JP2001250845A - Method and device for mounting semiconductor chip - Google Patents
Method and device for mounting semiconductor chipInfo
- Publication number
- JP2001250845A JP2001250845A JP2000062258A JP2000062258A JP2001250845A JP 2001250845 A JP2001250845 A JP 2001250845A JP 2000062258 A JP2000062258 A JP 2000062258A JP 2000062258 A JP2000062258 A JP 2000062258A JP 2001250845 A JP2001250845 A JP 2001250845A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin
- chip mounting
- flip
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体チップをプ
リント配線基板にフリップチップ実装するための半導体
チップ実装方法及びこれに用いる半導体チップ実装装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting method for flip-chip mounting a semiconductor chip on a printed wiring board and a semiconductor chip mounting apparatus used for the method.
【０００２】[0002]
【従来の技術】従来より、高密度、高集積の半導体集積
回路（ＩＣ）の実装には、プリップチップ実装方式が用
いられている。図５は、高密度、高集積の半導体集積回
路（ＩＣ）としての半導体チップのフリップチップ実装
工程を示す。半導体チップ１は、裏面周辺に微小ピッチ
で多数の微小突起電極２が設けられて成る。先ず、図５
Ａに示すように、配線パターン３が形成されたプリント
配線基板４の半導体チップ搭載部の中心に、ペースト状
の樹脂（いわゆる接着樹脂）５を塗布する。樹脂５の塗
布は、図６に示した樹脂５を入れたシリンジ７に先端の
尖ったニードル８を取り付けてなる塗布手段６を用いて
行われる。この場合、樹脂５は、半導体チップ搭載部の
中心に一点塗布される。2. Description of the Related Art Conventionally, a flip-chip mounting method has been used for mounting a high-density and highly integrated semiconductor integrated circuit (IC). FIG. 5 shows a flip-chip mounting process of a semiconductor chip as a high-density, highly integrated semiconductor integrated circuit (IC). The semiconductor chip 1 has a large number of minute projection electrodes 2 provided at a minute pitch around the back surface. First, FIG.
As shown in A, a paste-like resin (so-called adhesive resin) 5 is applied to the center of the semiconductor chip mounting portion of the printed wiring board 4 on which the wiring pattern 3 is formed. The application of the resin 5 is performed by using an application unit 6 in which a needle 8 having a sharp tip is attached to a syringe 7 containing the resin 5 shown in FIG. In this case, the resin 5 is applied at one point to the center of the semiconductor chip mounting portion.
【０００３】次に、図５Ｂに示すように、半導体チップ
１を、その突起電極２がプリント配線基板４の対応する
配線パターン３に対接するように樹脂５上に搭載する。
次いで、図５Ｃに示すように、ボンディングツール９に
より半導体チップ１を加圧、加熱して、突起電極２と配
線パターン３とを電気的に接続すると共に、半導体チッ
プ１を樹脂５を介して接着し、半導体チップ１のフリッ
プチップ実装を行なうようにしている。なお、突起電極
２と配線パターン３とを例えば超音波圧接にて接続する
こともできる。[0005] Next, as shown in FIG. 5B, the semiconductor chip 1 is mounted on the resin 5 such that the protruding electrodes 2 thereof are in contact with the corresponding wiring patterns 3 of the printed wiring board 4.
Next, as shown in FIG. 5C, the semiconductor chip 1 is pressurized and heated by the bonding tool 9 to electrically connect the protruding electrodes 2 and the wiring patterns 3 and to bond the semiconductor chip 1 via the resin 5. Then, the semiconductor chip 1 is flip-chip mounted. The protruding electrode 2 and the wiring pattern 3 can be connected by, for example, ultrasonic pressure welding.
【０００４】[0004]
【発明が解決しようとする課題】ところで、従来のフリ
ップチップ実装では、樹脂５が半導体チップ搭載部に一
点塗布されるので、半導体チップ１を搭載したとき、図
７Ａ，Ｂ及びＣの順に樹脂５が同心円状に広がる。この
ため、半導体チップ１の四隅部分に樹脂５がまわらなく
なり、接続信頼性が低下する恐れが生じやすい。By the way, in the conventional flip-chip mounting, the resin 5 is applied to the semiconductor chip mounting portion at one point. Therefore, when the semiconductor chip 1 is mounted, the resin 5 is applied in the order of FIGS. Spread concentrically. For this reason, the resin 5 does not cover the four corners of the semiconductor chip 1 and the connection reliability is likely to be reduced.
【０００５】また、半導体チップ１の四隅部分に樹脂５
がまわらないことを考慮して、多めに樹脂５を塗布する
ことが考えられる。しかし、この場合には、ボンディン
グツール９に大量の樹脂５が付着し、作業性の悪さが指
摘されていた。その上、本硬化後の樹脂はみ出し量が多
く、図７Ｃに示すように、周辺の実装部品搭載部分１０
まで樹脂５で覆われてしまい、部品実装しにくい、とい
う影響も生じるものであった。図７では配線パターン３
を省略して示す。[0005] Resin 5 is provided at four corners of semiconductor chip 1.
It is conceivable to apply a relatively large amount of the resin 5 in consideration of the fact that the resin 5 does not turn. However, in this case, a large amount of the resin 5 adhered to the bonding tool 9, and poor workability was pointed out. In addition, the amount of the resin that has completely hardened has protruded, and as shown in FIG.
This is covered with the resin 5, and it is difficult to mount components. In FIG. 7, wiring pattern 3
Is omitted.
【０００６】本発明は、上述の点に鑑み、良好なフリッ
プチップ実装を可能にした半導体チップ実装方法及びこ
れに用いる半導体チップ実装装置を提供するものであ
る。The present invention has been made in view of the above circumstances, and provides a semiconductor chip mounting method and a semiconductor chip mounting apparatus used for the same, which enable good flip chip mounting.
【０００７】[0007]
【課題を解決するための手段】本発明は、フリップチッ
プ実装における樹脂塗布工程で、半導体チップ搭載部に
接着樹脂を非円形状、または複数点状に塗布する。According to the present invention, in a resin application step in flip chip mounting, an adhesive resin is applied to a semiconductor chip mounting portion in a non-circular shape or a plurality of points.
【０００８】本発明では、接着樹脂を非円形状、または
複数点状に塗布することにより、半導体チップを配線基
板に搭載したときに、半導体チップの四隅まで均一に接
着樹脂が広がる。According to the present invention, by applying the adhesive resin in a non-circular shape or in a plurality of points, the adhesive resin spreads uniformly to the four corners of the semiconductor chip when the semiconductor chip is mounted on a wiring board.
【０００９】[0009]
【発明の実施の形態】本発明に係る半導体チップ実装方
法は、フリップチップ実装における樹脂塗布工程におい
て、配線基板の半導体チップ搭載部に接着樹脂を非円形
状、または複数点状に塗布する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a semiconductor chip mounting method according to the present invention, in a resin application step in flip chip mounting, an adhesive resin is applied to a semiconductor chip mounting portion of a wiring board in a non-circular shape or a plurality of points.
【００１０】本発明に係る半導体チップ実装装置は、接
着樹脂を注出するニードル先端が交差線状、または複数
分割されたに形成された樹脂塗布手段を備えた構成とす
る。ニードル先端としては、十字形状、または中心部と
複数のＬ字状部を有する分割形状に形成することが好ま
しい。[0010] The semiconductor chip mounting apparatus according to the present invention is provided with a resin coating means formed so that the tip of a needle for pouring the adhesive resin is cross-shaped or divided into a plurality of sections. The needle tip is preferably formed in a cross shape or a divided shape having a central portion and a plurality of L-shaped portions.
【００１１】以下、図面を参照して、本発明の実態の形
態を説明する。Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
【００１２】本実施の形態に係る半導体チップ実装装置
は、例えば、図１に示すように、接着樹脂、いわゆるペ
ースト状の樹脂１５を収容するシリンジ１７に先端形状
（いわゆる樹脂注出口の形状）１８ａが複数の線状を交
差させた形状（いわゆる交差線状）、本例では十字形状
のニードル１８を取り付けた樹脂塗布手段１６１、或い
は、図２に示すように、ペースト状の樹脂１５を収容す
るシリンジ１７に先端形状（いわゆる樹脂注出口の形
状）１９ａが複数分割された形状、本例では中心部に樹
脂を塗布できるように真っ直ぐに延びた部分と、四隅近
くにも樹脂を塗布できるように４本のＬ字状に湾曲した
部分とを有するニードル１９を取り付けた樹脂塗布手段
１６２を備えて成る。In the semiconductor chip mounting apparatus according to the present embodiment, for example, as shown in FIG. 1, a tip 17 (a so-called resin spout shape) 18a Contains a resin coating means 161 to which a plurality of linear shapes intersect (so-called crossed linear shape), a cross-shaped needle 18 in this example, or a paste-like resin 15 as shown in FIG. A shape in which a tip shape (a so-called resin spouting shape) 19a is divided into a plurality of portions on the syringe 17, in this example, a portion extending straight so that the resin can be applied to the central portion, and a portion near the four corners so that the resin can be applied. It comprises resin application means 162 to which a needle 19 having four L-shaped curved portions is attached.
【００１３】本実施の形態においても、高密度、高集積
の半導体集積回路（ＩＣ）、いわゆる裏面周辺に微小ピ
ッチで多数の微小突起電極２が設けられた半導体チップ
１のフリップチップ実装工程は、前述したと同様に、配
線パターン３が形成されたプリント配線基板４の半導体
チップ搭載部に、樹脂塗布手段１６〔１６１又は１６
２〕でペースト状の樹脂１５を塗布する。 次で、半導
体チップ５を、その突起電極２がプリント配線基板４の
対応する配線パターン３に対接するように樹脂５上に搭
載した後、ボンディングツール９により半導体チップ１
を加圧、加熱して突起電極２と配線パターン３とを電気
的に接続すると共に、半導体チップ１を樹脂１５を介し
て接着して、半導体チップ１のフリップチップ実装を行
う。なお、突起電極２と配線パターン３とを例えば超音
波圧接にて接続することもできる。Also in this embodiment, the flip-chip mounting process of a high-density, highly-integrated semiconductor integrated circuit (IC), that is, a semiconductor chip 1 provided with a large number of minute projection electrodes 2 at a minute pitch around the back surface, As described above, the resin coating means 16 [161 or 16] is provided on the semiconductor chip mounting portion of the printed wiring board 4 on which the wiring pattern 3 is formed.
In step 2), a paste-like resin 15 is applied. Next, the semiconductor chip 5 is mounted on the resin 5 such that the protruding electrodes 2 thereof are in contact with the corresponding wiring patterns 3 of the printed wiring board 4, and then the semiconductor chip 1 is
Is pressed and heated to electrically connect the protruding electrodes 2 and the wiring patterns 3, and the semiconductor chip 1 is bonded via the resin 15 to perform flip chip mounting of the semiconductor chip 1. The protruding electrode 2 and the wiring pattern 3 can be connected by, for example, ultrasonic pressure welding.
【００１４】図３は、図１のニードル先端形状１８ａを
十字形状とした樹脂塗布手段１６１を備えた実装装置を
用いてフリップチップ実装した場合を示す。図３Ａに示
すように、プリント配線基板４の半導体チップ搭載部
に、樹脂塗布手段１６１のニードル１８先端から樹脂１
５を塗布する。このとき、樹脂１５は、四隅の対角方向
に十字形状となるように塗布される。次に、半導体チッ
プ１をプリント配線基板４の搭載部分上に搭載し、ボン
ディングツール９によって半導体チップ１を加圧、加熱
してプリント配線基板４に電気的、機械的に接続する。
このとき、樹脂１５は、図３Ｂ、Ｃの順に示すように広
がり、半導体チップ１の四隅まで均一に充填される。図
３では、配線パターン３を省略して示す。FIG. 3 shows a case in which the needle tip 18a of FIG. 1 is flip-chip mounted using a mounting apparatus provided with a resin coating means 161 having a cross shape. As shown in FIG. 3A, the tip of the needle 18 of the resin coating means 161 is placed on the semiconductor chip mounting portion of the printed wiring board 4.
5 is applied. At this time, the resin 15 is applied so as to form a cross in the diagonal directions of the four corners. Next, the semiconductor chip 1 is mounted on the mounting portion of the printed wiring board 4, and the semiconductor chip 1 is pressed and heated by the bonding tool 9 to be electrically and mechanically connected to the printed wiring board 4.
At this time, the resin 15 spreads as shown in FIGS. 3B and 3C and is uniformly filled up to the four corners of the semiconductor chip 1. In FIG. 3, the wiring pattern 3 is omitted.
【００１５】図４は、図１のニードル先端形状１９ａを
５つの分割形状とした樹脂塗布手段１６２を備えた実装
装置を用いてフリップチップ実装した場合を示す。図４
Ａに示すように、プリント配線基板４の半導体チップ搭
載部に、樹脂塗布手段１６２のニードル１９先端から樹
脂１５を塗布する。このとき、樹脂１５は、中央の１点
と四隅近くの４点の計５ケ所に点形状に塗布される。次
に、半導体チップ１をプリント配線基板４の搭載部分上
に搭載し、ボンディングツール９によって半導体チップ
１を加圧、加熱してプリント配線基板４に電気的、機械
的に接続する。このとき、樹脂１５は、図４Ｂ、Ｃの順
に示すように広がり、半導体チップ１の四隅まで均一に
充填される。図４では、配線パターン３を省略して示
す。FIG. 4 shows a case in which the needle tip shape 19a of FIG. 1 is flip-chip mounted using a mounting apparatus provided with a resin coating means 162 having five divided shapes. FIG.
As shown in A, the resin 15 is applied to the semiconductor chip mounting portion of the printed wiring board 4 from the tip of the needle 19 of the resin applying means 162. At this time, the resin 15 is applied in a point shape at a total of five places, one at the center and four near the four corners. Next, the semiconductor chip 1 is mounted on the mounting portion of the printed wiring board 4, and the semiconductor chip 1 is pressed and heated by the bonding tool 9 to be electrically and mechanically connected to the printed wiring board 4. At this time, the resin 15 spreads as shown in FIGS. 4B and 4C and is uniformly filled up to the four corners of the semiconductor chip 1. In FIG. 4, the wiring pattern 3 is omitted.
【００１６】本実施の形態によれば、半導体チップ１の
フリップチップ実装工程において、樹脂１５を半導体チ
ップ１下に四隅まで均一に充填することができ、接続信
頼性を向上することができる。また、樹脂塗布の適量化
がし易く、ボンディングツールへの樹脂付着を少なくで
き、作業性を向上することができる。樹脂塗布量を調節
することにより、本硬化後の半導体チップ１周辺への樹
脂はみ出し量も少なくなり、半導体チップ周辺の実装部
品搭載部１０が樹脂１５で覆われることもなく、周辺の
部品実装が容易になる。According to the present embodiment, in the flip chip mounting step of the semiconductor chip 1, the resin 15 can be uniformly filled under the semiconductor chip 1 to four corners, and the connection reliability can be improved. In addition, the amount of resin applied can be easily adjusted, resin adhesion to the bonding tool can be reduced, and workability can be improved. By adjusting the amount of resin applied, the amount of resin that has protruded to the periphery of the semiconductor chip 1 after the main curing is reduced, and the mounting component mounting portion 10 around the semiconductor chip is not covered with the resin 15, so that the mounting of peripheral components can be performed. It will be easier.
【００１７】[0017]
【発明の効果】本発明の半導体チップ実装方法によれ
ば、フリップチップ実装工程において、接着樹脂を半導
体チップ下に四隅まで均一に充填することができ、半導
体チップの接続信頼性を向上することができる。また、
ボンディングツールへの樹脂付着を少なくできる。その
上、本硬化後の半導体チップ周辺へのはみ出し量も少な
くなり、半導体チップ周辺の部品実装が容易になる。According to the semiconductor chip mounting method of the present invention, in the flip chip mounting process, the adhesive resin can be uniformly filled up to the four corners under the semiconductor chip, and the connection reliability of the semiconductor chip can be improved. it can. Also,
Resin adhesion to the bonding tool can be reduced. In addition, the amount of protrusion to the periphery of the semiconductor chip after the main curing is reduced, and the component mounting around the semiconductor chip is facilitated.
【００１８】本発明の半導体チップ実装装置によれば、
フリップチップ実装工程において、配線基板の半導体チ
ップ搭載部の中央及び四隅近くに接着樹脂を塗布するこ
とができる。従って、接着樹脂をはみ出すことなく、半
導体チップ下に均一に充填することができ、また、半導
体チップ周辺の部品実装が容易になる。ニードル先端を
十字形状、または中心部と複数のＬ字状部を有する分割
形状にするときは、接着樹脂を半導体チップ搭載部の中
央及び四隅近くに良好に塗布することができる。According to the semiconductor chip mounting apparatus of the present invention,
In the flip chip mounting step, the adhesive resin can be applied to the center and near the four corners of the semiconductor chip mounting portion of the wiring board. Therefore, the adhesive resin can be uniformly filled under the semiconductor chip without protruding, and components can be easily mounted around the semiconductor chip. When the tip of the needle has a cross shape or a divided shape having a central portion and a plurality of L-shaped portions, the adhesive resin can be applied favorably to the center and near the four corners of the semiconductor chip mounting portion.
【図１】本発明の半導体チップ実装装置に用いる樹脂塗
布手段の一実施の形態を示す構成図である。FIG. 1 is a configuration diagram showing one embodiment of a resin coating unit used in a semiconductor chip mounting device of the present invention.
【図２】本発明の半導体チップ実装装置に用いる樹脂塗
布手段の他の実施の形態を示す構成図である。FIG. 2 is a configuration diagram showing another embodiment of a resin coating unit used in the semiconductor chip mounting device of the present invention.
【図３】Ａ〜Ｃ 図１の樹脂塗布手段を用いたときの、
本発明の半導体チップ実装方法の一実施の形態を示す工
程図である。FIGS. 3A to 3C show the results of using the resin coating means of FIG.
FIG. 3 is a process chart showing one embodiment of a semiconductor chip mounting method of the present invention.
【図４】Ａ〜Ｃ 図２の樹脂塗布手段を用いたときの、
本発明の半導体チップ実装方法の他の実施の形態を示す
工程図である。FIGS. 4A to 4C show the results of using the resin coating means of FIG.
It is a flowchart showing another embodiment of the semiconductor chip mounting method of the present invention.
【図５】Ａ〜Ｃ 半導体チップ（ＩＣチップ）のフリッ
プチップ実装工程図である。5A to 5C are flip-chip mounting process diagrams of semiconductor chips (IC chips).
【図６】従来の樹脂塗布手段の構成図である。FIG. 6 is a configuration diagram of a conventional resin application unit.
【図７】Ａ〜Ｃ 図６の従来の樹脂塗布手段を用いたと
きの、半導体チップのフリップチップ実装工程図であ
る。7A to 7C are flip-chip mounting process diagrams of a semiconductor chip when the conventional resin coating unit of FIG. 6 is used.
１・・・半導体チップ、２・・・突起電極、３・・・配
線パターン、４・・・プリント配線基板、１０・・・周
辺部品搭載部分、１５・・・樹脂、１６〔１６１，１６
２〕・・・樹脂塗布手段、１７・・・シリンジ、１８、
１９・・・ニードル、１８ａ、１９ａ・・・ニードル先
端形状DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Projection electrode, 3 ... Wiring pattern, 4 ... Printed wiring board, 10 ... Peripheral component mounting part, 15 ... Resin, 16 [161, 16]
2] ... resin application means, 17 ... syringe, 18,
19: Needle, 18a, 19a: Needle tip shape
Claims (3)
程において、 配線基板の半導体チップ搭載部に接着樹脂を非円形状、
または複数点状に塗布することを特徴とする半導体チッ
プ実装方法。In a resin application step in flip-chip mounting, an adhesive resin is applied to a semiconductor chip mounting portion of a wiring board in a non-circular shape,
Alternatively, a method for mounting a semiconductor chip, wherein the method is applied in a plurality of points.
線状、または複数分割された形状に形成された樹脂塗布
手段を備えて成ることを特徴とする半導体チップ実装装
置。2. A semiconductor chip mounting apparatus comprising a resin coating means having a tip of a needle for pouring an adhesive resin having a crossed line shape or a divided shape.
心部と複数のＬ字状部を有する分割形状に形成されて成
ることを特徴とする請求項１に記載の半導体チップ実装
装置。3. The semiconductor chip mounting device according to claim 1, wherein the tip of the needle is formed in a cross shape or a divided shape having a central portion and a plurality of L-shaped portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000062258A JP2001250845A (en) | 2000-03-07 | 2000-03-07 | Method and device for mounting semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000062258A JP2001250845A (en) | 2000-03-07 | 2000-03-07 | Method and device for mounting semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001250845A true JP2001250845A (en) | 2001-09-14 |
Family
ID=18582290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000062258A Pending JP2001250845A (en) | 2000-03-07 | 2000-03-07 | Method and device for mounting semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001250845A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120993A (en) * | 2004-10-25 | 2006-05-11 | Toppan Forms Co Ltd | Ic chip, and sheet with ic chip mounted thereon |
| WO2007046416A1 (en) * | 2005-10-20 | 2007-04-26 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting method |
| JP2017511609A (en) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | Method for aligning surface mount packages for thermal improvement |
-
2000
- 2000-03-07 JP JP2000062258A patent/JP2001250845A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120993A (en) * | 2004-10-25 | 2006-05-11 | Toppan Forms Co Ltd | Ic chip, and sheet with ic chip mounted thereon |
| WO2007046416A1 (en) * | 2005-10-20 | 2007-04-26 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting method |
| US8025205B2 (en) | 2005-10-20 | 2011-09-27 | Panasonic Corporation | Electronic component mounting method |
| JP2017511609A (en) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | Method for aligning surface mount packages for thermal improvement |
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