 and the epoxy resin does not overflow the epoxy storage groove 117 in the epoxy storage groove 117. And the stamp jig 118 is lifted by the head unit 37 again to do the epoxy resin on the lead frame.

Depth inserted into the epoxy receiving groove 117 of the probe pin 118b of the stamp jig 118 can be adjusted to 0.3mm ~ 1.0mm according to the working conditions, the end of the probe pin 118b is formed round After doping the epoxy resin on the leadframe, the remaining amount of the epoxy resin remaining at the end of the probe pin 118b is minimized.

Thus, according to the dispensing unit according to another embodiment of the present invention, the epoxy resin is carried out by the doping method by the stamp jig 118, but the stamp jig by constantly adjusting the height of the epoxy accommodating groove 117, which is the epoxy accommodating part, at all times. To prevent the phenomenon that the epoxy pin on the probe pin 118b of too much or vice versa too small, there is always the effect of doping a certain amount of epoxy resin, and can be dispensed within a short time, the epoxy resin of It is preferable to use together the head unit which directly supplies an epoxy resin, and the head unit with a stamp jig according to a characteristic.

The present invention is not limited to the embodiments described above, and various modifications and changes can be made by those skilled in the art, which are included in the spirit and scope of the present invention as defined in the appended claims.

As described above, the semiconductor package manufacturing apparatus according to the present invention has an effect of significantly reducing work time by automating a dispensing process, a glass bonding process, and a curing process.

In addition, by inspecting the package during the manufacturing process of the semiconductor package there is an effect that the defect rate of the product can be minimized by extracting a package having a poor glass bonding state.

In addition, there is an effect that can be produced in large quantities by reducing the working time due to the automated process.

In addition, there is an effect that can significantly reduce the manufacturing cost of the package manufacturing to reduce the manufacturing cost of the semiconductor package.

Claims (12)

delete A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The loader part Transport belt with multiple magazines, Pulleys disposed at both ends of the transfer belt, A driving motor connected to the one side pulley to provide power; A gripper for transferring the magazine to a working area of the conveyor, And a X and Y axis robot configured to transfer the gripper in the X axis direction and the Y axis direction. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The dispensing unit A conveyor connected to the loader part, A gripper which is installed at the tip of the conveyor and draws the boat from the magazine of the loader and moves it to the conveyor; A backup unit installed at a lower portion of the conveyor and fixing a package on a boat to perform a dispensing operation; A dispensing head for applying epoxy onto a package fixed by the backup unit, X, Y axis robot for transporting the dispensing head, And a linear motor installed under the backup unit to drive the backup unit. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The dispensing unit A conveyor connected to the loader part, A gripper which is installed at the tip of the conveyor and draws the boat from the magazine of the loader and moves it to the conveyor; A backup unit installed at a lower portion of the conveyor and fixing a package on a boat to perform a dispensing operation; A dispensing head having a stamp jig for applying epoxy onto a package fixed by the backup unit, X, Y axis robot for transporting the dispensing head, A linear motor installed under the backup unit to drive the backup unit; Epoxy storage unit containing epoxy, The semiconductor package manufacturing equipment, characterized in that it comprises an epoxy height adjusting means installed on the conveyor to maintain the height of the epoxy contained in the epoxy receiving unit uniformly. The method of claim 4, wherein the epoxy height adjusting means An epoxy holder in which epoxy is stored and penetrates up and down, a sliding block in which the epoxy holder is slid and the epoxy housing is formed, a cylinder for sliding the epoxy holder, an LM block for fixing the epoxy holder to the cylinder, and the epoxy A guide bracket for guiding a holder, and a coil spring for fixing one end is fixed to the guide bracket and the other end is fixed to the LM block to tightly close the epoxy holder to the upper surface of the sliding block. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The glass bonding portion A conveyor connected to the dispensing unit; A backup unit installed at a lower portion of the conveyor and fixing a package on a boat to perform glass bonding; Glass tray loader and unloader installed in front of the conveyor for automatically replacing the glass tray, Pick-up unit for picking up the glass supplied from the glass tray loader, A centering device for aligning the glass transferred from the pickup unit, A bonding unit which picks up the aligned glass through the centering device and mounts the bonded glass on the package to bond the bonded glass; And a Y-axis robot configured to transfer the pick-up unit and the bonding unit. The method of claim 6, wherein the glass bonding portion The semiconductor package manufacturing equipment, characterized in that the glass is further disposed on the circumference of the bonded package, the simple UV curer portion for irradiating ultraviolet rays while pressing the glass. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The ejecting unit A camera to check the location of the package, Detecting means for measuring the defect of the glass bonded surface, Ejecting unit for discharging a defective package, X, Y axis robot for driving the camera and the ejecting unit, Stopper to stop the boat containing the package, A backup unit installed at a lower portion of the stopper and configured to rise to perform an ejecting operation and to fix a package on a boat by vacuum; Semiconductor package manufacturing equipment, characterized in that consisting of a eviction box containing a defective package. The semiconductor package manufacturing apparatus of claim 8, wherein the sensing unit is a laser sensor. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The UV cured part A conveyor connected to the glass bonding part, UV cured frame disposed around the conveyor, UV irradiation unit installed on one side of the UV cured frame, A stopper installed at one end of the conveyor to stop the boat transported into the cured frame of the yuv, And a backup unit installed at a lower portion of the stopper to move the boat onto the belt of the conveyor during the ultraviolet irradiation time. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The hot cure unit A conveyor connected to the UV cured part, A cure oven disposed around the conveyor, A heating unit installed inside the cure oven, Magazine up, down robot to vertically arrange the boat transported into the cure oven, Semiconductor package manufacturing equipment comprising a hood duct formed on one side of the cure oven. A loader unit which moves a magazine to a work area and draws out the boats loaded in the magazine and supplies them sequentially. Dispensing unit for applying epoxy to the package of the boat transported from the loader, A glass bonding part which is transferred from the dispensing part and bonds the glass to the package on the boat on which the dispensing work is completed; An ejecting unit for extracting a package in which a bonding state is poor by inspecting a package in which glass bonding is finished in the glass bonding unit; UV curing unit for curing the epoxy of the package passing through the ejection unit with ultraviolet rays, Hot cure (Hot Cure) portion for curing the package cured in the UV cured portion with hot air, An unloader unit for separating the cured package from the hot cure unit from the boat, And a control unit for controlling driving of the loader unit, the dispensing unit, the glass bonding unit, the ejecting unit, the UV curing unit, the hot curing unit, and the unloader unit, The unloader part A conveyor connected to the hot cure part, A package pick-up unit installed at the top of the conveyor to pick up a glass-bonded package from a boat and mount the package on a tray; A boat pick-up unit for loading an empty boat into a magazine after the package is picked up, Semiconductor package manufacturing equipment comprising the X, Y axis robot for transporting the package pickup unit and the boat pickup unit.