JP2000137785A - Manufacture of noncontact type ic card and noncontact type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminates the need for many processes and facilities by making a high-reliability connection by using a low-temperature joining process and reducing the thickness when an IC chip is mounted on an antenna substrate. SOLUTION: This method has a process for forming an antenna pattern and a connection terminal part 5 on a base material 2 by using 1st conductive resin 4, a process for forming a through hole 6 in the connection terminal part 5, an antenna substrate forming process having a process for charging 2nd conductive resin 7 in the hole part of the through hole 6, and a process for mounting the IC chip 10 on the antenna substrate 8 by joining the part except a bump 9 on the bump formation surface of the IC chip 10 to the base material 2 by applying an insulating high-polymer adhesive 11 to the part and joining the bump 9 to the connection terminal part 5 while inserting and joining the bump 9 to 2nd conductive resin 7. Here, the 1st conductive resin 4, 2nd conductive resin 7, and high polymer adhesive 11 are heated and hardened at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to a manufacturing method and the non-contact type IC card non-contact type IC card, and more particularly, manufacture of the non-contact type IC card characterized by a method for mounting an IC chip on an antenna substrate methods and the non-contact type IC card.

[0002]

The Conventional non-contact IC card will be described with reference to FIG. 8 is a 7 and a schematic plan view of a conventional antenna substrate is a schematic sectional view of a conventional non-contact type IC card. As shown in FIG. 7, in general, non-contact type IC card 1
4, the antenna substrate 15 on which the IC chip 10 is mounted with the bumps 9, for example, two sheet-like protective member 1
2, constructed by bonding a thermoplastic adhesive 13. Further, as shown in FIG. 8, the antenna substrate 15 is a plan shape on the sheet-like substrate 2 of the square, for example, four turns of the spiral antenna pattern 3 and the electrode terminals 16 are formed.

[0003] In the preparation of the non-contact type IC card 14, the IC chip 10, the electrode terminal 16 via the bumps 9
While performing the electrical connection and, when implementing the antenna board 15, the solder joint, an anisotropic conductive film (ACF: Ani
sotropic Conductive Film) or a conductive adhesive is used. As the substrate 2 or the protective member 12, in particular, the case of manufacturing a non-contact type IC card 14 of a thin, typically a few tens μm hundred μm thick, for example, polyethylene terephthalate (PET) film, polyimide (PI)
Film or polyphenylene sulfide (PPS)
Film and the like can be used.

[0004] Figure 9, by using the anisotropic conductive film IC
Is a schematic sectional view showing an example of an antenna board mounted chips. As shown in FIG. 9, the bumps 9 are formed on the lower surface of the IC chip 10. On the substrate 2, the electrode terminals 16 connected like one end and the other end of the antenna pattern is formed. Then, on the electrode terminal 16 IC chip 10 is arranged such bumps 9 are in contact, between the IC chip 10 and the substrate 2 is disposed an anisotropic conductive film 17. The anisotropic conductive film 17
Was heated to 210 ° C. to 230 ° C. by thermocompression bonding, it is the IC chip 10 is mounted on the substrate 2, and the electrode terminals 16 bumps 9 are electrically connected. As a result,
Bumps 9 are electrically connected to only the electrode terminal 16, while between the bump 9 and the electrode terminals 16 are insulated.

[0005] Thus, the bonding by the anisotropic conductive film 17, during bonding and curing, to accompany high temperature partial heating of the order of a few seconds, but PI film or PPS film's possible to apply the substrate 2 , not suitable for PET film which is excellent in low-cost in productivity. In the method according to the solder bonding, in order to use the high-temperature reflow process 230 ° C. to 260 ° C., these polymer films can not be used. The heat resistance of PET film is limited to about 130 ° C., a conductive adhesive, such as 100 ° C. to 150 DEG ° C. for relatively low temperature curing can be also a conductive paste for bonding an IC chip 10 on the film agents are suitable.

However, when using a conductive adhesive, in the active area is a bump 9 forming surface of the IC chip 10, bumps 9 and other electrode pad is in contact with the conductive adhesive, the IC by shorting there is a possibility to destroy. In the method of connecting the bump 9 and the electrode terminal 16 through the bonding portion such as a conductive adhesive, IC
There is a limit to the thickness of the case of mounting the chip 10. In the case of forming a like antenna pattern 3 and the electrode terminal 16 to the antenna substrate 15, forming a conductive thin film on the substrate 2, such as microfabrication is required by photolithography, there is a problem that requires many steps It was.

[0007]

[SUMMARY OF THE INVENTION] In view of the above problems, in the implementation of the IC chip of the antenna substrate, using a low temperature bonding process, it performs a connection reliability, allows for thinner and then, a number of steps as the manufacturing method of the non-contact type IC card that does not require the equipment and non-contact I
It is an object of the present invention to provide a C card.

[0008]

Non-contact type IC card manufacturing method of the present invention SUMMARY OF], a non-contact type IC card manufacturing method of mounting the IC chip, the antenna substrate having an antenna pattern on a substrate having a bump a is, first on a substrate
Antenna with the using conductive resin between the antenna pattern and forming a connecting terminal portion, and forming a through hole in the connection terminal portion, the step of filling the second conductive resin to the hole portion of the through hole a substrate forming step, the bonding to a substrate by applying an insulating polymer adhesive to a portion excluding the bumps of the bump formation surface of the IC chip, by inserting the bump into the through hole, the second conductive resin while joining in,
By joining the connecting terminal portions of the antenna pattern,
And a step of mounting an IC chip on an antenna substrate, and carrying out the first conductive resin, the heat curing of the second conductive resin and polymeric adhesive at the same time.

[0009] The first conductive resin, the second conductive resin and polymeric binder is preferably a curing temperature is 0.99 ° C. or less. The lower limit temperature is not particularly limited, is preferably 100 ° C. or higher.

[0010] Non-contact type IC card of the present invention, according to claim 1
Characterized in that it is manufactured by the manufacturing method of the non-contact type IC card according to.

According to the non-contact type IC card manufacturing method and the non-contact IC card of the present inventors, IC having bumps
When a chip is mounted on the antenna substrate, the through hole provided in the connecting terminal portion of the antenna substrate, filled with a conductive resin, is inserted bumps of the IC chip, a portion excluding the bumps insulating polymer adhesive by coating and fixed with, while the IC chip performs the connection reliability to the antenna substrate, to enable thinner. Moreover, the antenna substrate can be easily formed by using a bonding agent which is cured at a low temperature such as a conductive resin. Further, thereby labor saving production process can be performed the step of curing the bonding agent of each step at the same time. Further, it is possible to use a polymer film such as polyethylene terephthalate having no heat resistance as the base material of the antenna substrate.

[0012]

The embodiment of the embodiment of the present invention will be described with reference to FIGS. 1 to 6 by the following embodiments. Figure 1
Is a schematic plan view of an antenna substrate of the contactless IC card of the present invention. Figure 2 is a schematic sectional view of an antenna board mounted with an IC chip according to the present invention. Fig. 3,
It is a schematic cross-sectional view of a non-contact type IC card mounted with the antenna board according to the present invention. 4 to 6 illustrate a manufacturing process of a contactless IC card of the present invention.

[0013] In exemplary embodiments the non-contact type IC card, as shown in FIG. 1, for example, the antenna pattern 3 and the connection terminal portion 5 on the sheet substrate 2, such as a PET film
Such as, for example the first conductive resin 4 such as a conductive paste is formed by using, together with the through-hole 6 is formed on the connection terminal portion 5, the hole portion of the through hole 6, such as, for example, conductive paste the antenna substrate 8 composed second conductive resin 7 is filled, as shown in FIG. 2, the bumps 9
IC chip 10 having found a bump 9 through hole 6
While bonded to the second conductive resin 7 while inserting into,
Joined to the connection terminal portion 5, which is applied to the portion excluding the bump 9 of the bump 9 forming surface, for example constituted by bonded on the substrate 2 by an insulating polymer adhesive 11 with thermosetting epoxy resin It is.

Furthermore, as shown in FIG. 3, and finally, the non-contact type IC card 1, the antenna substrate 8 which IC chip 10 is mounted with the bumps 9, for example, like the two sheets PET film It has a structure bonded heat pressing by the by the protection member 12, for example a copolymer with a thermoplastic adhesive 13, such as polyester for example, lamination method.

Next, the non-contact type IC card manufacturing process of the present invention will be described with reference to FIGS. First, as shown in FIG. 4
(A), a on the substrate 2 of the antenna substrate 8 is formed by a an antenna pattern and the connection terminal portion 5 with the first conductive resin 4 such as a conductive paste for example, a screen printing method. At this stage, the first conductive resin 4 has only solvent dried is retained the shape of an antenna pattern, there is no need to perform heating curing.

[0016] Next, as shown in FIG. 4 (b), the connection terminal portion 5, a through hole 6, drilling is formed by machining using for example a laser.

[0017] Next, as shown in FIG. 4 (c), to fill the second conductive resin 7 such as a conductive paste in the hole of the through-hole 6 formed as described above.

Next, as shown in FIG. 5 (a), the bump 9 forming surface of the IC chip 10, the portion excluding the bumps 9, a thermosetting polymeric adhesive 11 is applied by a dispenser. At this stage, not cured by heating the polymeric adhesive 11.

Next, as shown in FIG. 5 (b), mounting the IC chip 10 on the antenna substrate 8. In this case, by inserting the bump 9 into the through holes 6, while bonded to the second conductive resin 7 filling as described above, joined to the connecting terminal portion 5. Portion excluding the bump 9 of the bump 9 forming surface, are joined by base 2 and the polymer adhesive 11.

Next, as shown in FIG. 5 (c), 100 ℃
At a temperature of to 150 DEG ° C., for example, a first conductive resin 4 such as by high-temperature atmosphere furnace (not shown), to heat cure the second conductive resin 7 and polymeric adhesive 11. According to the heat curing conditions, relatively heat resistance without PET film sheet substrate, such as not subjected to heat damage.

In the above antenna substrate forming step, although not shown, on the substrate, after forming the first through hole to the connection terminal portion, using the same conductive resin, the antenna pattern by screen printing, it is also possible to form a packed bed of the connection terminal portion and the through hole portion.

Next, as shown in FIG. 6, IC chip 10
There antenna substrate 8 mounted, for example, using a sheet-like protective member 12 such as a two PET films, sandwiching the antenna substrate 8 from both sides, with a thermoplastic adhesive 13, not shown in the laminating apparatus such as a by joining thermocompression bonding. Then, to complete the final non-contact type IC card 1. In this case, when performing the heat compression bonding of the protective member 12, this heating step, the first conductive resin 4 above,
A second conductive resin 7 and polymeric adhesive 11 may ultimately be thermally cured.

[0023] In the embodiment of the above embodiment, as a substrate or protective member has been described an example of using a substrate such as a PET film, it is also possible to use PI film, and the like PPS film.

[0024]

According to the non-contact type IC card manufacturing method and the non-contact type IC card of the present invention according to the present invention, I have bumps
When implementing C chip on the antenna substrate, filled with a conductive resin provided with a through hole to the antenna substrate, such as by inserting the bump, with the IC chip for connecting reliability antenna substrate, thin to enable the reduction. Further, by using the conductive resin antenna substrate can be formed in an easy manufacturing process.
Further, thereby labor saving production process can be performed the step of curing the bonding agent of each step at the same time. Further, it is possible to use a polymer film such as polyethylene terephthalate having no heat resistance as the base material of the antenna substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a schematic sectional view of a contactless IC card of the present invention.

2 is a schematic plan view of an antenna substrate of the contactless IC card of the present invention.

3 is a schematic cross-sectional view of the mounted antenna substrate an IC chip according to the present invention.

It is a manufacturing process diagram of the contactless IC card of FIG. 4 (a) ~ (c) the present invention.

[5] (a) ~ (c) subsequent to FIG. 4, is a manufacturing process diagram of the contactless IC card of the present invention.

[6] followed by 5 illustrate a manufacturing process of the contactless IC card of the present invention.

7 is a schematic sectional view of a conventional non-contact type IC card.

8 is a schematic plan view of a conventional antenna substrate.

9 is a schematic cross-sectional view of implementing the conventional IC chip antenna substrate.

DESCRIPTION OF SYMBOLS

1,14 ... non-contact type IC card, 2 ... substrate, 3 ... antenna pattern, 4 ... first conductive resin, 5 ... connection terminal portion,
6 ... through hole, 7 ... second conductive resin, 8, 15 ...
The antenna substrate, 9 ... bump, 10 ... IC chip, 11 ...
Polymeric binder, 12 ... protective member, 13 ... thermoplastic adhesive, 16 ... electrode terminal, 17 ... Anisotropic conductive film

Claims (3)

[The claims]
1. The method according to claim 1] IC chip having bumps, a non-contact type IC card manufacturing method of mounting the antenna substrate having an antenna pattern on a substrate, using a first conductive resin on the substrate forming a connecting terminal portion and the antenna pattern Te, and forming a through hole in the connection terminal portion, and the antenna substrate forming step comprises the step of filling the second conductive resin to the hole portion of the through hole , together by applying an insulating polymer adhesive to the portion excluding the bumps of the bump formation surface of the IC chip bonded to the substrate, by inserting the bump into the through hole, the second while bonded to the conductive resin, by bonding to the connecting terminal portion, and a step of mounting the IC chip to the antenna substrate, the first conductive resin, the second conductive Non-contact type IC card manufacturing method, which comprises carrying out the heat curing of the resin and the polymer adhesive at the same time.
2. Wherein said first conductive resin, said second non-contact type I of conductive resin and the polymeric adhesive according to claim 1, wherein the curing temperature is 0.99 ° C. or less
   Method of manufacturing a C card.
3. 3. A non-contact type IC card, characterized by being manufactured using the manufacturing method of the non-contact type IC card according to claim 1.