JPH0274041A - Formation of electrode of electronic component - Google Patents
Formation of electrode of electronic componentInfo
- Publication number
- JPH0274041A JPH0274041A JP22598288A JP22598288A JPH0274041A JP H0274041 A JPH0274041 A JP H0274041A JP 22598288 A JP22598288 A JP 22598288A JP 22598288 A JP22598288 A JP 22598288A JP H0274041 A JPH0274041 A JP H0274041A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- electrode
- electronic component
- screen printing
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title claims abstract 3
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000007650 screen-printing Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、ＬＳＩなどの電子部品の電極形成方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for forming electrodes of electronic components such as LSIs.
（従来の技術）
液晶表示装置、感熱印字ヘッド、ハイブリッドＩＣ，Ｉ
Ｃカードなどの実装方法として、フェースダウンボンデ
ィングがある。このフェースダウンボンデインクでは゛
、あらかじめ電子部品の出入力電極部にバンプを形成し
てあき、このバンプを印刷配線板などの外部回路に熱圧
着することよによりおこなわれる。特に電子部品の電極
部の表面がアルミニウムでおる場合は、そのバンプを導
電性ペーストで形成することが効果的でおる。(Prior technology) Liquid crystal display device, thermal print head, hybrid IC, I
Face-down bonding is a mounting method for C cards and the like. This face-down bonding ink is carried out by forming bumps in advance on the input/output electrode portions of electronic components, and then bonding the bumps by thermocompression to an external circuit such as a printed wiring board. Particularly when the surface of the electrode portion of an electronic component is made of aluminum, it is effective to form the bump with a conductive paste.
本出願人に係る特願昭６２−３２８７７５４号には、上
記電子部品の出入力電極部にスクリーン印刷により導電
性ペーストを塗布してバンプを形成する方法が示されて
いる。Japanese Patent Application No. 62-3287754 filed by the present applicant discloses a method of forming bumps by applying a conductive paste to the input/output electrode portions of the electronic component by screen printing.
しかし、スクリーン印刷により導電性ペーストを塗布す
る方法では、導電性ペーストの粘度や印刷条件によって
、第４図に示すように、塗布された導電性ペースト（１
）の面積が電極部（２）より大きく、その外側にはみだ
すことがおる。このように導電性ペースト（１）がはみ
だして塗布されると、第５図に示すように、フェースダ
ウンボンディングによりこの塗布された導電性ペースト
（１）に外部回路（３）を接続するとき、その熱圧着に
より導電性ペースト（１）がさらに広がって短絡する危
険がある。However, in the method of applying conductive paste by screen printing, depending on the viscosity of the conductive paste and printing conditions, the applied conductive paste (1
) is larger than the electrode part (2) and may protrude outside of it. When the conductive paste (1) is applied so as to protrude in this way, as shown in FIG. 5, when connecting the external circuit (3) to the applied conductive paste (1) by face-down bonding, as shown in FIG. There is a risk that the conductive paste (1) will further spread due to the thermocompression bonding and cause a short circuit.
この短絡の最大原因は、最初の導電性ペースト（１）の
塗イＦ面積の大きさにおり、フェースダウンボンディン
グにより信頼性の高い接続をおこなうためには、その塗
布面積を最適に制御することが重要でおるが、上記特願
昭６２−３２８７７５４号では、まだ十分にその塗布面
積の制御が解決されていない。The main cause of this short circuit is the size of the area where the first conductive paste (1) is applied, and in order to make a reliable connection by face-down bonding, it is necessary to optimally control the application area. However, in the above-mentioned Japanese Patent Application No. 62-3287754, the control of the coating area has not yet been sufficiently solved.
（発明が解決しようとする課題）
上記のように、フェースダウンボンディングにより電子
部品の出入力電極部を外部回路に接続するときは、その
電極部にバンプを形成するが、このバンプを導電性ペー
ストで形成する従来方法は、導電性ペーストの塗布面積
を最適に制御する点で十分でなく、フェースダウンボン
ディングによる熱圧着時に、電極部上に塗布された導電
ペーストが広がって短絡をおこす危険があった。(Problem to be Solved by the Invention) As mentioned above, when connecting the input/output electrode part of an electronic component to an external circuit by face-down bonding, a bump is formed on the electrode part. The conventional method of forming conductive paste is not sufficient in terms of optimally controlling the application area of the conductive paste, and there is a risk that the conductive paste applied to the electrode part will spread and cause a short circuit during thermocompression bonding by face-down bonding. Ta.
この発明は、上記問題点に鑑みてなされたものであり、
フェースダウンボンディングによる熱圧着時に、短絡を
おこさない信頼性の高い電極を形成することを目的とす
る。This invention was made in view of the above problems, and
The purpose is to form highly reliable electrodes that do not cause short circuits during thermocompression bonding using face-down bonding.
［発明の溝成］
（課題を解決するための手段）
電子部品の電極形成方法において、電子部品の電極部に
対応する６０孔が形成されたスクリーン版を電子部品の
電極部形成面に密着して、スクリーン印刷により電極部
に導電性ペーストをその電極部の１７２以下の面積に塗
布し、上記スクリーン版を引離すとき、導電性ペースト
の粘性に基づいて上記電極部に塗イ「された導電性ペー
ストを円錐状に形成するようにした。[Means of the invention] (Means for solving the problem) In a method for forming an electrode of an electronic component, a screen plate in which 60 holes corresponding to the electrode portions of the electronic component are formed is brought into close contact with the electrode portion forming surface of the electronic component. Then, a conductive paste is applied to an area of 172 or less on the electrode part by screen printing, and when the screen plate is separated, the conductive paste applied to the electrode part is determined based on the viscosity of the conductive paste. The paste was formed into a cone shape.
特に電子部品の電極部表面がアルミニウムからなるとき
は、好ましくはその表面をあらかじめクロメート処理し
ておくとよい。Particularly when the surface of the electrode portion of an electronic component is made of aluminum, it is preferable to chromate-treat the surface in advance.
（作 用）
上記のようにスクリーン版を電子部品の電極部形成面に
密着して、スクリーン印刷により導電性ペーストを電極
部の１７２以下の面積に塗布し、その後スクリーン版を
引離すときに、導電性ペーストの粘性に基づいて塗布さ
れた導電性ペーストが円錐状なるようにすると、熱圧着
時の導電性ペーストの広がりによる短絡が防止され、信
頼性の高い接続かえられる。(Function) As described above, when the screen plate is closely attached to the electrode forming surface of the electronic component and the conductive paste is applied to an area of 172 mm or less of the electrode part by screen printing, and then the screen plate is separated, By forming the applied conductive paste into a conical shape based on the viscosity of the conductive paste, short circuits due to spread of the conductive paste during thermocompression bonding can be prevented, and a highly reliable connection can be achieved.
（実施例）
以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.
まず第１図（Ａ）図に示すように、電子部品（１０）の
電極部（２）にスクリーン印刷により導電性ペーストを
塗１５するために、その電極部形成面に、電極部（２）
に対応してそのＮ極部（２）の１７２以下の面積の開孔
（１１）が形成された下記スクリーン版（１２）を電極
部（２）と開孔（１１）とを位置合せして密着配置する
。First, as shown in FIG. 1(A), in order to apply conductive paste 15 to the electrode part (2) of the electronic component (10) by screen printing, the electrode part (2) is applied to the electrode part (2) on the electrode part forming surface.
Align the electrode part (2) and the aperture (11) with the following screen plate (12) in which an aperture (11) with an area of 172 or less is formed in the N-pole part (2) corresponding to the above. Place them close together.
上記スクリーン版（１２）は、Ｍｔａスクリーン版で、
ガラス基板上に形成されたクロムなどからなる金属薄膜
パターンを母型として、たとえばスルファミン酸ニッケ
ル浴から電濤により形成され、母型から剥がしたのち、
金属枠に張ったものである。The above screen version (12) is the Mta screen version,
Using a metal thin film pattern made of chromium or the like formed on a glass substrate as a matrix, it is formed, for example, by electropulsion from a nickel sulfamate bath, and after being peeled off from the matrix,
It is mounted on a metal frame.
つぎに、上記スクリーン版（１２）上からスキージを押
し当てながら移動することにより、スクリーン版（１２
）の開孔（１１）を介して電極部（２）に導電性ペース
トを塗布する。特にこの導電性ペーストの塗布は、スキ
ージの移動により、そのスキージの手前に溜った導電性
ペーストの一部を戻して開孔（１１）上に厚い導電性ペ
ースト層が得られるようにする。Next, the screen plate (12) is moved by pressing the squeegee from above the screen plate (12).
) A conductive paste is applied to the electrode part (2) through the opening (11). In particular, when applying this conductive paste, by moving the squeegee, a portion of the conductive paste that has accumulated in front of the squeegee is returned so that a thick layer of conductive paste is obtained on the openings (11).
このスクリーン印刷に使用される導電性ペーストとして
は、カーボンや銀、金、バラジュウムなどの金属微粒子
と熱可塑性樹脂とを主成分とする熱可塑性型の導電性ペ
ーストが良好な結果が得られる。As the conductive paste used in this screen printing, good results can be obtained with a thermoplastic conductive paste whose main components are a thermoplastic resin and fine metal particles such as carbon, silver, gold, or baradium.
つぎに、電子部品（１０）の電極部形成面からスクリー
ン版（１２）を引離す。このとき、導電性ペーストの粘
度を適切に調整しておくことにより、上記開孔（１１）
上の導電性ペースト層は、糸引き状態となり、（Ｂ）図
に示すように、電極部（２）上に高さの高い円錐状の導
電性ペーストＩＩ （１３）が形成される。すなわち電
極部（２）対して接触面積が１７２以下と十分に小さく
、かつ電極部（２）との接触面積の直径と高さとがほぼ
等しく、たとえば接触面積の直径と高さとが約５０μｍ
の円錐状の導電性べ一ストからなるバンブを形成するこ
とができる。Next, the screen plate (12) is separated from the electrode portion forming surface of the electronic component (10). At this time, by appropriately adjusting the viscosity of the conductive paste, the openings (11)
The upper conductive paste layer becomes stringy, and as shown in Figure (B), a tall conical conductive paste II (13) is formed on the electrode part (2). That is, the contact area with respect to the electrode part (2) is sufficiently small, 172 or less, and the diameter and height of the contact area with the electrode part (2) are approximately equal, for example, the diameter and height of the contact area are approximately 50 μm.
A bump consisting of a conical conductive base can be formed.
なお、この電極部（２）上に導電性ペーストを塗布して
電極の形成された電子部品（１０）は、第２図に示すよ
うに、その電極を外部回路たとえば印刷配線基板（１５
）の回路パターンの電極部（１６）に位置合せし、フェ
ースダウンボンディングにより約１８０℃に加熱し加圧
して導電性ペーストの接着により外部回路に接続される
。The electronic component (10) in which an electrode is formed by applying a conductive paste on the electrode portion (2) is connected to an external circuit such as a printed wiring board (15), as shown in FIG.
) is aligned with the electrode part (16) of the circuit pattern, heated to about 180° C. and pressurized by face down bonding, and connected to an external circuit by adhesion of conductive paste.
ところで、上記方法により導電性ペーストを塗布すると
、電子部品（１０）の電極部（２）に対して接触面積が
１７２以下と十分に小ざく高さの高い円錐状の導電性ペ
ースト層（１３）を形成され、電極部（２）面積に対し
てその塗イ５伍が少ないので、フェースダウンボンディ
ングによる熱圧着時に、第２図に示したように導電性ペ
ースト層（１３）に広がりを生じても、従来のように短
絡をおこすことなく所要の接続をおこなうことができる
。また、高さの高い導電性ペースト層（１３）は、電子
部品（１０）の多数の電極を同時に熱圧着しても、その
全てを確実に接着することができ、信頼性の高い接続が
得られる。さらに、導電性ペーストが熱可塑性型である
ため、所要の接続を得るための熱圧着の制御が容易であ
り、高さの高い導電性ペースト層（１３）の作用と相俟
つて信頼性の高い接続が得られる。By the way, when the conductive paste is applied by the above method, a conical conductive paste layer (13) with a sufficiently small contact area of 172 or less and a high height is formed with respect to the electrode part (2) of the electronic component (10). Since the area of the electrode part (2) is smaller than the area of the electrode part (2), the conductive paste layer (13) spreads during thermocompression bonding by face-down bonding, as shown in Figure 2. However, the required connections can be made without causing short circuits as in the conventional case. In addition, the conductive paste layer (13) with a high height can reliably bond all of the electrodes of the electronic component (10) even if they are thermocompression bonded at the same time, resulting in a highly reliable connection. It will be done. Furthermore, since the conductive paste is of thermoplastic type, it is easy to control the thermocompression bonding to obtain the desired connection, and together with the action of the high conductive paste layer (13), it is highly reliable. You get a connection.
なお、絶縁性接着剤を併用できる場合は、エポキシ樹脂
などの熱硬化性樹脂をバインダーとした導電性ペースト
を使用できる。Note that if an insulating adhesive can be used in combination, a conductive paste using a thermosetting resin such as an epoxy resin as a binder can be used.
また、電子部品の電極部に導電性ペーストからなるバン
ブを形成する場合、おる種の半導体装置のようにその電
子部品の電極部がアルミニウムからなるとき、このアル
ミニウムからなる電極部上に直接上記実施例の方法によ
り導電性ペーストを塗布してもよいが、第３図に示すよ
うに、あらかじめその電極部（２）をクロム酸および硫
酸を主成分とするクロメート処理液により処理してパッ
シベーション層（１７）を形成しておくと、導電性ペー
ストの密着性および電極部（２）の耐蝕性を高め、経時
変化の少ない信頼性の高い電極とすることができる。In addition, when forming a bump made of conductive paste on the electrode part of an electronic component, if the electrode part of the electronic part is made of aluminum, such as in some types of semiconductor devices, the above-mentioned bumps can be directly applied to the electrode part made of aluminum. The conductive paste may be applied by the method described above, but as shown in FIG. 17) improves the adhesion of the conductive paste and the corrosion resistance of the electrode portion (2), making it possible to provide a highly reliable electrode with little change over time.
［発明の効果］
電子部品の電極部に対応する開孔が形成されたスクリー
ン版を電子部品の電極部形成面に密着して、スクリーン
印刷により電極部に導電ペーストをその電極部の１７２
以下の面積に塗イ１し、上記スクリーン版を引離すとき
、導電ペーストの粘性に基づいて上記電極部に塗布され
た導電ペーストを円錐状に形成すると、フェースダウン
ボンディングによる熱圧着時に導電ペーストに広がりを
生じても、従来のように短絡をおこさない接続をおこな
うことができ、また、高さの高いバンブを形成により、
電子部品の多数の電極を同時に熱圧着しても、その全て
を確実に接着することができ信頼性の高い接続が得られ
る。[Effect of the invention] A screen plate in which openings corresponding to the electrode portions of the electronic component are formed is brought into close contact with the electrode portion forming surface of the electronic component, and a conductive paste is applied to the electrode portion by screen printing at 172 points of the electrode portion.
When applying the paste to the following area and separating the screen plate, if the conductive paste applied to the electrode part is formed into a conical shape based on the viscosity of the conductive paste, the conductive paste will form during thermocompression bonding by face-down bonding. Even if it spreads, it can be connected without causing a short circuit like in the past, and by forming a high bump,
Even if a large number of electrodes of an electronic component are thermocompression bonded at the same time, all of them can be reliably bonded and a highly reliable connection can be obtained.
第１図（Ａ）および（Ｂ）図はそれぞれこの発明の一実
施例である電子部品の電極形成方法を説明するための工
程図、第２図はその電極の形成された電子部品と外部回
路との接続を説明するための図、第３図はアルミニウム
からなる電極・にパッシベーション膜の形成する方法を
説明するための図、第４図（Ａ）および（Ｂ）図はそれ
ぞれ従来の電子部品の電極形成方法を説明するための工
程図でおる。
２・・・電極部 １０・・・電子部品１１・・
・開孔 １２・・・スクリーン版１３・・・
導電性ペースト １７・・・パッシベーション膜代理人
弁理士 大 胡 典 夫
手
続
補
正
曹（方式）
■、事件の表示
昭和６３年
第２２５９８２号
第
図
２、発明の名称
電子部品の電極形成方法
３、補正をする者
事件との関係 特許出願人
（３０７）株式会社 東芝
４、代
〒１４４
釘 ５ 図
５゜
６゜
７゜
補正命令の日付
昭和６３年１２月７日（発進口 昭和６３年１２月２０
日）補正の対象
（＋）明細書の発明の詳細な説明の欄
（２）図面
補正の内容
（１）明細書第１頁第１２行目の［徴とする電子部品の
電極形成方法。Ｊと、同第１３行目の「〔発明の目的］
」との間に、「３、発明の詳細な説明」の記載を挿入す
る。
（２）明細書添付図面のうち、第４図および第５図を別
紙のとおり訂正する。
以上Figures 1 (A) and (B) are process diagrams for explaining a method for forming electrodes of an electronic component, which is an embodiment of the present invention, and Figure 2 shows an electronic component with the electrode formed thereon and an external circuit. Figure 3 is a diagram to explain the method of forming a passivation film on an electrode made of aluminum, and Figures 4 (A) and (B) are diagrams of conventional electronic components. This is a process diagram for explaining the electrode forming method. 2... Electrode part 10... Electronic component 11...
・Opening hole 12...Screen plate 13...
Conductive paste 17...Passivation film agent Patent attorney Nian Ogo Procedural amendment specialist (method) ■, Indication of case No. 225982 of 1988 Figure 2, Title of invention Method for forming electrodes of electronic components 3, Amendment Relationship with the case of a person who did
Date: Subject of amendment (+) Detailed description of the invention in the specification (2) Contents of the drawing amendment (1) Method for forming electrodes of electronic components as described in page 1, line 12 of the specification. J and “[Object of the invention]” in line 13 of the same
”, insert the statement “3. Detailed Description of the Invention”. (2) Of the drawings attached to the specification, Figures 4 and 5 are corrected as shown in the attached sheet. that's all
Claims (1)
クリーン版を上記電子部品の電極形成面に密着してスク
リーン印刷により上記電極部に導電性ペーストを上記電
極部の１／２以下の面積に塗布し、上記スクリーン版を
引離すときに上記導電性ペーストの粘性に基づいて上記
電極部に塗布された導電性ペーストを円錐状に形成する
ことを特徴とする電子部品の電極形成方法。(1) A screen plate with openings corresponding to the electrode portions of the electronic component is closely attached to the electrode formation surface of the electronic component, and a conductive paste is applied to the electrode portion by screen printing to 1/2 or less of the electrode portion. A method for forming an electrode for an electronic component, characterized in that the conductive paste applied to the electrode part is formed into a conical shape based on the viscosity of the conductive paste when the screen plate is separated. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63225982A JP2501882B2 (en) | 1988-09-09 | 1988-09-09 | Electrode forming method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63225982A JP2501882B2 (en) | 1988-09-09 | 1988-09-09 | Electrode forming method for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0274041A true JPH0274041A (en) | 1990-03-14 |
| JP2501882B2 JP2501882B2 (en) | 1996-05-29 |
Family
ID=16837938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63225982A Expired - Fee Related JP2501882B2 (en) | 1988-09-09 | 1988-09-09 | Electrode forming method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501882B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582582A (en) * | 1991-09-24 | 1993-04-02 | Nec Yamagata Ltd | Semiconductor device |
| JP2008091933A (en) * | 1995-11-17 | 2008-04-17 | Dainippon Printing Co Ltd | Electronic component |
| JP2008091494A (en) * | 2006-09-29 | 2008-04-17 | Dainippon Printing Co Ltd | Method for forming conductive bump |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5112770A (en) * | 1974-07-22 | 1976-01-31 | Suwa Seikosha Kk | HANDOTAISHUSEKIKAIRONO SEIZOHOHO |
| JPS62283644A (en) * | 1986-05-31 | 1987-12-09 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
-
1988
- 1988-09-09 JP JP63225982A patent/JP2501882B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5112770A (en) * | 1974-07-22 | 1976-01-31 | Suwa Seikosha Kk | HANDOTAISHUSEKIKAIRONO SEIZOHOHO |
| JPS62283644A (en) * | 1986-05-31 | 1987-12-09 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582582A (en) * | 1991-09-24 | 1993-04-02 | Nec Yamagata Ltd | Semiconductor device |
| JP2008091933A (en) * | 1995-11-17 | 2008-04-17 | Dainippon Printing Co Ltd | Electronic component |
| JP2008091494A (en) * | 2006-09-29 | 2008-04-17 | Dainippon Printing Co Ltd | Method for forming conductive bump |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501882B2 (en) | 1996-05-29 |
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