JP4832963B2 - Resin coating system - Google Patents

Description

  The present invention relates to a resin coating system that applies a resin to a substrate and cures the resin applied to the substrate.

  Conventionally, a resin coating device that applies a resin for sealing and fixing a semiconductor chip mounted on a flexible tape-shaped substrate, a resin curing device that heats and cures the applied resin, and a resin coating 2. Description of the Related Art A resin coating system is known that includes a substrate supply device that supplies a substrate to the device and a substrate winding device that winds a substrate unloaded from the resin curing device (see, for example, Patent Document 1).

  In the resin coating system described in Patent Document 1, the substrate is supplied from the substrate supply device to the resin coating device. In the resin coating device, the resin is applied to the substrate, and the substrate coated with the resin is carried out toward the resin curing device. In the resin curing device, the resin applied to the substrate is cured. The substrate after the resin is cured is carried out toward the substrate take-up device and taken up by the substrate take-up device. This type of resin coating system is generally installed in a clean room.

JP 2004-122753 A

  In recent years, semiconductor-related components in which electronic components are mounted on a substrate have been diversified. In recent years, in order to reduce costs, the industry has reduced inventory. For this reason, the need for high-mix low-volume production is increasing year by year in the industry. On the other hand, in order to reduce costs, needs for downsizing a clean room where a resin coating system is installed are increasing year by year.

  Here, by arranging a plurality of resin coating systems described in Patent Document 1, it is also possible to meet the needs of high-mix low-volume production. However, simply arranging a plurality of resin coating systems described in Patent Document 1 increases the installation area of the resin coating system. For this reason, it is impossible to meet the needs for downsizing a clean room in which a resin coating system is installed.

  Then, the subject of this invention is providing the resin coating system which can reduce an installation area even when it is a case where two or more are arranged.

  In order to solve the above-described problems, the present invention provides a resin coating system including a resin coating device that applies a resin to a substrate conveyed in a predetermined direction, and a resin curing device that cures the resin applied to the substrate. The coating apparatus includes a transport path through which the substrate is transported, a resin coating mechanism that applies resin to the substrate, and a moving mechanism that moves the resin coating mechanism, and at least a part of the moving mechanism is disposed below the transport path. It is characterized by.

  In the resin coating system of the present invention, at least a part of the moving mechanism that moves the resin coating mechanism is disposed below the transport path on which the substrate is transported. Therefore, it is possible to reduce the size of the resin coating apparatus in the front-rear direction orthogonal to the substrate transport direction. As a result, the resin coating system can be reduced in size in the front-rear direction, and the installation area can be reduced even when a plurality of resin coating systems are arranged.

  Further, in order to solve the above-described problems, the present invention is directed to applying a resin to a first substrate transported in a predetermined direction and a second substrate transported in the same direction as the first substrate, and the applied resin. A resin coating system for curing, which includes a first processing lane having a first resin coating unit for coating a resin on a first substrate, and a second resin coating unit for coating a resin on a second substrate. In addition, the second processing lane is arranged symmetrically with the first processing lane with respect to the boundary surface with the first processing lane, and the first resin application unit transfers the first substrate. A path, a first resin application mechanism that applies resin to the first substrate, and a first movement mechanism that moves the first resin application mechanism, and the second resin application unit is configured to convey the second substrate. A transport path, a second resin application mechanism for applying resin to the second substrate, and a second resin application mechanism A second moving mechanism to be moved, wherein at least a part of the first moving mechanism is disposed below the first transport path, and at least a part of the second moving mechanism is disposed below the second transport path. It is characterized by.

  In the resin coating system of the present invention, at least a part of the first moving mechanism that moves the first resin coating mechanism is disposed below the first transport path through which the first substrate is transported, and moves the second resin coating mechanism. At least a part of the second moving mechanism is disposed below the second transport path on which the second substrate is transported. Therefore, even if the resin coating system is composed of two processing lanes, the first processing lane and the second processing lane, the resin coating system can be downsized in the front-rear direction orthogonal to the substrate transport direction. As a result, the installation area can be reduced even when a plurality of resin coating systems are arranged.

  The resin coating system of the present invention is configured by two processing lanes, a first processing lane and a second processing lane. Therefore, it is possible to apply and cure the resin on different substrates for each processing lane. As a result, in the resin coating system of the present invention, it is possible to cope with a large variety and small quantity production.

  Furthermore, in the resin coating system of the present invention, the first processing lane and the second processing lane are arranged symmetrically with respect to the boundary surface. Therefore, for example, the first processing lane can be arranged on the front side of the system, and the second processing lane can be arranged on the rear side. Therefore, even when a plurality of resin coating systems are arranged so that the front side and the rear side of the system face each other, when the work is necessary, the operator simply looks back and the first processing lane and the second processing lane It is possible to work in two processing lanes. Further, since the first processing lane and the second processing lane are arranged symmetrically with respect to the boundary surface, the substrate transport direction is also the same. As a result, the workability of the operator can be improved in the resin coating system of the present invention.

  In the present invention, the resin coating apparatus includes a first placement plate on which the first transport path is placed and a second placement plate on which the second transport path is placed, and at least one of the first moving mechanisms. Preferably, the portion is disposed below the first mounting plate, and at least a part of the second moving mechanism is disposed below the second mounting plate. If comprised in this way, it can partition with the 1st mounting board between the 1st conveyance path in which a 1st board | substrate is conveyed, and the 1st moving mechanism which can become a dust generation source. Therefore, it is possible to maintain the cleanness of the first substrate that requires cleanliness. Similarly, since the second transfer path and the second moving mechanism can be partitioned by the second placement plate, the cleanliness of the second substrate can be maintained.

  In the present invention, the boundary surface is a vertical surface parallel to the substrate transport direction, and the first processing lane and the second processing lane are preferably arranged symmetrically with respect to the vertical surface. If comprised in this way, since the structure of a 1st process lane and a 2nd process lane can be made the same, the structure of a resin coating system is simplified.

  As described above, in the resin coating system according to the present invention, the installation area can be reduced even when a plurality of resin coating systems are arranged.

  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

(Schematic configuration of resin coating system)
FIG. 1 is a schematic diagram showing a schematic configuration of a resin coating system 1 according to an embodiment of the present invention from the front (front side). FIG. 2 is a schematic view showing a schematic configuration of the resin coating system 1 shown in FIG. 1 from above. In FIG. 2, only the substrate 2 (2A, 2B) in the substrate supply device 6 is shown for convenience.

  The resin coating system 1 of this embodiment is for sealing and fixing an electronic component (not shown) such as a semiconductor chip mounted on a tape-shaped first substrate 2A and a second substrate 2B with a thermosetting resin. System. In this resin coating system 1, as shown in FIG. 2, the first substrate 2A is transported on the lower side of FIG. 2 (front side of the paper in FIG. 1), and on the upper side of FIG. 2 (back side of the paper in FIG. 1). Two substrates 2B are conveyed. That is, in the resin coating system 1 of the present embodiment, it is possible to simultaneously seal and fix the electronic component mounted on the first substrate 2A and to seal and fix the electronic component mounted on the second substrate 2B. It has become. Hereinafter, when the first substrate 2A and the second substrate 2B are collectively represented, they are referred to as “substrate 2”.

  As shown in FIGS. 1 and 2, the resin coating system 1 includes a resin coating device 4 that applies a thermosetting resin for sealing and securely fixing an electronic component mounted on the substrate 2, and a coating Resin curing device 5 that heats and cures the cured resin, substrate supply device 6 that supplies substrate 2 to resin coating device 4, and substrate winding device that winds substrate 2 that is unloaded from resin curing device 5 7. In the resin coating system 1, the substrate supply device 6, the resin coating device 4, the resin curing device 5, and the substrate winding device 7 are arranged in this order from the left side to the right side in FIG. .

  1 is the conveyance direction of the substrate 2 in the resin coating system 1, and therefore, the horizontal direction in FIG. Further, in the resin coating system 1, since the substrate 2 is supplied from the left side of FIG. 1 and the substrate 2 is wound up on the right side of FIG. 1, the left side of FIG. 1 is “supply side” and the right side is “winding side”. write. Further, the vertical direction in FIG. 1 is referred to as “front-rear direction” orthogonal to the transport direction, the front side of the paper is referred to as “front side”, and the back side of the paper is referred to as “rear side”. The vertical direction in FIG. 1 is referred to as “vertical direction”.

  The resin coating system 1 includes two processing lanes, a first processing lane 8A and a second processing lane 8B, which are arranged in parallel in two rows in the front-rear direction. Specifically, the resin coating system 1 includes a first processing lane 8A for applying a resin to the first substrate 2A transported on the front side and curing the applied resin, and a second transported on the rear side. The second processing lane 8B is configured to apply the resin to the substrate 2B and cure the applied resin. The first processing lane 8A and the second processing lane 8B are arranged along the transport direction of the substrate 2.

  As shown in FIG. 2, the first processing lane 8A and the second processing lane 8B are arranged symmetrically with respect to the vertical plane P that is a boundary surface between the first processing lane 8A and the second processing lane 8B. . In the resin coating system 1 of this embodiment, the first processing lane 8A and the second processing lane 8B having the same configuration are arranged symmetrically with respect to the vertical plane P parallel to the transport direction of the substrate 2. Specifically, the first processing lane 8A and the second processing lane 8B are arranged symmetrically with respect to a vertical plane P formed at a substantially central position of the resin coating system 1 in the front-rear direction. In this embodiment, as shown in FIG. 2, the widths in the front-rear direction of the substrate supply device 6, the resin coating device 4, the resin curing device 5, and the substrate winding device 7 are substantially equal. However, since the resin coating device 4 has complicated moving mechanisms 53A and 53B as will be described later, the resin coating device 4 is larger than the width in the front-rear direction of the substrate supply device 6, the resin curing device 5, and the substrate winding device 7. The width in the front-rear direction may be slightly wider. In addition, the center positions of the substrate supply device 6, the resin coating device 4, the resin curing device 5, and the substrate winding device 7 in the front-rear direction substantially coincide.

  As shown in FIGS. 1 and 2, the substrate supply device 6 includes a first substrate supply reel 10 </ b> A wound in a state where the first substrate 2 </ b> A supplied to the resin coating device 4 and the tape-like spacer 9 overlap each other. And a second substrate supply reel 10B wound in a state where the second substrate 2B supplied to the resin coating device 4 and the spacer 9 overlap each other. The substrate take-up device 7 is carried out from the resin curing device 5 and the first substrate take-up reel 11 </ b> A that is taken up in a state where the first substrate 2 </ b> A unloaded from the resin curing device 5 and the spacer 9 overlap each other. A second substrate take-up reel 11B is provided which is wound in a state where the second substrate 2B and the spacer 9 overlap each other. As shown in FIG. 1, the first substrate 2A wound around the first substrate supply reel 10A and the first substrate 2A wound around the first substrate take-up reel 11A are connected. Similarly, the second substrate 2B wound around the second substrate supply reel 10B and the second substrate 2B wound around the second substrate take-up reel 11B are connected. That is, the resin coating system 1 of this embodiment is a so-called reel-to-reel resin coating system. In the following, when the first substrate supply reel 10A and the second substrate supply reel 10B are collectively represented, they are referred to as the substrate supply reel 10, and the first substrate take-up reel 11A and the second substrate take-up reel 11B. Are collectively referred to as a substrate take-up reel 11.

  The substrate 2 is a flexible resin substrate such as a COF (Chip On Film or Chip On Flexible Circuit Board) tape or a TAB (Tape Automated Bonding) tape. In addition, electronic components are mounted in advance on the substrate 2 supplied from the substrate supply device 6. In the resin coating system 1 of this embodiment, as the substrate 2, various substrates 2 having a thickness of, for example, 20 μm to 125 μm and a width of, for example, 35 mm to 200 mm are used. The spacer 9 is for protecting the substrate 2 wound around the substrate supply reel 10 and the substrate 2 wound around the substrate take-up reel 11 and is formed in a tape shape with a thin resin. .

(Configuration of substrate supply device and substrate winding device)
FIG. 3 is a diagram for explaining the configuration of the drive portion of the substrate supply apparatus 6 shown in FIG. FIG. 3 shows a driving portion of the substrate supply device 6 from the EE direction of FIG.

  As shown in FIGS. 1 to 3, the substrate supply apparatus 6 includes a first substrate supply unit 21 </ b> A that constitutes a first processing lane 8 </ b> A disposed on the front surface side, and a second processing lane 8 </ b> B disposed on the rear surface side. The second substrate supply unit 21B is configured. That is, in the substrate supply device 6, the first substrate supply unit 21 </ b> A and the second substrate supply unit 21 </ b> B having the same configuration are arranged symmetrically with respect to the vertical plane P. Note that openable / closable doors (not shown) are attached to both the front and rear surfaces of the substrate supply device 6.

  In addition to the first substrate supply reel 10A described above, the first substrate supply unit 21A includes a spacer take-up reel 12A on which the spacer 9 separated from the first substrate 2A is taken up, and a substrate guide for guiding the first substrate 2A. Roller 13A and guide member 14A, spacer guide roller 15A for guiding spacer 9, substrate supply reel motor 16A for rotating first substrate supply reel 10A, and spacer take-up reel motor for rotating spacer take-up reel 12A 17A. The substrate guide roller 13A and the spacer guide roller 15A are driven rollers having no driving means.

  As shown in FIG. 3 and the like, each component such as the first substrate supply reel 10A and the spacer take-up reel 12A arranged on the front side is attached to an attachment plate 19A fixed to the housing 18 of the substrate supply device 6. ing. The height of the mounting plate 19A and the width in the transport direction are substantially the same as the height inside the casing 18 or the width in the transport direction. Further, the mounting plate 19 </ b> A is disposed on the front side of the vertical plane P that is the center position in the front-rear direction of the substrate supply device 6.

  As shown in FIG. 3, the substrate supply reel motor 16A and the spacer take-up reel motor 17A are fixed to the mounting plate 19A via a mounting bracket (not shown) so that the output shaft faces upward. Further, as shown in FIG. 3, the first substrate supply reel 10A and the substrate supply reel motor 16A include a bevel gear 23A fixed to the rotation shaft of the first substrate supply reel 10A, and an output shaft of the substrate supply reel motor 16A. It is connected via a bevel gear 24A fixed to. Similarly, the spacer take-up reel 12A and the spacer take-up reel motor 17A are a bevel gear 25A fixed to the rotating shaft of the spacer take-up reel 12A and a bevel gear fixed to the output shaft of the spacer take-up reel motor 17A. 26A.

  A cover 27A is disposed at a portion where the bevel gear 23A and the bevel gear 24A mesh with each other. Further, a cover 28A is disposed at a portion where the bevel gear 25A and the bevel gear 26A mesh with each other.

  As described above, the second substrate supply unit 21B is configured by arranging the same configuration as the first substrate supply unit 21A symmetrically with respect to the vertical plane P. Therefore, detailed description of the second substrate supply unit 21B is omitted. 2 and 3, the configuration of the second substrate supply unit 21B corresponding to the configuration of the first substrate supply unit 21A described above has “A” in the reference numerals attached to the configuration of the first substrate supply unit 21A. "Is replaced by" B ".

  As shown in FIGS. 2 and 3, a substrate supply reel motor is provided between the mounting plate 19 </ b> A disposed on the front side of the vertical plane P and the mounting plate 19 </ b> B disposed on the rear side of the vertical plane P. A storage space 20 in which 16A, 16B and the like are stored is formed. That is, drive units such as the substrate supply reel motors 16A and 16B, the spacer take-up reel motors 17A and 17B, and the bevel gears 23A to 26B are arranged in the storage space 20 as shown in FIG. Further, each configuration of the substrate supply device 6 excluding these is arranged on the front surface side of the mounting plate 19A or the rear surface side of the mounting plate 19B and inside the housing 18.

  In the first substrate supply unit 21A, as shown in FIG. 1, the first substrate 2A supplied from the first substrate supply reel 10A sag downwards between the substrate guide roller 13A and the guide member 14A. Then, the first substrate 2 </ b> A once slackened between the substrate guide roller 13 </ b> A and the guide member 14 </ b> A is guided downstream by the guide member 14 </ b> A and supplied to the resin coating device 4. Further, the spacer 9 separated from the first substrate 2A is guided by the spacer guide roller 15A and taken up on the spacer take-up reel 12A. Similarly, in the second substrate supply unit 21B, the second substrate 2B is supplied to the resin coating device 4, and the spacer 9 separated from the second substrate 2B is taken up by the spacer take-up reel 12B.

  As shown in FIGS. 1 and 2, the substrate winding device 7 includes a first substrate winding unit 22A constituting a first processing lane 8A disposed on the front surface side, and a second processing lane disposed on the rear surface side. It is comprised from the 2nd board | substrate winding part 22B which comprises 8B. That is, in the substrate winding device 7, the first substrate winding unit 22 </ b> A and the second substrate winding unit 22 </ b> B having the same configuration are arranged symmetrically with respect to the vertical plane P. Note that doors (not shown) that can be opened and closed are attached to both the front and rear surfaces of the substrate winding device 7.

  In addition to the first substrate take-up reel 11A described above, the first substrate take-up unit 22A rotates the spacer supply reel 30A that supplies the spacer 9 that overlaps the first substrate 2A, and the first substrate take-up reel 11A. A substrate take-up reel motor (not shown), a spacer supply reel motor (not shown) for rotationally driving the spacer supply reel 30A, and a first carry-out port 98A (described later) formed in the resin curing device 5 are first carried out. The first drawing roller 31A that pulls the substrate 2A into the apparatus, the second drawing roller 32A that pulls the first substrate 2A carried out from a second carry-out port 99A described later into the apparatus, and the first drawing roller 31A. A first guide member 33A that guides the first substrate 2A downward, and a second guide that guides the first substrate 2A drawn by the second drawing roller 32A downward. And de member 34A, and includes a board guide rollers 35A for guiding the conveyance of the first substrate 2A, and a spacer guide rollers 36A for guiding the conveyance of the spacer 9.

  The first drawing roller 31A and the second drawing roller 32A are driving rollers that are rotationally driven by a motor (not shown), and the substrate guide roller 35A and the spacer guide roller 36A are driven rollers having no driving means. The first drawing roller 31A and the second drawing roller 32A repeat a cycle of rotating for a predetermined distance and then stopping for a predetermined time so as to synchronize with later-described conveying rollers 46A and 47A. That is, in the first processing lane 8A, the first substrate 2A is intermittently conveyed by the first drawing roller 31A or the second drawing roller 32A and the conveyance rollers 46A and 47A.

  As shown in FIG. 2 and the like, the components such as the first substrate take-up reel 11A and the spacer supply reel 30A arranged on the front side are attached to an attachment plate 39A fixed to the housing 38 of the substrate take-up device 7. It has been. The height of the mounting plate 39A and the width in the transport direction are substantially the same as the height inside the casing 38 or the width in the transport direction. Further, the mounting plate 39 </ b> A is disposed on the front side of the vertical plane P that is the center position in the front-rear direction of the substrate winding device 7.

  Similar to the first substrate supply unit 21A, in the first substrate take-up unit 22A, the substrate take-up reel motor and the spacer supply reel motor are fixed to the attachment plate 39A via the attachment bracket so that the output shaft faces upward. Has been. Similarly to the first substrate supply unit 21A, the first substrate take-up reel 11A and the substrate take-up reel motor are a bevel gear (not shown) fixed to the rotation shaft of the first substrate take-up reel 11A, It is connected via a bevel gear (not shown) fixed to the output shaft of the substrate take-up reel motor. Further, similarly to the first substrate supply unit 21A, the spacer supply reel 30A and the spacer supply reel motor are a bevel gear (not shown) fixed to the rotation shaft of the spacer supply reel 30A, and an output shaft of the spacer supply reel motor. It is connected via a bevel gear (not shown) fixed to.

  Further, as shown in FIG. 2, a cover 42A is provided at a portion where the bevel gear fixed to the rotating shaft of the first substrate take-up reel 11A and the bevel gear fixed to the output shaft of the substrate take-up reel motor are engaged. Is arranged. Similarly, a cover (not shown) is also disposed at a portion where the bevel gear fixed to the rotation shaft of the spacer supply reel 30A and the bevel gear fixed to the output shaft of the spacer supply reel motor mesh. As shown in FIG. 2, a cover 43A is also provided in the driving portion of the first drawing roller 31A, and a cover (not shown) is also provided in the driving portion of the second drawing roller 32A and the like.

  As described above, the second substrate winding unit 22B is configured by arranging the same configuration as the first substrate winding unit 22A symmetrically with respect to the vertical plane P. Therefore, detailed description of the second substrate winding unit 22B is omitted. In FIG. 2, the configuration of the second substrate winding unit 22 </ b> B corresponding to the configuration of the first substrate winding unit 22 </ b> A described above is indicated by “A” in the reference numerals attached to the configuration of the first substrate winding unit 22 </ b> A. "Is replaced by" B ".

  Similar to the substrate supply device 6, in the substrate winding device 7, between the mounting plate 39 </ b> A disposed on the front side of the vertical surface P and the mounting plate 39 </ b> B disposed on the rear side of the vertical surface P, A storage space 40 corresponding to the storage space 20 is formed. That is, driving units such as a substrate take-up reel motor, a spacer supply reel motor, and a bevel gear, and driving units for the first and second drawing rollers 31A, 31B, and 32A are arranged in the storage space 40. Each configuration of the substrate winding device 7 excluding these configurations is disposed on the front surface side of the mounting plate 39A or the rear surface side of the mounting plate 39B and inside the housing 38.

  In the first substrate take-up part 22A, as shown in FIG. 1, after being taken out from the resin curing device 5, it is drawn in by the first draw-in roller 31A or the second draw-in roller 32A, and is taken into the first substrate take-up reel 11A. The first substrate 2A before being wound sag downwards between the first guide member 33A or the second guide member 34A and the substrate guide roller 35A. The spacer 9 is guided by the spacer guide roller 35A and supplied from the spacer supply reel 30A to the first substrate take-up reel 11A. Then, the first substrate 2A, which sags downward between the first guide member 33A or the second guide member 34A and the substrate guide roller 35A, is wound around the first substrate take-up reel 11A together with the spacer 9. Similarly, in the second substrate take-up portion 22B, the second substrate 2B is taken up along with the spacer 9 onto the second substrate take-up reel 11B. The substrate winding device 7 of this embodiment includes a substrate sag sensor (not shown) that detects the sag state of the first substrate 2A and the sag state of the second substrate 2B.

(Configuration of resin coating device)
FIG. 4 is a schematic view showing a schematic configuration of the resin coating apparatus 4 shown in FIG. 1 from above. FIG. 5 is a cross-sectional view showing the FF cross section of FIG. 4. FIG. 6 is a schematic view showing the schematic configuration of the moving mechanism 53A shown in FIG. 4 from above. 7 is a schematic diagram showing a schematic configuration of the Y-axis moving mechanisms 64A to 67A, the X-axis moving mechanisms 69A and 71A, and the transport path 48A from the GG direction of FIG. FIG. 8 is a diagram for explaining the configuration of the X-axis moving mechanisms 70A and 71A shown in FIG. In FIG. 4, only a part of the substrate 2 is shown. 5 to 8, the illustration of the substrate 2 is omitted.

  As shown in FIGS. 2 and 4, the resin coating apparatus 4 includes a first resin coating unit 45 </ b> A constituting the first processing lane 8 </ b> A disposed on the front surface side and a second processing lane 8 </ b> B disposed on the rear surface side. It is comprised from the 2nd resin application part 45B which comprises. That is, in the resin coating device 4, the first resin coating part 45 </ b> A and the second resin coating part 45 </ b> B having the same configuration are arranged symmetrically with respect to the vertical plane P. Further, as shown in FIG. 1, the first resin application part 45 </ b> A and the second resin application part 45 </ b> B are provided in a box-shaped storage part 44 in which a control device (not shown) such as a control board of the resin application apparatus 4 is stored. Arranged on the upper surface 44a. In addition, doors (not shown) that can be opened and closed are attached to both the front and rear surfaces of the resin coating device 4.

  As shown in FIG. 4 and the like, the first resin application unit 45A includes conveyance rollers 46A and 47A for conveying the first substrate 2A supplied from the first substrate supply unit 21A, and a conveyance path for conveying the first substrate 2A. 48A and four resin coating heads 49A, 50A as a resin coating mechanism disposed above the conveyance path 48A in order to apply a thermosetting resin to a portion where the electronic components of the first substrate 2A are mounted. 51A, 52A, and a moving mechanism 53A for moving the resin coating heads 49A to 52A. The first resin application unit 45A includes a mounting plate 54A that is disposed in parallel with the upper surface 44a of the storage unit 44 and on which the transport path 48A is mounted. The mounting plate 54A is fixed to the upper surface 44a via a mounting bracket (not shown). In this embodiment, the transport path 48A, the resin coating heads 49A to 52A, the moving mechanism 53A, and the mounting plate 54A are respectively the first transport path, the first resin coating mechanism, and the first movement that constitute the first processing lane 8A. The mechanism and the first mounting plate are provided.

  In this embodiment, the conveyance roller 46A is arranged on the supply side, and the conveyance roller 47A is arranged on the winding side. The transport rollers 46A and 47A rotate at the same peripheral speed so that no slack occurs in the first substrate 2A between the transport rollers 46A and 47A. Further, the transport rollers 46A and 47A repeat an intermittent operation of rotating for a predetermined distance and stopping for a predetermined time so as to be synchronized with the first drawing roller 31A or the second drawing roller 32A. Then, the resin is applied to the first substrate 2A by the resin application heads 49A to 52A while the first substrate 2A is stopped. That is, in the first resin application unit 45A, a thermosetting resin is applied to the first substrate 2A supplied from the first substrate supply unit 21A, and then the first substrate 2A is carried out toward the resin curing device 5. The

  In addition, as shown in FIG. 4 etc., drive parts, such as a motor which drives the conveyance rollers 46A and 47A, are covered with covers 55A and 55A. Further, as described above, in the present embodiment, the first substrate 2A is intermittently conveyed in the first processing lane 8A by the first drawing roller 31A or the second drawing roller 32A and the conveyance rollers 46A and 47A. Is called. That is, also in a first transport lane 90A, which will be described later, constituting the resin curing device 5, the first substrate 2A is transported by the first pull-in roller 31A or the second pull-in roller 32A and the transport rollers 46A and 47A.

  The transport path 48A includes two substrate guides 57A and 57A for guiding both ends of the first substrate 2A, and two attachment brackets 58A and 58A to which the substrate guides 57A and 57A are respectively attached. As shown in FIG. 4 and the like, the board guides 57A and 57A are elongated block-like members, and are fixed by mounting brackets 58A and 58A at intervals in the front-rear direction. As shown in FIGS. 4 and 7, the mounting brackets 58 </ b> A and 58 </ b> A are fixed to the upper surface of the mounting plate 54 </ b> A with a gap in the transport direction.

  As shown in FIG. 4 and the like, the resin coating heads 49A to 52A are arranged in this order from the supply side to the winding side and adjacent to each other in the transport direction. The resin coating heads 49A to 52A include a nozzle portion formed at a tip portion (lower end portion in FIG. 5). From this nozzle portion, a thermosetting portion is mounted on a portion where the electronic component on the upper surface of the first substrate 2A is mounted. Apply resin. The number of resin coating heads 49A to 52A arranged in the first resin coating unit 45A is not limited to four, but three or less or five or more resin coating heads are arranged in the first resin coating unit 45A. May be.

  As shown in FIG. 4 and the like, the moving mechanism 53A includes Z-axis moving mechanisms 60A, 61A, 62A, and 63A that move the resin coating heads 49A to 52A in the vertical direction, and the Z-axis moving mechanisms 60A to 63A. Along with Y-axis moving mechanisms 64A, 65A, 66A, 67A for moving 49A-52A in the front-rear direction, Z-axis moving mechanisms 60A-63A and Y-axis moving mechanisms 64A-67A, respectively, resin coating heads 49A-52A are moved in the transport direction. X-axis moving mechanisms 68A, 69A, 70A, 71A to be moved are provided.

  As shown in FIGS. 5 and 6, the Z-axis moving mechanisms 60 </ b> A to 63 </ b> A are each provided with a feed screw (not shown) that moves the arm 73 </ b> A with the resin coating heads 49 </ b> A to 52 </ b> A fixed to the front side end in the vertical direction And a motor 74A for rotating the feed screw. A feed nut (not shown) that is screwed to the feed screw is fixed to the rear surface side of the arm 73A. The feed screw is stored in a storage case 75A formed in a box shape. The motor 74A is fixed to the upper end surface of the storage case 75A.

  As shown in FIG. 5 and the like, each of the Y-axis moving mechanisms 64A to 67A includes a fixing bracket 76A to which the storage case 75A is fixed, a fixing plate 77A on which the fixing bracket 76A is mounted and fixed, a fixing bracket 76A, A feed screw 78A for moving the fixing plate 77A in the front-rear direction, a motor 79A for rotationally driving the feed screw 78A, and a feed nut 80A screwed to the feed screw 78A are provided. The feed screw 78A is stored in the storage case 81A, and the motor 79A is fixed to the rear surface side end of the storage case 81A. In FIG. 6, the feed screw 78A is not shown.

  As shown in FIG. 5, the fixed bracket 76 </ b> A is formed so that the shape viewed from the transport direction is substantially L-shaped, and is disposed on the rear side of the transport path 48 </ b> A. At the upper end of the fixed bracket 76A, a mounting portion 761A of the storage case 75A protruding to the front side is formed. The lower end of the fixing bracket 76A is placed and fixed on the upper surface on the rear surface side of the fixing plate 77A. That is, the resin application heads 49A to 52A are arranged in an overhanging state on the front side with respect to the fixing portion of the fixing bracket 76A to the fixing plate 77A.

  As shown in FIG. 5, the front surface side of the fixing plate 77A is disposed below the mounting plate 54A. The feed nut 80A is fixed to the lower surface on the front surface side of the fixing plate 77A. The feed screw 78A and the storage case 81A are arranged below the placement plate 54A and across the transport path 48A in the front-rear direction. That is, some of the Y-axis moving mechanisms 64A to 67A are arranged below the transport path 48A.

  As shown in FIG. 6 and the like, an opening 811A through which the feed nut 80A passes is formed on the upper surface of the storage case 81A. In addition, a guide (not shown) for guiding the feed nut 80A in the front-rear direction is attached to the inside of the storage case 81A.

  As shown in FIG. 5 and the like, the X-axis moving mechanisms 68A to 71A are screwed into a feed screw 83A that moves the storage case 81A in the transport direction, a motor 84A that rotationally drives the feed screw 83A, and the feed screw 83A. A feed nut 85A. The feed screw 83A is stored in the storage case 86A, and the motor 84A is fixed to the outer end of the storage case 86A in the transport direction, as shown in FIG. In FIG. 6, the feed screw 83A is not shown.

  Each of the X-axis moving mechanisms 68A to 71A includes two guide blocks 87A and 87A for guiding the storage case 81A in the transport direction. Further, two guide rails 88A and 88A with which the guide blocks 87A and 87A are engaged are provided as a configuration common to the four X-axis moving mechanisms 68A to 71A.

  In this embodiment, the resin coating head 52A is moved in the transport direction by the X-axis moving mechanism 70A disposed on the winding side and the rear side. That is, as shown in FIG. 8 and the like, a feed nut 85A that is screwed to a feed screw 83A that constitutes the X-axis movement mechanism 70A is fixed to the lower surface of the storage case 81A that constitutes the Y-axis movement mechanism 67A. Further, the X-axis moving mechanism 71A disposed on the winding side and the front side moves the resin coating head 51A in the transport direction. That is, as shown in FIG. 8 and the like, a feed nut 85A that is screwed to a feed screw 83A that constitutes the X-axis movement mechanism 71A is fixed to the lower surface of the storage case 81A that constitutes the Y-axis movement mechanism 66A.

  Similarly, since the X-axis movement mechanism 68A disposed on the supply side and the rear surface side moves the resin coating head 49A in the transport direction, the X-axis movement mechanism 68A is arranged on the lower surface of the storage case 81A constituting the Y-axis movement mechanism 64A. A feed nut 85A that is screwed into a feed screw 83A constituting the shaft moving mechanism 68A is fixed. Further, since the X-axis moving mechanism 69A disposed on the supply side and the front side moves the resin coating head 50A in the transport direction, the X-axis moving mechanism 69A has an X-axis on the lower surface of the storage case 81A constituting the Y-axis moving mechanism 65A. A feed nut 85A that is screwed into a feed screw 83A that constitutes the moving mechanism 69A is fixed.

  The two guide rails 88 </ b> A and 88 </ b> A are fixed to the upper surface 44 a of the storage portion 44 with a predetermined interval in the front-rear direction. The guide blocks 87A and 87A are fixed to the lower surface of the storage case 81A so as to engage with the guide rails 88A and 88A, respectively. The storage case 86A is fixed to the upper surface 44a. As shown in FIG. 6 and the like, an opening 861A through which the feed nut 85A passes is formed on the upper surface of the storage case 86A.

  As shown in FIG. 4, the X-axis moving mechanisms 68A to 71A are disposed below the mounting plate 54A. That is, the X-axis moving mechanisms 68A to 71A are arranged below the transport path 48A.

  As described above, the second resin application unit 45B is configured by arranging the same configuration as the first resin application unit 45A symmetrically with respect to the vertical plane P. Therefore, detailed description of the second resin application part 45B is omitted. 2 and 4, the configuration of the second resin coating portion 45B corresponding to the configuration of the first resin coating portion 45A described above has “A” in the reference numerals attached to the configuration of the first resin coating portion 45A. "Is replaced by" B ". In this embodiment, the conveyance path 48B, the resin application heads 49B to 52B, the movement mechanism 53B, and the placement plate 54B corresponding to the conveyance path 48A, the resin application heads 49A to 52A, the movement mechanism 53A, and the placement board 54A, respectively. These are the second transport path, the second resin coating mechanism, the second moving mechanism, and the second placement plate, respectively, that constitute the second processing lane 8B.

(Configuration of resin curing device)
9 is an enlarged cross-sectional view showing the HH cross section of FIG. 2 in an enlarged manner.

  Hereinafter, the configuration of the resin curing device 5 will be described with reference to FIGS. 1, 2, and 9.

  The resin curing device 5 is a heating furnace that heats the substrate 2 carried out from the resin coating device 4 and cures the resin applied to the substrate 2. As shown in FIG. 2, the resin curing device 5 includes a first transport lane 90A constituting the first processing lane 8A arranged on the front side and a second processing lane 8B constituting the second processing lane 8B arranged on the rear side. 2 transport lanes 90B. That is, in the resin curing device 5, the first transport lane 90A and the second transport lane 90B having the same configuration are arranged symmetrically with respect to the vertical plane P. In addition, doors (not shown) that can be opened and closed are attached to both the front and rear surfaces of the resin curing device 5.

  Further, as shown in FIG. 1, the first transport lane 90 </ b> A and the second transport lane 90 </ b> B are provided on the upper surface of a box-shaped storage unit 91 in which control equipment (not shown) such as a control board of the resin curing device 5 is stored. Is arranged. Furthermore, as shown in FIG. 2, the resin curing device 5 includes a partition wall 92 that partitions between the first transport lane 90A and the second transport lane 90B.

  The first transport lane 90A includes three transport paths, a first transport path LA1, a second transport path LA2, and a third transport path LA3 through which the first substrate 2A is transported. In addition, the first transport lane 90A reverses the front and back of the first substrate 2A and the partition plates 93A and 93A that partition between the first to third transport paths LA1 to LA3 and changes the transport direction of the first substrate 2A. The first reverse roller 94A and the second reverse roller 95A to be reversed, the heating mechanism 96A for heating and curing the resin applied to the first substrate 2A, and the first to third transport paths LA1 to LA3. And a substrate guide 97A for guiding both ends of the first substrate 2A in the transport direction. In FIG. 1, the substrate guide 97A is not shown. In FIG. 2, for the sake of convenience, only part of the substrate guide 97A (part on the supply side) disposed on the first transport path LA1, only the substrate guide 97A and the second reverse roller 95A disposed on the third transport path LA3. Is illustrated.

  The first to third transport paths LA1 to LA3 are arranged in this order from the lower side in the first transport lane 90A. In the first transport lane 90A, the first substrate 2A unloaded from the first resin coating unit 45A is first transported through the first transport path LA1 from the supply side to the winding side, and then the first It is reversed by the reversing drum 94A. The inverted first substrate 2A is transported through the second transport path LA2 from the winding side to the supply side, and then reversed again by the second reversing drum 95A. The inverted first substrate 2A is transported through the third transport path LA3 from the supply side to the take-up side, and unloaded from the first carry-out port 98A.

  Further, depending on the type of the first substrate 2A, the first substrate 2A transported through the first transport path LA1 from the supply side to the winding side is unloaded from the second carry-out port 99A as it is. That is, in the resin curing device 5 of this embodiment, switching between the conveyance of the first substrate 2A using the first to third conveyance paths LA1 to LA3 and the conveyance of the first substrate 2A using only the first conveyance path LA1. Is possible.

  The heating mechanism 96A is formed of a heating element (not shown) made of an infrared heater such as a ceramic heater and a metal plate having excellent thermal conductivity, and is disposed between the heating element and the first substrate 2A. And a heat diffusion plate (not shown) for diffusing heat from the body. As shown in FIG. 1, in the first transport path LA1 and the third transport path LA3, a heating mechanism 96A is disposed above the transported first substrate 2A. In the second transport path LA2, a heating mechanism 96A is disposed below the first substrate 2A to be transported.

  The substrate guide 97A is an elongated block-like member whose longitudinal direction is the transport direction, and is disposed at positions corresponding to both end portions of the first substrate 2A in the first to third transport paths LA1 to LA3.

  As described above, the second transport lane 90B is configured by arranging the same configuration as the first transport lane 90A symmetrically with respect to the vertical plane P. Therefore, detailed description of the second transport lane 90B is omitted. In FIG. 2, in the configuration of the second transport lane 90B corresponding to the configuration of the first transport lane 90A described above, the part “A” in the reference numerals attached to the configuration of the first transport lane 90A is “B”. The reference numerals in place of “

  The partition wall 92 is disposed at a substantially central position in the front-rear direction of the resin curing device 5. The partition wall 92 completely partitions the first transport lane 90A and the second transport lane 90B. That is, the height of the partition wall 92 and the width in the transport direction are substantially the same as the height of the first transport lane 90A and the width in the transport direction. The partition wall 92 may be formed so as to partition to the inside of the storage portion 91.

  As shown in FIG. 9, the partition wall 92 of this embodiment is configured by two thin plate members 92a and 92b. That is, the partition wall 92 is configured by arranging the two plate members 92a and 92b with a predetermined interval in the front-rear direction. The plate members 92a and 92b are, for example, stainless thin plates.

  In this embodiment, a space 92c is formed between the plate materials 92a and 92b. In this space 92c, as shown in FIG. 9, an air layer may be formed without arranging anything, and a heat insulating material may be arranged. In addition, predetermined piping and wiring may be routed using this space 92c. Furthermore, a predetermined opening may be formed in the plate members 92a and 92b, and the space 92c may be used as an air flow path.

  In the resin curing device 5 of this embodiment, temperature control is possible for each of the first transport lane 90A and the second transport lane 90B. That is, the temperature of the first transfer lane 90A is controlled based on a temperature sensor (not shown) provided in the first transfer lane 90A, and the first is set based on the temperature sensor (not shown) provided in the second transfer lane 90B. The temperature of the second transport lane 90B is controlled.

  If appropriate temperature control can be performed for each of the first transport lane 90A and the second transport lane 90B, the first transport lane 90A and the second transport lane 90B are separated from each other. It need not be completely partitioned by 92. That is, if the temperature control for each transport lane of the first transport lane 90A and the second transport lane 90B can be appropriately performed, the first transport lane 90A and the second transport lane 90B are partially communicated. May be.

(Main effects of this form)
As described above, in the resin coating system 1 of this embodiment, the first processing lane 8A and the second processing lane 8B are arranged symmetrically with respect to the vertical plane P. Therefore, in the resin coating system 1, the substrate 2 can be processed on both the front side and the rear side. Therefore, for example, as shown in FIG. 10, a plurality of resin coating systems 1 are arranged so that the front side and the rear side of the resin coating system 1 face each other, and an operator's work is required in each processing lane 8A, 8B. Even in this case, the operator can perform work in the two processing lanes of the first processing lane 8A and the second processing lane 8B only by looking back. Further, the transport direction of the substrate 2 is the same in the first processing lane 8A and the second processing lane 8B. That is, the supply side and winding side of the substrate 2 in the first processing lane 8A coincide with the supply side and winding side of the substrate 2 in the second processing lane 8B. As a result, in the resin coating system 1 of this embodiment, the operator's workability can be improved.

  Moreover, the resin system 1 of this embodiment is configured by two processing lanes, that is, a first processing lane 8A and a second processing lane 8B. Therefore, even if the first substrate 2A and the second substrate 2B are different, the resin can be applied and cured on the different substrates 2 for each processing lane. That is, it is possible to cope with a large variety and small quantity production. In particular, in the resin coating system 1 of the present embodiment, the resin curing device 5 includes a partition wall 92 that partitions the first transport lane 90A and the second transport lane 90B. Therefore, in the resin curing device 5, temperature control for curing the resin can be performed for each conveyance lane. Therefore, the resin coating system 1 can appropriately cope with a variety of small-quantity production.

  In the resin coating system 1 of the present embodiment, a large amount is obtained by processing the same substrate 2 (that is, the same substrate 2 on which the same electronic component is mounted) in the first processing lane 8A and the second processing lane 8B. It is also possible to respond to production.

  Furthermore, in the resin coating system 1 of this embodiment, the Y-axis movement mechanisms 64A to 67A and 64B to 67B and the X-axis movement mechanisms 68A to 71A and 68B to 71B that move the resin coating heads 49A to 52A and 49B to 52B are transported. It arrange | positions under the path 48A, 48B. Therefore, even the resin coating apparatus 4 including the complicated moving mechanisms 53A and 53B for moving the resin coating heads 49A to 52A and 49B to 52B in the three-axis directions can be reduced in size in the front-rear direction. As a result, even in the resin coating system 1 composed of the two processing lanes of the first processing lane 8A and the second processing lane 8B, the size can be reduced in the front-rear direction, and the resin coating system 1 is installed. The area can be reduced.

  In the resin coating apparatus 4 of this embodiment, Y-axis moving mechanisms 64A to 67A and 64B to 67B and X-axis moving mechanisms 68A to 71A and 68B to 71B are arranged below the mounting plates 54A and 54B. Therefore, it is placed between the transport paths 48A and 48B through which the substrate 2 is transported and the Y-axis moving mechanisms 64A to 67A and 64B to 67B and the X-axis moving mechanisms 68A to 71A and 68B to 71B that can be dust generation sources. It can be partitioned by plates 54A and 54B. As a result, it is possible to maintain the cleanness of the substrate 2 that requires cleanliness.

  In the resin coating apparatus 4 of this embodiment, the substrate guides 57A and 57B are attached to the placement plates 54A and 54B via the attachment brackets 58A and 58B. Therefore, the height of the mounting brackets 58A and 58B can be reduced compared to the case where the board guides 57A and 57B are attached to the upper surface 44a of the storage portion 44 via a predetermined bracket. Therefore, the mounting accuracy of the substrate guides 57A and 57B can be increased, and as a result, the substrate 2 can be appropriately conveyed.

  In the present embodiment, the first processing lane 8A and the second processing lane 8B having the same configuration are arranged symmetrically with respect to the vertical plane P. Therefore, in the resin coating device 4, the resin curing device 5, the substrate supply device 6, and the substrate winding device 7, the same control can be performed by using the same control constant. That is, it is not necessary to set a control constant for each processing lane 8A, 8B, and the control of the resin coating system 1 is simplified. Since the first processing lane 8A and the second processing lane 8B have the same configuration, the configuration can be simplified even with the resin coating system 1 including the two processing lanes 8A and 8B.

(Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without departing from the scope of the present invention. For example, in the embodiment described above, the moving mechanisms 53A and 53B are configured by feed screws and feed nuts, but the moving mechanisms 53A and 53B may be linear tables configured by linear motors, linear guides, or the like. good.

  4 and the like, the X-axis moving mechanisms 68A to 71A and 68B to 71B are not completely covered by the mounting plates 54A and 54B when viewed from the upper surface side. The X axis moving mechanisms 68A to 71A and 68B to 71B may be arranged so that all of the axis moving mechanisms 68A to 71A and 68B to 71B are covered with the mounting plates 54A and 54B. Moreover, the mounting plates 54A and 54B may be formed large so that all of the X-axis moving mechanisms 68A to 71A and 68B to 71B are covered with the mounting plates 54A and 54B. Furthermore, in the form mentioned above, although the resin hardening apparatus 4 is provided with mounting board 54A, 54B, the resin hardening apparatus 4 does not need to be provided with mounting board 54A, 54B.

  Furthermore, in the embodiment described above, the first processing lane 8A and the second processing lane 8B are arranged symmetrically with respect to the vertical plane P, but the first processing lane 8A and the second processing lane 8B are vertical planes. You may arrange | position so that it may become symmetrical when it sees from the upper surface with respect to P. That is, the configuration of the first processing lane 8A and the configuration of the second processing lane 8B corresponding to this configuration may be arranged at different heights. Further, the boundary surface between the first processing lane 8 </ b> A and the second processing lane 8 </ b> B is not limited to the vertical surface P parallel to the transport direction of the substrate 2. Further, the first processing lane 8A and the second processing lane 8B may not be arranged symmetrically with respect to the boundary surface.

  In the embodiment described above, the first substrate 2A and the second substrate 2B are transported in the same direction, but the transport direction of the first substrate 2A is opposite to the transport direction of the second substrate 2B. Also good.

  Furthermore, although the resin coating system 1 of the form mentioned above is comprised from two process lanes, the 1st process lane 8A and the 2nd process lane 8B, either the 1st process lane 8A or the 2nd process lane 8B is comprised. The resin coating system may be configured with only one processing lane. Even in this case, the resin coating apparatus can be downsized in the front-rear direction, and as a result, the resin coating system can be downsized in the front-rear direction.

It is the schematic which shows schematic structure of the resin coating system concerning embodiment of this invention from the front (front surface). It is the schematic which shows schematic structure of the resin coating system shown in FIG. 1 from the upper surface. It is a figure for demonstrating the structure of the drive part of the board | substrate supply apparatus shown in FIG. It is the schematic which shows schematic structure of the resin coating apparatus shown in FIG. 1 from an upper surface. It is sectional drawing which shows the FF cross section of FIG. It is the schematic which shows schematic structure of the moving mechanism shown in FIG. 4 from an upper surface. FIG. 5 is a schematic diagram illustrating a schematic configuration of a Y-axis moving mechanism, an X-axis moving mechanism, and a conveyance path from the GG direction of FIG. It is a figure for demonstrating the structure of the X-axis moving mechanism shown in FIG. It is an expanded sectional view which expands and shows the HH cross section of FIG. It is a figure which shows the state by which multiple resin application systems shown in FIG. 1 were arranged from the upper surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin coating system 2 Board | substrate 2A 1st board | substrate 2B 2nd board | substrate 4 Resin coating apparatus 5 Resin hardening apparatus 8A 1st process lane 8B 2nd process lane 45A 1st resin application part 45B 2nd resin application part 48A A conveyance path (1st Transport path)
48B transport path (second transport path)
49A-52A resin coating head (resin coating mechanism, first resin coating mechanism)
49B to 52B Resin coating head (resin coating mechanism, second resin coating mechanism)
53A Movement mechanism (first movement mechanism)
53B Movement mechanism (second movement mechanism)
54A mounting plate (first mounting plate)
54B Mounting plate (second mounting plate)
P Vertical surface (boundary surface)

Claims (6)

In a resin coating system comprising a resin coating device that applies a resin to a substrate conveyed in a predetermined direction, and a resin curing device that cures the resin applied to the substrate,
The resin coating apparatus includes a transport path through which the substrate is transported, a resin coating mechanism that applies resin to the substrate, an X-axis movement mechanism, a Y-axis movement mechanism, and a Z-axis movement mechanism that move the resin coating mechanism. With
The Y-axis moving mechanism moves at least the resin coating mechanism in the front-rear direction,
A resin coating system, wherein at least a part of the Y-axis moving mechanism is disposed below the transport path. The resin coating system according to claim 1, wherein the Y-axis moving mechanism is disposed so as to cross the transport path in the front-rear direction. A resin coating system that applies a resin to a first substrate transported in a predetermined direction and a second substrate transported in the same direction as the first substrate and cures the applied resin,
A first processing lane having a first resin application portion for applying resin to the first substrate; a second resin application portion for applying resin to the second substrate; and the first processing lane; A first processing lane and a second processing lane arranged symmetrically with respect to the boundary surface,
The first resin application unit includes a first conveyance path through which the first substrate is conveyed, a first resin application mechanism that applies resin to the first substrate, and a first X axis that moves the first resin application mechanism. A moving mechanism, a first Y-axis moving mechanism, and a first Z-axis moving mechanism;
The second resin application unit includes a second conveyance path through which the second substrate is conveyed, a second resin application mechanism that applies resin to the second substrate, and a second X axis that moves the second resin application mechanism. A moving mechanism, a second Y-axis moving mechanism, and a second Z-axis moving mechanism;
The first Y-axis moving mechanism moves at least the first resin coating mechanism in the front-rear direction,
The second Y-axis moving mechanism moves at least the second resin coating mechanism in the front-rear direction,
At least a part of the first Y-axis movement mechanism is disposed below the first conveyance path, and at least a part of the second Y-axis movement mechanism is disposed below the second conveyance path. Resin coating system. The first Y-axis moving mechanism is disposed so as to cross the transport path in the front-rear direction;
The resin coating system according to claim 3, wherein the second Y-axis moving mechanism is disposed so as to cross the transport path in the front-rear direction. The resin coating apparatus includes a first placement plate on which the first transport path is placed, and a second placement plate on which the second transport path is placed,
At least a part of the first Y-axis moving mechanism is disposed below the first mounting plate, and at least a part of the second Y-axis moving mechanism is disposed below the second mounting plate. The resin coating system according to claim 3 or 4 , characterized in that: The boundary surface is a vertical surface parallel to a transport direction of the substrate, and the first processing lane and the second processing lane are arranged symmetrically with respect to the vertical surface. The resin coating system as described in any one of 3-5 .

Images