JP2002026071A - Semiconductor device and its manufacturing method, circuit board, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device which can efficiently be manufactured and has a semiconductor chip with high reliability and its manufacturing method, a circuit board, and electronic equipment. SOLUTION: This manufacturing method for the semiconductor device includes a stage where the semiconductor chip 10 having an adhesive tape 20 stuck on one surface is fitted having the opposite surface from the mentioned one surface opposite a specific mounting area by being pressed across the adhesive tape 20 and the semiconductor chip 10 is peeled off the adhesive tape 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device and a method of manufacturing the same, a circuit board, and an electronic device.

[0002]

BACKGROUND OF THE INVENTION In a method of manufacturing a semiconductor device, there are several steps between cutting a semiconductor chip into individual pieces and mounting the chip on a substrate. For example, in the related art, a step of detaching a cut semiconductor chip attached to a dicing tape with a pickup tool, storing the semiconductor chip in a tray, and then mounting the semiconductor chip on a substrate again with a bonding tool is performed. Was. according to this,
Because of the large number of steps, handling of the semiconductor chip was complicated. In addition, a tool for handling a semiconductor chip was required for each process.

An object of the present invention is to solve this problem, and an object of the present invention is to provide a semiconductor device having a semiconductor chip which can be manufactured efficiently and has high reliability, a method of manufacturing the same, a circuit board, and electronic equipment. .

[0004]

(1) In a method of manufacturing a semiconductor device according to the present invention, a semiconductor chip having one surface adhered to an adhesive tape is pressed through the adhesive tape to a predetermined mounting position. A step of attaching the semiconductor chip to the region with the surface opposite to the one surface facing the other, and peeling the semiconductor chip from the adhesive tape.

According to the present invention, the semiconductor chip can be attached to a predetermined mounting area and peeled off from the adhesive tape by one step of pressing the semiconductor chip. That is, the semiconductor chip attached to the adhesive tape can be mounted in a predetermined mounting area in a small number of steps. Furthermore, since the semiconductor chip is pressed through the adhesive tape,
The semiconductor chip can be pressed without damaging the semiconductor chip using the adhesive tape as a protective member.

(2) In this method of manufacturing a semiconductor device, the mounting area may be a mounting area of a substrate on which a wiring pattern is formed.

According to this, 1 for pressing the semiconductor chip
Attach the semiconductor chip to the board by one process,
And it can be peeled off from the adhesive tape.

(3) In this method of manufacturing a semiconductor device, the adhesive tape is attached to the surface of the semiconductor chip opposite to the surface on which the electrodes are formed, and the semiconductor chip is attached in a step of attaching the semiconductor chip. The chip may be mounted with the surface on the side where the electrodes are formed facing the mounting area.

Thus, the semiconductor chip can be mounted on the mounting area without turning over the semiconductor chip, with the surfaces on which the electrodes are formed facing each other.

(4) In the method of manufacturing a semiconductor device, in the step of attaching the semiconductor chip, the semiconductor chip may be bonded to the mounting area via a resin.

Thus, the semiconductor chip can be easily mounted on the mounting area.

(5) In the method of manufacturing a semiconductor device, in the step of attaching the semiconductor chip, an anisotropic conductive material in which conductive particles are dispersed in an adhesive may be used as the resin.

Thus, for example, the semiconductor chip can be electrically connected to the substrate by using the resin for attaching the semiconductor chip to the mounting area.

(6) In the method of manufacturing a semiconductor device, in the step of attaching the semiconductor chip, after the step of temporarily bonding the semiconductor chip to the mounting area and the step of peeling the semiconductor chip from the adhesive tape, the step of attaching the adhesive tape And excluding the step of pressing the semiconductor chip on the mounting area.

By pressing the semiconductor chip again, the semiconductor chip can be more securely mounted on the mounting area.

(7) In the method of manufacturing a semiconductor device, in the step of pressing the semiconductor chip on the mounting area, the semiconductor chip is pressed by a tool having a heater, and the electrode of the semiconductor chip and the mounting of the semiconductor chip are mounted. The wiring pattern on the region may be electrically connected.

Thus, for example, even when it is necessary to heat the semiconductor chip to the mounting area at a high temperature, the semiconductor chip can be mounted on the mounting area by pressing again without the adhesive tape.

(8) A semiconductor device according to the present invention is manufactured by the above-described method for manufacturing a semiconductor device.

(9) A circuit board according to the present invention has the above semiconductor device mounted thereon.

(10) An electronic apparatus according to the present invention includes the above semiconductor device.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. However, the present invention
The present invention is not limited to the following embodiment.

(First Embodiment) FIG. 1 is a view showing a method of manufacturing a semiconductor device according to the present embodiment, and FIG. 2 is a view showing an example of the semiconductor device according to the present embodiment.

In this embodiment, a semiconductor chip 10 is prepared. The semiconductor chip 10 may be formed by cutting a semiconductor wafer (not shown) into individual pieces. The outer shape of the semiconductor chip 10 is often rectangular, but is not limited to this. The semiconductor chip 10 has a plurality of electrodes 12. The electrode 12 becomes an electrode of an integrated circuit formed inside the semiconductor chip 10. The electrode 12 is connected to the semiconductor chip 10
May be formed on the surface having the integrated circuit (active surface). The electrodes 12 may be arranged at the end of the surface of the semiconductor chip 10 or at the center. The electrode 12 is formed of, for example, aluminum. Note that a passivation film (not shown) may be formed on the surface of the semiconductor chip 10 on which the electrode 12 is formed.

A bump 14 may be formed on the electrode 12. The bump 14 is made of a solder ball, a gold wire ball,
It is formed by gold plating or the like. The bump 14
It may be already formed in the state of a semiconductor wafer. Nickel, chromium, titanium, or the like may be added between the electrode 12 and the bump 14 as a diffusion preventing layer for the bump metal.
The bumps 14 can improve the electrical connection with the outside. Alternatively, without forming the bumps 14,
The electrode 12 of the semiconductor chip 10 may be a connection portion with the outside.

As shown in FIG. 1, the semiconductor chip 10
One surface is adhered to the adhesive tape 20. For example, the adhesive tape 20 may be used when cutting a semiconductor wafer. Specifically, the adhesive tape 20
May be attached to the surface of the semiconductor wafer on the side opposite to the side to be cut, and may be directly attached to the plurality of semiconductor chips 10 after cutting. The surface of the semiconductor wafer having the electrode 12 is often a cut surface,
In this case, as shown in FIG. 1, the adhesive tape 20 is attached to the surface of the semiconductor chip 10 opposite to the surface on which the electrodes 12 are formed. In this case, the adhesive tape 20 may be referred to as a dicing tape.

Alternatively, the adhesive tape 20 may be attached to the surface of the semiconductor chip 10 on which the electrodes 12 are formed. The adhesive tape 20 may be affixed to the semiconductor chip 10 after cutting the semiconductor wafer, for example.

It is preferable that the adhesive tape 20 is one that can securely adhere the semiconductor chips 10 diced by cutting the semiconductor wafer, for example, and can easily peel the semiconductor chips 10 in a later step. . Adhesive tape 2
0 may have a property that its adhesive strength is weakened by applying a predetermined energy. In this case, a predetermined energy may be applied before the semiconductor chip 10 is peeled off from the adhesive tape 20 so that the semiconductor chip 10 can be easily peeled off. As an example, the adhesive tape 20 may have a so-called ultraviolet curable property in which the adhesive strength is weakened by irradiating the ultraviolet ray. Alternatively, the adhesive tape 20 may have a property such as thermosetting property or thermoplastic property, but is not limited thereto.

As shown in FIG. 1, the semiconductor chip 10 is
Pressing through the adhesive tape 20. Specifically, the surface of the semiconductor chip 10 facing the adhesive tape 20 is pressed via the adhesive tape 20. Using the tool 30,
Part or all of the surface of the semiconductor chip 10 may be pressed. In this case, the adhesive tape 20 may be pressed by the ring 32 from the side of the semiconductor chip 10, and the semiconductor chip 10 may be pressed by the tool 30 from the opposite side. According to this, since the pressing is performed by the tool 30 via the adhesive tape 20, the semiconductor chip 10 can be pressed without damaging the semiconductor chip 10 using the adhesive tape 20 as a protective member. In particular, when pressing the surface of the semiconductor chip 10 on the side where the electrodes 12 are formed, the pressing can be performed without damaging the active surface of the semiconductor chip 10.

The part of the tool 30 that presses the semiconductor chip 10 is preferably a flat surface. Thereby, the semiconductor chip 10 can be pressed without breaking through the adhesive tape 20. In addition, this allows the surface of the semiconductor chip 10 to be pressed uniformly. The tool 30 may be, for example, a bonding tool used when performing face-down bonding of the semiconductor chip 10.

The semiconductor chip 10 is pressed to attach the semiconductor chip 10 to a predetermined mounting area. More specifically, the semiconductor chip 10 is attached such that the surface of the semiconductor chip 10 opposite to the adhesive tape 20 faces a predetermined mounting area. When the surface of the semiconductor chip 10 opposite to the side on which the electrodes 12 are formed is attached to the adhesive tape 20, the surface of the semiconductor chip 10 on which the electrodes 12 are formed is placed in a predetermined mounting area. Mount facing each other. Alternatively, when the surface on which the electrode 12 is formed is affixed to the adhesive tape 20, the surface of the semiconductor chip 10 opposite to the surface on which the electrode 12 is formed is opposed to a predetermined mounting area. And attach it. When the semiconductor chip 10 is mounted, the mounting position may be adjusted using a camera (not shown).
Thus, the semiconductor chip 10 can be accurately attached even through the adhesive tape 20.

Here, the predetermined mounting area may be a mounting area of the substrate 40 on which the wiring pattern 42 is formed. The substrate 40 is placed on the base 50, and the semiconductor chip 10 is mounted on the mounting area of the substrate 40. Semiconductor chip 10
May be attached to the surface of the substrate 40 on which the wiring pattern 42 is formed.

The substrate 40 may be formed of either an organic or inorganic material. An example of the substrate 40 may be a flexible substrate made of, for example, a polyimide resin, or a substrate made of ceramic, glass, glass epoxy, or the like. Further, as the substrate 40, a multilayer substrate or a build-up type substrate may be used.
The forms of the wiring pattern 42 and the substrate 40 including the wiring pattern are not limited to those described above.

Alternatively, the predetermined mounting area may be, for example, a part of a lead frame (not shown) or another mounting area to which the semiconductor chip 10 can be attached in a later step.

When the semiconductor chip 10 is mounted with the surface on which the electrodes 12 are formed facing the substrate 40, the electrodes 12 and the wiring patterns 42 may be electrically connected. That is, the electrode 12 and the wiring pattern 42 may be electrically connected in one step of pressing the semiconductor chip 10 with the adhesive tape 20 interposed therebetween. When the bump 14 is formed on the electrode 12, the bump 14 and the wiring pattern 42 are joined. The form of the electrical connection is not particularly limited. When the electrode 12 and the wiring pattern 42 are electrically connected, heat may be applied to the joint between the two if necessary. For example, the joint between the two may be heated by the heater 52 of the table 50. By bonding the electrode 12 (bump 14) and the wiring pattern 42, the semiconductor chip 10 can be attached to the substrate 40.

In the step of attaching the semiconductor chip 10, the semiconductor chip 10 may be bonded to a predetermined mounting area via a resin. The resin may be thermoset or thermoplastic. Further, the resin may have an insulating property, or may have a conductive property as described later. The resin may be provided in a paste form or in a sheet form. When attaching the semiconductor chip 10 to the substrate 40,
The resin may be provided on the substrate 40 side as shown in FIG.
Alternatively, it may be provided on the semiconductor chip 10 side. In the case where the resin is used, heat may be applied to the resin by the heater 52 of the base 50 as necessary.

By providing a resin between the semiconductor chip 10 and the substrate 40, the semiconductor chip 10
And the substrate 40 can be bonded. In particular, when the semiconductor chip 10 is attached with the surface on the side where the electrodes 12 are formed facing the substrate 40, a resin provided as an adhesive is used as a means for relaxing the stress applied to the completed semiconductor device. be able to. The resin in this case may be referred to as an underfill material. When the semiconductor chip 10 is mounted with the surface on the side of the semiconductor chip 10 on which the electrodes 12 are formed facing the substrate 40, the semiconductor chip 10 is bonded to the substrate 40 with a resin, and the electrical connection between the electrodes 12 and the wiring pattern 42 Connection may be achieved.

It is to be noted that the semiconductor chip 10 is
After attaching to zero, it may be provided between them. Specifically, when the semiconductor chip 10 is mounted with the surface on the side where the electrodes 12 are formed facing the substrate 40, a resin may be injected between the semiconductor chip 10 and the substrate 40.

When the resin has conductivity at least in part, the semiconductor chip 10 can be bonded to the substrate 40 and the electrode 12 can be electrically connected to the wiring pattern 42. As an example, as shown in FIG.
An anisotropic conductive material 44 may be used as the resin. The anisotropic conductive material 44 is formed by adding conductive particles 46 to the adhesive (binder).
(Filler) is dispersed. Semiconductor chip 1
0 through the adhesive tape 20, the electrode 12
The conductive particles 4 between the (bump 14) and the wiring pattern 42
6 can be crushed to establish an electrical connection between the two (see FIG. 2).

After attaching the semiconductor chip 10 to a predetermined mounting area, the semiconductor chip 10 is peeled off from the adhesive tape 20. The semiconductor chip 10 is attached to a predetermined mounting area by the above-described means. Specifically, the semiconductor chip 10 is attached to a predetermined mounting area so that the adhesive strength is larger than that of the adhesive tape 20. Thus, the semiconductor chip 10 can be peeled off from the adhesive tape 20 by separating the adhesive tape 20 from the predetermined mounting area. For example, as shown in FIG. 1, the adhesive tape 20 is previously fixed away from a predetermined mounting area, and the adhesive chip 20 is partially pressed down by a tool 30 to attach the semiconductor chip 10 to the predetermined mounting area. Thereafter, by returning the tool 30 to its original state before being pressed down, the portion of the adhesive tape 20 where the semiconductor chip 10 has been attached returns to the original fixed position,
Peeled from the semiconductor chip 10. In other words, the semiconductor chip 10 can be peeled off from the adhesive tape 20 by pressing to attach the semiconductor chip 10 to a predetermined mounting area.

According to the method of manufacturing a semiconductor device in this embodiment, the semiconductor chip 10 can be attached to a predetermined mounting area and peeled off from the adhesive tape 20 by one step of pressing the semiconductor chip 10. . That is, the semiconductor chip 10 attached to the adhesive tape 20 can be mounted in a predetermined mounting area in a small number of steps. Further, since the semiconductor chip 10 is pressed via the adhesive tape 20, the semiconductor chip 10 can be pressed without damaging the semiconductor chip 10 using the adhesive tape 20 as a protective member.

Next, a semiconductor device according to the present embodiment will be described. As shown in FIG. 2, the semiconductor device 1 includes a semiconductor chip 10, a substrate 40, and external terminals 60. In the following description, portions that are the same as those described above will be omitted.

The semiconductor device 1 has an external terminal 60. In the example shown in FIG. 2, a ball-shaped bump is formed as the external terminal 60. The external terminals 60 may be, for example, solder balls. By laying out the wiring pattern 42 electrically connected to the semiconductor chip 10 in a predetermined arrangement, the external terminals 60 can be provided in a region of the substrate 40 that extends two-dimensionally. That is, the pitch of the external terminals 60 of the semiconductor device can be changed, and the semiconductor device can be easily mounted on a circuit board (motherboard), for example.

As another form of the external terminal 60, a part of the wiring pattern 42 of the substrate 40 may be extended and an external connection may be made therefrom. A part of the wiring pattern 42 may be used as a lead of the connector, or the connector may be mounted on the substrate 40. Further, the external terminal 60 may not be formed positively, and the external terminal may be formed as a result by using the solder cream applied to the circuit board at the time of mounting on the circuit board, and using the surface tension at the time of melting. The semiconductor device is a so-called land grid array type semiconductor device.

According to the semiconductor device of the present embodiment, the number of manufacturing steps can be reduced, so that the stress applied to the semiconductor chip 10 can be suppressed.
Therefore, a highly reliable semiconductor device can be provided.

(Second Embodiment) FIG. 3 is a diagram showing a method of manufacturing a semiconductor device according to the present embodiment. In this embodiment, the contents described in the above embodiment can be applied as much as possible.

The present embodiment further includes a step of pressing the semiconductor chip 10 on a predetermined mounting area after completing the above-described steps. FIG. 3 is a view showing a step of pressing the semiconductor chip 10 on a predetermined mounting area. In addition,
The predetermined mounting area may be the substrate 40.

First, the semiconductor chip 10 is mounted on a predetermined mounting area. In the present embodiment, the semiconductor chip 10 may be temporarily bonded to a predetermined mounting area. More specifically, the semiconductor chip 10 is bonded to the substrate 20 to such an extent that the holding force of the semiconductor chip 10 in a predetermined mounting area is larger than that of the adhesive tape 20. Thus, similarly to the above-described embodiment, the semiconductor chip 10 is pressed by a pressure for attaching the semiconductor chip 10 to a predetermined mounting area.
Can be peeled from the adhesive tape 20.

In this embodiment, the semiconductor chip 10
May be attached with the surface on which the electrode 12 is formed facing the substrate 40. In this case, the semiconductor chip 10 may be temporarily bonded to the substrate 40 via a resin. The resin may be the anisotropic conductive material described above. Also, by temporarily bonding the semiconductor chip 10, the electrode 12 and the wiring pattern 42 are
And may not be electrically connected. The present embodiment is effective when the electrode 12 and the wiring pattern 42 are not electrically connected at this point, as described later.

Next, the semiconductor chip 10 is peeled off from the adhesive tape 20 in the same manner as in the above embodiment. afterwards,
The semiconductor chip 10 on the predetermined mounting area is pressed toward the predetermined mounting area. In this case, the semiconductor chip 1
0 presses with the adhesive tape 20 excluded. That is,
The semiconductor chip 10 may be pressed by directly pressing the tool 30.

As shown in FIG. 3, the semiconductor chip 10 may be pressed and heated by a tool 30 having a heater 34. When the semiconductor chip 10 is temporarily bonded with the surface on which the electrode 12 is formed facing the substrate 40, the semiconductor chip 10 is directly heated to allow the electrode 12 (the bump 14) and the wiring pattern 42 to be bonded. Joining can be promoted.
In the case where a thermosetting resin is provided between the semiconductor chip 10 and the substrate 40, for example, the resin can be cured by heating the tool 30 and the semiconductor chip 10 can be attached to the substrate 40. In particular, when the anisotropic conductive material 44 is used as the thermosetting resin, the anisotropic conductive material 44 is used.
The semiconductor chip 10 is attached to the substrate 40 after being melted, and the electrical connection between the electrode 12 (bump 14) and the wiring pattern 42 can be achieved. In addition,
This step may be the same as the so-called face-down bonding step.

The semiconductor chip 10 may be heated by the heater 34 of the tool 30 and the substrate 40 may be heated by the heater 52 of the table 50 on which the substrate 40 is placed.

According to the method of manufacturing a semiconductor device in the present embodiment, the semiconductor chip 10 can be more reliably attached to the mounting area by pressing the semiconductor chip 10 again. Further, for example, even when it is necessary to heat the semiconductor chip 10 to a high temperature when mounting the semiconductor chip 10 on the mounting area, the semiconductor chip 10 can be mounted on the mounting area by pressing again without the adhesive tape 20. Note that the semiconductor device in this embodiment is as described above.

FIG. 4 shows a circuit board 70 on which the semiconductor device 1 according to the present embodiment is mounted. Circuit board 7
For 0, an organic substrate such as a glass epoxy substrate is generally used. Wiring patterns made of, for example, copper or the like are formed on the circuit board 70 so as to form a desired circuit, and these wiring patterns and the external terminals 60 of the semiconductor device 1 are electrically connected to each other by mechanically connecting them. Conduct continuity.

FIG. 5 shows a notebook personal computer 80 and FIG. 6 shows a portable telephone 90 as an electronic apparatus having a semiconductor device to which the present invention is applied.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing a semiconductor device according to a first embodiment to which the present invention is applied.

FIG. 2 is a diagram illustrating a semiconductor device according to a first embodiment to which the present invention is applied;

FIG. 3 is a diagram illustrating a method of manufacturing a semiconductor device according to a second embodiment to which the present invention is applied.

FIG. 4 is a diagram illustrating a circuit board on which a semiconductor device according to an embodiment to which the present invention is applied is mounted;

FIG. 5 is a diagram illustrating an electronic apparatus including a semiconductor device according to an embodiment to which the present invention is applied;

FIG. 6 is a diagram illustrating an electronic apparatus including a semiconductor device according to an embodiment to which the present invention is applied;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor chip 12 Electrode 20 Adhesive tape 30 Tool 34 Heater 40 Substrate 42 Wiring pattern 44 Anisotropic conductive material 46 Conductive particle

Claims (10)

[Claims] 1. A semiconductor chip having one surface attached to an adhesive tape is pressed through the adhesive tape, and attached to a predetermined mounting area with the surface opposite to the one surface facing the mounting chip, A method for manufacturing a semiconductor device, comprising a step of peeling the semiconductor chip from the adhesive tape. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the mounting area is a mounting area of a substrate on which a wiring pattern is formed. 3. The method of manufacturing a semiconductor device according to claim 2, wherein the adhesive tape is attached to a surface of the semiconductor chip opposite to a surface on which electrodes are formed, and the semiconductor chip is attached. And a method of manufacturing a semiconductor device in which a surface of the semiconductor chip on which the electrode is formed is mounted so as to face the mounting area. 4. The semiconductor device according to claim 1, wherein in the step of attaching the semiconductor chip, the semiconductor chip is bonded to the mounting region via a resin. Manufacturing method. 5. The method for manufacturing a semiconductor device according to claim 4, wherein the step of attaching the semiconductor chip includes an anisotropic conductive material in which conductive particles are dispersed in an adhesive as the resin. A method for manufacturing a semiconductor device using a material. 6. The method of manufacturing a semiconductor device according to claim 3, wherein the semiconductor chip is mounted in the mounting area in the step of mounting the semiconductor chip. A method of manufacturing a semiconductor device, further comprising, after the step of temporarily bonding the semiconductor chip from the adhesive tape and excluding the adhesive tape, pressing the semiconductor chip on the mounting area. 7. The method for manufacturing a semiconductor device according to claim 6, wherein the step of pressing the semiconductor chip on the mounting area includes:
A method of manufacturing a semiconductor device, wherein the semiconductor chip is pressed by a tool having a heater, and the electrodes of the semiconductor chip are electrically connected to the wiring patterns on the mounting area. 8. A semiconductor device manufactured by the method of manufacturing a semiconductor device according to claim 1. 9. A circuit board on which the semiconductor device according to claim 8 is mounted. 10. An electronic apparatus having the semiconductor device according to claim 8.