JP2745207B2 - Resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device for applying a synthetic resin liquid to a bonding portion to which a semiconductor chip is bonded and sealing it.

[0002]

2. Description of the Related Art Conventionally, it has been widely practiced to bond a semiconductor chip to a lead of a TAB tape or an electrode of a glass substrate, and at the same time, an epoxy resin liquid or a silicone resin liquid is applied to the bonding portion. Sealing is also widely practiced.

[0003] That is, FIG. 3 shows an example of such a resin sealing device.
And a first cylinder 5 mounted on an upper end of the bracket 3 guided by a vertical guide 4 mounted on the right side of the bracket 3 and mounted on an XY table 2 fixed to the bracket 3. The apparatus includes a holder 6 mounted so as to be able to move up and down, a syringe 7 mounted on the holder 6, and a needle nozzle 8 mounted on the syringe 7.

[0004] It should be noted that the TAB is
Both ends in the width direction of the tape 9 are gripped and TAB
Semiconductor chip 10 bonded to tape 9
Are supported by the support mechanism 16.

[0005] For this reason, compressed air is supplied from the pipe 5b to protrude the piston rod 5a of the cylinder 5 so that the needle nozzle 8 is bonded from above to below the bonding point (where the semiconductor chip 10 is bonded to the TAB tape 9). In a state where the synthetic resin liquid can be approached to a predetermined distance, compressed air is supplied from the pipe line 11 into the syringe 7 containing the synthetic resin liquid for sealing, and the synthetic resin liquid is supplied from the needle nozzle 8. At this time, the XY table 2 is driven and controlled so that the needle nozzle 8 is moved back and forth so as to draw a spiral trajectory gradually moving from the outer position to the inner position. The synthetic resin liquid was discharged and applied while being moved in a predetermined manner in the left-right direction.

[0006]

However, since this sealing device is composed of one coating device, the resin sealing must be interrupted when the needle nozzle 8 is blocked or the like. Since it is lost and the processing ability is inferior, and it is applied in a spiral form through the needle nozzle 8, it is difficult to quickly apply the synthetic resin liquid due to its high viscosity (for example, 20 to 50 poise). As the time becomes longer, the applied synthetic resin liquid is not diffused, that is, it does not spread out in a plane, so it is solidified in a state of being swirled up, so that the resin sealing surface becomes uneven and the product becomes uneven. There was a disadvantage that the value was significantly reduced.

In view of the drawbacks, the present invention has been intensively studied in order to solve the drawbacks, and as a result of comprising a pair of coating apparatuses, even if a trouble such as nozzle clogging occurs in one of the coating apparatuses, the other can be used. The resin sealing can be continued by the coating device, so that the processing capability (resin sealing capability) can be improved, and the pair of coating devices are provided with a needle nozzle for linearly coating the synthetic resin liquid. By using a coating device and a coating device equipped with a surface coating device that applies the synthetic resin liquid in a planar manner, rapid coating can be achieved and the processing capacity (resin sealing ability) can be further improved, and the commercial value It has been found that a flat resin-encapsulated surface having a high surface roughness can be obtained.

[0008]

That is, a resin sealing device according to the present invention seals a bonding portion where the semiconductor chip is bonded in a direction in which an object to be coated on which the semiconductor chip is bonded is transferred. the coating apparatus for coating a synthetic resin liquid for a pair arranged resin sealing
In the device, of the two coating devices,
The coating device that applies the synthetic resin liquid linearly applies the synthetic resin liquid
Needle nozzle and other coating equipment
However, there is provided a surface applicator for applying a synthetic resin liquid in a planar manner . Incidentally, the coating object is preferably TAB tape.

[0009]

In FIG. 1, a TAB tape 9 (substrate to be coated) to which a semiconductor chip 10 is bonded is intermittently transferred from left to right, and the bonding portion is suitable for applying a synthetic resin liquid for sealing. Once positioned, the applicators 20 and 21 start applying the same type of synthetic resin liquid. The coating device 20 includes the needle nozzle 8 and the coating device 21 includes the surface coating device 17.

[0010] Therefore, the linear coating by the coating device 20 on one bonding location and the planar coating by the coating device 21 on the other bonding location can be simultaneously performed, thereby achieving quick coating and processing capacity ( (Resin sealing ability) can be further improved, and a flat resin sealing surface with high commercial value can be obtained.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, one embodiment of a pair of coating units 20, 21 has the same construction as that of a conventional resin sealing unit (FIG. 1). This corresponds to the left side view (see FIG. 3), which includes a bracket 3 mounted on an XY table 2 fixed to the machine base 1, a cylinder 5 mounted on the upper end of the bracket 3, and a cylinder 5 5 includes a holder 6 to which the lower end of the piston rod 5a is screwed, a syringe 7 attached to the holder 6, and a needle nozzle 8 screwed to the bottom of the syringe 7.

Therefore, the piston rod 5 of the cylinder 5
The holder 6 can be moved up and down horizontally by moving a. The holder 6 is guided and moved by the vertical guide 4 mounted on the right side of the bracket 3. Further, by supplying compressed air to the lid mounted on the upper end of the syringe 7 from the open conduit 11,
The sealing synthetic resin liquid (for example, epoxy resin liquid or the like) contained therein can be discharged from the needle nozzle 8. The outer peripheral surface of the needle nozzle 8 is
It is preferable to coat with a resin adhesion preventing material such as fluororesin or ceramic.

On the other hand, the other coating device 21 is different in that the surface coating device 17 is mounted, that is, as shown in an enlarged view in FIG. 2, the coating device 21 is screwed to the bottom of the syringe 7. The difference is that a surface applicator 17 configured by fixing a surface application jig 18 to the lower end of the nozzle 19 is attached. The nozzle 19 is formed of a needle nozzle, and the surface coating jig 18 is provided in a circular, rectangular or square shape. In the case of a circular shape, the outer diameter is D, and the outer diameter of the nozzle 19 is d. Then, D ≧ (1.5 to 1
0) It is preferable to provide d.

According to this resin sealing device, the same type of synthetic resin liquid can be applied to the lower bonding portion and sealed through the following steps. First, FIG.
In FIG. 3 corresponding to the left side view of FIG. 3, the semiconductor chip 10 is attached to the lower TAB tape 9 (object to be coated) from the left or right retracted position while the holder 6 is moved upward via the cylinder 5. The syringe 7 having the needle nozzle 8 is moved above a position where the is bonded (bonding position). This movement is
This is performed by controlling the driving of the XY table 2.

Subsequently, when the compressed air is supplied from the pipeline 5b of the cylinder 5 during standby in such a state, the piston rod 5a is protruded, and the holder 6 is moved downward. The syringe 7 is moved downward. Then, when the lower end of the needle nozzle 8 approaches the bonding position in a predetermined manner, compressed air is supplied into the syringe 7 from a pipe line 11 connected to a compressed air supply source (not shown).

At this time, although not shown, a pressure control valve, an electromagnetic switching valve, and the like mounted on the pipeline 11 are controlled in a predetermined manner. Accordingly, the synthetic resin liquid for sealing whose predetermined amount is contained in the syringe 7 is pressurized and discharged from the needle nozzle 8. Then, the XY table 2 is driven and controlled, and the needle nozzle 8 is moved in a predetermined direction in the front-rear and left-right directions, and the synthetic resin liquid is linearly applied in a loop so as to surround the bonding portion.

As a result, the first application to the bonding portion is completed. Subsequently, the driving of the XY table 2 and the supply of the compressed air from the pipe 11 are stopped, and the compressed air is supplied from the pipe 5c of the cylinder 5. Therefore, the piston rod 5a is immersed, the syringe 7 is returned to the original upper position together with the holder 6, and is kept on standby. Note that, similarly to the pipe line 11, a pressure control valve, an electromagnetic switching valve, and the like are also mounted in the pipe lines 5b and 5c connected to the compressed air supply side (not shown).

On the other hand, the TAB tape 9 (substrate to be coated) in which the synthetic resin liquid is linearly applied to the bonding portion is intermittently transferred, and the linearly applied bonding portion is transferred to the other coating device 21. You. Then, the coating device 21 is also controlled in the same manner as the coating device 20 described above, whereby the area defined by the linear coating is coated in a planar manner so as to form a plane continuous with the linear coating. You.

That is, when the compressed air is supplied from the pipe 5b of the cylinder 5, the piston rod 5a is protruded and the holder 6 is moved downward, and accordingly, the syringe 7 is moved downward. And the needle nozzle 8
When the lower end of the cylinder approaches the bonding position in a predetermined manner, compressed air is supplied into the syringe 7 from a pipeline 11 connected to a compressed air supply source (not shown).

At this time, although not shown, a pressure control valve, an electromagnetic switching valve, and the like mounted on the pipeline 11 are controlled in a predetermined manner. Accordingly, a sealing synthetic resin liquid (a synthetic resin liquid of the same type as the synthetic resin liquid applied by the coating device 20) contained in the syringe 7 in a predetermined amount is pressurized and discharged from the nozzle 19. Then, the XY table 2 is driven and controlled,
The surface applicator 17 is moved in the front, rear, left and right directions. For this reason, the synthetic resin liquid discharged from the nozzle 19 and applied to the bonding location is leveled (flattened) by the surface application jig 18, and the area defined by the linear application is connected to the linear application. Is applied to form a flat surface.

As described above, since the planar coating is performed after the linear coating, a high-viscosity synthetic resin liquid for sealing can be quickly applied, and a flat resin sealing surface having high commercial value is formed. be able to. The linear coating by the coating device 20 and the planar coating by the coating device 21 are performed simultaneously.
Therefore, the processing ability (resin sealing ability) can be further improved.

After completion of the planar coating, the driving of the XY table 2 and the supply of compressed air from the pipe 11 are stopped, and the compressed air is supplied from the pipe 5c of the cylinder 5. Therefore, the piston rod 5a is submerged, and the syringe 7 is returned to the upper original position together with the holder 6, and is kept on standby. FIG. 1 shows a state in which the coating apparatuses 20 and 21 are in such a standby state.

The intermittent transfer of the TAB tape 9 (object to be coated), that is, the intermittent transfer of the bonding portion to the coating position, is performed while the coating devices 20 and 21 are on standby. That is, when the gripping mechanism 15 gripping both ends in the width direction of the TAB tape 9 releases the gripping and the support mechanism 16 supporting the semiconductor chip 10 moves downward to release the support, Is positioned below the standby needle nozzle 8 and the surface applicator 17.

This transfer is carried out by sending out a TAB tape (object to be coated) from a reel (not shown) on the tape supply side and winding the TAB tape (reel) on the reel on the tape winding side. Is transported below the waiting needle nozzle 8 and the surface applicator 17, the gripping mechanism 15 grips the TAB tape 9 (object to be coated) and the support mechanism 16 moves upward to support the semiconductor chip 10. I do.

In this way, the bonding locations are successively positioned below the standby needle nozzle 8 and the surface applicator 17 in the manner shown in FIG. 1, and are gripped by the gripping mechanism 15, that is, locked. And the support mechanism 16
The semiconductor chip 10 is supported by this, and in this state, the sealing synthetic resin liquid can be simultaneously applied by the application devices 20 and 21.

Although one embodiment has been described above, the resin sealing device according to the present invention includes a pair of coating devices, and if necessary, performs resin sealing with only one of the coating devices. Therefore, even if a trouble such as nozzle blockage occurs in one of the coating devices, the resin can be sealed by the other coating device, so that the resin sealing can be continued without interruption. Thus, the processing capacity can be improved. The pressure of air supplied to the syringe 7 is controlled to an appropriate pressure in consideration of the magnitude of the viscosity of the synthetic resin liquid, the size of the surface coating jig 18, and the like. The object to be coated may be something other than the TAB tape.

[0027]

As described above, according to the first aspect of the present invention, even if a trouble such as nozzle clogging occurs in one coating device, resin sealing can be performed by the other coating device. The processing ability (resin sealing ability) can be improved.

In addition, linear coating by one coating device
Surface coating by the other coating device can be performed simultaneously.
As a result, processing speed (resin sealing ability) can be further improved by speeding up resin sealing, and a flat resin sealing surface with high commercial value can be obtained.

According to the second aspect of the present invention, T
In the resin sealing of the AB tape, the processing capacity (resin sealing ability) can be improved.

[Brief description of the drawings]

FIG. 1 is a front view of a resin sealing device according to the present invention.

FIG. 2 is a longitudinal sectional view of the surface applicator.

FIG. 3 is a side view of a conventional resin sealing device and FIG.
FIG.

[Explanation of symbols]

 2 XY table 5 Cylinder 6 Holder 7 Syringe 8 Needle nozzle 9 TAB tape (object to be coated) 10 Semiconductor chip 17 Surface coating device 18 Surface coating jig 19 Nozzle

Claims (2)

(57) [Claims] 1. A pair of coating devices for applying a synthetic resin liquid for sealing a bonding portion to which the semiconductor chip is bonded is provided in a direction in which an object to be coated to which the semiconductor chip is bonded is transferred. Resin sealing equipment
First, of both coating devices,
The coating device that applies the resin liquid applies the synthetic resin liquid linearly.
And other coating devices,
A resin sealing device comprising a surface applicator for applying a synthetic resin liquid in a planar manner . 2. The resin sealing device according to claim 1, wherein the object to be coated is a TAB tape .