JP2000328112A - Manufacture of solder ball and manufacturing device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing solder balls capable of yielding solder balls of a desired diameter with an excellent yield, and a manufacturing device therefor. SOLUTION: In a manufacturing method (a manufacturing device) of solder balls in which a molten solder 5 is discharged from a tip of a nozzle 6 whose tip is immersed in the surface of an oil 2 into the oil heated to a temperature higher than the melting point of the solder, a liquid column 10 of the discharged molten solder is dropped downward in the oil while divided into pieces in the high temperature range of the oil heated to a temperature higher than the melting point of the solder and the liquid ball of the divided solder is solidified in a low temperature range in the oil adjacent to the lower part of the high temperature range in the oil to obtain the solder balls 8, the liquid column of the molten solder is divided into pieces by applying a vibration of >=400 Hz to <=1000 Hz in frequency to the molten solder discharged from the nozzle tip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a solder ball used for mounting in a semiconductor package, and more particularly to a method of manufacturing a solder ball having a desired diameter with a good yield. The present invention relates to the manufacturing apparatus.

[0002]

2. Description of the Related Art Conventionally, the mounting form of a semiconductor package is as follows.
As shown in FIG. 8, a so-called QFP (quad flat package) in which lead terminals b are arranged around a package a has been mainstream. However, in recent years, demands for high-density mounting of semiconductor packages have been increased with reduction in size and weight of electronic devices.

For this reason, recently, as an external terminal capable of high-density mounting, a BGA (ball grid array) in which solder bumps c are arranged in a grid as shown in FIG. Chip size package)
In addition, flip-chip mounting or the like, in which a protruding electrode is formed on an electrode pad of a semiconductor chip and directly connected to a substrate in a package, has been used. Note that d in FIGS. 8 and 9 denotes a semiconductor chip, e in FIG. 9 denotes a ceramic carrier (substrate in a package), f denotes an electrode pad of the semiconductor chip d, and g denotes a ceramic carrier e.
And wiring patterns for connecting the electrode pads f and the solder bumps c.

[0004] Solder balls are used as materials for external terminals of semiconductor packages such as the BGA.
Further, a small-diameter solder ball is required for a bump electrode for CSP or flip chip mounting.

By the way, it is desired that a solder ball used for mounting or the like in a semiconductor package has a shape close to a true sphere.

For this reason, the above-mentioned solder balls have been conventionally manufactured by the following method called an atomization method in oil. FIG. 10 shows an example of a manufacturing apparatus used for the in-oil atomizing method.

That is, the manufacturing apparatus i is provided with a column (tube) m in which an oil j such as soybean oil is accommodated and a heating means k is provided in an upper portion thereof, and is arranged above the column m. The main part of the nozzle n is immersed in the oil surface of the column m and contains the molten solder h therein. Then, the molten solder h is supplied to the nozzle n
The liquid column p of the molten solder h is discharged from the tip into the oil j heated to the melting point of the solder or more. And the molten solder becomes spherical due to the surface tension of the solder itself, and the liquid ball of the solder falls downward in the oil and is solidified in a low-temperature region in the oil to obtain a spherical solder ball.

[0008]

By the way, the in-oil atomization method using such a manufacturing apparatus has an advantage that a large amount of solder balls can be easily obtained, but on the other hand, the molten solder h discharged into the oil j has an advantage. Since the liquid column p is divided under the natural fluctuations such as the surface tension and gravity of the molten solder itself, when the liquid column p is divided, a large number of lateral droplets are generated, and an undesirable small-diameter solder ball is formed. The diameter of the solder ball is liable to fluctuate due to generation or division of the solder ball irregularly, so that a solder ball having a desired diameter cannot be manufactured with good yield.

The present invention has been made in view of such a problem, and an object thereof is to provide a method and an apparatus for manufacturing a solder ball capable of manufacturing a solder ball having a desired diameter with a high yield. Is to do.

[0010]

Accordingly, as a result of diligent studies conducted by the present inventor, in the in-oil atomization method, the liquid column of the molten solder discharged into the oil from the nozzle tip is divided and the solder liquid is separated. In the process of turning into a sphere, it has been found that forcing the liquid column of the molten solder into regular breaks is effective in solving the problem. The present invention has been completed through such studies.

That is, according to the first aspect of the present invention, the molten solder is discharged from the nozzle tip whose tip side is immersed in the oil surface into the oil heated to the melting point of the solder or more, and The liquid column of the molten solder is lowered downward in the oil while breaking it in the high-temperature area in oil heated above the melting point of the solder. Assuming a method of manufacturing a solder ball to obtain a solder ball by solidifying in a region, the molten solder discharged from the nozzle tip has a frequency of 400
It is characterized in that the liquid column of the molten solder is divided while applying a vibration of not less than 1000 Hz and not more than 1000 Hz.

According to the method for manufacturing a solder ball according to the first aspect of the present invention, the molten solder discharged from the nozzle tip is subjected to a vibration having a frequency of 400 Hz or more and 1000 Hz or less. Since the columns are regularly divided at the added vibration frequency, the diameter of the obtained solder ball is hard to vary, and the generation of the droplets at the time of the division of the liquid column is suppressed, and as a result, the solder having the desired diameter is obtained. Balls can be manufactured with good yield.

Here, as means for applying vibration having a frequency of 400 Hz or more and 1000 Hz or less to the molten solder discharged from the tip of the nozzle, means for directly or indirectly fixing a vibrator to the nozzle and applying vibration to the nozzle (claim) Item 2) may be adopted, or a vibrating body may be arranged in the molten solder accommodated in the nozzle (claim 3) or a vibrating body may be arranged in the oil (claim 4) for melting. Means for applying vibration to the solder or oil may be employed.

Next, the invention according to claims 5 to 8 is:
The present invention relates to an invention that specifies a manufacturing apparatus used in the method for manufacturing a solder ball according to any one of claims 1 to 4.

That is, the invention according to claim 5 is a pipe body in which oil is contained and a heating means is provided in an upper part thereof, and a pipe disposed above the pipe body and having a tip end having an oil level of the pipe body. A nozzle containing a molten solder immersed in the inside and discharging the molten solder from the tip of the nozzle into the oil heated above the melting point of the solder, and forming a liquid column of the discharged molten solder. Assuming an apparatus for manufacturing a solder ball that obtains a solder ball by being lowered in the oil while being divided in oil, a vibrating body that applies vibration having a frequency of 400 Hz or more and 1000 Hz or less to the molten solder discharged from the nozzle tip is provided. It is characterized by having.

In the apparatus for manufacturing a solder ball according to the fifth aspect of the present invention, the vibrating body for applying a vibration having a frequency of 400 Hz or more and 1000 Hz or less to the molten solder discharged from the nozzle tip is provided. Since the liquid column of the molten solder is regularly divided at the added vibration frequency, the diameter of the obtained solder ball is unlikely to vary, and the occurrence of droplets during the division of the liquid column is also suppressed. Can be manufactured with good yield.

The vibrating body for applying a vibration having a frequency of 400 Hz or more and 1000 Hz or less to the molten solder discharged from the tip of the nozzle may be fixed directly or indirectly to the nozzle. Alternatively, it may be arranged in the molten solder accommodated in the nozzle (Claim 7) or in the oil in the tube (Claim 8).

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[First Embodiment] A solder ball manufacturing apparatus 1 according to this embodiment has a column (see FIG. 1) in which an oil 2 is contained and a heating means 3 is provided above the column. A tube 6, a nozzle 6 disposed above the column 4, the tip end of which is immersed in the oil level of the column 4, and containing a molten solder 5 therein, and fixed to an upper portion of the nozzle 6 Vibration is added to the nozzle 6 and the molten solder discharged from the tip of the nozzle 6 has a frequency of 40.
A vibrating body 7 for applying a vibration of 0 Hz or more and 1000 Hz or less forms a main part thereof. A valve 9 for blocking the manufactured solder ball 8 is provided below the column 4.

The column 4 and the nozzle 6 are generally made of glass, and the oil 2 contained in the column 4 is a vegetable oil such as coconut oil or soybean oil or a synthetic oil such as silicone oil.

The heating means 3 for heating the oil 2 to form a high-temperature region in the oil may be a mantle heater attached to the outer periphery of the column 4 or a stainless steel heater provided in the oil. An example is a pipe heater. In any case of using any of the heaters, the oil temperature near the tip of the nozzle 6 is set to be higher than the melting point of the solder by 10 ° C. or more in principle.

The driving force for discharging the molten solder 5 from the nozzle 6 may be the own weight of the molten solder or the gas pressure acting on the own weight and the upper surface of the molten solder. The nozzle diameter, the liquid surface height H of the molten solder (that is, the distance from the nozzle tip of the molten solder 5 contained in the nozzle 6 to the liquid surface of the molten solder 5), and the gas pressure are such that a desired solder ball is obtained. It affects the flow rate of the molten solder required for this purpose, and is appropriately selected depending on the desired solder ball diameter.

In the solder ball manufacturing apparatus 1 according to this embodiment, since the vibrating body 7 for applying a vibration having a frequency of 400 Hz or more and 1000 Hz or less to the molten solder discharged from the tip of the nozzle 6 is provided, Since the liquid column 10 of the molten solder is regularly divided at the added vibration frequency, the diameter of the obtained solder ball 8 is hardly varied, and the generation of droplets when the liquid column 10 is divided is also suppressed. As a result, there is an advantage that the solder ball 8 having a desired diameter can be manufactured with high yield.

Here, the size of the solder ball obtained by the solder ball manufacturing apparatus 1 satisfies the following relational expression (1).

Solder ball weight (g) = Nozzle discharge flow rate (g / sec) ÷ Frequency (1 / sec) (1) That is, the diameter of the obtained solder ball is determined by the nozzle discharge flow rate and the frequency from the above relational expression (1). Is determined by
Then, the liquid surface height H, the nozzle diameter, and the gas pressure of the molten solder in the nozzle that determines the nozzle discharge flow rate are made constant, and vibration of a constant frequency is applied to the molten solder discharged from the tip of the nozzle 6. It is possible to stably manufacture a solder ball having a constant diameter.

The vibrating body 7 for applying vibration to the molten solder discharged from the tip of the nozzle 6 by applying vibration to the nozzle 6 and having a frequency of 400 Hz or more and 1000 Hz or less includes:
An acoustic speaker or a vibrator used for a component aligning machine may be used, but a speaker that generates a constant frequency stably for a long time and has a variable frequency is preferable.

[Second Embodiment] A solder ball manufacturing apparatus 20 according to this embodiment is different from the vibrating body 7 fixedly attached to the nozzle 6 in FIG. It is substantially the same as the solder ball manufacturing apparatus 1 according to the first embodiment except that a rod-shaped vibrator 21 is arranged in the molten solder 5 accommodated in the solder ball.

The vibrating body 21 arranged in the molten solder 5 and applying vibration to the molten solder 5 is a rod-shaped vibrating body that transmits vibration from a vibration source 23 fixed to a member 22 different from the nozzle 6. In addition, a plate-like thing, a pipe-like thing, etc. are arbitrary. Also, the vibration source 23 may be an acoustic speaker or a vibrator used for a component aligning machine,
It is preferable to use a device that generates a constant frequency stably for a long time and has a variable frequency.

In the solder ball manufacturing apparatus 20 according to this embodiment, the molten solder 5 in the nozzle 6 is also vibrated by the action of the rod-shaped vibrator 21 disposed in the molten solder 5. Vibration is transmitted to the molten solder discharged from the tip of the nozzle 6 to apply a vibration having a frequency of 400 Hz or more and 1000 Hz or less to the molten solder. Accordingly, since the liquid column 10 of the molten solder is regularly divided at the added vibration frequency, the diameter of the obtained solder ball 8 is hardly varied, and the generation of splashes when the liquid column 10 is divided is suppressed. As a result, there is an advantage that the solder ball 8 having a desired diameter can be manufactured with high yield.

The diameter of the obtained solder ball is the same as that of the solder ball manufacturing apparatus 1 according to the first embodiment.
From the relational expression (1), it is determined by the nozzle discharge flow rate and the frequency. Then, the liquid surface height H, the nozzle diameter, and the gas pressure of the molten solder in the nozzle that determines the nozzle discharge flow rate are made constant, and vibration of a constant frequency is applied to the molten solder discharged from the tip of the nozzle 6. It is possible to stably manufacture a solder ball having a constant diameter.

[Third Embodiment] A solder ball manufacturing apparatus 30 according to this embodiment is different from the vibrating body 7 fixedly attached to the nozzle 6 in the column 4 as shown in FIG. It is substantially the same as the solder ball manufacturing apparatus 1 according to the first embodiment except that the vibrating body 31 is arranged in the oil 2 stored in the oil ball 2.

That is, this solder ball manufacturing apparatus 3
Numeral 0 denotes a vibrating body case 32 which is provided in a part of the column 4 and communicates with the column 4.
A vibrating body (sound speaker for sound) 31 which is hermetically sealed is disposed therein, and the vibration generated by the vibrating body (sound speaker for sound) 31 is transmitted via the oil 2 to the molten solder discharged from the tip of the nozzle 6. Frequency 400Hz or more and 1000Hz
The following vibrations are applied. Therefore, also in the solder ball manufacturing apparatus 30 according to this embodiment, the diameter of the obtained solder ball 8 is hard to vary because the liquid column 10 of the molten solder is regularly cut at the added vibration frequency, and Since the generation of droplets at the time of dividing the liquid column 10 is also suppressed, there is an advantage that the solder balls 8 having a desired diameter can be manufactured with high yield.

The diameter of the obtained solder ball is the same as that of the solder ball manufacturing apparatus 1 according to the first embodiment.
From the relational expression (1), it is determined by the nozzle discharge flow rate and the frequency. Then, the liquid surface height H, the nozzle diameter, and the gas pressure of the molten solder in the nozzle that determines the nozzle discharge flow rate are made constant, and vibration of a constant frequency is applied to the molten solder discharged from the tip of the nozzle 6. It is possible to stably manufacture a solder ball having a constant diameter.

As shown in FIG. 6, a vibrating body case 34 is connected to the column 4 via a branch pipe 33, and a vibrating body (sound speaker) 31 is arranged in the vibrating body case 34. May be changed. With such a configuration, the vibrating body case 34 can be separated from the column 4, and the vibrating body (sound speaker) 31 is hardly exposed to high temperature because the vibrating body (sound speaker) 31 is separated from the column 4. In addition, by making the upper surface of the speaker float above the oil 2 surface, the upper surface of the speaker can be opened, which is advantageous for maintenance of the vibrating body (sound speaker) 31.

[0035]

Embodiments of the present invention will be specifically described below.

Examples 1 to 6 Using the manufacturing apparatus 1 having the configuration shown in FIG. 1, the conditions shown in Table 1 below (namely, the frequency Hz of the vibration generated by the vibrating body, the nozzle diameter μm, and the melting temperature) Solder balls were manufactured at a solder liquid level of Hmm). The composition of the solder is 63% tin (by weight) and 37% lead.
The oil used was soybean oil, the temperature of the oil near the tip of the nozzle was 230 ° C., and an acoustic speaker was used for the vibrating body 7, which was fixed to the upper part of the nozzle with double-sided tape.

The diameter of each of the 200 solder balls obtained by using this manufacturing apparatus was measured. Table 1 shows the average value and the standard deviation. Table 1 also shows the nozzle discharge flow rate (g / min) set from the above conditions.

[Comparative Examples 1 to 3] Solder balls were manufactured under the same conditions as in Examples 1 to 6 except for the conditions shown in Table 1 (ie, frequency Hz, nozzle diameter μm, liquid level height Hmm). That is, Comparative Example 1 does not impart vibration, Comparative Example 2 has a frequency of 350 Hz out of the condition of the present invention, and Comparative Example 3 has a frequency of 1050H which is out of the condition of the present invention.
z.

The diameter of each of the obtained solder balls was measured in 200 pieces. The average and standard deviation are also shown in Table 1.
Shown in

[0040]

[Table 1] [Confirmation] From the results shown in Table 1, in Examples 1 to 6, the standard deviations were all 15 μm or less, while Comparative Examples 1 to 3
In each case, it is 78 μm or more, which confirms the superiority of the embodiment. In particular, in Comparative Example 1 where no vibration is applied, the standard deviation is 128 μm, which is a remarkably bad result as compared with Examples 1 to 6 and Comparative Examples 2 and 3.

The diameters of the solder balls according to Examples 1 to 6 satisfied the above-mentioned relational expression (1).

[Embodiment 7] A production example using a mass production type production apparatus having the configuration shown in FIG. 2 will be described below.

The mass-production type manufacturing apparatus shown in FIG. 2 is different from the manufacturing apparatus 1 shown in FIG. 1 in that a molten solder supply tank 100 for supplying molten solder as a raw material is added to the nozzle 6. Cooling means 1 for forming a low-temperature region in oil on the lower side
It is the same in principle as the manufacturing apparatus 1 shown in FIG. 1 except that a point 20 is added and a solder ball collecting tank 110 is added on the bottom side of the column 4.

The main part of the molten solder supply tank 100 is composed of a raw material melting tank 101 provided with a control valve 103 and a control tank 102 connected to the raw material melting tank 101 and having a liquid level sensor 104. ing.
In FIG. 2, reference numeral 111 denotes a second valve, 112 denotes a cover oil, and 113 denotes a waste oil pipe.

In this embodiment, the composition of the solder, the type of oil used and the temperature thereof were the same as those of the first to sixth embodiments. The nozzle diameter was 400 μm, the liquid level of the molten solder was 100 mm, Was 550 Hz. Further, the temperature of the molten solder supply tank 100 was set to 250 ° C., and the vibrating body 7 was fixed to the upper side of the nozzle 6 by screws using the same acoustic speaker as in Examples 1 to 6.

Using the apparatus of FIG. 2 and setting the atomizing time (ie, continuous manufacturing time) to 5 hours under the above-described conditions, solder balls are continuously manufactured, and sampling is performed every hour from the start to the end. The diameter of each sampled 200 solder balls was measured. The average and standard deviation are shown in Table 2 below, and the overall average and standard deviation are also shown in Table 2.

[0047]

[Table 2] [Confirmation] As can be seen from the results in Table 2, the average value of the whole was 761 μm, the standard deviation was 9 μm, and the nozzle discharge flow rate (g / min) was as follows. Examples 1, 2, and 6 having the same liquid level
Was equivalent to

The change in the diameter of the solder ball with time was small, and a solder ball having a substantially constant diameter was obtained over 5 hours.

Then, a product (solder ball) having a diameter of 760 ± 20 μm with respect to the manufactured solder ball was obtained with a yield of about 70%.

Embodiments 8 to 13 Using the manufacturing apparatus 20 having the structure shown in FIG. 3, the conditions shown in Table 3 below (frequency of vibration generated by the vibrating body, nozzle diameter μm, A solder ball was manufactured at a liquid level height of Hmm).
In addition, as in Examples 1 to 6, the composition of the solder was 63% tin.
(Weight) and lead 37% (weight), the oil used was soybean oil, and the temperature of the oil near the nozzle tip was 230 ° C.

An acoustic speaker is used as the vibration source 23, and a rod having an outer diameter of 2 mm is fixed to the cone of the speaker to form a vibration transmission rod (ie, a rod-shaped vibrating body) 21. The vibration source 23 is fixed to a member 22 different from the nozzle 6 so as to be located 3 mm above the discharge port of the molten solder 5 in the nozzle 6.

The diameter of each of the 200 solder balls obtained by using this manufacturing apparatus was measured. Table 3 shows the average value and the standard deviation. Table 3 also shows the nozzle discharge flow rate (g / min) set from the above conditions.

Comparative Examples 4 to 6 Solder balls were manufactured under the same conditions as in Examples 8 to 13 except for the conditions shown in Table 3 (ie, frequency Hz, nozzle diameter μm, liquid level height Hmm). That is, Comparative Example 4 does not impart vibration, and Comparative Example 5 has a frequency of 350 Hz which is out of the condition of the present invention.
In Comparative Example 6, the frequency is out of the range of the present invention.
Hz.

Then, 200 diameters of each of the obtained solder balls were measured. The average and standard deviation are also shown in Table 3.
Shown in

[0055]

[Table 3] [Confirmation] From the results shown in Table 3, the standard deviations of Examples 8 to 13 were all 15 μm or less, while Comparative Examples 4 to
In No. 6, all of them are 45 μm or more, confirming the superiority of the embodiment. In particular, in Comparative Example 4 in which no vibration was applied, the standard deviation was 128 μm, and Examples 8 to 13 and Comparative Examples 5 to 6
The results are significantly worse than

The diameters of the solder balls according to Examples 8 to 13 satisfied the above-mentioned relational expression (1).

[Embodiment 14] A production example using a mass production type production apparatus having the configuration shown in FIG. 4 will be described below.

The mass-production type manufacturing apparatus shown in FIG. 4 is different from the manufacturing apparatus 1 shown in FIG. 3 in that a molten solder supply tank 100 for supplying molten solder as a raw material is added to the nozzle 6. Cooling means 1 for forming a low-temperature region in oil on the lower side
The manufacturing apparatus 1 is the same as the manufacturing apparatus 1 shown in FIG. 3 except that a point 20 is added and a solder ball collecting tank 110 is added to the bottom side of the column 4.

The main part of the molten solder supply tank 100 is composed of a raw material melting tank 101 provided with a control valve 103 and a control tank 102 connected to the raw material melting tank 101 and having a liquid level sensor 104. ing.
In FIG. 4, reference numeral 111 denotes a second valve, 112 denotes a cover oil, and 113 denotes a waste oil pipe.

In this embodiment, the solder composition, the type of oil used, and the temperature thereof are the same as those in Examples 8 to 13,
The manufacturing conditions were a nozzle diameter of 400 μm, a liquid surface height of the molten solder of 100 mm, and a frequency of vibration of the vibrating body of 550 Hz. Further, the temperature of the molten solder supply tank 100 is set to 250 ° C., and the vibration source 23 and the rod-shaped vibrating body 21 are the same as those in Examples 8 to 13.

Then, using the apparatus of FIG. 4 and setting the atomizing time (ie, continuous manufacturing time) to 5 hours under the above-described conditions, solder balls are continuously manufactured, and sampling is performed every hour from the start to the end. The diameter of each sampled 200 solder balls was measured. The average and standard deviation are shown in Table 4 below, and the overall average and standard deviation are also shown in Table 4.

[0062]

[Table 4] [Confirmation] As can be seen from the results in Table 4, the overall average value was 762 μm, the standard deviation was 10 μm, and the nozzle discharge flow rate (g / min) was Examples 8 and 9 having the same liquid level
13 was equivalent.

The variation of the solder ball diameter with time was small, and a solder ball having a substantially constant diameter was obtained over 5 hours.

Then, a product (solder ball) having a diameter of 760 ± 20 μm with respect to the manufactured solder ball was obtained with a yield of about 70%.

[Embodiment 15] Using the manufacturing apparatus 30 having the configuration shown in FIG. 5, the following conditions (namely, the frequency of the vibration generated by the vibrating body 31 is 450 Hz to 950 Hz, the nozzle diameter is 0.4 mm, the liquid of the molten solder is A solder ball was manufactured with a surface height of 100 mm). As in Examples 1 to 6, the composition of the solder was 63% (by weight) of tin and 37% (by weight) of lead, the oil used was soybean oil, and the temperature of the oil near the nozzle tip was 230 ° C.
And

Then, as shown in FIG.
It was confirmed that solder balls having different diameters can be stably manufactured in the range of z to 950 Hz.

Note that the required solder ball diameter accuracy is 7
At 60 ± 20 μm, 90% of the balls were in this range in this example.

On the other hand, when no vibration was applied near the nozzle tip, the diameter distribution was 760 ± 20 μm.
Was less than 30% of the range.

[0069]

According to the method of manufacturing a solder ball according to the present invention, the molten solder discharged from the nozzle tip is subjected to a vibration having a frequency of 400 Hz or more and 1000 Hz or less. Since the liquid column is regularly divided at the added vibration frequency, the diameter of the obtained solder ball is unlikely to vary, and the generation of droplets when the liquid column is divided is also suppressed.

Therefore, there is an effect that it is possible to manufacture solder balls having a desired diameter with a high yield.

Also, in the solder ball manufacturing apparatus according to the fifth to eighth aspects of the present invention, since the vibrating body for applying vibration having a frequency of 400 Hz to 1000 Hz to the molten solder discharged from the nozzle tip is provided. Since the liquid column of the molten solder is regularly divided at the added vibration frequency, the diameter of the obtained solder ball is hardly varied, and the generation of droplets at the time of the division of the liquid column is suppressed.

Accordingly, there is an effect that a solder ball having a desired diameter can be manufactured with high yield.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a manufacturing apparatus according to a first embodiment (Examples 1 to 6).

FIG. 2 is a schematic configuration explanatory view of a manufacturing apparatus according to a seventh embodiment.

FIG. 3 is a schematic configuration diagram of a manufacturing apparatus according to a second embodiment (Examples 8 to 13).

FIG. 4 is a schematic diagram illustrating a configuration of a manufacturing apparatus according to a fourteenth embodiment.

FIG. 5 is a schematic configuration diagram of a manufacturing apparatus according to a third embodiment (Example 15).

FIG. 6 is a schematic configuration diagram illustrating a manufacturing apparatus according to a modification of the third embodiment.

FIG. 7 is a graph showing a relationship between a frequency and a ball diameter obtained in Example 15.

FIG. 8 is a partially cutaway schematic perspective view of a QFP (quad flat package).

FIG. 9 is a partially cutaway schematic perspective view of a BGA (ball grid array).

FIG. 10 is a schematic configuration explanatory view of a solder ball manufacturing apparatus according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball manufacturing apparatus 2 Oil 3 Heating means 4 Column (tube) 5 Melted solder 6 Nozzle 7 Vibrating body 8 Solder ball 10 Liquid column of molten solder

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yasukuni Imabayashi 1-6-1, Suehirocho, Ome-shi, Tokyo Sumitomo Metal Mining Co., Ltd. Electronic Business Unit F-term (reference) 4K017 AA04 BA01 BB01 CA01 DA01 EC04 FA25

Claims (8)

[Claims] 1. A molten solder is discharged from a nozzle tip whose tip side is immersed in an oil surface into oil heated to a temperature higher than the melting point of the solder, and the liquid column of the discharged molten solder is formed by soldering. Lowering the inside of the oil while breaking it in the high-temperature region inside the oil heated to the melting point or more, and solidifying the liquid ball of the separated solder in the low-temperature region inside the oil adjacent to the high-temperature region below the oil In the method of manufacturing a solder ball to be obtained, the molten solder discharged from the tip of the nozzle has a frequency of 40.
A method of manufacturing a solder ball, wherein a liquid column of a molten solder is divided while applying a vibration of 0 Hz or more and 1000 Hz or less. 2. A method for manufacturing a solder ball according to claim 1, wherein a vibrator is fixed to said nozzle and vibration is applied to said nozzle. 3. A method for manufacturing a solder ball according to claim 1, wherein a vibrator is arranged in the molten solder accommodated in the nozzle to apply vibration to the molten solder. 4. A method for manufacturing a solder ball according to claim 1, wherein a vibrating body is arranged in the oil to apply vibration to the oil. 5. A tubular body in which oil is contained and a heating means is provided in an upper part thereof, and a tubular body is disposed above the tubular body, and a tip side is immersed in an oil level of the tubular body and melted therein. A nozzle containing solder is provided, and the molten solder is discharged from the tip of the nozzle into the oil heated to the melting point of the solder or more, and the liquid column of the discharged molten solder is divided into the oil while the molten solder is in the oil. In a solder ball manufacturing apparatus for obtaining solder balls by descending downward, the molten solder discharged from the tip of the nozzle has a frequency of 40.
An apparatus for manufacturing a solder ball, comprising a vibrating body for applying a vibration of 0 Hz or more and 1000 Hz or less. 6. An apparatus for manufacturing a solder ball according to claim 5, wherein said vibrating body is arranged in a nozzle. 7. An apparatus for manufacturing a solder ball according to claim 5, wherein said vibrator is disposed in molten solder contained in a nozzle. 8. An apparatus for manufacturing a solder ball according to claim 5, wherein said vibrator is disposed in oil contained in a tube.