JPH01284364A - Dispenser - Google Patents

Abstract

PURPOSE:To drop an extremely small amt. of liquid resin at a constant rate without damaging a body to be molded by applying high-frequency oscillation to a needle pipe. CONSTITUTION:The specified amt. of the liquid resin 2 is supplied through pipings 10, 11 to the needle pipe 1 from a tank 8 by a pump 9 and the drop of the resin 2 is stuck to a discharge port 1a. An oscillation generator 6 is operated in this sate and the needle pipe 1 is subjected to the high-frequency oscillation. The drop of the resin 2 sticking to the discharge port 1a of the needle pipe is surely dropped into the recess 4a of a substrate 4 and a chip 3 in the recess 4a is molded even if the quantity of said drop is extremely small. The need for the vertical movement of the needle pipe 1 for dropping the resin 2 by bringing the same into contact with the substrate 4 is, therefore, eliminated and since the contact with the chip 3 by the vertical movement is eliminated, no damages are given to the chip 3.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a dispenser for dropping resin little by little, and is used, for example, in resin molds of LED chips and IC chips.

<Prior Art> In manufacturing semiconductor devices using LEDs or ICs, after a chip is bonded onto a substrate, a resin mold is applied to the entire chip to protect the chip.

Conventionally, this resin molding is performed by dropping a fixed amount of liquid resin onto the chip using a dispensing device.

FIG. 2 shows how this resin is dripped, and the liquid resin 2 is fed in a fixed amount to the discharge port 1a of the needle tube 1 by air pressure or a gear pump (not shown).
From a, the liquid resin 2 is dripped onto the stubble 3 in a prostrate position.

<Problems to be Solved by the Invention> In order for the resin to drip from the needle tube 1 by natural fall, the resin needs to form a considerably large bead shape at the tip of the needle tube 1. Therefore, if the amount of liquid resin to be dropped at one time is large, it is possible to drip the liquid resin by gravity from the needle tube 1, but for example, as shown in FIG. In order to mold the chip 3 into a concave or planar shape as shown in FIG. 4, and to do so in such a way that the resin does not adhere to the surface around the concave portion of the substrate 4, it is necessary to adjust the amount of resin dropped at one time. It is necessary to minimize the amount of resin, and it is impossible to drip this extremely small amount of resin by gravity.

For this purpose, as shown in FIG. 3, by moving the needle tube 1 in the vertical direction, a drop of the resin 2 at the tip of the needle tube 1 is brought into contact with the substrate 4 surrounding the chip 3, and a very small amount of the resin 2 is applied to the substrate 4.
The method used was to encourage people to move to

However, in the method of moving the needle tube 1 in the vertical direction to bring the resin drops into contact with the object to be molded,
The tip of the moving needle tube 1 accidentally touches the gold wire 5 to which the LED chip 7 is wire-bonded, causing problems such as bending or cutting the gold wire 5. Further, when moving the needle tube 1 in the vertical direction to bring the resin drop into contact with a predetermined position on the substrate 4, a complicated operation is required to position the needle tube.

The present invention has been made in view of the above circumstances, and its purpose is to provide a dispenser that can drip a very small amount of resin without requiring an operation such as bringing the resin into contact with a molded object. It is.

Means for Solving the Problems> In order to achieve the above object, the dispenser according to the present invention includes a vibration generating means for applying high frequency vibration to the needle tube.

<Function> In the dispenser according to the present invention, with a drop of liquid resin formed at the tip of the needle tube, high-frequency vibration is applied to the needle tube by the vibration generating means.
A very small amount of liquid resin is dripped from the needle tube.

<Example> FIG. 1 shows the configuration of a dispenser of this example. In the figure, 1 is a needle tube, 2 is a liquid resin, and 3 is an L
ED chip, 4 is a substrate, 5 is a gold wire, 6 is a vibration generator,
7 is an arm, 8 is a resin tank, 9 is a pump, 10 is piping, and 11 is flexible piping.

A liquid resin passes through the needle tube 1, and a certain amount of liquid resin 2 drips from the tip of the needle tube 1 in the form of drops. Liquid resin is supplied to the needle pipe 1 from a tank 8 via a pipe 10 and a flexible pipe 11 by a pump 9 . The LED chip 3 is mounted in a recess 4a of a substrate 4, and wire bonded with a gold wire 5.

The liquid resin dripping from the needle tube 1 falls into the recess 4a of the substrate 4, and molds the LED chip 3 and the gold wire 5 within the recess 4a.

The vibration generator 6 generates high-frequency vibrations using ultrasonic waves or the like. This high frequency vibration is generated by the vibration generator 6 and the needle tube 1.
It is transmitted to the needle tube 1 by the arm 7 connecting the two.

The operation will be explained below.

First, a certain amount of liquid resin is fed from the tank 8 to the needle pipe 1 via the pipe 10 and the flexible pipe 11 by the pump 9 . When a drop of liquid resin adheres to the discharge port 1a of the needle tube 1 by feeding a certain amount of liquid resin, the vibration generator 6 is activated, and the needle tube 1 connected to the vibration generator 6 by an arm 7 is activated. vibrates at high frequency. Due to this vibration, the drops of liquid resin 2 adhering to the tip of the needle tube 1 fall into the recess 4a of the substrate 4. The fallen liquid resin 2 fills the inside of the recess 4a, and as shown in FIG. 4, a structure is obtained in which the LED chip 3 and the gold wire 5 are resin-molded in the recess 4a in a concave or planar shape.

<Effects of the Invention> As explained above, in the present invention, the needle tube is vibrated with a droplet of liquid resin formed at the tip of the needle tube, so that a metered drop of an extremely small amount of liquid resin can be applied to the resin. This can be carried out without requiring a complicated operation such as bringing the molded body into contact with the molded body, which may damage the molded body.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of an embodiment of the present invention, FIGS. 2 and 3 are diagrams explaining the operation of a conventional example, and FIG. 4 is a diagram showing a cross-sectional structure of a resin mold. 1... Needle tube 2... Liquid resin 3... LED chip 4... Substrate 5... Gold wire 6... Vibration generator 7... Arm Patent applicant Seiwa Denki Co., Ltd. Patent Attorney Nishi 1) New Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] A dispenser for dispensing a small amount of resin by passing it through a needle tube, characterized in that the dispenser is equipped with vibration generating means for applying high frequency vibration to the needle tube.