JPH1187420A - Coater and coating method of adhesive and mounting method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method for applying an adhesive such that a semiconductor bare chip is mounted with high reliability. SOLUTION: The coating method of adhesive comprises steps 90, 91 for applying an adhesive from a nozzle 83 to a semiconductor bare chip mounting region 20a on a board at two separated points P1 , P2 , and a step 92 for spreading the applied adhesive flatly in the semiconductor bare chip mounting region by reciprocating the nozzle, without supplying the adhesive, between the applying positions of adhesive close to the height of the board. A semiconductor bare chip is fixed temporarily and then mounted on the board by pressing while heating. According to the method, the adhesive may not sneak into the upper surface of the semiconductor bare chip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying method, an adhesive applying apparatus, and a semiconductor component mounting method.
The present invention relates to an adhesive applying method, an adhesive applying device, and a semiconductor component mounting method applied when a semiconductor bare chip is mounted on a substrate by a flip chip method of pressure bonding.

[0002] With the miniaturization of portable information devices, there has been a demand for higher density mounting of semiconductor devices on substrates. There is also a need to consider global environmental issues. Therefore, a technique for mounting a bare semiconductor chip, which is a bare chip that has not been packaged, by a flip-chip method of crimp bonding has been developed. Here, for convenience of description, the configuration of the semiconductor bare chip 10 and the structure of the semiconductor bare chip mounting module 30 on which the semiconductor bare chip 10 is mounted will be described.

As shown in FIG. 8A, a semiconductor bare chip 10 has stud bumps 13 formed on Al electrodes 12 on a lower surface 11a of a semiconductor bare chip body 11 cut out from a wafer. Stud bump 1
In this configuration, the conductive adhesive 14 is attached so as to cover the top of the third adhesive. The stud bump 13 is made of Au. The conductive adhesive 14 is an epoxy resin containing an Ag filler. The stud bump 13 and the conductive adhesive 14 do not contain lead.

[0004] The semiconductor bare chip 10 is
As shown in FIG. 8 (B), by applying pressure and heating to the printed circuit board 20 in which the thermosetting adhesive of epoxy is applied to the semiconductor bare chip mounting area 20a of FIG. Implemented. FIG. 8B shows a semiconductor bare chip mounting module 30 on which the semiconductor bare chip 10 of FIG. 8A is mounted. In the semiconductor bare chip 10, the stud bump 13 is pressed against the electrode 21 on the printed circuit board 20 and is bonded to the electrode 21 by the conductive adhesive 14, and the semiconductor bare chip body 11 is thermoset with thermosetting epoxy. The printed circuit board 11 is adhered and mounted by the agent 26.
The thermosetting adhesive 26 exists in the gap 27 between the semiconductor bare chip main body 11 and the printed circuit board 21 and is thermoset.
The entire surface 1a is adhered to the printed circuit board 20, and the entire lower surface 11a of the semiconductor bare chip main body 11 is drawn toward the printed circuit board 20 by the force F due to the thermosetting adhesive being thermally cured and contracting. With this force F,
The stud bumps 13 are pressed against the electrodes 21, and each stud bump 13 is electrically connected to the corresponding electrode 21. 26a is a fillet of the thermosetting adhesive 26, which is formed on the entire periphery of the semiconductor bare chip body 11.

[0005]

2. Description of the Related Art Conventionally, as shown in FIGS. 9A and 9B, a thermosetting adhesive is extruded from a nozzle 41 at the tip of a syringe 40 to form a semiconductor bare chip mounting area 20a of a printed circuit board 20. A predetermined amount was applied to the central portion as indicated by reference numeral 42, and in this state, the semiconductor bare chip was mounted while being pressed and heated. Specifically, as shown in FIG. 10, the semiconductor bare chip 10 is positioned at a predetermined position on the printed circuit board 20 to which the thermosetting adhesive 42 is applied by using the suction head 50 utilizing the suction of air. The semiconductor bare chip 1 to which the suction head 50 has been temporarily attached is mounted by mounting the suction head 50 lightly to temporarily attach the suction head 50, and gently blowing air from the suction head 50 and moving the suction head 50 upward.
0, the printed circuit board 20 to which the semiconductor bare chip 10 is temporarily attached is moved to another place, and the pressurizing and heating head 55 in which the pressurizing section 56 and the heater 57 are incorporated is attached to the temporarily attached semiconductor bare chip 10. It was mounted by pressing and heating for about 100 seconds.

The amount of the applied thermosetting adhesive 42 is an amount corresponding to the size of the semiconductor bare chip to be mounted. The entire lower surface of the semiconductor bare chip is adhered to the semiconductor bare chip. Fillet 26a
Is sufficient to form Here, the viscosity of the thermosetting adhesive is generally high. Therefore, the applied thermosetting adhesive 42 is applied to the printed circuit board 2 as shown in FIG.
The height h1 is as high as about 0.3 mm.

[0007]

Since the applied thermosetting adhesive 42 is concentrated at one location, the semiconductor bare chip 10 is positioned and mounted by using the suction head 50, and is temporarily pressed and lightly pressed. In the attached state, as shown in FIG. 9C, the thermosetting adhesive 42 largely protrudes from the semiconductor bare chip 10 at a part of the outer periphery of the semiconductor bare chip 10 and a part of the thermosetting adhesive 42 goes around the upper surface of the semiconductor bare chip 10. In some cases, sticking to the suction head 50 may occur as indicated by reference numeral 43. When the thermosetting adhesive 41 wrapped around the upper surface of the semiconductor bare chip 10 adheres to the suction head 50, when the suction head 50 separates from the semiconductor bare chip 10, the semiconductor bare chip 10 is dragged to the suction head 50 and temporarily attached. The stud bumps 13 are displaced from each other, and the stud bumps 13 are detached from the electrodes 21 and are mounted in an incomplete electrical connection state, which may cause a mounting failure.

At present, as the density of integrated circuits formed in a semiconductor bare chip has increased, the size of the semiconductor bare chip has been reduced from the conventional 20 mm square to several mm square, and the thickness of the semiconductor bare chip has been reduced accordingly. Conventional 1
It is getting thinner from 2 mm to 0.5 mm. As the size of the semiconductor bare chip has been reduced, the reference application amount of the thermosetting adhesive has been reduced, the amount of allowable variation in the applied amount has been reduced, and the thickness of the semiconductor bare chip has been reduced to 0.5 mm. As a result, the thermosetting adhesive tends to flow around the upper surface of the semiconductor bare chip. Therefore, measures have been required to make it difficult for the thermosetting adhesive to reach the upper surface of the semiconductor bare chip.

Accordingly, an object of the present invention is to provide an adhesive applying method, an adhesive applying apparatus, and a semiconductor component mounting method that solve the above-mentioned problems.

[0010]

According to a first aspect of the present invention, an adhesive is ejected from a nozzle and applied to a plurality of distant locations within a region where an object to be adhered on a substrate is to be adhered. Thereafter, the nozzle is moved between the applied adhesives so that the applied adhesive is flattened in the area where the object is to be bonded.

[0011] By flattening, compared to the case where stretching is not performed, the protrusion to the outer periphery of the adhered body occurs uniformly over the entire outer periphery. According to a second aspect of the present invention, the adhesive is ejected from the nozzle and applied to a portion of the substrate in a region where the object is to be bonded, and then the applied adhesive is blown with gas to spread the adhesive flat. It is.

By blowing gas, the adhesive can be spread and flattened without moving the nozzle complicatedly. The invention according to claim 3 is that, after the operation of taking out the adhesive from the nozzle and applying the adhesive to a plurality of distant locations in the region to be bonded on the substrate, the applied adhesive is flattened in the region to be bonded. And means for moving the nozzle between the applied adhesives so as to extend the nozzle.

By providing means for moving the nozzle between the applied adhesives, no special equipment is required,
The adhesive can be stretched and flattened. According to a fourth aspect of the present invention, a gas blowing nozzle for blowing a gas is provided adjacent to a nozzle for discharging the adhesive so as to spread the adhesive applied by the nozzle evenly.

By providing the gas blowing nozzle,
The adhesive can be spread and flattened without moving the nozzle complicatedly. According to a fifth aspect of the present invention, a semiconductor component is mounted using an adhesive applied by the adhesive applying method according to any one of the first and second aspects.

As compared with the case where the applied thermosetting adhesive is not stretched, the protrusion of the adhesive to the outer periphery of the semiconductor component occurs more uniformly over the entire outer periphery,
Many will not protrude in a particular place.

[0016]

FIG. 1A shows a thermosetting adhesive application device 60 applied to a method for mounting a semiconductor bare chip according to an embodiment of the present invention. The thermosetting adhesive application device 60 generally includes an XY robot 61, an adhesive application head 62 shown in FIG.
It has a control circuit 70 and drive circuits 71 to 74.

The XY robot 61 has an X arm 65 and a Y
An arm 66, an X-direction drive cylinder 67 for moving the Y arm 66 along the X arm 65, and a Y-direction drive cylinder 68 for moving the Z-direction drive cylinder 63 along the Y arm 66. The Z-direction drive cylinder 63 is supported by the Y arm 66, and as shown in FIG.
An adhesive application head 62 is supported by a Z-direction drive cylinder 63.

When the X drive circuit 71 and the Y drive circuit 72 are operated by a control signal from the control circuit 70, the X drive cylinder 67 and the Y drive cylinder 6 are driven.
8, the XY robot 61 operates to move the adhesive application head 62 in the XY directions. When the Z drive circuit 73 is operated by a control signal from the control circuit 70, the Z direction drive cylinder 63 is operated, and the adhesive coating head 62 is moved in the Z direction.

The adhesive application head 62 has a syringe support mechanism 80 fixed to a rod 63a of a Z-direction drive cylinder 63, and a syringe 82 containing a thermosetting adhesive 81 in the syringe support mechanism 80. Nozzle 83 at the tip
Is mounted in a vertical orientation facing down, and the syringe 8
The upper end of 2 is connected to a dispenser 85 by a tube 84. When the dispenser driving circuit 74 is operated by the control signal from the control circuit 70, the dispenser 85 is operated, and the compressed air of a predetermined pressure is sent out at a predetermined timing for a predetermined time, and the thermosetting adhesive 81 is supplied to the nozzle 83. Extrude from The cross section of the nozzle 83 is circular, the outer diameter is 0.9 mm, and the inner diameter is 0.5 m
m.

The control circuit 70 is constituted by a microcomputer. When the printed circuit board 20 is moved by the conveyor 88 and it is confirmed that the printed circuit board 20 is fixed at the thermosetting adhesive application position, the control circuit 7
0 operates as programmed, the XY robot 61 operates to move the nozzle 83 at the tip of the syringe 82 to the thermosetting adhesive application position, and thereafter, the Z-direction drive cylinder 67 and the Y-direction drive cylinder 68 are operated in a predetermined order, and the nozzle 83 is turned on in FIGS. 2 (A) and 2 (B).
The dispenser 85 moves as shown by trajectories (1) to (8), and operates at predetermined time points (time) T1 and T2.

The thermosetting adhesive application device 60 generally applies the thermosetting adhesive at two separate places, and then reciprocates with the nozzle 83 lowered to extend the thermosetting adhesive. It works to make it flat. Here, FIG.
The operation of applying the thermosetting adhesive will be described in detail with reference to (A) to (I). FIG. 3A shows the steps of a thermosetting adhesive application operation.

First, a first point application step 90 is performed. Here, as shown by the locus (1), the nozzle 83 descends to the first position P1 near the end in the Y1 direction in the semiconductor bare chip mounting area 20a of the printed board 20, and the nozzle 83 is lowered close to the printed board 20. The height H1 is reached and stops at this low height H1. When the nozzle 83 descends and reaches the low height H1, the dispenser 85 operates to send out compressed air of a predetermined pressure for a predetermined time, and the thermosetting adhesive 81
From the nozzle 83. As a result, FIG.
As shown in (B) and (C), half the amount V / 2 of the thermosetting adhesive 1 which is half the amount V required for mounting the semiconductor bare chip 10.
00 is applied in a mountain-like manner to the first location P1. Thereafter, the nozzle 83 rises as shown by a locus (2), and reaches a high height H2 apart from the printed circuit board 20.

Next, a second point application step 91 is performed. Here, first, as shown by a locus (3), the nozzle 83
It moves in two directions, then descends as shown by a locus (4), and has a low height above a second location P2 near the end in the Y2 direction within the semiconductor bare chip mounting area 20a of the printed circuit board 20 H1 is reached and stops at this low height H1. When the nozzle 83 descends and reaches the low height H1, the dispenser 85 operates to send out compressed air of a predetermined pressure in the same manner as described above for a predetermined time, thereby pushing out the thermosetting adhesive 81 from the nozzle 83. As a result, as shown in FIG.
As shown in (E), the amount V / 2 of the thermosetting adhesive 101, which is half the amount V required for mounting the semiconductor bare chip 10, is applied to the second portion P2 in a mountain shape.

Next, a stretching step 92 is performed. Here, the nozzle 83 moves to P1 in the Y1 direction as shown by the locus (5) while keeping the low height H1, and then moves to P2 in the Y2 direction as shown by the locus (6), and returns.
Next, as shown by the trajectory (7), it again moves to P1 in the Y1 direction. The nozzle 83 remains at the low height H1 while the P2-
Reciprocate between P1. The nozzle 83 moves while pulling the thermosetting adhesive attached to the tip. When moving in the Y1 direction, as indicated by reference numeral 102 in FIG.
The thermosetting adhesive 101 at the location P2 is moved while being stretched in the Y1 direction, and the thermosetting adhesive 101 at the location P2 is stretched in the Y1 direction. When moving in the Y2 direction, the thermosetting adhesive 100 at the location P1 is moved while being stretched in the Y2 direction, and the thermosetting adhesive 100 at the location P1 is stretched in the Y2 direction. As a result, as shown in FIGS. 3F and 3G, the peak-shaped thermosetting adhesive 100 at the point P1 and the peak-shaped thermosetting adhesive 101 at the point P2 are P2-P1. It is spread between and flattened.

Finally, an ascending step 93 is performed. here,
The nozzle 83 rises as shown by a locus (8) and
As shown in (F) and (G), the height reaches a high height H2. When the nozzle 83 rises, the thermosetting adhesive is cut off from the nozzle 83. In this state, as shown by reference numeral 103, the thermosetting adhesive 100 has a mountain-shaped thermosetting adhesive 100 at the point P1.
And the mountain-shaped thermosetting adhesive 101 at the point P2 are stretched and spread between P2 and P1, and are flattened. The height h2 of the thermosetting adhesive 103 is reduced to half of the height h1 of the mountain-shaped thermosetting adhesives 100 and 101,
0.15 mm.

Although the thermosetting adhesive can be spread well by the nozzle 83 reciprocating between P2 and P1 while maintaining the low height H1, in some cases,
The nozzle 83 may move to one side between P2 and P1 while keeping the low height H1. Semiconductor bare chip 10
Are implemented as shown in FIG. That is, first, the thermosetting adhesive 103 flattened by the above-described method is applied to the semiconductor bare chip mounting area 20a of the printed circuit board 20, and then the suction head 50 using the suction of air is used. The semiconductor bare chip 10 is positioned and mounted on a predetermined portion of the printed circuit board 20 to which the thermosetting adhesive 42 has been applied, and is lightly pressed to temporarily attach the semiconductor bare chip 10 to the suction head 50.
Is moved upward to separate the suction head 50 from the temporarily attached semiconductor bare chip 10, and then the semiconductor bare chip 10
Is moved to another place, and the pressurizing and heating head 55 in which the pressurizing section 56 and the heater 57 are incorporated is temporarily mounted on the semiconductor bare chip 1.
It is implemented by pressing against zero for about 100 seconds, pressing and heating.

Since the thermosetting adhesive 103 is flattened, the protrusion of the thermosetting adhesive to the outer periphery of the semiconductor bare chip 10 at the time of temporary attachment is uniform over the entire outer periphery of the semiconductor bare chip 10. As a result, a large amount of the thermosetting adhesive does not protrude at a specific place as in the related art, and thus the protruding thermosetting adhesive flows around the upper surface of the semiconductor bare chip 10 as shown in FIG. It doesn't happen. Therefore, the suction head 50 smoothly separates from the semiconductor bare chip 10 and the semiconductor bare chip 1
The position where the temporary attachment of 0 is shifted does not occur. That is, the semiconductor bare chip 10 is temporarily attached with high positional accuracy. Therefore, the stud bumps 13 may be displaced due to misalignment during the temporary attachment.
Of the semiconductor bare chip mounted module can be manufactured with higher yield than before, and the reliability of the manufactured semiconductor bare chip mounted module can be improved. I can do it.

Further, the protrusion of the thermosetting adhesive to the outer periphery of the semiconductor bare chip 10 at the time of temporary attachment is uniform over the entire outer periphery of the semiconductor bare chip 10, so that the thermosetting adhesive is thermally cured in a state after mounting. The fillet of the thermosetting adhesive (see FIG. 8B) is formed uniformly over the entire outer periphery of the semiconductor bare chip 10. Next, a modified example of the nozzle 83 will be described.

The nozzle 83A of FIG. 5A has a rectangular cross section. The nozzle 83A is used with its long side 120 oriented at right angles to the Y direction. By using the nozzle 83A in the above orientation, the thermosetting adhesive can be spread over a wider area as compared with the case where a cylindrical nozzle is used, as indicated by reference numeral 103A in FIG. 5B. It is flattened and spread.

Next, another thermosetting adhesive application apparatus applied to the semiconductor bare chip mounting method of the present invention will be described. As shown in FIG. 6 (A), the thermosetting adhesive application device 60A generally includes an XY robot 61,
(B), an adhesive application head 62A, a Z-direction drive cylinder 63, a control circuit 70A, and drive circuits 71 to 7
And 5.

In the adhesive application head 62A, the air blowing nozzles 130 and 131 have the syringe 82 at the tip of the nozzle 8
3 are provided on both sides in an oblique direction. A compressed air source 132 is connected to the air blowing nozzles 130 and 131 through a tube 133. An electromagnetic valve 134 is provided in the middle of the tube 133. The printed circuit board 20 is moved by the conveyor 88 and the printed circuit board 2 is moved.
When it is confirmed that 0 is fixed at the thermosetting adhesive application position, the control circuit 70A constituted by a microcomputer operates as programmed, and the XY robot 61 operates to operate the syringe 82. Nozzle 83 at the tip
Is moved to the thermosetting adhesive application position.

Thereafter, the Z drive circuit 73 is operated by the control signal from the control circuit 70A, whereby the Z direction drive cylinder 63 is operated, and the adhesive application head 62 is operated.
Descends in the Z2 direction and approaches the printed circuit board 20. Next, the dispenser driving circuit 74 is operated by a control signal from the control circuit 70, whereby the dispenser 85 is operated, and compressed air at a predetermined pressure is sent out at a predetermined timing for a predetermined time, and the thermosetting adhesive 81 is discharged. Push out from the nozzle 83. As a result, as shown in FIG. 7A, a predetermined amount of the thermosetting adhesive 140 is applied in a mountain shape. Next, the electromagnetic valve driving circuit 75 is operated by a control signal from the control circuit 70, whereby the electromagnetic valve 134 is opened and kept open for a predetermined time. When the electromagnetic valve 134 is opened, FIG.
As shown in the figure, the compressed air from the compressed air source 132 blows out from the air blowing nozzles 130 and 131, and the compressed air 135 blown out from the air blowing nozzles 130 and 131.
136 is obliquely sprayed onto the mountain-shaped thermosetting adhesive 140, and the mountain-shaped thermosetting adhesive 140 spreads on both sides.

The compressed air 135 and 136 from the air blowing nozzles 130 and 131 are used to form a mountain-like thermosetting adhesive 140.
7B, the thermosetting adhesive is flattened as indicated by reference numeral 141 in FIG. 7C. After this, the semiconductor bare chip 10
It is implemented as shown in FIG. Further, a gas other than air may be blown from the air blow nozzles 130 and 131.

The components mounted by using the adhesive applied as described above are not limited to the above-described semiconductor bare chip 10, but may be a semiconductor bare chip having no bumps and a resin-sealed semiconductor component. A semiconductor bare chip and a resin-sealed semiconductor component are collectively called a semiconductor component. The adhesive to be applied is not limited to a thermosetting adhesive.

[0035]

As described above, according to the first aspect of the present invention, the adhesive is discharged from the nozzle and applied to a plurality of distant portions in the area where the object is to be bonded on the substrate. Because the applied adhesive is moved between the applied adhesives so that the applied adhesive is flatly stretched in the area where the object is to be bonded, compared to the case where the stretching is not performed, the outer circumference of the object to be bonded is Extrusion can be made to occur uniformly over the entire outer circumference, and it protrudes much at a specific place. As a result, there is a portion of the back surface of the adherend where the adhesive does not spread, or the adhesive is It is possible to prevent the inconvenience of wrapping around the upper surface of the adherend.

According to the second aspect of the present invention, the adhesive is discharged from the nozzle and applied to a portion of the substrate in the area where the object is to be bonded, and then the applied adhesive is blown with a gas to flatten the adhesive. Since the nozzle is spread, the adhesive can be spread and flattened without moving the nozzle complicatedly. Claim 3
According to the invention of the above, after the operation of taking out the adhesive from the nozzle and applying it to a plurality of distant locations in the area to be bonded on the substrate on the substrate, the applied adhesive is flattened in the area to be bonded. Because the nozzle has a means for reciprocating between the applied adhesive so as to extend,
The adhesive can be stretched and flattened without any special equipment.

According to the fourth aspect of the present invention, a gas blowing nozzle for blowing a gas is provided adjacent to the nozzle for discharging the adhesive so as to spread the adhesive applied by the nozzle evenly. The adhesive can be spread and flattened without moving the nozzle complicatedly. Claim 5
According to the invention, the semiconductor component is mounted by using the adhesive applied by the adhesive applying method according to any one of claims 1 and 2, so that the applied adhesive is applied. As compared with the case where the stretching is not performed, the protrusion of the thermosetting adhesive to the outer periphery of the semiconductor component can be caused to occur uniformly over the entire outer periphery, and a large amount protrudes at a specific place, As a result, there is a portion of the back surface of the semiconductor component where the adhesive does not spread, or the adhesive wraps around the upper surface of the semiconductor component and attaches to the suction head for temporary attachment, when the suction head is separated from the semiconductor component, The components may be dragged by the suction head and the temporarily attached position may shift, resulting in inconvenience such as loss of reliability or, in some cases, loss of electrical connection and poor mounting. It can be stopped.

[Brief description of the drawings]

FIG. 1 is a diagram showing one thermosetting adhesive application device applied to a semiconductor bare chip mounting method according to one embodiment of the present invention.

FIG. 2 is a diagram showing a trajectory of a nozzle tip when a thermosetting adhesive is applied.

FIG. 3 is a diagram illustrating application of a thermosetting adhesive.

FIG. 4 is a diagram showing a method for mounting a semiconductor bare chip according to one embodiment of the present invention.

FIG. 5 is a view showing a modified example of a nozzle.

FIG. 6 is a diagram showing another thermosetting adhesive application device applied to the semiconductor bare chip mounting method according to one embodiment of the present invention.

FIG. 7 is a diagram showing a state where the applied thermosetting adhesive is spread and flattened.

FIG. 8 is a diagram showing a semiconductor bare chip and a semiconductor bare chip mounting module.

FIG. 9 is a view showing the application of a conventional thermosetting adhesive.

FIG. 10 is a diagram showing a conventional semiconductor bare chip mounting method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Semiconductor bare chip 13 Stud bump 20 Printed circuit board 21 Electrode 30 Semiconductor bare chip mounting module 50 Suction head 55 Pressure heating head 60, 60A Thermosetting adhesive coating device 61 XY robot 62, 62A Adhesive coating head 70, 70A Control circuit 71 -75 Drive circuit 82 Syringe 83, 83A nozzle 85 Dispenser 90 First point application step 91 Second point application step 92 Stretching step 103, 103A, 141 Flattened thermosetting adhesive 130, 131 Air blowing nozzle

Continued on the front page. (72) Inventor Norio Kainuma 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Naoki Ishikawa 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Tetsu Emoto 4-1-1 Kamikadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Limited

Claims (5)

[Claims] An adhesive is ejected from a nozzle and is applied to a plurality of distant locations within a region where an object to be adhered on a substrate is to be bonded, and then the nozzle is moved by moving the adhesive between the applied adhesives. An adhesive applying method, wherein the adhesive is flattened in a region where the object is to be bonded. 2. The method according to claim 1, wherein the adhesive is discharged from the nozzle and applied to a portion of the substrate in a region where the object is to be bonded, and thereafter the applied adhesive is blown with a gas to spread the adhesive flat. Adhesive application method. 3. An operation of taking out an adhesive from a nozzle and applying the adhesive to a plurality of distant places in a region to be bonded on a substrate, and then spreading the applied adhesive flat in the region to be bonded. The adhesive coating apparatus is provided with means for moving the nozzle between the applied adhesives as described above. 4. Adhesive coating characterized in that a gas blowing nozzle for blowing gas is provided adjacent to a nozzle for discharging the adhesive so as to spread the adhesive applied by the nozzle evenly. apparatus. 5. A method for mounting a semiconductor component using an adhesive applied by the method for applying an adhesive according to claim 1.