JPH01143291A - Equipment for applying conductive paste to electronic parts - Google Patents

Abstract

PURPOSE:To make it possible to apply a proper amount of conductive paste accurately to a mounting section of an electronic part only and to improve properties of junction and adherence between electronic parts by composing paste application equipment so that conductive paste splashed from a paste filling hole may attach to a paste application section of an electronic part which is arranged with clearance on a thin board whereon a number of paste filling holes are provided. CONSTITUTION:A number of air discharge openings 12 are provided on a surface of a base 11 to discharge operating gas such as air. On the base 11, a thin board 15 having a number of paste filling holes 14 are mounted and fixed, which are filled with conductive paste 16. The thin board 15 is arranged on the base 11 so that the hole pitch of the paste filling hole 14 matches that of the air discharge hole 12. An IC chip 17 of flip chip type is located above the thin board 15. The pitch of the air discharge hole 12 and the paste filling hole 14 is set to the same as that of a bump 18 of the IC chip 17.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a conductive paste application device for applying conductive paste to a mounting portion of an electronic component.

(Conventional technology) In recent years, mounting technology for electronic components has become more and more popular, as the demand for lower cost and improved reliability of products has increased, and the superiority or inferiority of mounting technology has a significant impact on product cost and reliability. It is important to establish efficient mounting technology.

For example, in IC chip mounting technology, mounting using paired chips (bare chips) is performed in order to reduce the cost of products and improve reliability.

In such pair chip mounting technology, a major focus of the mounting technology is the connection method between the electrodes of the chip and the wiring pattern formed on the substrate.

By the way, there are various mounting techniques for this electronic component, but for example, as a mounting technique for bare IC chips, etc., the electrical part of the chip and the electrode pads of the wiring pattern on the board are connected one by one using bonding wires. Wire bonding technology is widely contradicted by the public.

However, with the recent increase in the integration of electronic components, IC
As the number of electrodes in chips has increased significantly and the number of electrodes with narrower pitches has increased, the wire bonding technology described above requires an extremely large number of bonding steps, making it difficult to improve production efficiency. It was difficult to plan.

Therefore, in order to solve this problem, Figures 4 and 5
As shown in the figure, a flip-chimp mounting technique using a bumped IC chip in which bumps are formed on the electrode portions has been put into practical use.

The mounting technology shown in FIG.
IC chips with protruding electrodes called bumped ICs (bumped ICs)
), on the other hand, electrode portions (hereinafter referred to as lead fingers) 4 are provided protruding from the wiring pattern on the side of the substrate, for example, the flexible substrate 3, and after aligning the bumps 2 of the IC chip 1 and the lead fingers 4, they are heated. This is a technology that uses bonding, conductive adhesive, etc.

The mounting technique shown in FIG. 5 is a chip-on-glass mounting technique in which the bumped ICI is bonded to a predetermined position of an electrode pattern 6 formed of a thin film on a glass base 5. be.

(Problems to be Solved by the Invention) In the above-mentioned T A B method and chip-on-glass method mounting technology, since there are variations in the height of the bumps formed on the IC chip, it is difficult to bond with the substrate.・In order to improve adhesion, it is common to bond by sandwiching a conductive paste between the bump and the electrode part on the substrate.
Due to the narrower pitch and smaller size of IC leads in recent years, there has been a problem in that it is very difficult to apply a fixed amount of conductive paste only to the bumps.

In addition, when mounting chip components on a circuit board for mounting other than ICs, when applying conductive paste such as solder paste to the electrodes of chip electronic components on the circuit board, solder paste is applied one point at a time using a dispenser. There are methods of coating or screen printing, but the former method has the problem of decreasing productivity.
In the latter case, there was a problem in that the paste did not adhere stably to the circuit board side.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to accurately apply a predetermined amount of conductive paste only to the mounting area of electronic components, thereby significantly improving the bonding and adhesion of electronic components. An object of the present invention is to provide a conductive base 1-coating device for electronic components that is capable of coating a conductive base 1 for electronic components.

[Structure of the Invention] (Means for Solving the Problems) A conductive paste coating device for electronic components according to the present invention is a device for applying conductive paste to a bonded portion of electronic components when the electronic components are electrically bonded to each other. , a thin plate having a large number of paste filling holes for filling the conductive paste, a means for flying the conductive paste filled in the paste filling holes, and a thin plate arranged on the thin plate with a gap therebetween. The present invention is characterized in that the conductive paste that has flown from the paste filling hole adheres to a portion of the electronic component to which the conductive paste is to be applied.

(Function) The conductive paste filled in the paste filling hole of the thin plate is
By making it fly and attaching it to the part to be treated, it is possible to reliably attach an appropriate amount of the conductive paste.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing the configuration of a conductive paste application device according to an embodiment, in which a large number of air discharge holes 12 are formed on the surface of a base 11 for discharging a working gas such as air. Air supply pipe 1 inside the base 11 from an air supply device (not shown), such as a compressor, etc.
The structure is such that the air guided through the tube 3 is discharged.

A thin plate 15 having a large number of paste filling holes 14 is placed and fixed on the base 11, and the paste filling holes 14 are filled with a conductive paste 16. The thin plate 15 is arranged on the base 11 so that the pitch of the paste filling holes 14 and the pitch of the air discharge holes 12 match.

Above the thin plate 15 is a flip-chip type IC chip 1.
7 are arranged, and the pitch of the air discharge holes 12 and the paste filling holes 14 is the same as that of the bumps 1 of the IC chip 17.
It is set to the same pitch as No. 8.

By the way, as a method of filling the conductive paste into the paste filling holes 14 formed in a thin plate, for example, as shown in FIG. The conductive paste 16 may be dropped onto the surface of the conductive paste 16 (Fig. 2(a)) and stretched with a squeegee 19 or the like to fill the paste filling hole 14 with the conductive paste 16 (Fig. 2(b)). When filling the paste, it is important that the conductive paste 16 does not go around the back side of the thin plate 15. For example, the thin plate 15 is tightly attached to a support (not shown) with a smooth surface using a magnet or vacuum suction. Preferably, paste filling is performed.

A method of applying a conductive paste using the apparatus of the above embodiment will be described below.

First, a thin plate 15 whose paste filling holes 14 are filled with conductive paste 16 is placed on the base 11, and an IC chip 17 is placed above the thin plate 15.

At this time, the air discharge hole 12, paste filling hole 14, and bump 18 are aligned so that they are in the same position, but these alignments are performed using conventionally used techniques such as image recognition using an ITV camera. It can be done easily.

After completing the positioning work in this way, the air discharge hole 12
The conductive paste 16 filled in the paste filling hole 14 is caused to fly and adhere to the bump 18 by ejecting air in a pulsed manner, for example. At this time, it is better that the relationship between the thin plate thickness t1 and the distance t2 from the thin plate surface to the bump is t<t2! ! It is a theory.

Further, the close contact between the base 11 and the thin plate 15 is
It may be made of a magnetically permeable material and fixed by a magnet, or it may be fixed by suction using a vacuum.

In the above-mentioned embodiment device, an example was explained in which a conductive paste is attached to the bump of an IC chip, but the present invention is not limited to this. The apparatus of the present invention can also be used when attaching a conductive paste to.

Furthermore, the present invention is not limited to mounting IC chips, but can also be used in bonding work between substrates.

FIG. 5 is a diagram illustrating an example of bonding substrates of a liquid crystal display device as bonding of such substrates, in which a glass substrate 22 on which such a multi-electrode pattern 21 is formed and 4S poles are formed at the same pitch. When connecting the flexible circuit boards 23 by overlapping them, it is desirable to apply a conductive paste to the joint part and join them.If the device of the present invention is used in such a case, it is easy to make the conductive paste. It is possible to apply paste and improve productivity.

As described above, if the present invention is used for bonding work of various circuit boards, it is possible to attach an appropriate amount of paste to a predetermined position of a circuit board, and by flying the conductive paste and attaching it, kinetic energy is transferred to the paste. As a result, the adhesion becomes strong and stable quality can be obtained.

In this embodiment, the conductive paste is ejected by air pressure, but the present invention is not limited to this. For example, the conductive paste may be ejected by rapidly vibrating the thin plate.

Note that various conductive pastes such as solder paste and silver paste can be used as the conductive paste to which the present invention is applied.

[Effects of the Invention] As explained above, according to the electrically conductive paste coating device for electronic components of the present invention, it is possible to accurately coat MA electrically conductive paste only on the mounting portion of the electronic component, and It is possible to significantly improve the bonding and adhesion between the two.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of a conductive paste application apparatus for electronic components according to an embodiment, FIG. 2 is a diagram showing an example of a method for filling the paste filling hole of the thin plate shown in FIG.
The figure is a diagram illustrating the bonding of circuit boards used in liquid crystal display devices, and Figure 4 is a diagram illustrating the conventional TAB method mounting technology.
FIG. 5 is a diagram showing a conventional chip-on-glass mounting technique. 11...Base base 12...Air discharge hole 14...Paste filling hole 15...
... Thin plate 16 ... Conductive paste 17 ...
...IC chip 18 ...Bump applicant Toshiba Corporation Representative Patent attorney Sasu Suyama −

Claims (3)

[Claims] (1) An apparatus for applying a conductive paste to the joint portion of the electronic components during electrical bonding of the electronic components, comprising: a thin plate having a large number of paste filling holes for filling the conductive paste; A means for causing the conductive paste filled in the hole to fly, and the conductive paste that has flown from the paste filling hole adheres to a part to be coated with the conductive paste of an electronic component arranged with a gap maintained on the thin plate. A conductive paste coating device for electronic components, characterized in that it is configured as follows. (2) The means for making the conductive paste fly includes a base on which the thin plate is placed, a number of working gas discharge holes formed on the surface of the base for discharging a working gas, and a working gas discharge hole for discharging a working gas. Claim 1, further comprising a working gas supply section that supplies working gas to the discharge hole.
A conductive paste coating device for electronic components as described in 1. (3) Make sure that the hole pitch of the paste filling holes drilled in the thin plate and the working gas discharge holes on the surface of the base are formed at the same pitch as the part to be coated with the conductive paste of the electronic component. A conductive paste coating apparatus for electronic components according to claim 1 or 2.