JP3270813B2 - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor device constituted by a bare chip component and a printed board for realizing the improvement of the reliability and productivity by disposing a conductive elastic element at the position corresponding to the chip electrode on a board electrode, and disposing a salient-pole to be press-bonded to the element on the chip electrode. SOLUTION: The semiconductor device 10 is constituted by the bare chip component 1 and a printed board 2 of an LSI and fixing the component 1 and the board 2 by using adhesive 7 while electrically connecting the chip electrode 3 of the component 1 to the board electrode 6 of the board 2. In such a semiconductor device 10, an elastic element 8 having conductivity is disposed at the position corresponding to the electrode 3 of the electrode 6, and a salient- electrode 4 to be press-bonded to the element 8 is disposed on the electrode 3. For example, the bare chip component placing position of the board 2 is coated with the adhesive 7, and the coating adhesive 7 is cured while press- bonding the electrode 4 to the element 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, and a method of manufacturing the semiconductor device, and more particularly to a semiconductor device realizing improved reliability and productivity. And a method of manufacturing the semiconductor device.

[0002] Electronic equipment manufacturers are
By purchasing I and mounting it on a printed circuit board, electronic devices will be manufactured. Recently, there has been an increasing demand for miniaturization of electronic devices. From now on, electronic device manufacturers have been instructed by semiconductor manufacturers to supply bare chip components of unpackaged LSIs (a bare chip in which only electrodes are formed on a silicon substrate). (LSI parts) are purchased and mounted on printed circuit boards.

[0003] As a method of mounting the bare chip component, a configuration is adopted in which the bare chip component is fixed to the printed circuit board in such a manner that its electrodes face the same direction as the electrodes of the printed circuit board. The method of mounting on a printed circuit board by electrically connecting the electrodes to the printed circuit board, and the method of mounting the bare chip component on the printed circuit board by fixing the bare chip component to the printed circuit board while joining the electrodes of the bare chip component and the electrodes of the printed circuit board There is.

The latter mounting method is called face-down mounting, and has the advantage that bare chip components can be mounted at a higher density than the former mounting method, but has the drawback that reliability and productivity are low.

[0005] In order to further reduce the size of electronic equipment, bare chip components that achieve high density mounting and high reliability and productivity by solving the drawbacks of the face-down mounting. It is necessary to establish an implementation method for.

[0006]

2. Description of the Related Art FIG. 26 shows an example of the structure of a semiconductor device composed of a bare chip part of an LSI mounted according to face-down mounting and a printed circuit board.

As shown in FIG. 1, in a semiconductor device composed of a bare chip component 1 mounted according to face-down mounting and a printed circuit board 2, the bare chip component 1
The protruding electrode 4 called a bump is provided on the chip electrode 3 of
A conductive paste 5 is adhered to the protruding electrode 4, and the bare chip component 1 and the printed board 2 are bonded to each other with the protruding electrode 4 having the conductive paste 5 adhered to the board electrode 6 of the printed board 2. 7 is adopted.

[0008] Incidentally, the bare chip component 1 is, for example,
It is composed of a silicon substrate having a size of about 10 mm × 10 mm and a thickness of about 0.4 mm, and is formed of aluminum or the like having a size of about 100 μm × 100 μm and a height of about several μm on its outer periphery. 200 to 300 chip electrodes 3 are arranged. The bare chip component 1 and the printed circuit board 2
Is about 80 μm, and the height of the protruding electrode 4 is 50 μm.
μm, and the height of the substrate electrode 6 is about 25 μm.

Conventionally, such a semiconductor device is shown in FIG.
7 was manufactured. That is, first, in a bare chip bump forming step, the tip of a gold wire protruding from the tip of a capillary is melted by electric discharge to form a ball by a wire bonding method, and the ball is formed using ultrasonic vibration. After bonding to one chip electrode 3, a gold wire is cut at the neck of the ball to form a ball-shaped protruding electrode 4 having a size of about 60 μm on the chip electrode 3 of the bare chip component 1. .

Subsequently, in a bump leveling step, the bare chip component 1 is lightly pressed against a smooth glass substrate, thereby removing the variation in the height of the cut portion of the protruding electrode 4 and making the height of the protruding electrode 4 uniform.

Subsequently, in a conductive paste transfer step, a conductive paste (constituted by mixing a metal piece into an adhesive) is applied to a thickness of about 15 μm on a glass substrate, and the bare chip component 1 is The conductive paste 5 was transferred to the end face of the protruding electrode 4 by being brought into contact with the glass substrate coated with the conductive paste, and thereafter, the bare chip component 1 was heated for a certain period of time to be attached to the protruding electrode 4. The conductive paste 5 is semi-cured. The conductive paste 5 is made of U
In the case of exhibiting V-curing characteristics, the composition is semi-cured by irradiating ultraviolet rays.

Subsequently, in a mounting step, the bare chip component 1 is positioned on the printed circuit board 2 to which the adhesive has been applied in the adhesive applying step, and then the state is maintained.
By heating for a predetermined time, the adhesive 7 between the bare chip component 1 and the printed board 2 is hardened, and the conductive paste 5 is completely hardened, thereby completing the semiconductor device. When the conductive paste 5 and the adhesive 7 show UV curing properties, they are cured by irradiating ultraviolet rays.

[0013]

As described above, conventionally, the protruding electrode 4 is formed on the chip electrode 3 of the bare chip component 1, and the protruding electrode 4 is brought into contact with the substrate electrode 6 of the printed circuit board 2. Adhesive 7 with the printed circuit board 2
When adopting the configuration in which the conductive paste 5 is used, the configuration in which the reliability of the electrical connection between the protruding electrode 4 and the substrate electrode 6 is ensured by using the conductive paste 5 is adopted.

However, the conductive paste 5
In the case of adopting the configuration using the method, heat treatment must be performed in each of the conductive paste transferring step and the mounting step, and thus there is a problem that the productivity of the semiconductor device is poor.

In the conductive paste transfer step, a conductive paste must be applied to the glass substrate and transferred to the protruding electrode 4, which has a problem that the productivity of the semiconductor device is low. In addition, this conductive paste must be applied thinly and uniformly. However, if the metal pieces mixed in the conductive paste hinder uniform application, or if the amount of conductive paste applied is large, the adjacent chip electrode Controlling this coating is one of the extremely difficult tasks, for example, the electrical contact of 3.

Further, the thermal expansion coefficient of the printed circuit board 2 made of a resin such as a glass epoxy resin is several times larger than the thermal expansion coefficient of the bare chip part 1 made of silicon. As a result, a force for peeling off the joint between the conductive paste 5 and the substrate electrode 6 is generated, and the force cannot be absorbed even when the adhesive is fixed with the adhesive 7, which may cause a disconnection or a partial disconnection of the electrical connection. There was a problem.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device including a bare chip component and a printed circuit board which realizes improvement in reliability and productivity. It is an object to provide a method for manufacturing the semiconductor device.

[0018]

1 SUMMARY OF THE INVENTION The present onset Ming semiconductor
FIG view the structure of a semiconductor device to be manufactured in the apparatus manufacturing process. In the figure, it is produced in this onset Ming semiconductor device manufacturing method 10
A semi-conductor device, is composed of a bare chip 1 and the printed board 2 of LSI, while connecting the chip electrode 3 of bare chip 1 and electrically substrate electrode 6 of the printed circuit board 2, the bare chip 1 The printed circuit board 2 is fixed by using an adhesive 7.

[0019] Figure 1 semiconductors device 10 simply showing figure (a) is
A configuration in which a conductive elastic body 8 having conductivity is provided at a position corresponding to the chip electrode 3 of the substrate electrode 6, and a protruding electrode 4 to be pressed against the conductive elastic body 8 is provided on the chip electrode 3. take.

[0020] The simply showing figure FIGS. 1 (a) semi-conductor device 10
Forms a protruding electrode 4 to the tip electrode 3, as well as the shape formed the conductive elastic body 8 to the substrate electrode 6, the conductive who its formation
The shape of the elastic body 8 is regulated by heating and pressing.
The bare chip part 1 is pressed against the printed circuit board 2 while applying the adhesive to the bare chip part mounting position of the printed circuit board 2 and pressing the protruding electrode 4 against the conductive elastic body 8. And by curing the applied adhesive.

[0021] The simply showing figure FIGS. 1 (a) semi-conductor device 10
Then, since the conductive elastic body 8 has conductivity and elasticity,
Even if the bare chip component 1 is displaced away from the printed circuit board 2, as shown in FIG. 2 (a), the elastically deformed conductive elastic body 8 tends to return to its original shape. Meshes with the elastic body 8 without any gap,
As a result, the electrical connection between the chip electrode 3 and the substrate electrode 6 is reliably ensured without using the conductive paste and without leveling the protruding electrode 4.

Further, even if the bare chip part 1 and the printed board 2 are displaced laterally due to the difference between the coefficient of thermal expansion of the bare chip part 1 and the coefficient of thermal expansion of the printed board 2,
Since the conductive elastic body 8 attempts to return to the original shape, the protruding electrode 4 meshes with the conductive elastic body 8 without any gap, and as a result, even if the temperature changes, the chip electrode 3 and the substrate electrode 6
And the electrical connection between them is ensured.

Further, if the conductive elastic body 8 is formed into a concave shape or a convex shape, the contact area between the protruding electrode 4 and the conductive elastic body 8 increases, so that the chip electrode 3 and the substrate electrode 6 are formed.
And the electrical connection between them is ensured.

On the other hand, the semi-conductor that shown FIG. In FIG. 1 (b) device 1
0 (the semiconductor device 10 according to the third aspect of the present invention).
), The portion of the substrate electrode 6 corresponding to the chip electrode 3 is
A configuration is shown in which the shape is recessed inside the printed circuit board 2, and the protruding electrode 4 is provided on the chip electrode 3 so as to be pressed against the recess.

[0025] The simply showing FIG FIG 1 (b) semi-conductor device 10
Forms a protruding electrode 4 on the chip electrode 3, applies an adhesive to the bare chip component mounting position of the printed circuit board 2, and adjusts the position of the protruding electrode 4 and the substrate electrode 6 while attaching the bare chip component 1 to the adhesive. It can be manufactured by placing the bare chip component 1 on the printed substrate 2 on which the coating is performed, pressing the bare chip component 1 on the printed substrate 2 until the substrate electrode 6 is depressed, and curing the applied adhesive during the pressing.

[0026] The simply showing FIG FIG 1 (b) semi-conductor device 10
In this case, even if the bare chip component 1 is displaced in a direction away from the printed circuit board 2, even if the substrate electrode 6 has a shape recessed inside the printed circuit board 2, as shown in FIG. Since the concave portion tries to return to the original shape, the protruding electrode 4 meshes with the substrate electrode 6 without any gap, and as a result, without using a conductive paste, and without leveling the protruding electrode 4 Even so, electrical connection between chip electrode 3 and substrate electrode 6 is reliably ensured.

Further, even if the bare chip part 1 and the printed board 2 are shifted laterally due to the difference between the coefficient of thermal expansion of the bare chip part 1 and the coefficient of thermal expansion of the printed board 2,
Since the concave portion of the substrate electrode 6 acts to suppress the movement of the protruding electrode 4, even if the temperature changes, the chip electrode 3
The electrical connection between the substrate electrode 6 and the substrate electrode 6 is reliably ensured.

In addition, since the contact area between the protruding electrode 4 and the substrate electrode 6 is increased, the electrical connection between the chip electrode 3 and the substrate electrode 6 is ensured. Thus, according to the semi-conductor device 10 to be manufactured in a semiconductor device manufacturing method of the present invention, in the case of a configuration for bonding the bare chip 1 and the printed board 2 in a face-down, using a conductive paste Production without high production cost, and the production of bare chip parts 1
And the printed circuit board 2 can be reliably connected to each other, so that high reliability can be realized.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail according to embodiments. FIG. 3 shows a semiconductor device manufacturing method of the present invention.
It illustrates an example of a manufacturing line for implementing the law.

As shown in this figure, the semiconductor device of the present invention
Manufacturing line for implementing the manufacturing method, a bump bonder 20, a dispenser 21, a centrifugal vacuum deaerator 2
2 and a chip bonder device 23.

Upon receiving the bare chip component 1 from the transport line, the bump bonder 20 forms a projecting electrode 4 called a bump on the chip electrode 3 of the bare chip component 1.

As shown in FIG. 4, the bump bonder 20 has an XY stage 2 for fixing the bare chip component 1.
00, a gold wire storage box 201 for storing a gold wire serving as a material of the protruding electrode 4, a capillary 202 for guiding the gold wire supplied from the gold wire storage box 201 to the position of the chip electrode 3 of the bare chip component 1, A tension clamper 2 that pulls up a gold wire supplied to the capillary 202 to apply tension to the gold wire supplied to the capillary 202.
03, a cut clamper 204 that cuts the gold wire by pulling up the gold wire fused to the chip electrode 3 of the bare chip component 1, and a CCD camera 205 that detects the position of the chip electrode 3 of the bare chip component 1. , An unillustrated torch unit and an ultrasonic oscillator.

Here, the wire storage box 201 / capillary 202 / tension clamper 203 / cut clamper 2
The 04 / CCD camera 205 / torch unit constitutes an integrated bonding head and is configured to be movable in the XY directions by a mechanism (not shown).

In the bump bonder device 20 configured as described above, when the positioning of the chip electrode 3 of the bare chip component 1 is completed, the torch unit (not shown) is moved to the tip of the gold wire to perform discharge, thereby causing the tip of the gold wire to discharge. A ball is formed on the chip electrode 3 by using a capillary 202 and then the ball is brought into contact with the chip electrode 3 and then the capillary 202 is ultrasonically oscillated using an ultrasonic oscillator to melt the ball on the chip electrode 3. Then, the gold wire is pulled up using the cut clamper 204 to cut the ball and the gold wire, so that a ball-shaped protrusion having a size of about 60 μm is formed on the chip electrode 3 of the bare chip component 1. The electrode 4 is formed.

The dispenser device 21, when receiving the printed circuit board 2 from the transport line, applies an adhesive on the printed circuit board 2. As shown in FIG. 5, the dispenser device 21 includes an XY table 210 for fixing the printed circuit board 2 and moving the same in the XY directions.
A holder 212 for holding the syringe 211 filled with the adhesive; a discharge needle 213 for discharging a small amount of the adhesive filled in the syringe 211 onto the printed circuit board 2;
And a pressing mechanism (not shown).

The dispenser device 2 configured as described above
In 1, when the positioning of the printed circuit board 2 is completed, the adhesive filled in the syringe 211 is pushed out by using a pressing mechanism (not shown), so that the adhesive is applied to the printed circuit board 2.

When the centrifugal vacuum defoaming device 22 receives the adhesive filled in the syringe 211 (communicated with the outside through a small gap) from the transport line, the bubble contained in the adhesive is removed. Is removed and supplied to the dispenser device 21.

As shown in FIG. 6, the centrifugal vacuum defoaming device 22 has a rotating body 220 for fixing two syringes 211 filled with an adhesive and an opening for connecting the syringe 211 fixed to the rotating body 220. 221 having a hollow member 222
A motor 223 for rotating the rotating body 220; and a decompression chamber 224 for accommodating the rotating body 220 while maintaining airtightness.
, A lid 225 that opens the decompression chamber 224, and a decompression source 226 that suctions the decompression chamber 224 to reduce the internal pressure of the decompression chamber 224.

The centrifugal vacuum defoaming apparatus 2 configured as described above
In 2, the two syringes 211 filled with the adhesive are fixed to the rotating body 220, and when the connection by the hollow member 222 is completed, the internal pressure of the decompression chamber 224 is reduced using the decompression source 226, and the motor 223 is turned off. To rotate the rotating body 220. Thereby, the syringe 211
The air bubbles contained in the adhesive filled in are removed from the adhesive by moving toward the opening 221 of the hollow member 222 according to the centrifugal action and the depressurizing action.

When the chip bonder device 23 receives the bare chip component 1 from the bump bonder device 20 via the transport line and receives the printed circuit board 2 coated with the adhesive from the dispenser device 21 via the transport line, The semiconductor device 10 of the present invention is manufactured by joining the bare chip component 1 and the printed board 2.

As shown in FIG. 7, the chip bonder device 23 includes an orienter 230 for placing the bare chip component 1 and correcting the inclination thereof roughly, and a pickup head 23 for setting the bare chip component 1 on the orienter 230.
1 and an optical probe 2 for capturing an image of the circuit surface of the bare chip component 1 and an image of the substrate surface of the printed circuit board 2
32, a stage 233 for fixing the printed circuit board 2,
Pick up the bare chip component 1 placed on the orienter 230 and print the printed circuit board 2 fixed to the stage 233.
A load cell 235 for measuring the pressing force of the bonding head 234;
An encoder 236 for measuring the amount of movement of the bonding head 234. Here, the bonding head 23
4 has a heating mechanism for heating the bare chip component 1, and the stage 233 has a heating mechanism for heating the printed circuit board 2.

In the chip bonder device 23 configured as described above, when the orientation of the bare chip component 1 is roughly set to a prescribed one using the orienter 230, the bonding head 234 is moved to pick the bare chip component 1, and the bare chip component 1 is picked up. Stage 2 of picked bare chip part 1
After moving to the position 33, the optical probe 232 is inserted between the bare chip component 1 and the printed circuit board 2 to perform alignment, and then the bare chip component 1 is heated while being pressed against the printed circuit board 2 to perform printing. The semiconductor device 1 is manufactured by curing the adhesive applied to the substrate 2.

Next, a manufacturing method of the thus configured with the manufacturing line that is implemented semi-conductor device 10 will be described in detail. First, the structure shown in FIG.
One method of manufacturing a semi-conductor device 10 will be described.

The semi-conductor device 10 having the structure shown in FIG. 1 (a), the position corresponding to the tip electrode 3 of the substrate electrode 6, with disposing the conductive elastic body 8 having conductivity, chips The present invention is characterized in that the electrode 3 is provided with a protruding electrode 4 which is pressed against the conductive elastic body 8.

[0045] Figure 8 illustrates one embodiment of a method for manufacturing a semi-conductor device 10 of this. According to this embodiment, FIG.
In the production of semi-conductor device 10 having the illustrated structure, first of all, by using a bump bonder 20, to form a projecting electrode 4 to the tip electrode 3 of the bare chip 1.

In parallel with the formation of the protruding electrodes 4, the conductive elastic bodies 8 are formed on the substrate electrodes 6 of the printed circuit board 2. As shown in FIG. 9, the conductive elastic body 8 is formed by bonding a highly malleable metal such as gold to the substrate electrode 6 by wire bonding or welding using, for example, a bump bonder device 20, and then forming the capillary. The upper surface is formed by pressing and heating with a wedge to form a concave shape, or is formed by bonding conductive rubber having a concave shape to the substrate electrode 6.

The reason why the shape of the conductive elastic body 8 is made concave is to obtain a large bonding area by deformation and meshing. Therefore, when the protruding electrode 4 has a convex shape, the shape is changed accordingly. 10A is formed so as to have a concave shape as shown in FIG. 10A or a wedge-shaped concave shape as shown in FIG. 10B.
It is formed so as to show a convex shape as shown in FIG.

After the formation of the conductive elastic body 8, subsequently, an adhesive is applied to the printed circuit board 2 using the dispenser device 21. In this way, the protruding electrode 4 is formed on the chip electrode 3 of the bare chip component 1, the conductive elastic body 8 is formed on the substrate electrode 6 of the printed circuit board 2, and the adhesive is applied to the printed circuit board 2. Subsequently, the bare chip component 1 is mounted on the printed circuit board 2 while the protruding electrode 4 and the conductive elastic body 8 are pressed and connected by pressure, and the adhesive is cured by performing a heating operation, and then the load is released. semiconductors device 10 having the structure shown in FIGS. 1 (a) by
Complete the production of

As described above, the structure shown in FIG.
Semi conductor arrangement 10 having, along can be produced without using a conductive paste, since it can be produced even without a leveling projection electrodes 4 (may be carried out), it becomes possible to manufacture with high productivity.

Even if the bare chip part 1 is displaced away from the printed circuit board 2, the elastically deformed conductive elastic body 8 tends to return to the original shape.
Are engaged with the conductive elastic body 8 without any gap, and as a result, the electrical connection between the chip electrode 3 and the substrate electrode 6 is reliably ensured without using a conductive paste.

Further, even if the bare chip part 1 and the printed board 2 are displaced laterally due to the difference between the coefficient of thermal expansion of the bare chip part 1 and the thermal expansion coefficient of the printed board 2,
Since the elastically deformed conductive elastic body 8 tries to return to the original shape, the protruding electrode 4 meshes with the conductive elastic body 8 without any gap, and as a result, even if the temperature changes, the chip electrode 3
The electrical connection between the substrate electrode 6 and the substrate electrode 6 is reliably ensured.

In the manufacturing method shown in FIG. 8, the structure in which the conductive elastic body 8 is formed on the substrate electrode 6 of the printed circuit board 2 is adopted. However, as shown in FIG. An elastic body 9 such as rubber or resin is provided at the position of the printed board 2 to be used, and a flexible printed wiring board 6a is used as the board electrode 6, so that the protruding electrode 4 can be flexible without using a conductive paste. The same effect can be exerted by employing a configuration in which the bare chip component 1 is pressed down to the printed wiring board 6a and the bare chip component 1 is joined face down to the printed circuit board 2.

This configuration can be applied to the case where the shape of the protruding electrode 4 is convex or concave, and the elastic body 9 and the flexible printed wiring board 6a are formed instead of forming the conductive elastic body 8. It will be formed in a forming step. here,
In order to increase the bonding area between the protruding electrode 4 and the flexible printed wiring board 6a, it is preferable that the shape of the flexible printed wiring board 6a be adjusted to the shape of the protruding electrode 4 by using a heating bending process. Where this figure
The semiconductor device 10 having the structure shown in FIG.
Corresponds to the semiconductor device 10 of the present invention.

Further, in the manufacturing method shown in FIG. 8, the configuration in which the conductive elastic body 8 is formed on the substrate electrode 6 of the printed circuit board 2 is adopted. However, as shown in FIG. 8, the projecting electrode 4 is pressed against the substrate electrode 6 without using a conductive paste, and the bare chip component 1 is face-down joined to the printed circuit board 2 without using a conductive paste. The same effect can be exerted by adopting a configuration that performs the above.

In the case of adopting this configuration, as shown in FIG. 12, the projecting electrodes 4 are formed on the chip electrodes 3 of the bare chip component 1, the adhesive is applied to the printed circuit board 2, and then the bare chip component 1 is pressed. Then, the mounting is performed on the printed circuit board 2 and the adhesive is cured by a heating operation.

This configuration is preferably applied when the shape of the protruding electrode 4 is convex. It is preferable that the printed circuit board 2 used at this time has a large elastic deformation.
A material with a low glass fiber content and a high resin component, the glass transition temperature of the resin is higher than the heat curing temperature of the adhesive, the coefficient of thermal expansion is low, and the dimensional stability during heat curing of the adhesive is high. It is preferable to use

Next, the semiconductor device of the present invention described in FIG single lifting a structure illustrated in (b) semi <br/> conductor arrangement 10 (according to claim 3
10) will be described. FIG. 1 (b)
Semiconductors device 10 having the illustrated structure, the portion corresponding to the tip electrode 3 of the substrate electrode 6, with showing a shape recessed in the substrate, the tip electrode 3, the protruding electrodes 4 for crimping to the concave shape It is characterized by adopting a configuration of disposing.

[0058] Figure 13, the semi-conductor device having a structure of this 10
1 illustrates an embodiment of a method for manufacturing a semiconductor device. According to this embodiment, when producing semi-conductor device 10 having the structure shown in FIG. 1 (b), first of all, the bump bonder 2
The protruding electrode 4 is formed on the chip electrode 3 of the bare chip component 1 using 0.

In parallel with the formation of the protruding electrodes 4, an adhesive is applied to the printed circuit board 2 using the dispenser device 21. In this manner, the protruding electrodes 4 are formed on the chip electrodes 3 of the bare chip component 1 and the printed circuit boards 2 are formed.
The adhesive is applied to the chip bonder device 2
3, the bare chip component 1 is placed on the printed circuit board 2 while accurately aligning the protruding electrode 4 and the substrate electrode 6, and then a load is applied to the bare chip component 1 until the substrate electrode 6 becomes concave. The bare chip component 1 is pressed against the printed circuit board 2 by the addition, and a heat treatment is performed in that state, whereby the adhesive between the bare chip component 1 and the printed circuit board 2 is cured. (B)
With the structure illustrated in completing the fabrication of semi-conductor device 10.

As described above, the structure shown in FIG.
Semi conductor arrangement 10 having, along can be produced without using a conductive paste, since it can be produced even without a leveling projection electrodes 4 (may be carried out), it becomes possible to manufacture with high productivity.

Even if the bare chip component 1 is displaced away from the printed circuit board 2,
Due to the elasticity of the substrate electrode 6, the concave portion of the substrate electrode 6 joined to the protruding electrode 4 tries to return to the original shape, so that the protruding electrode 4 meshes with the substrate electrode 6 without any gap, and as a result, the conductive paste is not used. However, the chip electrode 3 and the substrate electrode 6
And the electrical connection between them is ensured.

Furthermore, even if the bare chip part 1 and the printed board 2 are shifted laterally due to the difference between the coefficient of thermal expansion of the bare chip part 1 and the coefficient of thermal expansion of the printed board 2,
Since the concave portion of the substrate electrode 6 acts to suppress the movement of the protruding electrode 4, even if the temperature changes, the chip electrode 3
The electrical connection between the substrate electrode 6 and the substrate electrode 6 is reliably ensured.

In addition, since the contact area between the protruding electrode 4 and the substrate electrode 6 is increased, the electrical connection between the chip electrode 3 and the substrate electrode 6 is ensured. Semiconductors device 10 having the structure shown in FIG. 1 (b), the printed circuit board 2
Is also used to ensure the electrical connection between the chip electrode 3 and the substrate electrode 6 by utilizing the elasticity. From this, it is preferable to use a printed circuit board 2 made of a material exhibiting sufficient elastic deformation. Since the plastic deformation increases when the temperature is higher than the glass transition temperature, prints made of a material with a large difference between the glass transition temperature and the temperature applied during the heat curing of the adhesive, that is, a material having a high glass transition temperature It is preferable to use the substrate 2.

In this embodiment, the protruding electrode 4 is formed by a wire bonding technique. However, a method of forming the protruding electrode 4 by using another technique such as a plating technique or a transfer technique is employed. It is also possible. Further, the protruding electrode 4 is not limited to a metal bump such as a gold bump, but may be a resin bump.

FIG. 14 and FIG. 15 show diagrams in FIG.
It illustrates another embodiment of a method for manufacturing a semi-conductor device 10 having the structure. These embodiments are characterized by having a processing step of removing air bubbles contained in the adhesive applied to the printed circuit board 2. If the adhesive contains air bubbles, the bonding force between the bare chip component 1 and the printed circuit board 2 will be weakened, and it will be difficult to control the amount of the adhesive to be applied. It has a processing step of removing air bubbles contained in the adhesive applied to the substrate.

In the embodiment shown in FIG. 14, the centrifugal vacuum defoaming device 22 is used to remove air bubbles contained in the adhesive applied to the printed circuit board 2 before the adhesive application step performed in the embodiment shown in FIG. A configuration is employed in which a defoaming step of removing air bubbles is included to remove air bubbles contained in the adhesive applied to the printed circuit board 2.

In the embodiment shown in FIG. 15, on the other hand, after the adhesive application step performed in the embodiment of FIG. 14, the adhesive of the printed circuit board 2 of the stage 233 of the chip bonder device 23 is used. Printed circuit board 2 coated with
Is provided with a heating step of temporarily heating air bubbles to remove air bubbles mixed during the application of the adhesive.

That is, as shown in FIG. 16, when the adhesive is applied to the printed circuit board 2 due to the unevenness of the surface of the printed circuit board 2, the adhesive is taken into consideration in consideration of the accumulation of air bubbles in the unevenness. The viscosity of the adhesive is lowered by temporarily heating the printed circuit board 2 on which is coated, so that the air bubbles accumulated in the irregularities are removed.

FIG. 17 has the structure shown in FIG.
One illustrates another embodiment of a method for manufacturing a semi-conductor device 10.
In this embodiment, a surface treatment step of forming irregularities on the surface of the substrate electrode 6 of the printed circuit board 2 is provided before the adhesive application step performed in the embodiment of FIG. 6 to improve the reliability of the electrical connection between them.

That is, as shown in FIG. 18, irregularities of about several μm are formed on the gold plating on the surface of the substrate electrode 6 and the bumps of the protruding electrode 4 are engaged with the irregularities.
Even if the reliability of the electrical connection between the protruding electrode 4 and the substrate electrode 6 is increased, or even if the surface of the substrate electrode 6 is thin or not plated with gold, the surface of the substrate electrode 6 has a thickness of about several μm. Irregularities are formed, and projecting electrodes 4 are formed on the irregularities.
In this configuration, the reliability of the electrical connection between the protruding electrode 4 and the substrate electrode 6 is improved by engaging the gold bumps or the like.

The surface treatment of the substrate electrode 6 is performed as shown in FIG.
As shown in (a), the bonding head 234 of the chip bonder device 23 attracts a SUS plate or a ceramic plate having a surface with irregularities of about several μm, and presses the SUS plate or the ceramic plate against the printed circuit board 2 to execute the process. As shown in FIG. 19 (b), a capillary 202 having an irregularity of about several μm at the tip is attached to the bump bonder device 20, and the capillary 202 is beaten against the substrate electrode 6, and the process is executed.
As shown in (a), a SUS plate on which particles having high hardness of about several μm are attached to the bonding head 234 of the chip bonder 23, and the SUS plate is attached to the printed board 2.
20B, or as shown in FIG. 20B, a chip bonder device 23 in which high-hardness particles of about several μm are scattered on the surface of the printed circuit board 2 and a flat SUS plate is mounted thereon. After the bonding head 234 is pressed against the printed circuit board 2, it is executed by removing the scattered particles using a solvent or the like.

Next, the adhesive coating process performed by the manufacturing method shown in FIG. 13 and the like will be described in detail. Conventionally, when applying an adhesive to the printed circuit board 2, the dispenser device 21 is used to apply the adhesive to the center of the mounting position of the bare chip component 1. However, if such an application method is followed, there is a problem that the adhesive is not applied to the end positions of the bare chip component 1 as shown in FIG. That is, the adhesive applied to the center position spreads in a circular shape in response to the pressing of the bare chip component 1, so that the bare chip component 1
Before reaching the end position of the bare chip component 1, since the flow path resistance in the protruding direction becomes smaller thereafter, the component protrudes only in that direction. There was a problem that the adhesive was not applied to the end position.

Therefore, in the present invention, as shown in FIG. 22, the center point of the bare chip component placement position, the four end points of the bare chip component placement position, and the four points between the center point and those end points. The intermediate point is set as the application position, and the amount of application at the intermediate point is reduced from the center point, and the amount of application at the end point is reduced from the intermediate point. Take a configuration. With this configuration, as shown in FIG. 23, the adhesive is applied neatly to the end point of the mounting position of the bare chip component without involving air bubbles. Note that the application of the adhesive to the intermediate points can be omitted, and more intermediate points can be set as the application positions.

Next, a description will be given of the load application process executed in the mounting step of the manufacturing method shown in FIG. In the present invention, after placing the bare chip component 1 on the printed circuit board 2, the bare chip component 1 is pressed against the printed circuit board 2 by applying a load to the bare chip component 1 until the substrate electrode 6 becomes concave. By performing the heat treatment,
The adhesive between the bare chip 1 and the printed board 2 to be cured, then, to produce a semi-conductor device 10 having the structure shown in FIG. 1 (b) by opening a load. It is necessary to accurately apply the load to the bare chip component 1.

Therefore, in the present invention, the relationship between the load corresponding to the width / length of the substrate electrode 6 and the amount of depression (the amount of depression) of the substrate electrode 6 is determined in advance for each type of the printed circuit board 2. Measurement is performed, and a correlation between the load per unit area and the amount of depression of the substrate electrode 6 is obtained from the result. Then, the width / length of the substrate electrode 6 of the printed circuit board 2 to be processed is measured using the optical probe 232 of the chip bonder device 23, and the measured value is compared with the correlation obtained in advance. In this case, the load applied to the bare chip component 1 is determined so that a load process corresponding to the substrate electrode 6 is performed.

The printed circuit board 2
Different lots make it possible to apply a load suitable for the width of the substrate electrode 6 when the width of the substrate electrode 6 changes, and in any case, realize the required amount of depression of the substrate electrode 6 become able to. The measurement of the width / length of the substrate electrode 6 of the printed circuit board 2 to be processed is performed at a plurality of points to obtain an average value.
At this time, it is preferable to include an end portion and a central portion where the variation in the width of the substrate electrode 6 is large.

Further, in the present invention, when a load is applied to the bare chip component 1, a two-stage load application process may be executed in order to positively remove bubbles contained in the adhesive.

That is, as shown in FIG. 24, when a load is applied to the bare chip component 1, a small load is applied to the bare chip component 1 until the temperature rise due to heating reaches a specified value. After a predetermined value is reached, a low load is applied to the bare chip component 1 at first, and then a large load is applied to the bare chip component 1 to realize a required amount of depression of the substrate electrode 6. There may be a configuration in which a two-stage load application process is performed. Here, it is also possible to control the load switching timing using time.

With this configuration, since the load is initially small, the dent of the substrate electrode 6 hardly occurs. At that time, the gap between the bare chip component 1 and the printed circuit board 2 is large, and the viscosity of the adhesive is reduced due to a rise in temperature. Therefore, the air bubbles contained in the adhesive are in a state of being easily generated. After that, before the curing of the adhesive starts, the load is increased to a predetermined value, thereby realizing the required amount of depression of the substrate electrode 6. At this time, the air bubbles that are in a state that is likely to come out are removed in a form that is pushed out together with the adhesive.

Further, in the present invention, instead of adopting a method of controlling the load applied to the bare chip component 1 to be constant, the amount of the depression becomes constant by detecting the amount of the depression of the substrate electrode 6. May be adopted.

The amount of depression of the substrate electrode 6 can be measured using the encoder 236 of the chip bonder 23. In this case, it is necessary to consider the amount of collapse of the protruding electrode 4. That is, since the amount of depression measured by the encoder 236 of the chip bonder device 23 includes the amount of collapse of the protruding electrode 4, the value obtained by subtracting the amount of collapse from the measured amount of depression is the original substrate electrode. The dent amount is 6.

Therefore, according to the present invention, as shown in FIG. 25, the load applied to the protruding electrode 4 and the
Is adopted, the bonding head 234 sucking the bare chip component 1 is pushed down toward the printed circuit board 2 and the load at that time is measured by the load cell 235.

The position at which the load cell 235 senses the application of the load is set as the origin, and
Press down on 34. At this time, if the load applied to the load cell 235 is f, the crush amount of the protruding electrode 4 is obtained as α (f) in accordance with the correspondence shown in FIG. Is obtained as a value obtained by subtracting the crush amount α (f) of the protruding electrode 5 from the following equation.
The bonding head 234 is pushed down to a specified value. This makes it possible to control the amount of depression of the substrate electrode 6 to be constant.

Here, in this configuration, when the substrate electrode 6 is depressed, the protruding electrode 4 is also deformed at the same time. However, in advance, the load at which the protruding electrode 4 is not further deformed (FIG. 25) keep seeking F ₁₎ in, by applying the load value F ₁ to the protruding electrodes 4 of the bare chip 1, and set so that it is no longer deform the bare chip 1 more to the chip bonder 23 You may go. By doing so, it is possible to control the recess amount of the substrate electrode 6 to be constant only by looking at the encoder 236 of the chip bonder device 23.

In this configuration, the substrate electrode 6 is recessed to a specified value at a time. However, a large load is required to realize the recess due to the high elastic modulus of the printed circuit board 2. In other words, the elastic modulus of the printed circuit board 2 decreases with an increase in temperature at a high temperature before the start of curing of the adhesive when the adhesive is heated at a low temperature during the heat treatment. , A configuration may be adopted in which the concave portion is formed so that the final concave amount can be realized. With this configuration, an effect of removing air bubbles contained in the adhesive can be expected as described above.

The present invention has been described with reference to the illustrated embodiments.
The present invention is not limited to this. For example, in the embodiment, it is assumed that a heat-curing type adhesive is used as an adhesive for joining the bare chip component 1 and the printed board 2, but the present invention is not limited to this.
It can be applied to the case where another type such as a V-curing type is used.

[0087]

As described above, according to the present invention, produced by the present onset Akira
According to the semi-conductor device which is, in the case of a configuration for bonding the bare chip and the printed circuit board in a face-down, since it can be manufactured without the use of conductive paste, it becomes to be produced with high productivity Since the electrical connection between the bare chip component and the printed circuit board can be ensured, high reliability can be realized.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a semiconductor device manufactured according to the present invention.
It is.

FIG. 2 is an explanatory diagram of a semiconductor device manufactured according to the present invention.
It is.

FIG. 3 is an explanatory diagram of a semiconductor device manufacturing line.

FIG. 4 is an explanatory diagram of a bump bonder device.

FIG. 5 is an explanatory diagram of a dispenser device.

FIG. 6 is an explanatory view of a centrifugal vacuum deaerator.

FIG. 7 is an explanatory diagram of a chip bonder device.

FIG. 8 is an embodiment of the present invention.

FIG. 9 is an embodiment of the present invention.

FIG. 10 is an explanatory diagram of a conductive elastic body.

FIG. 11 is another embodiment of the present invention.

FIG. 12 is another embodiment of the present invention.

FIG. 13 is an embodiment of the present invention.

FIG. 14 is another embodiment of the present invention.

FIG. 15 is another embodiment of the present invention.

FIG. 16 is an explanatory diagram of a defoaming process.

FIG. 17 is another embodiment of the present invention.

FIG. 18 is an explanatory diagram of a surface treatment.

FIG. 19 is an explanatory diagram of a surface treatment.

FIG. 20 is an explanatory diagram of a surface treatment.

FIG. 21 is an explanatory view of a conventional adhesive application.

FIG. 22 is an explanatory diagram of an adhesive application according to the present invention.

FIG. 23 is an explanatory diagram of the application of the adhesive of the present invention.

FIG. 24 is an explanatory diagram of a load process according to the present invention.

FIG. 25 is a diagram showing a correspondence relationship between the height of a protruding electrode and a load.

FIG. 26 is a structural diagram of a semiconductor device.

FIG. 27 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bare chip component 2 Printed circuit board 3 Chip electrode 4 Projecting electrode 6 Board electrode 7 Adhesive 8 Conductive elastic body 10 Semiconductor device

Continuation of front page (56) References JP-A-3-225934 (JP, A) JP-A-1-226160 (JP, A) JP-A-5-13496 (JP, A) JP-A-6-232205 (JP) , A) JP-A-62-279645 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60

Claims (14)

(57) [Claims] 1. An LSI comprising a bare chip component of an LSI and a printed circuit board, and electrically connecting the chip electrode of the bare chip component to a substrate electrode of the printed circuit board while bonding the bare chip component and the printed circuit board with an adhesive. In the semiconductor device constituted by fixing using the above, a configuration is adopted in which the substrate electrode is mounted on a flexible printed wiring board disposed on the upper surface of the printed circuit board, and at a position corresponding to the chip electrode on the printed circuit board. A semiconductor device having a structure in which an elastic body is provided and a protruding electrode that is pressed against the flexible printed wiring board is provided on the chip electrode. 2. A method for manufacturing a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, wherein a first electrode is formed on a chip electrode of the bare chip part.
And process of, The rewritable form <br/> an elastic body having conductivity to the substrate electrode of the printed circuit board, push heating the conductive elastic body in which its formation
In Rukoto, a second processing step you deforming the shape to those provisions, a third processing step of applying adhesive to bare chip mounting position of the printed circuit board, is formed in the first process The bare chip component is pressed against the printed circuit board while the protruding electrode is pressed against the conductive elastic body formed in the second processing step, and the adhesive applied in the third processing step is cured during the pressing. 4th
And a process of manufacturing the semiconductor device. 3. An LSI comprising a bare chip component of an LSI and a printed circuit board, and electrically connecting the chip electrode of the bare chip component to the substrate electrode of the printed circuit board while bonding the bare chip component to the printed circuit board with an adhesive. In the semiconductor device configured by being fixed by using, a portion corresponding to the chip electrode of the substrate electrode has a shape recessed inside the printed circuit board, and a protruding electrode that is crimped to the chip electrode in the concave shape. A semiconductor device characterized by adopting a configuration of disposing. 4. A method for manufacturing a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, wherein a protruding electrode is formed on a chip electrode of the bare chip part.
And a second processing step of applying an adhesive to the bare chip component mounting position of the printed circuit board; and aligning the positions of the protruding electrodes formed in the first processing step with the substrate electrodes of the printed circuit board, A third processing step of placing the bare chip component on the printed circuit board coated with the adhesive, and pressing the bare chip component placed in the third processing step onto the printed circuit board until the substrate electrode of the printed circuit board is depressed; And a fourth processing step of curing the adhesive applied in the second processing step during pressing. 5. The method for manufacturing a semiconductor device according to claim 4 , wherein prior to the processing in the second processing step, the adhesive applied in the second processing step is rotated in a vacuum to remove the adhesive. A method for manufacturing a semiconductor device, comprising: a process of removing air bubbles contained therein. 6. The method according to claim 4 or 5, wherein, following the processing of the second process, as the viscosity of the adhesive applied in the second process decreases temporarily and A method for manufacturing a semiconductor device, comprising a step of temporarily heating a printed board. 7. The method of manufacturing a semiconductor device claims 4 to 6, wherein in the second process, as application position of the adhesive, the center point and the end point of the bare chip loading position, or these points Setting a plurality of positions including the application position as an application position, and applying an adhesive to the application position in accordance with a mode in which the amount of the adhesive applied is reduced as the distance from the center point increases. Semiconductor device manufacturing method. 8. The method according to claim 4 to 7, further comprising a processing step of, prior to the processing of the third processing step, roughening the surface accuracy of the substrate electrode of the printed circuit board, and wherein Semiconductor device manufacturing method. 9. The method according to claim 4 to 8 wherein, in the fourth process, by measuring the shape value of the substrate electrode of the printed circuit board, certain pressing force to suit the shape value And processing the bare chip component against the printed circuit board in accordance with the specified pressing force. 10. A method of manufacturing a semiconductor device of claims 4 to 8, wherein, when a configuration for heat curing the adhesive, in the fourth process, first, printing a bare chip set smaller the pressing force A semiconductor device comprising: pressing the bare chip component against the printed circuit board by increasing the pressing force and setting the pressing force to a predetermined value before the curing of the adhesive is started. Manufacturing method. 11. The method of manufacturing a semiconductor device of claims 4 to 8, wherein, in the fourth process, by measuring the amount of dent of the substrate electrode while considering the collapse of the protruding electrodes, the amount seen recess is defined value A process for pressing a bare chip component against a printed circuit board so as to satisfy the following condition. 12. The method of manufacturing a semiconductor device according to claim 11 , wherein a pressing force is applied to the protruding electrode prior to the processing in the fourth processing step, whereby the height of the protruding electrode is further deformed. A method for manufacturing a semiconductor device, comprising: 13. The method according to claim 11 or 12, wherein, when a configuration for heat curing the adhesive, in the fourth process, stepwise pressing force in accordance with the temperature rise of the printed circuit board A process of pressing the bare chip component against the printed circuit board so that the amount of depression of the substrate electrode becomes a specified value while increasing the size of the substrate electrode. 14. The method of manufacturing a semiconductor device of claims 4 to 13, wherein, as a printed circuit board, the use of what is produced in a material showing a large elastic deformation, a method of manufacturing a semiconductor device according to claim.