JP3416032B2 - Adhesive application method, adhesive application device, and semiconductor component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method for applying an adhesive such that a semiconductor bare chip is mounted with high reliability. SOLUTION: The coating method of adhesive comprises steps 90, 91 for applying an adhesive from a nozzle 83 to a semiconductor bare chip mounting region 20a on a board at two separated points P1 , P2 , and a step 92 for spreading the applied adhesive flatly in the semiconductor bare chip mounting region by reciprocating the nozzle, without supplying the adhesive, between the applying positions of adhesive close to the height of the board. A semiconductor bare chip is fixed temporarily and then mounted on the board by pressing while heating. According to the method, the adhesive may not sneak into the upper surface of the semiconductor bare chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying method, an adhesive applying apparatus, and a semiconductor component mounting method, and in particular,
The present invention relates to an adhesive applying method, an adhesive applying apparatus, and a semiconductor component mounting method applied when a semiconductor bare chip is mounted on a substrate by a flip chip method of pressure bonding.

With the miniaturization of portable information equipment, higher density is required for mounting semiconductor devices on a substrate. It is also required to consider global environmental issues. Therefore, a technique of mounting a bare semiconductor chip, which is a bare chip in an unpackaged state, by a flip-chip method of pressure bonding is being developed. Here, for convenience of description, the configuration of the semiconductor bare chip 10 and the structure of the semiconductor bare chip mounting module 30 on which the semiconductor bare chip 10 is mounted will be described.

As shown in FIG. 8A, the semiconductor bare chip 10 has stud bumps 13 formed on each Al electrode 12 on the lower surface 11a of the semiconductor bare chip body 11 cut out from the wafer, and Stud bump 1
In this configuration, the conductive adhesive 14 is attached so as to cover the top part of No. 3. The stud bump 13 is made of Au. The conductive adhesive 14 is an epoxy resin containing an Ag filler. The stud bump 13 and the conductive adhesive 14 do not contain lead.

The semiconductor bare chip 10 is a printed circuit board 2
As shown in FIG. 8B, by applying pressure and heating to the printed circuit board 20 in which the epoxy thermosetting adhesive is applied to the semiconductor bare chip mounting area 20a of 0, as shown in FIG. To be implemented. FIG. 8B shows a semiconductor bare chip mounting module 30 on which the semiconductor bare chip 10 of FIG. 8A is mounted. In the semiconductor bare chip 10, the stud bumps 13 are pressure-bonded to the electrodes 21 on the printed circuit board 20 and are bonded to the electrodes 21 by the conductive adhesive 14, and the semiconductor bare chip main body 11 is thermoset with thermosetting epoxy. The agent 26 is adhered and mounted on the printed circuit board 11.
Since the thermosetting adhesive 26 is present in the gap 27 between the semiconductor bare chip body 11 and the printed board 21 and is thermoset, the bottom surface 1 of the semiconductor bare chip body 11 is
The entire surface 1a is adhered to the printed circuit board 20, and the entire lower surface 11a of the semiconductor bare chip body 11 is attracted to the printed circuit board 20 side by the force F due to the thermosetting adhesive being thermally cured and contracted. With this force F,
The stud bumps 13 are pressure-bonded to the electrodes 21, and each stud bump 13 is electrically connected to the corresponding electrode 21. Reference numeral 26 a is a fillet of the thermosetting adhesive 26, which is formed on the entire circumference of the semiconductor bare chip body 11.

[0005]

2. Description of the Related Art Conventionally, as shown in FIGS. 9 (A) and 9 (B), a thermosetting adhesive is extruded from a nozzle 41 at the tip of a syringe 40 so that a semiconductor bare chip mounting area 20a of a printed circuit board 20 is formed. A predetermined amount was applied to the central portion as indicated by reference numeral 42, and in this state, the semiconductor bare chip was pressed and heated to be mounted. Specifically, as shown in FIG. 10, the semiconductor bare chip 10 is positioned at a predetermined position on the printed circuit board 20 coated with the thermosetting adhesive 42 by using the suction head 50 utilizing the suction of air. The semiconductor bare chip 1 in which the suction heads 50 are temporarily attached by mounting them together, pressing them lightly, and temporarily adhering them to the suction heads 50 and moving the suction heads 50 upward
The printed circuit board 20 to which the semiconductor bare chip 10 is temporarily attached is moved to another place from 0, and the pressurizing and heating head 55 in which the pressurizing unit 56 and the heater 57 are incorporated is temporarily attached to the semiconductor bare chip 10. It was mounted by pressing for about 100 seconds to apply pressure and heating.

The amount of the thermosetting adhesive 42 applied is an amount corresponding to the size of the semiconductor bare chip to be mounted, and the entire lower surface of the semiconductor bare chip is adhered to the semiconductor bare chip so as to protrude to the periphery of the semiconductor bare chip. Fillet 26a
Is an amount sufficient to be formed. Here, the viscosity of the thermosetting adhesive is generally high. Therefore, the applied thermosetting adhesive 42 is, as shown in FIG.
It is raised in a mountain shape from the surface of 0, and the height h1 is as high as about 0.3 mm.

[0007]

Since the applied thermosetting adhesive 42 is concentrated in one place, the semiconductor bare chip 10 is aligned and mounted by using the suction head 50 and temporarily pressed by pressing. In the attached state, as shown in FIG. 9C, the thermosetting adhesive 42 largely protrudes from the semiconductor bare chip 10 in a part of the outer periphery of the semiconductor bare chip 10 and a part thereof wraps around the upper surface of the semiconductor bare chip 10. In some cases, as shown by reference numeral 43, sticking to the suction head 50 may occur. When the thermosetting adhesive 41 wraps around the upper surface of the semiconductor bare chip 10 and adheres to the suction head 50, when the suction head 50 separates from the semiconductor bare chip 10, the semiconductor bare chip 10 is dragged by the suction head 50 and temporarily attached. There is a risk that the stud bumps 13 are dislocated from the electrodes 21 and are mounted in a state where the electrical connection is incomplete, resulting in mounting failure.

At present, as the density of integrated circuits formed in a semiconductor bare chip increases, the size of the semiconductor bare chip is reduced from the conventional 20 mm □ to several mm □, and the thickness of the semiconductor bare chip is also reduced accordingly. Conventional 1
It is becoming thinner from 2 mm to 0.5 mm. Since the size of the semiconductor bare chip is reduced, the standard coating amount of the thermosetting adhesive is reduced, and the allowable variation in the coating amount is also reduced, and the thickness of the semiconductor bare chip is as thin as 0.5 mm. Therefore, the thermosetting adhesive tends to easily get around to the upper surface of the bare semiconductor chip. Therefore, it is necessary to take measures to prevent the thermosetting adhesive from wrapping around the upper surface of the semiconductor bare chip.

Therefore, an object of the present invention is to provide an adhesive applying method, an adhesive applying apparatus, and a semiconductor component mounting method which solve the above problems.

[0010]

In order to solve the above problems SUMMARY OF THE INVENTION The invention of Claim 1, apart plurality of locations adherend adhesive plan area on the substrate out of the adhesive from a single Roh nozzle To the nozzle , and finally with the adhesive applied, slide the nozzle sideways.
And between the coated adhesives
The last applied adhesive, stretch the adhesive and
The coated adhesives at a plurality of locations is obtained by postpones flat in adherend adhesion planned area.

By flattening, as compared with the case where the stretching is not performed, the protrusion of the adherend to the outer periphery is made to occur uniformly over the entire outer periphery.

[0012] The invention of 請 Motomeko 2, the adhesive from a single nozzle
The adhesive is applied to the substrate to be bonded and the
After the operation of applying to several places, the adhesive applied last
The adhesive is stretched and the adhesive is applied to multiple locations.
Spread the agent flat in the area to be bonded
The nozzle above the same height as when the adhesive was last applied.
It is configured to have means for moving between the applied adhesives .

By providing means for moving the nozzle between the applied adhesives, no special equipment is required,
It can be flattened by stretching the adhesive and that Do.

[0014] 請 nucleophilic claim 3 invention has a structure for mounting a semiconductor component using the adhesive applied by the adhesive application method according to claim 1, wherein.

As compared with the case where the applied thermosetting adhesive is not stretched, the protrusion of the adhesive to the outer periphery of the semiconductor component becomes uniform over the entire outer periphery,
You will not be able to overhang much in a specific place.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A shows a thermosetting adhesive applying device 60 applied to a semiconductor bare chip mounting method according to an embodiment of the present invention. The thermosetting adhesive application device 60 generally includes an XY robot 61, an adhesive application head 62 shown in FIG. 1 (B), a Z-direction drive cylinder 63, and
It has a control circuit 70 and drive circuits 71 to 74.

The XY robot 61 has an X arm 65 and a Y arm.
The arm 66 includes an X-direction drive cylinder 67 that moves the Y-arm 66 along the X-arm 65, and a Y-direction drive cylinder 68 that moves the Z-direction drive cylinder 63 along the Y-arm 66. The Z direction drive cylinder 63 is supported by the Y arm 66, and as shown in FIG.
The adhesive application head 62 is supported by the Z-direction drive cylinder 63.

The X drive circuit 71 and the Y drive circuit 72 are operated by the control signal from the control circuit 70, so that the X direction drive cylinder 67 and the Y direction drive cylinder 6 are operated.
8 is driven to operate the XY robot 61, and the adhesive application head 62 is moved in the XY directions. Further, the Z drive circuit 73 is operated by the control signal from the control circuit 70, whereby the Z direction drive cylinder 63 is operated and the adhesive application head 62 is moved in the Z direction.

In the adhesive application head 62, the syringe support mechanism 80 is fixed to the rod 63a of the Z-direction drive cylinder 63, and the syringe support mechanism 80 includes a syringe 82 containing a thermosetting adhesive 81. Tip nozzle 83
Mounted vertically with the syringe 8
The upper end of 2 is connected to the dispenser 85 with a tube 84. The dispenser drive circuit 74 is operated by the control signal from the control circuit 70, whereby the dispenser 85 is operated, the compressed air of a predetermined pressure is sent out at a predetermined timing for a predetermined time, and the thermosetting adhesive 81 is ejected from the nozzle 83. Push out from. Nozzle 83 has a circular cross section with an outer diameter of 0.9 mm and an inner diameter of 0.5 m.
m.

The control circuit 70 is composed of a microcomputer. When the printed circuit board 20 is moved by the conveyor 88 and it is confirmed that the printed circuit board 20 is fixed at the thermosetting adhesive application position, the control circuit 7
0 operates as programmed, the XY robot 61 operates to move the nozzle 83 at the tip of the syringe 82 to the thermosetting adhesive application position, and thereafter, the Z direction drive cylinder 67 and the Y direction drive cylinder. 68 is operated in a predetermined order so that the nozzle 83 moves to the position shown in FIGS. 2 (A) and 2 (B).
It moves as shown by the loci (1) to (8), and the dispenser 85 operates at predetermined time points (time) T1 and T2.

The thermosetting adhesive application device 60 generally applies the thermosetting adhesive at two separate locations, and then reciprocates with the nozzle 83 lowered to extend the thermosetting adhesive. Works as if flat. Here, FIG.
The operation of applying the thermosetting adhesive will be described in detail with reference to (A) to (I). FIG. 3A shows the steps of the thermosetting adhesive application operation.

First, the first point coating step 90 is performed. Here, as shown by the locus (1), the nozzle 83 descends to the first portion P1 in the semiconductor bare chip mounting scheduled region 20a of the printed circuit board 20 near the end in the Y1 direction and approaches the printed circuit board 20. It reaches the height H1 and stops and stays at this low height H1. When the nozzle 83 descends and reaches the low height H1, the dispenser 85 operates to deliver compressed air of a predetermined pressure for a predetermined time, and the thermosetting adhesive 81
Are extruded from the nozzle 83. As a result, FIG.
As shown in (B) and (C), the thermosetting adhesive 1 has an amount V / 2 which is half the amount V required for mounting the semiconductor bare chip 10.
00 is applied to the first portion P1 in a mountain shape. After this, the nozzle 83 rises as shown by the locus (2) and reaches a high height H2 which is separated from the printed circuit board 20.

Next, a second point coating step 91 is performed. Here, the nozzle 83 is first set to Y as shown by the locus (3).
It moves in two directions, then descends as shown by the locus (4), and has a low height above the second portion P2 in the semiconductor bare chip mounting area 20a of the printed circuit board 20 toward the Y2 direction end. It reaches H1 and stops and stays at this low height H1. When the nozzle 83 descends to reach the low height H1, the dispenser 85 operates, and the compressed air having a predetermined pressure is sent out for a predetermined time as described above, and the thermosetting adhesive 81 is pushed out from the nozzle 83. As a result, FIG.
As shown in (E), a thermosetting adhesive 101 having an amount V / 2, which is a half of the amount V required for mounting the semiconductor bare chip 10, is applied to the second portion P2 in a mountain shape.

Next, a stretching step 92 is performed. Here, the nozzle 83 moves to P1 in the Y1 direction as shown by the locus (5) while keeping the low height H1, and then moves to P2 in the Y2 direction as shown by the locus (6) and returns.
Then, as shown by the locus (7), it moves again in the Y1 direction to P1. The nozzle 83 remains P2-
Move back and forth between P1. The nozzle 83 moves while pulling the thermosetting adhesive attached to the tip. When moving in the Y1 direction, as indicated by reference numeral 102 in FIG.
The thermosetting adhesive 101 at the position 2 is moved while being stretched in the Y1 direction, and the thermosetting adhesive 101 at the position P2 is stretched in the Y1 direction. When moving in the Y2 direction, the thermosetting adhesive 100 at the point P1 is moved while being extended in the Y2 direction, and the thermosetting adhesive 100 at the point P1 is extended in the Y2 direction. As a result, as shown in FIGS. 3 (F) and (G), the mountain-shaped thermosetting adhesive 100 at the portion P1 and the mountain-shaped thermosetting adhesive 101 at the portion P2 are P2-P1. It is spread between and flattened.

Finally, the rising step 93 is performed. here,
The nozzle 83 rises as shown by the locus (8) and the
As shown in (F) and (G), a high height H2 is reached. When the nozzle 83 rises, the thermosetting adhesive is cut off from the nozzle 83. In this state, the thermosetting adhesive is, as indicated by reference numeral 103, a mountain-shaped thermosetting adhesive 100 at P1.
And the mountain-shaped thermosetting adhesive 101 at P2 are stretched and spread between P2-P1 to be flattened. The height h2 of the thermosetting adhesive 103 is reduced to half of the height h1 of the mountain-shaped thermosetting adhesives 100 and 101,
It becomes 0.15 mm.

The thermosetting adhesive can be spread well by moving the nozzle 83 back and forth between P2 and P1 while keeping the low height H1, but in some cases,
The nozzle 83 can be moved to one side between P2 and P1 while keeping the low height H1. Semiconductor bare chip 10
Are implemented as shown in FIG. That is, first, the semiconductor bare chip mounting area 20a of the printed circuit board 20 is coated with the thermosetting adhesive 103 planarized by the above-described method, and then the suction head 50 using air suction is used. The semiconductor bare chip 10 is aligned and mounted on a predetermined portion of the printed circuit board 20 coated with the thermosetting adhesive 42, lightly pressed and temporarily attached, and air is blown out slightly from the suction head 50 and the suction head 50.
To move the suction head 50 away from the temporarily attached semiconductor bare chip 10, and then the semiconductor bare chip 10
The semiconductor bare chip 1 to which the printed circuit board 20 temporarily attached with is temporarily attached with the pressurizing and heating head 55 in which the pressurizing portion 56 and the heater 57 are incorporated.
It is mounted by pressing 0 for about 100 seconds to apply pressure and heating.

Since the thermosetting adhesive 103 is flattened, the protrusion of the thermosetting adhesive to the outer periphery of the semiconductor bare chip 10 at the time of temporary attachment is uniform over the entire outer periphery of the semiconductor bare chip 10. This does not occur in a large amount at a specific place as in the conventional case. Therefore, the protruding thermosetting adhesive wraps around the upper surface of the semiconductor bare chip 10 as shown in FIG. It doesn't happen to stick to. Therefore, the suction head 50 is smoothly separated from the semiconductor bare chip 10, and the semiconductor bare chip 1
The temporary position of 0 does not shift. That is, the semiconductor bare chip 10 is temporarily attached with high positional accuracy. Therefore, the stud bumps 13 are
Is eliminated from the electrode 21 and the electrical connection becomes incomplete, the semiconductor bare chip mounting module can be manufactured with a higher yield than the conventional one, and the reliability of the manufactured semiconductor bare chip mounting module is improved. You can

Further, since the protrusion of the thermosetting adhesive to the outer periphery of the semiconductor bare chip 10 at the time of temporary attachment is uniform over the entire outer periphery of the semiconductor bare chip 10, the thermosetting adhesive was thermally cured in the mounted state. The fillet of the thermosetting adhesive (see FIG. 8B) is uniformly formed over the entire outer circumference of the semiconductor bare chip 10. Next, a modified example of the nozzle 83 will be described.

The nozzle 83A shown in FIG. 5A has a rectangular cross section. This nozzle 83A is used with its long side 120 oriented at a right angle to the Y direction. By using the nozzle 83A in the above orientation, this allows the thermosetting adhesive to spread over a larger area than when using a cylindrical nozzle, as shown at 103A in FIG. 5 (B). It is spread, spread, and flattened.

Next, another thermosetting adhesive applying device applied to the semiconductor bare chip mounting method of the present invention will be described. As shown in FIG. 6 (A), the thermosetting adhesive application device 60A generally includes an XY robot 61, and
The adhesive application head 62A shown in (B), the Z-direction drive cylinder 63, the control circuit 70A, and the drive circuits 71 to 7
5 and.

In the adhesive application head 62A, the air blowing nozzles 130 and 131 are the nozzles 8 with the syringe 82 at the tip.
3 are provided on both sides in an oblique direction. A compressed air source 132 is connected to the air blowing nozzles 130 and 131 through a tube 133. An electromagnetic valve 134 is provided in the middle of the tube 133. The printed circuit board 20 is moved by the conveyor 88, and the printed circuit board 2 is moved.
When it is confirmed that 0 is fixed to the thermosetting adhesive application position, the control circuit 70A configured by the microcomputer operates as programmed, and the XY robot 61 operates to operate the syringe 82. Tip nozzle 83
Is moved to the position where the thermosetting adhesive is applied.

After that, the Z drive circuit 73 is operated by the control signal from the control circuit 70A, whereby the Z direction drive cylinder 63 is operated and the adhesive coating head 62 is operated.
Moves down in the Z2 direction and approaches the printed circuit board 20. Next, the dispenser drive circuit 74 is operated by the control signal from the control circuit 70, whereby the dispenser 85 is operated, and the compressed air of a predetermined pressure is sent at a predetermined timing for a predetermined time to remove the thermosetting adhesive 81. It is pushed out from the nozzle 83. As a result, as shown in FIG. 7A, a predetermined amount of the thermosetting adhesive 140 is applied in a mountain shape. Next, the electromagnetic valve drive circuit 75 is operated by the control signal from the control circuit 70, whereby the electromagnetic valve 134 is opened and is kept open for a predetermined time. When the electromagnetic valve 134 is opened, FIG.
As shown in, compressed air from the compressed air source 132 is blown from the air blowing nozzles 130 and 131, compressed air 135 blown from the air blowing nozzles 130 and 131,
136 is obliquely sprayed on the mountain-shaped thermosetting adhesive 140, and the mountain-shaped thermosetting adhesive 140 spreads on both sides.

Compressed air 135, 136 from the air blowing nozzles 130, 131 is a mountain-shaped thermosetting adhesive 140.
The thermosetting adhesive is made flat as indicated by reference numeral 141 in FIG. 7C by continuously spraying it obliquely for a predetermined time. After this, the semiconductor bare chip 10
It is implemented as shown in FIG. Further, a gas other than air may be blown out from the air blowing nozzles 130 and 131.

It should be noted that what is mounted using the adhesive applied as described above is not limited to the semiconductor bare chip 10 described above, but may be a semiconductor bare chip having no bumps or a resin-sealed semiconductor component. The semiconductor bare chip and the resin-sealed semiconductor component are collectively referred to as a semiconductor component. Further, the applied adhesive is not limited to a thermosetting adhesive.

[0035]

As described in the foregoing, according to the first aspect of the present invention was applied to distant plurality of locations adherend adhesive plan area on the substrate out of the adhesive from a single Roh nozzle, Finally
Move the nozzle sideways with the adhesive applied and
Move between the applied adhesives and apply last
The adhesive is stretched and applied at multiple points.
Because you like flat prolong the adhesives in adherend adhesion planned area, as compared with the case without stretching, to take place uniformly over the entire circumference of the protrusion is the outer periphery to the outer periphery of the adherend It is possible to prevent the adhesive from sticking out, and as a result, there is a problem that a part of the back surface of the adherend that the adhesive does not spread over or the adhesive wraps around the top surface of the adherend is created. Can be prevented.

[0036] 請 According to the invention as determined in claim 2 Following the operation of applying the distant plurality of locations adherend adhesive plan area on the substrate out of the adhesive from a single nozzle, and finally coated adhesive So that the adhesive is spread at the same time and the adhesive applied to a plurality of places is spread evenly within the area to be adhered to the adherend, the above-mentioned adhesive is applied at the same height as when the nozzle was last applied with the adhesive. Since the device has a means for moving the space between them, the adhesive can be stretched and flattened without providing special equipment.

[0037] According to the invention billed to claim 3, since a structure for mounting a semiconductor component using the adhesive applied by the adhesive application method according to claim 1, wherein the stretching of the applied adhesive Compared to the case where it is not performed, the thermosetting adhesive can be made to protrude uniformly to the outer periphery of the semiconductor component over the entire periphery of the semiconductor component. There is a part of the back surface of the part where the adhesive does not spread, or the adhesive wraps around the top surface of the semiconductor part and attaches to the suction head for temporary attachment, and when the suction head is separated from the semiconductor part, the semiconductor part sucks It was dragged by the head and the position where it was temporarily attached was displaced,
It is possible to prevent the occurrence of inconveniences such as impairing reliability and, in some cases, electrical connection being lost and mounting being defective.

[Brief description of drawings]

FIG. 1 is a diagram showing one thermosetting adhesive application device applied to a semiconductor bare chip mounting method according to an embodiment of the present invention.

FIG. 2 is a diagram showing a locus of a nozzle tip when a thermosetting adhesive is applied.

FIG. 3 is a diagram illustrating application of a thermosetting adhesive.

FIG. 4 is a diagram showing a semiconductor bare chip mounting method according to an embodiment of the present invention.

FIG. 5 is a diagram showing a modified example of a nozzle.

FIG. 6 is a diagram showing another thermosetting adhesive application device applied to the semiconductor bare chip mounting method according to an embodiment of the present invention.

FIG. 7 is a diagram showing a state in which the applied thermosetting adhesive is spread and flattened.

FIG. 8 is a diagram showing a semiconductor bare chip and a semiconductor bare chip mounting module.

FIG. 9 is a diagram showing application of a conventional thermosetting adhesive.

FIG. 10 is a diagram showing a conventional semiconductor bare chip mounting method.

[Explanation of symbols]

10 Semiconductor Bare Chip 13 Stud Bump 20 Printed Circuit Board 21 Electrode 30 Semiconductor Bare Chip Mounting Module 50 Adsorption Head 55 Pressure Heating Head 60, 60A Thermosetting Adhesive Applying Device 61 XY Robot 62, 62A Adhesive Applying Head 70, 70A Control Circuit 71 ˜75 Drive circuit 82 Syringe 83, 83A Nozzle 85 Dispenser 90 First point application step 91 Second point application step 92 Extending steps 103, 103A, 141 Flattened thermosetting adhesives 130, 131 Air blowing nozzles

─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Naoki Ishikawa 4-1-1 Kamitadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Limited (72) Inventor Satoshi Emoto 4-chome, Kamitadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture No. 1 within Fujitsu Limited (56) Reference JP-A-5-55276 (JP, A) JP-A-59-61141 (JP, A) JP-A-2-28337 (JP, A) 71443 (JP, U) Actually open 60-146342 (JP, U) Actually open 62-132783 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 B05C 11 / 02 H01L 21/52 H01L 21/56

Claims (3)

(57) [Claims] 1. An adhesive agent is discharged from a single nozzle and applied to a plurality of distant locations within an area to be adhered on an substrate to be adhered,
Finally, the nozzle is laterally moved in a state where the adhesive is applied and moved between the applied adhesives, so that the finally applied adhesive is extended and the adhesive applied to a plurality of places. The method for applying an adhesive comprises: 2. The adhesive is discharged from a single nozzle on the substrate.
Adhesives to be applied to a plurality of distant locations within the area to be adhered
Following the operation, stretch the glue with the last glue applied.
Adhesive to be adhered to the adhesive applied to multiple locations along with the bulk
The nozzle above should be maximized so that it is stretched flat within the intended area.
Adhesive applied above with the same height as when adhesive was applied later
An adhesive applying device having a structure having means for moving between the two . 3. The method of applying an adhesive according to claim 1.
The semiconductor component can be mounted using the adhesive applied by
A method of mounting a semiconductor component, comprising: