JP2000137785A - Manufacture of noncontact type ic card and noncontact type ic card - Google Patents

Manufacture of noncontact type ic card and noncontact type ic card

Info

Publication number
JP2000137785A
JP2000137785A JP31118098A JP31118098A JP2000137785A JP 2000137785 A JP2000137785 A JP 2000137785A JP 31118098 A JP31118098 A JP 31118098A JP 31118098 A JP31118098 A JP 31118098A JP 2000137785 A JP2000137785 A JP 2000137785A
Authority
JP
Japan
Prior art keywords
card
chip
conductive resin
contact type
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31118098A
Other languages
Japanese (ja)
Inventor
Seiichi Miyai
清一 宮井
Original Assignee
Sony Corp
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, ソニー株式会社 filed Critical Sony Corp
Priority to JP31118098A priority Critical patent/JP2000137785A/en
Publication of JP2000137785A publication Critical patent/JP2000137785A/en
Pending legal-status Critical Current

Links

Abstract

(57) [Summary] In mounting an IC chip on an antenna substrate, high-reliability connection is performed by using a low-temperature bonding process, and the IC chip can be reduced in thickness, and does not require many processes and equipment. Non-contact type IC card manufacturing method and non-contact type IC
Offer a card. SOLUTION: A step of forming an antenna pattern and a connection terminal portion 5 on a base material 2 using a first conductive resin 4,
An antenna substrate forming step including a step of forming a through hole 6 in the connection terminal part 5, a step of filling the hole part of the through hole 6 with the second conductive resin 7, and a step of forming a bump 9 on the surface of the bump 9 of the IC chip 10 An insulating polymer adhesive 11 is applied to portions other than the base 9 to join the base 2 and the bumps 9.
Mounting the IC chip 10 on the antenna substrate 8 by bonding the IC chip 10 to the connection terminal portion 5 while inserting the IC chip 10 into the through hole 6 and bonding the second conductive resin 7 to the connection terminal portion 5. Resin 4, second conductive resin 7, and polymer adhesive 1
1. Heat curing is performed at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a non-contact type IC card and a non-contact type IC card, and more particularly, to a method for manufacturing a non-contact type IC card characterized by a method of mounting an IC chip on an antenna substrate. The present invention relates to a method and a contactless IC card.

[0002]

2. Description of the Related Art A conventional non-contact type IC card will be described with reference to FIG. 7 which is a schematic sectional view of a conventional non-contact type IC card and FIG. 8 which is a schematic plan view of a conventional antenna substrate. Generally, as shown in FIG.
Reference numeral 4 denotes an antenna substrate 15 on which an IC chip 10 having bumps 9 is mounted, for example, two sheet-shaped protection members 1
2 are bonded by a thermoplastic adhesive 13. As shown in FIG. 8, the antenna substrate 15 has a spirally-shaped antenna pattern 3 of four turns, electrode terminals 16 and the like formed on a sheet-like base material 2 having a square planar shape.

In manufacturing the non-contact type IC card 14, the IC chip 10 is connected to the electrode terminals 16 via the bumps 9.
Soldering, anisotropic conductive film (ACF: Ani)
Sotropic Conductive Film) or a conductive adhesive is used. In particular, when a thin non-contact type IC card 14 is produced, for example, a polyethylene terephthalate (PET) film, a polyimide (PI) having a thickness of several tens μm to several hundred μm as the base material 2 or the protection member 12.
Film or polyphenylene sulfide (PPS)
A film or the like is used.

FIG. 9 shows an IC using an anisotropic conductive film.
It is a schematic structure sectional view showing an example of an antenna board in which a chip was mounted. As shown in FIG. 9, bumps 9 are formed on the lower surface of the IC chip 10. On the base material 2, electrode terminals 16 connected to one end and the other end of the antenna pattern are formed. The IC chip 10 is arranged on the electrode terminals 16 so that the bumps 9 are in contact with each other. An anisotropic conductive film 17 is arranged between the IC chip 10 and the base 2. This anisotropic conductive film 17
Is heated to 210 ° C. to 230 ° C. and thermocompression bonded, whereby the IC chip 10 is mounted on the base material 2 and the electrode terminals 16 and the bumps 9 are electrically connected. This allows
The bumps 9 are electrically connected only to the electrode terminals 16, and the bumps 9 and the electrode terminals 16 are insulated.

[0005] As described above, the bonding using the anisotropic conductive film 17 involves high-temperature partial heating for several seconds at the time of bonding and curing, so that the PI film or the PPS film can be applied to the substrate 2. It is not suitable for a PET film which is inexpensive and has excellent productivity. Further, in the method by soldering, these polymer films cannot be used because a high-temperature reflow step of 230 ° C. to 260 ° C. is used. The heat resistance of a PET film is limited to about 130 ° C., and a conductive adhesive such as a conductive paste that can be cured at a relatively low temperature of 100 ° C. to 150 ° C. in order to bond the IC chip 10 or the like to the film. Agents are suitable.

However, when a conductive adhesive is used, the bumps 9 and other electrode pads come into contact with the conductive adhesive in the active area where the bumps 9 of the IC chip 10 are formed, and short-circuit the IC. There is a risk of destruction. In the method of connecting the bump 9 and the electrode terminal 16 through a joint such as a conductive adhesive, an IC
There is a limit to the thickness when the chip 10 is mounted. Further, when forming the antenna pattern 3 and the electrode terminals 16 on the antenna substrate 15, a conductive thin film is formed on the base material 2, and fine processing by photolithography or the like is required. Was.

[0007]

SUMMARY OF THE INVENTION In view of the above problems, the present invention makes it possible to perform high-reliability connection using a low-temperature bonding step and mount the IC chip on an antenna substrate, and to reduce the thickness. And a non-contact type IC card manufacturing method and a non-contact type IC card which do not require many processes and equipment.
It is an object to provide a C card.

[0008]

According to the present invention, there is provided a method of manufacturing a non-contact type IC card in which an IC chip having bumps is mounted on an antenna substrate having an antenna pattern on a base material. And a first on the substrate
Having a step of forming an antenna pattern and a connection terminal portion using the conductive resin of claim 1, a step of forming a through hole in the connection terminal portion, and a step of filling a hole portion of the through hole with a second conductive resin. In the substrate forming step, an insulating polymer adhesive is applied to a portion of the bump forming surface of the IC chip other than the bumps and bonded to the base material, and the bumps are inserted into the through holes to form the second conductive resin. While joining
By joining to the connection terminal of the antenna pattern,
Mounting the IC chip on the antenna substrate, wherein the first conductive resin, the second conductive resin, and the polymer adhesive are simultaneously heated and cured.

It is desirable that the first conductive resin, the second conductive resin, and the polymer adhesive have a curing temperature of 150 ° C. or lower. The lower limit temperature is not particularly limited, but is preferably 100 ° C. or higher.

[0010] The non-contact type IC card according to the present invention is characterized in that
The present invention is characterized by being manufactured using the method for manufacturing a non-contact type IC card described in (1).

According to the method for manufacturing a non-contact type IC card and the non-contact type IC card of the present invention, an IC having bumps
When mounting the chip on the antenna board, provide a through hole in the connection terminal of the antenna board, fill the conductive resin, insert the bump of the IC chip, and insulate the other parts than the bump with insulating polymer adhesive. By covering and fixing the IC chip by using the IC chip, the IC chip can be connected to the antenna substrate with high reliability, and the thickness can be reduced. Further, the antenna substrate can be easily formed by using a bonding agent such as a conductive resin that cures at a low temperature. Furthermore, since the curing step of the bonding agent in each step can be performed at the same time, the labor of the manufacturing process can be saved. Further, a polymer film having no heat resistance, such as polyethylene terephthalate, can be used as a base material of the antenna substrate.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS. FIG.
1 is a schematic plan view of an antenna substrate of a non-contact type IC card of the present invention. FIG. 2 is a schematic sectional view of an antenna substrate on which an IC chip according to the present invention is mounted. FIG.
FIG. 1 is a schematic sectional view of a non-contact type IC card on which an antenna board according to the present invention is mounted. 4 to 6 are views showing the steps of manufacturing the non-contact type IC card of the present invention.

Embodiment 1 In a non-contact type IC card, as shown in FIG. 1, an antenna pattern 3 and a connection terminal 5 are formed on a sheet-like base material 2 such as a PET film.
Are formed using, for example, a first conductive resin 4 such as a conductive paste, and a through hole 6 is formed in the connection terminal portion 5, and a hole such as a conductive paste is formed in the hole of the through hole 6. As shown in FIG. 2, bumps 9 are formed on an antenna substrate 8 configured by filling the second conductive resin 7.
IC chip 10 having bumps 9
While joining to the second conductive resin 7 while
It is joined to the connection terminal portion 5 and is joined to the base material 2 by a thermosetting and insulating polymer adhesive 11 such as an epoxy resin applied to a portion other than the bump 9 on the surface where the bump 9 is formed. Have been.

Further, as shown in FIG. 3, finally, the non-contact type IC card 1 is provided on the antenna substrate 8 on which the IC chip 10 having the bumps 9 is mounted, for example, by two sheets of PET film. The protective member 12 has a structure in which a thermoplastic adhesive 13 such as a copolymerized polyester is used and bonded by heating and compression by, for example, a laminating method.

Next, the manufacturing process of the non-contact type IC card of the present invention will be described with reference to FIGS. First, FIG.
As shown in FIG. 1A, an antenna pattern and connection terminal portions 5 are formed on a base material 2 of an antenna substrate 8 by using a first conductive resin 4 such as a conductive paste, for example, by a screen printing method. At this stage, the first conductive resin 4 only needs to dry and retain the shape of the antenna pattern and the like, and does not need to be heated and cured.

Next, as shown in FIG. 4 (b), a through hole 6 is formed in the connection terminal portion 5 by, for example, drilling using a laser.

Next, as shown in FIG. 4C, the second conductive resin 7 such as a conductive paste is filled in the holes of the through holes 6 formed as described above.

Next, as shown in FIG. 5A, a thermosetting polymer adhesive 11 is applied by a dispenser or the like to a portion of the IC chip 10 on which the bumps 9 are formed, excluding the bumps 9. At this stage, the polymer adhesive 11 is not cured by heating.

Next, as shown in FIG. 5B, the IC chip 10 is mounted on the antenna substrate 8. In this case, the bumps 9 are inserted into the through holes 6, and are bonded to the connection terminal portions 5 while being bonded to the second conductive resin 7 filled as described above. The portion of the surface on which the bumps 9 are formed except for the bumps 9 is joined to the base material 2 with the polymer adhesive 11.

Next, as shown in FIG.
The first conductive resin 4, the second conductive resin 7, and the polymer adhesive 11 are cured by heating at a temperature of about 150 ° C., for example, in a high-temperature atmosphere furnace (not shown). According to the heat-curing conditions, a sheet-like base material such as a PET film having relatively low heat resistance is not thermally damaged.

In the above antenna substrate forming step, though not shown, after first forming a through hole in the connection terminal portion on the base material, the antenna pattern is formed by screen printing using the same conductive resin. A filling layer for the connection terminal portion and the through hole portion can also be formed.

Next, as shown in FIG.
The antenna substrate 8 on which is mounted is sandwiched from both sides using two sheet-like protective members 12 such as PET films, and a laminating device (not shown) Bonding by heating. Then, the final non-contact type IC card 1 is completed. In this case, when performing the heat compression bonding of the protection member 12, the first conductive resin 4,
The second conductive resin 7 and the polymer adhesive 11 can be finally thermally cured.

In the above embodiment, an example in which a base material such as a PET film is used as the base material or the protection member has been described. However, a PI film, a PPS film, or the like may be used.

[0024]

According to the method of manufacturing a non-contact type IC card and the non-contact type IC card of the present invention, an I-shaped IC having bumps is provided.
When mounting the C chip on the antenna substrate, provide a through hole in the antenna substrate, fill the conductive resin, insert bumps, etc. to connect the IC chip to the antenna substrate with high reliability and reduce the thickness. Is possible. Further, by using a conductive resin for the antenna substrate, the antenna substrate can be formed in an easy manufacturing process.
Furthermore, since the curing step of the bonding agent in each step can be performed at the same time, the labor of the manufacturing process can be saved. Further, a polymer film having no heat resistance, such as polyethylene terephthalate, can be used as a base material of the antenna substrate.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a non-contact type IC card of the present invention.

FIG. 2 is a schematic plan view of an antenna substrate of the non-contact type IC card of the present invention.

FIG. 3 is a schematic sectional view of an antenna substrate on which an IC chip according to the present invention is mounted.

FIGS. 4A to 4C are manufacturing process diagrams of the non-contact type IC card of the present invention.

5 (a) to 5 (c) are manufacturing process diagrams of the non-contact type IC card of the present invention, following FIG. 4;

FIG. 6 is a manufacturing step diagram of the non-contact type IC card of the present invention, following FIG. 5;

FIG. 7 is a schematic sectional view of a conventional non-contact type IC card.

FIG. 8 is a schematic plan view of a conventional antenna substrate.

FIG. 9 is a schematic sectional view of an antenna substrate on which a conventional IC chip is mounted.

[Explanation of symbols]

1, 14 non-contact type IC card, 2 base material, 3 antenna pattern, 4 first conductive resin, 5 connection terminal portion,
6 through hole, 7 second conductive resin, 8, 15
Antenna substrate, 9 bumps, 10 IC chips, 11
Polymer adhesive, 12: protective member, 13: thermoplastic adhesive, 16: electrode terminal, 17: anisotropic conductive film

Claims (3)

[Claims]
1. A method for manufacturing a non-contact type IC card in which an IC chip having bumps is mounted on an antenna substrate having an antenna pattern on a base material, wherein a first conductive resin is used on the base material. Forming an antenna pattern and a connection terminal portion by forming the connection terminal portion; forming a through hole in the connection terminal portion; and filling a hole portion of the through hole with a second conductive resin. Applying an insulating polymer adhesive to a portion of the IC chip other than the bumps on the bump forming surface and joining the same to the base material; inserting the bump into the through hole; Mounting the IC chip on the antenna substrate by bonding to the connection terminal portion while bonding to the conductive resin, wherein the first conductive resin and the second conductive Non-contact type IC card manufacturing method, which comprises carrying out the heat curing of the resin and the polymer adhesive at the same time.
2. The non-contact type I according to claim 1, wherein the first conductive resin, the second conductive resin, and the polymer adhesive have a curing temperature of 150 ° C. or lower.
Manufacturing method of C card.
3. A non-contact type IC card manufactured by using the method of manufacturing a non-contact type IC card according to claim 1.
JP31118098A 1998-10-30 1998-10-30 Manufacture of noncontact type ic card and noncontact type ic card Pending JP2000137785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31118098A JP2000137785A (en) 1998-10-30 1998-10-30 Manufacture of noncontact type ic card and noncontact type ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31118098A JP2000137785A (en) 1998-10-30 1998-10-30 Manufacture of noncontact type ic card and noncontact type ic card

Publications (1)

Publication Number Publication Date
JP2000137785A true JP2000137785A (en) 2000-05-16

Family

ID=18014061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31118098A Pending JP2000137785A (en) 1998-10-30 1998-10-30 Manufacture of noncontact type ic card and noncontact type ic card

Country Status (1)

Country Link
JP (1) JP2000137785A (en)

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