JPH11186325A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure high reliability and productivity when a printed board showing low glass transition temperature or low elastic modulus is used, by recessing a board electrode by pressing a bear chip component to the printed board, and heat-curing the applied adhesive during pressing. SOLUTION: The part of a board electrode 6 which corresponds to a chip electrode 3 is made to have a form recessed inside a printed board 2. A protruding electrode 4 to be fixed by pressure to the recessed part is formed on a chip electrode 3. Adhesive agent 7 is applied on the bare chip mounting part of the printed board 2. While the protruding electrode 4 is aligned with a board electrode 6, a bare chip component 1 is mounted on the printed board 2 coated with the adhesive agent 7. The bare chip component 1 is pressed against the printed board 2, until the board electrode 6 is recessed. While pressing, the spread adhesive agent 7 is thermoset. Thereby an adequate recess of the board electrode can be obtained when a printed board showing low glass transposition temperature or low elastic modulus is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, wherein the printed circuit board has a low glass transition temperature and a low elastic modulus. The present invention relates to a method for manufacturing a semiconductor device that enables a semiconductor device having high reliability and high productivity to be manufactured when the semiconductor device is used.

[0002] Electronic equipment manufacturers are
By purchasing I and mounting it on a printed circuit board, electronic devices will be manufactured. Recently, there has been an increasing demand for miniaturization of electronic devices. From now on, electronic device manufacturers have been instructed by semiconductor manufacturers to supply bare chip components of unpackaged LSIs (a bare chip in which only electrodes are formed on a silicon substrate). (LSI parts) are purchased and mounted on printed circuit boards.

[0003] As a method of mounting the bare chip component, a configuration is adopted in which the bare chip component is fixed to the printed circuit board in such a manner that its electrodes face the same direction as the electrodes of the printed circuit board. The method of mounting on a printed circuit board by electrically connecting the electrodes to the printed circuit board, and the method of mounting the bare chip component on the printed circuit board by fixing the bare chip component to the printed circuit board while joining the electrodes of the bare chip component and the electrodes of the printed circuit board There is.

The latter mounting method is called face-down mounting, and has the advantage that bare chip components can be mounted at a higher density than the former mounting method, but has the drawback that reliability and productivity are low.

[0005] In order to further reduce the size of electronic equipment, bare chip components that achieve high density mounting and high reliability and productivity by solving the drawbacks of the face-down mounting. It is necessary to establish an implementation method for.

[0006]

2. Description of the Related Art FIG. 15 shows an example of the structure of a semiconductor device composed of an LSI bare chip component 1 and a printed circuit board 2 mounted according to face-down mounting.

As shown in FIG. 1, in a semiconductor device composed of a bare chip component 1 mounted according to face-down mounting and a printed circuit board 2, the bare chip component 1
The protruding electrode 4 called a bump is provided on the chip electrode 3 of
A conductive paste 5 is adhered to the protruding electrode 4, and the bare chip component 1 and the printed board 2 are bonded to each other with the protruding electrode 4 having the conductive paste 5 adhered to the board electrode 6 of the printed board 2. 7 is adopted.

[0008] Incidentally, the bare chip component 1 is, for example,
A chip composed of a silicon substrate having a size of about 10 mm × 10 mm and a thickness of about 0.4 mm, and an outer periphery thereof made of aluminum or the like having a size of about 100 μm × 100 μm and a height of about 1 μm. 200 to 300 electrodes 3 are arranged. The bare chip component 1 and the printed circuit board 2
Is about 80 μm, and the height of the protruding electrode 4 is 50 μm.
μm, and the height of the substrate electrode 6 is about 25 μm.

Conventionally, such a semiconductor device is shown in FIG.
6 was manufactured by the manufacturing method shown in FIG. That is, first, in a bare chip bump forming step, the tip of a gold wire protruding from the tip of a capillary is melted by electric discharge to form a ball by a wire bonding method, and the ball is formed using ultrasonic vibration. After bonding to one chip electrode 3, a gold wire is cut at the neck of the ball to form a ball-shaped protruding electrode 4 having a size of about 60 μm on the chip electrode 3 of the bare chip component 1. .

Subsequently, in a bump leveling step, the bare chip component 1 is lightly pressed against a smooth glass substrate, thereby removing the variation in the height of the cut portion of the protruding electrode 4 and making the height of the protruding electrode 4 uniform.

Subsequently, in a conductive paste transfer step, a conductive paste (constituted by mixing a metal piece into an adhesive) is applied to a thickness of about 15 μm on a glass substrate, and the bare chip component 1 is The conductive paste 5 was transferred to the end surface of the protruding electrode 4 by making contact with the glass substrate to which the conductive paste was applied, and thereafter, the bare chip component 1 was heated for a certain period of time to be attached to the protruding electrode 4. The conductive paste 5 is semi-cured. The conductive paste 5 is made of U
In the case of exhibiting V-curing characteristics, the composition is semi-cured by irradiating ultraviolet rays.

Subsequently, in a mounting step, the bare chip component 1 is positioned on the printed circuit board 2 to which the adhesive 7 has been applied in the adhesive applying step, and then heated for a predetermined time while maintaining the state. The semiconductor device is completed by hardening the adhesive 7 between the bare chip component 1 and the printed circuit board 2 and completely hardening the conductive paste 5. When the conductive paste 5 and the adhesive 7 show UV curing properties, they are cured by irradiating ultraviolet rays.

[0013]

As described above, conventionally, the protruding electrode 4 is formed on the chip electrode 3 of the bare chip component 1, and the protruding electrode 4 is brought into contact with the substrate electrode 6 of the printed circuit board 2. Adhesive 7 with the printed circuit board 2
When adopting the configuration in which the conductive paste 5 is used, the configuration in which the reliability of the electrical connection between the protruding electrode 4 and the substrate electrode 6 is ensured by using the conductive paste 5 is adopted.

However, the conductive paste 5
In the case of adopting the configuration using the method, heat treatment must be performed in each of the conductive paste transferring step and the mounting step, and thus there is a problem that the productivity of the semiconductor device is poor.

[0015] In the conductive paste transfer step, the conductive paste 5 must be applied to the glass substrate and transferred to the protruding electrode 4, resulting in a problem that the productivity of the semiconductor device is poor. Moreover, the application of the conductive paste 5 must be performed thinly and uniformly.
If the metal pieces mixed in the conductive paste 5 hinder uniform application, or if the conductive paste 5 is applied in a large amount, the conductive paste 5 may be in electrical contact with the adjacent chip electrode 3. It is one of the difficult tasks.

Further, the thermal expansion coefficient of the printed circuit board 2 made of a resin such as a glass epoxy resin is several times larger than the thermal expansion coefficient of the bare chip part 1 made of silicon. As a result, a force for peeling off the joint between the conductive paste 5 and the substrate electrode 6 is generated, and the force cannot be absorbed even when the adhesive is fixed with the adhesive 7, which may cause a disconnection or a partial disconnection of the electrical connection. There was a problem.

[0017] Against this background, the present applicant has previously filed Japanese Patent Application No. 8-181832, which describes a first processing step of forming a protruding electrode 4 on a chip electrode 3 of a bare chip component 1. A second processing step of applying the adhesive 7 to the bare chip component mounting position of the printed circuit board 2 and a position of the projecting electrode 4 formed in the first processing step and the position of the substrate electrode 6 of the printed circuit board 2 are adjusted. A third process in which the bare chip component 1 is placed on the printed circuit board 2 coated with the adhesive 7, and applying a load to the bare chip component 1 placed in the third process to form a substrate electrode of the printed circuit board 2. The invention has been disclosed for a method of manufacturing a semiconductor device comprising: a fourth processing step of pressing the printed circuit board 2 until the substrate 6 is depressed, and curing the adhesive 7 applied in the second processing step during the pressing.

According to the invention of the method of manufacturing a semiconductor device, the bare chip component 1 and the printed board 2 can be manufactured without using the conductive paste 5 when the configuration is adopted in which the bare chip component 1 and the printed board 2 are joined face down. Since it can be manufactured with productivity and the electrical connection between the bare chip component 1 and the printed circuit board 2 can be ensured, high reliability can be realized.

The method of manufacturing a semiconductor device according to the present invention utilizes the effect of engagement between the protruding electrode 4 and the substrate electrode 6 to secure electrical connection between the chip electrode 3 and the substrate electrode 6. Has been adopted. From this, when a heat-curable adhesive is used as the adhesive 7,
This is effective when a material having a high glass transition temperature is used. That is, when the glass transition temperature is high, a necessary amount of dent is generated at a high temperature at which the adhesive 7 is heated and cured.

However, when a printed circuit board 2 having a low glass transition temperature is used, inconvenience occurs. That is, when the glass transition temperature is low, a dent is generated before the adhesive 7 is heated to a high temperature to be cured, and when a large load is applied, the dent becomes too large, and the chip electrode 3 is printed on the printed circuit board. Therefore, a large load cannot be applied in the fourth process.

Since the contact area between the chip electrode 3 and the substrate electrode 6 cannot be increased, sufficient electrical connection between the chip electrode 3 and the substrate electrode 6 cannot be ensured.

On the other hand, when the load is increased, the dent becomes large, so that the chip electrode 3 and the printed circuit board 2 come into contact with each other and the required thickness of the adhesive 7 cannot be secured.

The present invention has been made in view of the above circumstances, and is directed to a bare chip component 1 of an LSI and a printed circuit board 2.
When manufacturing a semiconductor device composed of the following, when a substrate having a low glass transition temperature or a substrate having a low elastic modulus is used as the printed circuit board 2, a semiconductor having high reliability and high productivity is used. It is an object of the present invention to provide a new method for manufacturing a semiconductor device which enables the manufacture of a device.

[0024]

In order to achieve this object, according to the present invention, a first process for forming projecting electrodes 4 on chip electrodes 3 of a bare chip component 1 and a printed circuit board 2 are described.
The second processing step of applying the adhesive 7 to the bare chip component mounting position of FIG. 1 and the position of the projecting electrode 4 formed in the first processing step and the position of the substrate electrode 6 of the printed circuit board 2 are adjusted. Printed circuit board 2 coated with adhesive 7
The bare chip component 1 placed in the third processing step is pressed against the printed circuit board 2 by first using a high load and then using a low load. While the substrate electrode 6 is depressed,
A fourth processing step of heating and curing the adhesive 7 applied in the second processing step.

When employing this configuration, in the fourth processing step, the load is switched to a low load when heating is started, or the load is switched to a low load when the temperature reaches a specified value. The load is switched to a low load according to the state of heating, such as switching to a low load when the temperature at which the substrate electrode 6 is reached is reached. The load may be switched to a low load in accordance with the depression of the substrate electrode 6, such as switching to a low load when the amount of the depression reaches a specified value. In the fourth process, the load may be gradually increased when a high load is applied, or the load may be gradually reduced when a low load is applied.

As described above, in the present invention, it is considered that the temperature of the printed circuit board 2 is increased by heating the adhesive 7 and the elastic modulus of the printed circuit board 2 is thereby reduced. When the temperature of the printed circuit board 2 is low, the bare chip component 1 is pressed against the printed circuit board 2 by using a high load, thereby obtaining a necessary recess of the board electrode 6 of the printed circuit board 2 and increasing the temperature of the printed circuit board 2. In some cases, the bare chip component 1 is pressed against the printed circuit board 2 using a low load, so that the dent is controlled so as not to become larger than necessary.

In order to achieve this object, according to the present invention, in the first processing step of forming the protruding electrode 4 on the chip electrode 3 of the bare chip component 1, an adhesive is provided at the position where the bare chip component is placed on the printed circuit board 2. 7, the bare chip part 1 is printed while the adhesive 7 is applied thereto, while aligning the positions of the protruding electrodes 4 formed in the first processing step with the substrate electrodes 6 of the printed circuit board 2. The third processing step of mounting on the substrate 2 and the pressing of the bare chip component 1 mounted in the third processing step onto the printed circuit board 2 until the amount of depression of the substrate electrode 6 of the printed circuit board 2 reaches a specified value. Then, the substrate electrode 6 of the printed circuit board 2 is depressed, and the adhesive 7 applied in the second process is cured by heating during the pressing, and the depression amount of the substrate electrode 6 of the printed circuit board 2 is reduced to a specified value. When Configured to and a fourth processing step of stopping the movement of the pressure head.

When this configuration is adopted, in the fourth process, the pressing head is first controlled by using a constant high load or by sequentially increasing the load.
The pressing head may be controlled in accordance with the depression of the pressing head. Further, in the fourth process, when the heating is started, the load is switched to a low load, when the temperature reaches a specified value, the load is switched to a low load, or when the temperature reaches a temperature at which the dent of the substrate electrode 6 occurs. Switching to a low load, such as switching to a low load, depending on the state of heating, switching to a low load when the occurrence of dents in the substrate electrode 6 starts, or a dent amount of the substrate electrode 6 reaching a specified value Sometimes, the load is switched to a low load in accordance with the depression of the substrate electrode 6, such as switching to a low load.

As described above, according to the present invention, taking into consideration that the temperature of the printed circuit board 2 is increased by heating the adhesive 7 and thereby the elastic modulus of the printed circuit board 2 is reduced, 1 is pressed against the printed circuit board 2 to obtain the necessary recess of the substrate electrode 6 of the printed circuit board 2. Thereafter, the movement of the pressing head is stopped so that the recess does not become unnecessarily large. Control.

In order to achieve this object, according to the present invention, a first processing step of forming the protruding electrode 4 on the chip electrode 3 of the bare chip component 1 and an adhesive at the bare chip component mounting position of the printed circuit board 2 are performed. 7, the bare chip part 1 is printed while the adhesive 7 is applied thereto, while aligning the positions of the protruding electrodes 4 formed in the first processing step with the substrate electrodes 6 of the printed circuit board 2. The third processing step of mounting on the substrate 2 and the pressing of the bare chip component 1 mounted in the third processing step onto the printed circuit board 2 until the amount of depression of the substrate electrode 6 of the printed circuit board 2 reaches a specified value. Then, the substrate electrode 6 of the printed circuit board 2 is depressed, and the adhesive 7 applied in the second process is cured by heating during the pressing, and the depression amount of the substrate electrode 6 of the printed circuit board 2 is reduced to a specified value. When Is later, and configured with a fourth process of moving the pressing head (rise or fall) in accordance with the thermal expansion of the printed circuit board 2.

When employing this configuration, in the fourth process, the pressing head is first controlled by using a constant high load or by sequentially increasing the load.
The pressing head may be controlled in accordance with the depression of the pressing head. Further, in the fourth process, when the heating is started, the load is switched to a low load, when the temperature reaches a specified value, the load is switched to a low load, or when the temperature reaches a temperature at which the dent of the substrate electrode 6 occurs. Switching to a low load, such as switching to a low load, depending on the state of heating, switching to a low load when the occurrence of dents in the substrate electrode 6 starts, or a dent amount of the substrate electrode 6 reaching a specified value Sometimes, the load is switched to a low load in accordance with the depression of the substrate electrode 6, such as switching to a low load.

As described above, in the present invention, taking into consideration that the temperature of the printed circuit board 2 is increased by heating the adhesive 7 and thereby the elastic modulus of the printed circuit board 2 is reduced, the bare chip component is taken into consideration. 1 is pressed onto the printed circuit board 2 to obtain the necessary depression of the substrate electrode 6 of the printed circuit board 2. Thereafter, the pressing head is moved (up or down) in accordance with the thermal expansion of the printed circuit board 2. Is controlled so that the dent does not become larger than necessary.

As described above, according to the present invention, a load is applied to the bare chip component 1 to press the printed circuit board 2 until the substrate electrode 6 of the printed circuit board 2 is depressed. When manufacturing a face-down mounted semiconductor device composed of the bare chip part 1 and the printed circuit board 2 by curing
A printed circuit board 2 having a low glass transition temperature,
When a material exhibiting a low elastic modulus is used, it is possible to secure an appropriate one that is not too large or too small as a recess of the substrate electrode 6 of the printed circuit board 2 and also ensure a large contact area due to a high load. Therefore, even when a printed circuit board 2 having a low glass transition temperature or a low elastic modulus is used, a semiconductor device having high reliability and high productivity can be manufactured.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail according to embodiments. FIG. 1 illustrates a configuration of a semiconductor device 10 manufactured according to the present invention.

As shown in this figure, in the semiconductor device 10 manufactured according to the present invention, the portion of the substrate electrode 6 corresponding to the chip electrode 3 shows a shape recessed inside the printed circuit board 2 and the chip electrode 3 , A protruding electrode 4 to be pressed into the concave shape is provided.

According to this configuration, the semiconductor device 10 manufactured according to the present invention can be laterally shifted between the bare chip part 1 and the printed board 2 due to the difference between the thermal expansion coefficient of the bare chip part 1 and the thermal expansion coefficient of the printed board 2. Even if
Since the concave portion of the substrate electrode 6 acts to suppress the movement of the protruding electrode 4, even if the temperature changes, the chip electrode 3
It is characterized in that the electrical connection between the substrate electrode 6 and the substrate electrode 6 is reliably ensured.

Further, in addition to this feature, the contact area between the protruding electrode 4 and the substrate electrode 6 is increased, so that the electrical connection between the chip electrode 3 and the substrate electrode 6 is reliably ensured. It has the characteristic.

This semiconductor device 10 is disclosed in Japanese Patent Application No. Hei.
As disclosed in Japanese Patent Application Laid-Open No. H11-260, the protruding electrode 4 is formed on the chip electrode 3, the adhesive 7 is applied to the bare chip component mounting position of the printed circuit board 2, and the bare chip is The component 1 is placed on the printed board 2 on which the adhesive 7 is applied, and the placed bare chip component 1 is pressed against the printed board 2 until the board electrode 6 is depressed. It can be manufactured by curing.

FIG. 2 shows a semiconductor device 10 for realizing the present invention.
An example of the production line is illustrated. As shown in this figure,
The manufacturing line of the semiconductor device 10 for realizing the present invention includes a bump bonder device 20, a dispenser device 21, a centrifugal vacuum defoaming device 22, and a chip bonder device 23.

The bump bonder 20, when receiving the bare chip component 1 from the transport line, forms a projecting electrode 4 called a bump on the chip electrode 3 of the bare chip component 1.

As shown in FIG. 3, the bump bonder 20 includes an XY stage 2 for fixing the bare chip component 1.
00, a gold wire storage box 201 for storing a gold wire serving as a material of the protruding electrode 4, a capillary 202 for guiding the gold wire supplied from the gold wire storage box 201 to the position of the chip electrode 3 of the bare chip component 1, A tension clamper 2 that pulls up a gold wire supplied to the capillary 202 to apply tension to the gold wire supplied to the capillary 202.
03, a cut clamper 204 that cuts the gold wire by pulling up the gold wire fused to the chip electrode 3 of the bare chip component 1, and a CCD camera 205 that detects the position of the chip electrode 3 of the bare chip component 1. , An unillustrated torch unit and an ultrasonic oscillator.

Here, the wire storage box 201 / capillary 202 / tension clamper 203 / cut clamper 2
The 04 / CCD camera 205 / torch unit constitutes an integrated bonding head and is configured to be movable in the XY directions by a mechanism (not shown).

In the bump bonder device 20 configured as described above, when the positioning of the chip electrode 3 of the bare chip component 1 is completed, the torch unit (not shown) is moved to the tip of the gold wire to perform discharge, thereby causing the tip of the gold wire to discharge. A ball is formed on the chip electrode 3 by using a capillary 202 and then the ball is brought into contact with the chip electrode 3 and then the capillary 202 is ultrasonically oscillated using an ultrasonic oscillator to melt the ball on the chip electrode 3. Then, the gold wire is pulled up using the cut clamper 204 to cut the ball and the gold wire, so that a ball-shaped protrusion having a size of about 60 μm is formed on the chip electrode 3 of the bare chip component 1. The electrode 4 is formed.

When the dispenser device 21 receives the printed circuit board 2 from the transport line, the dispenser device 21 applies the adhesive 7 on the printed circuit board 2. As shown in FIG. 4, the dispenser device 21 includes an XY table 210 for fixing the printed circuit board 2 and moving the same in the XY directions.
A holder 212 for holding the syringe 211 filled with the adhesive 7, an ejection needle 213 for ejecting a small amount of the adhesive 7 filled in the syringe 211 to the printed circuit board 2, and a head 214 for moving the syringe 211 up and down. And a pressing mechanism (not shown).

The dispenser device 2 configured as described above
In 1, when the positioning of the printed board 2 is completed, the adhesive 7 filled in the syringe 211 is pushed out by using a pressing mechanism (not shown), so that the adhesive 7 is applied to the printed board 2.

When the centrifugal vacuum defoaming device 22 receives the adhesive 7 filled in the syringe 211 (communicated with the outside through a small gap) from the transport line, the centrifugal vacuum defoaming device 22 includes the adhesive 7 in the adhesive 7. To remove the air bubbles, and dispenser device 2
1.

As shown in FIG. 5, the centrifugal vacuum defoaming device 22 connects a rotating body 220 for fixing two syringes 211 filled with the adhesive 7, and a syringe 211 fixed to the rotating body 220. Hollow member 22 having opening 221
2, a motor 223 for rotating the rotating body 220, and a decompression chamber 22 for housing the rotating body 220 while maintaining airtightness.
4, a lid 225 for opening the decompression chamber 224, and a decompression source 226 for reducing the internal pressure of the decompression chamber 224 by sucking the decompression chamber 224.

The thus-configured centrifugal vacuum degassing apparatus 2
In 2, the two syringes 211 filled with the adhesive 7 are fixed to the rotating body 220, and when the connection by the hollow member 222 is completed, the decompression chamber 224 is
Is reduced, and the rotating body 220 is rotated using the motor 223. Thereby, the syringe 21
The air bubbles contained in the adhesive 7 filled in the first member 1 are separated from the openings 221 of the hollow member 222 by the centrifugal action and the pressure reducing action.
Is removed from the adhesive 7.

The chip bonder device 23 receives the bare chip component 1 from the bump bonder device 20 via the transport line, and also prints the printed circuit board 2 coated with the adhesive 7 from the dispenser device 21 via the transport line.
Then, the semiconductor device 10 of the present invention is manufactured by joining the bare chip component 1 and the printed board 2.

As shown in FIG. 6, the chip bonder device 23 includes an orienter 230 for placing the bare chip component 1 and correcting the inclination thereof roughly, and a pickup head 23 for setting the bare chip component 1 on the orienter 230.
1 and an optical probe 2 for capturing an image of the circuit surface of the bare chip component 1 and an image of the substrate surface of the printed circuit board 2
32, a stage 233 for fixing the printed circuit board 2,
Pick up the bare chip component 1 placed on the orienter 230 and print the printed circuit board 2 fixed to the stage 233.
A load cell 235 for measuring the pressing force of the bonding head 234;
An encoder 236 for measuring the amount of movement of the bonding head 234.

Here, the bonding head 234 has a heating mechanism for heating the bare chip component 1 and a temperature sensor such as a thermistor for detecting the temperature of the printed circuit board 2 whose temperature is increased by the heating mechanism. And stage 2
Reference numeral 33 has a heating mechanism for heating the printed circuit board 2 and a temperature sensor such as a thermistor for detecting the temperature of the printed circuit board 2 whose temperature is increased by the heating mechanism.

In the chip bonder device 23 configured as described above, when the orientation of the bare chip component 1 is roughly set to a prescribed one using the orienter 230, the bonding head 234 is moved to pick the bare chip component 1, and the bare chip component 1 is picked up. Stage 2 of picked bare chip part 1
After moving to the position 33, the optical probe 232 is inserted between the bare chip component 1 and the printed circuit board 2 to perform alignment, and then the bare chip component 1 is heated while being pressed against the printed circuit board 2 to perform printing. The semiconductor device 10 is cured by curing the adhesive 7 applied to the substrate 2.
Will be manufactured.

Next, a method of manufacturing the semiconductor device 10 of the present invention realized by using the manufacturing line configured as described above will be described in detail. First, a brief description will be given of a method of manufacturing the semiconductor device 10 disclosed in Japanese Patent Application No. 8-181832, which is a basic configuration of the present invention.

FIG. 7 shows a method of manufacturing the semiconductor device 10 disclosed in Japanese Patent Application No. 8-181382. When manufacturing the semiconductor device 10 shown in FIG. 1 according to the manufacturing method of the semiconductor device 10 disclosed in Japanese Patent Application No. Hei 8-181332, which is a basic configuration of the present invention, first, as shown in FIG. In the “bump forming step”, the bump electrodes 4 are formed on the chip electrodes 3 of the bare chip component 1 using the bump bonder 20.

In parallel with the formation of the protruding electrodes 4, the process enters the “adhesive defoaming step” and uses the centrifugal vacuum defoaming device 22 to remove bubbles contained in the adhesive 7 applied to the printed circuit board 2. After the removal, the process enters an “adhesive application step”, and the adhesive 7 from which the air bubbles have been removed is applied to the printed circuit board 2 using the dispenser device 21.

As described above, when the protruding electrodes 4 are formed on the chip electrodes 3 of the bare chip component 1 and the adhesive 7 is applied to the printed circuit board 2, subsequently, a “mounting process” is entered, and the chip bonding device 23 With the position of the protruding electrode 4 and the substrate electrode 6 accurately adjusted, a load is applied to the bare chip component 1 until the substrate electrode 6 becomes concave after the bare chip component 1 is mounted on the printed circuit board 2. By pressing the bare chip component 1 against the printed circuit board 2 and performing a heat treatment in that state, the adhesive 7 between the bare chip component 1 and the printed circuit board 2 is hardened, and thereafter, the load is released, and FIG. Semiconductor device 1 illustrated in FIG.
0 is completed.

Although the structure in which the protruding electrode 4 is formed by the wire bonding technique is employed here, a method of forming the protruding electrode 4 by using another technique such as a plating technique or a transfer technique may be employed. It is possible. Further, the protruding electrode 4 is not limited to a metal bump such as a gold bump, but may be a resin bump.

The semiconductor device 10 shown in FIG. 1 manufactured according to this manufacturing method can be manufactured without using a conductive paste, and can be manufactured (may be performed) without leveling the protruding electrodes 4. It can be manufactured with high productivity.

Even if the bare chip part 1 and the printed board 2 are displaced laterally due to the difference between the coefficient of thermal expansion of the bare chip part 1 and the coefficient of thermal expansion of the printed board 2, the concave part of the board electrode 6 Acts to suppress the movement of the protruding electrode 4, so that even if the temperature changes, the electrical connection between the chip electrode 3 and the substrate electrode 6 is reliably ensured. As a result, the electrical connection between the chip electrode 3 and the substrate electrode 6 is reliably ensured without using a conductive paste.

In addition, since the contact area between the protruding electrode 4 and the substrate electrode 6 increases, the electrical connection between the chip electrode 3 and the substrate electrode 6 is reliably ensured.
FIGS. 8 to 13 show one embodiment of the present invention which is executed in the “mounting step” of FIG. 7 when a substrate having a low glass transition temperature or a substrate having a low elastic modulus is used as the printed circuit board 2. I do. Next, the present invention will be described in detail according to this embodiment.

The embodiment shown in FIG.
When the semiconductor device 10 is manufactured by curing the adhesive 7 applied to the printed circuit board 2 by heating the bare chip component 1 while pressing the printed circuit board 2 by using the bonding head 234, Pressing with a high load while sequentially increasing the load, and when the load reaches a predetermined load (set below the load at which the protruding electrode 4 is not over-crushed), gradually reduce the load and start heating when the set low load is reached. It is taking the method of doing.

Here, the points in the figure indicate the point in time when the protruding electrode 4 comes into contact with the substrate electrode 6, the points indicate the point in time when the high load for switching to the low load has been reached, and the points have reached the set low load. The time point is shown, and the point indicates the time point when the sinking (recess) of the substrate electrode 6 starts.

That is, in this embodiment, the required contact area between the chip electrode 3 and the substrate electrode 6 is secured by first setting the mounting load large.
By starting the heating after reducing the mounting load,
The control is performed so that the recess amount of the substrate electrode 6 does not become larger than necessary. When the heating of the printed circuit board 2 proceeds, the temperature of the printed circuit board 2 becomes higher than the glass transition temperature and the elastic modulus is greatly reduced. Therefore, before the heating is started, the dent amount of the substrate electrode 6 is not increased more than necessary. This reduces the mounting load.

It is also possible to adopt a configuration in which the heating is started at the same time as the shift to the low load control, and the control is shifted to the low load control at the same time as the heating is started. The embodiment shown in FIG. 9 uses the bonding head 234 of the chip bonder device 23 to heat the bare chip component 1 while pressing the bare chip component 1 against the printed circuit board 2 so that the adhesive 7 applied to the printed circuit board 2 is heated.
When the semiconductor device 10 is manufactured by curing the semiconductor device 10, first, it is pressed with a constant high load (set so as not to be excessively crushed by the protruding electrode 4), heating is started during the pressing, and printing is performed. When the temperature of the substrate 2 reaches a specified temperature lower than the glass transition temperature indicated by a point, the load is switched to a low load.

That is, in this embodiment, when the temperature of the printed circuit board 2 is lower than the glass transition temperature, the mounting load is set large so that the required contact area between the chip electrode 3 and the substrate electrode 6 is increased. When the temperature of the printed circuit board 2 becomes higher than the glass transition temperature due to the progress of heating and the temperature of the printed circuit board 2 becomes higher than the glass transition temperature, the elastic modulus is greatly reduced in consideration of the mounting. By setting the load small, the amount of depression of the substrate electrode 6 is controlled so as not to become larger than necessary.

The embodiment shown in FIG.
By using the bonding head 234 of No. 3 and heating the bare chip component 1 while pressing it against the printed circuit board 2,
When the semiconductor device 10 is manufactured by curing the adhesive 7 applied to the printed circuit board 2, first, a certain high load is set (the load is set to be equal to or less than a load at which the protruding electrode 4 is not over-crushed).
And heating is started during the pressing.
When the descent of the shaft (the Z-axis of the bonding head 234) starts, the method is switched to a low load.

That is, in this embodiment, when the temperature of the printed circuit board 2 almost reaches the glass transition temperature, the lowering of the bonding head 234 starts, so that when the temperature of the printed circuit board 2 is lower than the glass transition temperature, By setting a large mounting load, a necessary contact area between the chip electrode 3 and the substrate electrode 6 is secured, and when the heating proceeds and the descent of the bonding head 234 starts, low load control is performed. By shifting, the amount of depression of the substrate electrode 6 is controlled so as not to become larger than necessary.

The embodiment shown in FIG.
By using the bonding head 234 of No. 3 and heating the bare chip component 1 while pressing it against the printed circuit board 2,
When the semiconductor device 10 is manufactured by curing the adhesive 7 applied to the printed circuit board 2, first, a certain high load is set (the load is set to be equal to or less than a load at which the protruding electrode 4 is not excessively crushed).
And heating is started during the pressing, and when the amount of depression of the substrate electrode 6 indicated by a point reaches a specified value, the descent of the bonding head 234 is stopped without managing the load. Has been adopted.

That is, in this embodiment, the amount of depression of the substrate electrode 6 is measured during the heating and pressing, and when it reaches a specified value, the lowering of the bonding head 234 is stopped. The dent amount is controlled so as not to be further increased.

The amount of depression of the substrate electrode 6 can be measured using the encoder 236 of the chip bonder 23. To improve the accuracy of the measurement of the amount of depression of the substrate electrode 6, the amount of collapse of the protruding electrode 4 must be reduced. It needs to be considered. That is, the amount of depression measured by the encoder 236 of the chip bonder 23 includes the amount of collapse of the protruding electrode 4.
It is necessary to subtract the crush amount of the protruding electrode 4 from the dent amount measured by the encoder 236.

In order to realize this, as shown in FIG. 14, a configuration is adopted in which the correspondence between the load applied to the projecting electrode 4 and the height of the projecting electrode 4 at that time is obtained in advance, and the bonding head 234 is used. Is pressed down toward the printed circuit board 2, the load at that time is measured by the load cell 235. The bonding head 234 is further depressed with the position at which the load cell 235 detects the application of the load as the origin, and at this time, the load cell 23
The load f applied to the protruding electrode 5 is obtained in accordance with the obtained load f and the correspondence relationship in FIG.

A load (F in FIG. 14) at which the protruding electrode 4 is not further deformed is determined in advance, and the load F is applied to the protruding electrode 4 of the bare chip component 1 in advance to obtain the protruding electrode 4. May be set in the chip bonder device 23 after being further deformed. By doing so, it is possible to control the amount of depression of the substrate electrode 6 to be a predetermined value only by looking at the encoder 236.

The embodiment shown in FIG.
By using the bonding head 234 of No. 3 and heating the bare chip component 1 while pressing it against the printed circuit board 2,
When the semiconductor device 10 is manufactured by curing the adhesive 7 applied to the printed circuit board 2, initially, while increasing the load sequentially, the load is set to be high (set to be equal to or less than the load at which the protruding electrode 4 is not excessively crushed). When the depression amount of the substrate electrode 6 indicated by a point reaches a specified value, without controlling the load,
The descent of the bonding head 234 is stopped, and then the heating is started.

That is, in this embodiment, the depression amount of the substrate electrode 6 is measured during pressing, and when the depression amount reaches the specified value, the lowering of the bonding head 234 is stopped, and then heating is started. Thus, control is performed so that the amount of depression of the substrate electrode 6 does not increase any more. FIG.
The third embodiment uses a bonding head 234 of the chip bonder device 23 to heat the bare chip component 1 while pressing the bare chip component 1 against the printed circuit board 2, thereby curing the adhesive 7 applied to the printed circuit board 2. When manufacturing the substrate electrode 10, first, the substrate electrode 6 is pressed with a constant high load (set below the load at which the protruding electrode 4 is not excessively crushed), heating is started during the pressing, and the substrate electrode 6 indicated by a dot is pressed. When the dent amount reaches the specified value, the lowering of the bonding head 234 is stopped without controlling the load, and thereafter, the thermal expansion of the printed circuit board 2 is considered in consideration of the thermal expansion of the printed circuit board 2 due to heating. In this case, the bonding head 234 is sequentially raised (or lowered in some cases).

That is, in this embodiment, the depression amount of the substrate electrode 6 is measured during the heating and pressing, and when the depression amount reaches the specified value, the lowering of the bonding head 234 is stopped. By sequentially raising (or lowering in some cases) the bonding head 234 in accordance with the thermal expansion of the substrate 2, the amount of depression of the substrate electrode 6 is controlled so as not to increase further.

Here, the thermal expansion amount of the printed board 2 is calculated based on the temperature of the printed board 2 detected by the temperature sensor of the stage 233 of the chip bonder 23, Prepare a table to manage the correspondence with the amount of thermal expansion,
It is determined by indexing the table.

When the configuration described above is adopted, by setting the heating and curing temperature of the adhesive 7 higher than usual so that the mounting is completed in a short time, the substrate electrode 6
This is effective because an increase in the amount of dents can be suppressed.

[0078]

As described above, according to the present invention,
A load is applied to the bare chip components to press them down until the board electrodes on the printed circuit board are depressed, and the applied adhesive is cured during the pressing, so that the face down composed of the bare chip components and the printed circuit board is achieved. When manufacturing a semiconductor device of a mount, when a substrate having a low glass transition temperature or a substrate having a low elastic modulus is used as a printed circuit board, it is not too large or too small as a recess of a substrate electrode of the printed circuit board. It is possible to secure semiconductor devices with high reliability and high productivity even when printed circuit boards with low glass transition temperature or low elastic modulus are used. Be able to manufacture.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a semiconductor device manufactured according to the present invention.

FIG. 2 is an explanatory diagram of a manufacturing line of a semiconductor device.

FIG. 3 is an explanatory diagram of a bump bonder device.

FIG. 4 is an explanatory diagram of a dispenser device.

FIG. 5 is an explanatory view of a centrifugal vacuum defoaming apparatus.

FIG. 6 is an explanatory diagram of a chip bonder device.

FIG. 7 is an explanatory diagram of the invention filed earlier.

FIG. 8 is an embodiment of the present invention.

FIG. 9 is an embodiment of the present invention.

FIG. 10 is an embodiment of the present invention.

FIG. 11 is an embodiment of the present invention.

FIG. 12 is an embodiment of the present invention.

FIG. 13 is an embodiment of the present invention.

FIG. 14 is a diagram illustrating a correspondence relationship between a height of a protruding electrode and a load.

FIG. 15 is a structural diagram of a semiconductor device.

FIG. 16 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bare chip component 2 Printed circuit board 3 Chip electrode 4 Projecting electrode 6 Board electrode 7 Adhesive 10 Semiconductor device

Claims (11)

[Claims] 1. A method of manufacturing a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, the method comprising: forming a protruding electrode on a chip electrode of the bare chip part;
And a second processing step of applying an adhesive to the bare chip component mounting position of the printed circuit board; and aligning the positions of the protruding electrodes formed in the first processing step with the substrate electrodes of the printed circuit board, A third processing step of placing the bare chip parts on the printed circuit board coated with the adhesive, and first using a high load and then using a low load, and then transferring the bare chip parts placed in the third processing step to the printed circuit board. By pressing the substrate electrode of the printed circuit board,
A fourth processing step of heating and curing the adhesive applied in the second processing step during the pressing. 2. The method for manufacturing a semiconductor device according to claim 1, wherein in the fourth processing step, a processing is performed to switch to a low load according to a heating state. 3. The method of manufacturing a semiconductor device according to claim 1, wherein in the fourth processing step, processing is performed to switch to a low load in accordance with a depression of the substrate electrode. . 4. The method for manufacturing a semiconductor device according to claim 1, wherein in the fourth processing step, when a high load is applied, processing is performed such that the load is sequentially increased. A method for manufacturing a semiconductor device. 5. The method for manufacturing a semiconductor device according to claim 1, wherein in the fourth processing step, when a low load is applied, processing is performed such that the load is gradually reduced. A method for manufacturing a semiconductor device. 6. A method of manufacturing a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, wherein a first electrode is formed on a chip electrode of the bare chip part.
And a second processing step of applying an adhesive to the bare chip component mounting position of the printed circuit board; and aligning the positions of the protruding electrodes formed in the first processing step with the substrate electrodes of the printed circuit board, The third processing step of placing the bare chip component on the printed circuit board coated with the adhesive, and until the amount of dent of the board electrode of the printed circuit board reaches a specified value.
By pressing the bare chip components placed in the third processing step against the printed circuit board, the substrate electrodes of the printed circuit board are depressed, and the adhesive applied in the second processing step is heated and cured during the pressing, And a fourth processing step of stopping the movement of the pressing head when the amount of depression of the substrate electrode of the printed circuit board reaches a specified value. 7. A method for manufacturing a semiconductor device comprising a bare chip part of an LSI and a printed circuit board, wherein a first electrode is formed on a chip electrode of the bare chip part.
And a second processing step of applying an adhesive to the bare chip component mounting position of the printed circuit board; and aligning the positions of the protruding electrodes formed in the first processing step with the substrate electrodes of the printed circuit board, The third processing step of placing the bare chip component on the printed circuit board coated with the adhesive, and until the amount of dent of the board electrode of the printed circuit board reaches a specified value.
By pressing the bare chip components placed in the third processing step against the printed circuit board, the substrate electrodes of the printed circuit board are depressed, and the adhesive applied in the second processing step is heated and cured during the pressing, And a fourth process of moving the pressing head in accordance with the thermal expansion of the printed circuit board when the amount of depression of the substrate electrode of the printed circuit board reaches a specified value. Device manufacturing method. 8. The method for manufacturing a semiconductor device according to claim 6, wherein in the fourth processing step, the pressing head is first controlled by load control, and subsequently, the pressing head is controlled by the depression of the substrate electrode of the printed circuit board. A method for controlling the pressing head in accordance with the method. 9. The method for manufacturing a semiconductor device according to claim 8, wherein in the fourth processing step, processing is performed to switch a control method according to a heating state. 10. The method of manufacturing a semiconductor device according to claim 8, wherein in the fourth processing step, the control method is switched in accordance with a depression of the substrate electrode. . 11. The method for manufacturing a semiconductor device according to claim 1, wherein the adhesive is heated to a curing temperature higher than a normal curing temperature in the fourth processing step. Semiconductor device manufacturing method.