JP2000216199A - Connecting method of electronic part by use of anisotropic conductive paste and collet therefor - Google Patents

Connecting method of electronic part by use of anisotropic conductive paste and collet therefor

Info

Publication number
JP2000216199A
JP2000216199A JP11013492A JP1349299A JP2000216199A JP 2000216199 A JP2000216199 A JP 2000216199A JP 11013492 A JP11013492 A JP 11013492A JP 1349299 A JP1349299 A JP 1349299A JP 2000216199 A JP2000216199 A JP 2000216199A
Authority
JP
Japan
Prior art keywords
conductive paste
anisotropic conductive
electronic component
gas
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11013492A
Other languages
Japanese (ja)
Other versions
JP3561166B2 (en
Inventor
Tsutomu Sakatsu
務 坂津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP01349299A priority Critical patent/JP3561166B2/en
Publication of JP2000216199A publication Critical patent/JP2000216199A/en
Application granted granted Critical
Publication of JP3561166B2 publication Critical patent/JP3561166B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

PROBLEM TO BE SOLVED: To prevent an electronic part such as a semiconductor chip from adhering to a collect after a pressure bonding operation is carried out, by a method wherein ansiotropic conductive paste is fed to the prescribed part of the electronic part, and gas is spouted out against the paste applied to the part to spread it in a region as intended. SOLUTION: Air is made to blow against anisotropic conductive paste(ACP) applied to the center of an electronic part (Substrate) as it is controlled in flow rate and shown by an arrow A so as to spread the paste over a semiconductor chip mounting area. On the other hand, air is made to blow against the anisotropic conductive paste as controlled in flow rate from the direction B1 to Bn so as to spread the paste in a shape conforming to the outer shape of a semiconductor chip, by which the anisotropic conductive paste is turned into states A-1 and B-1. By this setup, a semiconductor chip is can be prevented from adhering to a collect after a pressure bonding operation is carried out.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体の実装やフ
リップチップの接合などの技術分野に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technical field such as semiconductor mounting and flip chip bonding.

【０００２】[0002]

【従来技術】ノートパソコンのＬＣＤ（Ｌｉｑｕｉｄ
Ｃｒｙｓｔａｌ Ｄｉｓｐｌａｙ）とドライバＩＣを実
装したＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａ
ｇｅ）との接続といった電子部品間の接続では、異方性
導電ペースト（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃ
ｔｉｖｅ Ｐａｓｔｅ すなわち ＡＣＰ）が用いられ
ている。2. Description of the Related Art Notebook LCDs (Liquid)
TCP (Tape Carrier Packa) with a Crystal Display and a driver IC
ge), an anisotropic conductive paste (Anisotropic Conductive)
active paste, or ACP).

【０００３】たとえば、図１に示すように、バンプ（電
極、通常はＡｕ使用）を半導体チップ（図１ではＣＨＩ
Ｐと表示）上に形成し〔図１（ａ）〕、レベリング装置
を用いてバンプの高さをそろえて〔図１（ｂ）〕から、
接続を意図するマウント部中央に異方性導電ペーストを
塗布し〔図１（ｃ）〕、半導体チップをコレットを用い
て圧着し〔図１（ｄ）〕、加熱により接続を完了すると
いうのが、異方性導電接続方法の１例である。なお、図
２は接続部分の部分拡大断面図である。また、図１でも
図２の電極が含まれているが、表示は省略されている。For example, as shown in FIG. 1, bumps (electrodes, usually using Au) are mounted on a semiconductor chip (CHI in FIG. 1).
P (shown as P) (FIG. 1 (a)), and the height of the bumps is aligned using a leveling device (FIG. 1 (b)).
Applying an anisotropic conductive paste to the center of the mount portion intended for connection [FIG. 1 (c)], crimping the semiconductor chip using a collet [FIG. 1 (d)], and completing the connection by heating. , An example of an anisotropic conductive connection method. FIG. 2 is a partially enlarged sectional view of the connection portion. FIG. 1 also includes the electrodes of FIG. 2, but the illustration is omitted.

【０００４】このような場合に、異方性導電ペーストの
量が少ないと、図１（ｄ′）に示すように異方性導電ペ
ーストがバンプ（電極）部まで広がらず、バンプと半導
体チップの間に導電粒子が介在できなくなってしまう。
ところが、一方では異方性導電ペーストが多すぎると、
図１（ｄ）に示すように異方性導電ペーストがコレット
部までまわりこみ、加熱硬化させたとき、半導体チップ
とコレットがくっついてしまうという問題がおきる。In such a case, if the amount of the anisotropic conductive paste is small, the anisotropic conductive paste does not spread to the bump (electrode) portion as shown in FIG. The conductive particles cannot be interposed between them.
However, on the other hand, if there is too much anisotropic conductive paste,
As shown in FIG. 1D, when the anisotropic conductive paste spreads to the collet portion and is cured by heating, there is a problem in that the semiconductor chip and the collet adhere to each other.

【０００５】このような問題に対応するため、塗布量の
制御、ディスペンスポイントの制御などの方法が提案さ
れている。しかしながら、それでもまだ、チップ電極が
降下してきたときの異方性導電ペーストの広がりを制御
することは困難であり、ディスペンスポイントの設定は
極めて困難である。[0005] In order to cope with such a problem, methods such as control of the amount of application and control of a dispense point have been proposed. However, it is still difficult to control the spread of the anisotropic conductive paste when the tip electrode descends, and it is extremely difficult to set the dispense point.

【０００６】[0006]

【発明が解決しようとする課題】そこで本発明の目的は
異方性導電ペーストが半導体チップのような電子部品を
マウントする前に、必要なエリアに異方性導電ペースト
が充分行き渡り、かつ圧着接続後にコレットと半導体チ
ップのような電子部品が接着してしまうことがない“異
方性導電ペーストを用いた電子部品の接続方法”を提供
する点にある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an anisotropic conductive paste which is sufficiently spread over a required area before mounting an electronic component such as a semiconductor chip, and is connected by crimping. It is an object of the present invention to provide a "method of connecting electronic components using an anisotropic conductive paste", in which electronic components such as a collet and a semiconductor chip do not adhere later.

【０００７】[0007]

【課題を解決するための手段】本発明の第一は、異方性
導電ペーストを電子部品の所定部に供給した後、ガスを
吹き付けることにより、それを意図した領域に広げるこ
とを特徴とする異方性導電ペーストを用いた電子部品の
接続方法に関する。A first aspect of the present invention is characterized in that after supplying an anisotropic conductive paste to a predetermined portion of an electronic component, the gas is blown to spread the paste over an intended region. The present invention relates to a method for connecting electronic components using an anisotropic conductive paste.

【０００８】前記ガスの吹き付けをより具体的に説明す
ると、前記所定部に供給された異方性導電ペーストの上
方部よりガスを吹き付けて異方性導電ペーストの膜厚を
制御すると同時に、外周部からもガスを吹き付けて異方
性導電ペーストの広がりを制御するものである。More specifically, the gas blowing is controlled by controlling the film thickness of the anisotropic conductive paste by blowing a gas from above the anisotropic conductive paste supplied to the predetermined portion. This also controls the spread of the anisotropic conductive paste by blowing a gas.

【０００９】本発明においては、前記所定部に供給され
た異方性導電ペーストの上方部よりガスを吹き付けて異
方性導電ペーストの膜厚を制御すると同時に、外周部か
らもガスを吹き付けて異方性導電ペーストの広がりを制
御し、ついで、前記電子部品をコレット側に吸引した
後、前記電子部品を異方性導電ペースト層を介して相手
方の電子部品に圧接することが好ましい。In the present invention, the gas is blown from above the anisotropic conductive paste supplied to the predetermined portion to control the film thickness of the anisotropic conductive paste, and at the same time, the gas is blown also from the outer peripheral portion to form a different portion. Preferably, the spread of the isotropic conductive paste is controlled, and then, after the electronic component is sucked to the collet side, the electronic component is pressed against the other electronic component via the anisotropic conductive paste layer.

【００１０】また、本発明においては、前記圧接にさい
し、相手方の電子部品の外周部に、コレット側からガス
を吹き付けることにより異方性導電ペーストがコレット
と接触するのを防止することが好ましい。In the present invention, it is preferable to prevent the anisotropic conductive paste from coming into contact with the collet by spraying a gas from the collet side to the outer peripheral portion of the electronic component of the other party during the pressing.

【００１１】本発明の第二は、相手方電子部品の外周部
全体にガスを吹き付けるためのガス吹き出し機構を設け
たことを特徴とするコレットに関する。A second aspect of the present invention relates to a collet characterized by providing a gas blowing mechanism for blowing a gas to the entire outer peripheral portion of a counterpart electronic component.

【００１２】前記コレットは、その中央部にガス吹き出
し機能と吸引（例えば真空吸引）機能とを切り換えによ
りそれぞれ発揮できる機構を設けたものであることが好
ましい。It is preferable that the collet is provided with a mechanism at a central portion thereof capable of switching between a gas blowing function and a suction (for example, vacuum suction) function.

【００１３】前記ガスは、空気がもっとも経済的である
が、異方性導電ペーストの組成によっては不活性ガス、
たとえば炭酸ガスや窒素ガスを用いることもできる。As the gas, air is the most economical, but depending on the composition of the anisotropic conductive paste, an inert gas,
For example, carbon dioxide gas or nitrogen gas can be used.

【００１４】[0014]

【発明の実施の形態】半導体チップを相手方の電子部品
に接続する場合を例にとって、本発明の接続方法を説明
する。図３に示すように、相手方電子部品（Ｓｕｂｓｔ
ｒａｔｅ、たとえばプリント基板）の中央部に適用され
た異方性導電ペースト（ＡＣＰ）を半導体チップのマウ
ントエリア（バンプレイアウト範囲、すなわちＳｕｂｓ
ｔｒａｔｅ上でチップがマウントされるエリア）まで押
し広げるため、中央上部より矢印Ａで示すように空気量
を制御しながら吹き付ける（例えば図５のコレット中央
部の穴ａより空気を吹き付ける）。一方、半導体チップ
の外形に合わせた形に異方性導電ペーストが治るように
例えば矢印Ｂ１〜Ｂｎの各方向からも空気量を制御しな
がら吹き付け、異方性導電ペーストが図３のイ−１およ
びロ−１（イ−１は断面図、ロ−１は平面図）の状態か
らイ−２およびロ−２（イ−２は断面図、ロ−２は平面
図）の状態になるようにする。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The connection method of the present invention will be described with reference to an example in which a semiconductor chip is connected to a partner electronic component. As shown in FIG. 3, the other electronic component (Subst
rate, for example, a printed circuit board) is applied to the mounting area of the semiconductor chip (bump layout range, ie, Subs).
In order to spread the chip to the area where the chip is mounted on the rate, the air is blown from the upper center while controlling the amount of air as shown by the arrow A (for example, air is blown from the hole a in the center of the collet in FIG. 5). On the other hand, the anisotropic conductive paste is blown while controlling the amount of air also from each direction of arrows B1 to Bn so that the anisotropic conductive paste is cured in a shape conforming to the outer shape of the semiconductor chip. And from the state of b-1 (a-1 is a sectional view, b-1 is a plan view) to the state of a-2 and b-2 (a-2 is a sectional view, b-2 is a plan view). I do.

【００１５】前記Ｂ１〜Ｂｎの方向から空気を吹き付け
るためには、例えばリングの内側に連続したスリットま
たは多数の吹きだし穴を設けた空気吹き付けリングを通
して空気を所定の角度で吹き付けることができる。吹き
出し穴を用いる場合には、個々の吹きだし穴の空気量を
制御すれば異方性導電ペーストの塗布形は任意に調節で
きる。吹きだし穴の形状は円形、長方形などニーズに応
じて種々の形状と数を設定することができる。In order to blow air from the directions B1 to Bn, for example, air can be blown at a predetermined angle through an air blowing ring provided with a continuous slit or a number of blowout holes inside the ring. When the blowing holes are used, the application form of the anisotropic conductive paste can be arbitrarily adjusted by controlling the amount of air in each blowing hole. The shape of the blowout hole can be set to various shapes and numbers such as a circle and a rectangle according to needs.

【００１６】前述のように異方性導電ペーストの形状が
目的の形状に均一に塗布できたら、図５に示すようにコ
レットの中央部の穴ａから真空吸引して半導体チップを
コレットに固定した状態で、コレットを相手方の電子部
品（Ｓａｂｓｔｒａｔｅ）方向に降下させ、半導体チッ
プのマウントを異方性導電ペーストを介して相手方の電
子部品に圧着させる。このとき、半導体チップ外周には
み出した異方性導電ペーストが、図１（ｄ）のようにコ
レットに接触するのを防止するため、図５の穴ｂ−１〜
ｂ−４より空気を吹きだすことが好ましい。ついで例え
ば、パルスヒート方式により異方性導電ペーストを加熱
して、その主成分である熱硬化性樹脂（例えばエポキシ
樹脂）を硬化させることにより、接続を完了する。When the shape of the anisotropic conductive paste can be uniformly applied to the desired shape as described above, the semiconductor chip is fixed to the collet by vacuum suction from the hole a at the center of the collet as shown in FIG. In this state, the collet is lowered in the direction of the other electronic component (Sabstrate), and the mount of the semiconductor chip is pressed against the other electronic component via the anisotropic conductive paste. At this time, in order to prevent the anisotropic conductive paste protruding from the outer periphery of the semiconductor chip from contacting the collet as shown in FIG.
It is preferable to blow out air from b-4. Next, for example, the connection is completed by heating the anisotropic conductive paste by a pulse heating method to cure a thermosetting resin (for example, an epoxy resin) as a main component thereof.

【００１７】本発明に用いる異方性導電ペーストおよび
それに含まれる導電材料については格別の制限はなく、
例えば、雑誌「表面実装技術」１９９６年Ｎｏ．３、第
１０〜１３頁および同１９９７年Ｎｏ．４、第４６〜５
２頁記載のものを使用することができる。There is no particular limitation on the anisotropic conductive paste used in the present invention and the conductive material contained therein.
For example, the magazine “Surface Mount Technology” 1996 No. 3, pages 10 to 13 and 1997, no. 4, 46th to 5th
Those described on page 2 can be used.

【００１８】[0018]

【効果】（１） 請求項１の発明により、異方性導電ペ
ーストの膜厚や広がりを制御することができる。 （２） 請求項２の発明により、目的とする所定の形状
に異方性導電ペーストを広げることができる。 （３） 請求項３の発明により、圧接したとき異方性導
電ペーストがコレットに接着するのを防止することがで
きる。 （４） 請求項４の発明により、上側の電子部品の位置
を所定の位置にマウントすることができる。 （５） 請求項５の発明により、請求項１〜３記載の方
法を実施するのに適したコレットを提供できる。 （６） 請求項６の発明により、請求項４記載の方法を
実施するのに適したコレットを提供できる。(1) According to the first aspect of the invention, the thickness and spread of the anisotropic conductive paste can be controlled. (2) According to the second aspect of the present invention, the anisotropic conductive paste can be spread in a desired predetermined shape. (3) According to the invention of claim 3, it is possible to prevent the anisotropic conductive paste from adhering to the collet when pressed. (4) According to the invention of claim 4, the position of the upper electronic component can be mounted at a predetermined position. (5) According to the invention of claim 5, it is possible to provide a collet suitable for carrying out the method of claims 1 to 3. (6) According to the invention of claim 6, a collet suitable for carrying out the method of claim 4 can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図１】異方性導電ペーストを用いた電子部品の接続方
法の作業手順を示す図である。FIG. 1 is a diagram showing an operation procedure of a method for connecting electronic components using an anisotropic conductive paste.

【図２】異方性導電ペーストを用いて電子部品を接続し
たときのバンプ周辺の拡大断面図である。FIG. 2 is an enlarged cross-sectional view around a bump when an electronic component is connected using an anisotropic conductive paste.

【図３】図３は、本発明の接続方法の一実施態様を示
す。イ−１およびイ−２はそれぞれ断面図であり、ロ−
１およびロ−２は平面図である。FIG. 3 shows an embodiment of the connection method of the present invention. B-1 and B-2 are cross-sectional views, respectively.
1 and B-2 are plan views.

【図４】図４は、圧着したとき異方性導電ペーストがコ
レットに接着するのを防止するための一実施態様を示す
断面図である。FIG. 4 is a cross-sectional view showing one embodiment for preventing anisotropic conductive paste from adhering to a collet when pressed.

【図５】本発明方法を実施するのに好適に用いられるコ
レットの一具体例を示し、（イ）は断面図、（ロ）は平
面図を示す。FIGS. 5A and 5B show one specific example of a collet suitably used for carrying out the method of the present invention, wherein FIG. 5A is a cross-sectional view and FIG.

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 異方性導電ペーストを電子部品の所定部
に供給した後、ガスを吹き付けることにより、それを意
図した領域に広げることを特徴とする異方性導電ペース
トを用いた電子部品の接続方法。An electronic component using an anisotropic conductive paste, characterized in that after supplying an anisotropic conductive paste to a predetermined portion of an electronic component, the gas is blown to spread the gas to an intended region. Connection method. 【請求項２】 前記所定部に供給された異方性導電ペー
ストの上方部よりガスを吹き付けて異方性導電ペースト
の膜厚を制御すると同時に、外周部からもガスを吹き付
けて異方性導電ペーストの広がりを制御することを特徴
とする異方性導電ペーストを用いた電子部品の接続方
法。2. An anisotropic conductive paste is supplied by spraying a gas from an upper portion of the anisotropic conductive paste supplied to the predetermined portion to control the film thickness of the anisotropic conductive paste. A method for connecting electronic components using an anisotropic conductive paste, characterized by controlling the spread of the paste. 【請求項３】 前記所定部に供給された異方性導電ペー
ストの上方部よりガスを吹き付けて異方性導電ペースト
の膜厚を制御すると同時に、外周部からもガスを吹き付
けて異方性導電ペーストの広がりを制御し、ついで前記
電子部品を異方性導電ペースト層を介して相手方の電子
部品に圧接するにあたり、相手方の電子部品の外周部
に、コレット側からガスを吹き付けることにより、異方
性導電ペーストがコレットと接触するのを防止すること
を特徴とする異方性導電ペーストを用いた電子部品の接
続方法。3. An anisotropic conductive paste is supplied by spraying a gas from an upper portion of the anisotropic conductive paste supplied to the predetermined portion to control the film thickness of the anisotropic conductive paste. When the spread of the paste is controlled, and then the electronic component is pressed against the electronic component of the other party through the anisotropic conductive paste layer, the gas is blown from the collet side to the outer peripheral portion of the electronic component of the other party. A method for connecting an electronic component using an anisotropic conductive paste, wherein the conductive paste is prevented from contacting a collet. 【請求項４】 前記所定部に供給された異方性導電ペー
ストの上方部よりガスを吹き付けて異方性導電ペースト
の膜厚を制御すると同時に、外周部からもガスを吹き付
けて異方性導電ペーストの広がりを制御し、ついで前記
電子部品をコレット側に吸引した後、前記電子部品を異
方性導電ペースト層を介して、相手方の電子部品に圧接
するにあたり、相手方の電子部品の外周部に、コレット
側からガスを吹き付けることにより、異方性導電ペース
トがコレットと接触するのを防止することを特徴とする
異方性導電ペーストを用いた電子部品の接続方法。4. An anisotropic conductive paste is supplied from the upper portion of the anisotropic conductive paste supplied to the predetermined portion to control the film thickness of the anisotropic conductive paste and, at the same time, to blow the gas also from the outer peripheral portion. After controlling the spread of the paste, and then sucking the electronic component to the collet side, when the electronic component is pressed against the electronic component of the other party through the anisotropic conductive paste layer, the outer peripheral portion of the electronic component of the other party is pressed. A method of connecting an electronic component using an anisotropic conductive paste, wherein a gas is blown from a collet side to prevent the anisotropic conductive paste from contacting the collet. 【請求項５】 相手方電子部品の外周部全体にガスを吹
き付けるためのガス吹きだし機構を設けたことを特徴と
するコレット。5. A collet provided with a gas blowing mechanism for blowing gas over the entire outer peripheral portion of a mating electronic component. 【請求項６】 中央部にガス吹きだし機能と吸引機能と
を切り換えによりそれぞれ発揮できる機構を設けた請求
項５記載のコレット。6. The collet according to claim 5, wherein a mechanism capable of switching between a gas blowing function and a suction function is provided at a central portion.
JP01349299A 1999-01-21 1999-01-21 Method for connecting electronic components using anisotropic conductive paste Expired - Fee Related JP3561166B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175436A (en) * 2003-10-06 2005-06-30 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacturing method
JP2009076606A (en) * 2007-09-19 2009-04-09 Shibaura Mechatronics Corp Mounting device and mounting method for electronic component
CN111095504A (en) * 2017-08-07 2020-05-01 波士顿制程技术有限公司 Solder ball mounting device without soldering flux

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175436A (en) * 2003-10-06 2005-06-30 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacturing method
JP4679106B2 (en) * 2003-10-06 2011-04-27 株式会社半導体エネルギー研究所 Semiconductor device
US8481370B2 (en) 2003-10-06 2013-07-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2009076606A (en) * 2007-09-19 2009-04-09 Shibaura Mechatronics Corp Mounting device and mounting method for electronic component
CN111095504A (en) * 2017-08-07 2020-05-01 波士顿制程技术有限公司 Solder ball mounting device without soldering flux
JP2020530197A (en) * 2017-08-07 2020-10-15 ボストン プロセス テクノロジーズ，インコーポレイテッド Flux-free solder ball mounting mechanism
JP7084981B2 (en) 2017-08-07 2022-06-15 ボストン プロセス テクノロジーズ，インコーポレイテッド Flux-free solder ball mounting mechanism

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