JP2000137785A - Manufacture of noncontact type ic card and noncontact type ic card - Google Patents

Manufacture of noncontact type ic card and noncontact type ic card

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Publication number
JP2000137785A
JP2000137785A JP31118098A JP31118098A JP2000137785A JP 2000137785 A JP2000137785 A JP 2000137785A JP 31118098 A JP31118098 A JP 31118098A JP 31118098 A JP31118098 A JP 31118098A JP 2000137785 A JP2000137785 A JP 2000137785A
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conductive resin
ic card
substrate
hole
non
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JP31118098A
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Japanese (ja)
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Seiichi Miyai
清一 宮井
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Sony Corp
ソニー株式会社
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Abstract

PROBLEM TO BE SOLVED: To eliminates the need for many processes and facilities by making a high-reliability connection by using a low-temperature joining process and reducing the thickness when an IC chip is mounted on an antenna substrate. SOLUTION: This method has a process for forming an antenna pattern and a connection terminal part 5 on a base material 2 by using 1st conductive resin 4, a process for forming a through hole 6 in the connection terminal part 5, an antenna substrate forming process having a process for charging 2nd conductive resin 7 in the hole part of the through hole 6, and a process for mounting the IC chip 10 on the antenna substrate 8 by joining the part except a bump 9 on the bump formation surface of the IC chip 10 to the base material 2 by applying an insulating high-polymer adhesive 11 to the part and joining the bump 9 to the connection terminal part 5 while inserting and joining the bump 9 to 2nd conductive resin 7. Here, the 1st conductive resin 4, 2nd conductive resin 7, and high polymer adhesive 11 are heated and hardened at the same time.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は非接触型ICカードの製造方法および非接触型ICカードに関し、さらに詳しくは、ICチップをアンテナ基板に実装する方法に特徴を有する非接触型ICカードの製造方法および非接触型ICカードに関する。 The present invention relates to relates to a manufacturing method and the non-contact type IC card non-contact type IC card, and more particularly, manufacture of the non-contact type IC card characterized by a method for mounting an IC chip on an antenna substrate methods and the non-contact type IC card.

【0002】 [0002]

【従来の技術】従来の非接触型ICカードを、従来の非接触型ICカードの概略構成断面図である図7および従来のアンテナ基板の概略平面図である図8を参照して説明する。 The Conventional non-contact IC card will be described with reference to FIG. 8 is a 7 and a schematic plan view of a conventional antenna substrate is a schematic sectional view of a conventional non-contact type IC card. 図7のように、一般に、非接触型ICカード1 As shown in FIG. 7, in general, non-contact type IC card 1
4は、バンプ9を有するICチップ10が実装されたアンテナ基板15が、例えば2枚のシート状の保護部材1 4, the antenna substrate 15 on which the IC chip 10 is mounted with the bumps 9, for example, two sheet-like protective member 1
2に、熱可塑性接着剤13により貼り合わされて構成される。 2, constructed by bonding a thermoplastic adhesive 13. また、図8のように、アンテナ基板15は、平面形状が方形のシート状の基材2上に、例えば4ターンの渦巻き状のアンテナパターン3と電極端子16などが形成されている。 Further, as shown in FIG. 8, the antenna substrate 15 is a plan shape on the sheet-like substrate 2 of the square, for example, four turns of the spiral antenna pattern 3 and the electrode terminals 16 are formed.

【0003】この非接触型ICカード14の作製において、ICチップ10を、バンプ9を介して電極端子16 [0003] In the preparation of the non-contact type IC card 14, the IC chip 10, the electrode terminal 16 via the bumps 9
と電気的接続を行いつつ、アンテナ基板15に実装する場合、はんだ接合、異方性導電フィルム(ACF: Ani While performing the electrical connection and, when implementing the antenna board 15, the solder joint, an anisotropic conductive film (ACF: Ani
sotropic Conductive Film)または導電性接着剤などが用いられる。 sotropic Conductive Film) or a conductive adhesive is used. 基材2または保護部材12としては、特に、薄型の非接触型ICカード14を作製する場合、通常数十μmから数百μmの厚さの例えばポリエチレンテレフタレート(PET)フィルム、ポリイミド(PI) As the substrate 2 or the protective member 12, in particular, the case of manufacturing a non-contact type IC card 14 of a thin, typically a few tens μm hundred μm thick, for example, polyethylene terephthalate (PET) film, polyimide (PI)
フィルムまたはポリフェニレンサルファイド(PPS) Film or polyphenylene sulfide (PPS)
フィルムなどが用いられる。 Film and the like can be used.

【0004】図9は、異方性導電フィルムを用いてIC [0004] Figure 9, by using the anisotropic conductive film IC
チップを実装したアンテナ基板の1例を示す概略構成断面図である。 Is a schematic sectional view showing an example of an antenna board mounted chips. 図9に示すように、ICチップ10の下面にはバンプ9が形成されている。 As shown in FIG. 9, the bumps 9 are formed on the lower surface of the IC chip 10. 基材2の上には、アンテナパターンの一端および他端などに接続された電極端子16が形成されている。 On the substrate 2, the electrode terminals 16 connected like one end and the other end of the antenna pattern is formed. そして、電極端子16の上にはバンプ9が接触するようにICチップ10が配置され、このICチップ10と基材2の間には異方性導電フィルム17が配置される。 Then, on the electrode terminal 16 IC chip 10 is arranged such bumps 9 are in contact, between the IC chip 10 and the substrate 2 is disposed an anisotropic conductive film 17. この異方性導電フィルム17 The anisotropic conductive film 17
を210℃〜230℃に加熱して熱圧着することにより、基材2の上にICチップ10が実装され、電極端子16とバンプ9とが電気的に接続される。 Was heated to 210 ° C. to 230 ° C. by thermocompression bonding, it is the IC chip 10 is mounted on the substrate 2, and the electrode terminals 16 bumps 9 are electrically connected. これにより、 As a result,
バンプ9は、電極端子16のみと電気的に接続され、バンプ9間および電極端子16間は絶縁される。 Bumps 9 are electrically connected to only the electrode terminal 16, while between the bump 9 and the electrode terminals 16 are insulated.

【0005】このように、異方性導電フィルム17による接合では、接合および硬化時に、数秒間程度の高温部分加熱が伴うために、PIフィルムやPPSフィルムは基材2に適用することは可能だが、安価で生産性に優れるPETフィルムには適さない。 [0005] Thus, the bonding by the anisotropic conductive film 17, during bonding and curing, to accompany high temperature partial heating of the order of a few seconds, but PI film or PPS film's possible to apply the substrate 2 , not suitable for PET film which is excellent in low-cost in productivity. また、はんだ接合による方法では、230℃〜260℃の高温のリフロー工程を用いるために、これらの高分子フィルムは使用することができない。 In the method according to the solder bonding, in order to use the high-temperature reflow process 230 ° C. to 260 ° C., these polymer films can not be used. PETフィルムの耐熱性は、130℃程度が限界であり、このフィルムにICチップ10などを接合するためには100℃〜150℃の比較的低温でも硬化が可能な導電性ペーストなどの導電性接着剤が適している。 The heat resistance of PET film is limited to about 130 ° C., a conductive adhesive, such as 100 ° C. to 150 DEG ° C. for relatively low temperature curing can be also a conductive paste for bonding an IC chip 10 on the film agents are suitable.

【0006】しかしながら、導電性接着剤を用いる場合、ICチップ10のバンプ9形成面であるアクティブエリアにおいては、バンプ9やその他の電極パッドが導電性接着剤と接触し、ショートすることによりICを破壊する虞がある。 However, when using a conductive adhesive, in the active area is a bump 9 forming surface of the IC chip 10, bumps 9 and other electrode pad is in contact with the conductive adhesive, the IC by shorting there is a possibility to destroy. また、バンプ9と電極端子16を導電性接着剤などの接合部を介して接続する方法では、IC In the method of connecting the bump 9 and the electrode terminal 16 through the bonding portion such as a conductive adhesive, IC
チップ10を実装した場合の厚さに限界があった。 There is a limit to the thickness of the case of mounting the chip 10. また、アンテナ基板15にアンテナパターン3や電極端子16などを形成する場合、基材2上に導電性の薄膜を形成し、フォトリソグラフィーなどによる微細加工が必要となり、多くの工程を要する問題があった。 In the case of forming a like antenna pattern 3 and the electrode terminal 16 to the antenna substrate 15, forming a conductive thin film on the substrate 2, such as microfabrication is required by photolithography, there is a problem that requires many steps It was.

【0007】 [0007]

【発明が解決しようとする課題】本発明は、かかる問題点に鑑み、ICチップのアンテナ基板への実装において、低温の接合工程を用いて、高信頼性の接続を行うとともに、薄型化を可能とし、多くの工程と設備を必要としない非接触型ICカードの製造方法および非接触型I [SUMMARY OF THE INVENTION] In view of the above problems, in the implementation of the IC chip of the antenna substrate, using a low temperature bonding process, it performs a connection reliability, allows for thinner and then, a number of steps as the manufacturing method of the non-contact type IC card that does not require the equipment and non-contact I
Cカードを提供することを課題とする。 It is an object of the present invention to provide a C card.

【0008】 [0008]

【課題を解決するための手段】本発明の非接触型ICカードの製造方法は、バンプを有するICチップを、基材上にアンテナパターンを有するアンテナ基板に実装する非接触型ICカードの製造方法であって、基材上に第1 Non-contact type IC card manufacturing method of the present invention SUMMARY OF], a non-contact type IC card manufacturing method of mounting the IC chip, the antenna substrate having an antenna pattern on a substrate having a bump a is, first on a substrate
の導電性樹脂を用いてアンテナパターンと接続端子部を形成する工程と、接続端子部にスルーホールを形成する工程と、スルーホールの孔部に第2の導電性樹脂を充填する工程を有するアンテナ基板形成工程と、ICチップのバンプ形成面のバンプを除く部分に絶縁性の高分子接着剤を塗布して基材に接合するとともに、バンプをスルーホールへ挿入して、第2の導電性樹脂に接合しつつ、 Antenna with the using conductive resin between the antenna pattern and forming a connecting terminal portion, and forming a through hole in the connection terminal portion, the step of filling the second conductive resin to the hole portion of the through hole a substrate forming step, the bonding to a substrate by applying an insulating polymer adhesive to a portion excluding the bumps of the bump formation surface of the IC chip, by inserting the bump into the through hole, the second conductive resin while joining in,
アンテナパターンの接続端子部に接合することにより、 By joining the connecting terminal portions of the antenna pattern,
ICチップをアンテナ基板に実装する工程とを有し、第1の導電性樹脂、第2の導電性樹脂および高分子接着剤の加熱硬化を同時に行うことを特徴とする。 And a step of mounting an IC chip on an antenna substrate, and carrying out the first conductive resin, the heat curing of the second conductive resin and polymeric adhesive at the same time.

【0009】第1の導電性樹脂、第2の導電性樹脂および高分子接着剤は硬化温度が150℃以下であることが望ましい。 [0009] The first conductive resin, the second conductive resin and polymeric binder is preferably a curing temperature is 0.99 ° C. or less. 下限温度は特に限定しないが、100℃以上であることが好ましい。 The lower limit temperature is not particularly limited, is preferably 100 ° C. or higher.

【0010】本発明の非接触型ICカードは、請求項1 [0010] Non-contact type IC card of the present invention, according to claim 1
に記載の非接触型ICカードの製造方法を用いて製造されたことを特徴とする。 Characterized in that it is manufactured by the manufacturing method of the non-contact type IC card according to.

【0011】本発明の非接触型ICカードの製造方法および非接触型ICカードによれば、バンプを有するIC According to the non-contact type IC card manufacturing method and the non-contact IC card of the present inventors, IC having bumps
チップをアンテナ基板に実装する場合に、アンテナ基板の接続端子部にスルーホールを設け、導電性樹脂を充填し、ICチップのバンプを挿入するとともに、バンプを除く部分を絶縁性の高分子接着剤を用いて被覆および固定することにより、ICチップをアンテナ基板に高信頼性の接続を行いつつ、薄型化を可能とする。 When a chip is mounted on the antenna substrate, the through hole provided in the connecting terminal portion of the antenna substrate, filled with a conductive resin, is inserted bumps of the IC chip, a portion excluding the bumps insulating polymer adhesive by coating and fixed with, while the IC chip performs the connection reliability to the antenna substrate, to enable thinner. また、アンテナ基板を、導電性樹脂などの低温で硬化する接合剤を用いることにより容易に形成することができる。 Moreover, the antenna substrate can be easily formed by using a bonding agent which is cured at a low temperature such as a conductive resin. さらに、各々の工程の接合剤の硬化工程を同時に行うことができるので製造工程の省力化が図れる。 Further, thereby labor saving production process can be performed the step of curing the bonding agent of each step at the same time. また、アンテナ基板の基材として耐熱性のないポリエチレンテレフタレートなどの高分子フィルムを用いることができる。 Further, it is possible to use a polymer film such as polyethylene terephthalate having no heat resistance as the base material of the antenna substrate.

【0012】 [0012]

【発明の実施の形態】本発明の実施の形態を、以下の実施の形態例により図1〜図6を参照して説明する。 The embodiment of the embodiment of the present invention will be described with reference to FIGS. 1 to 6 by the following embodiments. 図1 Figure 1
は、本発明の非接触型ICカードのアンテナ基板の概略平面図である。 Is a schematic plan view of an antenna substrate of the contactless IC card of the present invention. 図2は、本発明に係わるICチップを実装したアンテナ基板の概略構成断面図である。 Figure 2 is a schematic sectional view of an antenna board mounted with an IC chip according to the present invention. 図3は、 Fig. 3,
本発明に係わるアンテナ基板を実装した非接触型ICカードの概略構成断面図である。 It is a schematic cross-sectional view of a non-contact type IC card mounted with the antenna board according to the present invention. 図4〜図6は本発明の非接触型ICカードの製造工程図である。 4 to 6 illustrate a manufacturing process of a contactless IC card of the present invention.

【0013】実施の形態例非接触型ICカードにおいて、図1のように、例えばPETフィルムなどのシート状の基材2上にアンテナパターン3および接続端子部5 [0013] In exemplary embodiments the non-contact type IC card, as shown in FIG. 1, for example, the antenna pattern 3 and the connection terminal portion 5 on the sheet substrate 2, such as a PET film
などが、例えば導電性ペーストなどの第1の導電性樹脂4を用いて形成され、接続端子部5にスルーホール6が形成されるとともに、スルーホール6の孔部に、例えば導電性ペーストなどの第2の導電性樹脂7が充填されて構成されるアンテナ基板8に、図2のように、バンプ9 Such as, for example the first conductive resin 4 such as a conductive paste is formed by using, together with the through-hole 6 is formed on the connection terminal portion 5, the hole portion of the through hole 6, such as, for example, conductive paste the antenna substrate 8 composed second conductive resin 7 is filled, as shown in FIG. 2, the bumps 9
を有するICチップ10が、バンプ9をスルーホール6 IC chip 10 having found a bump 9 through hole 6
に挿入しつつ第2の導電性樹脂7に接合するとともに、 While bonded to the second conductive resin 7 while inserting into,
接続端子部5に接合し、バンプ9形成面のバンプ9を除く部分に塗布された、例えばエポキシ樹脂などの熱硬化性で絶縁性の高分子接着剤11により基材2上に接合されて構成されている。 Joined to the connection terminal portion 5, which is applied to the portion excluding the bump 9 of the bump 9 forming surface, for example constituted by bonded on the substrate 2 by an insulating polymer adhesive 11 with thermosetting epoxy resin It is.

【0014】さらに、図3のように、最終的に、非接触型ICカード1は、上記のバンプ9を有するICチップ10が実装されたアンテナ基板8に、例えば2枚のシート状のPETフィルムの保護部材12により、例えば共重合ポリエステルなどの熱可塑性接着剤13を用いて例えばラミネート法により加熱圧着接合した構造となっている。 Furthermore, as shown in FIG. 3, and finally, the non-contact type IC card 1, the antenna substrate 8 which IC chip 10 is mounted with the bumps 9, for example, like the two sheets PET film It has a structure bonded heat pressing by the by the protection member 12, for example a copolymer with a thermoplastic adhesive 13, such as polyester for example, lamination method.

【0015】次に、本発明の非接触型ICカードの製造工程を、図4〜図6を参照して説明する。 Next, the non-contact type IC card manufacturing process of the present invention will be described with reference to FIGS. まず、図4 First, as shown in FIG. 4
(a)に示すように、アンテナ基板8の基材2上に、アンテナパターンおよび接続端子部5などを導電性ペーストなどの第1の導電性樹脂4を用いて例えばスクリーン印刷法により形成する。 (A), a on the substrate 2 of the antenna substrate 8 is formed by a an antenna pattern and the connection terminal portion 5 with the first conductive resin 4 such as a conductive paste for example, a screen printing method. この段階で、第1の導電性樹脂4は、溶剤が乾燥してアンテナパターンなどの形状が保持されていればよく、加熱硬化を行う必要はない。 At this stage, the first conductive resin 4 has only solvent dried is retained the shape of an antenna pattern, there is no need to perform heating curing.

【0016】次に、図4(b)に示すように、接続端子部5に、スルーホール6を、例えばレーザを用いた孔開け加工により形成する。 [0016] Next, as shown in FIG. 4 (b), the connection terminal portion 5, a through hole 6, drilling is formed by machining using for example a laser.

【0017】次に、図4(c)に示すように、上記のように形成されたスルーホール6の孔部に導電性ペーストなどの第2の導電性樹脂7を充填する。 [0017] Next, as shown in FIG. 4 (c), to fill the second conductive resin 7 such as a conductive paste in the hole of the through-hole 6 formed as described above.

【0018】次に、図5(a)に示すように、ICチップ10のバンプ9形成面の、バンプ9を除く部分に、熱硬化性の高分子接着剤11をディスペンサなどにより塗布する。 Next, as shown in FIG. 5 (a), the bump 9 forming surface of the IC chip 10, the portion excluding the bumps 9, a thermosetting polymeric adhesive 11 is applied by a dispenser. この段階では、高分子接着剤11を加熱硬化させない。 At this stage, not cured by heating the polymeric adhesive 11.

【0019】次に、図5(b)に示すように、ICチップ10をアンテナ基板8に実装する。 Next, as shown in FIG. 5 (b), mounting the IC chip 10 on the antenna substrate 8. この場合、バンプ9をスルーホール6に挿入して、上記のように充填された第2の導電性樹脂7に接合しつつ、接続端子部5に接合する。 In this case, by inserting the bump 9 into the through holes 6, while bonded to the second conductive resin 7 filling as described above, joined to the connecting terminal portion 5. バンプ9形成面のバンプ9を除く部分は、基材2と高分子接着剤11により接合される。 Portion excluding the bump 9 of the bump 9 forming surface, are joined by base 2 and the polymer adhesive 11.

【0020】次に、図5(c)に示すように、100℃ Next, as shown in FIG. 5 (c), 100 ℃
〜150℃の温度で、例えば、不図示の高温雰囲気炉などにより第1の導電性樹脂4、第2の導電性樹脂7および高分子接着剤11を加熱硬化する。 At a temperature of to 150 DEG ° C., for example, a first conductive resin 4 such as by high-temperature atmosphere furnace (not shown), to heat cure the second conductive resin 7 and polymeric adhesive 11. この加熱硬化条件によれば、比較的耐熱性のないPETフィルムなどのシート状の基材は熱損傷を受けない。 According to the heat curing conditions, relatively heat resistance without PET film sheet substrate, such as not subjected to heat damage.

【0021】上記のアンテナ基板形成工程において、図示を省略するが、基材上に、最初に接続端子部にスルーホールを形成後、同一の導電性樹脂を用いて、スクリーン印刷などによりアンテナパターン、接続端子部およびスルーホール部の充填層を形成することもできる。 In the above antenna substrate forming step, although not shown, on the substrate, after forming the first through hole to the connection terminal portion, using the same conductive resin, the antenna pattern by screen printing, it is also possible to form a packed bed of the connection terminal portion and the through hole portion.

【0022】次に、図6に示すように、ICチップ10 Next, as shown in FIG. 6, IC chip 10
が実装されたアンテナ基板8を、例えば2枚のPETフィルムなどのシート状の保護部材12を用いて、アンテナ基板8を両側から挟み込み、熱可塑性接着剤13を用いて、不図示のラミネート装置などにより加熱圧着接合する。 There antenna substrate 8 mounted, for example, using a sheet-like protective member 12 such as a two PET films, sandwiching the antenna substrate 8 from both sides, with a thermoplastic adhesive 13, not shown in the laminating apparatus such as a by joining thermocompression bonding. そして、最終的な非接触型ICカード1を完成する。 Then, to complete the final non-contact type IC card 1. この場合、保護部材12の加熱圧着接合を行う場合に、この加熱工程により、上記の第1の導電性樹脂4、 In this case, when performing the heat compression bonding of the protective member 12, this heating step, the first conductive resin 4 above,
第2の導電性樹脂7および高分子接着剤11を最終的に熱硬化させることもできる。 A second conductive resin 7 and polymeric adhesive 11 may ultimately be thermally cured.

【0023】上記の実施の形態例においては、基材または保護部材として、PETフィルムなどの基材を用いる例を説明したが、PIフィルム、PPSフィルムなどを用いることも可能である。 [0023] In the embodiment of the above embodiment, as a substrate or protective member has been described an example of using a substrate such as a PET film, it is also possible to use PI film, and the like PPS film.

【0024】 [0024]

【発明の効果】本発明の非接触型ICカードの製造方法および非接触型ICカードによれば、バンプを有するI According to the non-contact type IC card manufacturing method and the non-contact type IC card of the present invention according to the present invention, I have bumps
Cチップをアンテナ基板に実装する場合に、アンテナ基板にスルーホールを設けるとともに導電性樹脂を充填し、バンプを挿入することなどにより、ICチップをアンテナ基板に高信頼性の接続を行うとともに、薄型化を可能とする。 When implementing C chip on the antenna substrate, filled with a conductive resin provided with a through hole to the antenna substrate, such as by inserting the bump, with the IC chip for connecting reliability antenna substrate, thin to enable the reduction. また、アンテナ基板を導電性樹脂を用いることにより、容易な製造工程で形成することができる。 Further, by using the conductive resin antenna substrate can be formed in an easy manufacturing process.
さらに、各々の工程の接合剤の硬化工程を同時に行うことができるので製造工程の省力化が図れる。 Further, thereby labor saving production process can be performed the step of curing the bonding agent of each step at the same time. また、アンテナ基板の基材として耐熱性のないポリエチレンテレフタレートなどの高分子フィルムを用いることができる。 Further, it is possible to use a polymer film such as polyethylene terephthalate having no heat resistance as the base material of the antenna substrate.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本発明の非接触型ICカードの概略構成断面図である。 1 is a schematic sectional view of a contactless IC card of the present invention.

【図2】 本発明の非接触型ICカードのアンテナ基板の概略平面図である。 2 is a schematic plan view of an antenna substrate of the contactless IC card of the present invention.

【図3】 本発明に係わるICチップを実装したアンテナ基板の概略構成断面図である。 3 is a schematic cross-sectional view of the mounted antenna substrate an IC chip according to the present invention.

【図4】 (a)〜(c)本発明の非接触型ICカードの製造工程図である。 It is a manufacturing process diagram of the contactless IC card of FIG. 4 (a) ~ (c) the present invention.

【図5】 (a)〜(c)図4に続く、本発明の非接触型ICカードの製造工程図である。 [5] (a) ~ (c) subsequent to FIG. 4, is a manufacturing process diagram of the contactless IC card of the present invention.

【図6】 図5に続く、本発明の非接触型ICカードの製造工程図である。 [6] followed by 5 illustrate a manufacturing process of the contactless IC card of the present invention.

【図7】 従来の非接触型ICカードの概略構成断面図である。 7 is a schematic sectional view of a conventional non-contact type IC card.

【図8】 従来のアンテナ基板の概略平面図である。 8 is a schematic plan view of a conventional antenna substrate.

【図9】 従来のICチップを実装したアンテナ基板の概略構成断面図である。 9 is a schematic cross-sectional view of implementing the conventional IC chip antenna substrate.

【符号の説明】 DESCRIPTION OF SYMBOLS

1,14…非接触型ICカード、2…基材、3…アンテナパターン、4…第1の導電性樹脂、5…接続端子部、 1,14 ... non-contact type IC card, 2 ... substrate, 3 ... antenna pattern, 4 ... first conductive resin, 5 ... connection terminal portion,
6…スルーホール、7…第2の導電性樹脂、8,15… 6 ... through hole, 7 ... second conductive resin, 8, 15 ...
アンテナ基板、9…バンプ、10…ICチップ、11… The antenna substrate, 9 ... bump, 10 ... IC chip, 11 ...
高分子接着剤、12…保護部材、13…熱可塑性接着剤、16…電極端子、17…異方性導電フィルム Polymeric binder, 12 ... protective member, 13 ... thermoplastic adhesive, 16 ... electrode terminal, 17 ... Anisotropic conductive film

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 バンプを有するICチップを、基材上にアンテナパターンを有するアンテナ基板に実装する非接触型ICカードの製造方法であって、 前記基材上に第1の導電性樹脂を用いてアンテナパターンと接続端子部を形成する工程と、 前記接続端子部にスルーホールを形成する工程と、 前記スルーホールの孔部に第2の導電性樹脂を充填する工程を有するアンテナ基板形成工程と、 前記ICチップの前記バンプ形成面の前記バンプを除く部分に絶縁性の高分子接着剤を塗布して前記基材に接合するとともに、前記バンプを前記スルーホールへ挿入して、前記第2の導電性樹脂に接合しつつ、前記接続端子部に接合することにより、前記ICチップを前記アンテナ基板に実装する工程とを有し、 前記第1の導電性樹脂、前記第2の導電 The method according to claim 1] IC chip having bumps, a non-contact type IC card manufacturing method of mounting the antenna substrate having an antenna pattern on a substrate, using a first conductive resin on the substrate forming a connecting terminal portion and the antenna pattern Te, and forming a through hole in the connection terminal portion, and the antenna substrate forming step comprises the step of filling the second conductive resin to the hole portion of the through hole , together by applying an insulating polymer adhesive to the portion excluding the bumps of the bump formation surface of the IC chip bonded to the substrate, by inserting the bump into the through hole, the second while bonded to the conductive resin, by bonding to the connecting terminal portion, and a step of mounting the IC chip to the antenna substrate, the first conductive resin, the second conductive 樹脂および前記高分子接着剤の加熱硬化を同時に行うことを特徴とする非接触型ICカードの製造方法。 Non-contact type IC card manufacturing method, which comprises carrying out the heat curing of the resin and the polymer adhesive at the same time.
  2. 【請求項2】 前記第1の導電性樹脂、前記第2の導電性樹脂および前記高分子接着剤は硬化温度が150℃以下であることを特徴とする請求項1に記載の非接触型I Wherein said first conductive resin, said second non-contact type I of conductive resin and the polymeric adhesive according to claim 1, wherein the curing temperature is 0.99 ° C. or less
    Cカードの製造方法。 Method of manufacturing a C card.
  3. 【請求項3】 請求項1に記載の非接触型ICカードの製造方法を用いて製造されたことを特徴とする非接触型ICカード。 3. A non-contact type IC card, characterized by being manufactured using the manufacturing method of the non-contact type IC card according to claim 1.
JP31118098A 1998-10-30 1998-10-30 Manufacture of noncontact type ic card and noncontact type ic card Pending JP2000137785A (en)

Priority Applications (1)

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