JP2000133662A - Chip size package and method for resin-sealing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of a chip size package in which a given hole is provided on an electronic circuit board, and a method for resin-sealing by which a resin is applied through the hole. SOLUTION: In this method for resin-sealing, a chip size package in which the electrode of an IC chip 1 is connected with an electrode of an electronic circuit board 2 having a square or round hole with the predetermined dimension 7 via a microbump is used. The chip size package is placed on a horizontal plane so as to make the electronic circuit board 2 upward, and a thermosetting resin 3 is applied to the surface of the IC chip through the hole of the electronic circuit board 2. As a result, the gap between the IC chip and the electronic circuit board and the surface of the IC chip can be sealed with resin by one applying operation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for mounting an IC chip on an electronic circuit board, and more particularly to a structure of a chip size package and a method of sealing a chip size package with a resin.

[0002]

2. Description of the Related Art In recent years, in the field of electronics, as electronic components have become faster and more highly integrated, a method of directly mounting an IC chip on an electronic circuit board has become mainstream. The mounting method used is adopted. In this package mounting method, resin sealing is performed because the active surface of the IC chip and the joint between the electrode of the IC chip and the electrode of the electronic circuit board are exposed to the atmosphere. When filling the gap with a thermosetting resin, there is a demand for efficient and highly reliable resin sealing.

In order to respond to such a demand, in a conventional resin sealing method, as shown in FIGS.
The chip size package bonded to the electrode is tilted by about 15 degrees from the horizontal plane, and the thermosetting resin 3 filled in the syringe 4 is tilted by about 15 degrees while applying a predetermined amount by the air dispenser 5. As shown in FIG. 6, a thermosetting resin 3 is applied to a gap between one side of the IC chip and the electronic circuit board 2 so as to trace at a constant speed. Next, the thermosetting resin 3 applied to the gap between one side of the IC chip 1 and the electronic circuit board 2 is left for a predetermined time until it sufficiently flows into the gap between the IC chip 1 and the electronic circuit board 2.
By repeating the above coating operation two to three times, the IC
A thermosetting resin is filled between the chip 1 and the electronic circuit board 2.

[0004]

However, according to the structure of the chip size package and the resin sealing method as described above, the space between the IC chip 1 and the electronic circuit board 2 is generally 5 mm.
Since it is very small as 0 μm to 80 μm, in order to fill a thermosetting resin between the IC chip 1 and the electronic circuit board 2,
The above coating operation has to be repeated two or three times, which requires a long time for resin encapsulation. If the production of the chip size package increases, the production cannot be increased.

[0005] Further, with the IC chip facing upward, I
In order to apply a thermosetting resin on the gap between the C chip and the electronic circuit board, the size of the electronic circuit board must be larger than that of the IC chip. The present invention aims to reduce the time required for resin sealing in the manufacture of a chip size package and to make the size of an electronic circuit board equal to the size of an IC chip. It is intended to provide a stopping method.

[0006]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention relates to a chip-size package in which electrodes of an IC chip and electrodes of an electronic circuit board are joined by micro-bumps. A resin sealing hole having a size is provided. According to the present invention,
Using a chip-size package in which the electrodes of an IC chip and the electrodes of an electronic circuit board having a predetermined size of a resin sealing hole at the center are joined by microbumps, the resin sealing provided at the center of the electronic circuit board Thermosetting resin through hole
By applying to the chip surface, the filling distance of the thermosetting resin can be shortened, and the resin sealing can be reliably performed by one coating operation, and the resin sealing time can be reduced.

Further, in a resin sealing method for a chip size package, an electrode of an IC chip and an electrode of an electronic circuit board are joined by a microbump, and a thermosetting resin is poured into a gap between the IC chip and the electronic circuit board. A resin sealing hole of a predetermined size is provided in the center of the substrate, and a thermosetting resin is sequentially applied from the resin sealing hole with the electronic circuit board facing upward.

According to the present invention, since the thermosetting resin is applied with the electronic circuit board having the resin sealing hole facing upward, the size of the electronic circuit board can be made equal to the size of the IC chip.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a chip-size package in which electrodes of an IC chip and electrodes of an electronic circuit board are joined by micro-bumps. This is a chip size package characterized by providing a resin sealing hole of a size, and a micro bump connects an electrode of an IC chip and an electrode of an electronic circuit board having a resin sealing hole of a predetermined size at a center portion. The thermosetting resin is applied to the IC chip surface from the resin sealing hole provided in the center of the electronic circuit board using the bonded chip size package, so that the thermosetting resin is filled between the IC chip and the electronic circuit board. The distance can be shortened, the resin sealing can be reliably performed by one coating operation, and the resin sealing time can be shortened.

According to a second aspect of the present invention, there is provided a chip size package in which electrodes of an IC chip and electrodes of an electronic circuit board are joined by micro-bumps, wherein a plurality of resin sealing holes of a predetermined size are provided on the electronic circuit board. A chip size package characterized by being provided with a chip size package in which electrodes of an IC chip and electrodes of an electronic circuit board having a plurality of resin sealing holes of a predetermined size are joined by microbumps. By sequentially applying the thermosetting resin to the plurality of holes of the circuit board, there is an effect that a large chip size package can be resin-sealed in a short time.

According to a third aspect of the present invention, there is provided a chip size package characterized in that the resin sealing hole provided in the electronic circuit board is rectangular or circular. It has the same effect. According to a fourth aspect of the present invention, there is provided a chip size package characterized in that a side surface of a resin sealing hole provided in an electronic circuit board is an inclined surface, and the resin sealing hole provided in the electronic circuit board is provided. By providing a slope on the side surface, the thermosetting resin can be smoothly poured into the gap between the IC chip and the electronic circuit board.

According to a fifth aspect of the present invention, there is provided a resin for a chip size package, wherein an electrode of an IC chip and an electrode of an electronic circuit board are joined by a microbump, and a thermosetting resin is poured into a gap between the IC chip and the electronic circuit board. In the sealing method, a resin sealing hole of a predetermined size is provided in a central portion of the electronic circuit board, and a thermosetting resin is applied from the resin sealing hole with the electronic circuit board facing upward. A resin sealing method, in which a thermosetting resin is applied in a state where an electronic circuit board having a resin sealing hole is on the upper surface, and thus has an effect of making the size of the electronic circuit board equal to the size of an IC chip. .

According to a sixth aspect of the present invention, there is provided a resin for a chip size package, wherein an electrode of an IC chip and an electrode of an electronic circuit board are joined by a microbump, and a thermosetting resin is poured into a gap between the IC chip and the electronic circuit board. In the sealing method, a plurality of resin sealing holes of a predetermined size are provided on the electronic circuit board, and the thermosetting resin is sequentially applied from the plurality of resin sealing holes with the electronic circuit board facing upward. This is a resin sealing method characterized by the same action as the second and fifth aspects of the invention.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a structure of a chip size package and a method of applying a resin thereto. FIG. 2 is a perspective view showing a structure of a chip size package and a method of applying a resin thereto. In the figure, 1
Is an IC chip, 2 is an electronic circuit board, 3 is a thermosetting resin filled in a syringe 4, 5 is an air dispenser, 6
Is a micro-bump that joins the IC chip 1 and the electronic circuit board 2, and 7 is a square or circular hole provided at a central portion of the electronic circuit board 2 with a predetermined size.

The present embodiment is characterized in that a hole 7 having a predetermined size is provided in the center of the electronic circuit board 2 and resin sealing is performed with the electronic circuit board 2 facing upward. That is, as shown in FIGS. 1 and 2, a chip-size package in which electrodes of an electronic circuit board 2 having a square or circular hole 7 of a predetermined size in the center portion are bonded to an IC chip 1 by microbumps 6 is provided. The circuit board 2 is placed on a horizontal surface such that the thermosetting resin 3 in the syringe 4 is controlled by an air dispenser 5.
Is applied to the IC chip surface from the hole 7 of the electronic circuit board 2.

According to the present embodiment, since the thermosetting resin 3 is diffused and filled between the IC chip 1 and the electronic circuit board from the hole 7 provided at the center of the electronic circuit board 2, the thermosetting resin 3 is formed. The diffusion and filling distance of the resin is shorter than that of the conventional chip size package, and the gap between the IC chip and the electronic circuit board and the IC chip surface can be securely sealed with a single coating operation.

FIG. 3 is a cross-sectional view showing the structure of a chip size package in which an inclined surface 8 is provided on the side surface of the hole 7 of the electronic circuit board 2 and a method of applying the resin. As shown in FIG. 3, by providing a slope 8 on the side surface of the hole 7 of the electronic circuit board 2, the thermosetting resin applied to the IC chip surface from the hole 7 of the electronic circuit board 2 is transferred to the IC chip and the electronic circuit. It can be poured smoothly into the gap between the substrates.

FIG. 4 is a perspective view showing a structure of a chip size package having a plurality of holes 7 formed in the electronic circuit board 2 and a method of applying a resin. Multiple (4 in FIG. 4)
Chip-size package in which electrodes of an electronic circuit board 2 having holes 7 of a square or circular shape and a predetermined size are bonded to an IC chip 1 by microbumps, and placed on a horizontal surface such that the electronic circuit board 2 is on top. The thermosetting resin 3 in the syringe 4 is sequentially applied to a plurality of holes of the electronic circuit board 2 by controlling the application amount by the air dispenser 5 to install a large chip size package in a short time. It can be resin-sealed.

[0019]

According to the chip size package and the resin sealing method of the present invention, as is apparent from the above description, the electrode of the electronic circuit board having the predetermined size resin sealing hole at the center. A thermosetting resin is applied to the IC chip surface through a resin sealing hole provided at the center of the electronic circuit board using a chip size package in which the IC chip is bonded to the electrodes of the IC chip by micro bumps. The filling distance of the thermosetting resin between the substrates is shortened, the resin sealing can be reliably performed by one coating operation, and the resin sealing time can be shortened.

Further, by providing a slope on the side surface of the resin sealing hole provided on the electronic circuit board, the thermosetting resin can be smoothly poured into the gap between the IC chip and the electronic circuit board. In addition, using a chip size package in which electrodes of an IC chip and electrodes of an electronic circuit board having a plurality of resin sealing holes of a predetermined size are joined by microbumps, a plurality of thermosetting resin are provided in the plurality of holes of the electronic circuit board. , A large chip size package can be resin-sealed in a short time.

Further, since the thermosetting resin is applied to the active surface of the IC chip through the hole with the electronic circuit board having the resin sealing hole on the upper surface, the size of the electronic circuit board is reduced. Can be equivalent to size.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a structure of a chip size package and a resin sealing method thereof according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a structure of a chip size package and a resin sealing method thereof according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a structure of a chip size package and a resin sealing method thereof according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a structure of a chip size package and a resin sealing method thereof according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a structure of a conventional chip size package and a resin sealing method thereof.

FIG. 6 is a perspective view showing a structure of a conventional chip size package and a resin sealing method thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Electronic circuit board 3 Thermosetting resin 4 Syringe 5 Air dispenser 6 Micro bump 7 Hole 8 Incline

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hiroyuki Kiyomura 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. No. (72) Inventor Kenji Takahashi 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5F061 AA01 BA03 CA05

Claims (6)

[Claims] 1. A chip size package in which electrodes of an IC chip and electrodes of an electronic circuit board are joined by micro-bumps, wherein a resin sealing hole having a predetermined size is provided at a central portion of the electronic circuit board. Chip size package. 2. A chip size package in which electrodes of an IC chip and electrodes of an electronic circuit board are joined by micro-bumps, wherein a plurality of resin sealing holes of a predetermined size are provided on the electronic circuit board. Chip size package. 3. The resin sealing hole provided in the electronic circuit board is square or circular.
The described chip size package. 4. The chip size package according to claim 1, wherein a side surface of the resin sealing hole provided in the electronic circuit board is an inclined surface. 5. A resin sealing method for a chip-size package, comprising joining an electrode of an IC chip and an electrode of an electronic circuit board by a microbump and pouring a thermosetting resin into a gap between the IC chip and the electronic circuit board. A resin sealing method comprising: providing a resin sealing hole of a predetermined size in a central portion of a substrate; and applying a thermosetting resin from the resin sealing hole with the electronic circuit board facing upward. 6. A resin sealing method for a chip-size package, comprising joining an electrode of an IC chip and an electrode of an electronic circuit board by a microbump and pouring a thermosetting resin into a gap between the IC chip and the electronic circuit board. A resin sealing method comprising: providing a plurality of resin sealing holes of a predetermined size on a substrate; and sequentially applying a thermosetting resin from the plurality of resin sealing holes with the electronic circuit board facing upward. .