JPH09232385A - Method for joining electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need of forming a bump and to inexpensively and easily join an electronic part to a substrate by forming an adhesive layer on the main face of the electronic part, temporarily fitting conductors to positions matched with electrodes in the adhesive layer and press-fixing the conductors to circuit patterns. SOLUTION: The electronic part 1 having the electrodes 2 on the main face are joined with the substrate 6 having the circuit patterns 7 facing the electrodes 2. The adhesive layer 3 is formed on the main face of the electronic part 1 and the conductors 5 are temporarily fitted to the positions matched with the electrodes 2 in the adhesive layer 3. Then, the conductors 5 are press-fixed to the circuit patterns 7, and the electrodes 2 and the circuit patterns 7 are electrically connected by the conductors 5. The anisotropic conductor is used as the adhesive layer 3, and the materials of gold or solder are used as the conductors 5, for example. The conductors 5 are adjusted to the positions of the electrodes 2 and they are held with the recessed parts 4a of a positioning table 4, and the conductors 5 are temporarily fitted to the adhesive layer 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining electronic components in which a conductor is interposed between a circuit pattern on a substrate and an electrode of an electronic component.

[0002]

2. Description of the Related Art In recent years, a method of using a bump formed of a conductor has been carried out as a method of joining an electronic component to a substrate.

In this structure, first, a conductor is fixed to either the electrode of the electronic component or the circuit pattern of the substrate,
A bump (protruding electrode) is formed. Then, this bump is electrically joined to the other electrode via an adhesive or an anisotropic conductor.

[0004]

However, in this case, there is a problem in that the cost is increased accordingly because a step only for forming the bump is required.
The wire bump method is known as a relatively inexpensive method for forming bumps. In this method as well, the balls formed at the tip of the wire are pressed one by one against the electrodes, and then the wire is formed into a ball. It requires a process of tearing it off, and it is hard to say that joining can be performed easily.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component bonding method capable of easily bonding an electronic component to a substrate without forming bumps and at low cost.

[0006]

The method of joining electronic parts according to the present invention comprises a step of forming an adhesive layer on the main surface of an electronic part,
The method includes the steps of temporarily attaching a conductor to a position of the adhesive layer that corresponds to the electrode, and crimping the conductor to the circuit pattern to electrically connect the electrode and the circuit pattern with the conductor.

[0007]

According to the first aspect of the present invention, first, the conductor is not semi-permanently fixed to the electrode of the electronic component, but is simply temporarily attached to the adhesive layer. Therefore, as compared with the conventional technique in which all the bumps are fixed to the electrodes, it can be completed easily and in a short time. Next, the conductor is pressure-bonded to the circuit pattern of the substrate, and at this time, the conductor is
It is sandwiched between the electrodes of electronic parts and the circuit pattern of the board,
When the conductor is pressure-bonded to the circuit pattern, the conductor is also pressure-bonded to the electrode of the electronic component at the same time, so that the electrode and the circuit pattern can be electrically connected.

Next, an electronic component joining method according to the first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a process explanatory view of an electronic component joining method according to the first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes an electronic component having a plurality of electrodes 2 on a surface (main surface) having an integrated circuit.

First, the adhesive layer 3 is formed on the main surface of the electronic component 1. In this embodiment, since an anisotropic conductor (ACF) is used as the adhesive layer 3, it is only necessary to attach the anisotropic conductor to the main surface of the electronic component 1 (Fig. 1 (a)). 3a
Is an adhesive, and 3b is a particle which is present in the adhesive 3 in a dotted manner and has conductivity. Here, as the adhesive layer 3, a non-conductive adhesive may be used in addition to the anisotropic conductor. Further, as will be described later, if the conductor 5 can be temporarily attached, various changes such as a paste-like one and a tape-like one may be made.

Next, as shown in FIG. 1B, the conductor 5 is connected to the electrode 2 by the recess 4a of the positioning table 4 or the like.
The electric conductor 5 is temporarily attached to the adhesive layer 3 in accordance with the position. Also here, the upper part of the conductor 5 is covered with the adhesive layer 3
It only needs to be attached to, and it can be done at a significantly lower cost and in a shorter time than the conventional technology (bump formation).

Here, a material such as gold or solder can be used as the conductor 5, and the shape thereof may be variously changed, such as a rectangular parallelepiped or a cube, instead of the spherical shape shown in the drawing.

Next, in this embodiment, as shown in FIG. 1 (c), the circuit pattern 7 side of the substrate 6 faces upward, and the same adhesive layer 3 as described above is attached to this surface. However, the adhesive layer 3 on the substrate 6 may be omitted. Then, the electrode 2 of the electronic component 1 is aligned with the electrode 7 of the substrate 6, and the conductor 5 is pressure-bonded to the circuit pattern 7.

At this time, as shown in FIG. 1D, the conductor 5 is sandwiched between the electrode 2 and the circuit pattern 7. Therefore, when this crimping is performed, the conductor 5 becomes the electrode 2 and the circuit pattern 7.
The electrode 2 and the circuit pattern 7 are electrically connected to each other by crimping. At the time of this pressure bonding, the electronic component 1 is pressed against the substrate 6 side and heated.

In parallel with this, the adhesive layer 3 is cured. The procedure for curing is performed according to the property of the adhesive layer 3.
Specifically, if the adhesive layer 3 is an ultraviolet curable resin, it may be irradiated with ultraviolet rays, and if it is a thermosetting resin, it may be heated. In short, it is sufficient that the electronic component 1 can be fixed to the substrate 6 by curing the adhesive layer 3.

Next, with reference to FIG. 2, an electronic component joining method according to the second embodiment of the present invention will be described. The present embodiment is different from the above-mentioned one in that the conductor 5 is temporarily attached to the substrate 6 side.

That is, first, with the surface of the substrate 6 on which the circuit pattern 7 is formed facing upward (FIG. 2A), the adhesive layer 3 is formed.
To be formed. Next, the conductor 5 is positioned and attracted by the suction head 8 having the suction path 8a (FIG. 2B), and is transferred onto the adhesive layer 3 (FIG. 2C). As a result, the conductor 5 is temporarily attached to the adhesive layer 3.

Next, the adhesive layer 3 is attached to the main surface of the electronic component 1, and the conductor 5 is pressure-bonded as shown in FIG. 2 (d).
The procedure of this crimping is similar to that of the first embodiment. In this embodiment, the sticking of the adhesive layer 3 to the electronic component 1 may be omitted.

[0019]

According to the method of joining electronic components of the present invention, a step of forming an adhesive layer on the main surface of an electronic component, a step of temporarily attaching an electric conductor to a position of the adhesive layer that corresponds to an electrode, and a circuit of the electric conductor Since it includes the step of pressure-bonding to the pattern and electrically connecting the electrode and the circuit pattern by the conductor, it is not necessary to form a bump on the electrode of the electronic component.
As a result, the electronic components can be joined at low cost and in a short time.

[Brief description of drawings]

FIG. 1A is a process explanatory diagram of an electronic component bonding method according to a first embodiment of the present invention. FIG. 1B is a process explanatory diagram of an electronic component bonding method according to a first embodiment of the present invention. Process explanatory drawing of the electronic component joining method in the 1st Embodiment of this invention (d) Process explanatory drawing of the electronic component joining method in the 1st Embodiment of this invention

2A is a process explanatory view of an electronic component bonding method according to a second embodiment of the present invention. FIG. 2B is a process explanatory diagram of an electronic component bonding method according to a second embodiment of the present invention. Process explanatory drawing of electronic component joining method in 2nd Embodiment of invention (d) Process explanatory drawing of electronic component joining method in 2nd Embodiment of this invention

[Explanation of symbols]

 1 Electronic Component 2 Electrode 3 Adhesive Layer 5 Conductor 6 Substrate 7 Circuit Pattern

Claims (6)

[Claims] 1. A method of joining an electronic component having an electrode on a main surface and a substrate having a circuit pattern facing the electrode, the method comprising forming an adhesive layer on the main surface of the electronic component. And a step of temporarily attaching a conductor to the adhesive layer at a position corresponding to the electrode, and the conductor is pressure-bonded to the circuit pattern to electrically connect the electrode and the circuit pattern by the conductor. A method for joining electronic components, comprising: 2. The electronic component joining method according to claim 1, wherein an adhesive layer is formed on the substrate. 3. The method for joining electronic components according to claim 1, further comprising the step of curing the adhesive layer when or after the conductor is pressure-bonded to the circuit pattern. 4. A method of joining an electronic component having an electrode on its main surface and a substrate having a circuit pattern facing the electrode, the method comprising: forming an adhesive layer on the substrate; A step of temporarily attaching a conductor to a position of the layer corresponding to the circuit pattern; and an electrode of the electronic component is pressure-bonded to the conductor to electrically connect the electrode and the circuit pattern by the conductor. A method for joining electronic components, comprising: 5. The method of joining electronic parts according to claim 4, wherein an adhesive layer is formed on the main surface of the electronic parts. 6. The method of joining electronic components according to claim 4, further comprising the step of curing the adhesive layer when or after pressure-bonding the electrodes of the electronic component to the conductor.